STD5N52U,
STF5N52U
N-channel 525 V, 1.25 Ω typ., 4.4 A UltraFASTmesh™
Power MOSFETs in DPAK and TO-220FP packages
Datasheet - production data
Features
Order codes
VDS
RDS(on) max
ID
525 V
1.5 Ω
4.4 A
STD5N52U
TAB
PTOT
70 W
STF5N52U
• Outstanding dv/dt capability
3
1
3
• Gate charge minimized
2
DPAK
25 W
1
• Very low intrinsic capacitances
TO-220FP
• Very low RDS(on)
• Extremely low trr
Figure 1. Internal schematic diagram
Applications
• Switching applications
D(2, TAB)
Description
These devices are N-channel Power MOSFETs
developed using UltraFASTmesh™ technology,
which combines the advantages of reduced onresistance, Zener gate protection and very high
dv/dt capability with an enhanced fast body-drain
recovery diode.
G(1)
S(3)
AM01476v1
Table 1. Device summary
Order codes
Marking
Package
Packaging
DPAK
Tape and reel
TO-220FP
Tube
STD5N52U
5N52U
STF5N52U
April 2014
This is information on a product in full production.
DocID15684 Rev 3
1/19
www.st.com
Contents
STD5N52U, STF5N52U
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
........................... 6
3
Test circuits
.............................................. 9
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1
DPAK, STD5N52U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
4.2
TO-220FP, STF5N52U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2/19
DocID15684 Rev 3
STD5N52U, STF5N52U
1
Electrical ratings
Electrical ratings
Table 2. Absolute maximum ratings
Value
Symbol
Parameter
Unit
DPAK
VGS
TO-220FP
Gate- source voltage
± 30
V
ID
Drain current (continuous) at TC = 25 °C
4.4
A
ID
Drain current (continuous) at TC = 100 °C
2.8
A
Drain current (pulsed)
17.6
A
IDM
(1)
PTOT
Total dissipation at TC = 25 °C
70
25
W
IAR
Avalanche current, repetitive or not-repetitive
(pulse width limited by TJ max)
4.4
A
EAS
Single pulse avalanche energy
(starting TJ = 25 °C, ID = IAR, VDD = 50 V)
170
mJ
Peak diode recovery voltage slope
20
V/ns
ESD
Gate-source human body model (R = 1.5 kΩ,
C = 100 pF)
2.8
kV
VISO
Insulation withstand voltage (RMS) from all
three leads to external heat sink
(t=1 s;TC=25 °C)
dv/dt(2)
TJ
2500
Operating junction temperature
V
°C
-55 to 150
Tstg
Storage temperature
°C
1. Pulse width limited by safe operating area.
2. ISD ≤ 4.4 A, di/dt ≤ 400 A/μs, peak VDS ≤ V(BR)DSS
Table 3. Thermal data
Value
Symbol
Parameter
Rthj-case
Thermal resistance junction-case max
Rthj-amb
Thermal resistance junction-ambient max
Rthj-pcb(1) Thermal resistance junction-pcb
Unit
DPAK
TO-220FP
1.79
5
°C/W
62.5
°C/W
50
°C/W
1. When mounted on 1 inch² FR-4 board, 2oz Cu
DocID15684 Rev 3
3/19
19
Electrical characteristics
2
STD5N52U, STF5N52U
Electrical characteristics
(Tcase =25 °C unless otherwise specified).
Table 4. On /off states
Symbol
V(BR)DSS
IDSS
IGSS
Parameter
Test conditions
Drain-source
breakdown voltage
(VGS = 0)
ID = 1 mA
Min.
Typ.
V
10
μA
500
μA
±10
μA
3.75
4.5
V
1.25
1.5
Ω
Min.
Typ.
Max.
Unit
-
529
-
pF
-
71
-
pF
-
13.4
-
pF
VGS = 20 V
VGS(th)
Gate threshold voltage VDS = VGS, ID = 50 μA
RDS(on)
Static drain-source onVGS = 10 V, ID = 2.2 A
resistance
Unit
525
VDS = 525 V
Zero gate voltage
drain current (VGS = 0) VDS = 525 V, TC=125 °C
Gate-body leakage
current (VDS = 0)
Max.
