UM0376
User manual
STEVAL-IFS002V1
STR9 MEMS extension
Introduction
This user manual describes the STEVAL-IFS002V1 STR9 MEMS extension hardware. As
well as the block diagram and schematics of the extension, a bill of materials and assembly
instructions are also included.
The STR9 MEMS extension provides an STR9 dongle-based application with a MEMS
sensor. MEMS (micro-electro-mechanical system) exploits the mechanical properties of
silicon to create movable structures that, in the case of MEMS-based motion sensors, are
able to sense motion (acceleration or vibration) in distinct directions.
The extension board used here can be assembled with several types of digital MEMS
sensors as well as analog ones. For data storage, there is assembly space for ST serial
Flash. The integration of voltage regulators and operational amplifiers is optional and
depends on the intended chip usage.
Figure 1.
November 2007
STR9 MEMS extension
Rev 3
1/17
www.st.com
Contents
UM0376
Contents
1
STR9 MEMS extension Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
MEMS footprints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1
LGA8 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2
LGA14 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.3
LGA16 (D) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.4
LGA16 (A) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.5
QFN28 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4
PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5
Bill of materials and assembly instructions . . . . . . . . . . . . . . . . . . . . . 11
6
2/17
5.1
Assembly information for analog MEMS . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2
Assembly information for digital MEMS . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3
Assembly information for serial memory . . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
UM0376
1
STR9 MEMS extension Block diagram
STR9 MEMS extension Block diagram
This board is based on STR9 dongle. The main board features are the following:
●
●
●
Analog MEMS:
–
LGA8 (LIS2L02AL, LIS2L06AL, LIS3L02AL, LIS3L06AL)
–
LGA14 (LIS302ALB)
–
LGA16 (LIS3L02AL3)
Digital MEMS:
–
LGA14 (LIS302DL)
–
LGA16 (LIS3LV02DL)
–
QFN28 (LIS3L02DQ, LIS3LV02DQ)
Serial Flash/EEPROM memory
–
●
Voltage regulator
–
●
SO8 (M95xx, M25xx, M34xx)
SOT23-5L (LD2980CMxx)
Operational amplifier
–
SOT23-5L (TS507ILT)
Figure 2 shows the dongle block diagram.
Figure 2.
STR9 dongle block diagram
ANALOG_CONNECTOR
10 x GPIO
8 x Ain
2 x ExtINT
OA
OA
OA
x
y
z
Analog MEMS
LGA14
STAB
OA
mix
LGA8
LGA16
LGA14
QFN28
LGA16
STAB
I 2C
Digital MEMS
SPI
MEMORY
STAB
DIGITAL_CONNECTOR
16 x GPIO
I2C & SPI
2 x ExtINT
3/17
1
3
5
7
9
11
13
15
17
19
10
P80 7
P41mems 8
P42mems 9
Vmm
8
7 P87
6 SCL_SPC
5 SDA/SDI
Vdd
Vdd
12
13
P43mems 11
Vcc
3V3
R100
0
Vcc
1
C100
1uF
X7R
3V3
3V3
3
2
1
LD2980CMxx
INHIBIT
GND
Vin
