STGB19NC60KT4

STGB19NC60KT4

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOT404

  • 描述:

    IGBT 600V 35A 125W Surface Mount D2PAK

  • 详情介绍
  • 数据手册
  • 价格&库存
STGB19NC60KT4 数据手册
STGB19NC60K STGP19NC60K 20 A - 600 V - short circuit rugged IGBT Features ■ Low on-voltage drop (VCE(sat)) ■ Low Cres / Cies ratio (no cross conduction susceptibility) ■ Short circuit withstand time 10 µs ■ IGBT co-packaged with ultra fast free-wheeling diode 3 3 1 1 2 D2PAK TO-220 Applications ■ High frequency inverters ■ Motor drivers c u d Description This IGBT utilizes the advanced PowerMESH™ process resulting in an excellent trade-off between switching performance and low on-state behavior. ) s ( ct e t le Figure 1. ) s t( o r P Internal schematic diagram o s b O - u d o r P e t e l o bs Table 1. O Device summary Order codes Marking Package Packaging STGB19NC60KT4 GB19NC60K D2PAK Tape and reel STGP19NC60K GP19NC60K TO-220 Tube May 2008 Rev 2 1/15 www.st.com 15 Contents STGB19NC60K - STGP19NC60K Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 Test circuits ............................................... 9 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Packing mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 c u d e t le ) s ( ct u d o r P e t e l o s b O 2/15 o s b O - o r P ) s t( STGB19NC60K - STGP19NC60K 1 Electrical ratings Electrical ratings Table 2. Absolute maximum ratings Symbol VCES Parameter Value Unit Collector-emitter voltage (VGE = 0) 600 V IC (1) Collector current (continuous) at TC = 25 °C 35 A IC (1) Collector current (continuous) at TC = 100 °C 20 A ICL (2) Turn-off latching current 75 A (3) Pulsed collector current 75 A VGE Gate-emitter voltage ±20 V PTOT Total dissipation at TC = 25 °C 125 W tscw Short circuit withstand time, VCE = 0.5 V(BR)CES Tj = 125 °C, RG = 10 Ω, VGE = 12 V 10 ICP Tj 1. Operating junction temperature Table 3. Thermal resistance Symbol (t s) Value Unit Rthj-case Thermal resistance junction-case max. 0.95 °C/W Rthj-amb Thermal resistance junction-ambient max. 62.5 °C/W o r P e Parameter °C P e let o s b O - 3. Pulse width limited by max. junction temperature allowed uc d o r Calculated according to the iterative formula: 2. Vclamp = 80%,(VCES), Tj =150°C, RG = 10 Ω, VGE = 15 V µs – 55 to 150 T J ( MAX ) – T c I c ( T c ) = ------------------------------------------------------------------------------------R thj – c × V CE ( sat ) ( MAX ) ⋅ ( T c ,I c ) ) s t( c u d t e l o s b O 3/15 Electrical characteristics 2 STGB19NC60K - STGP19NC60K Electrical characteristics (TCASE = 25 °C unless otherwise specified) Table 4. Static Symbol Parameter Test conditions V(BR)CES Collector-emitter breakdown IC = 1 mA voltage (VGE= 0) VCE(sat) Collector-emitter saturation voltage VGE = 15 V, IC = 12 A VGE = 15 V, IC = 12 A, Tc = 125 °C ICES Collector cut-off current (VGE = 0) VCE = 600 V VCE = 600 V, TC = 125 °C VGE(th) Gate threshold voltage VCE = VGE, IC = 250 µA IGES Gate-emitter leakage current (VCE = 0) VGE = ±20 V gfs (1) Forward transconductance VCE = 15 V , IC = 12 A Parameter Cres Input capacitance Output capacitance Reverse transfer capacitance Qg Qge Qgc Total gate charge Gate-emitter charge Gate-collector charge Cies Coes r P e u d o t e l o s b O 4/15 ) s ( ct Max. Unit so Test conditions b O - V 2.0 2.75 1.8 4.5 uc od Min. µA mA ) s t( 6.5 V ±100 nA 15 Typ. V V 150 1 r P e t le Dynamic Symbol Typ. 600 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5% Table 