STD10NM65N
Datasheet
N-channel 650 V, 0.43 Ω typ., 9 A MDmesh™ II Power MOSFET
in a DPAK package
Features
TAB
Order code
2 3
1
STD10NM65N
DPAK
•
•
•
D(2, TAB)
VDS @
Tjmax.
710 V
RDS(on) max.
ID
0.48 Ω
9A
100% avalanche tested
Low input capacitance and gate charge
Low gate input resistance
Applications
G(1)
•
S(3)
AM01475v1_noZen
Switching applications
Description
This device is an N-channel Power MOSFET developed using the second generation
of MDmesh™ technology. This revolutionary Power MOSFET associates a vertical
structure to the company’s strip layout to yield one of the world’s lowest on-resistance
and gate charge. It is therefore suitable for the most demanding high efficiency
converters.
Product status
STD10NM65N
Product summary
Order code
STD10NM65N
Marking
10NM65N
Package
DPAK
Packing
Tape and reel
DS5566 - Rev 4 - May 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
STD10NM65N
Electrical ratings
1
Electrical ratings
Table 1. Absolute maximum ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source voltage
650
V
VGS
Gate-source voltage
±25
V
Drain current (continuous) at TC = 25 °C
9
A
Drain current (continuous) at TC = 100 °C
5.7
A
Drain current (pulsed)
36
A
Total dissipation at TC = 25 °C
90
W
Peak diode recovery voltage slope
15
Drain-source voltage slope (VDD = 520 V, ID = 9 A, VGS = 10 V)
25
ID
ID
IDM
(1)
PTOT
dv/dt (2)
dv/dt
Tj
Operating junction temperature range
Tstg
V/ns
-55 to 150
°C
Value
Unit
Thermal resistance junction-case
1.39
°C/W
Thermal resistance junction-pcb
50
°C/W
Value
Unit
Storage temperature range
1. Pulse width limited by safe operating area.
2. ISD ≤ 9 A, di/dt ≤ 400 A/μs, VDSpeak ≤ V(BR)DSS, VDD = 80% V(BR)DSS.
Table 2. Thermal data
Symbol
Rthj-case
Rthj-pcb
(1)
Parameter
1. When mounted on 1inch² FR-4, 2 Oz copper board.
Table 3. Avalanche characteristics
Symbol
DS5566 - Rev 4
Parameter
IAS
Avalanche current, repetitive or not-repetitive (pulse width limited by Tj Max)
2.5
A
EAS
Single pulse avalanche energy (starting Tj = 25 °C, ID = IAS, VDD = 50 V)
200
mJ
page 2/18
STD10NM65N
Electrical characteristics
2
Electrical characteristics
(TCASE = 25 °C unless otherwise specified)
Table 4. On/off states
Symbol
Parameter
V(BR)DSS
Drain-source
breakdown voltage
Test conditions
Min.
ID = 1 mA, VGS = 0 V
Typ.
650
Zero gate voltage drain
current
IGSS
Gate body leakage
current
VDS = 0 V, VGS = ±20 V
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250 µA
RDS(on)
Static drain-source on
resistance
VGS = 10 V, ID = 4.5 A
VGS = 0 V, VDS = 650 V, TC = 125 °C
1
µA
100
µA
±100
nA
3
4
V
0.43
0.48
Ω
Typ.
Max.
Unit
-
pF
-
pF
-
nC
(1)
2
Unit
V
VGS = 0 V, VDS = 650 V
IDSS
Max.
1. Defined by design, not subject to production test.
Table 5. Dynamic
Symbol
Parameter
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Coss eq. (1)
Equivalent output
capacitance
Qg
Total gate charge
Qgs
Gate-source charge
Qgd
Gate-drain charge
Test conditions
Min.
850
VDS = 50 V, f = 1 MHz, VGS = 0 V
-
53
4
VDS = 0 to 520 V, VGS = 0 V
VDD = 520 V, ID = 9 A, VGS = 0 to 10 V
(see Figure 13. Test circuit for gate charge
behavior)
-
90
25
-
4
14
1. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0
to 80% VDSS.
Table 6. Switching times
Symbol
td(on)
tr
td(off)
tf(i)
DS5566 - Rev 4
Parameter
Test conditions
Turn-on delay time
VDD = 325 V, ID = 4.5 A,
Rise time
RG = 4.7 Ω, VGS = 10 V
Turn-off delay time
(see Figure 12. Test circuit for resistive load
switching times and Figure 17. Switching
time waveform)
Fall time
Min.
Typ.
Max.
Unit
-
ns
12
-
8
50
20
page 3/18
STD10NM65N
Electrical characteristics
Table 7. Source drain diode
Symbol
Parameter
Test conditions
ISD
Source-drain current
ISDM (1)
Source-drain current
(pulsed)
VSD (2)
Forward on voltage
ISD = 9 A, VGS = 0 V
trr
Reverse recovery time
ISD = 9 A, di/dt = 100 A/µs
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
VDD = 100 V (see Figure 14. Test circuit for
inductive load switching and diode recovery
times)
trr
Reverse recovery time
ISD = 9 A, di/dt = 100 A/µs
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
VDD = 100 V (see Figure 14. Test circuit for
inductive load switching and diode recovery
times)
Min.
