STM32F302x6 STM32F302x8
ARM® Cortex®-M4 32-bit MCU+FPU, up to 64 KB Flash,
16 KB SRAM, ADC, DAC, USB, CAN, COMP, Op-Amp, 2.0 - 3.6 V
Datasheet - production data
Features
• Core: ARM® 32-bit Cortex®-M4 CPU with FPU
(72 MHz max.), single-cycle multiplication and
HW division, DSP instruction
• Memories
– 32 to 64 Kbytes of Flash memory
– 16 Kbytes of SRAM on data bus
• Reset and power management
– VDD, VDDA voltage range: 2.0 to 3.6 V
– Power-on/Power down reset (POR/PDR)
– Programmable voltage detector (PVD)
– Low-power: Sleep, Stop, and Standby
– VBAT supply for RTC and backup registers
• Clock management
– 4 to 32 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 8 MHz RC with x 16 PLL option
– Internal 40 kHz oscillator
• Up to 51 fast I/O ports, all mappable on
external interrupt vectors, several 5 V-tolerant
• Interconnect matrix
• 7-channel DMA controller supporting timers,
ADCs, SPIs, I2Cs, USARTs and DAC
• 1 × ADC 0.20 μs (up to 15 channels) with
selectable resolution of 12/10/8/6 bits, 0 to
3.6 V conversion range, single
ended/differential mode, separate analog
supply from 2.0 to 3.6 V
• Temperature sensor
• 1 x 12-bit DAC channel with analog supply from
2.4 to 3.6 V
• Three fast rail-to-rail analog comparators with
analog supply from 2.0 to 3.6 V
• 1 x operational amplifier that can be used in
PGA mode, all terminal accessible with analog
supply from 2.4 to 3.6 V
This is information on a product in full production.
UFQFPN32
(5x5 mm)
WLCSP49
(3.417x3.151 mm)
• Up to 18 capacitive sensing channels
supporting touchkey, linear and rotary sensors
• CRC calculation unit
June 2017
LQFP48 (7x7 mm)
LQFP64 (10x10 mm)
• Up to 9 timers
– One 32-bit timer with up to 4 IC/OC/PWM
or pulse counter and quadrature
(incremental) encoder input
– One 16-bit 6-channel advanced-control
timer, with up to 6 PWM channels,
deadtime generation and emergency stop
– Three 16-bit timers with IC/OC/OCN or
PWM, deadtime gen. and emergency stop
– One 16-bit basic timer to drive the DAC
– 2 watchdog timers (independent, window)
– SysTick timer: 24-bit downcounter
• Calendar RTC with alarm, periodic wakeup
from Stop/Standby
• Communication interfaces
– Three I2Cs with 20 mA current sink to
support Fast mode plus
– Up to 3 USARTs, 1 with ISO 7816 I/F, auto
baudrate detect and Dual clock domain
– Up to two SPIs with multiplexed full duplex
I2S
– USB 2.0 full-speed interface
– 1 x CAN interface (2.0B Active)
– Infrared transmitter
• Serial wire debug (SWD), JTAG
• 96-bit unique ID
Table 1. Device summary
Reference
Part number
STM32F302x6
STM32F302R6, STM32F302C6, STM32F302K6
STM32F302x8
STM32F302R8, STM32F302C8, STM32F302K8
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www.st.com
Contents
STM32F302x6 STM32F302x8
Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3
Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1
ARM® Cortex®-M4 core with FPU, embedded Flash and SRAM . . . . . . . 13
3.2
Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.2.1
Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.2.2
Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.3
Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.4
Cyclic redundancy check calculation unit (CRC) . . . . . . . . . . . . . . . . . . . 14
3.5
Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.5.1
Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.5.2
Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.5.3
Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.5.4
Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.6
Interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.7
Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.8
General-purpose inputs/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.9
Direct memory access (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.10
Interrupts and events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.10.1
3.11
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Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 19
Fast analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.11.1
Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.11.2
Internal voltage reference (VREFINT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.11.3
VBAT battery voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.12
Digital-to-analog converter (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.13
Operational amplifier (OPAMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.14
Ultra-fast comparators (COMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.15
Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.15.1
Advanced timer (TIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.15.2
General-purpose timers (TIM2, TIM15, TIM16, TIM17) . . . . . . . . . . . . . 23
3.15.3
Basic timer (TIM6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
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3.15.4
Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.15.5
Window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.15.6
SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.16
Real-time clock (RTC) and backup registers . . . . . . . . . . . . . . . . . . . . . . 24
3.17
Inter-integrated circuit interfaces (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.18
Universal synchronous/asynchronous receiver transmitter (USART) . . . 27
3.19
Serial peripheral interfaces (SPI)/Inter-integrated sound
interfaces (I2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.20
Controller area network (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.21
Universal serial bus (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.22
Touch sensing controller (TSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.23
Infrared transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.24
Development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.24.1
Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . 31
4
Pinouts and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5
Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.1
Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.1.1
Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.1.2
Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.1.3
Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.1.4
Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.1.5
