STM32F756IGK6

STM32F756xx ARM®-based Cortex®-M7 32b MCU+FPU, 462DMIPS, up to 1MB Flash/320+16+ 4KB RAM, crypto, USB OTG HS/FS, ethernet, 18 TIMs, 3 ADCs, 25 com itf, cam & LCD Datasheet - production data Features &"'! ® ® • Core: ARM 32-bit Cortex -M7 CPU with FPU, adaptive real-time accelerator (ART Accelerator™) and L1-cache: 4KB data cache and 4KB instruction cache, allowing 0-wait state execution from embedded Flash memory and external memories, frequency up to 216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions. • Memories – Up to 1MB of Flash memory – 1024 bytes of OTP memory – SRAM: 320KB (including 64KB of data TCM RAM for critical real-time data) + 16KB of instruction TCM RAM (for critical real-time routines) + 4KB of backup SRAM (available in the lowest power modes) – Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories • Dual mode Quad-SPI • LCD parallel interface, 8080/6800 modes • LCD-TFT controller up to XGA resolution with dedicated Chrom-ART Accelerator™ for enhanced graphic content creation (DMA2D) • Clock, reset and supply management – 1.7 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – Dedicated USB power – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC (1% accuracy) – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Low-power – Sleep, Stop and Standby modes – VBAT supply for RTC, 32×32 bit backup registers + 4KB backup SRAM • 3×12-bit, 2.4 MSPS ADC: up to 24 channels and 7.2 MSPS in triple interleaved mode • 2×12-bit D/A converters • Up to 18 timers: up to thirteen 16-bit (1x lowpower 16-bit timer available in Stop mode) and two 32-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input. All 15 timers running up to 216 MHz. 2x watchdogs, SysTick timer February 2016 This is information on a product in full production. LQFP100 (14x14 mm) LQFP144 (20x20 mm) LQFP176 (24x24 mm) LQFP208 (28x28 mm) UFBGA176 (10x10 mm) TFBGA216 (13x13 mm) TFBGA100 (8x8 mm) WLCSP143 (4.5x5.8 mm) • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support • Debug mode – SWD & JTAG interfaces – Cortex®-M7 Trace Macrocell™ • Up to 168 I/O ports with interrupt capability – Up to 164 fast I/Os up to 108 MHz – Up to 166 5 V-tolerant I/Os • Up to 25 communication interfaces – Up to 4× I2C interfaces (SMBus/PMBus) – Up to 4 USARTs/4 UARTs (27 Mbit/s, ISO7816 interface, LIN, IrDA, modem control) – Up to 6 SPIs (up2to 50 Mbit/s), 3 with muxed simplex I S for audio class accuracy via internal audio PLL or external clock – 2 x SAIs (serial audio interface) – 2 × CANs (2.0B active) and SDMMC interface – SPDIFRX interface – HDMI-CEC • Advanced connectivity – USB 2.0 full-speed device/host/OTG controller with on-chip PHY – USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI – 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII • 8- to 14-bit parallel camera interface up to 54 Mbyte/s • Cryptographic acceleration: hardware acceleration for AES 128, 192, 256, triple DES, HASH (MD5, SHA-1, SHA-2), and HMAC • True random number generator • CRC calculation unit • RTC: subsecond accuracy, hardware calendar • 96-bit unique ID Table 1. Device summary Reference STM32F756xx DocID027589 Rev 4 Part number STM32F756VG, STM32F756ZG, STM32F756IG, STM32F756BG, STM32F756NG 1/228 www.st.com Contents STM32F756xx Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 1.1 2 Full compatibility throughout the family . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.1 ARM® Cortex®-M7 with FPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.2 Memory protection unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.3 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.4 CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . . 18 2.5 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.6 AXI-AHB bus matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.7 DMA controller (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2.8 Flexible memory controller (FMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.9 Quad-SPI memory interface (QUADSPI) . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.10 LCD-TFT controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.11 Chrom-ART Accelerator™ (DMA2D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.12 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . . 22 2.13 External interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.14 Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.15 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.16 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.17 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 2.18 2.17.1 Internal reset ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 2.17.2 Internal reset OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2.18.1 Regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2.18.2 Regulator OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 2.18.3 Regulator ON/OFF and internal reset ON/OFF availability . . . . . . . . . . 30 2.19 Real-time clock (RTC), backup SRAM and backup registers . . . . . . . . . . 30 2.20 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 2.21 VBAT operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2.22 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2.22.1 2/228 Advanced-control timers (TIM1, TIM8) . . . . . . . . . . . . . . . . . . . . . . . . . 34 DocID027589 Rev 4 STM32F756xx Contents 2.22.2 General-purpose timers (TIMx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 2.22.3 Basic timers TIM6 and TIM7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 2.22.4 Low-power timer (LPTIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 2.22.5 Independent watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 2.22.6 Window watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 2.22.7 SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 2.23 Inter-integrated circuit interface (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 2.24 Universal synchronous/asynchronous receiver transmitters (USART) . . 