STM32H743ZGT6

STM32H742xI/G STM32H743xI/G 32-bit Arm® Cortex®-M7 480MHz MCUs, up to 2MB Flash, up to 1MB RAM, 46 com. and analog interfaces Datasheet - production data Features Includes ST state-of-the-art patented technology Core • 32-bit Arm® Cortex®-M7 core with doubleprecision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache; frequency up to 480 MHz, MPU, 1027 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions LQFP100 (14 x 14 mm) LQFP144 (20 x 20 mm) LQFP176 (24 x 24 mm) LQFP208 (28 x 28 mm) TFBGA100 (8 x 8 mm)(1) TFBGA240+25 (14 x 14 mm) UFBGA169 (7 x 7 mm) UFBGA176+25 (10 x 10 mm) – D2: communication peripherals and timers – D3: reset/clock control/power management Memories • 1.62 to 3.6 V application supply and I/Os • Up to 2 Mbytes of Flash memory with readwhile-write support • POR, PDR, PVD and BOR • Up to 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), Up to 864 Kbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain • Embedded regulator (LDO) with configurable scalable output to supply the digital circuitry • Dual mode Quad-SPI memory interface running up to 133 MHz • Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs • Voltage scaling in Run and Stop mode (6 configurable ranges) • Backup regulator (~0.9 V) • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND Flash memory clocked up to 100 MHz in Synchronous mode • CRC calculation unit • Voltage reference for analog peripheral/VREF+ • Low-power modes: Sleep, Stop, Standby and VBAT supporting battery charging Low-power consumption • VBAT battery operating mode with charging capability Security • CPU and domain power state monitoring pins • ROP, PC-ROP, active tamper • 2.95 µA in Standby mode (Backup SRAM OFF, RTC/LSE ON) General-purpose input/outputs • Up to 168 I/O ports with interrupt capability Clock management Reset and power management • Internal oscillators: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI • 3 separate power domains which can be independently clock-gated or switched off: – D1: high-performance capabilities March 2022 This is information on a product in full production. • External oscillators: 4-48 MHz HSE, 32.768 kHz LSE DS12110 Rev 9 1/361 www.st.com STM32H742xI/G STM32H743xI/G • 3× PLLs (1 for the system clock, 2 for kernel clocks) with Fractional mode Graphics Interconnect matrix • Chrom-ART graphical hardware Accelerator (DMA2D) to reduce CPU load • 3 bus matrices (1 AXI and 2 AHB) • Bridges (5× AHB2-APB, 2× AXI2-AHB) • LCD-TFT controller up to XGA resolution • Hardware JPEG Codec 4 DMA controllers to unload the CPU Up to 22 timers and watchdogs • 1× high-speed master direct memory access controller (MDMA) with linked list support • 1× high-resolution timer (2.1 ns max resolution) • 2× dual-port DMAs with FIFO • 2× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to 240 MHz) • 1× basic DMA with request router capabilities • 2× 16-bit advanced motor control timers (up to 240 MHz) Up to 35 communication peripherals • 4× I2Cs FM+ interfaces (SMBus/PMBus) • 4× USARTs/4x UARTs (ISO7816 interface, LIN, IrDA, up to 12.5 Mbit/s) and 1x LPUART • 6× SPIs, 3 with muxed duplex I2S audio class accuracy via internal audio PLL or external clock, 1x I2S in LP domain (up to 150 MHz) • 10× 16-bit general-purpose timers (up to 240 MHz) • 5× 16-bit low-power timers (up to 240 MHz) • 2× watchdogs (independent and window) • 1× SysTick timer • RTC with sub-second accuracy and hardware calendar • 4x SAIs (serial audio interface) • SPDIFRX interface • SWPMI single-wire protocol master I/F Debug mode • MDIO Slave interface • 2× SD/SDIO/MMC interfaces (up to 125 MHz) • 2× CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN) • 2× USB OTG interfaces (1FS, 1HS/FS) crystalless solution with LPM and BCD • Ethernet MAC interface with DMA controller • HDMI-CEC • SWD & JTAG interfaces • 4-Kbyte Embedded Trace Buffer True random number generators (3 oscillators each) 96-bit unique ID All packages are ECOPACK2 compliant • 8- to 14-bit camera interface (up to 80 MHz) Reference 11 analog peripherals • 3× ADCs with 16-bit max. resolution (up to 36 channels, up to 3.6 MSPS) • 1× temperature sensor • 2× 12-bit D/A converters (1 MHz) • 2× ultra-low-power comparators • 2× operational amplifiers (7.3 MHz bandwidth) • 1× digital filters for sigma delta modulator (DFSDM) with 8 channels/4 filters 2/361 Table 1. Device summary Part number STM32H742VI, STM32H742ZI, STM32H742II, STM32H742BI, STM32H742XI, STM32H742AI, STM32H742xI/G STM32H742VG, STM32H742ZG, STM32H742IG, STM32H742BG, STM32H742XG, STM32H742AG STM32H743VI, STM32H743ZI, STM32H743II, STM32H743BI, STM32H743XI, STM32H743AI, STM32H743xI/G STM32H743VG, STM32H743ZG, STM32H743IG, STM32H743BG, STM32H743XG, STM32H743AG DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.1 Arm® Cortex®-M7 with FPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.2 Memory protection unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.3 Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.3.1 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.3.2 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.4 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.5 Power supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.5.1 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.5.2 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.5.3 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.6 Low-power strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.7 Reset and clock controller (RCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 3.7.1 Clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 3.7.2 System reset sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 3.8 General-purpose input/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . . 32 3.9 Bus-interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 3.10 DMA controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.11 Chrom-ART Accelerator (DMA2D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.12 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . . 35 3.13 Extended interrupt and event controller (EXTI) . . . . . . . . . . . . . . . . . . . . 35 3.14 Cyclic redundancy check calculation unit (CRC) . . . . . . . . . . . . . . . . . . . 35 3.15 Flexible memory controller (FMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 3.16 Quad-SPI memory interface (QUADSPI) . . . . . . . . . . . . . . . . . . . . . . . . . 36 3.17 Analog-to-digital converters (ADCs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 3.18 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 3.19 VBAT operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 3.20 Digital-to-analog converters (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 DS12110 Rev 9 3/361 7 Contents 4 4/361 STM32H742xI/G STM32H743xI/G 3.21 Ultra-low-power comparators (COMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 3.22 Operational amplifiers (OPAMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 3.23 Digital filter for sigma-delta modulators (DFSDM) . . . . . . . . . . . . . . . . . . 39 3.24 Digital camera interface (DCMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.25 LCD-TFT controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.26 JPEG Codec (JPEG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 3.27 True random number generator (RNG) . . . . . . . . . . . . . . . . . . . . . . . . . . 41 3.28 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 3.28.1 High-resolution timer (HRTIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 3.28.2 Advanced-control timers (TIM1, TIM8) . . . . . . . . . . . . . . . . . . . . . . . . . 44 3.28.3 General-purpose timers (TIMx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 3.28.4 Basic timers TIM6 and TIM7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 3.28.5 Low-power timers (LPTIM1, LPTIM2, LPTIM3, LPTIM4, LPTIM5) . . . . 45 3.28.6 Independent watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 3.28.7 Window watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 3.28.8 SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 3.29 Real-time clock (RTC), backup SRAM and backup registers . . . . . . . . . . 46 3.30 Inter-integrated circuit interface (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 3.31 Universal synchronous/asynchronous receiver transmitter (USART) . . . 47 3.32 Low-power universal asynchronous receiver transmitter (LPUART) . . . . 48 3.33 Serial peripheral interfaces (SPI)/integrated interchip sound interfaces (I2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 3.34 Serial audio interfaces (SAI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 3.35 SPDIFRX Receiver Interface (SPDIFRX) . . . . . . . . . . . . . . . . . . . . . . . . . 50 3.36 Single wire protocol master interface (SWPMI) . . . . . . . . . . . . . . . . . . . . 50 3.37 Management Data Input/Output (MDIO) slaves . . . . . . . . . . . . . . . . . . . . 51 3.38 SD/SDIO/MMC card host interfaces (SDMMC) . . . . . . . . . . . . . . . . . . . . 51 3.39 Controller area network (FDCAN1, FDCAN2) . . . . . . . . . . . . . . . . . . . . . 51 3.40 Universal serial bus on-the-go high-speed (OTG_HS) . . . . . . . . . . . . . . . 52 3.41 Ethernet MAC interface with dedicated DMA controller (ETH) . . . . . . . . . 52 3.42 High-definition multimedia interface (HDMI) - consumer electronics control (CEC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 3.43 Debug infrastructure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Contents 5 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 6 Electrical characteristics (rev Y) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 6.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 6.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 6.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 6.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 6.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 6.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 6.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 6.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . 104 6.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 6.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 6.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 6.3.2 VCAP external capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 6.3.3 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . 107 6.3.4 Embedded reset and power control block characteristics . . . . . . . . . . 108 6.3.5 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 6.3.6 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 6.3.7 Wakeup time from low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . 123 6.3.8 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 124 6.3.9 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 128 6.3.10 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 6.3.11 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 6.3.12 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 6.3.13 Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . 135 6.3.14 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 6.3.15 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 6.3.16 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 6.3.17 FMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145 6.3.18 Quad-SPI interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 6.3.19 Delay block (DLYB) characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 6.3.20 16-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 6.3.21 DAC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 6.3.22 Voltage reference buffer characteristics . . . . . . . . . . . . . . . . . . . . . . . 175 6.3.23 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 6.3.24 Temperature and VBAT monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 DS12110 Rev 9 5/361 7 Contents 7 STM32H742xI/G STM32H743xI/G Voltage booster for analog switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 6.3.26 Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 6.3.27 Operational amplifier characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 180 6.3.28 Digital filter for Sigma-Delta Modulators (DFSDM) characteristics . . . 183 6.3.29 Camera interface (DCMI) timing specifications . . . . . . . . . . . . . . . . . . 185 6.3.30 LCD-TFT controller (LTDC) characteristics . . . . . . . . . . . . . . . . . . . . . 186 6.3.31 Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 6.3.32 Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 6.3.33 JTAG/SWD interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 203 Electrical characteristics (rev V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 7.1 6/361 6.3.25 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 7.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 7.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 7.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 7.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 7.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 7.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 7.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . 208 7.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208 7.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210 7.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210 7.3.2 VCAP external capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212 7.3.3 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . 212 7.3.4 Embedded reset and power control block characteristics . . . . . . . . . . 213 7.3.5 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214 7.3.6 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215 7.3.7 Wakeup time from low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . 227 7.3.8 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 228 7.3.9 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 232 7.3.10 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235 7.3.11 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237 7.3.12 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238 7.3.13 Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . 240 7.3.14 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 241 7.3.15 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242 7.3.16 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G 8 Contents 7.3.17 FMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249 7.3.18 Quad-SPI interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 271 7.3.19 Delay block (DLYB) characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 7.3.20 16-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 7.3.21 DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283 7.3.22 Voltage reference buffer characteristics . . . . . . . . . . . . . . . . . . . . . . . 287 7.3.23 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 288 7.3.24 Temperature and VBAT monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289 7.3.25 Voltage booster for analog switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289 7.3.26 Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290 7.3.27 Operational amplifier characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 291 7.3.28 Digital filter for Sigma-Delta Modulators (DFSDM) characteristics . . . 293 7.3.29 Camera interface (DCMI) timing specifications . . . . . . . . . . . . . . . . . . 296 7.3.30 LCD-TFT controller (LTDC) characteristics . . . . . . . . . . . . . . . . . . . . . 297 7.3.31 Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299 7.3.32 Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 319 8.1 LQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 320 8.2 TFBGA100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 8.3 LQFP144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 327 8.4 UFBGA169 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332 8.5 LQFP176 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 335 8.6 LQFP208 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 340 8.7 UFBGA176+25 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . 344 8.8 TFBGA240+25 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . 347 8.9 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350 8.9.1 Reference documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 352 9 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 354 DS12110 Rev 9 7/361 7 List of tables STM32H742xI/G STM32H743xI/G List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 41. Table 42. Table 43. Table 44. 8/361 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 STM32H742xI/G and STM32H743xI/G features and peripheral counts. . . . . . . . . . . . . . . 19 System vs domain low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 DFSDM implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 USART features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Flash memory and SRAM memory mapping for STM32H742xI/G . . . . . . . . . . . . . . . . . . . 