5. Min. Max. S Unit VCE = 25 V, f = 1 MHz, VGE = 0 1170 127 28 pF pF pF VCE = 480 V, IC = 12 A, VGE = 15 V (see Figure 17) 55 11 26 nC nC nC STGB19NC60K - STGP19NC60K Table 6. Electrical characteristics Switching on/off (inductive load) Symbol Parameter td(on) tr (di/dt)on Turn-on delay time Current rise time Turn-on current slope td(on) tr (di/dt)on Typ. Max. Unit VCC = 480 V, IC = 12 A RG = 10 Ω, VGE = 15 V, (see Figure 16) 30 8 1450 ns ns A/µs Turn-on delay time Current rise time Turn-on current slope VCC = 480 V, IC = 12 A RG = 10 Ω, VGE = 15 V, Tc = 125 °C (see Figure 16) 30 8 1380 ns ns A/µs tr(Voff) td(off) tf Off voltage rise time Turn-off delay time Current fall time VCC = 480 V, IC = 12 A RG = 10 Ω, VGE = 15 V, (see Figure 16) 35 105 85 ns ns ns tr(Voff) td(off) tf Off voltage rise time Turn-off delay time Current fall time Vcc = 480 V, IC = 12 A, RGE = 10 Ω, VGE = 15 V Tc = 125 °C (see Figure 16) 65 145 125 ns ns ns Table 7. Test conditions Switching energy (inductive load) Symbol Parameter Eon Eoff (1) Ets Turn-on switching losses Turn-off switching losses Total switching losses Eon Eoff (1) Ets Turn-on switching losses Turn-off switching losses Total switching losses ) s ( ct Test conditions e t le VCC = 480 V, IC = 12 A RG = 10 Ω, VGE = 15 V, (see Figure 16) o s b O - VCC = 480 V, IC = 12 A RG = 10 Ω, VGE = 15 V, TC = 125 °C (see Figure 16) Min. o r P c u d Min Typ. ) s t( Max Unit 165 255 420 µJ µJ µJ 250 445 695 µJ µJ µJ 1. Turn-off losses include also the tail of the collector current. u d o r P e t e l o s b O 5/15 Electrical characteristics STGB19NC60K - STGP19NC60K 2.1 Electrical characteristics (curves) Figure 2. Output characteristics Figure 3. HV43020 IC(A) Transfer characteristics HV43025 IC(A) VCE = 15 V VGE=15V 100 100 14V 80 80 13V 60 60 12V 40 40 11V 10V 20 20 9V 8V 0 0 5 Figure 4. 10 15 20 25 30 0 VCE(V) Transconductance 3 Figure 5. HV43110 Gfs(S) 8 0 TJ=-50°C 7.5 e t le 2.3 TJ=25°C 5.5 4 TJ=125°C 3.5 (s) 3 2.5 t c u 2 1.5 2 Figure 6. d o r P e 4 ) s t( VGE(V) 15 o r P HV43100_b o s b O - 6 8 10 25A 12A 1.7 1.5 6A 1.4 1.2 -75 12 IC(A) Gate charge vs gate-source voltage Figure 7. t e l o O 13 1.8 4.5 bs 2.1 2.0 5 10 c u d VCE(sat) (V) 2.4 7 8 Collector-emitter on voltage vs temperature 6.5 6 5 -50 -25 0 25 50 75 100 125 150 TJ(°C) Capacitance variations HV43000 C(pF) 2000 1500 Cies 1000 500 Coes Cres 0 0 6/15 10 20 30 40 VCE(V) STGB19NC60K - STGP19NC60K Figure 8. Electrical characteristics Normalized gate threshold voltage vs temperature HV43070 VGE(th) Figure 9. Collector-emitter on voltage vs collector current HV43090 VCE(sat) (V) (norm) IC=250µA 1.15 1.10 2.55 1.05 2.3 1.00 2.05 0.95 -50°C 1.8 0.90 25°C 1.55 0.85 1.3 0.80 1.05 0.75 -100 125°C 0.8 0.70 -50 0 50 150 100 0 TJ(°C) Figure 10. Normalized breakdown voltage vs temperature 5 10 15 20 25 30 c u d (norm) 1.10 IC=250µA 1.08 e t le 1.06 1.04 1.02 1.00 0.98 ) s ( ct 0.96 0.94 -100 -50 50 0 100 150 40 IC(A) ) s t( Figure 11. Switching losses vs temperature HV43080 BVCES 35 o r P o s b O - TJ(°C) u d o Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector current r P e t e l o s b O 7/15 Electrical characteristics STGB19NC60K - STGP19NC60K Figure 14. Turn-off SOA Figure 15. Thermal impedance c u d e t le ) s ( ct u d o r P e t e l o s b O 8/15 o s b O - o r P ) s t( STGB19NC60K - STGP19NC60K 3 Test circuits Test circuits Figure 16. Test circuit for inductive load switching Figure 17. Gate charge test circuit c u d Figure 18. Switching