STL17N3LLH6
N-channel 30 V, 0.0038 Ω 17 A PowerFLAT™(3.3x3.3) , STripFET™ VI DeepGATE™ Power MOSFET
Features
Order code STL17N3LLH6 VDSS 30 V RDS(on) max. 0.0045 Ω ID 17 A (1)
1. The value is rated according Rthj-pcb ■ ■ ■ ■ ■
RDS(on) * Qg industry benchmark Extremely low on-resistance RDS(on) High avalanche ruggedness Low gate drive power losses Very low switching gate charge Figure 1. Pin-out configuration 1 2 3 4 S S S G
PowerFLAT™ (3.3 x 3.3)
Application
Switching applications
Description
This product utilizes the 6th generation of design rules of ST’s proprietary STripFET™ technology, with a new gate structure. The resulting Power MOSFET exhibits the lowest RDS(on) in a standard package, that makes it suitable for the most demanding DC-DC converter applications, where high power density has to be achieved.
D 8
D 7
D 6
D 5
BOTTOM VIEW
Table 1.
Device summary
Marking 17N3L Package PowerFLAT™ (3.3 x 3.3) Packaging Tape and reel
Order code STL17N3LLH6
November 2010
Doc ID 15535 Rev 3
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www.st.com 13
Contents
STL17N3LLH6
Contents
1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................ 6
3 4 5
Test circuits
.............................................. 8
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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STL17N3LLH6
Electrical ratings
1
Electrical ratings
Table 2.
Symbol VDS VGS ID
(1)
Absolute maximum ratings
Parameter Drain-source voltage (VGS = 0) Gate-source voltage Drain current (continuous) at TC = 25 °C Drain current (continuous) at TC = 100 °C Drain current (pulsed) Total dissipation at TC = 25 °C Total dissipation at TC = 25 °C Derating factor Value 30 ± 20 17 11 68 50 2 0.03 -55 to 150 Unit V V A A A W W W/°C °C
ID (1) IDM
(2) (3) (1)
PTOT PTOT
TJ Tstg
Operating junction temperature Storage temperature
1. The value is rated according Rthj-pcb 2. Pulse width limited by safe operating area 3. The value is rated according Rthj-c
Table 3.
Symbol Rthj-case Rthj-pcb
(1)
Thermal resistance
Parameter Thermal resistance junction-case (drain) (steady state) Thermal resistance junction-pcb Thermal resistance junction-pcb Value 2.5 42.8 63.5 Unit °C/W °C/W °C/W
Rthj-pcb(2)
2. Steady state
1. When mounted on FR-4 board of 1inch², 2oz Cu, t < 10 sec
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Electrical characteristics
STL17N3LLH6
2
Electrical characteristics
(TCASE = 25 °C unless otherwise specified) Table 4.
Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on)
On/off states
Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS = 0) Gate body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance Test conditions ID = 250 µA, VGS = 0 VDS = Max rating, VDS = Max rating @125 °C VGS = ±20 V VDS = VGS, ID = 250 µA VGS = 10 V, ID = 8.5 A VGS = 4.5 V, ID = 8.5 A 1 0.0038 0.0057 0.0045 0.0073 Min. 30 1 10
±100
Typ.
Max.
Unit V µA µA nA V Ω Ω
Table 5.
Symbol Ciss Coss Crss Qg Qgs Qgd RG
Dynamic
Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-source charge Gate-drain charge Gate input resistance Test conditions Min. Typ. 1690 290 176 17 8 6 1.7 Max. Unit pF pF pF nC nC nC Ω
VDS = 25 V, f=1 MHz, VGS=0 VDD = 15 V, ID = 17 A VGS = 4.5 V (see Figure 14) f=1 MHz Gate DC Bias = 0 Test signal level = 20 mV open drain
-
-
-
-
-
-
Table 6.
Symbol td(on) tr td(off) tf
Switching times
Parameter Turn-on delay time Rise time Turn-off delay time Fall time Test conditions VDD= 15V, ID = 8.5A, RG = 4.7Ω, VGS = 10V (see Figure 13) Min. Typ. 9.5 30 37 12 Max. Unit ns ns ns ns
-
-
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STL17N3LLH6
Electrical characteristics
Table 7.
Symbol ISD ISDM(1) VSD(2) trr Qrr IRRM
Source drain diode
Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 17 A, VGS = 0 ISD = 17 A, di/dt = 100 A/µs, VDD= 25 V Test conditions Min. 24 16.8 1.4 Typ. Max. 17 68 1.1 Unit A A V ns nC A
1. Pulse width limited by safe operating area. 2. Pulsed: pulse duration=300µs, duty cycle 1.5%
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Electrical characteristics
STL17N3LLH6
2.1
Figure 2.