54 Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Pin/ball definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Port A alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Port B alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 Port C alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Port D alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Port E alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Port F alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Port G alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Port H alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Port I alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Port J alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Port K alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 VCAP operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Operating conditions at power-up / power-down (regulator ON) . . . . . . . . . . . . . . . . . . . 107 Reset and power control block characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Typical and maximum current consumption in Run mode, code with data processing running from ITCM, regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Typical and maximum current consumption in Run mode, code with data processing running from Flash memory, cache ON, regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 Typical and maximum current consumption in Run mode, code with data processing running from Flash memory, cache OFF, regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . 112 Typical consumption in Run mode and corresponding performance versus code position . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 Typical current consumption batch acquisition mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 Typical and maximum current consumption in Sleep mode, regulator ON. . . . . . . . . . . . 113 Typical and maximum current consumption in Stop mode, regulator ON. . . . . . . . . . . . . 114 Typical and maximum current consumption in Standby mode . . . . . . . . . . . . . . . . . . . . . 114 Typical and maximum current consumption in VBAT mode . . . . . . . . . . . . . . . . . . . . . . . 115 Peripheral current consumption in Run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 Peripheral current consumption in Stop, Standby and VBAT mode . . . . . . . . . . . . . . . . . 122 Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 4-48 MHz HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Table 45. Table 46. Table 47. Table 48. Table 49. Table 50. Table 51. Table 52. Table 53. Table 54. Table 55. Table 56. Table 57. Table 58. Table 59. Table 60. Table 61. Table 62. Table 63. Table 64. Table 65. Table 66. Table 67. Table 68. Table 69. Table 70. Table 71. Table 72. Table 73. Table 74. Table 75. Table 76. Table 77. Table 78. Table 79. Table 80. Table 81. Table 82. Table 83. Table 84. Table 85. Table 86. Table 87. Table 88. Table 89. Table 90. Table 91. Table 92. Table 93. Table 94. Table 95. Table 96. List of tables Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 HSI48 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 CSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 PLL characteristics (wide VCO frequency range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 PLL characteristics (medium VCO frequency range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 Flash memory programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133 Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133 EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 Output voltage characteristics for all I/Os except PC13, PC14, PC15 and PI8 . . . . . . . . 139 Output voltage characteristics for PC13, PC14, PC15 and PI8 . . . . . . . . . . . . . . . . . . . . 140 Output timing characteristics (HSLV OFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 Output timing characteristics (HSLV ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . 147 Asynchronous non-multiplexed SRAM/PSRAM/NOR read - NWAIT timings . . . . . . . . . . 147 Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . 148 Asynchronous non-multiplexed SRAM/PSRAM/NOR write - NWAIT timings. . . . . . . . . . 149 Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . 150 Asynchronous multiplexed PSRAM/NOR read-NWAIT timings . . . . . . . . . . . . . . . . . . . . 150 Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . 151 Asynchronous multiplexed PSRAM/NOR write-NWAIT timings . . . . . . . . . . . . . . . . . . . . 152 Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156 Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 157 Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 Switching characteristics for NAND Flash read cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 Switching characteristics for NAND Flash write cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . 161 SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 LPSDR SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 SDRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 LPSDR SDRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 QUADSPI characteristics in SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 QUADSPI characteristics in DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Dynamics characteristics: Delay Block characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169 DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 DAC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173 VREFBUF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 VBAT charging characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 Temperature monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 DS12110 Rev 9 9/361 12 List of tables Table 97. Table 98. Table 99. Table 100. Table 101. Table 102. Table 103. Table 104. Table 105. Table 106. Table 107. Table 108. Table 109. Table 110. Table 111. Table 112. Table 113. Table 114. Table 115. Table 116. Table 117. Table 118. Table 119. Table 120. Table 121. Table 122. Table 123. Table 124. Table 125. Table 126. Table 127. Table 128. Table 129. Table 130. Table 131. Table 132. Table 133. Table 134. Table 135. Table 136. Table 137. Table 138. Table 139. Table 140. Table 141. Table 142. 10/361 STM32H742xI/G STM32H743xI/G Voltage booster for analog switch characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 COMP characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 OPAMP characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 DFSDM measured timing - 1.62-3.6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183 DCMI characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 LTDC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186 TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 Minimum i2c_ker_ck frequency in all I2C modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 SPI dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190 I2S dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193 SAI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195 MDIO Slave timing parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196 Dynamic characteristics: SD / MMC characteristics, VDD = 2.7 to 3.6 V . . . . . . . . . . . . . 197 Dynamic characteristics: eMMC characteristics, VDD = 1.71 to 1.9 V . . . . . . . . . . . . . . . 198 USB OTG_FS electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 Dynamic characteristics: USB ULPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 Dynamics characteristics: Ethernet MAC signals for SMI. . . . . . . . . . . . . . . . . . . . . . . . . 201 Dynamics characteristics: Ethernet MAC signals for RMII . . . . . . . . . . . . . . . . . . . . . . . . 202 Dynamics characteristics: Ethernet MAC signals for MII . . . . . . . . . . . . . . . . . . . . . . . . . 203 Dynamics JTAG characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 Dynamics SWD characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208 Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210 Supply voltage and maximum frequency configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 211 VCAP operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212 Operating conditions at power-up / power-down (regulator ON) . . . . . . . . . . . . . . . . . . . 212 Reset and power control block characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214 Internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215 Typical and maximum current consumption in Run mode, code with data processing running from ITCM, LDO regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216 Typical and maximum current consumption in Run mode, code with data processing running from Flash memory, cache ON, LDO regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217 Typical and maximum current consumption in Run mode, code with data processing running from Flash memory, cache OFF, LDO regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217 Typical and maximum current consumption batch acquisition mode, LDO regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218 Typical and maximum current consumption in Stop, LDO regulator ON . . . . . . . . . . . . . 218 Typical and maximum current consumption in Sleep mode, LDO regulator. . . . . . . . . . . 219 Typical and maximum current consumption in Standby . . . . . . . . . . . . . . . . . . . . . . . . . . 219 Typical and maximum current consumption in VBAT mode . . . . . . . . . . . . . . . . . . . . . . . 220 Peripheral current consumption in Run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222 Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227 High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228 Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 4-48 MHz HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230 Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Table 143. Table 144. Table 145. Table 146. Table 147. Table 148. Table 149. Table 150. Table 151. Table 152. Table 153. Table 154. Table 155. Table 156. Table 157. Table 158. Table 159. Table 160. Table 161. Table 162. Table 163. Table 164. Table 165. Table 166. Table 167. Table 168. Table 169. Table 170. Table 171. Table 172. Table 173. Table 174. Table 175. Table 176. Table 177. Table 178. Table 179. Table 180. Table 181. Table 182. Table 183. Table 184. Table 185. Table 186. Table 187. Table 188. Table 189. Table 190. Table 191. Table 192. Table 193. Table 194. List of tables HSI48 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232 HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233 CSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233 LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234 PLL characteristics (wide VCO frequency range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235 PLL characteristics (medium VCO frequency range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236 Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237 Flash memory programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237 Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238 EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238 EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240 Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240 I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241 I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242 Output voltage characteristics for all I/Os except PC13, PC14, PC15 and PI8 . . . . . . . . 244 Output voltage characteristics for PC13, PC14, PC15 and PI8 . . . . . . . . . . . . . . . . . . . . 245 Output timing characteristics (HSLV OFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 246 Output timing characteristics (HSLV ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249 Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . 251 Asynchronous non-multiplexed SRAM/PSRAM/NOR read-NWAIT timings . . . . . . . . . . . 251 Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . 253 Asynchronous non-multiplexed SRAM/PSRAM/NOR write-NWAIT timings. . . . . . . . . . . 253 Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . 255 Asynchronous multiplexed PSRAM/NOR read-NWAIT timings . . . . . . . . . . . . . . . . . . . . 255 Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . 256 Asynchronous multiplexed PSRAM/NOR write-NWAIT timings . . . . . . . . . . . . . . . . . . . . 256 Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 258 Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260 Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 262 Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264 Switching characteristics for NAND Flash read cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . 267 Switching characteristics for NAND Flash write cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . 267 SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269 LPSDR SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269 SDRAM Write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270 LPSDR SDRAM Write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271 QUADSPI characteristics in SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272 QUADSPI characteristics in DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273 Delay Block characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 Minimum sampling time vs RAIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278 ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280 DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283 DAC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 285 VREFBUF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288 Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288 VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289 VBAT charging characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289 Temperature monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289 DS12110 Rev 9 11/361 12 List of tables Table 195. Table 196. Table 197. Table 198. Table 199. Table 200. Table 201. Table 202. Table 203. Table 204. Table 205. Table 206. Table 207. Table 208. Table 209. Table 210. Table 211. Table 212. Table 213. Table 214. Table 215. Table 216. Table 217. Table 218. Table 219. Table 220. Table 221. Table 222. Table 223. Table 224. Table 225. Table 226. Table 227. Table 228. Table 229. Table 230. Table 231. 12/361 STM32H742xI/G STM32H743xI/G Voltage booster for analog switch characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289 COMP characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290 Operational amplifier characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291 DFSDM measured timing - 1.62-3.6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 294 DCMI characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296 LTDC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297 TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299 Minimum i2c_ker_ck frequency in all I2C modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 USART characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 SPI dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 303 I2S dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306 SAI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 307 MDIO Slave timing parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 309 Dynamics characteristics: SD / MMC characteristics, VDD = 2.7 to 3.6 V . . . . . . . . . . . . 310 Dynamics characteristics: eMMC characteristics VDD = 1.71V to 1.9V . . . . . . . . . . . . . . 311 USB OTG_FS electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 313 Dynamics characteristics: USB ULPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 313 Dynamics characteristics: Ethernet MAC signals for SMI . . . . . . . . . . . . . . . . . . . . . . . . 314 Dynamics characteristics: Ethernet MAC signals for RMII . . . . . . . . . . . . . . . . . . . . . . . . 315 Dynamics characteristics: Ethernet MAC signals for MII . . . . . . . . . . . . . . . . . . . . . . . . . 316 Dynamics JTAG characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317 Dynamics SWD characteristics: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317 LQFP100 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 321 TFBGA100 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 TFBGA100 - Recommended PCB design rules (0.8 mm pitch BGA) . . . . . . . . . . . . . . . . 325 LQFP144 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 328 UFBGA169 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332 UFBGA169 - Recommended PCB design rules (0.5 mm pitch BGA). . . . . . . . . . . . . . . . 