37 2.25 Serial peripheral interface (SPI)/inter- integrated sound interfaces (I2S) . 38 2.26 Serial audio interface (SAI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 2.27 SPDIFRX Receiver Interface (SPDIFRX) . . . . . . . . . . . . . . . . . . . . . . . . . 39 2.28 Audio PLL (PLLI2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 2.29 Audio and LCD PLL(PLLSAI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 2.30 SD/SDIO/MMC card host interface (SDMMC) . . . . . . . . . . . . . . . . . . . . . 40 2.31 Ethernet MAC interface with dedicated DMA and IEEE 1588 support . . . 40 2.32 Controller area network (bxCAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 2.33 Universal serial bus on-the-go full-speed (OTG_FS) . . . . . . . . . . . . . . . . 41 2.34 Universal serial bus on-the-go high-speed (OTG_HS) . . . . . . . . . . . . . . . 41 2.35 High-definition multimedia interface (HDMI) - consumer electronics control (CEC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 2.36 Digital camera interface (DCMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 2.37 Cryptographic acceleration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 2.38 Random number generator (RNG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 2.39 General-purpose input/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . . 43 2.40 Analog-to-digital converters (ADCs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 2.41 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 2.42 Digital-to-analog converter (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 2.43 Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . . 44 2.44 Embedded Trace Macrocell™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 3 Pinouts and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 4 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 DocID027589 Rev 4 3/228 5 Contents STM32F756xx 5.1 4/228 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 5.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 5.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 5.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 5.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 5.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 5.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 5.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 5.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 5.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 5.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 5.3.2 VCAP1/VCAP2 external capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 5.3.3 Operating conditions at power-up / power-down (regulator ON) . . . . . 102 5.3.4 Operating conditions at power-up / power-down (regulator OFF) . . . . 102 5.3.5 Reset and power control block characteristics . . . . . . . . . . . . . . . . . . 102 5.3.6 Over-drive switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 104 5.3.7 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 5.3.8 Wakeup time from low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . 122 5.3.9 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 123 5.3.10 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 128 5.3.11 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 5.3.12 PLL spread spectrum clock generation (SSCG) characteristics . . . . . 132 5.3.13 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 5.3.14 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 5.3.15 Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . 138 5.3.16 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 138 5.3.17 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139 5.3.18 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145 5.3.19 TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 5.3.20 RTC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 5.3.21 12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 5.3.22 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 5.3.23 VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 5.3.24 Reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 5.3.25 DAC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 5.3.26 Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 5.3.27 FMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 DocID027589 Rev 4 STM32F756xx 6 7 Contents 5.3.28 Quad-SPI interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 190 5.3.29 Camera interface (DCMI) timing specifications . . . . . . . . . . . . . . . . . . 192 5.3.30 LCD-TFT controller (LTDC) characteristics . . . . . . . . . . . . . . . . . . . . . 193 5.3.31 SD/SDIO MMC card host interface (SDMMC) characteristics . . . . . . . 195 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197 6.1 LQFP100, 14 x 14 mm low-profile quad flat package information . . . . . 197 6.2 TFBGA100, 8 x 8 x 0.8 mm thin fine-pitch ball grid array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 6.3 WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 6.4 LQFP144, 20 x 20 mm low-profile quad flat package information . . . . . 206 6.5 LQFP176, 24 x 24 mm low-profile quad flat package information . . . . . 209 6.6 LQFP208, 28 x 28 mm low-profile quad flat package information . . . . . 213 6.7 UFBGA 176+25, 10 x 10 x 0.65 mm ultra thin-pitch ball grid array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217 6.8 TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 6.9 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 Appendix A Recommendations when using internal reset OFF . . . . . . . . . . . 225 A.1 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226 DocID027589 Rev 4 5/228 5 List of tables STM32F756xx List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 41. 