STM32F302xD STM32F302xE
ARM® Cortex®-M4 32b MCU+FPU, up to 512KB Flash, 64KB SRAM,
FSMC, 2 ADCs, 1 DAC ch., 4 comp, 2 Op-Amp, 2.0-3.6 V
Datasheet - production data
Features
• Core: ARM® Cortex®-M4 32-bit CPU with
72 MHz FPU, single-cycle multiplication and
HW division, DSP instruction and MPU
(memory protection unit)
LQFP64
(10 × 10 mm)
LQFP100
(14 × 14 mm)
LQFP144
(20 x 20 mm)
• Operating conditions:
– VDD, VDDA voltage range: 2.0 V to 3.6 V
• Memories
– Up to 512 Kbytes of Flash memory
– 64 Kbytes of SRAM, with HW parity check
implemented on the first 32 Kbytes.
– Flexible memory controller (FSMC) for
static memories, with four Chip Select
• CRC calculation unit
• Reset and supply management
– Power-on/Power-down reset (POR/PDR)
– Programmable voltage detector (PVD)
– Low-power modes: Sleep, Stop and
Standby
– VBAT supply for RTC and backup registers
• Clock management
– 4 to 32 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 8 MHz RC with x 16 PLL option
– Internal 40 kHz oscillator
• Up to 115 fast I/Os
– All mappable on external interrupt vectors
– Several 5 V-tolerant
• Interconnect matrix
• 12-channel DMA controller
• Two ADCs 0.20 µs (up to 18 channels) with
selectable resolution of 12/10/8/6 bits, 0 to
3.6 V conversion range, separate analog
supply from 2.0 to 3.6 V
• One 12-bit DAC channels with analog supply
from 2.4 to 3.6 V
October 2016
This is information on a product in full production.
UFBGA100
(7 x 7 mm)
WLCSP100
(4.775 x 5.041 mm)
• Four ultra-fast rail-to-rail analog comparators
with analog supply from 2.0 to 3.6 V
• Two operational amplifiers that can be used in
PGA mode, all terminals accessible with
analog supply from 2.4 to 3.6 V
• Up to 24 capacitive sensing channels supporting
touchkey, linear and rotary touch sensors
• Up to 11 timers:
– One 32-bit timer and two 16-bit timers with
up to four IC/OC/PWM or pulse counter
and quadrature (incremental) encoder input
– One 16-bit 6-channel advanced-control
timers, with up to six PWM channels,
deadtime generation and emergency stop
– One 16-bit timer with two IC/OCs, one
OCN/PWM, deadtime generation and
emergency stop
– Two 16-bit timers with IC/OC/OCN/PWM,
deadtime generation and emergency stop
– Two watchdog timers (independent,
window)
– One SysTick timer: 24-bit downcounter
– One 16-bit basic timers to drive the DAC
• Calendar RTC with Alarm, periodic wakeup
from Stop/Standby
• Communication interfaces
– CAN interface (2.0B Active)
DocID026900 Rev 4
1/168
www.st.com
STM32F302xD STM32F302xE
– Three I2C Fast mode plus (1 Mbit/s) with
– USB 2.0 full-speed interface with LPM
20 mA current sink, SMBus/PMBus,
support
wakeup from STOP
– Infrared transmitter
– Up to five USART/UARTs (ISO 7816
• SWD, Cortex®-M4 with FPU ETM, JTAG
interface, LIN, IrDA, modem control)
• 96-bit unique ID
– Up to four SPIs, 4 to 16 programmable bit
frames, two with multiplexed half/full duplex
I2S interface
Table 1. Device summary
Reference
Part number
STM32F302xD
STM32F302RD, STM32F302VD, STM32F302ZD.
STM32F302xE
STM32F302RE, STM32F302VE, STM32F302ZE.