333 LQFP176 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 336 LQFP208 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 341 UFBGA(176+25) - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 344 UFBGA176+25 - Recommended PCB design rules (0.65 mm pitch BGA) . . . . . . . . . . . 345 TFBG240+25 - Mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348 TFBGA240+25 - Recommended PCB design rules (0.8 mm pitch BGA). . . . . . . . . . . . . 349 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 354 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. Figure 45. Figure 46. Figure 47. STM32H742xI/G block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 STM32H743xI/G block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Power-up/power-down sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 STM32H743xI/G bus matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 TFBGA100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 LQFP144 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 UFBGA169 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 LQFP176 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 UFBGA176+25 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 LQFP208 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 TFBGA240+25 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 External capacitor CEXT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 VIL/VIH for all I/Os except BOOT0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138 Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms . . . . . . . . . . . . . . 146 Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms . . . . . . . . . . . . . . 148 Asynchronous multiplexed PSRAM/NOR read waveforms. . . . . . . . . . . . . . . . . . . . . . . . 149 Asynchronous multiplexed PSRAM/NOR write waveforms . . . . . . . . . . . . . . . . . . . . . . . 151 Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 157 Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 NAND controller waveforms for read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 NAND controller waveforms for write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 NAND controller waveforms for common memory read access . . . . . . . . . . . . . . . . . . . . 160 NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . 161 SDRAM read access waveforms (CL = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 SDRAM write access waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 Quad-SPI timing diagram - SDR mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Quad-SPI timing diagram - DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 Typical connection diagram when using the ADC with FT/TT pins featuring analog switch function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 Power supply and reference decoupling (VREF+ not connected to VDDA). . . . . . . . . . . . . 171 Power supply and reference decoupling (VREF+ connected to VDDA). . . . . . . . . . . . . . . . 171 12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 Channel transceiver timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184 DCMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 LCD-TFT horizontal timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187 DS12110 Rev 9 13/361 15 List of figures Figure 48. Figure 49. Figure 50. Figure 51. Figure 52. Figure 53. Figure 54. Figure 55. Figure 56. Figure 57. Figure 58. Figure 59. Figure 60. Figure 61. Figure 62. Figure 63. Figure 64. Figure 65. Figure 66. Figure 67. Figure 68. Figure 69. Figure 70. Figure 71. Figure 72. Figure 73. Figure 74. Figure 75. Figure 76. Figure 77. Figure 78. Figure 79. Figure 80. Figure 81. Figure 82. Figure 83. Figure 84. Figure 85. Figure 86. Figure 87. Figure 88. Figure 89. Figure 90. Figure 91. Figure 92. Figure 93. Figure 94. Figure 95. Figure 96. Figure 97. Figure 98. 14/361 STM32H742xI/G STM32H743xI/G LCD-TFT vertical timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187 SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191 SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194 I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194 SAI master timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196 SAI slave timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196 MDIO Slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197 SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 ULPI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201 Ethernet SMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 Ethernet RMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 Ethernet MII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 JTAG timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 SWD timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208 External capacitor CEXT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212 High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 228 Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231 Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232 VIL/VIH for all I/Os except BOOT0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243 Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249 Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms . . . . . . . . . . . . . . 250 Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms . . . . . . . . . . . . . . 252 Asynchronous multiplexed PSRAM/NOR read waveforms. . . . . . . . . . . . . . . . . . . . . . . . 254 Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 257 Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259 Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 261 Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263 NAND controller waveforms for read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265 NAND controller waveforms for write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266 NAND controller waveforms for common memory read access . . . . . . . . . . . . . . . . . . . . 266 NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . 267 SDRAM read access waveforms (CL = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 268 SDRAM write access waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270 QUADSPI timing diagram - SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273 Quad-SPI timing diagram - DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281 Typical connection diagram when using the ADC with FT/TT pins featuring analog switch function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281 Power supply and reference decoupling (VREF+ not connected to VDDA). . . . . . . . . . . . . 282 Power supply and reference decoupling (VREF+ connected to VDDA). . . . . . . . . . . . . . . . 282 12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 286 Channel transceiver timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 295 DCMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Figure 99. Figure 100. Figure 101. Figure 102. Figure 103. Figure 104. Figure 105. Figure 106. Figure 107. Figure 108. Figure 109. Figure 110. Figure 111. Figure 112. Figure 113. Figure 114. Figure 115. Figure 116. Figure 117. Figure 118. Figure 119. Figure 120. Figure 121. Figure 122. Figure 123. Figure 124. Figure 125. Figure 126. Figure 127. Figure 128. Figure 129. Figure 130. Figure 131. Figure 132. Figure 133. Figure 134. Figure 135. Figure 136. Figure 137. Figure 138. Figure 139. Figure 140. Figure 141. Figure 142. Figure 143. List of figures LCD-TFT horizontal timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 298 LCD-TFT vertical timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 298 USART timing diagram in Master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 USART timing diagram in Slave mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 302 SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305 I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306 I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 307 SAI master timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 309 SAI slave timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 309 MDIO Slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 310 SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312 SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312 DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312 ULPI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314 Ethernet SMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 315 Ethernet RMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 315 Ethernet MII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 316 JTAG timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317 SWD timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 318 LQFP100 - Outline(15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 320 LQFP100 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 322 LQFP100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323 TFBGA100 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 TFBGA100 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 TFBGA100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 326 LQFP144 - Outline(15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 327 LQFP144 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 330 LQFP144 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 331 UFBGA169 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332 UFBGA169 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333 UFBGA169 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 334 LQFP176 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 335 LQFP176 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338 LQFP176 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 339 LQFP208 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 340 LQFP208 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 342 LQFP208 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 343 UFBGA176+25 - Outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 344 UFBGA176+25 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345 UFBGA176+25 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . 346 TFBGA240+25 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 347 TFBGA240+25 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348 TFBGA240+25 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . 349 DS12110 Rev 9 15/361 15 Introduction 1 STM32H742xI/G STM32H743xI/G Introduction This document provides information on STM32H742xI/G STM32H743xI/G microcontrollers, such as description, functional overview, pin assignment and definition, electrical characteristics, packaging, and ordering information. This document should be read in conjunction with the STM32H742xI/G STM32H743xI/G reference manual (RM0433), available from the STMicroelectronics website www.st.com. For information on the device errata with respect to the datasheet and reference manual, refer to the STM32H742xI/G STM32H743xI/G errata sheet (ES0392), available on the STMicroelectronics website www.st.com. For information on the Arm®(a) Cortex®-M7 core, please refer to the Cortex®-M7 Technical Reference Manual, available from the http://www.arm.com website. a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere. 16/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G 2 Description Description STM32H742xI/G and STM32H743xI/G devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 480 MHz. The Cortex® -M7 core features a floating point unit (FPU) which supports Arm® double-precision (IEEE 754 compliant) and single-precision data-processing instructions and data types. STM32H742xI/G and STM32H743xI/G devices support a full set of DSP instructions and a memory protection unit (MPU) to enhance application security. STM32H742xI/G and STM32H743xI/G devices incorporate high-speed embedded memories with a dual-bank Flash memory of up to 2 Mbytes, up to 1 Mbyte of RAM (including 192 Kbytes of TCM RAM, up to 864 Kbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access. All the devices offer three ADCs, two DACs, two ultra-low power comparators, a low-power RTC, a high-resolution timer, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG). The devices support four digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces. • • Standard peripherals – Four I2Cs – Four USARTs, four UARTs and one LPUART – Six SPIs, three I2Ss in Half-duplex mode. To achieve audio class accuracy, the I2S peripherals can be clocked by a dedicated internal audio PLL or by an external clock to allow synchronization. – Four SAI serial audio interfaces – One SPDIFRX interface – One SWPMI (Single Wire Protocol Master Interface) – Management Data Input/Output (MDIO) slaves – Two SDMMC interfaces – A USB OTG full-speed and a USB OTG high-speed interface with full-speed capability (with the ULPI) – One FDCAN plus one TT-FDCAN interface – An Ethernet interface – Chrom-ART Accelerator – HDMI-CEC Advanced peripherals including – A flexible memory control (FMC) interface – A Quad-SPI Flash memory interface – A camera interface for CMOS sensors – An LCD-TFT display controller (only available on STM32H743xI/G) – A JPEG hardware compressor/decompressor (only available on STM32H743xI/G) Refer to Table 2: STM32H742xI/G and STM32H743xI/G features and peripheral counts for the list of peripherals available on each part number. DS12110 Rev 9 17/361 54 Description STM32H742xI/G STM32H743xI/G STM32H742xI/G and STM32H743xI/G devices operate in the –40 to +85 °C temperature range from a 1.62 to 3.6 V power supply. The supply voltage can drop down to 1.62 V by using an external power supervisor (see Section 3.5.2: Power supply supervisor) and connecting the PDR_ON pin to VSS. Otherwise the supply voltage must stay above 1.71 V with the embedded power voltage detector enabled. Dedicated supply inputs for USB (OTG_FS and OTG_HS) are available on all packages except LQFP100 to allow a greater power supply choice. A comprehensive set of power-saving modes allows the design of low-power applications. STM32H742xI/G and STM32H743xI/G devices are offered in 8 packages ranging from 100 pins to 240 pins/balls. The set of included peripherals changes with the device chosen. These features make STM32H742xI/G and STM32H743xI/G microcontrollers suitable for a wide range of applications: • Motor drive and application control • Medical equipment • Industrial applications: PLC, inverters, circuit breakers • Printers, and scanners • Alarm systems, video intercom, and HVAC • Home audio appliances • Mobile applications, Internet of Things • Wearable devices: smart watches. Figure 1 and Figure 2 shows the device block diagrams. 18/361 DS12110 Rev 9 Flash memory in Kbytes DS12110 Rev 9 SRAM in Kbytes TCM RAM in Kbytes 2 x 512 Kbytes 384 512 384 512 SRAM1 (D2 domain) 32 128 32 128 SRAM2 (D2 domain) 16 128 16 128 SRAM3 (D2 domain) - 32 - 32 SRAM4 (D3 domain) 64 64 64 64 ITCM RAM (instruction) 64 64 64 64 DTCM RAM (data) 128 128 128 128 Backup SRAM (Kbytes) 4 FMC Yes(1) 82 114 131 140 168 82 STM32H743XI 2 x 1 Mbyte SRAM mapped onto AXI bus GPIOs STM32H743BI STM32H743II STM32H743AI STM32H743ZI STM32H743VI STM32H742XI STM32H742BI STM32H742II STM32H742AI STM32H742ZI STM32H 742VI STM32H743XG STM32H743BG STM32H743IG STM32H743AG STM32H743ZG STM32H743VG STM32H742XG STM32H742BG STM32H742IG STM32H742AG STM32H742ZG STM32H 742VG Peripherals 114 131 140 168 82 Quad-SPI interface Yes Ethernet Yes 114 131 140 168 82 114 131 140 STM32H742xI/G STM32H743xI/G Table 2. STM32H742xI/G and STM32H743xI/G features and peripheral counts 168 Description 19/361 Timers DS12110 Rev 9 1 Generalpurpose 10 Advancedcontrol (PWM) 2 Basic 2 Low-power 5 Random number generator 4 2 5 2 6 3 4 2 5 2 6 3 4 2 5 2 6 3 4 2 5 2 STM32H743XI STM32H743BI STM32H743II STM32H743AI STM32H743ZI STM32H743VI STM32H742XI STM32H742BI STM32H742II STM32H742AI STM32H742ZI STM32H 742VI STM32H743XG STM32H743BG STM32H743IG STM32H743AG STM32H743ZG STM32H743VG STM32H742XG STM32H742BG STM32H742IG STM32H742AG STM32H742ZG Highresolution Tamper pins Wakeup pins 6 3 Yes SPI / I2S 6/3(2) I2C 4 USART/ UART/ LPUART 4/4 /1 SAI 4 SPDIFRX 4 inputs SWPMI Yes MDIO Yes SDMMC 2 FDCAN/TTFDCAN 1/1 USB OTG_FS Yes USB OTG_HS Yes STM32H742xI/G STM32H743xI/G Communication interfaces STM32H 742VG Peripherals Description 20/361 Table 2. STM32H742xI/G and STM32H743xI/G features and peripheral counts (continued) Ethernet and camera interface LCD-TFT - Yes - Yes - Yes - Yes Chrom-ART Accelerator (DMA2D) Yes 2 3 11 2 9 17 2 9 21 4 9 23 2 3 11 2 9 17 2 9 21 4 9 23 2 3 11 Yes 2 Comparators 2 Operational amplifiers 2 2 9 21 4 9 23 2 3 11 2 9 17 2 9 21 4 9 23 Yes 480MHz 1.71 to 3.6 V(5) 1.71 to 3.6 V(5) 1.62 to 3.6 V(6) (3)(4) /400 MHz 1.71 to 3.6 V(5) 1.62 to 3.6 V(6) 1.62 to 3.6 V(6) 1.62 to 3.6 V(6) Ambient temperatures: –40 up to +85 °C(7) Operating temperatures TFBGA240+25 LQFP208 UFBGA169 LQFP144 TFBGA240+25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 TFBGA240+25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 LQFP100 TFBGA100 TFBGA240+25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 LQFP100 TFBGA100 Junction temperature: –40 to + 125 °C Description 21/361 1.71 to 3.6 V(5) LQFP176 UFBGA176+25 Maximum CPU frequency Package 2 9 17 LQFP100 TFBGA100 DFSDM LQFP100 TFBGA100 DS12110 Rev 9 3 12-bit DAC Number of channels Operating voltage STM32H743XI Yes JPEG Codec 16-bit ADCs Number of Direct channels Number of Fast channels Number of Slow channels STM32H743BI STM32H743II STM32H743AI STM32H743ZI STM32H743VI STM32H742XI STM32H742BI STM32H742II STM32H742AI STM32H742ZI STM32H 742VI STM32H743XG STM32H743BG STM32H743IG STM32H743AG STM32H743ZG STM32H743VG STM32H742XG STM32H742BG STM32H742IG STM32H742AG STM32H742ZG STM32H 742VG Peripherals STM32H742xI/G STM32H743xI/G Table 2. STM32H742xI/G and STM32H743xI/G features and peripheral counts (continued) 2. The SPI1, SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode. 3. The maximum CPU frequency of 480 MHz can be obtained on devices revision V. 4. The product junction temperature must be kept within the –40 to +105 °C temperature range. 