6/228 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 STM32F756xx features and peripheral counts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Voltage regulator configuration mode versus device operating mode . . . . . . . . . . . . . . . . 27 Regulator ON/OFF and internal reset ON/OFF availability. . . . . . . . . . . . . . . . . . . . . . . . . 30 Voltage regulator modes in Stop mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 I2C implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 USART implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 STM32F756xx pin and ball definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 FMC pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 STM32F756xx alternate function mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 STM32F756xx register boundary addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Limitations depending on the operating power supply range . . . . . . . . . . . . . . . . . . . . . . 101 VCAP1/VCAP2 operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Operating conditions at power-up / power-down (regulator ON) . . . . . . . . . . . . . . . . . . . 102 Operating conditions at power-up / power-down (regulator OFF). . . . . . . . . . . . . . . . . . . 102 reset and power control block characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Over-drive switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Typical and maximum current consumption in Run mode, code with data processing running from ITCM RAM, regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Typical and maximum current consumption in Run mode, code with data processing running from Flash memory (ART ON except prefetch / L1-cache ON) or SRAM on AXI (L1-cache ON), regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Typical and maximum current consumption in Run mode, code with data processing running from Flash memory or SRAM on AXI (L1-cache disabled), regulator ON . . . . . 107 Typical and maximum current consumption in Run mode, code with data processing running from Flash memory on ITCM interface (ART disabled), regulator ON . . . . . . . . 108 Typical and maximum current consumption in Run mode, code with data processing running from Flash memory (ART ON except prefetch / L1-cache ON) or SRAM on AXI (L1-cache ON), regulator OFF. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Typical and maximum current consumption in Sleep mode, regulator ON. . . . . . . . . . . . 110 Typical and maximum current consumption in Sleep mode, regulator OFF . . . . . . . . . . . 110 Typical and maximum current consumptions in Stop mode . . . . . . . . . . . . . . . . . . . . . . . 111 Typical and maximum current consumptions in Standby mode . . . . . . . . . . . . . . . . . . . . 112 Typical and maximum current consumptions in VBAT mode. . . . . . . . . . . . . . . . . . . . . . . 113 Switching output I/O current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 HSE 4-26 MHz oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 HSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 DocID027589 Rev 4 STM32F756xx Table 42. Table 43. Table 44. Table 45. Table 46. Table 47. Table 48. Table 49. Table 50. Table 51. Table 52. Table 53. Table 54. Table 55. Table 56. Table 57. Table 58. Table 59. Table 60. Table 61. Table 62. Table 63. Table 64. Table 65. Table 66. Table 67. Table 68. Table 69. Table 70. Table 71. Table 72. Table 73. Table 74. Table 75. Table 76. Table 77. Table 78. Table 79. Table 80. Table 81. Table 82. Table 83. Table 84. Table 85. Table 86. Table 87. Table 88. Table 89. Table 90. Table 91. Table 92. Table 93. List of tables LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 Main PLL characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 PLLI2S characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 PLLISAI characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 SSCG parameters constraint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 Flash memory programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 Flash memory programming with VPP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138 Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138 I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139 I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139 Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145 TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 RTC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 ADC static accuracy at fADC = 18 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 ADC static accuracy at fADC = 30 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 ADC static accuracy at fADC = 36 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149 ADC dynamic accuracy at fADC = 18 MHz - limited test conditions . . . . . . . . . . . . . . . . . 149 ADC dynamic accuracy at fADC = 36 MHz - limited test conditions . . . . . . . . . . . . . . . . . 149 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 Internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 Minimum I2CCLK frequency in all I2C modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156 SPI dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157 I2S dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 SAI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 USB OTG full speed startup time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 USB OTG full speed DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 USB OTG full speed electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 USB HS DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 USB HS clock timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Dynamic characteristics: USB ULPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 Dynamics characteristics: Ethernet MAC signals for SMI. . . . . . . . . . . . . . . . . . . . . . . . . 