STL13N60DM2
N-channel 600 V, 0.350 Ω typ., 8 A MDmesh™ DM2
Power MOSFET in a PowerFLAT™ 5x6 HV package
Datasheet - production data
Features
1
2
3
4
PowerFLAT™ 5x6 HV
Order code
VDS
RDS(on) max.
ID
STL13N60DM2
600 V
0.370 Ω
8A
Fast-recovery body diode
Extremely low gate charge and input
capacitance
Low on-resistance
100% avalanche tested
Extremely high dv/dt ruggedness
Zener-protected
Figure 1: Internal schematic diagram
Applications
D(5, 6, 7, 8)
8
7
6
5
Switching applications
Description
G(4)
1
S(1, 2, 3)
2
3
4
This high voltage N-channel Power MOSFET is
part of the MDmesh™ DM2 fast recovery diode
series. It offers very low recovery charge (Qrr)
and time (trr) combined with low RDS(on), rendering
it suitable for the most demanding high efficiency
converters and ideal for bridge topologies and
ZVS phase-shift converters.
Top View
Table 1: Device summary
Order code
Marking
Package
Packing
STL13N60DM2
13N60DM2
PowerFLAT™ 5x6 HV
Tape and reel
December 2016
DocID029284 Rev 2
This is information on a product in full production.
1/15
www.st.com
Contents
STL13N60DM2
Contents
1
Electrical ratings ............................................................................. 3
2
Electrical characteristics ................................................................ 4
2.1
Electrical characteristics (curves) ...................................................... 6
3
Test circuits ..................................................................................... 8
4
Package mechanical data ............................................................... 9
5
2/15
4.1
PowerFLAT™ 5x6 HV package information .................................... 10
4.2
Packing information......................................................................... 12
Revision history ............................................................................ 14
DocID029284 Rev 2
STL13N60DM2
1
Electrical ratings
Electrical ratings
Table 2: Absolute maximum ratings
Symbol
Parameter
VGS
Value
Unit
Gate-source voltage
± 25
V
ID
Drain current (continuous) at TC = 25 °C
8(1)
A
ID
Drain current (continuous) at TC= 100 °C
5
A
IDM(2)
Drain current (pulsed)
32
A
PTOT
Total dissipation at TC = 25 °C
52
W
dv/dt(3)
Peak diode recovery voltage slope
40
V/ns
dv/dt(4)
MOSFET dv/dt ruggedness
50
V/ns
Tstg
Storage temperature range
- 55 to 150
Tj
Operating junction temperature range
150
°C
Notes:
(1)The
value is limited by package.
(2)Pulse
(3)I
SD
(4)V
width limited by safe operating area.
≤ 8 A, di/dt ≤ 400 A/µs; VDS peak < V(BR)DSS, VDD = 400 V
DS
≤ 480 V
Table 3: Thermal data
Symbol
Rthj-case
Rthj-pcb
Parameter
Thermal resistance junction-case max
Thermal resistance junction-pcb
Value
Unit
2.40
°C/W
59
°C/W
max(1)
Notes:
(1)When
mounted on 1 inch2 FR-4, 2 Oz copper board
Table 4: Avalanche characteristics
Symbol
Parameter
Value
Unit
IAR
Avalanche current, repetetive or not repetetive (pulse width limited by
Tjmax)
2.5
A
EAS
Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V)
340
mJ
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Electrical characteristics
2
STL13N60DM2
Electrical characteristics
(TC= 25 °C unless otherwise specified)
Table 5: On/off states
Symbol
Parameter
Test conditions
V(BR)DSS
Drain-source breakdown
voltage
IDSS
Zero gate voltage Drain
current
IGSS
VGS = 0 V, ID = 1 mA
Min.
Typ.
Max.
600
Unit
V
VGS = 0 V, VDS = 600 V
1.5
µA
VGS = 0 V, VDS = 600 V,
TC = 125 °C(1)
100
µA
Gate-body leakage
current
VDS = 0 V, VGS = ±25 V
±10
µA
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250 µA
4
5
V
RDS(on)
Static drain-source onresistance
VGS = 10 V, ID = 4 A
0.350
0.370
Ω
Min.
Typ.
Max.
Unit
-
730
-
pF
-
38
-
pF
-
0.9
-
pF
3
Notes:
(1)Defined
by design, not subject to production test.
Table 6: Dynamic
Symbol
Parameter
Test conditions
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Coss eq.(1)
Equivalent output
capacitance
VDS = 0 V to 480 V, VGS = 0 V
-
70
-
pF
RG
Intrinsic gate resistance
f = 1 MHz, ID=0 A
-
5.1
-
Ω
Qg
Total gate charge
-
19
-
nC
Qgs
Gate-source charge
-
4.4
-
nC
Qgd
Gate-drain charge
VDD = 480 V, ID = 11 A,
VGS = 10 V (see Figure 15:
"Test circuit for gate charge
behavior")
-
9.9
-
nC
VDS= 100 V, f = 1 MHz,
VGS = 0 V
Notes:
(1)C
oss eq.
is defined as a constant equivalent capacitance giving the same charging time as C oss when VDS
increases from 0 to 80% VDSS
Table 7: Switching times
Symbol
td(on)
tr
td(off)
tf
4/15
Parameter
Turn-on delay time
Rise time
Turn-off-delay time
Fall time
Test conditions
Min.
