STF8N60DM2
N-channel 600 V, 550 mΩ typ., 8 A MDmesh™ DM2
Power MOSFET in a TO-220FP package
Datasheet - production data
Features
Order code
VDS
RDS(on) max.
ID
PTOT
STF8N60DM2
600 V
600 mΩ
8A
25 W
TO-220FP
Figure 1: Internal schematic diagram
D(2)
Fast-recovery body diode
Extremely low gate charge and input
capacitance
Low on-resistance
100% avalanche tested
Extremely high dv/dt ruggedness
Zener-protected
Applications
Switching applications
Description
This high voltage N-channel Power MOSFET is
part of the MDmesh™ DM2 fast recovery diode
series. It offers very low recovery charge (Qrr)
and time (trr) combined with low RDS(on), rendering
it suitable for the most demanding high efficiency
converters and ideal for bridge topologies and
ZVS phase-shift converters.
G(1)
S(3)
AM15572v1_no_tab
Table 1: Device summary
Order code
Marking
Package
Packing
STF8N60DM2
8N60DM2
TO-220FP
Tube
November 2016
DocID027864 Rev 2
This is information on a product in full production.
1/13
www.st.com
Contents
STF8N60DM2
Contents
1
Electrical ratings ............................................................................. 3
2
Electrical characteristics ................................................................ 4
2.1
Electrical characteristics (curves) ...................................................... 6
3
Test circuits ..................................................................................... 8
4
Package information ....................................................................... 9
4.1
5
2/13
TO-220FP package information ...................................................... 10
Revision history ............................................................................ 12
DocID027864 Rev 2
STF8N60DM2
1
Electrical ratings
Electrical ratings
Table 2: Absolute maximum ratings
Symbol
VGS
Parameter
Value
Unit
±25
V
Gate-source voltage
Drain current (continuous) at Tcase = 25 °C
8
Drain current (continuous) at Tcase = 100 °C
5
IDM(2)
Drain current (pulsed)
32
A
PTOT
W
ID(1)
A
Total dissipation at Tcase = 25 °C
25
dv/dt(3)
Peak diode recovery voltage slope
50
dv/dt(4)
MOSFET dv/dt ruggedness
50
VISO
Insulation withstand voltage (RMS) from all three leads to external
heat sink (t = 1 s; TC = 25 °C)
2.5
kV
Tstg
Storage temperature range
–55 to 150
°C
Tj
Operating junction temperature range
V/ns
Notes:
(1)
Current is limited by package.
(2)
Pulse width is limited by safe operating area.
(3)
ISD ≤ 8 A, di/dt=900 A/μs; VDS peak < V(BR)DSS, VDD = 400 V.
(4)
VDS ≤ 480 V.
Table 3: Thermal data
Symbol
Parameter
Rthj-case
Thermal resistance junction-case
Rthj-amb
Thermal resistance junction-ambient
Value
5
62.5
Unit
°C/W
Table 4: Avalanche characteristics
Symbol
Parameter
Value
Unit
IAR(1)
Avalanche current, repetitive or not repetitive
2.5
A
EAS(2)
Single pulse avalanche energy
430
mJ
Notes:
(1)
Pulse width limited by Tjmax.
(2)
starting Tj = 25 °C, ID = IAR, VDD = 50 V.
DocID027864 Rev 2
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Electrical characteristics
2
STF8N60DM2
Electrical characteristics
(Tcase = 25 °C unless otherwise specified)
Table 5: Static
Symbol
V(BR)DSS
Parameter
Test conditions
Drain-source breakdown
voltage
VGS = 0 V, ID = 1 mA
Min.
Typ.
Max.
600
Unit
V
VGS = 0 V, VDS = 600 V
1
VGS = 0 V, VDS = 600 V,
Tcase = 125 °C(1)
100
Gate-body leakage
current
VDS = 0 V, VGS = ±25 V
±5
µA
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250 µA
4
5
V
RDS(on)
Static drain-source onresistance
VGS = 10 V, ID = 4 A
550
600
mΩ
Min.
Typ.
Max.
Unit
-
449
-
-
24
-
-
0.89
-
IDSS
Zero gate voltage drain
current
IGSS
3
µA
Notes:
(1)Defined
by design, not subject to production test.