U10
NC
Vout
4
5
2
Vcc
C101
2.2uF
X7R
Vcc
STABILIZATOR FOR ANALOG MEMS (OPTIONAL)
1
P85
SSP0_MISO 2
P86
3
4
U7
M95xx/M25xx/M34xx
M95xx/M25xx/M34xx
S^/S^/E0
Vcc
Q/Q/E1
HOLD^/RESET^/WC
W^/TSL^/E2
C/C/SCL
Vss
D/D/SDA
I2C/SPI EEPROM/FLASH MEMORY
SCL_SPC
R02 4k7
4k7
P81
P83
P84
P85
P86
P25 SSP0_MOSI
P27
3V3
P55 R03 4k7
R01
2
4
6
8
10
12
14
16
18
20
SSP0_SCLK I2C1_CLK
1
3
5
7
9
11
13
15
17
19
3V3
SSP0_MOSI I2C1_DATA SDA/SDI
3V3
P80
P82
I2C1_CLK P22
I2C1_DATA P23
SSP0_SCLK P24
P87
SSP0_MISO P26
P54
2
4
6
8
10
12
14
16
18
20
CN4
DIGITAL_CON
DIGITAL MEMS
P40
P41
P42
P43
P44
P45
P46
P47
P77
P76
CN5
ANALOG_CON
Vdd
Vouty
Voutz
GND
Vout
Aux_in
Vdd
CS
C102
10nF
Vdd
Vdd
P40mems
PD
ST
S1
S0
RES(Vdd)
SCL_SPC
Vcc
C103
10uF
X7R
C71
10nF
P47
P44
P76
4
5
6
3
P55
Vdd
7
6
5
4
3
2
1
P45
5
6
7
NC
RDY/INT
GND
RES
Vdd
GND
NC
P41mems
P40mems
P40mems
3
2
1
C84
10nF
TS507ILT
IN+
GND
OUT
U80
IN-
Vcc
GND
Voutz/FS/NC
ST
R84
10k
4
5
P40
R85
10k
Vcc
Vdd
R81
0
P41mems
P41
3
2
1
NC
CK
GND
RES
Vdd
RES
NC
3
C85
10nF
Vdd
3V3
C110
1uF
X7R
3V3
3V3
3
2
1
4
LD2980Cxx
INHIBIT
GND
Vin
U11
NC
Vout
4
5
Vdd
C111
2.2uF
X7R
Vdd
IN-
C112
10nF
TS507ILT
IN+
GND
Vcc
Vdd
Vdd
5
R86
10k
4
5
5
U5
LIS3LV02DQ
OUT
U81
15
16
17
18
19
20
21
2 P42mems
1 P44
U2
LIS3/2L06/2AL
STABILIZATOR FOR DIGITAL MEMS (OPTIONAL)
R80
0
P40
Vcc
LIS3/2L06/2AL
FS/NC
Vouty
Voutx
4
OPERATIONAL AMPLIFIER
R110
0
14 SCL_SPC
U4
LIS302DL
P46
Vcc
3
2
1
U1
LIS302ALB
RES(Vdd)
Vcc
C70
100nF
Vmm
8
P54
3
Vcc
CK
NC
RES
RES
RES
Vdd
GND
P42mems
P42
8
7
9
10
11
12
3
2
1
15
Vdd
Vouty
ST
Voutx
Vdd
GND
6
C86
10nF
TS507ILT
IN+
GND
OUT
U82
IN-
Vcc
Vdd
R88
10k
4
5
5
4
3
2
1
Vcc
15
16
R83
0
P42
R89
10k
RES
GND
P43mems
P43
U6
LIS3LV02DL
P41mems
P44
Vcc
P40mems
U3
LIS3LV02AL3
3V3
R130
0
Vmm
C130
1uF
X7R
3V3
3V3
3
2
1
6
LD2980CMxx
INHIBIT
GND
Vin
U13
NC
Vout
4
5
Vmm
3
2
1
Title
Date:
File:
A3
Size
4
R90
10k
Number
C132
10nF
IN-
5
C41
100nF
R91
10k
P43
C50
100nF
C11
2.2uF
Vcc
Vdd
C10
100nF
7
C20
100nF
C80
100nF
C51
100nF
Vcc
Vcc
C81
100nF
C52
100nF
C21
2.2uF
7
8
8
C83
100nF
C61
100nF
C31
2.2uF
Revision
C82
100nF
C60
100nF
C30
100nF
21.2.2007
Sheet of
D:\STR9_DONGLE\..\STR9_MEMS_MODULE.SchDoc
Drawn By:
Vmm
TS507ILT
IN+
GND
Vcc
C40
100nF
OUT
U83
C87
10nF
C131
2.2uF
X7R
STABILIZATOR FOR MEMORY (OPTIONAL)
P41
R87
10k
R82
0
Vcc
13
14
NC
ANALOG MEMS
Vcc
6
14
RES(Vdd)
Voutx
7
INT_1
5
GND
4
GND
INT_2
10
GND
9
P55
2
GND
1
Vdd_io
SDA/SDI
Vcc
GND
11
SDO
SSP0_MISO 12
28
8
3
SSP0_MISO
2
SDA/SDI
13
SDA/SDI
8
NC
9
NC
26
NC
25
SDO
27
Vdd
4
RES
24
NC
SDASDI/SDO
10
NC
Vdd_io
23
NC
11
NC
22
NC
SCL/SPC
14
CS
12
SCL_SPC
NC
13
P81
P82
6
CS
NC
16
NC
Voutz
6
PD
P42mems 7
SCL_SPC
5
P77
FS
8
P45
GND
9
SDA/SDI
SCL/SPC
10
P54
1
RDY/INT
SSP0_MISO
RES
4
Vdd_io
Vdd
3
SDA/SDI/SDO
RES
2
SDO
Vdd
4/17
11
STR9 dongle schematics
12
Figure 3.
GND
Schematics
13
2
14
1
Schematics
UM0376
UM0376
MEMS footprints
3
MEMS footprints
3.1
LGA8 package
Figure 4.
