STEVAL-SP1ML868

STEVAL-SP1ML915; STEVAL-SP1ML868 USB dongle for SPIRIT1 low power RF modules SP1ML-868 and SP1ML-915 Data brief Description The STEVAL-SP1ML868 and STEVALSP1ML915 boards are design tools that allow evaluation of ST's SP1ML-868 and SP1ML-915 low power RF modules in a quick and simple way. Features • • • • • Based on SPIRIT1 sub GHz modules SP1ML-868 and SP1ML-915 USB interface and power supply RESET button On-board antenna RoHS compliant The dongle includes the module to evaluate, an on-board RF antenna, and a USB connector. The USB connector is used to connect the dongle to a PC, to access the sub GHz RF module and to supply the dongle. The STEVAL-SP1ML868 and STEVALSP1ML915 downloaded firmware enables the user to create a SPIRIT1 link using simple AT commands. The SP1ML-based dongle is not qualified. It is a demonstration tool only, to be used strictly for evaluation purposes. It is not a product in itself. January 2015 DocID027158 Rev 1 For further information contact your local STMicroelectronics sales office 1/9 www.st.com Recommended operating conditions 1 STEVAL-SP1ML915; STEVAL-SP1ML868 Recommended operating conditions Table 1: Recommended operating conditions 2/9 Symbol Parameter Conditions VDD Board supply voltage Top Operating case temperature range -20 °C < T < 70 °C DocID027158 Rev 1 Min. 4.5 -20 Typ. Max. Unit 5 5.5 V +70 °C STEVAL-SP1ML915; STEVAL-SP1ML868 2 Dongle layout Dongle layout Figure 1: Dongle component layout, top side Figure 2: Dongle component layout, bottom side DocID027158 Rev 1 3/9 I/O Connections STEVAL-SP1ML915; STEVAL-SP1ML868 3 I/O Connections 3.1 Pad references In addition to the USB plug, several pads are also available. Pads 1 to 14 (indicated by the yellow boxes in the figure below) render the SP1ML-868 / SP1ML-915 module pins available to the user. There are also six jumpers (indicated by red boxes) for current absorption purposes and for reprogramming the module firmware. Figure 3: Available pads and jumpers Table 2 provides a description of the pad connections. 4/9 DocID027158 Rev 1 STEVAL-SP1ML915; STEVAL-SP1ML868 I/O Connections Table 2: Pad connections Description 1 GND (SP1ML-868 / SP1ML-915MODULE GND) 2 MODE0 SP1ML-868 / SP1ML-915 I/O signal 3 WKUP SP1ML-868 / SP1ML-915 signal (WAKE-UP high level digital voltage / SHUTDOWN low level digital voltage) 4 GPIO0 SP1ML-868 / SP1ML-915 programmable I/O signal 5 GPIO1 SP1ML-868 / SP1ML-915 programmable I/O signal 6 MODE1 SP1ML-868 / SP1ML-915 programmable I/O signal 7 TxRx_LED SP1ML-868 / SP1ML-915 programmable I/O signal (LED2 is internally connected to this signal) 8 GND 9 +5 V (USB) 10 +3.3 V 11 BOOT0 (boot pin used for firmware downloading - used for testing purpose) 12 Reset - connected in parallel to on-board reset switch 13 SWCLK SP1ML-868 / SP1ML-915 I/O signal (firmware dependent) 14 SWDIO SP1ML-868 / SP1ML-915 I/O signal (firmware dependent) Pad DocID027158 Rev 1 5/9 Reset switch 4 STEVAL-SP1ML915; STEVAL-SP1ML868 Reset switch A reset switch (SW1) is present on the dongle. When SW1 is pressed the SP1ML-868 / SP1ML-915 module is forced to reset. Figure 4: Reset switch 6/9 DocID027158 Rev 1 R11 N .M . USB (GND) USB (D+) USB (D-) USB (Vcc) J1 4 3 2 1 U S B M A L E C O N N E C TO R ( A type ) N.M. (ALTERNATIVE DEVICE) C3 10n R1 0 Ohm C4 22u 6 .3 V (TANT.) +3.3V_CP2102 6 5 4 D4 3.3V D3 (OPTIONAL) D1 GND D2 1 2 3 C8 10u 6 .3 V IC 3 U S B U F 0 1 W 6 C7 100n U S B M IN I C O N N E C TO R 5 4 3 2 1 J 1 -A L TE R N A TIV E +5V_USB (VCC) TP 1 R4 N .M . 4 .7 K R10 C9 1uF 1 2 3 4 5 6 7 LED1 GREEN IC 2 DC D RI GND D+ DVdd REGIN R2 470 Ohm CP2102 R9 4 .7 K NC NC NC NC NC NC NC RTS_CP2102 CTS_CP2102 21 20 19 18 17 16 15 RXD_CP2102 TXD_CP2102 VB US /RST NC /SUSPE ND SUSPE ND NC NC 8 9 10 11 12 13 14 +3.3V DTR DSR TXD RXD RTS CTS NC 28 27 26 25 24 23 22 ( It' s possible not mount the power supply unit in case of module with low power consumption ) C5 100n GND 1 GND U1A1 M C P 1 7 0 1 T-3 3 0 2 E /TT 3 2 Vin Vout SW 1 N.M. R3 +3.3V ( JUMPER NOT MOUNTED ) JP4 R7 0 Ohm JP3 R6 0 Ohm 100n C6 S W P U S H B U TTO N PAD8 2 +5V USB (VCC) PAD9 C2 10u 6 .3 V P A D 10 C1 100n RESE TN P A D 12 +3.3V_HC JP1 BOO T0 P A D 11 4 SWDIO P A D 14 5 SWCLK P A D 13 Vout 16 15 14 13 12 11 10 9 TXD CTS RTS RXD CON10A J2 1 3 5 7 9 S P IR IT1 (U S A ) M O D U L E TxRx_LED W KUP GPIO0 GPIO1 MODE0 MODE1 VIN GND (EMULATOR / DEBUGGER CONNECTOR) RESE TN BOO T0 SW CLK SW DIO SPM 1 2 4 6 8 10 1 2 3 4 5 6 7 8 LED2 GREEN R8 470 Ohm R5 JP2 0 Ohm R12 4 7 K o r N .M . R13 N .M . o r 4 7 K R12 for SPIRIT1 868MHz module and R13 for SPIRIT1 915MHz module TxRx_LED PAD7 ByPass WKUP PAD3 LDS3985M 33R GPIO0 PAD4 Vin MODE0 PAD2 INH IBIT GPIO1 PAD5 IC 1 GND 1 ANTENNA 3 SUBGIGA DocID027158 Rev 1 MODE1 GSPG11112014DI1435 PAD6 5 PAD1 STEVAL-SP1ML915; STEVAL-SP1ML868 Dongle schematics Dongle schematics Figure 5: Dongle circuit schematic 7/9 Revision history 6 STEVAL-SP1ML915; STEVAL-SP1ML868 Revision history Table 3: Document revision history 8/9 Date Rev 22-Jan-2015 1 DocID027158 Rev 1 Changes First release. STEVAL-SP1ML915; STEVAL-SP1ML868 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved DocID027158 Rev 1 9/9