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STFU13N80K5

STFU13N80K5

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOT78

  • 描述:

    MOSFETN-CH800V12ATO220FP

  • 数据手册
  • 价格&库存
STFU13N80K5 数据手册
STFU13N80K5 N-channel 800 V, 0.37 Ω typ., 12 A MDmesh™ K5 Power MOSFET in a TO-220FP ultra narrow leads package Datasheet - production data Features 1 2 Order code VDS RDS(on) max ID PTOT STFU13N80K5 800 V 0.45 Ω 12 A 35 W      3 TO-220FP ultra narrow leads Industry’s lowest RDS(on) x area Industry’s best FoM (figure of merit) Ultra-low gate charge 100% avalanche tested Zener-protected Applications Figure 1: Internal schematic diagram D(2)  Switching applications Description This very high voltage N-channel Power MOSFET is designed using MDmesh™ K5 technology based on an innovative proprietary vertical structure. The result is a dramatic reduction in on-resistance and ultra-low gate charge for applications requiring superior power density and high efficiency. G(1) S(3) AM15572v1_no_tab Table 1: Device summary Order code Marking Package Packing STFU13N80K5 13N80K5 TO-220FP ultra narrow leads Tube July 2017 DocID028462 Rev 2 This is information on a product in full production. 1/13 www.st.com Contents STFU13N80K5 Contents 1 Electrical ratings ............................................................................. 3 2 Electrical characteristics ................................................................ 4 2.1 Electrical characteristics (curves) ...................................................... 6 3 Test circuit ....................................................................................... 9 4 Package information ..................................................................... 10 4.1 5 2/13 TO-220FP ultra narrow leads package information ......................... 10 Revision history ............................................................................ 12 DocID028462 Rev 2 STFU13N80K5 1 Electrical ratings Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VGS Gate source voltage ±30 V ID(1) Drain current (continuous) at TC = 25 °C 12 A ID(1) Drain current (continuous) at TC = 100 °C 7.6 A IDM(2) Drain current (pulsed) 48 A PTOT Total dissipation at TC = 25 °C 35 W IAS Max current during repetitive or single pulse avalanche (pulse width limited by Tjmax ) 4 A EAS Single pulse avalanche energy (starting TJ = 25 °C, ID = IAS, VDD = 50 V) 148 mJ VISO Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s; TC = 25 °C) 2500 V Peak diode recovery voltage slope 4.5 V/ns MOSFET dv/dt ruggedness 50 V/ns -55 to 150 °C dv/dt (3) dv/dt (4) Tstg Storage temperature range Tj Operating junction temperature range Notes: (1)Limited (2)Pulse (3)I SD (4)V by package. width limited by safe operating area. ≤ 12 A, di/dt ≤ 100 A/μs, VDS(peak) ≤ V(BR)DSS. SD ≤ 640 V. Table 3: Thermal data Symbol Parameter Value Rthj-case Thermal resistance junction-case 3.57 Rthj-amb Thermal resistance junction-ambient 62.5 DocID028462 Rev 2 Unit °C/W 3/13 Electrical characteristics 2 STFU13N80K5 Electrical characteristics (TC = 25 °C unless otherwise specified) Table 4: On /off states Symbol V(BR)DSS Parameter Test conditions Drain-source breakdown voltage VGS = 0 V, ID = 1 mA Min. Typ. Max. 800 Unit V VGS = 0 V, VDS = 800 V 1 µA VGS = 0 V, VDS = 800 V, TC = 125 °C (1) 50 µA Gate-body leakage current VDS = 0 V, VGS = ±20 V ±10 µA VGS(th) Gate threshold voltage VDS = VGS, ID = 100 µA 4 5 V RDS(on) Static drain-source on-resistance VGS = 10 V, ID = 6 A 0.37 0.45 Ω Min. Typ. Max. Unit - 870 - pF - 50 - pF - 2 - pF - 110 - pF IDSS Zero gate voltage drain current IGSS 3 Notes: (1)Defined by design, not subject to production test. Table 5: Dynamic Symbol Parameter Ciss Input capacitance Coss Output capacitance Crss Reverse transfer capacitance Co(tr)(1) Equivalent output capacitance Test conditions VDS = 100 V, f = 1 MHz, VGS = 0 V VGS = 0 V, VDS = 0 to 640 V Co(er)(2) Equivalent capacitance energy related RG Intrinsic gate resistance f = 1 MHz, ID = 0 A - 5 - Ω VDD = 640 V, ID = 12 A, VGS = 0 to 10 V (see Figure 16: "Test circuit for gate charge behavior") - 29 - nC - 