STL26N60DM6
Datasheet
N-channel 600 V, 175 mΩ typ., 15 A, MDmesh DM6 Power MOSFET
in a PowerFLAT 8x8 HV package
Features
5
4
3
2
1
PowerFLAT 8x8 HV
Drain(5)
Order code
VDS
RDS(on) max.
ID
STL26N60DM6
600 V
215 mΩ
15 A
•
•
Fast-recovery body diode
Lower RDS(on) per area vs previous generation
•
•
•
•
Low gate charge, input capacitance and resistance
100% avalanche tested
Extremely high dv/dt ruggedness
Zener-protected
Applications
Gate(1)
•
Driver
source (2)
Power
source (3, 4)
NG1DS2PS34D5Z
Switching applications
Description
This high-voltage N-channel Power MOSFET is part of the MDmesh DM6 fastrecovery diode series. Compared with the previous MDmesh fast generation, DM6
combines very low recovery charge (Qrr), recovery time (trr) and excellent
improvement in RDS(on) per area with one of the most effective switching behaviors
available in the market for the most demanding high-efficiency bridge topologies and
ZVS phase-shift converters.
Product status link
STL26N60DM6
Product summary
Order code
STL26N60DM6
Marking
26N60DM6
Package
PowerFLAT 8x8 HV
Packing
Tape and reel
DS12852 - Rev 3 - September 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
STL26N60DM6
Electrical ratings
1
Electrical ratings
Table 1. Absolute maximum ratings
Symbol
Value
Unit
Gate-source voltage
±25
V
Drain current (continuous) at TC = 25 °C
15
A
Drain current (continuous) at TC = 100 °C
9.5
A
Drain current (pulsed)
60
A
Total power dissipation at TC = 25 °C
110
W
dv/dt(2)
Peak diode recovery voltage slope
100
V/ns
di/dt(2)
Peak diode recovery current slope
1000
A/µs
dv/dt(3)
MOSFET dv/dt ruggedness
100
V/ns
Tstg
Storage temperature range
-55 to 150
°C
Value
Unit
VGS
ID
IDM
(1)
PTOT
Tj
Parameter
Operating junction temperature range
1. Pulse width is limited by safe operating area.
2. ISD ≤ 15 A, VDS (peak) < V(BR)DSS, VDD = 400 V.
3. VDS ≤ 480 V
Table 2. Thermal data
Symbol
Parameter
Rthj-case
Thermal resistance junction-case
1.14
°C/W
Rthj-pcb(1)
Thermal resistance junction-pcb
45
°C/W
Value
Unit
1. When mounted on FR-4 board of inch², 2oz Cu.
Table 3. Avalanche characteristics
Symbol
DS12852 - Rev 3
Parameter
IAR
Avalanche current, repetitive or not repetitive (pulse width limited by Tjmax)
4
A
EAS
Single pulse avalanche energy (starting TJ = 25 °C, ID = IAR, VDD = 50 V)
360
mJ
page 2/14
STL26N60DM6
Electrical characteristics
2
Electrical characteristics
TC = 25 °C unless otherwise specified
Table 4. On/off states
Symbol
V(BR)DSS
Parameter
Test conditions
Drain-source breakdown voltage
VGS = 0 V, ID = 1 mA
Min.
Typ.
600
Zero gate voltage drain current
5
µA
100
µA
±5
µA
4
4.75
V
175
215
mΩ
Min.
Typ.
Max.
Unit
-
940
-
pF
-
75
-
pF
-
4
-
pF
VGS = 0 V, VDS = 600 V,
TC = 125 °C(1)
IGSS
Gate-body leakage current
VDS = 0 V, VGS = ±25 V
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250 µA
RDS(on)
Static drain-source on-resistance
VGS = 10 V, ID = 7.5 A
Unit
V
VGS = 0 V, VDS = 600 V
IDSS
Max.
3.25
1. Defined by design, not subject to production test.
Table 5. Dynamic
Symbol
Parameter
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer capacitance
(1)
Test conditions
VDS = 100 V, f = 1 MHz,
VGS = 0 V
Equivalent output capacitance
VDS = 0 to 480 V, VGS = 0 V
-
157
-
pF
RG
Intrinsic gate resistance
f = 1 MHz, ID = 0 A
-
4.8
-
Ω
Qg
Total gate charge
VDD = 480 V, ID = 18 A,
-
24
-
nC
Qgs
Gate-source charge
VGS = 0 to 10 V
-
6
-
nC
Qgd
Gate-drain charge
(see Figure 14. Test circuit for gate
charge behavior)
-
11.5
-
nC
Coss eq.
1. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0
to 80% VDSS.
Table 6. Switching times
Symbol
td(on)
tr
td(off)
tf
DS12852 - Rev 3
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Turn-on delay time
VDD = 300 V, ID = 9 A,
-
13
-
ns
Rise time
RG = 4.7 Ω, VGS = 10 V
-
11
-
ns
Turn-off delay time
(see Figure 13. Switching times
test circuit for resistive load and
Figure 18. Switching time
waveform)
-
39
-
ns
-
8
-
ns
Fall time
page 3/14
STL26N60DM6
Electrical characteristics
Table 7. Source drain diode
Symbol
ISD
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Source-drain current
-
15
A
ISDM(1)
Source-drain current (pulsed)
-
60
A
VSD(2)
Forward on voltage
VGS = 0 V, ISD = 15 A
-
1.6
V
trr
Reverse recovery time
ISD = 18 A, di/dt = 100 A/µs,
-
100
ns
Qrr
Reverse recovery charge
VDD = 60 V
-
0.35
µC
Reverse recovery current
(see Figure 15. Test circuit for
inductive load switching and diode
recovery times)
-
7
A
trr
Reverse recovery time
ISD = 18 A, di/dt = 100 A/µs,
-
170
ns
Qrr
Reverse recovery charge
VDD = 60 V, Tj = 150 °C
-
1.02
µC
Reverse recovery current
(see Figure 15. Test circuit for
inductive load switching and diode
recovery times)
-
12
A
IRRM
IRRM
1. Pulse width is limited by safe operating area.
2. Pulsed: pulse duration = 300 µs, duty cycle 1.5 %.
DS12852 - Rev 3
page 4/14
STL26N60DM6
Electrical characteristics (curves)
2.1
Electrical characteristics (curves)
Figure 2. Normalized thermal impedance
Figure 1. Safe operating area
ID
(A)
K
GADG291120180825SOA
Zth PowerFLAT 8x8 HV
δ = 0.5
Operation in this area
is limited by RDS(on)
δ = 0.2
tp = 1 μs
101
δ = 0.1
10 -1
δ = 0.05
tp = 1 ms
δ = 0.02
δ = 0.01
tp = 10 μs
100
TJ ≤ 150 °C,
TC = 25 °C,
single pulse
100
101
Single pulse
10 -3
10 -6
10 -5
tp = 100 μs
tp = 10 ms
10-1
10-1
10 -2
VDS (V)
102
Figure 3. Output characteristics
ID
(A)
50
ID
(A)
VGS = 9 V
VGS = 8 V
40
GADG291120180826TCH
VDS = 20 V
50
20
10
10
VGS = 6 V
0
0
4
8
12
16
20
VDS (V)
0
4
Figure 5. Gate charge vs gate-source voltage
VDS
(V)
GADG291120180831QVG
VDD = 480 V, ID = 18 A
600
10
VDS
6
200
4
100
2
8
12
7
8
9
VGS (V)
Figure 6. Capacitance variations
C
(pF)
GADG291120180831CVR
10 3
CISS
10 2
300
4
6
8
Qgd
Qgs
VGS
(V)
5
12
Qg
500
DS12852 - Rev 3
tp (s)
30
VGS = 7 V
20
0
0
10 -2
40
30
400
10 -3
Figure 4. Transfer characteristics
GADG291120180826OCH
VGS = 10 V
10 -4
16
20
24
0
Qg (nC)
COSS
10 1
f = 1 MHz
10 0
10 0
CRSS
10 1
10 2
VDS (V)
page 5/14
STL26N60DM6
Electrical characteristics (curves)
Figure 7. Static drain-source on-resistance
RDS(on)
(mΩ)
Figure 8. Normalized on-resistance vs temperature
RDS(on)
(norm.)
GADG291120180834RID
GADG291120180832RON
2.5
190
185
2.0
VGS = 10 V
VGS = 10 V
180
1.5
175
1.0
170
165
160
0
0.5
3
6
9
12
15
ID (A)
Figure 9. Normalized gate threshold voltage vs
temperature
VGS(th)
(norm.)
GADG291120181054VTH
-25
25
75
125
Tj (°C)
Figure 10. Normalized V(BR)DSS vs temperature
V(BR)DSS
(norm.)