5. Since the LQFP100 package does not feature the PDR_ON pin (tied internally to VDD), the minimum VDD value for this package is 1.71 V. 6. VDD/VDDA can drop down to 1.62 V by using an external power supervisor (see Section 3.5.2: Power supply supervisor) and connecting PDR_ON pin to VSS. Otherwise the supply voltage must stay above 1.71 V with the embedded power voltage detector enabled. 7. The product junction temperature must be kept within the –40 to +125 °C temperature range. Description 22/361 1. SDRAM is not available on LQFP144 package. DS12110 Rev 9 STM32H742xI/G STM32H743xI/G STM32H742xI/G STM32H743xI/G Description Figure 1. STM32H742xI/G block diagram MII / RMII To APB1-2 peripherals MDIO as AF AHB1 D-TCM 64KB D-TCM 64KB DMA1 AXIM 1 MB FLASH D-Cache 16KB WWDG SDMMC_D[7:0],SDMMC_D[7:3,1]Dir SDMMC_D0dir, SDMMC_D2dir CMD, CMDdir, CK, Ckin, CKio as AF FMC_signals Quad-SPI RNG SRAM1 32 KB CLK, CS,D[7:0] 32b AXI/AHB34 (240MHz) TIM6 16b 16b TIM7 16b 16b SWPMI 32b 16b A P B 10 MHz 3 DAP AHB4 TIM1/PWM 16b 16b CRC ADC3 RX, TX as AF UART7 RX, TX as AF RX, TX as AF SPI2/I2S2 MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF SPI3/I2S3 MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF SCL, SDA, SMBAL as AF I2C2/SMBUS I2C3/SMBUS MDIOs FDCAN2 4 KB BKP RAM SPDIFRX1 IN[1:4] as AF HDMI-CEC SAI4 LPTIM3_OUT as AF LPTIM3 AHB/APB VREF I2C4 MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF SPI6/I2S6 RX, TX, CK, CTS, RTS as AF LPUART1 LPTIM2 LPTIM1 CEC as AF DAC_OUT1, DAC_OUT2 as AF 16b OPAMP1&2 @VDD33 VDD12 BBgen + POWER MNGT PWRCTRL RCC Reset & control COMP1&2 LPTIM4 TX, RX TX, RX USBCR 64 KB SRAM GPIO PORTK LPTIM5 SCL, SDA, SMBAL as AF SCL, SDA, SMBAL as AF MDC, MDIO TT-FDCAN1 DAC GPIO PORTA.. J RX, TX, SCK CTS, RTS as AF RX, TX as AF I2C1/SMBUS RAM I/F 32-bit AHB BUS-MATRIX HSEM APB1 120 MHz (max) 10 KB SRAM AHB4 AHB4 AHB4 BDMA SPI1/I2S1 LPTIM4_OUT as AF LPTIM2_IN1, LPTIM2_IN2 and LPTIM2_OUT AHB4 smcard irDA USART6 smcard irDA USART1 LPTIM5_OUT as AF SCL, SDA, SMBAL as AF ABP2 120 MHz (max) SPI4 DMA Mux2 RX, TX, SCK, CTS, RTS as AF UART5 UART8 Voltage regulator 3.3 to 1.2V LPTIM1_IN1, LPTIM1_IN2, LPTIM1_OUT as AF OPAMPx_VINM OPAMPx_VINP OPAMPx_VOUT as AF VDDMMC33 = 1.8 to 3.6V VDDUSB33 = 3.0 to 3.6 V VDD = 1.8 to 3.6 V VSS VCAP @VSW SYSCFG XTAL 32 kHz LS EXTI WKUP IWDG Temperature sensor @VDD CSI HSI48 HSI LSI HS RC LS RC RTC Backup registers LS SD, SCK, FS, MCLK, D[3;1], CK[2:1] as AF COMPx_INP, COMPx_INM, COMPx_OUT as AF TIM15 AHB4 (240MHz) PK[7:0] TIM17 TIM16 APB4 MHz (max) APB4 120100 MHz (max) PA..J[15:0] SPI5 TIM8/PWM irDA UART4 AHB4 (240MHz) 4 compl. chan. (TIM1_CH1[1:4]N), 4 chan. (TIM1_CH1[1:4]ETR, BKIN as AF 4 compl. chan.(TIM8_CH1[1:4]N), 4 chan. (TIM8_CH1[1:4], ETR, BKIN as AF Up to 17 analog inputs common to ADC1 and 2 1 channel as AF irDA FIFO RX, TX, SCK, CTS, RTS as AF 1 channel as AF smcard AHB4 RX, TX, SCK, CTS, RTS as AF 2 channels as AF TIM13 Digital filter MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF 4 channels TIM12 USART3 SAI3 SAI1 MOSI, MISO, SCK, NSS as AF 4 channels, ETR as AF TIM5 USART2 DFSDM1 SD, SCK, FS, MCLK, D[3:1], CK[2:1] as AF 2 compl. chan.(TIM15_CH1[1:2]N), 2 chan. (TIM_CH15[1:2], BKIN as AF 4 channels, ETR as AF TIM4 smcard SAI2 1 compl. chan.(TIM17_CH1N), 1 chan. (TIM17_CH1, BKIN as AF 1 compl. chan.(TIM16_CH1N), 1 chan. (TIM16_CH1, BKIN as AF 4 channels, ETR as AF TIM14 HRTIM1 SD, SCK, FS, MCLK, CK[2:1] as AF MOSI, MISO, SCK, NSS as AF TIM2 TIM3 AHB/APB FIFO FIFO FIFO HRTIM1_CH[A..E]x HRTIM1_FLT[5:1], HRTIM1_FLT[5:1]_in, SYSFLT DFSDM1_CKOUT, DFSDM1_DATAIN[0:7], DFSDM1_CKIN[0:7] SD, SCK, FS, MCLK, D/CK[4:1] as AF 16b 16b APB4 100 MHz (max) HSYNC, VSYNC, PIXCLK, D[13:0] AHB2 (240MHz) DCMI Up to 20 analog inputs common to ADC1 & 2 ADC2 AHB/APB Delay block SRAM2 16 KB ADC1 FIFO SDMMC1 DMA/ FIFO AHB/APB AHB3 FIFO DMA Mux1 FMC 64-bit AXI BUS-MATRIX CHROM-ART (DMA2D) DMA/ FIFO FIFO 32-bit AHB BUS-MATRIX 384 KB AXI SRAM AHBS 16 Streams FIFO MDMA PHY OTG_FS 1 MB FLASH ETM I-Cache 16KB DMA/ FIFO 8 Stream 8 Stream FIFOs FIFOs AXI/AHB12 (240MHz) AHB2 (240MHz) TRACECK TRACED[3:0] PHY ETHER SDMMC2 OTG_HS MAC AHBP Arm CPU Cortex-M7 480 MHz JTAG/SW AHB4 (240MHz) JTRST, JTDI, JTCK/SWCLK JTDO/SWD, JTDO DMA2 (240MHz) AHB1 (240MHz) I-TCM 64KB DP, DM, STP, SDMMC_ NXT,ULPI:CK DP, DM, ID, D[7:0], VBUS , D[7:0], DIR, CMD, CK as AF ID, VBUS AWU OSC32_IN OSC32_OUT RTC_TS RTC_TAMP[1:3] RTC_OUT RTC_REFIN VBAT = 1.8 to 3.6 V @VDD XTAL OSC 4- 48 MHz PLL1+PLL2+PLL3 OSC_IN OSC_OUT WDG_LS_D1 @VDD POR reset Int SUPPLY SUPERVISION POR/PDR/BOR PVD VDDA, VSSA NRESET WKUP[5:0] MSv48805V6 DS12110 Rev 9 23/361 54 Description STM32H742xI/G STM32H743xI/G Figure 2. STM32H743xI/G block diagram MII / RMII To APB1-2 peripherals MDIO as AF AHB1 I-TCM 64KB D-TCM 64KB D-TCM 64KB DMA1 DMA2 DP, DM, STP, SDMMC_ NXT,ULPI:CK DP, DM, ID, D[7:0], VBUS , D[7:0], DIR, CMD, CK as AF ID, VBUS (240MHz) PHY ETHER SDMMC2 OTG_HS MAC PHY OTG_FS AHBP Up to 1 MB FLASH I-Cache 16KB Up to 1 MB FLASH D-Cache 16KB LCD-TFT WWDG SDMMC_D[7:0],SDMMC_D[7:3,1]Dir SDMMC_D0dir, SDMMC_D2dir CMD, CMDdir, CK, Ckin, CKio as AF FIFO JPEG FMC_signals Quad-SPI RNG SRAM1 SRAM2 SRAM3 128 KB 128 KB 32 KB ADC1 CLK, CS,D[7:0] 32b AXI/AHB34 (240MHz) TIM6 16b 16b TIM7 16b 16b AHB/APB SWPMI FIFO SDMMC1 32b 16b Delay block DCMI A P B 10 MHz 3 DAP AHB4 16b HSEM 16b CRC ADC3 RX, TX as AF UART7 RX, TX as AF RX, TX as AF SPI2/I2S2 MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF SPI3/I2S3 MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF SCL, SDA, SMBAL as AF I2C2/SMBUS I2C3/SMBUS MDIOs MDC, MDIO TT-FDCAN1 FDCAN2 4 KB BKP RAM SPDIFRX1 LPTIM3 AHB/APB VREF I2C4 MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF SPI6/I2S6 RX, TX, CK, CTS, RTS as AF LPUART1 LPTIM2 LPTIM1 CEC as AF DAC_OUT1, DAC_OUT2 as AF 16b OPAMP1&2 @VDD33 VDD12 BBgen + POWER MNGT PWRCTRL RCC Reset & control COMP1&2 LPTIM3_OUT as AF TX, RX TX, RX IN[1:4] as AF HDMI-CEC SAI4 LPTIM4 SCL, SDA, SMBAL as AF SCL, SDA, SMBAL as AF USBCR 64 KB SRAM GPIO PORTK LPTIM5 RX, TX, SCK CTS, RTS as AF RX, TX as AF DAC GPIO PORTA.. J RX, TX, SCK, CTS, RTS as AF UART5 I2C1/SMBUS RAM I/F 32-bit AHB BUS-MATRIX AHB4 (240MHz) TIM1/PWM TIM8/PWM irDA UART8 APB1 120 MHz (max) 10 KB SRAM BDMA SPI1/I2S1 smcard irDA USART6 smcard irDA USART1 LPTIM4_OUT as AF LPTIM2_IN1, LPTIM2_IN2 and LPTIM2_OUT AHB4 AHB4 SPI4 DMA Mux2 AHB4 TIM15 AHB4 TIM17 TIM16 LPTIM5_OUT as AF SCL, SDA, SMBAL as AF APB2 120 MHz (max) SPI5 Voltage regulator 3.3 to 1.2V LPTIM1_IN1, LPTIM1_IN2, LPTIM1_OUT as AF OPAMPx_VINM OPAMPx_VINP OPAMPx_VOUT as AF VDDMMC33 = 1.8 to 3.6V VDDUSB33 = 3.0 to 3.6 V VDD = 1.8 to 3.6 V VSS VCAP @VSW SYSCFG XTAL 32 kHz LS EXTI WKUP IWDG Temperature sensor @VDD CSI HSI48 HSI LSI HS RC LS RC RTC Backup registers LS SD, SCK, FS, MCLK, D[3;1], CK[2:1] as AF COMPx_INP, COMPx_INM, COMPx_OUT as AF irDA UART4 AHB4 (240MHz) PK[7:0] 1 channel as AF USART3 APB4 MHz (max) APB4 120100 MHz (max) PA..J[15:0] 1 channel as AF FIFO RX, TX, SCK, CTS, RTS as AF 4 compl. chan. (TIM1_CH1[1:4]N), 4 chan. (TIM1_CH1[1:4]ETR, BKIN as AF 4 compl. chan.(TIM8_CH1[1:4]N), 4 chan. (TIM8_CH1[1:4], ETR, BKIN as AF Up to 17 analog inputs common to ADC1 and 2 2 channels as AF TIM13 smcard AHB4 RX, TX, SCK, CTS, RTS as AF 4 channels TIM12 Digital filter MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF 4 channels, ETR as AF TIM5 USART2 SAI3 SAI1 MOSI, MISO, SCK, NSS as AF 4 channels, ETR as AF TIM4 TIM14 16b DFSDM1 SD, SCK, FS, MCLK, D[3:1], CK[2:1] as AF 2 compl. chan.(TIM15_CH1[1:2]N), 2 chan. (TIM_CH15[1:2], BKIN as AF 4 channels, ETR as AF smcard SAI2 1 compl. chan.(TIM17_CH1N), 1 chan. (TIM17_CH1, BKIN as AF 1 compl. chan.(TIM16_CH1N), 1 chan. (TIM16_CH1, BKIN as AF TIM2 TIM3 AHB/APB HRTIM1 SD, SCK, FS, MCLK, CK[2:1] as AF MOSI, MISO, SCK, NSS as AF 16b FIFO FIFO FIFO HRTIM1_CH[A..E]x HRTIM1_FLT[5:1], HRTIM1_FLT[5:1]_in, SYSFLT DFSDM1_CKOUT, DFSDM1_DATAIN[0:7], DFSDM1_CKIN[0:7] SD, SCK, FS, MCLK, D/CK[4:1] as AF AHB2 (240MHz) APB4 100 MHz (max) HSYNC, VSYNC, PIXCLK, D[13:0] Up to 20 analog inputs common to ADC1 & 2 ADC2 AHB/APB AHB3 LCD_R[7:0], LCD_G[7:0], LCD_B[7:0], LCD_HSYNC, LCD_VSYNC, LCD_DE, LCD_CLK FIFO FMC 64-bit AXI BUS-MATRIX CHROM-ART (DMA2D) DMA/ FIFO 32-bit AHB BUS-MATRIX DMA Mux1 512 KB AXI SRAM AHBS 16 Streams FIFO MDMA DMA/ FIFO FIFO AHB1 (240MHz) AXIM ETM DMA/ FIFO 8 Stream 8 Stream FIFOs FIFOs AXI/AHB12 (240MHz) Arm CPU Cortex-M7 480 MHz AHB2 (240MHz) TRACECK TRACED[3:0] JTAG/SW AHB4 (240MHz) JTRST, JTDI, JTCK/SWCLK JTDO/SWD, JTDO AWU OSC32_IN OSC32_OUT RTC_TS RTC_TAMP[1:3] RTC_OUT RTC_REFIN VBAT = 1.8 to 3.6 V @VDD XTAL OSC 4- 48 MHz PLL1+PLL2+PLL3 OSC_IN OSC_OUT WDG_LS_D1 @VDD POR reset Int SUPPLY SUPERVISION POR/PDR/BOR PVD VDDA, VSSA NRESET WKUP[5:0] MSv41922V13 24/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Functional overview 3 Functional overview 3.1 Arm® Cortex®-M7 with FPU The Arm® Cortex®-M7 with double-precision FPU processor is the latest generation of Arm processors for embedded systems. It was developed to provide a low-cost platform that meets the needs of MCU implementation, with a reduced pin count and optimized power consumption, while delivering outstanding computational performance and low interrupt latency. The Cortex®-M7 processor is a highly efficient high-performance featuring: • Six-stage dual-issue pipeline • Dynamic branch prediction • Harvard architecture with L1 caches (16 Kbytes of I-cache and 16 Kbytes of D-cache) • 64-bit AXI interface • 64-bit ITCM interface • 2x32-bit DTCM interfaces The following memory interfaces are supported: • Separate Instruction and Data buses (Harvard Architecture) to optimize CPU latency • Tightly Coupled Memory (TCM) interface designed for fast and deterministic SRAM accesses • AXI Bus interface to optimize Burst transfers • Dedicated low-latency AHB-Lite peripheral bus (AHBP) to connect to peripherals. The processor supports a set of DSP instructions which allow efficient signal processing and complex algorithm execution. It also supports single and double precision FPU (floating point unit) speeds up software development by using metalanguage development tools, while avoiding saturation. Figure 1 and Figure 2 shows the general block diagram of the STM32H742xI/G and STM32H743xI/G family. Note: Cortex®-M7 with FPU core is binary compatible with the Cortex®-M4 core. 3.2 Memory protection unit (MPU) The memory protection unit (MPU) manages the CPU access rights and the attributes of the system resources. It has to be programmed and enabled before use. Its main purposes are to prevent an untrusted user program to accidentally corrupt data used by the OS and/or by a privileged task, but also to protect data processes or read-protect memory regions. The MPU defines access rules for privileged accesses and user program accesses. It allows defining up to 16 protected regions that can in turn be divided into up to 8 independent subregions, where region address, size, and attributes can be configured. The protection area ranges from 32 bytes to 4 Gbytes of addressable memory. When an unauthorized access is performed, a memory management exception is generated. DS12110 Rev 9 25/361 54 Functional overview STM32H742xI/G STM32H743xI/G 3.3 Memories 3.3.1 Embedded Flash memory The STM32H742xI/G and STM32H743xI/G devices embed up to 2 Mbytes of Flash memory that can be used for storing programs and data. The Flash memory is organized as 266-bit Flash words memory that can be used for storing both code and data constants. Each word consists of: • One Flash word (8 words, 32 bytes or 256 bits) • 10 ECC bits. The Flash memory is divided into two independent banks. Each bank is organized as follows: 3.3.2 • A user Flash memory block of 512 Kbytes (STM32H7xxxG) or 1-Mbyte (STM32H7xxxI) containing eight user sectors of 128 Kbytes (4 K Flash memory words) • 128 Kbytes of System Flash memory from which the device can boot • 2 Kbytes (64 Flash words) of user option bytes for user configuration Embedded SRAM All devices feature: • 384 (STM32H742xI/G) or 512 Kbytes (STM32H743xI/G) of AXI-SRAM mapped onto AXI bus on D1 domain. • SRAM1 mapped on D2 domain: 32 (STM32H742xI/G) or 128 Kbytes (STM32H743xI/G) • SRAM2 mapped on D2 domain: 16 (STM32H742xI/G) or 128 Kbytes (STM32H743xI/G)128 Kbytes • SRAM3 mapped on D2 domain: 32 Kbytes (STM32H743xI/G only) • SRAM4 mapped on D3 domain: 64 Kbytes • 4 Kbytes of backup SRAM The content of this area is protected against possible unwanted write accesses, and is retained in Standby or VBAT mode. • RAM mapped to TCM interface (ITCM and DTCM): Both ITCM and DTCM RAMs are 0 wait state memories. either They can be accessed either from the CPU or the MDMA (even in Sleep mode) through a specific AHB slave of the CPU(AHBP): – 64 Kbytes of ITCM-RAM (instruction RAM) This RAM is connected to ITCM 64-bit interface designed for execution of critical real-times routines by the CPU. – 128 Kbytes of DTCM-RAM (2x 64-Kbyte DTCM-RAMs on 2x32-bit DTCM ports) The DTCM-RAM could be used for critical real-time data, such as interrupt service routines or stack/heap memory. Both DTCM-RAMs can be used in parallel (for load/store operations) thanks to the Cortex®-M7 dual issue capability. The MDMA can be used to load code or data in ITCM or DTCM RAMs. 26/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Functional overview Error code correction (ECC) Over the product lifetime, and/or due to external events such as radiations, invalid bits in memories may occur. They can be detected and corrected by ECC. This is an expected behavior that has to be managed at final-application software level in order to ensure data integrity through ECC algorithms implementation. SRAM data are protected by ECC: • 7 ECC bits are added per 32-bit word. • 8 ECC bits are added per 64-bit word for AXI-SRAM and ITCM-RAM. The ECC mechanism is based on the SECDED algorithm. It supports single-error correction and double-error detection. 3.4 Boot modes At startup, the boot memory space is selected by the BOOT pin and BOOT_ADDx option bytes, allowing to program any boot memory address from 0x0000 0000 to 0x3FFF FFFF which includes: • All Flash address space • All RAM address space: ITCM, DTCM RAMs and SRAMs • The System memory bootloader The boot loader is located in non-user System memory. It is used to reprogram the Flash memory through a serial interface (USART, I2C, SPI, USB-DFU). Refer to STM32 microcontroller System memory Boot mode application note (AN2606) for details. 