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STF12PF06

STF12PF06

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOT78

  • 描述:

    MOSFET P-CH 60V 8A TO-220FP

  • 数据手册
  • 价格&库存
STF12PF06 数据手册
STP12PF06 STF12PF06 P-CHANNEL 60V - 0.18 Ω - 12A TO-220/TO-220FP STripFET™ II POWER MOSFET Table 1: General Features Figure 1:Package TYPE VDSS RDS(on) ID STP12PF06 STF12PF06 60 V 60 V < 0.20 Ω < 0.20 Ω 12 A 12 A ■ ■ ■ ■ ■ ) s t( TYPICAL RDS(on) = 0.18 Ω EXCEPTIONAL dv/dt CAPABILITY 100% AVALANCHE TESTED LOW GATE CHARGE APPLICATION ORIENTED CHARACTERIZATION c u d 3 1 2 TO-220 DESCRIPTION This Power MOSFET is the latest development of STMicroelectronis unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high packing density for low onresistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility ) s ( ct e t le o r P 3 1 2 TO-220FP o s b -O Figure 2: Internal Schematic Diagram APPLICATIONS ■ MOTOR CONTROL ■ DC-DC & DC-AC CONVERTERS u d o r P e t e l o Table 2: Order Codes PART NUMBER STP12PF06 STF12PF06 s b O MARKING P12PF06 F12PF06 PACKAGE TO-220 TO-220FP PACKAGING TUBE TUBE Table 3: ABSOLUTE MAXIMUM RATINGS Symbol VDS VDGR VGS ID ID IDM(•) Ptot dv/dt (1) EAS (2) Tstg Tj Parameter Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ) Gate- source Voltage Drain Current (continuous) at TC = 25°C Drain Current (continuous) at TC = 100°C Drain Current (pulsed) Total Dissipation at TC = 25°C Derating Factor Peak Diode Recovery voltage slope Single Pulse Avalanche Energy Storage Temperature Operating Junction Temperature (•) Pulse width limited by safe operating area. NOTE:For the P-CHANNEL MOSFET actual polarity of voltages and current has to be reversed. March 2005 Value STP20PF06 Unit STF20PF06 60 60 ± 20 6 200 V V V A A A W W/°C V/ns mJ -55 to 175 °C 12 8.4 48 60 0.4 8 5.6 32 225 0.17 (1) ISD ≤12A, di/dt ≤200A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX (2) Starting Tj = 25 oC, ID = 12A, VDD= 25V Rev. 2.0 1/10 STP12PF06 STF12PF06 Table 4: THERMAL DATA Rthj-case Thermal Resistance Junction-case Max Rthj-amb Tl Thermal Resistance Junction-ambient Maximum Lead Temperature For Soldering Purpose Max TO-220 TO-220FP 2.5 5.35 62.5 300 °C/W °C/W °C ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED) Table 5: OFF Symbol Parameter Test Conditions Min. Drain-source Breakdown Voltage ID = 250 µA, VGS = 0 IDSS Zero Gate Voltage Drain Current (VGS = 0) VDS = Max Rating VDS = Max Rating TC = 125°C IGSS Gate-body Leakage Current (VDS = 0) VGS = ± 20V V(BR)DSS Table 6: ON (*) Symbol Parameter Gate Threshold Voltage VDS = VGS ID = 250 µA RDS(on) Static Drain-source On Resistance VGS = 10 V ID = 10 A ) s ( ct Symbol Parameter Forward Transconductance Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance e t e ol s b O 2/10 u d o gfs (2) Pr b O - Test Conditions VDS = 15 V Unit ) s ( V t c u ID = 6 A VDS = 25V f = 1 MHz VGS = 0 1 10 µA µA d o r ±100 nA Min. Typ. Max. Unit 2 3.4 4 V 0.18 0.20 Ω Min. Typ. Max. Unit 2.5 6 S 850 230 75 pF pF pF P e et VGS(th) Table 7: DYNAMIC Max. 60 l o s Test Conditions Typ. STP12PF06 STF12PF06 ELECTRICAL CHARACTERISTICS (continued) Table 8: SWITCHING ON Symbol Parameter Test Conditions Min. Typ. Max. td(on) tr Turn-on Delay Time Rise Time VDD = 30 V ID = 6 A VGS = 10 V RG = 4.7 Ω (Resistive Load, Figure 19) 20 40 Qg Qgs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge VDD= 48 V ID= 12 A VGS= 10 V 16 4 6 21 Typ. Max. ns ns nC nC nC ) s t( Table 9: SWITCHING OFF Symbol td(off) tf Parameter Test Conditions