168 Dynamics characteristics: Ethernet MAC signals for RMII . . . . . . . . . . . . . . . . . . . . . . . . 168 Dynamics characteristics: Ethernet MAC signals for MII . . . . . . . . . . . . . . . . . . . . . . . . . 169 Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . 172 Asynchronous non-multiplexed SRAM/PSRAM/NOR read - NWAIT timings . . . . . . . . . . 172 Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . 173 Asynchronous non-multiplexed SRAM/PSRAM/NOR write - NWAIT timings. . . . . . . . . . 174 Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . 175 Asynchronous multiplexed PSRAM/NOR read-NWAIT timings . . . . . . . . . . . . . . . . . . . . 175 DocID027589 Rev 4 7/228 8 List of tables Table 94. Table 95. Table 96. Table 97. Table 98. Table 99. Table 100. Table 101. Table 102. Table 103. Table 104. Table 105. Table 106. Table 107. Table 108. Table 109. Table 110. Table 111. Table 112. Table 113. Table 114. Table 115. Table 116. Table 117. Table 118. Table 119. Table 120. Table 121. Table 122. Table 123. Table 124. Table 125. Table 126. Table 127. 8/228 STM32F756xx Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . 176 Asynchronous multiplexed PSRAM/NOR write-NWAIT timings . . . . . . . . . . . . . . . . . . . . 177 Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181 Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 182 Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184 Switching characteristics for NAND Flash read cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . 186 Switching characteristics for NAND Flash write cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . 186 SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 LPSDR SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 SDRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 LPSDR SDRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190 Quad-SPI characteristics in SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190 Quad-SPI characteristics in DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191 DCMI characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 LTDC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193 Dynamic characteristics: SD / MMC characteristics, VDD=2.7V to 3.6V . . . . . . . . . . . . . 196 Dynamic characteristics: eMMC characteristics, VDD=1.71V to 1.9V . . . . . . . . . . . . . . . 196 LQPF100, 14 x 14 mm 100-pin low-profile quad flat package mechanical data. . . . . . . . 198 TFBGA100, 8 x 8 × 0.8 mm thin fine-pitch ball grid array package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 TFBGA100 recommended PCB design rules (0.8 mm pitch BGA). . . . . . . . . . . . . . . . . . 202 WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 WLCSP143 recommended PCB design rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209 LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213 UFBGA 176+25, 10 × 10 × 0.65 mm ultra thin fine-pitch ball grid array package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217 UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA) . . . . . . . . . . . . . 218 TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 TFBGA216 recommended PCB design rules (0.8 mm pitch BGA). . . . . . . . . . . . . . . . . . 221 Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 Limitations depending on the operating power supply range . . . . . . . . . . . . . . . . . . . . . . 225 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226 DocID027589 Rev 4 STM32F756xx List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Compatible board design for LQFP100 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 STM32F756xx block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 STM32F756xx AXI-AHB bus matrix architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 VDDUSB connected to VDD power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 VDDUSB connected to external power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Power supply supervisor interconnection with internal reset OFF . . . . . . . . . . . . . . . . . . . 25 PDR_ON control with internal reset OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Regulator OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Startup in regulator OFF: slow VDD slope - power-down reset risen after VCAP_1/VCAP_2 stabilization . . . . . . . . . . . . . . . . . . . . . . . . 29 Startup in regulator OFF mode: fast VDD slope - power-down reset risen before VCAP_1/VCAP_2 stabilization . . . . . . . . . . . . . . . . . . . . . . 29 STM32F756Vx LQFP100 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 STM32F756Vx TFBGA100 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 STM32F756Zx WLCSP143 ballout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 STM32F756Zx LQFP144 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 STM32F756Ix LQFP176 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 STM32F756Bx LQFP208 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 STM32F756Ix UFBGA176 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 STM32F756Nx TFBGA216 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 External capacitor CEXT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 Typical VBAT current consumption (RTC ON/BKP SRAM OFF and LSE in low drive mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Typical VBAT current consumption (RTC ON/BKP SRAM OFF and LSE in medium low drive mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Typical VBAT current consumption (RTC ON/BKP SRAM OFF and LSE in medium high drive mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 Typical VBAT current consumption (RTC ON/BKP SRAM OFF and LSE in high drive mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 Typical VBAT current consumption (RTC ON/BKP SRAM OFF and LSE in high medium drive mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 