Typ.
Max.
Unit
VDD = 300 V, ID = 5.5 A
RG = 4.7 Ω, VGS = 10 V (see
Figure 14: "Test circuit for
resistive load switching times"
and Figure 19: "Switching time
waveform")
-
12.3
-
ns
-
4.8
-
ns
-
42.5
-
ns
-
10.6
-
ns
DocID029284 Rev 2
STL13N60DM2
Electrical characteristics
Table 8: Source drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
ISD
Source-drain current
-
8
A
ISDM(1)
Source-drain current
(pulsed)
-
32
A
VSD (2)
Forward on voltage
VGS = 0 V, ISD = 8 A
-
1.6
V
trr
Reverse recovery time
-
90
ns
Qrr
Reverse recovery charge
-
252
nC
IRRM
Reverse recovery current
ISD = 11 A, di/dt = 100 A/µs,
VDD = 60 V (see Figure 16:
"Test circuit for inductive load
switching and diode recovery
times")
-
5.6
A
ISD = 11 A, di/dt = 100 A/µs,
VDD = 60 V, Tj = 150 °C (see
Figure 16: "Test circuit for
inductive load switching and
diode recovery times")
-
170
ns
-
667
ns
-
8.6
A
Test conditions
Min.
Typ.
Max.
Unit
IGS = ± 1 mA, ID = 0 A
±30
-
-
V
trr
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
Notes:
(1)Pulse
width is limited by safe operating area
(2)Pulse
test: pulse duration = 300 µs, duty cycle 1.5%
Table 9: Gate-source Zener diode
Symbol
V(BR)GSO
Parameter
Gate-source breakdown voltage
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD
performance of the device. The Zener voltage facilitates efficient and cost-effective device
integrity protection, thus eliminating the need for additional external componentry.
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Electrical characteristics
2.1
STL13N60DM2
Electrical characteristics (curves)
Figure 2: Safe operating area
Figure 3: Thermal impedance
Figure 4: Output characteristics
Figure 5: Transfer characteristics
Figure 6: Gate charge vs gate-source voltage
Figure 7: Static drain-source on-resistance
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DocID029284 Rev 2
STL13N60DM2
Electrical characteristics
Figure 8: Capacitance variations
Figure 9: Normalized gate threshold voltage vs
temperature
Figure 10: Normalized on-resistance vs temperature
Figure 11: Normalized V(BR)DSS vs temperature
Figure 12: Source-drain diode forward
characteristics
Figure 13: Output capacitance stored energy
DocID029284 Rev 2
7/15
Test circuits
3
STL13N60DM2
Test circuits
Figure 15: Test circuit for gate charge
behavior
Figure 14: Test circuit for resistive load
switching times
Figure 16: Test circuit for inductive load
switching and diode recovery times
Figure 17: Unclamped inductive load test
circuit
Figure 18: Unclamped inductive waveform
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DocID029284 Rev 2
Figure 19: Switching time waveform
STL13N60DM2
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
DocID029284 Rev 2
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Package mechanical data
4.1
STL13N60DM2
PowerFLAT™ 5x6 HV package information
Figure 20: PowerFLAT™ 5x6 HV package outline
8368143_Rev_3
10/15
DocID029284 Rev 2
STL13N60DM2
Package mechanical data
Table 10: PowerFLAT™ 5x6 HV mechanical data
mm
Dim.
Min.
Typ.
Max.
A
0.80
1.00
A1
0.02
0.05
A2
0.25
b
0.30
0.50
D
5.10
5.20
5.30
E
6.05
6.15
6.25
E2
3.10
3.20
3.30
D2
4.30
4.40
4.50
e
1.27
L
0.50
0.55
0.60
K
1.90
2.00
2.10
Figure 21: PowerFLAT™ 5x6 HV recommended footprint (dimensions are in mm)
8368143_Rev_3_footprint
DocID029284 Rev 2
11/15
Package mechanical data
4.2
STL13N60DM2
Packing information
Figure 22: PowerFLAT™ 5x6 tape (dimensions are in mm)
Figure 23: PowerFLAT™ 5x6 package orientation in carrier tape
12/15
DocID029284 Rev 2
STL13N60DM2
Package mechanical data
Figure 24: PowerFLAT™ 5x6 reel
DocID029284 Rev 2
13/15
Revision history
5
STL13N60DM2
Revision history
Table 11: Document revision history
14/15
Date
Revision
Changes
02-May-2016
1
First release.
07-Dec-2016
2
Document status promoted from preliminary to production data.
DocID029284 Rev 2
STL13N60DM2
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