2/168
DocID026900 Rev 4
STM32F302xD STM32F302xE
Contents
Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3
Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1
ARM® Cortex®-M4 core with FPU with embedded Flash and SRAM . . . 15
3.2
Memory protection unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.3
Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.4
Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.5
Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.6
Cyclic redundancy check (CRC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.7
Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.7.1
Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.7.2
Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.7.3
Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.7.4
Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.8
Interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.9
Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.10
General-purpose input/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.11
Direct memory access (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.12
Flexible static memory controller (FSMC) . . . . . . . . . . . . . . . . . . . . . . . . 21
3.13
Interrupts and events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.13.1
3.14
Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 22
Fast analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.14.1
Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.14.2
Internal voltage reference (VREFINT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.14.3
VBAT battery voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.14.4
OPAMP reference voltage (VREFOPAMP) . . . . . . . . . . . . . . . . . . . . . . 23
3.15
Digital-to-analog converter (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.16
Operational amplifier (OPAMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.17
Ultra-fast comparators (COMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.18
Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DocID026900 Rev 4
3/168
5
Contents
STM32F302xD STM32F302xE
3.18.1
Advanced timers (TIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.18.2
General-purpose timers (TIM2, TIM3, TIM4, TIM15, TIM16, TIM17) . . 25
3.18.3
Basic timers (TIM6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.18.4
Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.18.5
Window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.18.6
SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.19
Real-time clock (RTC) and backup registers . . . . . . . . . . . . . . . . . . . . . . 27
3.20
Inter-integrated circuit interface (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.21
Universal synchronous/asynchronous receiver transmitter (USART) . . . 28
3.22
Universal asynchronous receiver transmitter (UART) . . . . . . . . . . . . . . . 29
3.23
Serial peripheral interface (SPI)/Inter-integrated sound interfaces (I2S) . 29
3.24
Controller area network (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.25
Universal serial bus (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.26
Infrared transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.27
Touch sensing controller (TSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.28
Development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.28.1
Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.28.2
Embedded Trace Macrocell . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4
Pinout and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5
Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
6.1
4/168
Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
6.1.1
Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
6.1.2
Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
6.1.3
Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
6.1.4
Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
6.1.5
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
6.1.6
Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
6.1.7
Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
6.2
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
6.3
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
6.3.1
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
6.3.2
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 69
DocID026900 Rev 4
STM32F302xD STM32F302xE
7
Contents
6.3.3
Embedded reset and power control block characteristics . . . . . . . . . . . 69
6.3.4
Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
6.3.5
Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
6.3.6
Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
6.3.7
External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
6.3.8
Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
6.3.9
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
6.3.10
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
6.3.11
FSMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
6.3.12
EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
6.3.13
Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
6.3.14
I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
6.3.15
I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
6.3.16
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
6.3.17
Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
6.3.18
Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
6.3.19
ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
6.3.20
DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
6.3.21
Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
6.3.22
Operational amplifier characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 143
6.3.23
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
6.3.24
VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
7.1
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
7.2
LQFP144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
7.3
UFBGA100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
7.4
LQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
7.5
WLCSP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
7.6
LQFP64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
7.7
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
7.7.1
Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
7.7.2
Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . 163
8
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
DocID026900 Rev 4
5/168
5
List of tables
STM32F302xD STM32F302xE
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Table 46.
6/168
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
STM32F302xD/E family device features and peripheral counts . . . . . . . . . . . . . . . . . . . . . 13
External analog supply values for analog peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
STM32F302xD/E peripheral interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Comparison of I2C analog and digital filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
STM32F302xD/E I2C implementation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
USART features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
STM32F302xD/E SPI/I2S implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Capacitive sensing GPIOs available on STM32F302xD/E devices . . . . . . . . . . . . . . . . . . 31
Number of capacitive sensing channels available on
STM32F302xD/E devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
STM32F302xD/E pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
STM32F302xD/E alternate function mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Memory map, peripheral register boundary addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 69
Programmable voltage detector characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Typical and maximum current consumption from VDD supply at VDD = 3.6V . . . . . . . . . . . 71
Typical and maximum current consumption from the VDDA supply . . . . . . . . . . . . . . . . . . 72
Typical and maximum VDD consumption in Stop and Standby modes. . . . . . . . . . . . . . . . 73
Typical and maximum VDDA consumption in Stop and Standby modes. . . . . . . . . . . . . . . 74
Typical and maximum current consumption from VBAT supply. . . . . . . . . . . . . . . . . . . . . . 74
Typical current consumption in Run mode, code with data processing running
from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Typical current consumption in Sleep mode, code running from Flash or RAM . . . . . . . . . 77
Switching output I/O current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Wakeup time using USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . . 91
Asynchronous non-multiplexed SRAM/PSRAM/NOR read-NWAIT timings . . . . . . . . . . . . 91
DocID026900 Rev 4
STM32F302xD STM32F302xE
Table 47.
