STH240N75F3-2, STH240N75F3-6
N-channel 75 V, 2.6 mΩ typ., 180 A STripFET™ III Power MOSFET
in H²PAK-2 and H²PAK-6 packages
Datasheet − production data
Features
Order code
VDSS
RDS(on)
max.
ID
75 V
< 3.0 mΩ
180 A
STH240N75F3-2
STH240N75F3-6
TAB
7
■
Conduction losses reduced
■
Low profile, very low parasitic inductance
1
H2PAK-6
H2PAK-2
Applications
■
Switching application
Description
These devices are N-channel enhancement mode
Power MOSFETs produced using
STMicroelectronics’ STripFET™ III technology,
which is specifically designed to minimize onresistance and gate charge to provide superior
switching performance.
Figure 1.
Internal schematic diagram
D(TAB)
D(TAB)
G(1)
G(1)
S(2, 3)
H2PAK-2
S(2, 3, 4, 5, 6, 7)
H2PAK-6
AM14551V1
Table 1.
Device summary
Order code
Marking
240N75F3
STH240N75F3-6
This is information on a product in full production.
Packaging
H2PAK-2
STH240N75F3-2
July 2012
Package
Doc ID 18486 Rev 2
H2PAK-6
Tape and reel
1/18
www.st.com
18
Contents
STH240N75F3-2, STH240N75F3-6
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................. 6
3
Test circuits
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2/18
.............................................. 8
Doc ID 18486 Rev 2
STH240N75F3-2, STH240N75F3-6
1
Electrical ratings
Electrical ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source voltage
75
V
VGS
Gate-source voltage
± 20
V
Drain current (continuous) at TC = 25 °C
180
A
Drain current (continuous) at TC = 100 °C
170
A
Drain current (pulsed)
720
A
Total dissipation at TC = 25 °C
300
W
2
W/°C
600
mJ
-55 to 175
°C
Value
Unit
Thermal resistance junction-case max
0.5
°C/W
Thermal resistance junction-pcb max
35
°C/W
ID
(1)
ID
IDM
(2)
PTOT
Derating factor
EAS (3)
Tstg
Single pulse avalanche energy
Storage temperature
Operating junction temperature
Tj
1. Current limited by package.
2. Pulse width limited by safe operating area.
3.
Starting Tj = 25 °C, ID = 60 A, VDD = 15 V.
Table 3.
Symbol
Rthj-case
Rthj-pcb
(1)
Thermal data
Parameter
1. When mounted on 1 inch2 FR-4 2 oz Cu.
Doc ID 18486 Rev 2
3/18
Electrical characteristics
2
STH240N75F3-2, STH240N75F3-6
Electrical characteristics
(Tcase = 25 °C unless otherwise specified)
Table 4.
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
V(BR)DSS
Drain-source
breakdown voltage
ID = 250 µA, VGS= 0
IDSS
Zero gate voltage
drain current
VDS = 75 V,
VDS = 75 V, TC =125 °C,
VGS= 0
10
100
µA
µA
IGSS
Gate body leakage
current
VDS = ± 20 V, VDS = 0
±200
nA
4
V
2.6
3.0
mΩ
VGS(th)
Gate threshold voltage VDS= VGS, ID = 250 µA
RDS(on)
Static drain-source onVGS= 10 V, ID= 90 A
resistance
Table 5.
Symbol
75
V
2
Dynamic
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS = 25 V, f = 1 MHz, VGS =0
-
6800
1100
50
-
pF
pF
pF
Qg
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain charge
VDD= 37.5 V, ID= 120 A,
VGS= 10 V
(see Figure 14)
-
87
30
26
-
nC
nC
nC
Table 6.
Symbol
4/18
On /off states
Switching times
Parameter
td(on)
tr
Turn-on delay time
Rise time
td(off)
tf
Turn-off delay time
Fall time
Test conditions
VDD = 37.5 V, ID = 60 A
RG= 4.7 Ω, VGS= 10 V,
(see Figure 13)
Doc ID 18486 Rev 2
Min.