MEMS footprint (LGA8 package)
Xm
Ym
Height
Yd
Ys
Xs
Width
ai14147
Table 1.
Mechanical data
Symbol
Dimension
Unit
Xs
0.79
mm
Ys
1.35
mm
Xm
1.81
mm
Ym
1.81
mm
Yd
1.27
mm
Height
5.0
mm
Width
5.0
mm
5/17
MEMS footprints
3.2
UM0376
LGA14 package
Figure 5.
MEMS footprint (LGA14 package)
Xm
Ym
Height
Ys
Xs
Xd
Width
ai14148
Table 2.
6/17
Mechanical data
Symbol
Dimension
Unit
Xs
0.64
mm
Ys
0.975
mm
Xm
2.0
mm
Ym
1.0
mm
Xd
0.8
mm
Height
3.0
mm
Width
5.0
mm
UM0376
3.3
MEMS footprints
LGA16 (D) package
Figure 6.
MEMS footprint (LGA16 (D) package)
Xm
Ym
Height
Yd
Ys
Xs
Xd
Width
ai14149
Table 3.
LGA16 (D) mechanical data
Symbol
Dimension
Unit
Xs
0.65
mm
Ys
0.975
mm
Xm
3.25
mm
Ym
1.7
mm
Xd
1.0
mm
Yd
1.0
mm
Height
4.4
mm
Width
7.5
mm
7/17
MEMS footprints
3.4
UM0376
LGA16 (A) package
Figure 7.
MEMS footprint (LAG16 (A) package)
Xm
Ym
Height
Yd
Ys
Xs
Xd
Width
ai14150
Table 4.
8/17
Mechanical data
Symbol
Dimension
Unit
Xs
0.64
mm
Ys
0.975
mm
Xm
2
mm
Ym
2
mm
Xd
0.8
mm
Yd
0.8
mm
Height
5.0
mm
Width
5.0
mm
UM0376
3.5
MEMS footprints
QFN28 package
Figure 8.
MEMS footprint (QFN28 package)
Xm
Ym
Height
Yd
Ys
Xs
Xd
Width
ai14151
1. Draft only. Not all the 28 pins are shown.
Table 5.
Mechanical data
Symbol
Dimension
Unit
Xs
0.5
mm
Ys
0.725
mm
Xm
3.225
mm
Ym
3.225
mm
Xd
0.8
mm
Yd
0.8
mm
Height
7.0
mm
Width
7.0
mm
9/17
PCB layout
4
UM0376
PCB layout
Figure 9.
Top view
Figure 10. Bottom view
10/17
UM0376
5
Bill of materials and assembly instructions
Bill of materials and assembly instructions
Table 6 to Table 15 show the bill of materials, while sections Section 5.1 to Section 5.3
provide additional information on assembly.
5.1
Assembly information for analog MEMS
1.
When U10 LD2980CMxx is not assembled use R100 instead. For low voltage MEMS
use a voltage regulator. The maximum supply current is around 1.5 mA per device.
2.
Operational amplifiers are optional.
a)
If they are not necessary, use resistors R80, R81, R82, R83 instead.
b)
If they are required, use operational amplifiers with the following resistor
configuration.
R80, R81, R82, R83 - not assembled
R84, R86, R88, R90 - not assembled
R85, R87, R89, R91 - assembled with 0R.
c)
To alter the gain of the operational amplifiers, use following resistor configuration.
R80, R81, R82, R83 - not assembled
The gain is determined by configuration of R84, R86, R88, R90 and R85, R87,
R89, R91.
d)
3.
5.2
In all cases it is recommended to have assembled filtering capacitors C84, C85,
C86, C87. Default is 10 nF, but this can be changed according to the required
filtering features.
Only ONE analog MEMS can be assembled. MEMS analog output pins are shared.
Assembly information for digital MEMS
1.
When U11 LD2980CMxx is not assembled, use R110 instead. For low voltage MEMS
use a voltage regulator. Maximum supply current is around 1.5 mA per device.
2.
Both I2C and SPI are wired.
3.
a)
The unused interface must be selected as floating input or third state.
b)
When using I2C, it is recommended to have assembled resistors R01 and R02
which are 4.7 kΩ pull-ups.
c)
When using SPI, each device has its own chip select.
The board is designed to have one MEMS assembled on the board although I2C and
SPI allows more devices to be used simultaneously. Care should be taken, however
with the RDY/INT pins, as they are shared.
11/17
Bill of materials and assembly instructions
5.3
UM0376
Assembly information for serial memory
1.
When U13 LD2980CMxx is not assembled, use R130 instead. All mentioned memories
should be able to operate on 3.3 V. Use a voltage regulator for low voltage memories.