7 - nC - 18 - nC Qg Total gate charge Qgs Gate-source charge Qgd Gate-drain charge 43 pF Notes: (1)Time related is defined as a constant equivalent capacitance giving the same charging time as C oss when VDS increases from 0 to 80% VDSS. (2)Energy related is defined as a constant equivalent capacitance giving the same stored energy as Coss when VDS increases from 0 to 80% VDSS. 4/13 DocID028462 Rev 2 STFU13N80K5 Electrical characteristics Table 6: Switching times Symbol td(on) tr td(off) tf Parameter Turn-on delay time Rise time Turn-off delay time Fall time Test conditions Min. Typ. Max. Unit VDD = 400 V, ID = 6 A, RG = 4.7 Ω, VGS = 10 V (see Figure 15: "Test circuit for resistive load switching times" and Figure 20: "Switching time waveform") - 16 - ns - 16 - ns - 42 - ns - 16 - ns Min. Typ. Max. Unit Table 7: Source drain diode Symbol Parameter Test conditions ISD Source-drain current - 14 A ISDM Source-drain current (pulsed) - 56 A VSD(1) Forward on voltage ISD = 12 A, VGS = 0 V - 1.5 V ISD = 12 A, di/dt = 100 A/µs, VDD = 60 V (see Figure 17: "Test circuit for inductive load switching and diode recovery times") - 406 ns - 5.7 µC - 28 A ISD = 12 A, di/dt = 100 A/µs, VDD = 60 V, Tj = 150 °C (see Figure 17: "Test circuit for inductive load switching and diode recovery times") - 600 ns - 7.9 µC - 26 A Min. Typ. Max. Unit 30 - - V trr Reverse recovery time Qrr Reverse recovery charge IRRM Reverse recovery current trr Reverse recovery time Qrr Reverse recovery charge IRRM Reverse recovery current Notes: (1)Pulsed: pulse duration = 300μs, duty cycle 1.5%. Table 8: Gate-source Zener diode Symbol V(BR)GSO Parameter Gate-source breakdown voltage Test conditions IGS = ± 1mA, ID = 0 A The built-in back-to-back Zener diodes are specifically designed to enhance the ESD performance of the device. The Zener voltage facilitates efficient and cost-effective device integrity protection,thus eliminating the need for additional external componentry. DocID028462 Rev 2 5/13 Electrical characteristics 2.1 STFU13N80K5 Electrical characteristics (curves) Figure 2: Safe operating area Figure 3: Thermal impedance Figure 4: Output characteristics Figure 5: Transfer characteristics Figure 6: Gate charge vs gate-source voltage Figure 7: Static drain-source on-resistance 6/13 DocID028462 Rev 2 STFU13N80K5 Electrical characteristics Figure 8: Capacitance variations Figure 9: Source-drain diode forward characteristics Figure 10: Normalized gate threshold voltage vs temperature Figure 11: Normalized on-resistance vs temperature Figure 12: Output capacitance stored energy Figure 13: Normalized V(BR)DSS vs temperature DocID028462 Rev 2 7/13 Electrical characteristics STFU13N80K5 Figure 14: Maximum avalanche energy vs temperature EAS (mJ) 8/13 DocID028462 Rev 2 STFU13N80K5 3 Test circuit Test circuit Figure 15: Test circuit for resistive load switching times Figure 16: Test circuit for gate charge behavior Figure 17: Test circuit for inductive load switching and diode recovery times Figure 18: Unclamped inductive load test circuit Figure 19: Unclamped inductive waveform Figure 20: Switching time waveform DocID028462 Rev 2 9/13 Package information 4 STFU13N80K5 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 4.1 TO-220FP ultra narrow leads package information Figure 21: TO-220FP ultra narrow leads package outline 8576148_1 10/13 DocID028462 Rev 2 STFU13N80K5 Package information Table 9: TO-220FP ultra narrow leads mechanical data mm Dim. Min. Typ. Max. A 4.40 4.60 B 2.50 2.70 D 2.50 2.75 E 0.45 0.60 F 0.65 0.75 F1 - 0.90 G 4.95 5.20 G1 2.40 H 10.00 10.40 L2 15.10 15.90 L3 28.50 30.50 L4 10.20 11.00 L5 2.50 3.10 L6 15.60 16.40 L7 9.00 9.30 L8 L9 3.20 3.60 - 1.30 Dia. 3.00 3.20 DocID028462 Rev 2 2.54 2.70 11/13 Revision history 5 STFU13N80K5 Revision history Table 10: Document revision history 12/13 Date Revision Changes 08-Oct-2015 1 Initial release 14-Jul-2017 2 Modified Figure 7: "Static drain-source on-resistance ". Minor text changes. DocID028462 Rev 2 STFU13N80K5 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID028462 Rev 2 13/13
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