Typ.
Max.
Unit
9
-
36
-
-
-
1.3
A
V
330
ns
3
μC
19
A
430
ns
4
μC
19
A
1. Pulse width limited by safe operating area.
2. Pulsed: pulse duration = 300 μs, duty cycle 1.5%.
DS5566 - Rev 4
page 4/18
STD10NM65N
Electrical characteristics curves
2.1
Electrical characteristics curves
Figure 1. Safe operating area
Figure 2. Thermal impedance
HV41670
ID(A)
Tj=150°C
Tc=25°C
4
Single
pulse
2
1
8
6
Op
Li erati
mi on
ted
in
by thi
M sA
ax
r
Rd ea is
s(o
n)
10
4
2
10
0
8
6
100
100 m s
1ms
4
10ms
2
10
GC20460
K
10-1
-1
8
6
4
2
-2
10
10
-1
2
4 6 8
10
0
2
4
6 8
10 1
2
4 6 8
10 2
2
4
6 8
10 3 VDS(V)
10-2
10-5
Figure 3. Output characterisics
ID(A)
VGS=10V
10-2
tp (s)
10-1
HV41695
ID(A)
VDS=20V
20
6V
15
10-3
Figure 4. Transfer characteristics
HV41690
20
10-4
15
10
10
5V
5
5
4V
0
10
30 VDS(V)
20
Figure 5. Static drain-source on resistance
HV41760
R DS(on)
0
8
6
4
2
VGS(V)
Figure 6. Gate charge vs gate-source voltage
HV41720
VGS (V)
(Ω)
0.6
VDD=520V
12
I D =9A
VGS =10V
0.5
9
0.4
6
0.3
0.2
DS5566 - Rev 4
3
0
2
4
6
8
I D(A)
0
5
10
15
20
25
Qg(nC)
page 5/18
STD10NM65N
Electrical characteristics curves
Figure 8. Normalized gate threshold voltage vs
temperature
Figure 7. Capacitance variations
HV41730
C (pF)
HV41740
VGS(th)
(norm)
4
ID =250µA
2
10
Ciss
3
1.1
8
6
4
1.0
2
10
2
8
6
0.9
Coss
4
2
10
0.8
1
8
6
Crss
4
0.7
2
10
0
10
-1
2
4
6 8
10
0
2
4
6 8
10
1
2
4
6 8
10
2
0.6
VDS (V)
-100
Figure 9. Normalized on resistance vs temperature
RDS(on)
(norm)
2.5
0
50
100
150 TJ (°C)
Figure 10. Source-drain diode forward characteristic
HV41750
HV27230
VSD
(V)
VGS =10V
ID=4.5A
TJ =-50
°C
0.9
2.0
0.8
1.5
0.7
1.0
0.6
0.5
0.5
0
-100
-50
25 °C
150 °C
-50
0
50
100
0.4
150 TJ ( °C)
0
2
4
6
8
10
I SD (A)
Figure 11. Normalized V(BR)DSS vs temperature
HV41700
V(BR)DSS
VGS=0
ID=1mA
(norm)
1.1
1.05
1.0
0.95
0.90
DS5566 - Rev 4
-50
0
50
100
TJ (°C)
page 6/18
STD10NM65N
Test circuits
3
Test circuits
Figure 12. Test circuit for resistive load switching times
Figure 13. Test circuit for gate charge behavior
VDD
12 V
2200
+ μF
3.3
μF
VDD
VD
VGS
1 kΩ
100 nF
RL
IG= CONST
VGS
RG
47 kΩ
+
pulse width
D.U.T.
2.7 kΩ
2200
μF
pulse width
D.U.T.
100 Ω
VG
47 kΩ
1 kΩ
AM01469v1
AM01468v1
Figure 14. Test circuit for inductive load switching and
diode recovery times
D
G
A
D.U.T.
S
25 Ω
A
L
A
B
B
3.3
µF
D
G
+
VD
100 µH
fast
diode
B
Figure 15. Unclamped inductive load test circuit
RG
1000
+ µF
2200
+ µF
VDD
3.3
µF
VDD
ID
D.U.T.
S
D.U.T.
Vi
_
pulse width
AM01471v1
AM01470v1
Figure 16. Unclamped inductive waveform
Figure 17. Switching time waveform
V(BR)DSS
ton
VD
td(on)
90%
IDM
tf
90%
10%
10%
0
ID
VDD
toff
td(off)
tr
VDD
VGS
0
VDS
90%
10%
AM01472v1
AM01473v1
DS5566 - Rev 4
page 7/18
STD10NM65N
Package information
4
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
DS5566 - Rev 4
page 8/18
STD10NM65N
DPAK (TO-252) type A2 package information
4.1
DPAK (TO-252) type A2 package information
Figure 18. DPAK (TO-252) type A2 package outline
0068772_type-A2_rev25
DS5566 - Rev 4
page 9/18
STD10NM65N
DPAK (TO-252) type A2 package information
Table 8. DPAK (TO-252) type A2 mechanical data
Dim.
mm
Min.
