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STL8P2UH7

STL8P2UH7

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    PowerWDFN6

  • 描述:

    MOSFET P-CH 20V 8A POWERFLAT22

  • 数据手册
  • 价格&库存
STL8P2UH7 数据手册
STL8P2UH7 P-channel 20 V, 0.0195 Ω typ., 8 A STripFET™ VII DeepGATE™ Power MOSFET in a PowerFLAT™ 2x2 package Datasheet - production data Features 1 2 3 6 1 Order code VDS RDS(on)max ID STL8P2UH7 20 V 0.0225 Ω @ 4.5 V 8A 5 2 3 4 PowerFLAT™ 2x2   Extremely low on-resistance R DS(on) Ultra logic level Figure 1: Internal schematic diagram Applications  Switching applications Description This device exhibits low on-state resistance and capacitance for improved conduction and switching performance. Table 1: Device summary Order code Marking Package Packaging STL8P2UH7 8L2U PowerFLAT™ 2x2 Tape and reel For the P-channel Power MOSFET the actual polarity of the voltages and the current must be reversed. June 2014 DocID025128 Rev 2 This is information on a product in full production. 1/14 www.st.com Contents STL8P2UH7 Contents 1 Electrical ratings ............................................................................. 3 2 Electrical characteristics ................................................................ 4 2.1 Electrical characteristics (curves) ...................................................... 6 3 Test circuits ..................................................................................... 8 4 Package mechanical data ............................................................... 9 4.1 5 2/14 PowerFLAT™ 2x2 package mechanical data ................................. 10 Revision history ............................................................................ 13 DocID025128 Rev 2 STL8P2UH7 1 Electrical ratings Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage 20 V VGS Gate-source voltage ±8 V ID Drain current (continuous) at Tpcb= 25 °C 8 A ID Drain current (continuous) at Tpcb= 100 °C 5.3 A Drain current (pulsed) 32 A Total dissipation at Tpcb= 25 °C 2.4 W - 55 to 150 °C 150 °C Value Unit 52 °C/W IDM (1) PTOT Tstg Storage temperature Tj Max. operating junction temperature Notes: (1) Pulse width limited by safe operating area Table 3: Thermal data Symbol Parameter (1) Rthj-pcb Thermal resistance junction-pcb max Notes: (1) When mounted on 1inch² FR-4 board, 2 oz Cu For the P-channel Power MOSFET the actual polarity of the voltages and the current must be reversed. DocID025128 Rev 2 3/14 Electrical characteristics 2 STL8P2UH7 Electrical characteristics (T C= 25 °C unless otherwise specified) Table 4: On /off states Symbol Parameter Test conditions Min. Typ. Max. Unit Drain-source breakdown voltage VGS= 0, ID= 250 μA IDSS Zero gate voltage drain current VGS= 0, VDS= 20 V 1 μA IGSS Gate-body leakage current VDS= 0, VGS= ± 5 V ±5 μA Gate threshold voltage VDS= VGS, ID= 250 μA 1 V Static drain-source on- resistance VGS= 4.5 V, ID= 4 A 0.0195 0.0225 Ω VGS= 2.5 V, ID= 4 A 0.02 0.025 Ω VGS= 1.8 V, ID= 4 A 0.036 0.043 Ω VGS= 1.5 V, ID= 4 A 0.05 0.085 Ω Min. Typ. Max. Unit - 2390 - pF - 220 - pF - 188 - pF - 22 - nC - 4.2 - nC - 3.6 - nC V(BR)DSS VGS(th) RDS(on) 20 V 0.4 Table 5: Dynamic Symbol Parameter Test conditions Ciss Input capacitance Coss Output capacitance Crss Reverse transfer capacitance Qg Total gate charge Qgs Gate-source charge Qgd Gate-drain charge VGS= 0, VDS= 16 V, f = 1 MHz VDD= 16 V, ID= 8 A, VGS= 4.5 V For the P-channel Power MOSFET the actual polarity of the voltages and the current must be reversed. Table 6: Switching times Symbol td(on) tr td(off) tf 4/14 Parameter Test conditions Min. Typ. Max Uni t - 12.5 - ns - 30.5 - ns Turn-off delay time - 128 - ns Fall time - 84.5 - ns Turn-on delay time Rise time VDD= 16 V, ID= 8 A, RG= 1 Ω, VGS= 4.5 V DocID025128 Rev 2 STL8P2UH7 Electrical characteristics Table 7: Source drain diode Symbol ISD (1) ISDM VSD (2) Parameter Test conditions Min. Typ. Max. Unit Source-drain current - 8 A Source-drain current (pulsed) - 