Table 6: Dynamic
Symbol
Parameter
Test conditions
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Coss eq.(1)
Equivalent output
capacitance
VDS = 0 to 480 V, VGS = 0 V
-
42
-
pF
RG
Intrinsic gate resistance
f = 1 MHz, ID = 0 A
-
6.5
-
Ω
Qg
Total gate charge
-
13.5
-
Qgs
Gate-source charge
-
3
-
Qgd
Gate-drain charge
VDD = 480 V, ID = 8 A,
VGS = 10 V (see Figure 15:
"Test circuit for gate charge
behavior")
-
7.7
-
VDS = 100 V, f = 1 MHz,
VGS = 0 V
pF
nC
Notes:
(1)
Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS
increases from 0 to 80% VDSS.
Table 7: Switching times
Symbol
td(on)
tr
td(off)
tf
4/13
Parameter
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Test conditions
Min.
Typ.
Max.
VDD = 300 V, ID = 4 A
RG = 4.7 Ω, VGS = 10 V (see
Figure 14: "Test circuit for
resistive load switching times"
and Figure 19: "Switching time
waveform")
-
10
-
-
6
-
-
25.4
-
-
9.5
-
DocID027864 Rev 2
Unit
ns
STF8N60DM2
Electrical characteristics
Table 8: Source-drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
ISD
Source-drain current
-
8
A
ISDM(1)
Source-drain current
(pulsed)
-
32
A
VSD(2)
Forward on voltage
VGS = 0 V, ISD = 8 A
-
1.6
V
trr
Reverse recovery time
-
80
ns
Qrr
Reverse recovery charge
-
188
nC
IRRM
Reverse recovery current
ISD = 8 A, di/dt = 100 A/µs,
VDD = 60 V (see Figure 16:
"Test circuit for inductive load
switching and diode recovery
times")
-
4.7
A
ISD = 8 A, di/dt = 100 A/µs,
VDD = 60 V, Tj = 150 °C (see
Figure 16: "Test circuit for
inductive load switching and
diode recovery times")
-
160
ns
-
640
nC
-
8
A
trr
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
Notes:
(1)
Pulse width is limited by safe operating area.
(2)
Pulse test: pulse duration = 300 µs, duty cycle 1.5%.
DocID027864 Rev 2
5/13
Electrical characteristics
2.1
STF8N60DM2
Electrical characteristics (curves)
Figure 2: Safe operating area
Figure 3: Thermal impedance
Figure 4: Output characteristics
Figure 5: Transfer characteristics
Figure 6: Gate charge vs gate-source voltage
Figure 7: Static drain-source on resistance
6/13
DocID027864 Rev 2
STF8N60DM2
Electrical characteristics
Figure 8: Capacitance variations
Figure 9: Normalized gate threshold voltage vs
temperature
Figure 10: Normalized on-resistance vs temperature
Figure 11: Normalized V(BR)DSS vs temperature
Figure 12: Source-drain diode forward
characteristics
Figure 13: Output capacitance stored energy
DocID027864 Rev 2
7/13
Test circuits
3
STF8N60DM2
Test circuits
Figure 15: Test circuit for gate charge
behavior
Figure 14: Test circuit for resistive load
switching times
Figure 16: Test circuit for inductive load
switching and diode recovery times
Figure 17: Unclamped inductive load test
circuit
Figure 18: Unclamped inductive waveform
8/13
DocID027864 Rev 2
Figure 19: Switching time waveform
STF8N60DM2
4
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
DocID027864 Rev 2
9/13
Package information
4.1
STF8N60DM2
TO-220FP package information
Figure 20: TO-220FP package outline
10/13
DocID027864 Rev 2
STF8N60DM2
Package information
Table 9: TO-220FP package mechanical data
mm
Dim.
Min.
Typ.
Max.
A
4.4
4.6
B
2.5
2.7
D
2.5
2.75
E
0.45
0.7
F
0.75
1
F1
1.15
1.70
F2
1.15
1.70
G
4.95
5.2
G1
2.4
2.7
H
10
10.4
L2
16
L3
28.6
30.6
L4
9.8
10.6
L5
2.9
3.6
L6
15.9
16.4
L7
9
9.3
Dia
3
3.2
DocID027864 Rev 2
11/13
Revision history
5
STF8N60DM2
Revision history
Table 10: Document revision history
Date
Revision
12-May-2015
1
First release.
2
Document status promoted from preliminary to production data.
Updated title in cover page, Section 1: "Electrical ratings", Section 2:
"Electrical characteristics".
Added Section 2.1: "Electrical characteristics (curves)".
24-Nov-2016
12/13
Changes
DocID027864 Rev 2
STF8N60DM2
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DocID027864 Rev 2
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