Table 48.
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Table 70.
Table 71.
Table 72.
Table 73.
Table 74.
Table 75.
Table 76.
Table 77.
Table 78.
Table 79.
Table 80.
Table 81.
Table 82.
Table 83.
Table 84.
Table 85.
Table 86.
Table 87.
Table 88.
Table 89.
Table 90.
Table 91.
Table 92.
Table 93.
Table 94.
Table 95.
Table 96.
Table 97.
List of tables
Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . 92
Asynchronous non-multiplexed SRAM/PSRAM/NOR write-NWAIT timings. . . . . . . . . . . . 93
Asynchronous multiplexed PSRAM/NOR read-NWAIT timings . . . . . . . . . . . . . . . . . . . . . 93
Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Asynchronous multiplexed PSRAM/NOR write-NWAIT timings . . . . . . . . . . . . . . . . . . . . . 96
Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 100
Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Switching characteristics for PC Card/CF read and write cycles
in attribute/common space. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Switching characteristics for PC Card/CF read and write cycles in I/O space . . . . . . . . . 106
Switching characteristics for NAND Flash read cycles . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Switching characteristics for NAND Flash write cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . 109
EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
IWDG min/max timeout period at 40 kHz (LSI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
WWDG min-max timeout value @72 MHz (PCLK). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
I2S characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
USB startup time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
USB DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
USB: full-speed electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Maximum ADC RAIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
ADC accuracy - limited test conditions, 100-/144-pin packages . . . . . . . . . . . . . . . . . . . 132
ADC accuracy, 100-pin/144-pin packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
ADC accuracy - limited test conditions, 64-pin packages . . . . . . . . . . . . . . . . . . . . . . . . . 135
ADC accuracy, 64-pin packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
ADC accuracy at 1MSPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
Operational amplifier characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
TS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
LQFP144 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
UFBGA100 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
UFBGA100 recommended PCB design rules (0.5 mm pitch BGA) . . . . . . . . . . . . . . . . . 152
LQPF100 package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
WLCSP100 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
WLCSP100 recommended PCB design rules (0.4 mm pitch) . . . . . . . . . . . . . . . . . . . . . 159
DocID026900 Rev 4
7/168
8
List of tables
Table 98.
Table 99.
Table 100.
Table 101.
8/168
STM32F302xD STM32F302xE
LQFP64 package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
DocID026900 Rev 4
STM32F302xD STM32F302xE
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
Figure 43.
Figure 44.
STM32F302xD/E block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
STM32F302xD/E clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Infrared transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
STM32F302xD/E LQFP64 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
STM32F302xD/E LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
STM32F302xD/E LQFP144 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
STM32F302xD/E WLCSP100 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
STM32F302xD/E UFBGA100 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
STM32F302xD/E memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Typical VBAT current consumption (LSE and RTC ON/LSEDRV[1:0] 00’) . . . . . . . . . . . . . 75
High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
HSI oscillator accuracy characterization results for soldered parts . . . . . . . . . . . . . . . . . . 88
Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . . 90
Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . 92
Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 100
Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
PC Card/CompactFlash controller waveforms for common memory
read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
PC Card/CompactFlash controller waveforms for common memory
write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
PC Card/CompactFlash controller waveforms for attribute memory
read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
PC Card/CompactFlash controller waveforms for attribute memory
write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
PC Card/CompactFlash controller waveforms for I/O space read access . . . . . . . . . . . . 107
PC Card/CompactFlash controller waveforms for I/O space write access . . . . . . . . . . . . 107
NAND controller read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
NAND controller write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
TC and TTa I/O input characteristics - CMOS port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
TC and TTa I/O input characteristics - TTL port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Five volt tolerant (FT and FTf) I/O input characteristics - CMOS port. . . . . . . . . . . . . . . . 115
Five volt tolerant (FT and FTf) I/O input characteristics - TTL port . . . . . . . . . . . . . . . . . . 115
I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
DocID026900 Rev 4
9/168
10
List of figures
Figure 45.
Figure 46.
Figure 47.
Figure 48.
Figure 49.
Figure 50.
Figure 51.
Figure 52.
Figure 53.
Figure 54.
