STL2N80K5
N-channel 800 V, 3.7 Ω typ., 1.5 A MDmesh™ K5
Power MOSFET in a PowerFLAT™ 5x6 VHV package
Datasheet - production data
Features
Order code
VDS
RDS(on)max.
ID
STL2N80K5
800 V
4.5 Ω
1.5 A
• Industry’s lowest RDS(on)
• Industry’s best figure of merit (FoM)
1
2
3
• Ultra low gate charge
4
• 100% avalanche tested
PowerFLAT™ 5x6 VHV
• Zener-protected
Applications
Figure 1. Internal schematic diagram
D(5, 6, 7, 8)
8
7
• Switching applications
5
6
Description
This very high voltage N-channel Power MOSFET
is designed using MDmesh™ K5 technology
based on an innovative proprietary vertical
structure. The result is a dramatic reduction in onresistance and ultra-low gate charge for
applications requiring superior power density and
high efficiency.
G(4)
1
S(1, 2, 3)
2
3
4
Top View
AM15540v1
Table 1. Device summary
Order code
Marking
Packages
Packaging
STL2N80K5
2N80K5
PowerFLAT™ 5x6 VHV
Tape and reel
September 2015
This is information on a product in full production.
DocID025104 Rev 3
1/17
www.st.com
Contents
STL2N80K5
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
Test circuits
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2/17
.............................................. 9
DocID025104 Rev 3
STL2N80K5
1
Electrical ratings
Electrical ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
Value
Unit
Gate-source voltage
± 30
V
ID
(1)
Drain current (continuous) at TC = 25 °C
1.5
A
ID
(1)
Drain current (continuous) at TC = 100 °C
1
A
6
A
Total dissipation at TC = 25 °C
33
W
IAR(3)
Avalanche current, repetitive or notrepetitive (pulse width limited by Tj max)
0.5
A
EAS(4)
Single pulse avalanche energy
(starting Tj = 25 °C, ID = IAR, VDD = 50 V)
60.5
mJ
Peak diode recovery voltage slope
4.5
V/ns
MOSFET dv/dt ruggedness
50
V/ns
VGS
IDM (1),(2) Drain current (pulsed)
PTOT(1)
dv/dt (5)
dv/dt
(6)
Tstg
Tj
Storage temperature
°C
- 55 to 150
Max. operating junction temperature
°C
1. The value is rated according to Rthj-case and limited by package.
2. Pulse width limited by safe operating area.
3. Pulse width limited by Tjmax
4. Starting Tj=25 °C, ID=IAR, VDD=50 V
5. ISD ≤ 1.5 A, di/dt ≤ 100 A/µs, VDS(peak) ≤ V(BR)DSS
6. VDS ≤ 640 V
Table 3. Thermal data
Symbol
Parameter
Value
Unit
Rthj-case
Thermal resistance junction-case max
3.7
°C/W
Rthj-amb(1)
Thermal resistance junction-amb max
59
°C/W
1. When mounted on 1inch² FR-4 board, 2 oz Cu.
DocID025104 Rev 3
3/17
17
Electrical characteristics
2
STL2N80K5
Electrical characteristics
(TC = 25 °C unless otherwise specified)
Table 4. On /off states
Symbol
V(BR)DSS
Parameter
Drain-source
breakdown voltage
IDSS
Zero gate voltage
drain current
IGSS
Gate-body leakage
current
Test conditions
VGS = 0, ID = 1 mA
Min.
Typ.
Max.
Unit
800
V
VGS = 0, VDS = 800 V
1
µA
VDS = 800 V, TC=125 °C
50
µA
± 10
µA
4
5
V
3.7
4.5
Ω
Min.
Typ.
Max.
Unit
-
105
-
pF
-
8
-
pF
-
0.5
-
pF
-
16
-
pF
-
7
-
pF
f = 1 MHz, ID=0
-
18
-
Ω
VDD = 640 V, ID = 2 A,
VGS = 10 V
(see Figure 16)
-
5
-
nC
-
1
-
nC
-
3.7
-
nC
VDS = 0, VGS = ± 20 V
VGS(th)
Gate threshold voltage VDS = VGS, ID = 100 µA
RDS(on)
Static drain-source
on- resistance
3
VGS = 10 V, ID = 1 A
Table 5. Dynamic
Symbol
Parameter
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Co(tr)(1)
Equivalent
capacitance time
related
Co(er)(2)
Equivalent
capacitance energy
related
RG
Intrinsic gate
resistance
Qg
Total gate charge
Qgs
Gate-source charge
Qgd
Gate-drain charge
Test conditions
VGS = 0, VDS = 100 V,
f = 1 MHz
VGS = 0, VDS = 0 to 640 V
1. Coss eq. time related is defined as a constant equivalent capacitance giving the same charging
time as Coss when VDS increases from 0 to 80% VDSS
2. Coss eq. energy related is defined as a constant equivalent capacitance giving the same stored
energy as Coss when VDS increases from 0 to 80% VDSS
4/17
DocID025104 Rev 3
STL2N80K5
Electrical characteristics
Table 6. Switching times
Symbol
td(on)
tr
td(off)
tf
Parameter
Test conditions
Turn-on delay time
VDD = 400 V, ID = 1 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 15),
(see Figure 20)
Rise time
Turn-off delay time
Fall time
Min.