Typ.
Max.
Unit
-
25
70
-
ns
ns
-
100
15
-
ns
ns
STH240N75F3-2, STH240N75F3-6
Table 7.
Electrical characteristics
Source drain diode
Symbol
Parameter
ISD
ISD (1)
Source-drain current
Source-drain current (pulsed)
VSD (2)
Forward on voltage
Reverse recovery time
Reverse recovery charge
Reverse recovery current
trr
Qrr
IRRM
Test conditions
Min.
Typ.
Max. Unit
-
180
720
A
A
ISD = 120 A, VGS = 0
-
1.5
V
ISD = 120 A,di/dt = 100 A/µs
VDD = 30 V, Tj = 150 °C
(see Figure 15)
-
80
180
4.5
ns
nC
A
1. Pulse width limited by safe operating area.
2.
Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.
Doc ID 18486 Rev 2
5/18
Electrical characteristics
STH240N75F3-2, STH240N75F3-6
2.1
Electrical characteristics (curves)
Figure 2.
Safe operating area
Figure 3.
Thermal impedance
Figure 5.
Transfer characteristics
AM08147v1
ID
(A)
is
ea
ar (on)
s
i
S
h RD
nt
n i max
tio
ra by
e
d
Op ite
Lim
100
100µs
10
1ms
10ms
1
Tj=175°C
Tc=25°C
Single pulse
0.1
0.1
Figure 4.
10
1
VDS(V)
Output characteristics
AM05545v1
ID (A)
VGS=10V
(6
)$
!
350
6V
250
200
150
100
5V
50
0
0
Figure 6.
6$36
300
1
2
3
4
5
VDS(V)
Normalized BVDSS vs temperature
Figure 7.
6'36
Static drain-source on-resistance
AM08148v1
RDS(on)
(mΩ)
VGS=10V
2.90
2.80
2.70
2.60
2.50
2.40
0
6/18
Doc ID 18486 Rev 2
20
40
60
80 100 120 140 160 180
ID(A)
STH240N75F3-2, STH240N75F3-6
Figure 8.
Electrical characteristics
Gate charge vs gate-source voltage Figure 9.
Figure 10. Normalized gate threshold voltage
vs temperature
Capacitance variations
Figure 11. Normalized on-resistance vs
temperature
Figure 12. Source-drain diode forward
characteristics
Doc ID 18486 Rev 2
7/18
Test circuits
3
STH240N75F3-2, STH240N75F3-6
Test circuits
Figure 13. Switching times test circuit for
resistive load
Figure 14. Gate charge test circuit
VDD
12V
47kΩ
1kΩ
100nF
3.3
µF
2200
RL
µF
VGS
IG=CONST
VDD
100Ω
Vi=20V=VGMAX
VD
RG
2200
µF
D.U.T.
D.U.T.
VG
2.7kΩ
PW
47kΩ
1kΩ
PW
AM01468v1
AM01469v1
Figure 15. Test circuit for inductive load
Figure 16. Unclamped inductive load test
switching and diode recovery times
circuit
A
A
D.U.T.
FAST
DIODE
B
B
L
A
D
G
VD
L=100µH
S
3.3
µF
B
25 Ω
1000
µF
D
VDD
2200
µF
3.3
µF
VDD
ID
G
RG
S
Vi
D.U.T.
Pw
AM01470v1
Figure 17. Unclamped inductive waveform
AM01471v1
Figure 18. Switching time waveform
ton
V(BR)DSS
tdon
VD
toff
tr
tdoff
tf
90%
90%
IDM
10%
ID
VDD
10%
0
VDD
VDS
90%
VGS
AM01472v1
8/18
0
Doc ID 18486 Rev 2
10%
AM01473v1
STH240N75F3-2, STH240N75F3-6
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 8.
H²PAK-2 mechanical data
mm
Dim.
Min.
Typ.
Max.
