STP12PF06
STF12PF06
P-CHANNEL 60V - 0.18 Ω - 12A TO-220/TO-220FP
STripFET™ II POWER MOSFET
Table 1: General Features
Figure 1:Package
TYPE
VDSS
RDS(on)
ID
STP12PF06
STF12PF06
60 V
60 V
< 0.20 Ω
< 0.20 Ω
12 A
12 A
■
■
■
■
■
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TYPICAL RDS(on) = 0.18 Ω
EXCEPTIONAL dv/dt CAPABILITY
100% AVALANCHE TESTED
LOW GATE CHARGE
APPLICATION ORIENTED
CHARACTERIZATION
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1
2
TO-220
DESCRIPTION
This Power MOSFET is the latest development of
STMicroelectronis unique "Single Feature Size™"
strip-based process. The resulting transistor
shows extremely high packing density for low onresistance, rugged avalanche characteristics and
less critical alignment steps therefore a
remarkable manufacturing reproducibility
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TO-220FP
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Figure 2: Internal Schematic Diagram
APPLICATIONS
■ MOTOR CONTROL
■ DC-DC & DC-AC CONVERTERS
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Table 2: Order Codes
PART NUMBER
STP12PF06
STF12PF06
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MARKING
P12PF06
F12PF06
PACKAGE
TO-220
TO-220FP
PACKAGING
TUBE
TUBE
Table 3: ABSOLUTE MAXIMUM RATINGS
Symbol
VDS
VDGR
VGS
ID
ID
IDM(•)
Ptot
dv/dt (1)
EAS (2)
Tstg
Tj
Parameter
Drain-source Voltage (VGS = 0)
Drain-gate Voltage (RGS = 20 kΩ)
Gate- source Voltage
Drain Current (continuous) at TC = 25°C
Drain Current (continuous) at TC = 100°C
Drain Current (pulsed)
Total Dissipation at TC = 25°C
Derating Factor
Peak Diode Recovery voltage slope
Single Pulse Avalanche Energy
Storage Temperature
Operating Junction Temperature
(•) Pulse width limited by safe operating area.
NOTE:For the P-CHANNEL MOSFET actual polarity of voltages
and current has to be reversed.
March 2005
Value
STP20PF06
Unit
STF20PF06
60
60
± 20
6
200
V
V
V
A
A
A
W
W/°C
V/ns
mJ
-55 to 175
°C
12
8.4
48
60
0.4
8
5.6
32
225
0.17
(1) ISD ≤12A, di/dt ≤200A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
(2) Starting Tj = 25 oC, ID = 12A, VDD= 25V
Rev. 2.0
1/10
STP12PF06 STF12PF06
Table 4: THERMAL DATA
Rthj-case
Thermal Resistance Junction-case
Max
Rthj-amb
Tl
Thermal Resistance Junction-ambient
Maximum Lead Temperature For Soldering Purpose
Max
TO-220
TO-220FP
2.5
5.35
62.5
300
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
Table 5: OFF
Symbol
Parameter
Test Conditions
Min.
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 20V
V(BR)DSS
Table 6: ON (*)
Symbol
Parameter
Gate Threshold Voltage
VDS = VGS
ID = 250 µA
RDS(on)
Static Drain-source On
Resistance
VGS = 10 V
ID = 10 A
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Symbol
Parameter
Forward Transconductance
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
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Pr
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Test Conditions
VDS = 15 V
Unit
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ID = 6 A
VDS = 25V f = 1 MHz VGS = 0
1
10
µA
µA
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±100
nA
Min.
Typ.
Max.
Unit
2
3.4
4
V
0.18
0.20
Ω
Min.
Typ.
Max.
Unit
2.5
6
S
850
230
75
pF
pF
pF
P
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et
VGS(th)
Table 7: DYNAMIC
Max.
60
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Test Conditions
Typ.
STP12PF06 STF12PF06
ELECTRICAL CHARACTERISTICS (continued)
Table 8: SWITCHING ON
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
td(on)
tr
Turn-on Delay Time
Rise Time
VDD = 30 V
ID = 6 A
VGS = 10 V
RG = 4.7 Ω
(Resistive Load, Figure 19)
20
40
Qg
Qgs
Qgd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VDD= 48 V ID= 12 A VGS= 10 V
16
4
6
21
Typ.