GADG291120181051BDV
1.10
1.1
1.05
1.0
1.00
0.9
ID = 1 mA
ID = 250 µA
0.95
0.8
0.90
0.7
0.6
-75
0
-75
-25
25
75
125
Tj (°C)
Figure 11. Output capacitance stored energy
EOSS
(µJ)
GADG291120181055EOS
0.85
-75
-25
25
75
Tj (°C)
Figure 12. Source-drain diode forward characteristics
VSD
(V)
GADG291120181054SDF
1.1
10
125
TJ = -50 °C
1.0
8
TJ = 25 °C
0.9
6
0.8
TJ = 150 °C
4
0.7
2
0
0
DS12852 - Rev 3
0.6
100
200
300
400
500
600
VDS (V)
0.5
0
3
6
9
12
15
ISD (A)
page 6/14
STL26N60DM6
Test circuits
3
Test circuits
Figure 13. Switching times test circuit for resistive load
Figure 14. Test circuit for gate charge behavior
VDD
RL
RL
+
VD
VGS
3.3
µF
2200
µF
VDD
IG= CONST
VGS
RG
+
pulse width
D.U.T.
2200
μF
PW
D.U.T.
100 Ω
2.7 kΩ
VG
47 kΩ
GND1
(driver signal)
GND2
(power)
1 kΩ
GND1
AM15855v1
GND2
GADG180720181011SA
Figure 15. Test circuit for inductive load switching and
diode recovery times
A
A
D.U.T.
FAST
DIODE
Figure 16. Unclamped inductive load test circuit
A
L
D
G
S
L=100µH
B
B
D
25Ω
VD
3.3
µF
B
+
1000
µF
2200
µF
3.3
µF
+
VDD
VDD
ID
G
S
RG
D.U.T.
Vi
D.U.T.
Pw
GND2
GND1
GND1
GND2
AM15858v1
AM15857v1
Figure 18. Switching time waveform
Figure 17. Unclamped inductive waveform
ton
V(BR)DSS
td(on)
VD
toff
td(off)
tr
tf
90%
90%
IDM
VDD
10%
0
ID
VDD
AM01472v1
VGS
0
VDS
10%
90%
10%
AM01473v1
DS12852 - Rev 3
page 7/14
STL26N60DM6
Package information
4
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
4.1
PowerFLAT 8x8 HV package information
Figure 19. PowerFLAT 8x8 HV package outline
8222871_Rev_4
DS12852 - Rev 3
page 8/14
STL26N60DM6
PowerFLAT 8x8 HV package information
Table 8. PowerFLAT 8x8 HV mechanical data
Ref.
Dimensions (in mm)
Min.
Typ.
Max.
A
0.75
0.85
0.95
A1
0.00
A3
0.10
0.20
0.30
b
0.90
1.00
1.10
D
7.90
8.00
8.10
E
7.90
8.00
8.10
D2
7.10
7.20
7.30
E1
2.65
2.75
2.85
E2
4.25
4.35
4.45
e
L
0.05
2.00 BSC
0.40
0.50
0.60
Figure 20. PowerFLAT 8x8 HV footprint
8222871_REV_4_footprint
Note:
DS12852 - Rev 3
All dimensions are in millimeters.
page 9/14
STL26N60DM6
PowerFLAT 8x8 HV packing information
4.2
PowerFLAT 8x8 HV packing information
Figure 21. PowerFLAT 8x8 HV tape
P0 (4.0±0.1)
P2 (2.0±0.1)
D0 ( 1.55±0.05)
T (0.30±0.05)
B0 (8.30±0.1)
D1 ( 1.5 Min)
P1 (12.00±0.1)
W (16.00±0.3)
F (7.50±0.1)
E (1.75±0.1)
A0 (8.30±0.1)
K0 (1.10±0.1)
Note: Base and Bulk qu antity 3000 pcs
8229819_Tape_revA
Note:
All dimensions are in millimeters.
Figure 22. PowerFLAT 8x8 HV package orientation in carrier tape
ST
DS12852 - Rev 3
ST
ST
ST
page 10/14
STL26N60DM6
PowerFLAT 8x8 HV packing information
Figure 23. PowerFLAT 8x8 HV reel
8229819_Reel_revA
Note:
DS12852 - Rev 3
All dimensions are in millimeters.
page 11/14
STL26N60DM6
Revision history
Table 9. Document revision history
DS12852 - Rev 3
Date
Version
Changes
29-Nov-2018
1
First release.
21-Jan-2019
2
Updated Table 4. On/off states and Figure 7. Static drain-source onresistance.
08-Sep-2020
3
Updated Table 1.
page 12/14
STL26N60DM6
Contents
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1
Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
4
Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
4.1
PowerFLAT 8x8 HV package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2
PowerFLAT 8x8 HV packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
DS12852 - Rev 3
page 13/14
STL26N60DM6
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DS12852 - Rev 3
page 14/14