3
Table 5. Dynamic
Symbol
Parameter
Test conditions
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Co(tr)(1)
Equivalent
capacitance time
related
VDS = 0 to 420 V, VGS = 0
-
11
-
pF
Rg
Gate input resistance
f=1 MHz open drain
-
6
-
Ω
Qg
Total gate charge
-
16.9
-
nC
Qgs
Gate-source charge
-
4.2
-
nC
Qgd
Gate-drain charge
VDD = 416 V, ID = 4.4 A,
VGS = 10 V
(see Figure 17)
-
8.4
-
nC
VDS = 25 V, f = 1 MHz,
VGS = 0
1. Coss eq. time related is defined as a constant equivalent capacitance giving the same charging time as Coss
when VDS increases from 0 to 80% VDSS
4/19
DocID15684 Rev 3
STD5N52U, STF5N52U
Electrical characteristics
Table 6. Switching times
Symbol
td(on)
tr
Parameter
Test conditions
tf
Typ.
-
11.4
-
ns
-
13.6
-
ns
-
23.1
-
ns
-
15
-
ns
Turn-on delay time
VDD = 260 V, ID = 2.2 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 16)
Rise time
td(off)
Min.
Turn-off-delay time
Fall time
Max. Unit
Table 7. Source drain diode
Symbol
ISD
ISDM (1)
VSD
(2)
Parameter
Test conditions
Min. Typ. Max. Unit
Source-drain current
-
4.4
A
Source-drain current (pulsed)
-
17.6
A
1.6
V
Forward on voltage
ISD = 4.4 A, VGS = 0
-
trr
Reverse recovery time
-
55
ns
Qrr
Reverse recovery charge
-
95
nC
IRRM
Reverse recovery current
ISD = 4.4 A, di/dt = 100 A/μs
VDD= 60 V
(see Figure 18)
-
3.5
A
-
120
ns
-
266
nC
-
4.5
A
trr
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
ISD = 4.4 A, di/dt = 100 A/μs
VDD= 60 V TJ = 150 °C
(see Figure 18)
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration = 300 μs, duty cycle 1.5%
Table 8. Gate-source Zener diode
Symbol
Parameter
Test conditions
V(BR)GSO Gate-source breakdown voltage IGS = ± 1mA, ID=0
Min
Typ.
Max.
Unit
30
-
-
V
The built-in back-to-back Zener diodes have specifically been designed to enhance the
device's ESD capability. In this respect the Zener voltage is appropriate to achieve an
efficient and cost-effective intervention to protect the device's integrity. These integrated
Zener diodes thus avoid the usage of external components.
DocID15684 Rev 3
5/19
19
Electrical characteristics
2.1
STD5N52U, STF5N52U
Electrical characteristics (curves)
Figure 2. Safe operating area for DPAK
Figure 3. Thermal impedance for DPAK
Figure 4. Safe operating area for TO-220FP
Figure 5. Thermal impedance for TO-220FP
Figure 6. Output characteristics
Figure 7. Transfer characteristics
6/19
DocID15684 Rev 3
STD5N52U, STF5N52U
Electrical characteristics
Figure 8. Normalized V(BR)DSS vs temperature
Figure 9. Static drain-source on-resistance
(BR)
Figure 10. Gate charge vs gate-source voltage
Figure 11. Capacitance variations
Figure 12. Normalized gate threshold voltage vs
temperature
Figure 13. Normalized on-resistance vs
temperature
DocID15684 Rev 3
7/19
19
Electrical characteristics
STD5N52U, STF5N52U
Figure 14. Source-drain diode forward
characteristics
8/19
Figure 15. Maximum avalanche energy vs
temperature
DocID15684 Rev 3
STD5N52U, STF5N52U
3
Test circuits
Test circuits
Figure 16. Switching times test circuit for
resistive load
Figure 17. Gate charge test circuit
VDD
12V
47kΩ
1kΩ
100nF
3.3
μF
2200
RL
μF
IG=CONST
VDD
VGS
100Ω
Vi=20V=VGMAX
VD
RG
2200
μF
D.U.T.
D.U.T.
VG
2.7kΩ
PW
47kΩ
1kΩ
PW
AM01468v1
Figure 18. Test circuit for inductive load
switching and diode recovery times
A
A
AM01469v1
Figure 19. Unclamped inductive load test circuit
L
A
D
G
D.U.T.
FAST
DIODE
B
B
VD
L=100μH
S
3.3
μF
B
25 Ω
1000
μF
D
VDD
2200
μF
3.3
μF
VDD
ID
G
RG
S
Vi
D.U.T.