Max.
A
2.20
2.40
A1
0.90
1.10
A2
0.03
0.23
b
0.64
0.90
b4
5.20
5.40
c
0.45
0.60
c2
0.48
0.60
D
6.00
6.20
D1
4.95
E
6.40
E1
5.10
5.20
5.30
e
2.159
2.286
2.413
e1
4.445
4.572
4.699
H
9.35
10.10
L
1.00
1.50
L1
2.60
2.80
3.00
L2
0.65
0.80
0.95
L4
0.60
R
V2
DS5566 - Rev 4
Typ.
5.10
5.25
6.60
1.00
0.20
0°
8°
page 10/18
STD10NM65N
DPAK (TO-252) type C2 package information
4.2
DPAK (TO-252) type C2 package information
Figure 19. DPAK (TO-252) type C2 package outline
0068772_C2_25
DS5566 - Rev 4
page 11/18
STD10NM65N
DPAK (TO-252) type C2 package information
Table 9. DPAK (TO-252) type C2 mechanical data
Dim.
mm
Min.
Typ.
Max.
A
2.20
2.30
2.38
A1
0.90
1.01
1.10
A2
0.00
0.10
b
0.72
0.85
b4
5.13
c
0.47
0.60
c2
0.47
0.60
D
6.00
D1
5.10
E
6.50
E1
5.20
e
2.186
2.286
2.386
H
9.80
10.10
10.40
L
1.40
1.50
1.70
L1
L2
6.20
5.60
6.60
6.70
5.50
0.90
1.25
0.51 BSC
0.60
L6
DS5566 - Rev 4
6.10
5.46
2.90 REF
L3
L4
5.33
0.80
1.00
1.80 BSC
θ1
5°
7°
9°
θ2
5°
7°
9°
V2
0°
8°
page 12/18
STD10NM65N
DPAK (TO-252) type C2 package information
Figure 20. DPAK (TO-252) recommended footprint (dimensions are in mm)
FP_0068772_25
DS5566 - Rev 4
page 13/18
STD10NM65N
DPAK (TO-252) packing information
4.3
DPAK (TO-252) packing information
Figure 21. DPAK (TO-252) tape outline
10 pitches cumulative
tolerance on tape +/- 0.2 mm
T
P0
Top cover
tape
P2
D
E
F
B1
K0
For machine ref. only
including draft and
radii concentric around B0
W
B0
A0
P1
D1
User direction of feed
R
Bending radius
User direction of feed
AM08852v1
DS5566 - Rev 4
page 14/18
STD10NM65N
DPAK (TO-252) packing information
Figure 22. DPAK (TO-252) reel outline
T
40mm min.
access hole
at slot location
B
D
C
N
A
G measured
at hub
Tape slot
in core for
tape start
2.5mm min.width
Full radius
AM06038v1
Table 10. DPAK (TO-252) tape and reel mechanical data
Tape
Dim.
mm
mm
Dim.
Min.
Max.
A0
6.8
7
A
B0
10.4
10.6
B
1.5
12.1
C
12.8
1.6
D
20.2
G
16.4
50
B1
DS5566 - Rev 4
Reel
Min.
Max.
330
13.2
D
1.5
D1
1.5
E
1.65
1.85
N
F
7.4
7.6
T
K0
2.55
2.75
P0
3.9
4.1
Base qty.
2500
P1
7.9
8.1
Bulk qty.
2500
P2
1.9
2.1
R
40
T
0.25
0.35
W
15.7
16.3
18.4
22.4
page 15/18
STD10NM65N
Revision history
Table 11. Document revision history
Date
Version
Changes
26-Oct-2007
1
Initial release.
07-Feb-2008
2
Document status promoted from preliminary data to datasheet.
14-Oct-2008
3
Table 4: Avalanche characteristics has been corrected.
The part numbers STF10NM65N, STP10NM65N and STU10NM65N have
been moved to a separate datasheet.
16-May-2018
4
Removed maturity status indication from cover page. The document status is
production data.
Updated features and description in cover page, Section 1 Electrical ratings,
Section 2 Electrical characteristics, Section 2.1 Electrical characteristics
curves and Section 4 Package information.
Minor text changes.
DS5566 - Rev 4
page 16/18
STD10NM65N
Contents
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
4
Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1
DPAK (TO-252) type A2 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2
DPAK (TO-252) type C2 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.3
DPAK (TO-252) packing information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
DS5566 - Rev 4
page 17/18
STD10NM65N
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
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Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
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ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
DS5566 - Rev 4
page 18/18