STM32F031F6P7

STM32F031x4 STM32F031x6 ARM®-based 32-bit MCU with up to 32 Kbyte Flash, 9 timers, ADC and communication interfaces, 2.0 - 3.6 V Datasheet - production data Features • Core: ARM® 32-bit Cortex®-M0 CPU, frequency up to 48 MHz LQFP32 7x7 mm UFQFPN32 5x5 mm LQFP48 7x7 mm UFQFPN28 4x4 mm • Memories – 16 to 32 Kbytes of Flash memory – 4 Kbytes of SRAM with HW parity • CRC calculation unit • Reset and power management – Digital and I/Os supply: 2.0 to 3.6 V – Analog supply: VDDA = from VDD to 3.6 V – Power-on/Power-down reset (POR/PDR) – Programmable voltage detector (PVD) – Low power modes: Sleep, Stop and Standby – VBAT supply for RTC and backup registers WLCSP25 2.1x2.1 mm TSSOP20 6.5x4.4 mm – 1 x 16-bit timer, with IC/OC and OCN, deadtime generation, emergency stop and modulator gate for IR control – 1 x 16-bit timer with 1 IC/OC – Independent and system watchdog timers – SysTick timer: 24-bit downcounter • Calendar RTC with alarm and periodic wakeup from Stop/Standby • Up to 39 fast I/Os – All mappable on external interrupt vectors – Up to 26 I/Os with 5 V tolerant capability • Communication interfaces – 1 x I2C interface, supporting Fast Mode Plus (1 Mbit/s) with 20 mA current sink, SMBus/PMBus, and wakeup from Stop mode – 1 x USART supporting master synchronous SPI and modem control, ISO7816 interface, LIN, IrDA capability, auto baud rate detection and wakeup feature – 1 x SPI (18 Mbit/s) with 4 to 16 programmable bit frames, with I2S interface multiplexed • 5-channel DMA controller • Serial wire debug (SWD) • Clock management – 4 to 32 MHz crystal oscillator – 32 kHz oscillator for RTC with calibration – Internal 8 MHz RC with x6 PLL option – Internal 40 kHz RC oscillator • 1 × 12-bit, 1.0 µs ADC (up to 10 channels) – Conversion range: 0 to 3.6V – Separate analog supply from 2.4 up to 3.6 V • Up to 9 timers – 1 x 16-bit 7-channel advanced-control timer for 6 channels PWM output, with deadtime generation and emergency stop – 1 x 32-bit and 1 x 16-bit timer, with up to 4 IC/OC, usable for IR control decoding – 1 x 16-bit timer, with 2 IC/OC, 1 OCN, deadtime generation and emergency stop May 2017 This is information on a product in full production. • 96-bit unique ID • Extended temperature range: -40 to +105°C • All packages ECOPACK®2 Table 1. Device summary Reference Part number STM32F031C6, STM32F031E6, STM32F031x6 STM32F031F6, STM32F031G6, STM32F031K6 STM32F031x4 DocID025743 Rev 6 STM32F031C4, STM32F031F4, STM32F031G4, STM32F031K4 1/106 www.st.com Contents STM32F031x4 STM32F031x6 Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.1 ARM®-Cortex®-M0 core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 3.2 Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 3.3 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 3.4 Cyclic redundancy check calculation unit (CRC) . . . . . . . . . . . . . . . . . . . 12 3.5 Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.5.2 Power supply supervisors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.5.3 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.5.4 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.6 Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.7 General-purpose inputs/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.8 Direct memory access controller (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.9 Interrupts and events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.10 3.11 2/106 3.5.1 3.9.1 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 15 3.9.2 Extended interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . 15 Analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.10.1 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.10.2 Internal voltage reference (VREFINT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.10.3 VBAT battery voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.11.1 Advanced-control timer (TIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.11.2 General-purpose timers (TIM2, 3, 14, 16, 17) . . . . . . . . . . . . . . . . . . . . 17 3.11.3 Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.11.4 System window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.11.5 SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.12 Real-time clock (RTC) and backup registers . . . . . . . . . . . . . . . . . . . . . . 19 3.13 Inter-integrated circuit interface (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.14 Universal synchronous/asynchronous receiver/transmitter (USART) . . . 20 DocID025743 Rev 6 STM32F031x4 STM32F031x6 Contents 3.15 Serial peripheral interface (SPI) / Inter-integrated sound interface (I2S) . 21 3.16 Serial wire debug port (SW-DP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4 Pinouts and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 6 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 6.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 6.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 6.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 6.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 6.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 6.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 6.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 6.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 6.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 6.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 6.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 6.3.2 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 41 6.3.3 Embedded reset and power control block characteristics . . . . . . . . . . . 