waveforms e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 9/15 Package mechanical data 4 STGB19NC60K - STGP19NC60K Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com c u d e t le ) s ( ct u d o r P e t e l o s b O 10/15 o s b O - o r P ) s t( STGB19NC60K - STGP19NC60K Package mechanical data TO-220 mechanical data mm inch Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 ∅P Q Typ 4.40 0.61 1.14 0.48 15.25 Max Min 4.60 0.88 1.70 0.70 15.75 0.173 0.024 0.044 0.019 0.6 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 Typ 0.181 0.034 0.066 0.027 0.62 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 0.050 16.40 28.90 3.75 2.65 ) s ( ct Max 3.85 2.95 o r P 0.147 0.104 e t le c u d 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 ) s t( 0.645 1.137 0.151 0.116 o s b O - u d o r P e t e l o s b O 11/15 Package mechanical data STGB19NC60K - STGP19NC60K D²PAK (TO-263) mechanical data mm inch Dim Min A A1 b b2 c c2 D D1 E E1 e e1 H J1 L L1 L2 R V2 4.40 0.03 0.70 1.14 0.45 1.23 8.95 7.50 10 8.50 Max Min 4.60 0.23 0.93 1.70 0.60 1.36 9.35 0.173 0.001 0.027 0.045 0.017 0.048 0.352 0.295 0.394 0.334 10.40 Typ 0.409 0.1 5.28 15.85 2.69 2.79 1.40 1.75 0.192 0.590 0.099 0.090 0.05 0.051 0.4 0° u d o r P e t e l o s b O 0079457_M Max 0.181 0.009 0.037 0.067 0.024 0.053 0.368 2.54 4.88 15 2.49 2.29 1.27 1.30 ) s ( ct 12/15 Typ c u d o r P ) s t( 0.208 0.624 0.106 0.110 0.055 0.069 0.016 e t le 8° o s b O - 0° 8° STGB19NC60K - STGP19NC60K 5 Packing mechanical data Packing mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT c u d ) s t( REEL MECHANICAL DATA DIM. e t le A B so (t s) TAPE MECHANICAL DATA DIM. MIN. s b O inch MAX. MIN. 10.7 0.413 0.421 15.9 0.618 0.626 MAX. 12.8 D 20.2 G 24.4 N 100 T MAX. 330 12.992 13.2 0.504 0.520 26.4 0.960 1.039 1.5 C inch MIN. 0.059 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 MAX. A0 10.5 B0 15.7 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 o r P e t e l o c u d mm b O - o r P mm MIN. K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 * on sales type 13/15 Revision history 6 STGB19NC60K - STGP19NC60K Revision history Table 8. Document revision history Date Revision Changes 14-May-2008 1 Initial release 28-May-2008 2 Inserted new drawing: Figure 15: Thermal impedance c u d e t le ) s ( ct u d o r P e t e l o s b O 14/15 o s b O - o r P ) s t( STGB19NC60K - STGP19NC60K Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ) s t( Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. c u d No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. e t le o r P UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. o s b O - UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. ) s ( ct u d o Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. r P e t e l o s b O ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 15/15
STGB19NC60KT4
1. 物料型号:STGB19NC60K和STGP19NC60K,是20A - 600V的IGBT,具有短路耐受能力。

2. 器件简介:这些IGBT采用先进的PowerMESH™工艺,实现了优异的开关性能和低导通状态行为之间的平衡。

3. 引脚分配:内部原理图显示了IGBT的引脚分配,包括集电极(C)、发射极(E)和门极(G)。

4. 参数特性: - 低导通压降(VCE(sat)) - 低Cres/Cies比率,无交叉导通敏感性 - 短路耐受时间10微秒 - IGBT与超快速续流二极管共封装

5. 功能详解:包括电气额定值、电气特性、热阻、开关能量等详细参数和曲线图。

6. 应用信息:适用于高频逆变器和电机驱动器。

7. 封装信息:提供TO-220和D2PAK两种封装形式的尺寸和机械数据。

8. 测试电路:提供了用于测试IGBT特性的电路图。

9. 修订历史:文档的修订历史,包括初始发布和新增内容。

10. 版权和免责声明:STMicroelectronics NV及其子公司保留随时更改文档的权利,不承担任何责任。
STGB19NC60KT4 价格&库存

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STGB19NC60KT4
  •  国内价格 香港价格
  • 1000+11.778401000+1.52507

库存:2817