2.
U7 supports the following series of ST memories:
M95xx - Serial SPI Bus EEPROM
M25xx - Serial SPI Bus Flash Memory
M34xx - Serial I2C Bus EEPROM
Table 6.
Voltage regulator for analog MEMS(1)
Label
Comment
Footprint
Description
Assembled
Order code
U10
LD2980CMxx
SOT23-5L
Voltage regulator
NO
ST: LD2980CMxx
R100
0
0603
Resistor
YES
GM: R0603-0R
C100
1 µF
0805
Pol. Capacitor
NO
Farnell: 422-7086 (X7R)
C101
2.2 µF
1206
Pol. Capacitor
NO
Farnell: 422-7323 (X7R)
C102
10 nF
0603
Capacitor
NO
Farnell: 422-6938 (X7R)
C103
10 µF
3528_AB_REV2
Pol. Capacitor
YES
Farnell: 331-3888
B45196H2106K109
1. By default, the voltage regulator is not assembled.
Table 7.
Voltage regulator for digital MEMS(1)
Label
Comment
Footprint
Description
Assembled
Order code
U11
LD2980Cxx
SOT23-5L
Voltage regulator
NO
ST: LD2980Cxx
R110
0
0603
Resistor
YES
GM: R0603-0R
C110
1 µF
0805
Pol. Capacitor
NO
Farnell: 422-7086 (X7R)
C111
2.2 µF
1206
Pol. Capacitor
No
Farnell: 422-7323 (X7R)
C112
10 µF
0603
Capacitor
NO
Farnell: 422-6938 (X7R)
1. By default, the voltage regulator is not assembled.
Table 8.
Voltage regulator for memory(1)
Label
Comment
Footprint
Description
Assembled
Order code
U13
LD2980CMxx
SOT23-5L
Voltage regulator
NO
ST: LD2980CMxx
R130
0
0603
Resistor
YES
GM: R0603-0R
C130
1 µF
0805
Pol. Capacitor
NO
Farnell: 422-7086 (X7R)
C131
2.2 µF
1206
Pol. Capacitor
NO
Farnell: 422-7323 (X7R)
C132
10 nF
0603
Capacitor
NO
Farnell: 422-6938 (X7R)
1. By default, the voltage regulator is not assembled.
12/17
UM0376
Table 9.
Bill of materials and assembly instructions
Analog MEMS(1)
Label
Comment
Footprint
Description
Assembled
Order code
CN5
ANALOG_CON
HDR2X10STD
Header 10X2
YES
GM:S2G20
U1
LIS302ALB
LGA14AD
ANALOG MEMS
NO
ST: LIS302ALB
C10
100 nF
0603
Capacitor
NO
Farnell: 422-6859 (X7R)
C11
2.2 µF
1206
Pol. Capacitor
NO
Farnell: 422-7323 (X7R)
U2
LIS3/2L06/2AL
LGA8A
ANALOG MEMS
YES
ST: LIS3/2L06/2AL
(LIS3L06AL for MP)
C20
100 nF
0603
Capacitor
YES
Farnell: 422-6859 (X7R)
C21
2.2 µF
1206
Pol. Capacitor
YES
Farnell: 422-7323 (X7R)
U3
LIS3LV02AL3
LGA16A
ANALOG MEMS
NO
ST: LIS3LV02AL3
C30
100 nF
0603
Capacitor
NO
Farnell: 422-6859 (X7R)
C31
2.2 µF
1206
Pol. Capacitor
NO
Farnell: 422-7323 (X7R)
1. By default, the LIS3/2L06/2AL is assembled.
Table 10. Digital MEMS(1)(2)
Label
Comment
Footprint
Description
Assembled
Order code
CN4
DIGITAL_CON
HDR2X10STD
Header 10X2
YES
GM: BL220G
U4
LIS302DL
LGA14AD
DIGITAL MEMS
NO
ST:LIS302DL
C40
100 nF
0603
Capacitor
NO
Farnell: 422-6859 (X7R)
C41
100 nF
0603
Capacitor
NO
Farnell: 422-6859 (X7R)
U5
LIS3LV02DQ
QFN28D
DIGITAL MEMS
YES
ST: LIS3LV02DQ
C50
100 nF
0603
Capacitor
YES
Farnell: 422-6859 (X7R)
C51
100 nF
0603
Capacitor
YES
Farnell: 422-6859 (X7R)
U6
LIS3LV02DL
LGA16D
DIGITAL MEMS
NO
ST: LIS3LV02DL
C60
100 nF
0603
Capacitor
NO
Farnell: 422-6859 (X7R)
C61
100 nF
0603
Capacitor
NO
Farnell: 422-6859 (X7R)
R01
4.7 kΩ
0603
R02
4.7 kΩ
R03
4.7 kΩ
1. By default, the
I 2C
Resistor
YES
(I2C)
GM: R0603-4k7
0603
Resistor
YES (I2C)
GM: R0603-4k7
0603
Resistor
YES (SPI)
GM: R0603-4k7
interface is used.