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.1.6
Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
6.1.7
Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6.2
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
6.3
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
6.3.1
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
6.3.2
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 59
6.3.3
Embedded reset and power control block characteristics . . . . . . . . . . . 59
6.3.4
Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
6.3.5
Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
6.3.6
Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
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STM32F302x6 STM32F302x8
6.3.7
External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
6.3.8
Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
6.3.9
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
6.3.10
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
6.3.11
EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
6.3.12
Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
6.3.13
I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
6.3.14
I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
6.3.15
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
6.3.16
Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
6.3.17
Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
6.3.18
ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
6.3.19
DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
6.3.20
Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
6.3.21
Operational amplifier characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 114
6.3.22
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
6.3.23
VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
7.1
WLCSP49 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119
7.2
LQFP64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
7.3
LQFP48 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
7.4
UFQFPN32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
7.5
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
7.5.1
Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
7.5.2
Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . 133
8
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
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List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Table 46.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
STM32F302x6/8 device features and peripheral counts . . . . . . . . . . . . . . . . . . . . . . . . . . 11
External analog supply values for analog peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
STM32F302x6/8 peripheral interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Comparison of I2C analog and digital filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
STM32F302x6/8 I2C implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
USART features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
STM32F302x6/8 SPI/I2S implementation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Capacitive sensing GPIOs available on STM32F302x6/8 devices . . . . . . . . . . . . . . . . . . . 29
No. of capacitive sensing channels available on
STM32F302x6/8 devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
STM32F302x6/8 pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Alternate functions for Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Alternate functions for Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Alternate functions for Port C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Alternate functions for Port D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Alternate functions for Port F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
STM32F302x6 STM32F302x8 peripheral register boundary
addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 59
Programmable voltage detector characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Typical and maximum current consumption from VDD supply at VDD = 3.6V . . . . . . . . . . 62
Typical and maximum current consumption from the VDDA supply . . . . . . . . . . . . . . . . . . 64
Typical and maximum VDD consumption in Stop and Standby modes. . . . . . . . . . . . . . . . 64
Typical and maximum VDDA consumption in Stop and Standby modes. . . . . . . . . . . . . . . 65
Typical and maximum current consumption from VBAT supply. . . . . . . . . . . . . . . . . . . . . . 65
Typical current consumption in Run mode, code with data processing running from Flash 67
Typical current consumption in Sleep mode, code running from Flash or RAM . . . . . . . . . 68
Switching output I/O current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
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List of tables
Table 47.
Table 48.
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Table 70.
Table 71.
Table 72.
Table 73.
Table 74.
Table 75.
Table 76.
Table 77.
Table 78.
Table 79.
Table 80.
Table 81.
Table 82.
Table 83.
Table 84.
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STM32F302x6 STM32F302x8
Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
IWDG min/max timeout period at 40 kHz (LSI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
WWDG min-max timeout value @72 MHz (PCLK). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
I2S characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
USB startup time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
USB DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
USB: Full-speed electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Maximum ADC RAIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
ADC accuracy - limited test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Operational amplifier characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
TS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
WLCSP49 - 49-pin, 3.417 x 3.151 mm, 0.4 mm pitch wafer level chip scale
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
WLCSP49 recommended PCB design rules (0.4 mm pitch) . . . . . . . . . . . . . . . . . . . . . . 121
LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
DocID025147 Rev 7
STM32F302x6 STM32F302x8
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
Figure 43.
Figure 44.