Typ.
Max
Unit
-
8
-
ns
-
12
-
ns
-
19
-
ns
-
32
-
ns
Min.
Typ.
Table 7. Source drain diode
Symbol
ISD
ISDM
VSD(1)
trr
Parameter
Test conditions
Max. Unit
Source-drain current
-
1.5
A
Source-drain current (pulsed)
-
6
A
-
1.5
V
VGS = 0, ISD = 2 A
Forward on voltage
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
trr
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
ISD = 2 A, di/dt = 100 A/µs
VDD = 60 V (see Figure 17)
ISD = 2 A, di/dt = 100 A/µs
VDD = 60 V, Tj = 150 °C
(see Figure 17)
-
255
ns
-
1
µC
-
8
A
-
285
ns
-
1.45
µC
-
7.5
A
Min
Typ.
Max
Unit
30
-
-
V
1. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Table 8. Gate-source Zener diode
Symbol
Parameter
Test conditions
V(BR)GSO Gate-source breakdown voltage IGS= ± 1mA, ID=0
The built-in back-to-back Zener diodes have specifically been designed to enhance the
device's ESD capability. In this respect the Zener voltage is appropriate to achieve an
efficient and cost-effective intervention to protect the device's integrity. These integrated
Zener diodes thus avoid the usage of external components.
DocID025104 Rev 3
5/17
17
Electrical characteristics
2.1
STL2N80K5
Electrical characteristics (curves)
Figure 2. Safe operating area
Figure 3. Thermal impedance
*,3*6$
,'
$
K
ZthPowerFlat_5x6_27
δ=0.5
0.2
2
SH
P UDWL
LWH RQ
G LQ
E\ W
P KLV
D[ DU
5 HD
'
LV
$
6
RQ
0.1
10 -1
$
0.05
0.02
/L
P$
P$
0.01
case
10 -2
Single pulse
7M &
7F &
6LQJOHSXOVH
10 -3
10 -5
9'69
Figure 4. Output characteristics
10 0
10 -2 10 -1
10 1 tp(s)
Figure 5. Transfer characteristics
AM18075v1
ID (A)
10 -4 10 -3
VGS=10, 11V
AM18085v1
ID
(A)
VDS=20V
3.0
3
2.5
9V
2.5
2.0
2
1.5
1.5
8V
1.0
1
0.5
7V
0.5
6V
0.0
0
4
2
6
8
10
Figure 6. Gate charge vs gate-source voltage
AM18076v1
VDS
VGS
(V)
14
12
600
10
500
8
400
6
300
4
200
2
100
0
0
6/17
(V)
700
VDD = 640 V
ID = 2 A
VDS
1
2
3
4
0
5
12 14 16 VDS(V)
5
6
6
7
8
9
10
VGS(V)
Figure 7. Static drain-source on-resistance
AM18077v1
RDS(on)
(Ω)
0
Qg(nC)
DocID025104 Rev 3
VGS=10V
6
4
2
0
0.0
0.5
1.0
1.5
2.0
2.5 ID(A)
STL2N80K5
Electrical characteristics
Figure 8. Capacitance variations
Figure 9. Output capacitance stored energy
AM18078v1
C
(pF)
AM18079v1
Eoss
(μJ)
f = 1MHz
100
100
Ciss
2
10
Coss
Crss
1
0.1
0.1
1
100
10
0
VDS(V)
Figure 10. Normalized gate threshold voltage vs
temperature
0
400
200
600
800
Figure 11. Normalized on-resistance vs
temperature
AM18082v1
VGS(th)
VDS(V)
AM18081v1
RDS(on)
(norm)
(norm)
ID=100 μA
1.2
ID=1 A
VGS=10 V
2.5
1.1
1
2
0.9
0.8
1.5
0.7
1
0.6
0.5
0.5
0.4
-100
-50
0
50
100
0
-100
150 TJ(°C)
Figure 12. Normalized V(BR)DSS vs temperature
0
100
50
150
TJ(°C)
Figure 13. Source-drain diode forward
characteristics
AM18083v1
V(BR)DSS
AM18084v1
VSD(V)
(norm)
TJ=-50°C
ID=1mA
1.1
1
1.05
0.9
1
0.8
0.95
0.7
0.9
0.6
0.85
-100
-50
TJ=25°C
TJ=150°C
0.5
-50
0
50
100
TJ(°C)
DocID025104 Rev 3
0
0.5
1
1.5
2
ISD(A)
7/17
17
Electrical characteristics
STL2N80K5
Figure 14. Maximum avalanche energy vs
starting TJ
*,3*6$
($6
P-
8/17
7-&
DocID025104 Rev 3
STL2N80K5
3
Test circuits
Test circuits
Figure 15. Switching times test circuit for
resistive load
Figure 16. Gate charge test circuit
VDD
12V
47kΩ
1kΩ
100nF
3.3
μF
2200
RL
μF
IG=CONST
VDD
VGS
100Ω
Vi=20V=VGMAX
VD
RG
2200
μF
D.U.T.