Figure 55.
Figure 56.
Figure 57.
Figure 58.
Figure 59.
Figure 60.
Figure 61.
Figure 62.
Figure 63.
Figure 64.
Figure 65.
Figure 66.
Figure 67.
Figure 68.
Figure 69.
10/168
STM32F302xD STM32F302xE
I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
USB timings: definition of data signal rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . 126
ADC typical current consumption on VDDA pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
ADC typical current consumption on VREF+ pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
OPAMP voltage noise versus frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
LQFP144 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
Recommended footprint for the LQFP144 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
LQFP144 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
UFBGA100 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
Recommended footprint for the UFBGA100 package . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
UFBGA100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153
LQFP100 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
Recommended footprint for the LQFP100 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
LQFP100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
WLCSP100 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
Recommended footprint for the WLCSP100 package . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
WLCSP100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
LQFP64 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Recommended footprint for the LQFP64 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
LQFP64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
LQFP100 PD max vs. TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
DocID026900 Rev 4
STM32F302xD STM32F302xE
1
Introduction
Introduction
This datasheet provides the ordering information and mechanical device characteristics of
the STM32F302xD/E microcontrollers.
This STM32F302xD/E datasheet should be read in conjunction with the reference manual of
STM32F302xB/C/D/E, STM32F302x6/8 devices (RM0365) available on STMicroelectronics
website at www.st.com.
For information on the ARM® Cortex®-M4 core with FPU, refer to the following documents:
•
Cortex® -M4 with FPU Technical Reference Manual, available from the www.arm.com
website
•
STM32F3 and STM32F4 Series Cortex® -M4 programming manual (PM0214)
available on STMicroelectronics website at www.st.com.
DocID026900 Rev 4
11/168
63
Description
2
STM32F302xD STM32F302xE
Description
The STM32F302xD/E family is based on the high-performance ARM® Cortex®-M4 32-bit
RISC core with FPU operating at a frequency of 72 MHz, and embedding a floating point
unit (FPU), a memory protection unit (MPU) and an embedded trace macrocell (ETM). The
family incorporates high-speed embedded memories (512-Kbyte Flash memory, 64-Kbyte
SRAM), a flexible memory controller (FSMC) for static memories (SRAM, PSRAM, NOR
and NAND), and an extensive range of enhanced I/Os and peripherals connected to an
AHB and two APB buses.
The devices offer two fast 12-bit ADCs (5 Msps), four comparators, two operational
amplifiers, one DAC channel, a low-power RTC, up to two general-purpose 16-bit timers,
one general-purpose 32-bit timer, and one timer dedicated to motor control. They also
feature standard and advanced communication interfaces: up to three I2Cs, up to four SPIs
(two SPIs are with multiplexed full-duplex I2Ss), three USARTs, up to two UARTs, CAN and
USB. To achieve audio class accuracy, the I2S peripherals can be clocked via an external
PLL.
The STM32F302xD/E family operates in the -40 to +85°C and -40 to +105°C temperature
ranges from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows
the design of low-power applications.
The STM32F302xD/E family offers devices in different packages ranging from 64 to
144 pins.
Depending on the device chosen, different sets of peripherals are included.
12/168
DocID026900 Rev 4
STM32F302xD STM32F302xE
Description
Table 2. STM32F302xD/E family device features and peripheral counts
Peripheral
Flash (Kbytes)
STM32F302Rx
STM32F302Vx
STM32F302Zx
384
384
384
512
SRAM (Kbytes) on data bus
NO
YES
Advanced control
1 (16-bit)
General purpose
5 (16-bit)
1 (32-bit)
Basic
PWM channels (all)
1 (16-bit)
(1)
26
PWM channels
(except
complementary)
20
SPI (I2S)(2)
I
4(2)
2C
3
Communication USART
interfaces
UART
3
2
CAN
1
USB
1
Normal I/Os
(TC, TTa)
26
37 in WLCSP100,44 in
LQFP100 and
UFBGA100
45
5-volt tolerant
I/Os (FT, FTf)
25
42 in LQFP100
40 in WLCSP100 and
UFBGA100
70
GPIOs
DMA channels
Capacitive sensing channels
12-bit ADCs
12
18
2
16 channels
24
2
17 channels
12-bit DAC channels
1
Analog comparator
4
Operational amplifiers
72 MHz
Operating voltage
Operating temperature
2
18 channels
2
CPU frequency
Packages
512
64
FMC (flexible memory controller)