32 A 1 V Forward on voltage VGS= 0, ISD= 1 A - trr Reverse recovery time - 15.8 ns Qrr Reverse recovery charge - 5.9 nC IRRM VDD= 16 V di/dt = 100 A/μs, ISD= 1 A Reverse recovery current - 0.7 A Notes: (1) (2) Pulse width limited by safe operating area. Pulsed: pulse duration = 300 μs, duty cycle 1.5% For the P-channel Power MOSFET the actual polarity of the voltages and the current must be reversed. DocID025128 Rev 2 5/14 Electrical characteristics 2.1 STL8P2UH7 Electrical characteristics (curves) Figure 2: Safe operating area Figure 3: Thermal impedance GIPG210520141011SA ID (A) GIPG210520141036SA K δ=0.5 100µs is ) ea ar S(on D his nt xR i n ma o i y at er d b Op ite m Li 10 0.2 1ms 10 0.1 -1 0.05 10ms 1 0.02 0.01 10 -2 0.1 Single pulse Tj=150°C Tpcb=25°C Single pulse 0.01 0.1 1 10 V DS(V) 10 -3 10 Figure 4: Output characteristics 10 -4 10 -3 10 -2 10 -1 10 0 tp(s) Figure 5: Transfer characteristics GIPG210520141044SA ID(A) -5 GIPG210520141055SA ID (A) V GS=2.5, 3, 3.5, 4, 4.5, 5V V DS=2V 20 12.00 2V 15 8.00 10 1.5V 5 4.00 0 0 2 6 4 8 V DS(V) 0.00 0.5 0 Figure 6: Gate charge vs gate-source voltage V DD=16V ID=8A 4 2 1.5 V GS(V) Figure 7: Static drain-source on-resistance GIPG210520141101SA V GS (V) 1 GIPG210520141102SA R DS(on) (mΩ) V GS=4.5V 20.5 20.0 3 19.5 2 19.0 1 18.5 0 0 5 10 15 20 Q g(nC) 18.0 0 6/14 DocID025128 Rev 2 1 2 3 4 5 6 ID(A) STL8P2UH7 Electrical characteristics Figure 8: Capacitance variations Figure 9: Normalized gate threshold voltage vs temperature GIPG210520141108SA C (pF) GIPG210520141114SA V GS(th) (norm) ID=250µ A 1.4 1.2 Ciss 1 1000 0.8 0.6 Coss Crss 0.4 100 0 4 8 12 16 0.2 -75 V DS(V) Figure 10: Normalized on-resistance vs temperature 125 T J(°C) GIPG210520141132SA V (BR)DSS (norm) ID=4A V GS=4.5V 1.4 75 25 Figure 11: Normalized V(BR)DSS vs temperature GIPG290520141440SA R DS(on) (norm) 1.6 -25 ID=1m A 1.04 1.2 1.0 1 0.8 0.6 0.4 0.96 0.2 0.0 -75 -25 25 0.92 -75 125 T J(°C) 75 -25 25 75 125 T J(°C) Figure 12: Source-drain diode forward characteristics GIPG210520141134SA V SD(V) T J=-55°C 0.9 TJ=25°C 0.8 T J=75°C 0.7 0.6 0.5 1 2 3 4 5 DocID025128 Rev 2 6 7 8 ISD(A) 7/14 Test circuits 3 STL8P2UH7 Test circuits Figure 13: Switching times test circuit for resistive load Figure 14: Gate charge test circuit Figure 15: Test circuit for inductive load switching and diode recovery times 8/14 DocID025128 Rev 2 STL8P2UH7 4 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK is an ST trademark. DocID025128 Rev 2 9/14 Package mechanical data 4.1 STL8P2UH7 PowerFLAT™ 2x2 package mechanical data Figure 16: Drawing dimension PowerFLAT™ 2 x 2 10/14 DocID025128 Rev 2 STL8P2UH7 Package mechanical data Table 8: PowerFLAT™ 2 x 2 mechanical data Dim. mm. Min. Typ. Max. A 0.70 0.75 0.80 A1 0.00 0.02 0.05 A3 0.20 b 0.25 0.30 0.35 D 1.90 2.00 2.10 E 1.90 2.00 2.10 D2 0.90 1.00 1.10 E2 0.80 0.90 1.00 e 0.55 0.65 0.75 K 0.15 0.25 0.35 K1 0.20 0.30 0.40 K2 0.25 0.35 0.45 L 0.20 0.25 0.30 L1 0.65 0.75 0.85 DocID025128 Rev 2 11/14 Package mechanical data STL8P2UH7 Figure 17: PowerFLAT™ 2 x 2 footprint 12/14 DocID025128 Rev 2 STL8P2UH7 5 Revision history Revision history Table 9: Document revision history Date Revision 20-Aug-2013 1 First release. 2 Document status promoted from preliminary data to production data Modified: title Modified: RDS(on) max value in cover page Modified: RDS(on) (typical and maximum) values in Table 4: "On /off states" Modified: the entire typical values in Table 5: "Dynamic", Table 6: "Switching times" and Table 7: "Source drain diode" Added Section 8.1: "Electrical characteristics (curves)" Minor text changes 04-Jun-2014 Changes DocID025128 Rev 2 13/14 STL8P2UH7 Please Read Carefully Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR "AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL" INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2014 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 14/14 DocID025128 Rev 2
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