HSI deviation versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 LSI deviation versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 PLL output clock waveforms in center spread mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133 PLL output clock waveforms in down spread mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 FT I/O input characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145 ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 DocID027589 Rev 4 9/228 11 List of figures Figure 42. Figure 43. Figure 44. Figure 45. Figure 46. Figure 47. Figure 48. Figure 49. Figure 50. Figure 51. Figure 52. Figure 53. Figure 54. Figure 55. Figure 56. Figure 57. Figure 58. Figure 59. Figure 60. Figure 61. Figure 62. Figure 63. Figure 64. Figure 65. Figure 66. Figure 67. Figure 68. Figure 69. Figure 70. Figure 71. Figure 72. Figure 73. Figure 74. Figure 75. Figure 76. Figure 77. Figure 78. Figure 79. Figure 80. Figure 81. Figure 82. Figure 83. Figure 84. Figure 85. Figure 86. 10/228 STM32F756xx Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 Power supply and reference decoupling (VREF+ not connected to VDDA). . . . . . . . . . . . . 151 Power supply and reference decoupling (VREF+ connected to VDDA). . . . . . . . . . . . . . . . 151 12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 SPI timing diagram - slave mode and CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 SPI timing diagram - master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 SAI master timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 SAI slave timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 USB OTG full speed timings: definition of data signal rise and fall time . . . . . . . . . . . . . . 165 ULPI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Ethernet SMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 Ethernet RMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 Ethernet MII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169 Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms . . . . . . . . . . . . . . 171 Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms . . . . . . . . . . . . . . 173 Asynchronous multiplexed PSRAM/NOR read waveforms. . . . . . . . . . . . . . . . . . . . . . . . 174 Asynchronous multiplexed PSRAM/NOR write waveforms . . . . . . . . . . . . . . . . . . . . . . . 176 Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 182 Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183 NAND controller waveforms for read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 NAND controller waveforms for write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 NAND controller waveforms for common memory read access . . . . . . . . . . . . . . . . . . . . 185 NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . 186 SDRAM read access waveforms (CL = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187 SDRAM write access waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 Quad-SPI timing diagram - SDR mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 Quad-SPI timing diagram - DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 DCMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193 LCD-TFT horizontal timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194 LCD-TFT vertical timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194 SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195 SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195 LQFP100, 14 x 14 mm 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 197 LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 TFBGA100, 8 × 8 × 0.8 mm thin fine-pitch ball grid array package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 TFBGA100, 8 x 8 x 0.8 mm thin fine-pitch ball grid array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201 TFBGA100, 8 × 8 × 0.8mm thin fine-pitch ball grid array package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 DocID027589 Rev 4 STM32F756xx List of figures Figure 87. WLCSP143, 0.4 mm pitch wafer level chip scale package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 Figure 88. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 206 Figure 89. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 Figure 90. LQFP144, 20 x 20mm, 144-pin low-profile quad flat package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208 Figure 91. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 209 Figure 92. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211 Figure 93. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212 Figure 94. LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 213 Figure 95. LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215 Figure 96. LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216 Figure 97. UFBGA 176+25, 10 × 10 × 0.65 mm ultra thin fine-pitch ball grid array package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217 Figure 98. UFBGA176+25, 10 x 10 x 0.65 mm, ultra fine-pitch ball grid array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218 Figure 99. UFBGA 176+25, 10 × 10 × 0.6 mm ultra thin fine-pitch ball grid array package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219 Figure 100. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 Figure 101. TFBGA216, 13 x 13 x 0.8 mm thin fine-pitch ball grid array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221 Figure 102. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222 DocID027589 Rev 4 11/228 11 Description 1 STM32F756xx Description The STM32F756xx devices are based on the high-performance ARM® Cortex®-M7 32-bit RISC core operating at up to 216 MHz frequency. The Cortex®-M7 core features a single floating point unit (SFPU) precision which supports all ARM® single-precision dataprocessing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances the application security. The STM32F756xx devices incorporate high-speed embedded memories with a Flash memory up to 1 Mbyte, 320 Kbytes of SRAM (including 64 Kbytes of Data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multiAHB bus matrix and a multi layer AXI interconnect supporting internal and external memories access. All the devices offer three 12-bit ADCs, two DACs, a low-power RTC, thirteen generalpurpose 16-bit timers including two PWM timers for motor control and one low-power timer available in Stop mode, two general-purpose 32-bit timers, a true random number generator (RNG), and a cryptographic acceleration cell. They also feature standard and advanced communication interfaces. • • • • • • • • • • • • Up to four I2Cs Six SPIs, three I2Ss in duplex mode. To achieve the audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL or via an external clock to allow synchronization. Four USARTs plus four UARTs An USB OTG full-speed and a USB OTG high-speed with full-speed capability (with the ULPI), Two CANs Two SAI serial audio interfaces An SDMMC host interface Ethernet and camera interfaces LCD-TFT display controller Chrom-ART Accelerator™ SPDIFRX interface HDMI-CEC Advanced peripherals include an SDMMC interface, a flexible memory control (FMC) interface, a Quad-SPI Flash memory interface, a camera interface for CMOS sensors and a cryptographic acceleration cell. Refer to Table 2: STM32F756xx features and peripheral counts for the list of peripherals available on each part number. The STM32F756xx devices operate in the –40 to +105 °C temperature range from a 1.7 to 3.6 V power supply. A dedicated supply input for USB (OTG_FS and OTG_HS) is available on all the packages except LQFP100 for a greater power supply choice. The supply voltage can drop to 1.7 V with the use of an external power supply supervisor (refer to Section 2.17.2: Internal reset OFF). A comprehensive set of power-saving mode allows the design of low-power applications. The STM32F756xx devices offer devices in 8 packages ranging from 100 pins to 216 pins. The set of included peripherals changes with the device chosen. 12/228 DocID027589 Rev 4 STM32F756xx Description These features make the STM32F756xx microcontrollers suitable for a wide range of applications: • Motor drive and application control, • Medical equipment, • Industrial applications: PLC, inverters, circuit breakers, • Printers, and scanners, • Alarm systems, video intercom, and HVAC, • Home audio appliances, • Mobile applications, Internet of Things, • Wearable devices: smartwatches. Figure 2 shows the general block diagram of the device family. Table 2. STM32F756xx features and peripheral counts Peripherals Flash memory in Kbytes SRAM in Kbytes STM32F756Vx STM32F756Zx STM32F756Ix 512 512 512 1024 1024 320(240+16+64) Instruction 16 Backup 4 General-purpose 10 Advancedcontrol 2 Basic 2 Low-power 1 512 1024 Yes SPI / I2S 4/3 (simplex)(2) 6/3 (simplex)(2) I2C 4 USART/UART 4/4 USB OTG FS Yes USB OTG HS Yes CAN 2 SAI 2 SPDIFRX 4 inputs SDMMC Yes Camera interface Yes LCD-TFT Yes Chrom-ART Accelerator™ (DMA2D) Yes Cryptography Yes 82 114 12-bit ADC Number of channels 1024 Yes Random number generator GPIOs 512 STM32F756Nx Yes(1) Ethernet Communication interfaces 1024 System FMC memory controller Timers STM32F756Bx 140 168 3 16 DocID027589 Rev 4 24 13/228 45 Description STM32F756xx Table 2. STM32F756xx features and peripheral counts (continued) Peripherals STM32F756Vx STM32F756Zx 12-bit DAC Number of channels STM32F756Bx STM32F756Nx Yes 2 216 MHz(3) Maximum CPU frequency 1.7 to 3.6 V(4) Operating voltage Ambient temperatures: –40 to +85 °C /–40 to +105 °C Operating temperatures Package STM32F756Ix Junction temperature: –40 to + 125 °C LQFP100 TFBGA100 WLCSP143 LQFP144 UFBGA176 LQFP176 LQFP208 TFBGA216 1. For the LQFP100 package, only FMC Bank1 is available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. 2. The SPI1, SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode. 3. 216 MHz maximum frequency for -40°C to + 85°C ambient temperature range (200 MHz maximum frequency for -40°C to + 105°C ambient temperature range). 4. VDD/VDDA minimum value of 1.7 V is obtained when the internal reset is OFF (refer to Section 2.17.2: Internal reset OFF). 14/228 DocID027589 Rev 4 STM32F756xx Full compatibility throughout the family The STM32F756xx devices are fully pin-to-pin, compatible with the STM32F4xxxx devices, allowing the user to try different peripherals, and reaching higher performances (higher frequency) for a greater degree of freedom during the development cycle. Figure 1 give compatible board designs between the STM32F4xx families. Figure 1. Compatible board design for LQFP100 package 3& 9'' 966$ 95() 9''$ 3$:.83 3$ 3$ 670)[[670)[[ 670)[[670)[[ 670)[[670)[[ 670)[[670)[[                 9'' 3% 9&$3 3% 3( 3( 3( 3( 3( 3( 3( 3( 3( 3% 3% 3& 3% 3& 3$ 3$ 3$ 3$ 9'' 3$ 3& 966$ 95() 9''$ 3$:.83 3$ 3$ 3$ 966  670)[[ 3LQVWRDUHQRWFRPSDWLEOH 9'' 966 9&$3 3% 3% 3( 3( 3( 3( 3( 3( 3( 3( 3( 3% 3% 3% 3& 3& 3$ 3$ 3$ 3$ 9''  966 1.1 Description 06Y9 The STM32F756xx LQFP144, LQFP176, LQFP208, TFBGA216, UFBGA176, WLCSP143 packages are fully pin to pin compatible with STM32F4xxxx devices. DocID027589 Rev 4 15/228 45 Description STM32F756xx Figure 2. STM32F756xx block diagram :d'Θ^t dDZDϲϰ^,ϭD h^ >ͺZ΀ϳ͗Ϭ΁͕>ͺ'΀ϳ͗Ϭ΁͕>ͺ΀ϳ͗Ϭ΁͕ ,^zE͕s^zE ĂŵĞƌĂ ŝŶƚĞƌĨĂĐĞ ^ZDϮϭϲϯϮŬ,nj Zd W/΀ϭϱ͗Ϭ΁ K^ϯϮͺKhd >^ W'΀ϭϱ͗Ϭ΁ yd>K^ W>>ϭ͕Ϯ͕ϯ 'W/KWKZd sсϭ͘ϳͬϭ͘ϴƚŽϯ͘ϲs Λs ^ƵƉƉůLJ Z 'W/KWKZd W΀ϭϱ͗Ϭ΁ sh^сϯ͘ϬƚŽϯ͘ϲs sŽůƚĂŐĞ ƌĞŐƵůĂƚŽƌ ϭ͘Ϯs Λs ;DϮͿ D /͕sh^͕^K& >< W΀ϭϱ͗Ϭ΁ ,^, Zd W,z ,W ϭϬͬϭϬϬ W,z h>W/͗@ WVX5;' WVX&56 WLK5;' WLK&56 50,,B5;'>@ 9 50,,B&56B' DL Table 86. Dynamics characteristics: Ethernet MAC signals for RMII(1) Symbol Parameter Typ Max tsu(RXD) Receive data setup time 1 - - tih(RXD) Receive data hold time 1.5 - - tsu(CRS) Carrier sense setup time 1 - - tih(CRS) Carrier sense hold time 1 - - td(TXEN) Transmit enable valid delay time 5 6 10.5 td(TXD) Transmit data valid delay time 5 6 12 1. Guaranteed by characterization results. 