Timers
512
2.0 to 3.6 V
Ambient operating temperature: - 40 to 85 °C / - 40 to 105 °C
Junction temperature: - 40 to 125 °C
LQFP64
LQFP100
,WLCSP100
UFBGA100
LQFP144
1. This total number considers also the PWMs generated on the complementary output channels.
2. The SPI interfaces works in an exclusive way in either the SPI mode or the I2S audio mode.
DocID026900 Rev 4
13/168
63
Description
STM32F302xD STM32F302xE
Figure 1. STM32F302xD/E block diagram
6:-7$*
(70
7UDFH
7ULJ
9''
2%/
)ODVK
LQWHUIDFH
73,8
038)38
,EXV
&RUWH[0&38
'EXV
)PD[ 0+]
6\VWHP
%XV0DWUL[
75$'(&/.
75$&('>@
DV$)
-7567
-7',
-7&.6:&/.
-7066:',2
-7'2
$V$)
)0& 65$0365$0
3&&DUG&RPSDFW
)ODVK
1251$1')ODVK
.%)/$6+
ELWV
325
5HVHW
,QW
.%65$0
19,&
#9''$
5&/6
3//
*3'0$
FKDQQHOV
3$> @
*3,23257$
3%> @
*3,23257%
3&> @
*3,23257&
3'> @
*3,23257'
3(> @
*3,23257(
3)> @
*3,23257)
3*> @
*3,23257*
3+> @
*3,23257+
;;*URXSVRI
FKDQQHOVDV
$)
6WDQGE\
LQWHUIDFH
;7$/N+]
%DFNXS
57&
5HJ
$:8 %\WH
%DFNXS
LQWHUIDFH
86$57&/.
,&&/.
$'&6$5
&/.
&5&
7RXFK6HQVLQJ
&RQWUROOHU
$+%
$3%
&KDQQHOV(75DV$)
7,0(5
&KDQQHOV(75DV$)
63,,6
026,6'0,62H[WB6'
6&.&.166:60&/.DV$)
$+%
$3%
63,,6
026,6'0,62H[WB6'
6&.&.166:60&/.DV$)
86$57
5;7;&76576DV$)
86$57
5;7;&76576DV$)
8$57
5;7;DV$)
8$57
5;7;DV$)
&KDQQHO&RPS
&KDQQHO%5.DV$)
7,0(5
&KDQQHOV
&RPSFKDQQHOV
(75%5.DV$)
7,0(53:0
026,0,62
6&.166DV$)
63,
026,0,62
6&.166DV$)
63,
5;7;&76576
6PDUW&DUGDV$)
86$57
,&
6&/6'$60%$DV$)
,&
6&/6'$60%$DV$)
&$17;&$15;
86%)6
86%B'386%B'0
,) ELW'$&
'$&B&+DV$)
7,0(5
#9''$
#9''$
6 @$> @'^ @
12(11:(11%/> @
6'&/.(> @6'1(> @
6'1:(1/15$61&$6
1$'91:$,71,25'
15(*&',171
2S$PS
,1[[
287[[
2S$PS
,1[[
287[[
06Y 9
STM32F302xD STM32F302xE
Functional overview
3
Functional overview
3.1
ARM® Cortex®-M4 core with FPU with embedded Flash and
SRAM
The ARM® Cortex®-M4 processor with FPU is the latest generation of ARM processors for
embedded systems. It was developed to provide a low-cost platform that meets the needs of
MCU implementation, with a reduced pin count and low-power consumption, while
delivering outstanding computational performance and an advanced response to interrupts.
The ARM® Cortex®-M4 32-bit RISC processor with FPU features exceptional codeefficiency, delivering the high-performance expected from an ARM core in the memory size
usually associated with 8- and 16-bit devices.
The processor supports a set of DSP instructions which allows efficient signal processing
and complex algorithm execution.
Its single precision FPU speeds up software development by using metalanguage
development tools, while avoiding saturation.
With its embedded ARM core, the STM32F302xD/E family is compatible with all ARM tools
and software.
Figure 1 shows the general block diagram of the STM32F302xD/E family devices.