DS9896 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Infrared transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
STM32F302x6/8 UFQFN32 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
STM32F302x6/8 LQFP48 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
STM32F302x6/8 LQFP64 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
STM32F302x6/8 WLCSP49 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
STM32F302x6/8 memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Typical VBAT current consumption (LSE and RTC ON/LSEDRV[1:0] = ‘00’) . . . . . . . . . . . 66
High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
HSI oscillator accuracy characterization results for soldered parts . . . . . . . . . . . . . . . . . . 80
TC and TTa I/O input characteristics - CMOS port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
TC and TTa I/O input characteristics - TTL port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Five volt tolerant (FT and FTf) I/O input characteristics - CMOS port. . . . . . . . . . . . . . . . . 88
Five volt tolerant (FT and FTf) I/O input characteristics - TTL port . . . . . . . . . . . . . . . . . . . 88
I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
USB timings: definition of data signal rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . 100
ADC typical current consumption in single-ended and differential modes . . . . . . . . . . . . 104
ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Maximum VREFINT scaler startup time from power down . . . . . . . . . . . . . . . . . . . . . . . . . 113
OPAMP Voltage Noise versus Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
WLCSP49 - 49-pin, 3.417 x 3.151 mm, 0.4 mm pitch wafer level chip scale
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
WLCSP49 - 49-pin, 3.417 x 3.151 mm, 0.4 mm pitch wafer level chip scale
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
WLCSP49 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . 122
LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
LQFP64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 125
LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
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8
List of figures
Figure 45.
Figure 46.
Figure 47.
Figure 48.
8/138
STM32F302x6 STM32F302x8
LQFP48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
UFQFPN32 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
DocID025147 Rev 7
STM32F302x6 STM32F302x8
1
Introduction
Introduction
This datasheet provides the ordering information and mechanical device characteristics of
the STM32F302x6/8 microcontrollers.
This datasheet should be read in conjunction with the STM32F302xB/C/D/E and
STM32F302x6/8 advanced ARM®-based 32-bit MCUs reference manual (RM0365). The
reference manual is available from the STMicroelectronics website www.st.com.
For information on the ARM® Cortex®-M4 core, please refer to the Cortex®-M4 Technical
Reference Manual, available from ARM website www.arm.com.
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52
Description
2
STM32F302x6 STM32F302x8
Description
The STM32F302x6/8 family is based on the high-performance ARM® Cortex®-M4
32-bit RISC core operating at a frequency of up to 72 MHz and embedding a floating point
unit (FPU). The family incorporates high-speed embedded memories (up to 64 Kbytes of
Flash memory, 16 Kbytes of SRAM), and an extensive range of enhanced I/Os and
peripherals connected to two APB buses.
The devices offer a fast 12-bit ADC (5 Msps), three comparators, an operational amplifier,
up to 18 capacitive sensing channels, one DAC channel, a low-power RTC, one generalpurpose 32-bit timer, one timer dedicated to motor control, and up to three general-purpose
16-bit timers, and one timer to drive the DAC. They also feature standard and advanced
communication interfaces: three I2Cs, up to three USARTs, up to two SPIs with multiplexed
full-duplex I2S, a USB FS device, a CAN, and an infrared transmitter.
The STM32F302x6/8 family operates in the –40 to +85°C and –40 to +105°C temperature
ranges from at a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode
allows the design of low-power applications.
The STM32F302x6/8 family offers devices in 32-, 48-, 49- and 64-pin packages.
The set of included peripherals changes with the device chosen.
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STM32F302x6 STM32F302x8
Description
Table 2. STM32F302x6/8 device features and peripheral counts
Peripheral
STM32F302Kx
Flash (Kbytes)
32
64
SRAM (Kbytes)
Timers
32
STM32F302Rx
64
32
64
16
Advanced control
1 (16-bit)
General purpose
3 (16-bit)
1 (32 bit)
Basic
1
SysTick timer
1
Watchdog timers
(independent, window)
2
PWM channels (all)(1)
16
18
PWM channels
(except complementary)
10
12
SPI/I2S
2
2C
3
I
Comm. interfaces USART
GPIOs
STM32F302Cx
2
3
USB 2.0 FS
1
CAN 2.0B
1
Normal I/Os (TC, TTa)
9
20
26
5-Volt tolerant I/Os (FT, FT1)
15
17
25
DMA channels
7
Capacitive sensing channels
13
17
18
12-bit ADC
Number of channels
1
8
1
11
1
15
12-bit DAC channels
Analog comparator
1
2
3
Operational amplifier
1
CPU frequency
72 MHz
Operating voltage
Operating temperature
Packages
3
2.0 to 3.6 V
Ambient operating temperature:
