STEVAL-STWINBX1

STEVAL-STWINBX1 Data brief STWIN.box - SensorTile Wireless Industrial Node Development Kit Features • • Multisensing wireless platform for vibration monitoring and ultrasound detection Built around STWIN.box core system board with processing, sensing, connectivity, and expansion capabilities • Ultra-low power Arm® Cortex®-M33 with FPU and TrustZone at 160 MHz, 2048 kBytes Flash memory (STM32U585AI) MicroSD card slot for standalone data logging applications • • • • Product summary STWIN.box SensorTile Wireless STEVALIndustrial Node STWINBX1 Development Kit Software example for STEVALSTWINBX1 FP-SNSDATALOG2 Ultra-low-power with FPU Arm Cortex-M33 with Trust Zone STM32U585AII6Q High-accuracy, High-resolution, Low-power, 2-axis Digital Inclinometer with Embedded Machine Learning Core IIS2ICLX Ultra-wide bandwidth, lownoise, 3-axis digital vibration sensor IIS3DWB Applications Factory Automation / Industrial Sensors • On-board Bluetooth® low energy v5.0 wireless technology (BlueNRG-M2), Wi-Fi (EMW3080) and NFC (ST25DV64K) Option to implement authentication and brand protection secure solution with STSAFE-A110 Wide range of industrial IoT sensors: – Ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB) – 3D accelerometer + 3D gyro iNEMO inertial measurement unit (ISM330DHCX) with Machine Learning Core – High-performance ultra-low-power 3-axis accelerometer for industrial applications (IIS2DLPC) – Ultra-low power 3-axis magnetometer (IIS2MDC) – High-accuracy, high-resolution, low-power, 2-axis digital inclinometer with Embedded Machine Learning Core (IIS2ICLX) – Dual full-scale, 1.26 bar and 4 bar, absolute digital output barometer in fullmold package (ILPS22QS) – Low-voltage, ultra low-power, 0.5°C accuracy I²C/SMBus 3.0 temperature sensor (STTS22H) – Industrial grade digital MEMS microphone (IMP34DT05) – Analog MEMS microphone with frequency response up to 80 kHz (IMP23ABSU) Expandable via a 34-pin FPC connector Description The STWIN.box (STEVAL-STWINBX1) is a development kit and reference design that simplifies prototyping and testing of advanced industrial sensing applications in IoT contexts such as condition monitoring and predictive maintenance. It is an evolution of the original STWIN kit (STEVAL-STWINKT1B) and features a higher mechanical accuracy in the measurement of vibrations, an improved robustness, an updated BoM to reflect the latest and best-in-class MCU and industrial sensors, and an easy-to-use interface for external add-ons. The STWIN.box kit consists of an STWIN.box core system, a 480mAh LiPo battery, an adapter for the ST-LINK debugger, a plastic case, an adapter board for DIL 24 sensors and a flexible cable. The many on-board industrial-grade sensors and the ultra-low power MCU enable applications that feature: ultra-low power, 9 DoF motion sensing, wide-bandwidth vibration analysis, audio and ultrasound acoustic inspection, very precise local temperature, and environmental monitoring. DB4598 - Rev 3 - August 2023 For further information contact your local STMicroelectronics sales office. www.st.com STEVAL-STWINBX1 A rich set of software packages is available in source code. Optimized firmware libraries and a complete companion cloud application help to speed up the design cycle to develop end-to-end solutions. The kit supports a broad range of connectivity options, including the built-in RS485 transceiver, BLE, Wi-Fi, and NFC. The STWIN.box also includes a 34-pin expansion connector for small form factor daughter boards associated with the STM32 family, such as the STEVAL-C34KAT1 vibrometer and temperature sensors expansion board. The STWIN.box is suitable for field trials, demonstrations, and PoC for industrial IoT applications that use ST software and third-party software. DB4598 - Rev 3 page 2/6 STEVAL-STWINBX1 Solution overview 1 Solution overview Predictive maintenance applications collect and process data from a wide variety of sensors in order to identify potential failures in machinery before they happen. A principal requirement of such applications is that the condition monitoring equipment is placed very close to relevant machine componentry for the data to be reliable, which is why the STWIN.box node is designed to be small but robust, self-powered and capable of wireless communication. Another application issue is the high volumes of preferably real-time data processing involved, which can overwhelm centralized monitoring and control systems, and corresponding communication networks. Distributed (or decentralized) computing architectures represent a valid solution to this problem by performing data preprocessing and analytical operations directly on the node. The STWIN kit supports and can demonstrate this concept through sample applications in the firmware package running on the STM32U5 ultra-low-power microcontroller embedded on the core system board. An additional possibility is provided by the embedded processing capabilities of the IIS2ICLX and the ISM330DHCX sensors, thanks to their programmable finite state machine and machine learning core. Figure 1. STEVAL-STWINBX1 functional block diagram DB4598 - Rev 3 page 3/6 STEVAL-STWINBX1 Kit versions 2 Kit versions Table 1. STEVAL-STWINBX1 versions PCB version STEVAL$STWINBX1A (1) Schematic diagrams STEVAL$STWINBX1A schematic diagrams Bill of materials STEVAL$ISTWINBX1A bill of materials 1. This code identifies the STEVAL-STWINBX1 evaluation kit first version. The STEVAL-STWINBX1 kit contains the STEVAL$STWBXCS1A main board, the STEVAL$C34DIL24A expansion board, the STEVAL$FLTCB01A flexible cable, and the STEVAL$MKIGIBV4A adapter. DB4598 - Rev 3 page 4/6 STEVAL-STWINBX1 Revision history Table 2. Document revision history DB4598 - Rev 3 Date Revision Changes 15-Dec-2022 1 Initial release. 25-Jan-2023 2 Updated Product summary and Section 1 Solution overview. 02-Aug-2023 3 Updated features in cover page: removed ST25DV04K, added ST25DV64K. page 5/6 STEVAL-STWINBX1 IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2023 STMicroelectronics – All rights reserved DB4598 - Rev 3 page 6/6