3.2
Memory protection unit (MPU)
The memory protection unit (MPU) is used to separate the processing of tasks from the data
protection. The MPU manage up to 8 protection areas that are further divided up into 8
subareas. The protection area sizes are between 32 bytes and the whole 4 gigabytes of
addressable memory.
The memory protection unit is especially helpful for applications where some critical or
certified code has to be protected against the misbehavior of other tasks. It is usually
managed by an RTOS (real-time operating system). If a program accesses a memory
location that is prohibited by the MPU, the RTOS detects it and takes action. In an RTOS
environment, the kernel dynamically updates the MPU area setting, based on the process to
be executed.
The MPU is optional and can be bypassed for applications that do not need it.
3.3
Embedded Flash memory
All STM32F302xD/E devices feature 384/512 Kbyte of embedded Flash memory available
for storing programs and data. The Flash memory access time is adjusted to the CPU clock
frequency (0 wait state from 0 to 24 MHz, 1 wait state from 24 to 48 MHz and 2 wait states
above).
DocID026900 Rev 4
15/168
63
Functional overview
3.4
STM32F302xD STM32F302xE
Embedded SRAM
STM32F302xD/E devices feature 64 Kbyte of embedded SRAM with hardware parity check
implemented on the first 32 Kbyte. The memory can be accessed in read/write at CPU clock
speed with 0 wait states.
3.5
Boot modes
At startup, Boot0 pin and Boot1 option bit are used to select one of three boot options:
•
Boot from user Flash
•
Boot from system memory
•
Boot from embedded SRAM
The boot loader is located in the system memory. It is used to reprogram the Flash memory
by using USART1 (PA9/PA10), USART2 (PA2/PA3) or USB (PA11/PA12) through DFU
(device firmware upgrade).
3.6
Cyclic redundancy check (CRC)
The CRC (cyclic redundancy check) calculation unit is used to get a CRC code using a
configurable generator polynomial value and size.
Among other applications, CRC-based techniques are used to verify data transmission or
storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of
verifying the Flash memory integrity. The CRC calculation unit helps compute a signature of
the software during runtime, to be compared with a reference signature generated at
linktime and stored at a given memory location.
16/168
DocID026900 Rev 4
STM32F302xD STM32F302xE
3.7
Power management
3.7.1
Power supply schemes
Functional overview
•
VSS, VDD = 2.0 to 3.6 V: external power supply for I/Os and the internal regulator. It is
provided externally through VDD pins.
•
VSSA, VDDA = 2.0 to 3.6 V: external analog power supply for ADC, DAC, comparators,
operational amplifier, reset blocks, RCs and PLL. The minimum voltage to be applied to
VDDA differs from one analog peripheral to another. Table 3 provides the summary of
the VDDA ranges for analog peripherals. The VDDA voltage level must always be greater
than or equal to the VDD voltage level and must be provided first.
Table 3. External analog supply values for analog peripherals
Analog peripheral
•
3.7.2
Minimum VDDA supply
Maximum VDDA supply
ADC/COMP
2.0 V
3.6 V
DAC/OPAMP
2.4 V
3.6 V
VBAT = 1.65 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and
backup registers (through power switch) when VDD is not present.
Power supply supervisor
The device has an integrated power-on reset (POR) and power-down reset (PDR) circuits.
They are always active, and ensure proper operation above a threshold of 2 V. The device
remains in reset mode when the monitored supply voltage is below a specified threshold,
VPOR/PDR, without the need for an external reset circuit.
•
The POR monitors only the VDD supply voltage. During the startup phase it is required
that VDDA should arrive first and be greater than or equal to VDD.
•
The PDR monitors both the VDD and VDDA supply voltages, however the VDDA power
supply supervisor can be disabled (by programming a dedicated Option bit) to reduce
the power consumption if the application design ensures that VDDA is higher than or
equal to VDD.
The device features an embedded programmable voltage detector (PVD) that monitors the
VDD power supply and compares it to the VPVD threshold. An interrupt can be generated
when VDD drops below the VPVD threshold and/or when VDD is higher than the VPVD
threshold. The interrupt service routine can then generate a warning message and/or put
the MCU into a safe state. The PVD is enabled by software.