42 6.3.4 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 6.3.5 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 6.3.6 Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.3.7 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.3.8 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 6.3.9 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 6.3.10 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 6.3.11 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 6.3.12 Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 6.3.13 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 6.3.14 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 6.3.15 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 6.3.16 12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 6.3.17 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 6.3.18 VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 6.3.19 Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 DocID025743 Rev 6 3/106 4 Contents STM32F031x4 STM32F031x6 6.3.20 7 Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 7.1 LQFP48 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 7.2 LQFP32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 7.3 UFQFPN32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 7.4 UFQFPN28 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 7.5 WLCSP25 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 7.6 TSSOP20 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 7.7 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 7.7.1 Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 7.7.2 Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . 100 8 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 4/106 DocID025743 Rev 6 STM32F031x4 STM32F031x6 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 41. Table 42. Table 43. Table 44. Table 45. Table 46. Table 47. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 STM32F031x4/x6 family device features and peripheral counts . . . . . . . . . . . . . . . . . . . . . 9 Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Internal voltage reference calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Comparison of I2C analog and digital filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 STM32F031x4/x6 I2C implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 STM32F031x4/x6 USART implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 STM32F031x4/x6 SPI/I2S implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Alternate functions selected through GPIOA_AFR registers for port A . . . . . . . . . . . . . . . 31 Alternate functions selected through GPIOB_AFR registers for port B . . . . . . . . . . . . . . . 32 Peripheral register boundary addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 42 Programmable voltage detector characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Typical and maximum current consumption from VDD at 3.6 V . . . . . . . . . . . . . . . . . . . . . 44 Typical and maximum current consumption from the VDDA supply . . . . . . . . . . . . . . . . . 45 Typical and maximum current consumption in Stop and Standby modes . . . . . . . . . . . . 46 Typical and maximum current consumption from the VBAT supply. . . . . . . . . . . . . . . . . . . 47 Typical current consumption, code executing from Flash memory, running from HSE 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Switching output I/O current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 HSI14 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 DocID025743 Rev 6 5/106 6 List of tables Table 48. Table 49. Table 50. Table 51. Table 52. Table 53. Table 54. Table 55. Table 56. Table 57. Table 58. Table 59. Table 60. Table 61. Table 62. Table 63. Table 64. Table 65. Table 66. Table 67. Table 68. Table 69. Table 70. 6/106 STM32F031x4 STM32F031x6 I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 RAIN max for fADC = 14 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 TS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 IWDG min/max timeout period at 40 kHz (LSI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 WWDG min/max timeout value at 48 MHz (PCLK). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 I2C analog filter characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 I2S characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 LQFP48 package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 LQFP32 package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 UFQFPN32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 UFQFPN28 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 WLCSP25 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 WLCSP25 recommended PCB design rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 TSSOP20 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 DocID025743 Rev 6 STM32F031x4 STM32F031x6 List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. Figure 45. Figure 46. Figure 47. Figure 48. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 LQFP48 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 LQFP32 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 UFQFPN32 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 UFQFPN28 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 WLCSP25 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 TSSOP20 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 STM32F031x6 memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 HSI oscillator accuracy characterization results for soldered parts . . . . . . . . . . . . . . . . . . 58 HSI14 oscillator accuracy characterization results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 TC and TTa I/O input characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Five volt tolerant (FT and FTf) I/O input characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 SPI timing diagram - slave mode and CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 SPI timing diagram - master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 I2S slave timing diagram (Philips protocol) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 I2S master timing diagram (Philips protocol). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 LQFP48 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Recommended footprint for LQFP48 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 LQFP48 package marking example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 LQFP32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Recommended footprint for LQFP32 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 LQFP32 package marking example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 UFQFPN32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Recommended footprint for UFQFPN32 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 UFQFPN32 package marking example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 UFQFPN28 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Recommended footprint for UFQFPN28 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 UFQFPN28 package marking example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 WLCSP25 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Recommended footprint for WLCSP25 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 WLCSP25 package marking example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 TSSOP20 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Recommended footprint for TSSOP20 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 TSSOP20 package marking example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 DocID025743 Rev 6 7/106 7 Introduction 1 STM32F031x4 STM32F031x6 Introduction This datasheet provides the ordering information and mechanical device characteristics of the STM32F031x4/x6 microcontrollers. This document should be read in conjunction with the STM32F0xxxx reference manual (RM0091). The reference manual is available from the STMicroelectronics website www.st.com. For information on the ARM® Cortex®-M0 core, please refer to the Cortex®-M0 Technical Reference Manual, available from the www.arm.com website. 8/106 DocID025743 Rev 6 STM32F031x4 STM32F031x6 2 Description Description The STM32F031x4/x6 microcontrollers incorporate the high-performance ARM® Cortex®M0 32-bit RISC core operating at up to 48 MHz frequency, high-speed embedded memories (up to 32 Kbytes of Flash memory and 4 Kbytes of SRAM), and an extensive range of enhanced peripherals and I/Os. All devices offer standard communication interfaces (one I2C, one SPI/ I2S and one USART), one 12-bit ADC, five 16-bit timers, one 32-bit timer and an advanced-control PWM timer. The STM32F031x4/x6 microcontrollers operate in the -40 to +85 °C and -40 to +105 °C temperature ranges, from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving modes allows the design of low-power applications. The STM32F031x4/x6 microcontrollers include devices in six different packages ranging from 20 pins to 48 pins with a die form also available upon request. Depending on the device chosen, different sets of peripherals are included. These features make the STM32F031x4/x6 microcontrollers suitable for a wide range of applications such as application control and user interfaces, hand-held equipment, A/V receivers and digital TV, PC peripherals, gaming and GPS platforms, industrial applications, PLCs, inverters, printers, scanners, alarm systems, video intercoms and HVACs. Table 2. STM32F031x4/x6 family device features and peripheral counts Peripheral STM32F031Fx STM32F031Ex STM32F031Gx Flash memory (Kbyte) 16 32 32 16 32 SRAM (Kbyte) Timers 16 32 STM32F031Cx 16 1 (16-bit) General purpose 4 (16-bit) 1 (32-bit) SPI [I2S](1) 1 [1] 2 I C 1 USART 1 12-bit ADC (number of channels) 1 (9 ext. + 3 int.) GPIOs 15 1 (10 ext. + 3 int.) 20 23 25 (on LQFP32) 27 (on UFQFPN32) Max. CPU frequency 48 MHz Operating voltage 2.0 to 3.6 V Operating temperature Ambient operating temperature: -40°C to 85°C / -40°C to 105°C Junction temperature: -40°C to 105°C / -40°C to 125°C Packages 32 4 Advanced control Comm. interfaces STM32F031Kx TSSOP20 WLCSP25 UFQFPN28 LQFP32 UFQFPN32 39 LQFP48 1. The SPI interface can be used either in SPI mode or in I2S audio mode. DocID025743 Rev 6 9/106 22 Description STM32F031x4 STM32F031x6 Figure 1. Block diagram 32:(5 6HULDO:LUH 'HEXJ 2EO )ODVK PHPRU\ LQWHUIDFH 6:&/. 6:',2 DV$) 65$0 FRQWUROOHU 19,& %XVPDWUL[ &257(;0&38 I0$; 0+] 9'' )ODVK*3/ 8SWR.% ELW #9''$ 5&0+] 3//&/. *3'0$ FKDQQHOV 325 5HVHW ,QW 6833/@ 3RZHU &RQWUROOHU 5(6(7 &/2&. &21752/ 86$57 5;7;&76576 &.DV$) ,& 6&/6'$60%$ P$)0DV$) 9''$ 06Y9 10/106 DocID025743 Rev 6 STM32F031x4 STM32F031x6 3 Functional overview Functional overview Figure 1 shows the general block diagram of the STM32F031x4/x6 devices. 3.1 ARM®-Cortex®-M0 core The ARM® Cortex®-M0 is a generation of ARM 32-bit RISC processors for embedded systems. It has been developed to provide a low-cost platform that meets the needs of MCU implementation, with a reduced pin count and low-power consumption, while delivering outstanding computational performance and an advanced system response to interrupts. The ARM® Cortex®-M0 processors feature exceptional code-efficiency, delivering the high performance expected from an ARM core, with memory sizes usually associated with 8- and 16-bit devices. The STM32F031x4/x6 devices embed ARM core and are compatible with all ARM tools and software. 