3.5 Power supply management 3.5.1 Power supply scheme STM32H742xI/G STM32H743xI/G power supply voltages are the following: • VDD = 1.62 to 3.6 V: external power supply for I/Os, provided externally through VDD pins. • VDDLDO = 1.62 to 3.6 V: supply voltage for the internal regulator supplying VCORE • VDDA = 1.62 to 3.6 V: external analog power supplies for ADC, DAC, COMP and OPAMP. • VDD33USB and VDD50USB: VDD50USB can be supplied through the USB cable to generate the VDD33USB via the USB internal regulator. This allows supporting a VDD supply different from 3.3 V. The USB regulator can be bypassed to supply directly VDD33USB if VDD = 3.3 V. • VBAT = 1.2 to 3.6 V: power supply for the VSW domain when VDD is not present. • VCAP: VCORE supply voltage, which values depend on voltage scaling (1.0 V, 1.1 V, 1.2 V or 1.35 V). They are configured through VOS bits in PWR_D3CR register and DS12110 Rev 9 27/361 54 Functional overview STM32H742xI/G STM32H743xI/G ODEN bit in the SYSCFG_PWRCR register. The VCORE domain is split into the following power domains that can be independently switch off. – D1 domain containing some peripherals and the Cortex®-M7 core. – D2 domain containing a large part of the peripherals. – D3 domain containing some peripherals and the system control. During power-up and power-down phases, the following power sequence requirements must be respected (see Figure 3): • When VDD is below 1 V, other power supplies (VDDA, VDD33USB, VDD50USB) must remain below VDD + 300 mV. • When VDD is above 1 V, all power supplies are independent. During the power-down phase, VDD can temporarily become lower than other supplies only if the energy provided to the microcontroller remains below 1 mJ. This allows external decoupling capacitors to be discharged with different time constants during the power-down transient phase. Figure 3. Power-up/power-down sequence V 3.6 VDDX(1) VDD VBOR0 1 0.3 Power-on Invalid supply area Operating mode VDDX < VDD + 300 mV Power-down time VDDX independent from VDD MSv47490V1 1. VDDx refers to any power supply among VDDA, VDD33USB, VDD50USB. 28/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G 3.5.2 Functional overview Power supply supervisor The devices have an integrated power-on reset (POR)/ power-down reset (PDR) circuitry coupled with a Brownout reset (BOR) circuitry: • Power-on reset (POR) The POR supervisor monitors VDD power supply and compares it to a fixed threshold. The devices remain in Reset mode when VDD is below this threshold, • Power-down reset (PDR) The PDR supervisor monitors VDD power supply. A reset is generated when VDD drops below a fixed threshold. The PDR supervisor can be enabled/disabled through PDR_ON pin. • Brownout reset (BOR) The BOR supervisor monitors VDD power supply. Three BOR thresholds (from 2.1 to 2.7 V) can be configured through option bytes. A reset is generated when VDD drops below this threshold. 3.5.3 Voltage regulator The same voltage regulator supplies the 3 power domains (D1, D2 and D3). D1 and D2 can be independently switched off. Voltage regulator output can be adjusted according to application needs through 6 power supply levels: • • Run mode (VOS0 to VOS3) – Scale 0: boosted performance (available only with LDO regulator) – Scale 1: high performance – Scale 2: medium performance and consumption – Scale 3: optimized performance and low-power consumption Stop mode (SVOS3 to SVOS5) – Scale 3: peripheral with wakeup from Stop mode capabilities (UART, SPI, I2C, LPTIM) are operational – Scale 4 and 5 where the peripheral with wakeup from Stop mode is disabled The peripheral functionality is disabled but wakeup from Stop mode is possible through GPIO or asynchronous interrupt. DS12110 Rev 9 29/361 54 Functional overview 3.6 STM32H742xI/G STM32H743xI/G Low-power strategy There are several ways to reduce power consumption on STM32H742xI/G and STM32H743xI/G: • Decrease the dynamic power consumption by slowing down the system clocks even in Run mode and by individually clock gating the peripherals that are not used. • Save power consumption when the CPU is idle, by selecting among the available lowpower mode according to the user application needs. This allows achieving the best compromise between short startup time, low-power consumption, as well as available wakeup sources. The devices feature several low-power modes: • CSleep (CPU clock stopped) • CStop (CPU sub-system clock stopped) • DStop (Domain bus matrix clock stopped) • Stop (System clock stopped) • DStandby (Domain powered down) • Standby (System powered down) CSleep and CStop low-power modes are entered by the MCU when executing the WFI (Wait for Interrupt) or WFE (Wait for Event) instructions, or when the SLEEPONEXIT bit of the Cortex®-Mx core is set after returning from an interrupt service routine. A domain can enter low-power mode (DStop or DStandby) when the processor, its subsystem and the peripherals allocated in the domain enter low-power mode. If part of the domain is not in low-power mode, the domain remains in the current mode. Finally the system can enter Stop or Standby when all EXTI wakeup sources are cleared and the power domains are in DStop or DStandby mode. Table 3. System vs domain low-power mode System power mode Run 30/361 D1 domain power mode D2 domain power mode DRun/DStop/DStandby DRun/DStop/DStandby D3 domain power mode DRun Stop DStop/DStandby DStop/DStandby DStop Standby DStandby DStandby DStandby DS12110 Rev 9 STM32H742xI/G STM32H743xI/G 3.7 Functional overview Reset and clock controller (RCC) The clock and reset controller is located in D3 domain. The RCC manages the generation of all the clocks, as well as the clock gating and the control of the system and peripheral resets. It provides a high flexibility in the choice of clock sources and allows to apply clock ratios to improve the power consumption. In addition, on some communication peripherals that are capable to work with two different clock domains (either a bus interface clock or a kernel peripheral clock), the system frequency can be changed without modifying the baudrate. 3.7.1 Clock management The devices embed four internal oscillators, two oscillators with external crystal or resonator, two internal oscillators with fast startup time and three PLLs. The RCC receives the following clock source inputs: • Internal oscillators: – • 64 MHz HSI clock – 48 MHz RC oscillator – 4 MHz CSI clock – 32 kHz LSI clock External oscillators: – HSE clock: 4-50 MHz (generated from an external source) or 4-48 MHz(generated from a crystal/ceramic resonator) – LSE clock: 32.768 kHz The RCC provides three PLLs: one for system clock, two for kernel clocks. The system starts on the HSI clock. The user application can then select the clock configuration. 3.7.2 System reset sources Power-on reset initializes all registers while system reset reinitializes the system except for the debug, part of the RCC and power controller status registers, as well as the backup power domain. A system reset is generated in the following cases: • Power-on reset (pwr_por_rst) • Brownout reset • Low level on NRST pin (external reset) • Window watchdog • Independent watchdog • Software reset • Low-power mode security reset • Exit from Standby DS12110 Rev 9 31/361 54 Functional overview 3.8 STM32H742xI/G STM32H743xI/G General-purpose input/outputs (GPIOs) Each of the GPIO pins can be configured by software as output (push-pull or open-drain, with or without pull-up or pull-down), as input (floating, with or without pull-up or pull-down) or as peripheral alternate function. Most of the GPIO pins are shared with digital or analog alternate functions. All GPIOs are high-current-capable and have speed selection to better manage internal noise, power consumption and electromagnetic emission. After reset, all GPIOs (except debug pins) are in Analog mode to reduce power consumption (refer to GPIOs register reset values in the device reference manual). The I/O configuration can be locked if needed by following a specific sequence in order to avoid spurious writing to the I/Os registers. 3.9 Bus-interconnect matrix The devices feature an AXI bus matrix, two AHB bus matrices and bus bridges that allow interconnecting bus masters with bus slaves (see Figure 4). Figure 4 shows STM32H743xI/G bus matrix. All peripherals may not be available for STM32H742xI/G (refer to Table 2: STM32H742xI/G and STM32H743xI/G features and peripheral counts). 32/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Figure 4. STM32H743xI/G bus matrix AHBS CPU ITCM 64 Kbyte MDMA DMA2D DMA1_MEM SDMMC1 LTDC D1-to-D2 AHB DMA2 DMA2_MEM DMA1 Ethernet SDMMC2 USBHS1 MAC USBHS2 DMA2_PERIPH DTCM 128 Kbyte AHBP AXIM I$ D$ 16KB 16KB DMA1_PERIPH Cortex-M7 APB3 SRAM1 128 Kbyte AHB3 SRAM2 128 Kbyte SRAM3 32 Kbyte Flash A Up to 1 Mbyte DS12110 Rev 9 AHB1 Flash B Up to 1 Mbyte AHB2 AXI SRAM 512 Kbyte APB1 QSPI APB2 FMC 64-bit AXI bus matrix D1 domain 32-bit AHB bus matrix D2 domain D2-to-D1 AHB D2-to-D3 AHB D1-to-D3 AHB Legend 32-bit bus AHB4 TCM AHB AXI APB 33/361 64-bit bus Master interface Bus multiplexer Slave interface APB4 SRAM4 64 Kbyte Backup SRAM 4 Kbyte MSv69514V1 Functional overview BDMA 32-bit AHB bus matrix D3 domain Functional overview 3.10 STM32H742xI/G STM32H743xI/G DMA controllers The devices feature four DMA instances to unload CPU activity: • A master direct memory access (MDMA) The MDMA is a high-speed DMA controller, which is in charge of all types of memory transfers (peripheral to memory, memory to memory, memory to peripheral), without any CPU action. It features a master AXI interface and a dedicated AHB interface to access Cortex®-M7 TCM memories. The MDMA is located in D1 domain. It is able to interface with the other DMA controllers located in D2 domain to extend the standard DMA capabilities, or can manage peripheral DMA requests directly. Each of the 16 channels can perform single block transfers, repeated block transfers and linked list transfers. • Two dual-port DMAs (DMA1, DMA2) located in D2 domain, with FIFO and request router capabilities. • One basic DMA (BDMA) located in D3 domain, with request router capabilities. The DMA request router could be considered as an extension of the DMA controller. It routes the DMA peripheral requests to the DMA controller itself. This allowing managing the DMA requests with a high flexibility, maximizing the number of DMA requests that run concurrently, as well as generating DMA requests from peripheral output trigger or DMA event. 3.11 Chrom-ART Accelerator (DMA2D) The Chrom-Art Accelerator (DMA2D) is a graphical accelerator which offers advanced bit blitting, row data copy and pixel format conversion. It supports the following functions: • Rectangle filling with a fixed color • Rectangle copy • Rectangle copy with pixel format conversion • Rectangle composition with blending and pixel format conversion Various image format coding are supported, from indirect 4bpp color mode up to 32bpp direct color. It embeds dedicated memory to store color lookup tables. The DMA2D also supports block based YCbCr to handle JPEG decoder output. An interrupt can be generated when an operation is complete or at a programmed watermark. All the operations are fully automatized and are running independently from the CPU or the DMAs. 34/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G 3.12 Functional overview Nested vectored interrupt controller (NVIC) The devices embed a nested vectored interrupt controller which is able to manage 16 priority levels, and handle up to 150 maskable interrupt channels plus the 16 interrupt lines of the Cortex®-M7 with FPU core. • Closely coupled NVIC gives low-latency interrupt processing • Interrupt entry vector table address passed directly to the core • Allows early processing of interrupts • Processing of late arriving, higher-priority interrupts • Support tail chaining • Processor context automatically saved on interrupt entry, and restored on interrupt exit with no instruction overhead This hardware block provides flexible interrupt management features with minimum interrupt latency. 3.13 Extended interrupt and event controller (EXTI) The EXTI controller performs interrupt and event management. In addition, it can wake up the processor, power domains and/or D3 domain from Stop mode. The EXTI handles up to 89 independent event/interrupt lines split as 28 configurable events and 61 direct events . Configurable events have dedicated pending flags, active edge selection, and software trigger capable. Direct events provide interrupts or events from peripherals having a status flag. 3.14 Cyclic redundancy check calculation unit (CRC) The CRC (cyclic redundancy check) calculation unit is used to get a CRC code using a programmable polynomial. Among other applications, CRC-based techniques are used to verify data transmission or storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of verifying the Flash memory integrity. The CRC calculation unit helps compute a signature of the software during runtime, to be compared with a reference signature generated at linktime and stored at a given memory location. DS12110 Rev 9 35/361 54 Functional overview 3.15 STM32H742xI/G STM32H743xI/G Flexible memory controller (FMC) The FMC controller main features are the following: • Interface with static-memory mapped devices including: 3.16 – Static random access memory (SRAM) – NOR Flash memory/OneNAND Flash memory – PSRAM (4 memory banks) – NAND Flash memory with ECC hardware to check up to 8 Kbytes of data • Interface with synchronous DRAM (SDRAM/Mobile LPSDR SDRAM) memories • 8-,16-,32-bit data bus width • Independent Chip Select control for each memory bank • Independent configuration for each memory bank • Write FIFO • Read FIFO for SDRAM controller • The maximum FMC_CLK/FMC_SDCLK frequency for synchronous accesses is the FMC kernel clock divided by 2. Quad-SPI memory interface (QUADSPI) All devices embed a Quad-SPI memory interface, which is a specialized communication interface targeting Single, Dual or Quad-SPI Flash memories. It supports both single and double datarate operations. It can operate in any of the following modes: • Direct mode through registers • External Flash status register polling mode • Memory mapped mode. Up to 256 Mbytes of external Flash memory can be mapped, and 8-, 16- and 32-bit data accesses are supported as well as code execution. The opcode and the frame format are fully programmable. 3.17 Analog-to-digital converters (ADCs) The STM32H742xI/G and STM32H743xI/G devices embed three analog-to-digital converters, which resolution can be configured to 16, 14, 12, 10 or 8 bits. Each ADC shares up to 20 external channels, performing conversions in the Single-shot or Scan mode. In Scan mode, automatic conversion is performed on a selected group of analog inputs. Additional logic functions embedded in the ADC interface allow: • Simultaneous sample and hold • Interleaved sample and hold The ADC can be served by the DMA controller, thus allowing to automatically transfer ADC converted values to a destination location without any software action. 36/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Functional overview In addition, an analog watchdog feature can accurately monitor the converted voltage of one, some or all selected channels. An interrupt is generated when the converted voltage is outside the programmed thresholds. To synchronize A/D conversion and timers, the ADCs could be triggered by any of TIM1, TIM2, TIM3, TIM4, TIM6, TIM8, TIM15, HRTIM1 and LPTIM1 timer. 3.18 Temperature sensor STM32H742xI/G and STM32H743xI/G devices embed a temperature sensor that generates a voltage (VTS) that varies linearly with the temperature. This temperature sensor is internally connected to ADC3_IN18. The conversion range is between 1.7 V and 3.6 V. It can measure the device junction temperature ranging from − 40 up to +125 °C. The temperature sensor have a good linearity, but it has to be calibrated to obtain a good overall accuracy of the temperature measurement. As the temperature sensor offset varies from chip to chip due to process variation, the uncalibrated internal temperature sensor is suitable for applications that detect temperature changes only. To improve the accuracy of the temperature sensor measurement, each device is individually factory-calibrated by ST. The temperature sensor factory calibration data are stored by ST in the System memory area, which is accessible in Read-only mode. 3.19 VBAT operation The VBAT power domain contains the RTC, the backup registers and the backup SRAM. To optimize battery duration, this power domain is supplied by VDD when available or by the voltage applied on VBAT pin (when VDD supply is not present). VBAT power is switched when the PDR detects that VDD dropped below the PDR level. The voltage on the VBAT pin could be provided by an external battery, a supercapacitor or directly by VDD, in which case, the VBAT mode is not functional. VBAT operation is activated when VDD is not present. The VBAT pin supplies the RTC, the backup registers and the backup SRAM. Note: When the microcontroller is supplied from VBAT, external interrupts and RTC alarm/events do not exit it from VBAT operation. When PDR_ON pin is connected to VSS (Internal Reset OFF), the VBAT functionality is no more available and VBAT pin should be connected to VDD. DS12110 Rev 9 37/361 54 Functional overview 3.20 STM32H742xI/G STM32H743xI/G Digital-to-analog converters (DAC) The two 12-bit buffered DAC channels can be used to convert two digital signals into two analog voltage signal outputs. This dual digital Interface supports the following features: • two DAC converters: one for each output channel • 8-bit or 12-bit monotonic output • left or right data alignment in 12-bit mode • synchronized update capability • noise-wave generation • triangular-wave generation • dual DAC channel independent or simultaneous conversions • DMA capability for each channel including DMA underrun error detection • external triggers for conversion • input voltage reference VREF+ or internal VREFBUF reference. The DAC channels are triggered through the timer update outputs that are also connected to different DMA streams. 