3.7.3
Voltage regulator
The regulator has three operation modes: main (MR), low power (LPR), and power-down.
•
The MR mode is used in the nominal regulation mode (Run)
•
The LPR mode is used in Stop mode.
•
The power-down mode is used in Standby mode: the regulator output is in high
impedance, and the kernel circuitry is powered down thus inducing zero consumption.
The voltage regulator is always enabled after reset. It is disabled in Standby mode.
DocID026900 Rev 4
17/168
63
Functional overview
3.7.4
STM32F302xD STM32F302xE
Low-power modes
The STM32F302xD/E supports three low-power modes to achieve the best compromise
between low power consumption, short startup time and available wakeup sources:
•
Sleep mode
In Sleep mode, only the CPU is stopped. All peripherals continue to operate and wake
up the CPU when an interrupt/event occurs.
•
Stop mode
Stop mode achieves the lowest power consumption while retaining the content of
SRAM and registers. All clocks in the 1.8 V domain are stopped, the PLL, the HSI RC
and the HSE crystal oscillators are disabled. The voltage regulator can also be put
either in normal or in low-power mode.
The device can be woken up from Stop mode by any of the EXTI line. The EXTI line
source can be one of the 16 external lines, the PVD output, the USB wakeup, the RTC
alarm, COMPx, I2Cx or U(S)ARTx.
•
Standby mode
The Standby mode is used to achieve the lowest power consumption. The internal
voltage regulator is switched off so that the entire 1.8 V domain is powered off. The
PLL, the HSI RC and the HSE crystal oscillators are also switched off. After entering
Standby mode, SRAM and register contents are lost except for registers in the Backup
domain and Standby circuitry.
The device exits Standby mode when an external reset (NRST pin), an IWDG reset, a
rising edge on the WKUP pin or an RTC alarm occurs.
Note:
The RTC, the IWDG and the corresponding clock sources are not stopped by entering Stop
or Standby mode.
3.8
Interconnect matrix
Several peripherals have direct connections between them. This allows autonomous
communication between peripherals, saving CPU resources thus power supply
consumption. In addition, these hardware connections allow fast and predictable latency.
Table 4. STM32F302xD/E peripheral interconnect matrix
Interconnect source
Interconnect action
TIMx
Timers synchronization or chaining
ADCx
DAC1
Conversion triggers
DMA
Memory to memory transfer trigger
Compx
Comparator output blanking
COMPx
TIMx
Timer input: OCREF_CLR input, input capture
ADCx
TIMx
Timer triggered by analog watchdog
TIMx
18/168
Interconnect
destination
DocID026900 Rev 4
STM32F302xD STM32F302xE
Functional overview
Table 4. STM32F302xD/E peripheral interconnect matrix (continued)
Interconnect source
Interconnect
destination
Interconnect action
GPIO
RTCCLK
HSE/32
MC0
TIM16
Clock source used as input channel for HSI and
LSI calibration
CSS
CPU (hard fault)
COMPx
GPIO
TIM1
TIM15, 16, 17
Timer break
TIMx
External trigger, timer break
GPIO
ADCx
DAC1
Conversion external trigger
DAC1
COMPx
Comparator inverting input
Note:
For more details about the interconnect actions, refer to the corresponding sections in the
STM32F302xD/E reference manual (RM0365).
3.9
Clocks and startup
System clock selection is performed on startup, however the internal RC 8 MHz oscillator is
selected as default CPU clock on reset. An external 4-32 MHz clock can be selected, in
which case it is monitored for failure. If failure is detected, the system automatically switches
back to the internal RC oscillator. A software interrupt is generated if enabled. Similarly, full
interrupt management of the PLL clock entry is available when necessary (for example with
failure of an indirectly used external oscillator).
Several prescalers allow to configure the AHB frequency, the high speed APB (APB2) and
the low speed APB (APB1) domains. The maximum frequency of the AHB and the high
speed APB domains is 72 MHz, while the maximum allowed frequency of the low speed
APB domain is 36 MHz.
DocID026900 Rev 4
19/168
63
Functional overview
STM32F302xD STM32F302xE
Figure 2. STM32F302xD/E clock tree
)/,7)&/.
WR)ODVKSURJUDPPLQJLQWHUIDFH
+6,
WR,&[ [
6
工商网监
湘ICP备2023018690号