3.2 Memories The device has the following features: • 4 Kbytes of embedded SRAM accessed (read/write) at CPU clock speed with 0 wait states and featuring embedded parity checking with exception generation for fail-critical applications. • The non-volatile memory is divided into two arrays: – 16 to 32 Kbytes of embedded Flash memory for programs and data – Option bytes The option bytes are used to write-protect the memory (with 4 KB granularity) and/or readout-protect the whole memory with the following options: – Level 0: no readout protection – Level 1: memory readout protection, the Flash memory cannot be read from or written to if either debug features are connected or boot in RAM is selected ® Level 2: chip readout protection, debug features (Cortex -M0 serial wire) and boot in RAM selection disabled – 3.3 Boot modes At startup, the boot pin and boot selector option bit are used to select one of the three boot options: • boot from User Flash memory • boot from System Memory • boot from embedded SRAM The boot loader is located in System Memory. It is used to reprogram the Flash memory by using USART on pins PA14/PA15 or PA9/PA10. DocID025743 Rev 6 11/106 22 Functional overview 3.4 STM32F031x4 STM32F031x6 Cyclic redundancy check calculation unit (CRC) The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit data word and a CRC-32 (Ethernet) polynomial. Among other applications, CRC-based techniques are used to verify data transmission or storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of verifying the Flash memory integrity. The CRC calculation unit helps compute a signature of the software during runtime, to be compared with a reference signature generated at linktime and stored at a given memory location. 3.5 Power management 3.5.1 Power supply schemes • VDD = VDDIO1 = 2.0 to 3.6 V: external power supply for I/Os (VDDIO1) and the internal regulator. It is provided externally through VDD pins. • VDDA = from VDD to 3.6 V: external analog power supply for ADC, Reset blocks, RCs and PLL (minimum voltage to be applied to VDDA is 2.4 V when the ADC is used). It is provided externally through VDDA pin. The VDDA voltage level must be always greater or equal to the VDD voltage level and must be established first. • VBAT = 1.65 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and backup registers (through power switch) when VDD is not present. For more details on how to connect power pins, refer to Figure 12: Power supply scheme. 3.5.2 Power supply supervisors The device has integrated power-on reset (POR) and power-down reset (PDR) circuits. They are always active, and ensure proper operation above a threshold of 2 V. The device remains in reset mode when the monitored supply voltage is below a specified threshold, VPOR/PDR, without the need for an external reset circuit. • The POR monitors only the VDD supply voltage. During the startup phase it is required that VDDA should arrive first and be greater than or equal to VDD. • The PDR monitors both the VDD and VDDA supply voltages, however the VDDA power supply supervisor can be disabled (by programming a dedicated Option bit) to reduce the power consumption if the application design ensures that VDDA is higher than or equal to VDD. The device features an embedded programmable voltage detector (PVD) that monitors the VDD power supply and compares it to the VPVD threshold. An interrupt can be generated when VDD drops below the VPVD threshold and/or when VDD is higher than the VPVD threshold. The interrupt service routine can then generate a warning message and/or put the MCU into a safe state. The PVD is enabled by software. 3.5.3 Voltage regulator The regulator has two operating modes and it is always enabled after reset. 12/106 • Main (MR) is used in normal operating mode (Run). • Low power (LPR) can be used in Stop mode where the power demand is reduced. DocID025743 Rev 6 STM32F031x4 STM32F031x6 Functional overview In Standby mode, it is put in power down mode. In this mode, the regulator output is in high impedance and the kernel circuitry is powered down, inducing zero consumption (but the contents of the registers and SRAM are lost). 3.5.4 Low-power modes The STM32F031x4/x6 microcontrollers support three low-power modes to achieve the best compromise between low power consumption, short startup time and available wakeup sources: • Sleep mode In Sleep mode, only the CPU is stopped. All peripherals continue to operate and can wake up the CPU when an interrupt/event occurs. • Stop mode Stop mode achieves very low power consumption while retaining the content of SRAM and registers. All clocks in the 1.8 V domain are stopped, the PLL, the HSI RC and the HSE crystal oscillators are disabled. The voltage regulator can also be put either in normal or in low power mode. The device can be woken up from Stop mode by any of the EXTI lines. The EXTI line source can be one of the 16 external lines, the PVD output, RTC, I2C1 or USART1. USART1 and I2C1 peripherals can be configured to enable the HSI RC oscillator so as to get clock for processing incoming data. If this is used when the voltage regulator is put in low power mode, the regulator is first switched to normal mode before the clock is provided to the given peripheral. • Standby mode The Standby mode is used to achieve the lowest power consumption. The internal voltage regulator is switched off so that the entire 1.8 V domain is powered off. The PLL, the HSI RC and the HSE crystal oscillators are also switched off. After entering Standby mode, SRAM and register contents are lost except for registers in the RTC domain and Standby circuitry. The device exits Standby mode when an external reset (NRST pin), an IWDG reset, a rising edge on the WKUP pins, or an RTC event occurs. Note: The RTC, the IWDG, and the corresponding clock sources are not stopped by entering Stop or Standby mode. 3.6 Clocks and startup System clock selection is performed on startup, however the internal RC 8 MHz oscillator is selected as default CPU clock on reset. An external 4-32 MHz clock can be selected, in which case it is monitored for failure. If failure is detected, the system automatically switches back to the internal RC oscillator. A software interrupt is generated if enabled. Similarly, full interrupt management of the PLL clock entry is available when necessary (for example on failure of an indirectly used external crystal, resonator or oscillator). Several prescalers allow the application to configure the frequency of the AHB and the APB domains. The maximum frequency of the AHB and the APB domains is 48 MHz. DocID025743 Rev 6 13/106 22 Functional overview STM32F031x4 STM32F031x6 Figure 2. Clock tree )/,7)&/. ,&6: +6, +6, +6, 0+] +6,5& ,& 6