- 40 to 85 °C / - 40 to 105 °C
Junction temperature: - 40 to 125 °C
UFQFPN32
LQFP48,
WLCSP49
LQFP64
1. This total number considers also the PWMs generated on the complementary output channels.
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52
Description
STM32F302x6 STM32F302x8
Figure 1. DS9896 block diagram
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12/138
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STM32F302x6 STM32F302x8
Functional overview
3
Functional overview
3.1
ARM® Cortex®-M4 core with FPU, embedded Flash and
SRAM
The ARM® Cortex®-M4 processor with FPU is the latest generation of ARM processors for
embedded systems. It was developed to provide a low-cost platform that meets the needs of
MCU implementation, with a reduced pin count and low-power consumption, while
delivering outstanding computational performance and an advanced response to interrupts.
The ARM® Cortex®-M4 32-bit RISC processor with FPU features exceptional codeefficiency, delivering the high-performance expected from an ARM core in the memory size
usually associated with 8- and 16-bit devices.
The processor supports a set of DSP instructions which allow efficient signal processing and
complex algorithm execution. Its single-precision FPU speeds up software development by
using metalanguage development tools while avoiding saturation.
With its embedded ARM core, the STM32F302x6/8 family is compatible with all ARM tools
and software.
Figure 1 shows the general block diagram of the STM32F302x6/8 family devices.
3.2
Memories
3.2.1
Embedded Flash memory
All STM32F302x6/8 devices feature up to 64 Kbytes of embedded Flash memory available
for storing programs and data. The Flash memory access time is adjusted to the CPU clock
frequency (0 wait state from 0 to 24 MHz, 1 wait state from 24 to 48 MHz and 2 wait states
above).
3.2.2
Embedded SRAM
STM32F302x6/8 devices feature 16 Kbytes of embedded SRAM.
3.3
Boot modes
At startup, BOOT0 pin and BOOT1 option bit are used to select one of three boot options:
•
Boot from user Flash
•
Boot from system memory
•
Boot from embedded SRAM
The boot loader is located in system memory. It is used to reprogram the Flash memory by
using USART1 (PA9/PA10), USART2 (PA2/PA3) or USB (PA11/PA12) through DFU (device
firmware upgrade).
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52
Functional overview
3.4
STM32F302x6 STM32F302x8
Cyclic redundancy check calculation unit (CRC)
The CRC (cyclic redundancy check) calculation unit is used to get a CRC code using a
configurable generator polynomial value and size.
Among other applications, CRC-based techniques are used to verify data transmission or
storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of
verifying the Flash memory integrity. The CRC calculation unit helps compute a signature of
the software during runtime, to be compared with a reference signature generated at
linktime and stored at a given memory location.
3.5
Power management
3.5.1
Power supply schemes
•
VSS, VDD = 2.0 to 3.6 V: external power supply for I/Os and the internal regulator. It is
provided externally through VDD pins.
•
VSSA, VDDA = 2.0 to 3.6 V: external analog power supply for ADC, DAC, comparators,
operational amplifier, reset blocks, RCs and PLL. The minimum voltage to be applied to
VDDA differs from one analog peripheral to another. Table 3 provides the summary of
the VDDA ranges for analog peripherals. The VDDA voltage level must always be greater
than or equal to the VDD voltage level and must be provided first.
Table 3. External analog supply values for analog peripherals
Analog peripheral
•
3.5.2
Minimum VDDA supply
Maximum VDDA supply
ADC/COMP
2.0 V
3.6 V
DAC/OPAMP
2.4 V
3.6 V
VBAT = 1.65 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and
backup registers (through power switch) when VDD is not present.
Power supply supervisor
The device has an integrated power-on reset (POR) and power-down reset (PDR) circuits.
They are always active, and ensure proper operation above a threshold of 2 V. The device
remains in reset mode when the monitored supply voltage is below a specified threshold,
VPOR/PDR, without the need for an external reset circuit.
•
The POR monitors only the VDD supply voltage. During the startup phase it is required
that VDDA should arrive first and be greater than or equal to VDD.
•
The PDR monitors both the VDD and VDDA supply voltages, however the VDDA power
supply supervisor can be disabled (by programming a dedicated Option bit) to reduce
the power consumption if the application design ensures that VDDA is higher than or
equal to VDD.