Min. VDD = 30 V ID = 6 A VGS = 10 V RG = 4.7Ω, (Resistive Load, Figure 19) Turn-off Delay Time Fall Time Symbol Parameter ISD ISDM (1) Source-drain Current Source-drain Current (pulsed) VSD (2) Forward On Voltage trr Qrr IRRM Test Conditions ) s ( ct Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current o r P Min. Typ. so b O - ISD = 12 A c u d 40 10 e t le Table 10: SOURCE DRAIN DIODE VGS = 0 ISD = 12 A di/dt = 100A/µs Tj = 150°C VDD = 30 V (see test circuit, Figure 21) Unit Unit ns ns Max. Unit 10 40 A A 2.5 V 100 260 5.2 ns nC A du (1 )Pulse width limited by safe operating area. (2) Pulsed: Pulse duration = 300 µs, duty cycle s b O e t e ol 1.5 %. o r P Figure 3: Safe Operating Area for TO-220 Figure 4: Safe Operating Area for TO-220FP 3/10 STP12PF06 STF12PF06 Figure 5: Thermal Impedance Figure 6: Thermal Impedance for TO-220FP ) s t( c u d Figure 7: Output Characteristics o r P Figure 8: Transfer Characteristics e t le o s b O ) s ( t c u d o r P e t e l o bs Figure 9: Transconductance O 4/10 Figure 10: Static Drain-source On Resistance STP12PF06 STF12PF06 Figure 11: Gate Charge vs Gate-source Voltage Figure 12: Capacitance Variations ) s t( c u d Figure 13: Normalized Gate Threshold Voltage vs Temperature o r P Figure 14: Normalized on Resistance vs Temperature e t le o s b O ) s ( t c u d o r P e t e l o bs Figure 15: Source-drain Diode Forward Characteristics O Figure 16: Normalized Breakdown Voltage Temperature 5/10 STP12PF06 STF12PF06 Figure 17: Unclamped Inductive Load Test Circuit Figure 18: Unclamped Inductive Waveform ) s t( c u d Figure 19: Switching Times Test Circuits For Re- e t le sistive Load o s b O ) s ( t c u d o r P e t e l o s b O Figure 21: Test Circuit For Inductive Load Switching And Diode Recovery Times 6/10 o r P Figure 20: Gate Charge test Circuit STP12PF06 STF12PF06 TO-220 MECHANICAL DATA mm. DIM. MIN. TYP. inch. MAX. MIN. A 4.4 4.6 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 F2 1.14 1.70 0.044 G 4.95 5.15 0.194 G1 2.40 2.70 0.094 H2 10 10.40 0.393 L2 16.40 L3 e t le 28.90 L4 13 14 L5 2.65 2.95 L6 15.25 15.75 L7 6.20 L9 3.50 DIA 3.75 TYP. ) s t( 0.067 od uc Pr 0.067 0.203 0.106 0.409 0.645 1.137 0.511 0.551 0.104 0.116 0.600 0.620 6.60 0.244 0.260 3.93 0.137 0.154 3.85 0.147 0.151 )- s ( t c TYP. Ob so u d o r P e t e l o s b O 7/10 STP12PF06 STF12PF06 TO-220FP MECHANICAL DATA mm DIM. MIN. inch TYP. MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027 F 0.75 1 0.030 F1 1.15 1.7 0.045 F2 1.15 1.7 0.045 G 4.95 5.2 0.195 G1 2.4 2.7 0.094 H 10 10.4 0.393 L2 L3 28.6 30.6 L4 9.8 10.6 L6 15.9 L7 9 Ø 3 Pr b O - 0.106 0.630 1.204 0.385 0.417 0.626 0.645 0.354 0.366 3.2 0.118 0.126 E D P e B 0.204 9.3 d o r A 0.067 1.126 t c u t e l o 0.067 0.409 so 16.4 (s) uc od e t le 16 ) s t( 0.039 L3 s b O L6 F2 H G G1 ¯ F F1 L7 1 2 3 L2 8/10 L4 STP12PF06 STF12PF06 Table 11:Revision History Date Revision Description of Changes March 2005 1.0 FIRST ISSUE March 2005 2.0 MINOR REVISION ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O 9/10 STP12PF06 STF12PF06 ) s t( c u d e t le o r P o s b O ) s ( t c u d o r P e t e l o s b O Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is registered trademark of STMicroelectronics All other names are the property of their respective owners. © 2005 STMicroelectronics - All Rights Reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco -Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America. www.st.com 10/10
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