STM1645-10

STM1645-10 RF POWER MODULES SATELLITE COMMUNICATIONS APPLICATIONS . . . . . . PRELIMINARY DATA SATELLITE COMMUNICATIONS AMPLIFIER 1625 - 1665 MHz 18/28 VOLTS INPUT/OUTPUT 50 OHMS P OU T = 10 W MIN. GAIN = 30 dB MIN. CASE STYLE H150 ORDER CODE STM1645-10 BRANDING STM1645-10 PIN CONNECTION DESCRIPTION The STM1645-10 module is designed for high power satellite communication applications in the 1.6 GHz frequency range operating at 28 Volts. 1. RF Input 3. VC2, 28V 2. VC1, 18V 4. RF Output ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C) Symbol Parameter Value Un it VC 1 VC 2 P IN P OUT T ST G TC DC Supply Voltage DC Supply Voltage RF Input Power RF Output Power Storage Temperature Operating Case Temperature 20 32 20 16 − 40 to +100 − 35 to +70 Vdc Vdc mW W °C °C April 4, 1996 1/5 STM1645-10 E LECTRICAL SPECIFICATIONS (Tcase = 25 ° C, VC1* = 18 V, VC2 = 28 V) Symbo l Parameter Test Co nditio ns Value Min. Typ. Max. Un it BW P IN GP η H Z IN — Frequency Range Input Power Power Gain Efficiency Harmonics Input Impedance Load Mismatch POUT = 10 W POUT = 10 W POUT = 10 W POUT = 10 W reference POUT = 10 W VSWR = 10:1 POUT = 10 W ZG, ZL = 50Ω V = 28 Vdc 1625 — 30 30 — — — — — 35 − 45 1.5:1 1665 10.0 — — − 40 2.0:1 MHz dBm dB % dBc VSWR No Degradation in Output Power *Not e: V C1 = 18V R egulat ed ± 1% D.C. TEST FIXTURE BYPASSING C1 C2 C3 C4 : : : : 100pf Chip Capacitor 1000pf Chip Capacitor .01µf Chip Capacitor 10µf Chip Capacitor 2/5 STM1645-10 T YPICAL PERFORMANCE POWER OUTPUT vs FREQUENCY 20 VC2 vs FLANGE TEMPERATURE 30 18 Power Output (Watts) Pin = 10mW Vc1 = 18V Vc2 = 28V -35 deg C Vc2 (Volts) 28 Vc1 = 18V Pin = 10mW Pout = 10W 1662 MHz 16 26 +25 deg C 14 24 1626 MHz 12 +70 deg C 22 10 1620 1625 1630 1635 1640 1645 1650 1655 1660 1665 1670 Frequency (MHz) 20 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature(Deg C) 3/5 STM1645-10 APPLICATIONS RECOMMENDATIONS O PERATION LIMITS The STM1645-10 power module should never be operated under any condition which exceeds the Absolute Maximum Ratings presented on this data sheet. Nor should the module be operated continuously at any of the specified maximum ratings. If the module is to be subjected to one or more of the maximum rating conditions, care must be taken to monitor other parameters which may be affected. DECOUPLING Failure to properly decouple any of the voltage supply pins mayl result in oscillations at certain operating frequencies. Therefore, it is recommended that these pins be bypassed as indicated in the Module DC and Test Fixture Configuration drawing of this data sheet. POWER CONTROL The recommeded method of power control for the STM1645-10 is to set PIN = 10mW, VC1 = 18V and VC2 = 28 volts nominal at a flange temperature of 25°C to achieve an output power of 10 watts. Varing VC2 will allow stable power control over a wide range of flange temperature. The current consumption of VC2 is typically 850mA to 900mA for 10 watts power ouput. MODULE MOUNTING To insure adequate thermal transfer from the module to the heatsink, it is recommended that a satisfactory thermal compound such as Dow Corning 340, Wakefield 120-2 or equivalent be applied between the module flange and the heatsink. The heatsink mounting surface under the module should be flat to within ± 0.05mm (± 0.002 inch). The module should be mounted to the heatsink using 3 mm (or 4-40) or equivalent screws torqued to 5-6 kg-cm (4-6 in-lb). The module leads should be attached to equipment PC board using 180°C solder applied to the leads with a properly grounded soldering iron tip, not to exceed 195°C, applied a minimum of 2mm (0.080 inch) from the body of the module for a duration not to exceed 15 seconds per lead. It is imperative that no other portion of the module, other than the leads, be subjected to temperatures in excess of 100°C (maximum storage temperature), for any period of time, as the plastic moulded cover, internal components and sealing adhesives may be adversely affected by such conditions. Due to the construction techniques and materials used within the module, reflow soldering of the flange heatsink or leads, is not recommended. 4/5 STM1645-10 PACKAGE MECHANICAL DATA Ref.: Dwg. No. 1018019 rev. D Informati on furni shed is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibili ty for the consequences of use of such information nor for any infringement of patents or other rights of thir d parties w hic h may result from its use. No lic ense is granted by impli cation or otherwise under any patent or patent rights of SGS-THOMSON Mi croelectr onics. Specificati ons mentioned i n this publication are subject to change without notice. T his publication supersedes and replaces all information pr eviously supplied. SGS-T HOMSON Mi croelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Mi croelectronics. ©1996 SGS -T HOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - B razi l - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia Malta - Mor occo - The Netherlands - S ingapore - Spain - Sweden - Switzerland - Taiw an T hai land - United Kingdom - U.S.A. 5/5