The device features an embedded programmable voltage detector (PVD) that monitors the
VDD power supply and compares it to the VPVD threshold. An interrupt can be generated
when VDD drops below the VPVD threshold and/or when VDD is higher than the VPVD
threshold. The interrupt service routine can then generate a warning message and/or put
the MCU into a safe state. The PVD is enabled by software.
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3.5.3
Functional overview
Voltage regulator
The regulator has three operation modes: main (MR), low-power (LPR), and power-down.
•
The MR mode is used in the nominal regulation mode (Run)
•
The LPR mode is used in Stop mode.
•
The power-down mode is used in Standby mode: the regulator output is in high
impedance, and the kernel circuitry is powered down thus inducing zero consumption.
The voltage regulator is always enabled after reset. It is disabled in Standby mode.
3.5.4
Low-power modes
The STM32F302x6/8 supports three low-power modes to achieve the best compromise
between low power consumption, short startup time and available wakeup sources:
•
Sleep mode
In Sleep mode, only the CPU is stopped. All peripherals continue to operate and can
wake up the CPU when an interrupt/event occurs.
•
Stop mode
Stop mode achieves the lowest power consumption while retaining the content of
SRAM and registers. All clocks in the 1.8 V domain are stopped, the PLL, the HSI RC
and the HSE crystal oscillators are disabled. The voltage regulator can also be put
either in normal or in low-power mode.
The device can be woken up from Stop mode by any of the EXTI line. The EXTI line
source can be one of the 16 external lines, the PVD output, the USB wakeup, the RTC
alarm, COMPx, I2C or USARTx.
•
Standby mode
The Standby mode is used to achieve the lowest power consumption. The internal
voltage regulator is switched off so that the entire 1.8 V domain is powered off. The
PLL, the HSI RC and the HSE crystal oscillators are also switched off. After entering
Standby mode, SRAM and register contents are lost except for registers in the Backup
domain and Standby circuitry.
The device exits Standby mode when an external reset (NRST pin), an IWDG reset, a
rising edge on the WKUP pin, or an RTC alarm occurs.
Note:
The RTC, the IWDG, and the corresponding clock sources are not stopped by entering Stop
or Standby mode.
3.6
Interconnect matrix
Several peripherals have direct connections between them. This allows autonomous
communication between peripherals, saving CPU resources thus power supply
consumption. In addition, these hardware connections allow fast and predictable latency.
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Functional overview
STM32F302x6 STM32F302x8
Table 4. STM32F302x6/8 peripheral interconnect matrix
Interconnect source
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Interconnect action
TIMx
Timers synchronization or chaining
ADC1
DAC1
Conversion triggers
DMA
Memory to memory transfer trigger
Compx
Comparator output blanking
COMPx
TIMx
Timer input: OCREF_CLR input, input capture
ADC1
TIM1
Timer triggered by analog watchdog
GPIO
RTCCLK
HSE/32
MC0
TIM16
Clock source used as input channel for HSI and
LSI calibration
CSS
CPU (hard fault)
COMPx
PVD
GPIO
TIM1
TIM15, 16, 17
Timer break
TIMx
Note:
Interconnect
destination
TIMx
External trigger, timer break
GPIO
ADC1
DAC1
Conversion external trigger
DAC1
COMPx
Comparator inverting input
For more details about the interconnect actions, please refer to the corresponding sections
in the STM32F302xx and STM32F302x6/8 reference manual RM0365.
DocID025147 Rev 7
STM32F302x6 STM32F302x8
3.7
Functional overview
Clocks and startup
System clock selection is performed on startup, however the internal RC 8 MHz oscillator is
selected as default CPU clock on reset. An external 4-32 MHz clock can be selected, in
which case it is monitored for failure. If failure is detected, the system automatically switches
back to the internal RC oscillator. A software interrupt is generated if enabled. Similarly, full
interrupt management of the PLL clock entry is available when necessary (for example with
failure of an indirectly used external oscillator).
Several prescalers allow to configure the AHB frequency, the high speed APB (APB2) and
the low speed APB (APB1) domains. The maximum frequency of the AHB and the high
speed APB domains is 72 MHz, while the maximum allowed frequency of the low speed
APB domain is 36 MHz.
The advanced clock controller clocks the core and all peripherals using a single crystal or
oscillator. To achieve audio class performance, an audio crystal can be used.
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Functional overview
STM32F302x6 STM32F302x8
Figure 2. Clock tree
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