168/228 Min DocID027589 Rev 4 Unit ns STM32F756xx Electrical characteristics Table 87 gives the list of Ethernet MAC signals for MII and Figure 56 shows the corresponding timing diagram. Figure 57. Ethernet MII timing diagram -))?28?#,+ -))?28$;= -))?28?$6 -))?28?%2 TSU28$ TSU%2 TSU$6 TIH28$ TIH%2 TIH$6 -))?48?#,+ TD48%. TD48$ -))?48?%. -))?48$;= AI Table 87. Dynamics characteristics: Ethernet MAC signals for MII(1) Symbol Parameter Min Typ Max tsu(RXD) Receive data setup time 3 - - tih(RXD) Receive data hold time 1.5 - - tsu(DV) Data valid setup time 0 - - tih(DV) Data valid hold time 1.5 - - tsu(ER) Error setup time 1.5 - - tih(ER) Error hold time 0.5 - - td(TXEN) Transmit enable valid delay time 6.5 7 13.5 td(TXD) Transmit data valid delay time 6.5 7 13.5 Unit ns 1. Guaranteed by characterization results. CAN (controller area network) interface Refer to Section 5.3.17: I/O port characteristics for more details on the input/output alternate function characteristics (CANx_TX and CANx_RX). DocID027589 Rev 4 169/228 196 Electrical characteristics 5.3.27 STM32F756xx FMC characteristics Unless otherwise specified, the parameters given in Table 88 to Table 101 for the FMC interface are derived from tests performed under the ambient temperature, fHCLK frequency and VDD supply voltage conditions summarized in Table 17, with the following configuration: • Output speed is set to OSPEEDRy[1:0] = 11 • Measurement points are done at CMOS levels: 0.5VDD Refer to Section 5.3.17: I/O port characteristics for more details on the input/output characteristics. Asynchronous waveforms and timings Figure 58 through Figure 61 represent asynchronous waveforms and Table 88 through Table 95 provide the corresponding timings. The results shown in these tables are obtained with the following FMC configuration: • AddressSetupTime = 0x1 • AddressHoldTime = 0x1 • DataSetupTime = 0x1 (except for asynchronous NWAIT mode , DataSetupTime = 0x5) • BusTurnAroundDuration = 0x0 • Capcitive load CL = 30 pF In all timing tables, the THCLK is the HCLK clock period 170/228 DocID027589 Rev 4 STM32F756xx Electrical characteristics Figure 58. Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms TW.% &-#?.% TV./%?.% T W./% T H.%?./% &-#?./% &-#?.7% TV!?.% &-#?!;= T H!?./% !DDRESS TV",?.% T H",?./% &-#?.",;= T H$ATA?.% T SU$ATA?./% TH$ATA?./% T SU$ATA?.% $ATA &-#?$;= T V.!$6?.% TW.!$6 &-#?.!$6  &-#?.7!)4 TH.%?.7!)4 TSU.7!)4?.% -36 1. Mode 2/B, C and D only. In Mode 1, FMC_NADV is not used. DocID027589 Rev 4 171/228 196 Electrical characteristics STM32F756xx Table 88. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings(1) Symbol Min Max 2THCLK− 0.5 2 THCLK+1.5 0 1 2THCLK− 1 2THCLK+ 1 FMC_NOE high to FMC_NE high hold time 0 - FMC_NEx low to FMC_A valid - 0.5 th(A_NOE) Address hold time after FMC_NOE high 0 - tv(BL_NE) FMC_NEx low to FMC_BL valid - 0.5 th(BL_NOE) FMC_BL hold time after FMC_NOE high 0 - tsu(Data_NE) Data to FMC_NEx high setup time THCLK - 2 - tsu(Data_NOE) Data to FMC_NOEx high setup time THCLK -2 - th(Data_NOE) Data hold time after FMC_NOE high 0 - th(Data_NE) Data hold time after FMC_NEx high 0 - tv(NADV_NE) FMC_NEx low to FMC_NADV low - 0 FMC_NADV low time - THCLK +1 tw(NE) tv(NOE_NE) tw(NOE) th(NE_NOE) tv(A_NE) tw(NADV) Parameter FMC_NE low time FMC_NEx low to FMC_NOE low FMC_NOE low time Unit ns 1. CL = 30 pF. Table 89. Asynchronous non-multiplexed SRAM/PSRAM/NOR read - NWAIT timings(1) Symbol Min Max FMC_NE low time 7THCLK −1 7THCLK FMC_NWE low time 5THCLK −1 5THCLK +1 FMC_NWAIT low time THCLK −0.5 tsu(NWAIT_NE) FMC_NWAIT valid before FMC_NEx high 5THCLK +1.5 - th(NE_NWAIT) FMC_NEx hold time after FMC_NWAIT invalid 4THCLK+1 - tw(NE) tw(NOE) tw(NWAIT) Parameter 1. Guaranteed by characterization results. 172/228 DocID027589 Rev 4 Unit ns STM32F756xx Electrical characteristics Figure 59. Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms TW.% &-#?.%X &-#?./% TV.7%?.% TW.7% T H.%?.7% &-#?.7% TV!?.% &-#?!;= TH!?.7% !DDRESS TV",?.% &-#?.",;= TH",?.7% .", TV$ATA?.% TH$ATA?.7% $ATA &-#?$;= T V.!$6?.% &-#?.!$6  TW.!$6 &-#?.7!)4 TH.%?.7!)4 TSU.7!)4?.% -36 1. Mode 2/B, C and D only. In Mode 1, FMC_NADV is not used. Table 90. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings(1) Symbol tw(NE) tv(NWE_NE) tw(NWE) th(NE_NWE) tv(A_NE) Parameter Min Max FMC_NE low time 3THCLK−0.5 3THCLK+1.5 FMC_NEx low to FMC_NWE low THCLK−0.5 THCLK+ 1 FMC_NWE low time THCLK−0.5 THCLK+ 1 FMC_NWE high to FMC_NE high hold time THCLK −0.5 - - 0 THCLK−0.5 - - 0 THCLK−0.5 - FMC_NEx low to FMC_A valid th(A_NWE) Address hold time after FMC_NWE high tv(BL_NE) FMC_NEx low to FMC_BL valid th(BL_NWE) FMC_BL hold time after FMC_NWE high tv(Data_NE) Data to FMC_NEx low to Data valid - THCLK+ 3 th(Data_NWE) Data hold time after FMC_NWE high THCLK+0.5 - tv(NADV_NE) FMC_NEx low to FMC_NADV low - 0 FMC_NADV low time - THCLK+ 0.5 tw(NADV) Unit ns 1. Guaranteed by characterization results. DocID027589 Rev 4 173/228 196 Electrical characteristics STM32F756xx Table 91. Asynchronous non-multiplexed SRAM/PSRAM/NOR write - NWAIT timings(1) Symbol Parameter tw(NE) tw(NWE) Min Max FMC_NE low time 8THCLK−0.5 8THCLK+1.5 FMC_NWE low time 6THCLK−0.5 6THCLK+1 tsu(NWAIT_NE) FMC_NWAIT valid before FMC_NEx high 6THCLK−1 - th(NE_NWAIT) FMC_NEx hold time after FMC_NWAIT invalid 4THCLK+2 - Unit ns 1. Guaranteed by characterization results. Figure 60. Asynchronous multiplexed PSRAM/NOR read waveforms TW.% &-#? .% TV./%?.% T H.%?./% &-#?./% T W./% &-#?.7% TH!?./% TV!?.% &-#? !;= !DDRESS TV",?.% TH",?./% &-#? .",;= .", TH$ATA?.% TSU$ATA?.% T V!?.% &-#? !$;= TSU$ATA?./% TH$ATA?./% $ATA !DDRESS TH!$?.!$6 T V.!$6?.% TW.!$6 &-#?.!$6 &-#?.7!)4 TH.%?.7!)4 TSU.7!)4?.