3.21 Ultra-low-power comparators (COMP) STM32H742xI/G and STM32H743xI/G devices embed two rail-to-rail comparators (COMP1 and COMP2). They feature programmable reference voltage (internal or external), hysteresis and speed (low speed for low-power) as well as selectable output polarity. The reference voltage can be one of the following: • An external I/O • A DAC output channel • An internal reference voltage or submultiple (1/4, 1/2, 3/4). All comparators can wake up from Stop mode, generate interrupts and breaks for the timers, and be combined into a window comparator. 3.22 Operational amplifiers (OPAMP) STM32H742xI/G and STM32H743xI/G devices embed two rail-to-rail operational amplifiers (OPAMP1 and OPAMP2) with external or internal follower routing and PGA capability. The operational amplifier main features are: 38/361 • PGA with a non-inverting gain ranging of 2, 4, 8 or 16 or inverting gain ranging of -1, -3, -7 or -15 • One positive input connected to DAC • Output connected to internal ADC • Low input bias current down to 1 nA • Low input offset voltage down to 1.5 mV • Gain bandwidth up to 7.3 MHz DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Functional overview The devices embeds two operational amplifiers (OPAMP1 and OPAMP2) with two inputs and one output each. These three I/Os can be connected to the external pins, thus enabling any type of external interconnections. The operational amplifiers can be configured internally as a follower, as an amplifier with a non-inverting gain ranging from 2 to 16 or with inverting gain ranging from -1 to -15. 3.23 Digital filter for sigma-delta modulators (DFSDM) The devices embed one DFSDM with 4 digital filters modules and 8 external input serial channels (transceivers) or alternately 8 internal parallel inputs support. The DFSDM peripheral is dedicated to interface the external Σ∆ modulators to microcontroller and then to perform digital filtering of the received data streams (which represent analog value on Σ∆ modulators inputs). DFSDM can also interface PDM (Pulse Density Modulation) microphones and perform PDM to PCM conversion and filtering in hardware. DFSDM features optional parallel data stream inputs from internal ADC peripherals or microcontroller memory (through DMA/CPU transfers into DFSDM). DFSDM transceivers support several serial interface formats (to support various Σ∆ modulators). DFSDM digital filter modules perform digital processing according user selected filter parameters with up to 24-bit final ADC resolution. The DFSDM peripheral supports: • • 8 multiplexed input digital serial channels: – configurable SPI interface to connect various SD modulator(s) – configurable Manchester coded 1 wire interface support – PDM (Pulse Density Modulation) microphone input support – maximum input clock frequency up to 20 MHz (10 MHz for Manchester coding) – clock output for SD modulator(s): 0..20 MHz alternative inputs from 8 internal digital parallel channels (up to 16 bit input resolution): – • internal sources: ADC data or memory data streams (DMA) 4 digital filter modules with adjustable digital signal processing: – Sincx filter: filter order/type (1..5), oversampling ratio (up to 1..1024) – integrator: oversampling ratio (1..256) • up to 24-bit output data resolution, signed output data format • automatic data offset correction (offset stored in register by user) • continuous or single conversion • start-of-conversion triggered by: • – software trigger – internal timers – external events – start-of-conversion synchronously with first digital filter module (DFSDM0) analog watchdog feature: – low value and high value data threshold registers – dedicated configurable Sincx digital filter (order = 1..3, oversampling ratio = 1..32) – input from final output data or from selected input digital serial channels – continuous monitoring independently from standard conversion DS12110 Rev 9 39/361 54 Functional overview • STM32H742xI/G STM32H743xI/G short circuit detector to detect saturated analog input values (bottom and top range): – up to 8-bit counter to detect 1..256 consecutive 0’s or 1’s on serial data stream – monitoring continuously each input serial channel • break signal generation on analog watchdog event or on short circuit detector event • extremes detector: – storage of minimum and maximum values of final conversion data – refreshed by software • DMA capability to read the final conversion data • interrupts: end of conversion, overrun, analog watchdog, short circuit, input serial channel clock absence • “regular” or “injected” conversions: – “regular” conversions can be requested at any time or even in Continuous mode without having any impact on the timing of “injected” conversions – “injected” conversions for precise timing and with high conversion priority Table 4. DFSDM implementation DFSDM features 3.24 DFSDM1 Number of filters 4 Number of input transceivers/channels 8 Internal ADC parallel input X Number of external triggers 16 Regular channel information in identification register X Digital camera interface (DCMI) The devices embed a camera interface that can connect with camera modules and CMOS sensors through an 8-bit to 14-bit parallel interface, to receive video data. The camera interface can achieve a data transfer rate up to 140 Mbyte/s using a 80 MHz pixel clock. It features: 3.25 • Programmable polarity for the input pixel clock and synchronization signals • Parallel data communication can be 8-, 10-, 12- or 14-bit • Supports 8-bit progressive video monochrome or raw bayer format, YCbCr 4:2:2 progressive video, RGB 565 progressive video or compressed data (like JPEG) • Supports Continuous mode or Snapshot (a single frame) mode • Capability to automatically crop the image LCD-TFT controller The LCD-TFT display controller (only available on STM32H743xI/G) provides a 24-bit parallel digital RGB (Red, Green, Blue) and delivers all signals to interface directly to a 40/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Functional overview broad range of LCD and TFT panels up to XGA (1024x768) resolution with the following features: 3.26 • 2 display layers with dedicated FIFO (64x64-bit) • Color Look-Up table (CLUT) up to 256 colors (256x24-bit) per layer • Up to 8 input color formats selectable per layer • Flexible blending between two layers using alpha value (per pixel or constant) • Flexible programmable parameters for each layer • Color keying (transparency color) • Up to 4 programmable interrupt events • AXI master interface with burst of 16 words JPEG Codec (JPEG) The JPEG Codec (only available on STM32H743xI/G) can encode and decode a JPEG stream as defined in the ISO/IEC 10918-1 specification. It provides an fast and simple hardware compressor and decompressor of JPEG images with full management of JPEG headers. The JPEG codec main features are as follows: 3.27 • 8-bit/channel pixel depths • Single clock per pixel encoding and decoding • Support for JPEG header generation and parsing • Up to four programmable quantization tables • Fully programmable Huffman tables (two AC and two DC) • Fully programmable minimum coded unit (MCU) • Encode/decode support (non simultaneous) • Single clock Huffman coding and decoding • Two-channel interface: Pixel/Compress In, Pixel/Compressed Out • Support for single greyscale component • Ability to enable/disable header processing • Fully synchronous design • Configuration for High-speed decode mode True random number generator (RNG) The RNG is a true random number generator that provides full entropy outputs to the application as 32-bit samples. It is composed of a live entropy source (analog) and an internal conditioning component. 3.28 Timers and watchdogs The devices include one high-resolution timer, two advanced-control timers, ten generalpurpose timers, two basic timers, five low-power timers, two watchdogs and a SysTick timer. All timer counters can be frozen in Debug mode. DS12110 Rev 9 41/361 54 Functional overview STM32H742xI/G STM32H743xI/G Table 5 compares the features of the advanced-control, general-purpose and basic timers. Table 5. Timer feature comparison Timer type Timer Highresolution HRTIM1 timer Advanced -control TIM1, TIM8 TIM2, TIM5 TIM3, TIM4 TIM12 DMA Capture/ Counter Counter Prescaler request compare resolution type factor generation channels TIM15 TIM16, TIM17 42/361 Max interface clock (MHz) Max timer clock (MHz) (1) /1 /2 /4 (x2 x4 x8 x16 x32, with DLL) Yes 10 Yes 480 480 16-bit Any Up, integer Down, between 1 Up/down and 65536 Yes 4 Yes 120 240 32-bit Any Up, integer Down, between 1 Up/down and 65536 Yes 4 No 120 240 16-bit Any Up, integer Down, between 1 Up/down and 65536 Yes 4 No 120 240 16-bit Up Any integer between 1 and 65536 No 2 No 120 240 Up Any integer between 1 and 65536 No 1 No 120 240 Up Any integer between 1 and 65536 Yes 2 1 120 240 Up Any integer between 1 and 65536 Yes 1 1 120 240 16-bit Up General purpose TIM13, TIM14 Complementary output 16-bit 16-bit 16-bit DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Functional overview Table 5. Timer feature comparison (continued) Timer type Timer DMA Capture/ Counter Counter Prescaler request compare resolution type factor generation channels Basic TIM6, TIM7 16-bit Up Any integer between 1 and 65536 Lowpower timer LPTIM1, LPTIM2, LPTIM3, LPTIM4, LPTIM5 16-bit Up 1, 2, 4, 8, 16, 32, 64, 128 Complementary output Max interface clock (MHz) Max timer clock (MHz) (1) Yes 0 No 120 240 No 0 No 120 240 1. The maximum timer clock is up to 480 MHz depending on TIMPRE bit in the RCC_CFGR register and D2PRE1/2 bits in RCC_D2CFGR register. 3.28.1 High-resolution timer (HRTIM1) The high-resolution timer (HRTIM1) allows generating digital signals with high-accuracy timings, such as PWM or phase-shifted pulses. It consists of 6 timers, 1 master and 5 slaves, totaling 10 high-resolution outputs, which can be coupled by pairs for deadtime insertion. It also features 5 fault inputs for protection purposes and 10 inputs to handle external events such as current limitation, zero voltage or zero current switching. The HRTIM1 timer is made of a digital kernel clocked at 480 MHz The high-resolution is available on the 10 outputs in all operating modes: variable duty cycle, variable frequency, and constant ON time. The slave timers can be combined to control multiswitch complex converters or operate independently to manage multiple independent converters. The waveforms are defined by a combination of user-defined timings and external events such as analog or digital feedbacks signals. HRTIM1 timer includes options for blanking and filtering out spurious events or faults. It also offers specific modes and features to offload the CPU: DMA requests, Burst mode controller, Push-pull and Resonant mode. It supports many topologies including LLC, Full bridge phase shifted, buck or boost converters, either in voltage or current mode, as well as lighting application (fluorescent or LED). It can also be used as a general purpose timer, for instance to achieve high-resolution PWM-emulated DAC. DS12110 Rev 9 43/361 54 Functional overview 3.28.2 STM32H742xI/G STM32H743xI/G Advanced-control timers (TIM1, TIM8) The advanced-control timers (TIM1, TIM8) can be seen as three-phase PWM generators multiplexed on 6 channels. They have complementary PWM outputs with programmable inserted dead times. They can also be considered as complete general-purpose timers. Their 4 independent channels can be used for: • Input capture • Output compare • PWM generation (Edge- or Center-aligned modes) • One-pulse mode output If configured as standard 16-bit timers, they have the same features as the general-purpose TIMx timers. If configured as 16-bit PWM generators, they have full modulation capability (0100%). The advanced-control timer can work together with the TIMx timers via the Timer Link feature for synchronization or event chaining. TIM1 and TIM8 support independent DMA request generation. 3.28.3 General-purpose timers (TIMx) There are ten synchronizable general-purpose timers embedded in the STM32H742xI/G and STM32H743xI/G devices (see Table 5 for differences). • TIM2, TIM3, TIM4, TIM5 The devices include 4 full-featured general-purpose timers: TIM2, TIM3, TIM4 and TIM5. TIM2 and TIM5 are based on a 32-bit auto-reload up/downcounter and a 16-bit prescaler while TIM3 and TIM4 are based on a 16-bit auto-reload up/downcounter and a 16-bit prescaler. All timers feature 4 independent channels for input capture/output compare, PWM or One-pulse mode output. This gives up to 16 input capture/output compare/PWMs on the largest packages. TIM2, TIM3, TIM4 and TIM5 general-purpose timers can work together, or with the other general-purpose timers and the advanced-control timers TIM1 and TIM8 via the Timer Link feature for synchronization or event chaining. Any of these general-purpose timers can be used to generate PWM outputs. TIM2, TIM3, TIM4, TIM5 all have independent DMA request generation. They are capable of handling quadrature (incremental) encoder signals and the digital outputs from 1 to 4 hall-effect sensors. • TIM12, TIM13, TIM14, TIM15, TIM16, TIM17 These timers are based on a 16-bit auto-reload upcounter and a 16-bit prescaler. TIM13, TIM14, TIM16 and TIM17 feature one independent channel, whereas TIM12 and TIM15 have two independent channels for input capture/output compare, PWM or One-pulse mode output. They can be synchronized with the TIM2, TIM3, TIM4, TIM5 full-featured general-purpose timers or used as simple timebases. 44/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G 3.28.4 Functional overview Basic timers TIM6 and TIM7 These timers are mainly used for DAC trigger and waveform generation. They can also be used as a generic 16-bit time base. TIM6 and TIM7 support independent DMA request generation. 3.28.5 Low-power timers (LPTIM1, LPTIM2, LPTIM3, LPTIM4, LPTIM5) The low-power timers have an independent clock and is running also in Stop mode if it is clocked by LSE, LSI or an external clock. It is able to wakeup the devices from Stop mode. This low-power timer supports the following features: 3.28.6 • 16-bit up counter with 16-bit autoreload register • 16-bit compare register • Configurable output: pulse, PWM • Continuous / One-shot mode • Selectable software / hardware input trigger • Selectable clock source: • Internal clock source: LSE, LSI, HSI or APB clock • External clock source over LPTIM input (working even with no internal clock source running, used by the Pulse Counter Application) • Programmable digital glitch filter • Encoder mode Independent watchdog The independent watchdog is based on a 12-bit downcounter and 8-bit prescaler. It is clocked from an independent 32 kHz internal RC and as it operates independently from the main clock, it can operate in Stop and Standby modes. It can be used either as a watchdog to reset the device when a problem occurs, or as a free-running timer for application timeout management. It is hardware- or software-configurable through the option bytes. 3.28.7 Window watchdog The window watchdog is based on a 7-bit downcounter that can be set as free-running. It can be used as a watchdog to reset the device when a problem occurs. It is clocked from the main clock. It has an early warning interrupt capability and the counter can be frozen in Debug mode. 3.28.8 SysTick timer This timer is dedicated to real-time operating systems, but could also be used as a standard downcounter. It features: • A 24-bit downcounter • Autoreload capability • Maskable system interrupt generation when the counter reaches 0 • Programmable clock source. DS12110 Rev 9 45/361 54 Functional overview 3.29 STM32H742xI/G STM32H743xI/G Real-time clock (RTC), backup SRAM and backup registers The RTC is an independent BCD timer/counter. It supports the following features: • Calendar with subsecond, seconds, minutes, hours (12 or 24 format), week day, date, month, year, in BCD (binary-coded decimal) format. • Automatic correction for 28, 29 (leap year), 30, and 31 days of the month. • Two programmable alarms. • On-the-fly correction from 1 to 32767 RTC clock pulses. This can be used to synchronize it with a master clock. • Reference clock detection: a more precise second source clock (50 or 60 Hz) can be used to enhance the calendar precision. • Digital calibration circuit with 0.95 ppm resolution, to compensate for quartz crystal inaccuracy. • Three anti-tamper detection pins with programmable filter. • Timestamp feature which can be used to save the calendar content. This function can be triggered by an event on the timestamp pin, or by a tamper event, or by a switch to VBAT mode. • 17-bit auto-reload wakeup timer (WUT) for periodic events with programmable resolution and period. The RTC and the 32 backup registers are supplied through a switch that takes power either from the VDD supply when present or from the VBAT pin. The backup registers are 32-bit registers used to store 128 bytes of user application data when VDD power is not present. They are not reset by a system or power reset, or when the device wakes up from Standby mode. The RTC clock sources can be: • A 32.768 kHz external crystal (LSE) • An external resonator or oscillator (LSE) • The internal low-power RC oscillator (LSI, with typical frequency of 32 kHz) • The high-speed external clock (HSE) divided by 32. The RTC is functional in VBAT mode and in all low-power modes when it is clocked by the LSE. When clocked by the LSI, the RTC is not functional in VBAT mode, but is functional in all low-power modes. All RTC events (Alarm, Wakeup Timer, Timestamp or Tamper) can generate an interrupt and wakeup the device from the low-power modes. 