D.U.T.
VG
2.7kΩ
PW
47kΩ
1kΩ
PW
AM01468v1
Figure 17. Test circuit for inductive load
switching and diode recovery times
A
A
AM01469v1
Figure 18. Unclamped inductive load test circuit
L
A
D
G
D.U.T.
FAST
DIODE
B
B
VD
L=100μH
S
3.3
μF
B
25 Ω
1000
μF
D
VDD
2200
μF
3.3
μF
VDD
ID
G
RG
S
Vi
D.U.T.
Pw
AM01470v1
AM01471v1
Figure 19. Unclamped inductive waveform
Figure 20. Switching time waveform
ton
V(BR)DSS
tdon
VD
toff
tr
tdoff
tf
90%
90%
IDM
10%
ID
VDD
10%
0
VDD
VDS
90%
VGS
AM01472v1
0
DocID025104 Rev 3
10%
AM01473v1
9/17
17
Package mechanical data
4
STL2N80K5
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
10/17
DocID025104 Rev 3
STL2N80K5
Package mechanical data
Figure 21. PowerFLAT™ 5x6 VHV
Bottom view
Side view
Top view
8368144_REV_B
DocID025104 Rev 3
11/17
17
Package mechanical data
STL2N80K5
Table 9. PowerFLAT™ 5x6 VHV mechanical data
mm.
DIM
min.
max.
A
0.80
1.00
A1
0.02
0.05
A2
0.25
b
0.30
D
5.00
5.20
5.40
E
5.95
6.15
6.35
D2
4.30
4.40
4.50
E2
2.40
2.50
2.60
e
12/17
typ.
0.50
1.27
L
0.50
0.55
0.60
K
2.60
2.70
2.80
aaa
0.15
bbb
0.15
ccc
0.10
eee
0.10
DocID025104 Rev 3
STL2N80K5
Package mechanical data
Figure 22. PowerFLAT™ 5x6 VHV (dimensions are in mm)
8368144_REV_B_footprint
DocID025104 Rev 3
13/17
17
Packaging mechanical data
5
STL2N80K5
Packaging mechanical data
Figure 23. PowerFLAT™ 5x6 tape
P0
4.0±0.1 (II)
P2
2.0±0.1 (I)
T
(0.30 ±0.05)
E1
1.75±0.1
Y
0.
20
Do
Ø1.55±0.05
W(12.00±0.3)
F(5.50±0.1)(III)
R
Bo (5.30±0.1)
C
L
EF
D1
Ø1.5 MIN.
REF
.R0
.50
Y
P1(8.00±0.1)
Ao(6.30±0.1)
Ko (1.20±0.1)
SECTION Y-Y
(I) Measured from centerline of sprocket hole
to centerline of pocket.
(II) Cumulative tolerance of 10 sprocket
holes is ± 0.20 .
Base and bulk quantity 3000 pcs
All dimensions are in millimeters
(III) Measured from centerline of sprocket
hole to centerline of pocket.
8234350_Tape_rev_C
Figure 24. PowerFLAT™ 5x6 package orientation in carrier tape.
Pin 1
identification
14/17
DocID025104 Rev 3
STL2N80K5
Packaging mechanical data
Figure 25. PowerFLAT™ 5x6 reel
R0.60
W3
11.9/15.4
PART NO.
1.90
2.50
R25.00
ØN
178(±2.0)
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING ELECTROSTATIC
SENSITIVE DEVICES
W2
18.4 (max)
A
330 (+0/-4.0)
4.00
2.50
77
ESD LOGO
W1
12.4 (+2/-0)
06
PS
ØA
128
2.20
R1.10
Ø21.2
All dimensions are in millimeters
13.00
CORE DETAIL
8234350_Reel_rev_C
DocID025104 Rev 3
15/17
17
Revision history
6
STL2N80K5
Revision history
Table 10. Document revision history
16/17
Date
Revision
Changes
09-Aug-2013
1
First release.
24-Jul-2014
2
–
–
–
–
–
–
–
–
25-Sep-2015
3
– Updated title in cover page.
– Updated Figure 6, Figure 7 and Figure 8.
– Minor text changes.
Modified: title
Modified: Features table
Modified: ID, IDM, PTOT, IAR, EAS values and note 5 in Table 2
Modified: Rthj-case value in Table 3
Modified: RDS(on) values in Table 4
Modified: the entire typical values in Table 5, 6 and 7
Added: Section 2.1: Electrical characteristics (curves)
Minor text changes.
DocID025104 Rev 3
STL2N80K5
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2015 STMicroelectronics – All rights reserved
DocID025104 Rev 3
17/17
17