2. By default, the LIS3LV02DQ is assembled.
13/17
Bill of materials and assembly instructions
UM0376
Table 11.
Memory(1)
Label
Comment
Footprint
Description
Assembled
Order code
U7
M95xx/M25xx/
M34xx
SO8
Serial
FLASH/EEPROM
NO
ST: M95xx/M25xx/M34xx
C70
10 nF
0603
Capacitor
NO
Farnell: 422-6859 (X7R)
C71
10 nF
0603
Capacitor
NO
Farnell: 422-6938 (X7R)
1. By default, the memory is not assembled.
Table 12.
Operational amplifier X-axe for analog MEMS(1)
Label
Comment
Footprint
Description
Assembled
Order code
U80
TS507ILT
SOT23-5L
Operational
amplifier
NO
ST: TS507ILT
R80
0
0603
Resistor
YES
GM: R0603-0R
R84
10 kΩ
0603
Resistor
NO
GM: R0603-10k
R85
10 kΩ
0603
Resistor
NO
GM: R0603-10k
C80
100 nF
0603
Capacitor
NO
Farnell: 422-6859 (X7R)
C84
10 nF
0603
Capacitor
NO
Farnell: 422-6938 (X7R)
1. By default, the amplifier is not assembled.
Table 13.
Operational amplifier Y-axe for analog MEMS(1)
Label
Comment
Footprint
Description
Assembled
Order code
U81
TS507ILT
SOT23-5L
Operational
amplifier
NO
ST: TS507ILT
R81
0
0603
Resistor
YES
GM: R0603-0R
R86
10 kΩ
0603
Resistor
NO
GM: R0603-10k
R87
10 kΩ
0603
Resistor
NO
GM: R0603-10k
C81
100 nF
0603
Capacitor
NO
Farnell: 422-6859 (X7R)
C85
10 nF
0603
Capacitor
NO
Farnell: 422-6938 (X7R)
1. By default, the amplifier is not assembled.
Table 14.
Operational amplifier Z-axe for analog MEMS(1)
Label
Comment
Footprint
Description
Assembled
Order code
U82
TS507ILT
SOT23-5L
Operational
amplifier
NO
ST: TS507ILT
R82
0
0603
Resistor
YES
GM: R0603-0R
R88
10 kΩ
0603
Resistor
NO
GM: R0603-10k
R89
10 kΩ
0603
Resistor
NO
GM: R0603-10k
C82
100 nF
0603
Capacitor
NO
Farnell: 422-6859 (X7R)
C86
10 nF
0603
Capacitor
NO
Farnell: 422-6938 (X7R)
1. By default, the amplifier is not assembled.
14/17
UM0376
Table 15.
Bill of materials and assembly instructions
Operational amplifier Xyz-axe for analog MEMS(1)
Label
Comment
Footprint
Description
Assembled
Order code
U83
TS507ILT
SOT23-5L
Operational
amplifier
NO
ST: TS507ILT
R83
0
0603
Resistor
YES
GM: R0603-0R
R90
10 kΩ
0603
Resistor
NO
GM: R0603-10k
R91
10 kΩ
0603
Resistor
NO
GM: R0603-10k
C83
100 nF
0603
Capacitor
NO
Farnell: 422-6859 (X7R)
C87
10 nF
0603
Capacitor
NO
Farnell: 422-6938 (X7R)
1. By default, the amplifier is not assembled.
15/17
Revision history
6
UM0376
Revision history
Table 16.
Document revision history
Date
Revision
19-Jan-2007
1
Initial release.
2
Figure 3: STR9 dongle schematics, Figure 9: Top view and
Figure 10: Bottom view updated.
Stabilisator replaced by voltage regulator in the whole document.
MEMS footprint figures updated inSection 3 to add height and width.
Bill of materials updated and reorganized in Section 5.
3
Added extension board root part number.
Updated STR9 MEMS extension board photo in Figure 1: STR9
MEMS extension.
Updated R01, R02 and R03 assembling status and Note 1 in
Table 10: Digital MEMS.
24-May-2007
12-Nov-2007
16/17
Changes
UM0376
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
17/17