Max.
ns
ns
nC
nC
nC
)
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Table 9: SWITCHING OFF
Symbol
td(off)
tf
Parameter
Test Conditions
Min.
VDD = 30 V
ID = 6 A
VGS = 10 V
RG = 4.7Ω,
(Resistive Load, Figure 19)
Turn-off Delay Time
Fall Time
Symbol
Parameter
ISD
ISDM (1)
Source-drain Current
Source-drain Current (pulsed)
VSD (2)
Forward On Voltage
trr
Qrr
IRRM
Test Conditions
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Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
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Min.
Typ.
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ISD = 12 A
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10
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Table 10: SOURCE DRAIN DIODE
VGS = 0
ISD = 12 A
di/dt = 100A/µs
Tj = 150°C
VDD = 30 V
(see test circuit, Figure 21)
Unit
Unit
ns
ns
Max.
Unit
10
40
A
A
2.5
V
100
260
5.2
ns
nC
A
du
(1 )Pulse width limited by safe operating area.
(2) Pulsed: Pulse duration = 300 µs, duty cycle
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Figure 3: Safe Operating Area for TO-220
Figure 4: Safe Operating Area for TO-220FP
3/10
STP12PF06 STF12PF06
Figure 5: Thermal Impedance
Figure 6: Thermal Impedance for TO-220FP
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Figure 7: Output Characteristics
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Figure 8: Transfer Characteristics
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Figure 9: Transconductance
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Figure 10: Static Drain-source On Resistance
STP12PF06 STF12PF06
Figure 11: Gate Charge vs Gate-source Voltage
Figure 12: Capacitance Variations
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Figure 13: Normalized Gate Threshold Voltage vs
Temperature
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Figure 14: Normalized on Resistance vs Temperature
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Figure 15: Source-drain Diode Forward
Characteristics
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Figure 16: Normalized Breakdown Voltage
Temperature
5/10
STP12PF06 STF12PF06
Figure 17: Unclamped Inductive Load Test Circuit
Figure 18: Unclamped Inductive Waveform
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Figure 19: Switching Times Test Circuits For Re-
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sistive Load
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Figure 21: Test Circuit For Inductive Load
Switching And Diode Recovery Times
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Figure 20: Gate Charge test Circuit
STP12PF06 STF12PF06
TO-220 MECHANICAL DATA
mm.
DIM.
MIN.
TYP.
inch.
MAX.
MIN.
A
4.4
4.6
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
F2
1.14
1.70
0.044
G
4.95
5.15
0.194
G1
2.40
2.70
0.094
H2
10
10.40
0.393
L2
16.40
L3
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28.90
L4
13
14
L5
2.65
2.95
L6
15.25
15.75
L7
6.20
L9
3.50
DIA
3.75
TYP.
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0.067
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Pr
0.067
0.203
0.106
0.409
0.645
1.137
0.511
0.551
0.104
0.116
0.600
0.620
6.60
0.244
0.260
3.93
0.137
0.154
3.85
0.147
0.151
)-
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TYP.
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7/10
STP12PF06 STF12PF06
TO-220FP MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.7
0.017
0.027
F
0.75
1
0.030
F1
1.15
1.7
0.045
F2
1.15
1.7
0.045
G
4.95
5.2
0.195
G1
2.4
2.7
0.094
H
10
10.4
0.393
L2
L3
28.6
30.6
L4
9.8
10.6
L6
15.9
L7
9
Ø
3
Pr
b
O
-
0.106
0.630
1.204
0.385
0.417
0.626
0.645
0.354
0.366
3.2
0.118
0.126
E
D
P
e
B
0.204
9.3
d
o
r
A
0.067
1.126
t
c
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l
o
0.067
0.409
so
16.4
(s)
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16
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0.039
L3
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L6
F2
H
G
G1
¯
F
F1
L7
1 2 3
L2
8/10
L4
STP12PF06 STF12PF06
Table 11:Revision History
Date
Revision
Description of Changes
March 2005
1.0
FIRST ISSUE
March 2005
2.0
MINOR REVISION
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STP12PF06 STF12PF06
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is registered trademark of STMicroelectronics
All other names are the property of their respective owners.
© 2005 STMicroelectronics - All Rights Reserved
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