Pw
AM01470v1
AM01471v1
Figure 20. Unclamped inductive waveform
Figure 21. Switching time waveform
ton
V(BR)DSS
tdon
VD
toff
tr
tdoff
tf
90%
90%
IDM
10%
ID
VDD
10%
0
VDD
VDS
90%
VGS
AM01472v1
0
DocID15684 Rev 3
10%
AM01473v1
9/19
19
Package mechanical data
4
STD5N52U, STF5N52U
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
10/19
DocID15684 Rev 3
STD5N52U, STF5N52U
4.1
Package mechanical data
DPAK, STD5N52U
Figure 22. DPAK (TO-252) type A drawing
B1
DocID15684 Rev 3
11/19
19
Package mechanical data
STD5N52U, STF5N52U
Table 9. DPAK (TO-252) type A mechanical data
mm
Dim.
Min.
Typ.
A
2.20
2.40
A1
0.90
1.10
A2
0.03
0.23
b
0.64
0.90
b4
5.20
5.40
c
0.45
0.60
c2
0.48
0.60
D
6.00
6.20
D1
E
5.10
6.40
6.60
E1
4.70
e
2.28
e1
4.40
4.60
H
9.35
10.10
L
1.00
1.50
(L1)
2.80
L2
0.80
L4
0.60
1.00
R
V2
12/19
Max.
0.20
0°
8°
DocID15684 Rev 3
STD5N52U, STF5N52U
Package mechanical data
Figure 23. DPAK (TO-252) type A footprint (a)
)3B1
a. All dimensions are in millimeters
DocID15684 Rev 3
13/19
19
Package mechanical data
4.2
STD5N52U, STF5N52U
TO-220FP, STF5N52U
Figure 24. TO-220FP drawing
7012510_Rev_K_B
14/19
DocID15684 Rev 3
STD5N52U, STF5N52U
Package mechanical data
Table 10. TO-220FP mechanical data
mm
Dim.
Min.
Typ.
Max.
A
4.4
4.6
B
2.5
2.7
D
2.5
2.75
E
0.45
0.7
F
0.75
1
F1
1.15
1.70
F2
1.15
1.70
G
4.95
5.2
G1
2.4
2.7
H
10
10.4
L2
16
L3
28.6
30.6
L4
9.8
10.6
L5
2.9
3.6
L6
15.9
16.4
L7
9
9.3
Ø
3
3.2
DocID15684 Rev 3
15/19
19
Packaging mechanical data
5
STD5N52U, STF5N52U
Packaging mechanical data
Figure 25. Tape for DPAK (TO-252)
10 pitches cumulative
tolerance on tape +/- 0.2 mm
T
P0
Top cover
tape
P2
D
E
F
B1
K0
For machine ref. only
including draft and
radii concentric around B0
W
B0
A0
P1
D1
User direction of feed
R
Bending radius
User direction of feed
AM08852v1
16/19
DocID15684 Rev 3
STD5N52U, STF5N52U
Packaging mechanical data
Figure 26. Reel for DPAK (TO-252)
T
REEL DIMENSIONS
40mm min.
Access hole
At sl ot location
B
D
C
N
A
Full radius
G measured at hub
Tape slot
in core for
tape start 25 mm min.
width
AM08851v2
Table 11. DPAK (TO-252) tape and reel mechanical data
Tape
Reel
mm
mm
Dim.
Dim.
Min.
Max.
A0
6.8
7
A
B0
10.4
10.6
B
1.5
12.1
C
12.8
1.6
D
20.2
G
16.4
50
B1
Min.
Max.
330
13.2
D
1.5
D1
1.5
E
1.65
1.85
N
F
7.4
7.6
T
K0
2.55
2.75
P0
3.9
4.1
Base qty.
2500
P1
7.9
8.1
Bulk qty.
2500
P2
1.9
2.1
R
40
T
0.25
0.35
W
15.7
16.3
DocID15684 Rev 3
18.4
22.4
17/19
19
Revision history
6
STD5N52U, STF5N52U
Revision history
Table 12. Document revision history
Date
Revision
06-May-2009
1
First release.
2
– Inserted new device in I2PAK.
– Updated tables 1, 2 and 3 with the new package.
– Updated Section 4: Package mechanical data with the new
package and Section 5: Packaging mechanical data.
– Minor text changes.
28-Sep-2011
24-Apr-2014
18/19
3
Changes
–
–
–
–
Updated Section 4.1: DPAK, STD5N52U
Modified: Qrr unit in Table 7
Modified: Figure 8 and 11
The part number STI5N52U has been moved to a separate
datasheet
DocID15684 Rev 3
STD5N52U, STF5N52U
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE
SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B)
AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS
OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT
PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS
EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY
DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE
DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2014 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
DocID15684 Rev 3
19/19
19