46/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G 3.30 Functional overview Inter-integrated circuit interface (I2C) STM32H742xI/G and STM32H743xI/G devices embed four I2C interfaces. The I2C bus interface handles communications between the microcontroller and the serial I2C bus. It controls all I2C bus-specific sequencing, protocol, arbitration and timing. The I2C peripheral supports: • • 3.31 I2C-bus specification and user manual rev. 5 compatibility: – Slave and Master modes, multimaster capability – Standard-mode (Sm), with a bitrate up to 100 kbit/s – Fast-mode (Fm), with a bitrate up to 400 kbit/s – Fast-mode Plus (Fm+), with a bitrate up to 1 Mbit/s and 20 mA output drive I/Os – 7-bit and 10-bit addressing mode, multiple 7-bit slave addresses – Programmable setup and hold times – Optional clock stretching System Management Bus (SMBus) specification rev 2.0 compatibility: – Hardware PEC (Packet Error Checking) generation and verification with ACK control – Address resolution protocol (ARP) support – SMBus alert • Power System Management Protocol (PMBusTM) specification rev 1.1 compatibility • Independent clock: a choice of independent clock sources allowing the I2C communication speed to be independent from the PCLK reprogramming. • Wakeup from Stop mode on address match • Programmable analog and digital noise filters • 1-byte buffer with DMA capability Universal synchronous/asynchronous receiver transmitter (USART) STM32H742xI/G and STM32H743xI/G devices have four embedded universal synchronous receiver transmitters (USART1, USART2, USART3 and USART6) and four universal asynchronous receiver transmitters (UART4, UART5, UART7 and UART8). Refer to Table 6 for a summary of USARTx and UARTx features. These interfaces provide asynchronous communication, IrDA SIR ENDEC support, multiprocessor communication mode, single-wire Half-duplex communication mode and have LIN Master/Slave capability. They provide hardware management of the CTS and RTS signals, and RS485 Driver Enable. They are able to communicate at speeds of up to 12.5 Mbit/s. USART1, USART2, USART3 and USART6 also provide Smartcard mode (ISO 7816 compliant) and SPI-like communication capability. The USARTs embed a Transmit FIFO (TXFIFO) and a Receive FIFO (RXFIFO). FIFO mode is enabled by software and is disabled by default. DS12110 Rev 9 47/361 54 Functional overview STM32H742xI/G STM32H743xI/G All USART have a clock domain independent from the CPU clock, allowing the USARTx to wake up the MCU from Stop mode.The wakeup from Stop mode is programmable and can be done on: • Start bit detection • Any received data frame • A specific programmed data frame • Specific TXFIFO/RXFIFO status when FIFO mode is enabled. All USART interfaces can be served by the DMA controller. Table 6. USART features USART modes/features(1) USART1/2/3/6 UART4/5/7/8 Hardware flow control for modem X X Continuous communication using DMA X X Multiprocessor communication X X Synchronous mode (Master/Slave) X - Smartcard mode X - Single-wire Half-duplex communication X X IrDA SIR ENDEC block X X LIN mode X X Dual clock domain and wakeup from low power mode X X Receiver timeout interrupt X X Modbus communication X X Auto baud rate detection X X Driver Enable X X USART data length 7, 8 and 9 bits Tx/Rx FIFO X Tx/Rx FIFO size X 16 1. X = supported. 3.32 Low-power universal asynchronous receiver transmitter (LPUART) The device embeds one Low-Power UART (LPUART1). The LPUART supports asynchronous serial communication with minimum power consumption. It supports half duplex single wire communication and modem operations (CTS/RTS). It allows multiprocessor communication. The LPUARTs embed a Transmit FIFO (TXFIFO) and a Receive FIFO (RXFIFO). FIFO mode is enabled by software and is disabled by default. 48/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Functional overview The LPUART has a clock domain independent from the CPU clock, and can wakeup the system from Stop mode. The wakeup from Stop mode are programmable and can be done on: • Start bit detection • Any received data frame • A specific programmed data frame • Specific TXFIFO/RXFIFO status when FIFO mode is enabled. Only a 32.768 kHz clock (LSE) is needed to allow LPUART communication up to 9600 baud. Therefore, even in Stop mode, the LPUART can wait for an incoming frame while having an extremely low energy consumption. Higher speed clock can be used to reach higher baudrates. LPUART interface can be served by the DMA controller. 3.33 Serial peripheral interfaces (SPI)/integrated interchip sound interfaces (I2S) The devices feature up to six SPIs (SPI2S1, SPI2S2, SPI2S3, SPI4, SPI5 and SPI6) that allow communicating up to 150 Mbits/s in Master and Slave modes, in Half-duplex, Fullduplex and Simplex modes. The 3-bit prescaler gives 8 master mode frequencies and the frame is configurable from 4 to 16 bits. All SPI interfaces support NSS pulse mode, TI mode, Hardware CRC calculation and 8x 8-bit embedded Rx and Tx FIFOs with DMA capability. Three standard I2S interfaces (multiplexed with SPI1, SPI2 and SPI3) are available. They can be operated in Master or Slave mode, in Simplex or Full-duplex communication mode, and can be configured to operate with a 16-/32-bit resolution as an input or output channel. Audio sampling frequencies from 8 kHz up to 192 kHz are supported. When either or both of the I2S interfaces is/are configured in Master mode, the master clock can be output to the external DAC/CODEC at 256 times the sampling frequency. All I2S interfaces support 16x 8bit embedded Rx and Tx FIFOs with DMA capability. 3.34 Serial audio interfaces (SAI) The devices embed 4 SAIs (SAI1, SAI2, SAI3 and SAI4) that allow designing many stereo or mono audio protocols such as I2S, LSB or MSB-justified, PCM/DSP, TDM or AC’97. An SPDIF output is available when the audio block is configured as a transmitter. To bring this level of flexibility and reconfigurability, the SAI contains two independent audio sub-blocks. Each block has it own clock generator and I/O line controller. Audio sampling frequencies up to 192 kHz are supported. In addition, up to 6 microphones can be supported thanks to an embedded PDM interface. The SAI can work in master or slave configuration. The audio sub-blocks can be either receiver or transmitter and can work synchronously or asynchronously (with respect to the other one). The SAI can be connected with other SAIs to work synchronously. DS12110 Rev 9 49/361 54 Functional overview 3.35 STM32H742xI/G STM32H743xI/G SPDIFRX Receiver Interface (SPDIFRX) The SPDIFRX peripheral is designed to receive an S/PDIF flow compliant with IEC-60958 and IEC-61937. These standards support simple stereo streams up to high sample rate, and compressed multi-channel surround sound, such as those defined by Dolby or DTS (up to 5.1). The main SPDIFRX features are the following: • Up to 4 inputs available • Automatic symbol rate detection • Maximum symbol rate: 12.288 MHz • Stereo stream from 32 to 192 kHz supported • Supports Audio IEC-60958 and IEC-61937, consumer applications • Parity bit management • Communication using DMA for audio samples • Communication using DMA for control and user channel information • Interrupt capabilities The SPDIFRX receiver provides all the necessary features to detect the symbol rate, and decode the incoming data stream. The user can select the wanted SPDIF input, and when a valid signal will be available, the SPDIFRX will re-sample the incoming signal, decode the Manchester stream, recognize frames, sub-frames and blocks elements. It delivers to the CPU decoded data, and associated status flags. The SPDIFRX also offers a signal named spdif_frame_sync, which toggles at the S/PDIF sub-frame rate that will be used to compute the exact sample rate for clock drift algorithms. 3.36 Single wire protocol master interface (SWPMI) The Single wire protocol master interface (SWPMI) is the master interface corresponding to the Contactless Frontend (CLF) defined in the ETSI TS 102 613 technical specification. The main features are: • Full-duplex communication mode • automatic SWP bus state management (active, suspend, resume) • configurable bitrate up to 2 Mbit/s • automatic SOF, EOF and CRC handling SWPMI can be served by the DMA controller. 50/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G 3.37 Functional overview Management Data Input/Output (MDIO) slaves The devices embed an MDIO slave interface it includes the following features: • – 32 x 16-bit firmware read/write, MDIO read-only output data registers – 32 x 16-bit firmware read-only, MDIO write-only input data registers • Configurable slave (port) address • Independently maskable interrupts/events: • 3.38 32 MDIO Registers addresses, each of which is managed using separate input and output data registers: – MDIO Register write – MDIO Register read – MDIO protocol error Able to operate in and wake up from Stop mode SD/SDIO/MMC card host interfaces (SDMMC) Two SDMMC host interfaces are available. They support MultiMediaCard System Specification Version 4.51 in three different databus modes: 1 bit (default), 4 bits and 8 bits. Both interfaces support the SD memory card specifications version 4.1. and the SDIO card specification version 4.0. in two different databus modes: 1 bit (default) and 4 bits. Each SDMMC host interface supports only one SD/SDIO/MMC card at any one time and a stack of MMC Version 4.51 or previous. The SDMMC host interface embeds a dedicated DMA controller allowing high-speed transfers between the interface and the SRAM. 3.39 Controller area network (FDCAN1, FDCAN2) The controller area network (CAN) subsystem consists of two CAN modules, a shared message RAM memory and a clock calibration unit. Both CAN modules (FDCAN1 and FDCAN2) are compliant with ISO 11898-1 (CAN protocol specification version 2.0 part A, B) and CAN FD protocol specification version 1.0. FDCAN1 supports time triggered CAN (TT-FDCAN) specified in ISO 11898-4, including event synchronized time-triggered communication, global system time, and clock drift compensation. The FDCAN1 contains additional registers, specific to the time triggered feature. The CAN FD option can be used together with event-triggered and time-triggered CAN communication. A 10-Kbyte message RAM memory implements filters, receive FIFOs, receive buffers, transmit event FIFOs, transmit buffers (and triggers for TT-FDCAN). This message RAM is shared between the two FDCAN1 and FDCAN2 modules. The common clock calibration unit is optional. It can be used to generate a calibrated clock for both FDCAN1 and FDCAN2 from the HSI internal RC oscillator and the PLL, by evaluating CAN messages received by the FDCAN1. DS12110 Rev 9 51/361 54 Functional overview 3.40 STM32H742xI/G STM32H743xI/G Universal serial bus on-the-go high-speed (OTG_HS) The devices embed two USB OTG high-speed (up to 480 Mbit/s) device/host/OTG peripheral. OTG-HS1 supports both full-speed and high-speed operations, while OTG-HS2 supports only full-speed operations. They both integrate the transceivers for full-speed operation (12 Mbit/s) and are able to operate from the internal HSI48 oscillator. OTG-HS1 features a UTMI low-pin interface (ULPI) for high-speed operation (480 Mbit/s). When using the USB OTG-HS1 in HS mode, an external PHY device connected to the ULPI is required. The USB OTG HS peripherals are compliant with the USB 2.0 specification and with the OTG 2.0 specification. They have software-configurable endpoint setting and supports suspend/resume. The USB OTG controllers require a dedicated 48 MHz clock that is generated by a PLL connected to the HSE oscillator. The main features are: • Combined Rx and Tx FIFO size of 4 Kbytes with dynamic FIFO sizing • Supports the session request protocol (SRP) and host negotiation protocol (HNP) • 9 bidirectional endpoints (including EP0) • 16 host channels with periodic OUT support • Software configurable to OTG1.3 and OTG2.0 modes of operation • USB 2.0 LPM (Link Power Management) support • Battery Charging Specification Revision 1.2 support • Internal FS OTG PHY support • External HS or HS OTG operation supporting ULPI in SDR mode (OTG_HS1 only) The OTG PHY is connected to the microcontroller ULPI port through 12 signals. It can be clocked using the 60 MHz output. 3.41 • Internal USB DMA • HNP/SNP/IP inside (no need for any external resistor) • For OTG/Host modes, a power switch is needed in case bus-powered devices are connected Ethernet MAC interface with dedicated DMA controller (ETH) The devices provide an IEEE-802.3-2002-compliant media access controller (MAC) for ethernet LAN communications through an industry-standard medium-independent interface (MII) or a reduced medium-independent interface (RMII). The microcontroller requires an external physical interface device (PHY) to connect to the physical LAN bus (twisted-pair, fiber, etc.). The PHY is connected to the device MII port using 17 signals for MII or 9 signals for RMII, and can be clocked using the 25 MHz (MII) from the microcontroller. 52/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Functional overview The devices include the following features: 3.42 • Supports 10 and 100 Mbit/s rates • Dedicated DMA controller allowing high-speed transfers between the dedicated SRAM and the descriptors • Tagged MAC frame support (VLAN support) • Half-duplex (CSMA/CD) and full-duplex operation • MAC control sublayer (control frames) support • 32-bit CRC generation and removal • Several address filtering modes for physical and multicast address (multicast and group addresses) • 32-bit status code for each transmitted or received frame • Internal FIFOs to buffer transmit and receive frames. The transmit FIFO and the receive FIFO are both 2 Kbytes. • Supports hardware PTP (precision time protocol) in accordance with IEEE 1588 2008 (PTP V2) with the time stamp comparator connected to the TIM2 input • Triggers interrupt when system time becomes greater than target time High-definition multimedia interface (HDMI) - consumer electronics control (CEC) The devices embed a HDMI-CEC controller that provides hardware support for the Consumer Electronics Control (CEC) protocol (Supplement 1 to the HDMI standard). This protocol provides high-level control functions between all audiovisual products in an environment. It is specified to operate at low speeds with minimum processing and memory overhead. It has a clock domain independent from the CPU clock, allowing the HDMI-CEC controller to wakeup the MCU from Stop mode on data reception. 