% -36 174/228 DocID027589 Rev 4 STM32F756xx Electrical characteristics Table 92. Asynchronous multiplexed PSRAM/NOR read timings(1) Symbol tw(NE) tv(NOE_NE) ttw(NOE) th(NE_NOE) tv(A_NE) tv(NADV_NE) tw(NADV) Parameter Min Max 3THCLK−0.5 3THCLK+1.5 FMC_NEx low to FMC_NOE low 2THCLK−1 2THCLK+0.5 FMC_NOE low time THCLK−0.5 THCLK+0.5 FMC_NOE high to FMC_NE high hold time 0 - FMC_NEx low to FMC_A valid - 0.5 FMC_NEx low to FMC_NADV low 0 0.5 THCLK−0.5 THCLK+1.5 FMC_NE low time FMC_NADV low time th(AD_NADV) FMC_AD(address) valid hold time after FMC_NADV high) 0 - th(A_NOE) Address hold time after FMC_NOE high THCLK−0.5 - th(BL_NOE) FMC_BL time after FMC_NOE high 0 - FMC_NEx low to FMC_BL valid - 0.5 tv(BL_NE) tsu(Data_NE) Data to FMC_NEx high setup time THCLK−2 - tsu(Data_NOE) Data to FMC_NOE high setup time THCLK−2 - th(Data_NE) Data hold time after FMC_NEx high 0 - th(Data_NOE) Data hold time after FMC_NOE high 0 - Unit ns 1. Guaranteed by characterization results. Table 93. Asynchronous multiplexed PSRAM/NOR read-NWAIT timings(1) Symbol tw(NE) tw(NOE) Parameter Min Max FMC_NE low time 8THCLK−1 8THCLK+2 FMC_NWE low time 5THCLK−1 5THCLK +1 5THCLK +1.5 - 4THCLK+1 - tsu(NWAIT_NE) FMC_NWAIT valid before FMC_NEx high th(NE_NWAIT) FMC_NEx hold time after FMC_NWAIT invalid Unit ns 1. Guaranteed by characterization results. DocID027589 Rev 4 175/228 196 Electrical characteristics STM32F756xx Figure 61. Asynchronous multiplexed PSRAM/NOR write waveforms TW.% &-#? .%X &-#?./% TV.7%?.% TW.7% T H.%?.7% &-#?.7% TH!?.7% TV!?.% &-#? !;= !DDRESS TV",?.% TH",?.7% &-#? .",;= .", T V!?.% &-#? !$;= T V$ATA?.!$6 !DDRESS TH$ATA?.7% $ATA TH!$?.!$6 T V.!$6?.% TW.!$6 &-#?.!$6 &-#?.7!)4 TH.%?.7!)4 TSU.7!)4?.% -36 Table 94. Asynchronous multiplexed PSRAM/NOR write timings(1) Symbol tw(NE) tv(NWE_NE) tw(NWE) th(NE_NWE) tv(A_NE) tv(NADV_NE) tw(NADV) th(AD_NADV) 176/228 Parameter Min Max 4THCLK−0.5 4THCLK+1.5 THCLK−1 THCLK+0.5 2THCLK−0.5 2THCLK+0.5 THCLK - FMC_NEx low to FMC_A valid - 0 FMC_NEx low to FMC_NADV low 0 0.5 THCLK−0.5 THCLK+ 1.5 THCLK−2 - FMC_NE low time FMC_NEx low to FMC_NWE low FMC_NWE low time FMC_NWE high to FMC_NE high hold time FMC_NADV low time FMC_AD(adress) valid hold time after FMC_NADV high) th(A_NWE) Address hold time after FMC_NWE high THCLK - th(BL_NWE) FMC_BL hold time after FMC_NWE high THCLK−2 - tv(BL_NE) FMC_NEx low to FMC_BL valid - 0 tv(Data_NADV) FMC_NADV high to Data valid - THCLK +2 th(Data_NWE) Data hold time after FMC_NWE high THCLK +0.5 - DocID027589 Rev 4 Unit ns STM32F756xx Electrical characteristics 1. Guaranteed by characterization results. Table 95. Asynchronous multiplexed PSRAM/NOR write-NWAIT timings(1) Symbol tw(NE) tw(NWE) Parameter FMC_NE low time FMC_NWE low time Min Max 9THCLK 9THCLK+1.5 7THCLK–0.5 7THCLK+0.5 tsu(NWAIT_NE) FMC_NWAIT valid before FMC_NEx high 6THCLK+2 - th(NE_NWAIT) FMC_NEx hold time after FMC_NWAIT invalid 4THCLK–1 - Unit ns 1. Guaranteed by characterization results. Synchronous waveforms and timings Figure 62 through Figure 65 represent synchronous waveforms and Table 96 through Table 99 provide the corresponding timings. The results shown in these tables are obtained with the following FMC configuration: • BurstAccessMode = FMC_BurstAccessMode_Enable; • MemoryType = FMC_MemoryType_CRAM; • WriteBurst = FMC_WriteBurst_Enable; • CLKDivision = 1; • DataLatency = 1 for NOR Flash; DataLatency = 0 for PSRAM • CL = 30 pF on data and address lines. CL = 10 pF on FMC_CLK unless otherwise specified. In all timing tables, the THCLK is the HCLK clock period. – For 2.7 V≤VDD≤3.6 V, maximum FMC_CLK = 108 MHz at CL=20 pF or 90 MHz at CL=30 pF (on FMC_CLK). – For 1.71 V≤VDD@ 2OWN #OL #OL #OLI #OLN TH3$#,+,?!DD# TH3$#,+,?3.$% TD3$#,+,?3.$% &-#?3$.%;= TH3$#,+,?.2!3 TD3$#,+,?.2!3 &-#?3$.2!3 TD3$#,+,?.#!3 TH3$#,+,?.#!3 TD3$#,+,?.7% TH3$#,+,?.7% &-#?3$.#!3 &-#?3$.7% TD3$#,+,?$ATA $ATA &-#?$;= $ATA $ATAI $ATAN TH3$#,+,?$ATA TD3$#,+,?.", &-#?.",;= -36 Table 104. SDRAM write timings(1) Symbol Parameter Min Max tw(SDCLK) FMC_SDCLK period 2THCLK−0.5 2THCLK+0.5 td(SDCLKL _Data) Data output valid time - 2 th(SDCLKL _Data) Data output hold time 0.5 - td(SDCLKL_Add) Address valid time - 4 td(SDCLKL_SDNWE) SDNWE valid time - 0.5 th(SDCLKL_SDNWE) SDNWE hold time 0 - td(SDCLKL_ SDNE) Chip select valid time - 0.5 th(SDCLKL-_SDNE) Chip select hold time 0 - td(SDCLKL_SDNRAS) SDNRAS valid time - 0.5 th(SDCLKL_SDNRAS) SDNRAS hold time 0 - td(SDCLKL_SDNCAS) SDNCAS valid time - 0.5 td(SDCLKL_SDNCAS) SDNCAS hold time 0 - Unit ns 1. Guaranteed by characterization results. DocID027589 Rev 4 189/228 196 Electrical characteristics STM32F756xx Table 105. LPSDR SDRAM write timings(1) Symbol Parameter Min Max Unit tw(SDCLK) FMC_SDCLK period 2THCLK−0.5 2THCLK+0.5 td(SDCLKL _Data) Data output valid time - 4 th(SDCLKL _Data) Data output hold time 0 - td(SDCLKL_Add) Address valid time - 3.5 td(SDCLKL-SDNWE) SDNWE valid time - 0.5 th(SDCLKL-SDNWE) SDNWE hold time 0 - td(SDCLKL- SDNE) Chip select valid time - 0.5 th(SDCLKL- SDNE) Chip select hold time 0 - td(SDCLKL-SDNRAS) SDNRAS valid time - 0.5 th(SDCLKL-SDNRAS) SDNRAS hold time 0 - td(SDCLKL-SDNCAS) SDNCAS valid time - 0.5 td(SDCLKL-SDNCAS) SDNCAS hold time 0 - ns 1. Guaranteed by characterization results. 5.3.28 Quad-SPI interface characteristics Unless otherwise specified, the parameters given in Table 106 and Table 107 for Quad-SPI are derived from tests performed under the ambient temperature, fAHB frequency and VDD supply voltage conditions summarized in Table 17: General operating conditions, with the following configuration: • Output speed is set to OSPEEDRy[1:0] = 11 • Capacitive load C = 20 pF • Measurement points are done at CMOS levels: 0.5 ₓ VDD Refer to Section 5.3.17: I/O port characteristics for more details on the input/output alternate function characteristics. Table 106. Quad-SPI characteristics in SDR mode(1) Symbol Fck1/t(CK) 190/228 Parameter Quad-SPI clock frequency Conditions Min Typ Max 2.7 V≤VDD