ID (A) 100
Electrical characteristics (curves)
Safe operating area
AM08217v1
Figure 3.
K
δ=0.5 0.2
Thermal impedance
Zth_powerflat_3.3x3.3
is rea s a S(on) thi in x RD a on rati y m pe ed b O it Lim
Tj=150°C Tc=25°C Single pulse
10 10ms
-1
0.1 0.05 0.02
10
1 100ms 1s 0.1
Single pulse
10
-2
0.01
0.01 0.1
1
10
VDS(V)
10 -3 10
-3
10
-2
10
-1
10
0
10
1
10
2
tp (s)
Figure 4.
ID (A)
Output characteristics
AM08218v1
Figure 5.
ID (A) 200 5V 150
Transfer characteristics
AM08219v1
VGS=10V 250 200 150
6V
4V 100
100
50 50 3V 0 0 1 2 3 4 5 VDS(V) 0 0 1 2 3 4 5 VGS(V)
Figure 6.
BVDSS
(norm)
Normalized BVDSS vs temperature
AM08220v1
Figure 7.
RDS(on) (Ω) 4.8
Static drain-source on resistance
AM08221v1
1.06 1.04 1.02 1.00 0.98 0.96 0.94 0.92 -50 -25 0 25 50 75 100 125 TJ(°C) ID=1mA
VGS=10V 4.6 4.4 4.2 4.0 3.8 0
5
10
15
20
25
30
35
ID(A)
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Doc ID 15535 Rev 3
STL17N3LLH6 Figure 8.
VGS (V) 12 10 2000 8 1500 6 1000 4 2 0 0 10 20 30 40 50 Qg(nC) 500 0 0 Crss 10 Coss VDD=15V ID=17A
Electrical characteristics Capacitance variations
AM08223v1
Gate charge vs gate-source voltage Figure 9.
AM08222v1
C (pF) 2500
Ciss
20
VDS(V)
Figure 10. Normalized gate threshold voltage vs temperature
VGS(th) (norm) 1.2 1.0 0.8 0.6 0.4 0.2 -50 -25
AM08224v1
Figure 11. Normalized on resistance vs temperature
RDS(on)
(norm)
AM08225v1
1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -50 -25
0
25
50
75 100
TJ(°C)
0
25
50
75 100
TJ(°C)
Figure 12. Source-drain diode forward characteristics
VSD (V) 1.0 0.9 0.8 TJ=25°C 0.7 0.6 TJ=150°C 0.5 0.4 0 10 20 30 40 50 60 70 ISD(A)
AM08226v1
TJ=-55°C
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Test circuits
STL17N3LLH6
3
Test circuits
Figure 14. Gate charge test circuit
VDD 12V
2200
Figure 13. Switching times test circuit for resistive load
47kΩ 100nF
1kΩ
RL VGS VD RG PW D.U.T.
μF
3.3 μF
VDD Vi=20V=VGMAX
2200 μF
IG=CONST 2.7kΩ 47kΩ PW 1kΩ
100Ω
D.U.T. VG
AM01468v1
AM01469v1
Figure 15. Test circuit for inductive load Figure 16. Unclamped inductive load test switching and diode recovery times circuit
A D G S B 25 Ω D.U.T.
A FAST DIODE B
A L=100μH B D G 3.3 μF 1000 μF
L
VD
2200 μF
3.3 μF
VDD
VDD
ID
RG
S
Vi
D.U.T.
Pw
AM01470v1 AM01471v1
Figure 17. Unclamped inductive waveform
V(BR)DSS VD
Figure 18. Switching time waveform
ton tdon tr toff tdoff tf
90% IDM
90% 10%
ID VDD VDD
0
10%
VDS 90%
VGS
AM01472v1
0
10%
AM01473v1
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STL17N3LLH6
Package mechanical data
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 8. Package dimensions
mm. Dim. Min. A A1 b D D2 e E E2 L 1.76 0.30 2.50 0.25 0.80 Typ 0.90 0.02 0.30 3.30 2.65 0.65 3.30 1.91 0.40 2.01 0.50 2.75 Max. 1.00 0.05 0.35
Doc ID 15535 Rev 3
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Package mechanical data Figure 19. Package drawing
STL17N3LLH6
10/13
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STL17N3LLH6 Figure 20. Recommended footprint (dimensions in mm)
Package mechanical data
AM03834v1
Doc ID 15535 Rev 3
11/13
Revision history
STL17N3LLH6
5
Revision history
Table 9.
Date 24-Mar-2009 06-Jul-2010 10-Nov-2010
Document revision history
Revision 1 2 3 First release. Updated Table 4: On/off states. Document status promoted from preliminary data to datasheet. Changes
12/13
Doc ID 15535 Rev 3
STL17N3LLH6
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Doc ID 15535 Rev 3
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