A
4.30
4.80
A1
0.03
0.20
C
1.17
1.37
e
4.98
5.18
E
0.50
0.90
F
0.78
0.85
H
10.00
10.40
H1
7.40
7.80
-
L
15.30
15.80
L1
1.27
1.40
L2
4.93
5.23
L3
6.85
7.25
L4
1.5
1.7
M
2.6
2.9
R
0.20
0.60
V
0°
8°
Doc ID 18486 Rev 2
9/18
Package mechanical data
STH240N75F3-2, STH240N75F3-6
Figure 19. H²PAK-2 drawing
8159712_C
10/18
Doc ID 18486 Rev 2
STH240N75F3-2, STH240N75F3-6
Package mechanical data
Figure 20. H²PAK-2 recommended footprint (dimensions in mm)
footprint_Rev_E
Doc ID 18486 Rev 2
11/18
Package mechanical data
Table 9.
STH240N75F3-2, STH240N75F3-6
H²PAK-6 mechanical data
mm
Dim.
Min.
Typ.
Max.
A
4.30
4.80
A1
0.03
0.20
C
1.17
1.37
e
2.34
2.74
e1
4.88
5.28
e2
7.42
7.82
E
0.45
0.60
F
0.50
0.70
H
10.00
10.40
-
12/18
H1
7.40
7.80
L
14.75
15.25
L1
1.27
1.40
L2
4.35
4.95
L3
6.85
7.25
L4
1.5
1.75
M
1.90
2.50
R
0.20
0.60
V
0°
8°
Doc ID 18486 Rev 2
STH240N75F3-2, STH240N75F3-6
Package mechanical data
Figure 21. H²PAK-6 drawing
8159693_Rev_E
Doc ID 18486 Rev 2
13/18
Package mechanical data
STH240N75F3-2, STH240N75F3-6
Figure 22. H²PAK-6 recommended footprint (dimensions in mm)
footprint_Rev_E
14/18
Doc ID 18486 Rev 2
STH240N75F3-2, STH240N75F3-6
5
Packaging mechanical data
Packaging mechanical data
Table 10.
H²PAK-2 and H²PAK-6 tape and reel mechanical data
Tape
Reel
mm
mm
Dim.
Dim.
Min.
Max.
A0
10.5
10.7
A
B0
15.7
15.9
B
1.5
D
1.5
1.6
C
12.8
D1
1.59
1.61
D
20.2
E
1.65
1.85
G
24.4
F
11.4
11.6
N
100
K0
4.8
5.0
T
P0
3.9
4.1
P1
11.9
12.1
Base qty
1000
P2
1.9
2.1
Bulk qty
1000
R
50
T
0.25
0.35
W
23.7
24.3
Doc ID 18486 Rev 2
Min.
Max.
330
13.2
26.4
30.4
15/18
Packaging mechanical data
STH240N75F3-2, STH240N75F3-6
Figure 23. Tape
10 pitches cumulative
tolerance on tape +/- 0.2 mm
T
P0
Top cover
tape
P2
D
E
F
W
K0
B0
A0
P1
D1
User direction of feed
R
Bending radius
User direction of feed
AM08852v2
Figure 24. Reel
T
REEL DIMENSIONS
40mm min.
Access hole
At sl ot location
B
D
C
N
A
Full radius
Tape slot
in core for
tape start 25 mm min.
width
G measured at hub
AM08851v2
16/18
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STH240N75F3-2, STH240N75F3-6
6
Revision history
Revision history
Table 11.
Document revision history
Date
Revision
19-Oct-2011
1
Initial release.
2
Added new device in H²PAK-2.
Table 1: Device summary has been modified accordingly.
Table 8: H²PAK-2 mechanical data, Figure 19: H²PAK-2 drawing and
Figure 20: H²PAK-2 recommended footprint (dimensions in mm)
have been added.
Minor text changes.
02-Jul-2012
Changes
Doc ID 18486 Rev 2
17/18
STH240N75F3-2, STH240N75F3-6
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