3.43 Debug infrastructure The devices offer a comprehensive set of debug and trace features to support software development and system integration. • Breakpoint debugging • Code execution tracing • Software instrumentation • JTAG debug port • Serial-wire debug port • Trigger input and output • Serial-wire trace port • Trace port • Arm® CoreSight™ debug and trace components The debug can be controlled via a JTAG/Serial-wire debug access port, using industry standard debugging tools. The trace port performs data capture for logging and analysis. DS12110 Rev 9 53/361 54 Memory mapping 4 STM32H742xI/G STM32H743xI/G Memory mapping Refer to Table 7 for details on STM32H742xI/G Flash and SRAM block memory mapping and to the product line reference manual for information on the boundary addresses for all STM32H742xI/G peripherals. Details on STM32H743xGxI/G Flash and SRAM block memory mapping and boundary addresses for all STM32H743xI/G peripherals are given in the product line reference manual. Table 7. Flash memory and SRAM memory mapping for STM32H742xI/G RAM area Code area 54/361 Memory Size in Kbytes Start address Backup SRAM 4 0x3880 0000 SRAM4 64 0x3800 0000 SRAM2 16 0x3002 0000 SRAM1 32 0x3000 0000 AXI-SRAM 384 0x2400 0000 DTCM 128 0x2000 0000 System memory 2 0x1FF4 0000 System memory 0x1FF0 0000 Flash memory 2048 0x0800 0000 ITCM 64 0x0000 0000 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G 5 Pin descriptions Pin descriptions PA14 PA15 PC10 PC11 PC12 PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 PB3 PB4 PB5 PB6 PB7 BOOT0 PB8 PB9 PE0 PE1 VSS VDD Figure 5. LQFP100 pinout 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 PE2 1 75 VDD PE3 2 74 VSS PE4 3 73 VCAP PE5 4 72 PA13 PE6 5 71 PA12 VBAT 6 70 PA11 PC13 7 69 PA10 PC14-OSC32_IN 8 68 PA9 PC15-OSC32_OUT 9 67 PA8 VSS 10 66 PC9 VDD 11 65 PC8 PH0-OSC_IN 12 64 PC7 100-pins PH1-OSC_OUT 13 63 PC6 NRST 14 62 PD15 PC0 15 61 PD14 PC1 16 60 PD13 PC2_C 17 59 PD12 PC3_C 18 58 PD11 VSSA 19 57 PD10 VREF+ 20 56 PD9 VDDA 21 55 PD8 PA0 22 54 PB15 PA1 23 53 PB14 PA2 24 52 PB13 PA3 25 51 PB12 VDD VSS VCAP PB11 PB10 PE15 PE14 PE13 PE12 PE11 PE10 PE9 PE8 PE7 PB2 PB1 PB0 PC5 PC4 PA7 PA6 PA5 PA4 VDD VSS 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 MSv41918V4 1. The above figure shows the package top view. DS12110 Rev 9 55/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Figure 6. TFBGA100 pinout 1 2 3 4 5 6 7 8 9 10 A PC14OSC32_IN PC13 PE2 PB9 PB7 PB4 PB3 PA15 PA14 PA13 B PC15OSC32_OUT VBAT PE3 PB8 PB6 PD5 PD2 PC11 PC10 PA12 C PH0-OSC_IN VSS PE4 PE1 PB5 PD6 PD3 PC12 PA9 PA11 D PH1OSC_OUT VDD PE5 PE0 BOOT0 PD7 PD4 PD0 PA8 PA10 E NRST PC2_C PE6 VSS VSS VSS VCAP PD1 PC9 PC7 F PC0 PC1 PC3_C VDDLDO VDD VDD33USB PDR_ON VCAP PC8 PC6 G VSSA PA0 PA4 PC4 PB2 PE10 PE14 PD15 PD11 PB15 H VDDA PA1 PA5 PC5 PE7 PE11 PE15 PD14 PD10 PB14 J VSS PA2 PA6 PB0 PE8 PE12 PB10 PB13 PD9 PD13 K VDD PA3 PA7 PB1 PE9 PE13 PB11 PB12 PD8 PD12 MSv46177V2 1. The above figure shows the package top view. 56/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Pin descriptions 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 144-pins 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 VDD VSS VCAP PA13 PA12 PA11 PA10 PA9 PA8 PC9 PC8 PC7 PC6 VDD33USB VSS PG8 PG7 PG6 PG5 PG4 PG3 PG2 PD15 PD14 VDD VSS PD13 PD12 PD11 PD10 PD9 PD8 PB15 PB14 PB13 PB12 PA3 VSS VDD PA4 PA5 PA6 PA7 PC4 PC5 PB0 PB1 PB2 PF11 PF12 VSS VDD PF13 PF14 PF15 PG0 PG1 PE7 PE8 PE9 VSS VDD PE10 PE11 PE12 PE13 PE14 PE15 PB10 PB11 VCAP VDD PE2 PE3 PE4 PE5 PE6 VBAT PC13 PC14-OSC32_IN PC15-OSC32_OUT PF0 PF1 PF2 PF3 PF4 PF5 VSS VDD PF6 PF7 PF8 PF9 PF10 PH0-OSC_IN PH1-OSC_OUT NRST PC0 PC1 PC2_C PC3_C VDD VSSA VREF+ VDDA PA0 PA1 PA2 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 VDD PDR_ON PE1 PE0 PB9 PB8 BOOT0 PB7 PB6 PB5 PB4 PB3 PG15 VDD VSS PG14 PG13 PG12 PG11 PG10 PG9 PD7 PD6 VDD VSS PD5 PD4 PD3 PD2 PD1 PD0 PC12 PC11 PC10 PA15 PA14 Figure 7. LQFP144 pinout MSv41917V4 1. The above figure shows the package top view. DS12110 Rev 9 57/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Figure 8. UFBGA169 ballout A B C 1 2 3 4 5 6 PE4 PE2 VDD PI6 PB6 PI2 VDD PE3 VSS VDDLDO PB8 PB4 PI3 PE6 PE5 PDR_ON PB9 PB5 PC15OSC32_ OUT PC14OSC32_ IN 7 8 9 10 PG10 PD5 VDD PG11 PD6 VSS PG14 PG9 PD4 11 PC12 12 13 PC10 PI0 PC11 PA14 PI1 PD1 PA15 VSS VDD D VDD VSS PC13 PE1 PE0 PB7 PG13 PD7 PD3 PD0 PA13 VDDLDO VCAP E PI11 PI7 VBAT PF1 PF3 BOOT0 PG15 PG12 PD2 PA10 PA9 PA8 PA12 F PI13 PI12 PF0 PF2 PF5 PF7 PB3 PG4 PC6 PC7 PC9 PC8 PA11 G VDD VSS PF4 PF6 PF9 NRST PF13 PE7 PG6 PG7 PG8 VDD50_ USB VDD33_ USB H PH0OSC_ IN PH1OSC_ OUT PF10 PF8 PJ1 PA4 PF14 PE8 PG2 PG3 PG5 VSS VDD J PC0 PC1 VSSA PJ0 PA0 PA7 PF15 PE9 PE14 PD11 PD13 PD15 PD14 K PC3_C PC2_C PH4 PA1 PA6 PC4 PG0 PE13 PH10 PH12 PD9 PD10 PD12 L VDDA VREF+ PH5 PA5 PB1 PB2 PG1 PE12 PB10 PH11 PB13 VSS VDD M VDD VSS PH3 VSS PB0 PF11 VSS PE10 PB11 VDDLDO VSS PD8 PB15 N PA2 PH2 PA3 VDD PC5 PF12 VDD PE11 PE15 VCAP VDD PB12 PB14 MSv45339V4 1. The above figure shows the package top view. 58/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Pin descriptions PE2 PE3 PE4 PE5 PE6 VBAT PI8 PC13 PC14-OSC32_IN PC15-OSC32_OUT PI9 PI10 PI11 VSS VDD PF0 PF1 PF2 PF3 PF4 PF5 VSS VDD PF6 PF7 PF8 PF9 PF10 PH0-OSC_IN PH1-OSC_OUT NRST PC0 PC1 PC2_C PC3_C VDD VSSA VREF+ VDDA PA0 PA1 PA2 PH2 PH3 134 135 133 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 PINOUT UNDER DEVELOPMENT 169 170 171 172 173 174 175 176 PI7 PI6 PI5 PI4 VDD PDR_ON PE1 PE0 PB9 PB8 BOOT0 PB7 PB6 PB5 PB4 PB3 PG15 VDD VSS PG14 PG13 PG12 PG11 PG10 PG9 PD7 PD6 VDD VSS PD5 PD4 PD3 PD2 PD1 PD0 PC12 PC11 PC10 PA15 PA14 VDD VSS PI3 PI2 Figure 9. LQFP176 pinout 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 176-pins 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 PI1 PI0 PH15 PH14 PH13 VDD VSS VCAP PA13 PA12 PA11 PA10 PA9 PA8 PC9 PC8 PC7 PC6 VDD33USB VSS PG8 PG7 PG6 PG5 PG4 PG3 PG2 PD15 PD14 VDD VSS PD13 PD12 PD11 PD10 PD9 PD8 PB15 PB14 PB13 PB12 VDD VSS PH12 PH4 PH5 PA3 VSS VDD PA4 PA5 PA6 PA7 PC4 PC5 PB0 PB1 PB2 PF11 PF12 VSS VDD PF13 PF14 PF15 PG0 PG1 PE7 PE8 PE9 VSS VDD PE10 PE11 PE12 PE13 PE14 PE15 PB10 PB11 VCAP VDD PH6 PH7 PH8 PH9 PH10 PH11 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 MSv41916V5 1. The above figure shows the package top view. DS12110 Rev 9 59/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Figure 10. UFBGA176+25 ballout 1 2 3 5 6 10 11 A PE3 PE2 PE1 PE0 PB8 PB5 PG14 PG13 PB4 PB3 PD7 B PE4 PE5 PE6 PB9 PB7 PB6 PG15 PG12 PG11 PG10 C VBAT PI7 PI6 PI5 VDD PDR_ON VDD VDD VDD D PC13 PI8 PI9 PI4 VSS BOOT0 VSS VSS VSS PF0 PI10 PI11 VSS VDD PH2 VSS VSS VSS VSS E F PC14OSC32_ IN PC15OSC32_ OUT 4 7 8 9 12 13 14 PC12 PA15 PA14 PA13 15 PD6 PD0 PC11 PC10 PA12 PG9 PD5 PD1 PI3 PI2 PA11 PD4 PD3 PD2 PH15 PI1 PA10 PH13 PH14 PI0 PA9 VSS VSS VCAP PC9 PA8 G PH0OSC_IN VSS VDD PH3 VSS VSS VSS VSS VSS VSS VDD PC8 PC7 H PH1OSC_ OUT PF2 PF1 PH4 VSS VSS VSS VSS VSS VSS VDD 33USB PG8 PC6 J NRST PF3 PF4 PH5 VSS VSS VSS VSS VSS VDD VDD PG7 PG6 K PF7 PF6 PF5 VDD VSS VSS VSS VSS VSS PH12 PG5 PG4 PG3 L PF10 PF9 PF8 VSS PH11 PH10 PD15 PG2 M VSSA PC0 PC1 PC2_C PC3_C PB2 PG1 VSS VSS VCAP PH6 PH8 PH9 PD14 PD13 N VREF- PA1 PA0 PA4 PC4 PF13 PG0 VDD VDD VDD PE13 PH7 PD12 PD11 PD10 P VREF+ PA2 PA6 PA5 PC5 PF12 PF15 PE8 PE9 PE11 PE14 PB12 PB13 PD9 PD8 R VDDA PA3 PA7 PB1 PB0 PF11 PF14 PE7 PE10 PE12 PE15 PB10 PB11 PB14 PB15 MSv41912V3 1. The above figure shows the package top view. 60/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Pin descriptions 208-pins 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 PI2 PI1 PI0 PH15 PH14 PH13 VDD VSS VCAP PA13 PA12 PA11 PA10 PA9 PA8 PC9 PC8 PC7 PC6 VDD33USB VSS PG8 PG7 PG6 PG5 PG4 PG3 PG2 PK2 PK1 PK0 VSS VDD PJ11 PJ10 PJ9 PJ8 PJ7 PJ6 PD15 PD14 VDD VSS PD13 PD12 PD11 PD10 PD9 PD8 PB15 PB14 PB13 PA4 PA5 PA6 PA7 PC4 PC5 VDD VSS PB0 PB1 PB2 PI15 PJ0 PJ1 PJ2 PJ3 PJ4 PF11 PF12 VSS VDD PF13 PF14 PF15 PG0 PG1 PE7 PE8 PE9 VSS VDD PE10 PE11 PE12 PE13 PE14 PE15 PB10 PB11 VCAP VSS VDD PJ5 PH6 PH7 PH8 PH9 PH10 PH11 PH12 VDD PB12 PE2 PE3 PE4 PE5 PE6 VBAT PI8 PC13 PC14-OSC32_IN PC15-OSC32_OUT PI9 PI10 PI11 VSS VDD PF0 PF1 PF2 PI12 PI13 PI14 PF3 PF4 PF5 VSS VDD PF6 PF7 PF8 PF9 PF10 PH0-OSC_IN PH1-OSC_OUT NRST PC0 PC1 PC2_C PC3_C VDD VSSA VREF+ VDDA PA0 PA1 PA2 PH2 PH3 PH4 PH5 PA3 VSS VDD 208 207 206 205 204 203 202 201 200 199 198 197 196 195 194 193 192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 PI7 PI6 PI5 PI4 VDD PDR_ON VSS PE1 PE0 PB9 PB8 BOOT0 PB7 PB6 PB5 PB4 PB3 PG15 PK7 PK6 PK5 PK4 PK3 VDD VSS PG14 PG13 PG12 PG11 PG10 PG9 PJ15 PJ14 PJ13 PJ12 PD7 PD6 VDD VSS PD5 PD4 PD3 PD2 PD1 PD0 PC12 PC11 PC10 PA15 PA14 VDD PI3 Figure 11. LQFP208 pinout MSv41915V3 1. The above figure shows the package top view. DS12110 Rev 9 61/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Figure 12. TFBGA240+25 ballout 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 VCAP PK5 PG10 PG9 PD5 PD4 PC10 PA15 PI1 PI0 VSS A VSS PI6 PI5 PI4 PB5 VDD LDO B VBAT VSS PI7 PE1 PB6 VSS PB4 PK4 PG11 PJ15 PD6 PD3 PC11 PA14 PI2 PH15 PH14 PE2 PE0 PB7 PB3 PK6 PK3 PG12 VSS PD7 PC12 VSS PI3 PA13 VSS VDD LDO PB9 PB8 PG15 PK7 PG14 PG13 PJ14 PJ12 PD2 PD0 PA10 PA9 PH13 VCAP VDD VDD PJ13 VDD PD1 PC8 PC9 PA8 PA12 PA11 PC6 PG8 PG7 VDD33 USB PG5 PG6 VSS VDD50 USB C D PC15- PC14OSC32_ OSC32_ OUT IN PE5 PE4 PE3 E NC(2) PI9 PC13 PI8 PE6 F VSS(3) VSS(4) PI10 PI11 VDD G PF2 VSS(4) PF1 PF0 VDD PDR_ ON BOO T0 PC7 VSS VSS VSS VSS VSS VDD VSS VSS VSS VSS VSS VDD H PI12 J PH1PH0OSC_ OSC_IN OUT VSS PF5 PF4 VSS VSS VSS VSS VSS VDD PK0 K NRST PF6 PF7 PF8 VDD VSS VSS VSS VSS VSS VDD L VDDA PC0 PF10 PF9 VDD VSS VSS VSS VSS VSS M VREF+ PC1 PC2 PC3 VDD N VREF- PH2 PA2 PA1 PA0 PJ0 VDD VDD PE10 VDD VDD P VSSA PH3 PH4 PH5 PI15 PJ1 PF13 PF14 PE9 PE11 R PC2_C PC3_C PA6 VSS PA7 PB2 PF12 VSS PF15 T PA0_C PA1_C PA5 PC4 PB1 PJ2 PF11 PG0 U VSS PA3 PA4 PC5 PB0 PJ3 PJ4 PG1 PI13 PI14 PF3 VDD PG4 PG3 PG2 PK2 PK1 VSS VSS PJ11 VSS NC NC VDD PJ10 VSS NC NC VDD PJ9 VSS NC NC VDD PJ8 PJ7 PJ6 VSS NC PB10 PB11 PH10 PH11 PD15 PD14 VDD PE12 PE15 PJ5 PH9 PH12 PD11 PD12 PD13 PE8 PE13 PH6 VSS PH8 PB12 PB15 PD10 PD9 PE7 PE14 VCAP VDD LDO PH7 PB13 PB14 PD8 VSS MSv41911V5 1. The above figure shows the package top view. 2. This ball should remain floating. 3. This ball should not remain floating. It can be connected to VSS or VDD. It is reserved for future use. 4. This ball should be connected to VSS. 62/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Pin descriptions Table 8. Legend/abbreviations used in the pinout table Name Pin name Pin type Abbreviation Unless otherwise specified in brackets below the pin name, the pin function during and after reset is the same as the actual pin name S Supply pin I Input only pin I/O Input / output pin ANA Analog-only Input FT 5 V tolerant I/O TT 3.3 V tolerant I/O B Dedicated BOOT0 pin RST I/O structure Notes Pin functions Definition Bidirectional reset pin with embedded weak pull-up resistor Option for TT and FT I/Os _f I2C FM+ option _a analog option (supplied by VDDA) _u USB option (supplied by VDD33USB) _h High-speed low-voltage I/O Unless otherwise specified by a note, all I/Os are set as floating inputs during and after reset. Alternate functions Functions selected through GPIOx_AFR registers Additional functions Functions directly selected/enabled through peripheral registers Table 9 and Table 10 to Table 20 show STM32H743xI/G pin/ball definition and alternate functions, respectively. Refer to Table 2 for the features and peripherals available on STM32H742xI/G devices. DS12110 Rev 9 63/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Table 9. Pin/ball definition A2 1 1 C3 PE2 I/O FT_h - 2 B3 2 B2 A1 2 2 D3 PE3 I/O FT_h - TRACED0, TIM15_BKIN, SAI1_SD_B, SAI4_SD_B, FMC_A19, EVENTOUT - - TRACED1, SAI1_D2, DFSDM1_DATIN3, TIM15_CH1N, SPI4_NSS, SAI1_FS_A, SAI4_FS_A, SAI4_D2, FMC_A20, DCMI_D4, LCD_B0, EVENTOUT - - TRACED2, SAI1_CK2, DFSDM1_CKIN3, TIM15_CH1, SPI4_MISO, SAI1_SCK_A, SAI4_SCK_A, SAI4_CK2, FMC_A21, DCMI_D6, LCD_G0, EVENTOUT - - 3 4 C3 D3 3 4 A1 C3 B1 B2 3 4 LQFP208 A2 LQFP176 1 UFBGA169 A3 LQFP144 1 TRACECLK, SAI1_CK1, SPI4_SCK, SAI1_MCLK_A, SAI4_MCLK_A, QUADSPI_BK1_IO2, SAI4_CK1, ETH_MII_TXD3, FMC_A23, EVENTOUT TFBGA100 Alternate functions LQFP100 Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 UFBGA176+25 Pin/ball name 3 4 D2 D1 PE4 PE5 I/O I/O FT_h FT_h Additional functions - 5 E3 5 C2 B3 5 5 E5 PE6 I/O FT_h - TRACED3, TIM1_BKIN2, SAI1_D1, TIM15_CH2, SPI4_MOSI, SAI1_SD_A, SAI4_SD_A, SAI4_D1, SAI2_MCLK_B, TIM1_BKIN2_COMP12, FMC_A22, DCMI_D7, LCD_G1, EVENTOUT - - - M4 H10 - - A1 VSS S - - - - - - - A3 - - - - VDD S - - - - 6 B2 6 E3 C1 6 6 B1 VBAT S - - - - - - - - J6 - - B2 VSS S - - - - - - - - D2 7 7 E4 PI8 I/O FT - EVENTOUT RTC_TAMP2/ WKUP2 7 A2 7 D3 D1 8 8 E3 PC13 I/O FT - EVENTOUT RTC_TAMP1/ RTC_TS/ WKUP3 - - - - J7 - - B6 VSS S - - - - 64/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Pin descriptions Table 9. Pin/ball definition (continued) B1 E1 F1 9 10 9 10 Additional functions FT - EVENTOUT OSC32_IN - EVENTOUT OSC32_ OUT - C2 PC14OSC32_ IN (OSC32_ IN)(1) I/O C1 PC15OSC32_ OUT (OSC32_ OUT)(1) I/O FT TFBGA240 +25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 9 C1 Notes B1 8 I/O structure 9 A1 Alternate functions Pin name (function after reset) Pin type 8 TFBGA100 LQFP100 Pin/ball name - - - - D3 11 11 E2 PI9 I/O FT_h - UART4_RX, FDCAN1_RX, FMC_D30, LCD_VSYNC, EVENTOUT - - - - E3 12 12 F3 PI10 I/O FT_h - ETH_MII_RX_ER, FMC_D31, LCD_HSYNC, EVENTOUT - - - E1 E4 13 13 F4 PI11 I/O FT - LCD_G6, OTG_HS_ULPI_DIR, EVENTOUT WKUP4 - C2 - D2 F2 14 14 A17 VSS S - - - - - D2 - D1 F3 15 15 E6 VDD S - - - - - - - - - - (2) - E1 NC - - - - - - F1(3) VSS S - - - - VSS S - - - - - - - - - - - G2(4) - - 10 F3 E2 16 16 G4 PF0 I/O FT_f - I2C2_SDA, FMC_A0, EVENTOUT - - - 11 E4 H3 17 17 G3 PF1 I/O FT_f - I2C2_SCL, FMC_A1, EVENTOUT - - - 12 F4 H2 18 18 G1 PF2 I/O FT - I2C2_SMBA, FMC_A2, EVENTOUT - - - - F2 - - 19 H1 PI12 I/O FT - LCD_HSYNC, EVENTOUT - - - - F1 - - 20 H2 PI13 I/O FT - LCD_VSYNC, EVENTOUT - - - - - - - 21 H3 PI14 I/O FT_h - LCD_CLK, EVENTOUT - - - 13 E5 J2 19 22 H4 PF3 I/O FT_ ha - FMC_A3, EVENTOUT ADC3_INP5 - - 14 G3 J3 20 23 J5 PF4 I/O FT_ ha - FMC_A4, EVENTOUT ADC3_INN5, ADC3_INP9 DS12110 Rev 9 65/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Table 9. Pin/ball definition (continued) LQFP100 TFBGA100 LQFP144 UFBGA169 UFBGA176+25 LQFP176 LQFP208 TFBGA240 +25 Pin name (function after reset) Pin type I/O structure Notes Pin/ball name Alternate functions - - 15 F5 K3 21 24 J4 PF5 I/O FT_ ha - FMC_A5, EVENTOUT ADC3_INP4 10 - 16 B10 G2 22 25 C10 VSS S - - - - 11 - 17 G1 G3 23 26 E9 VDD S - - - - I/O FT_ ha - TIM16_CH1, SPI5_NSS, SAI1_SD_B, UART7_RX, SAI4_SD_B, QUADSPI_BK1_IO3, EVENTOUT ADC3_INN4, ADC3_INP8 - TIM17_CH1, SPI5_SCK, SAI1_MCLK_B, UART7_TX, SAI4_MCLK_B, QUADSPI_BK1_IO2, EVENTOUT ADC3_INP3 - TIM16_CH1N, SPI5_MISO, SAI1_SCK_B, UART7_RTS/UART7_DE , SAI4_SCK_B, TIM13_CH1, QUADSPI_BK1_IO0, EVENTOUT ADC3_INN3, ADC3_INP7 - TIM17_CH1N, SPI5_MOSI, SAI1_FS_B, UART7_CTS, SAI4_FS_B, TIM14_CH1, QUADSPI_BK1_IO1, EVENTOUT ADC3_INP2 ADC3_INN2, ADC3_INP6 - - - - - - - - 18 19 20 21 G4 F6 H4 G5 K2 K1 L3 L2 24 25 26 27 27 28 29 30 K2 K3 K4 L4 PF6 PF7 PF8 PF9 I/O I/O FT_ ha FT_ ha I/O FT_ ha - TIM16_BKIN, SAI1_D3, QUADSPI_CLK, SAI4_D3, DCMI_D11, LCD_DE, EVENTOUT Additional functions - - 22 H3 L1 28 31 L3 PF10 I/O FT_ ha 12 C1 23 H1 G1 29 32 J2 PH0OSC_IN (PH0) I/O FT - EVENTOUT OSC_IN 13 D1 24 H2 H1 30 33 J1 PH1OSC_OUT (PH1) I/O FT - EVENTOUT OSC_OUT 14 E1 25 G6 J1 31 34 K1 NRST I/O RST - - - 66/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Pin descriptions Table 9. Pin/ball definition (continued) 15 F1 26 J1 M2 32 35 L2 PC0 I/O FT_a Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 TFBGA100 LQFP100 Pin/ball name Alternate functions Additional functions - DFSDM1_CKIN0, DFSDM1_DATIN4, SAI2_FS_B, OTG_HS_ULPI_STP, FMC_SDNWE, LCD_R5, EVENTOUT ADC123_ INP10 TRACED0, SAI1_D1, DFSDM1_DATIN0, DFSDM1_CKIN4, SPI2_MOSI/I2S2_SDO, SAI1_SD_A, SAI4_SD_A, SDMMC2_CK, SAI4_D1, ETH_MDC, MDIOS_MDC, EVENTOUT ADC123_ INN10, ADC123_ INP11, RTC_TAMP3/W KUP5 16 F2 27 J2 M3 33 36 M2 PC1 I/O FT_ ha - - - - - - - - M3(5) PC2 I/O FT_a - R1(5) PC2_C ANA TT_a - M4(5) PC3 R2(5) PC3_C 17 (6) - 18 (6) E2(6) 28(6) K2(6) M4(6) 34(6) 37(6) - - - - - - F3(6) 29(6) K1(6) M5(6) 35(6) 38(6) I/O FT_a - ANA TT_a - CDSLEEP, DFSDM1_CKIN1, SPI2_MISO/I2S2_SDI, DFSDM1_CKOUT, OTG_HS_ULPI_DIR, ETH_MII_TXD2, FMC_SDNE0, EVENTOUT ADC123_ INN11, ADC123_ INP12 ADC3_INN1, ADC3_INP0 CSLEEP, DFSDM1_DATIN1, SPI2_MOSI/I2S2_SDO, OTG_HS_ULPI_NXT, ETH_MII_TX_CLK, FMC_SDCKE0, EVENTOUT ADC12_INN12, ADC12_INP13 ADC3_INP1 - F5 30 - G3 36 39 E11 VDD S - - - - - E6 - B3 J10 - - C13 VSS S - - - - 19 G1 31 J3 M1 37 40 P1 VSSA S - - - - - - - - N1 - - N1 VREF- S - - - - 20 -(7) 32 L2 P1 38 41 M1 VREF+ S - - - - 21 H1 33 L1 R1 39 42 L1 VDDA S - - - - DS12110 Rev 9 67/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Table 9. Pin/ball definition (continued) UFBGA169 UFBGA176+25 LQFP176 LQFP208 TFBGA240 +25 G2 34 J5 N3 40 43 N5(5) PA0 - - - - - - - T1(5) PA0_C 23 H2 35 K4 N2 41 44 N4(5) PA1 - - - - - - - T2(5) PA1_C 24 J2 36 N1 P2 42 45 N3 PA2 Notes LQFP144 22 I/O structure TFBGA100 Pin name (function after reset) Pin type LQFP100 Pin/ball name I/O FT_a - ANA TT_a - FT_ ha - ANA TT_a - I/O I/O FT_a Alternate functions TIM2_CH1/TIM2_ETR, TIM5_CH1, TIM8_ETR, TIM15_BKIN, USART2_CTS/USART2_ NSS, UART4_TX, SDMMC2_CMD, SAI2_SD_B, ETH_MII_CRS, EVENTOUT TIM2_CH2, TIM5_CH2, LPTIM3_OUT, TIM15_CH1N, USART2_RTS/USART2_ DE, UART4_RX, QUADSPI_BK1_IO3, SAI2_MCLK_B, ETH_MII_RX_CLK/ETH_ RMII_REF_CLK, LCD_R2, EVENTOUT Additional functions ADC1_INP16, WKUP0 ADC12_INN1, ADC12_INP0 ADC1_INN16, ADC1_INP17 ADC12_INP1 - TIM2_CH3, TIM5_CH3, LPTIM4_OUT, TIM15_CH1, USART2_TX, SAI2_SCK_B, ETH_MDIO, MDIOS_MDIO, LCD_R1, EVENTOUT ADC12_INP14, WKUP1 ADC3_INP13 - - - N2 F4 43 46 N2 PH2 I/O FT_ ha - LPTIM1_IN2, QUADSPI_BK2_IO0, SAI2_SCK_B, ETH_MII_CRS, FMC_SDCKE0, LCD_R0, EVENTOUT - K1 - M1 - - - F5 VDD S - - - - - J1 - M7 J8 - - C16 VSS S - - - - - QUADSPI_BK2_IO1, SAI2_MCLK_B, ETH_MII_COL, FMC_SDNE0, LCD_R1, EVENTOUT ADC3_INN13, ADC3_INP14 - - - M3 G4 44 47 P2 PH3 I/O FT_ ha - - - K3 H4 45 48 P3 PH4 I/O FT_fa - I2C2_SCL, LCD_G5, OTG_HS_ULPI_NXT, LCD_G4, EVENTOUT ADC3_INN14, ADC3_INP15 - - - L3 J4 46 49 P4 PH5 I/O FT_fa - I2C2_SDA, SPI5_NSS, FMC_SDNWE, EVENTOUT ADC3_INN15, ADC3_INP16 68/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Pin descriptions Table 9. Pin/ball definition (continued) R2 47 50 U2 PA3 I/O FT_ ha - 26 - 38 G2 K6 - 51 F2(4) VSS S - - - - - - - - L4 48 - - VSS S - - - - 27 - 39 - K4 49 52 G5 VDD S - - - - - D1PWREN, TIM5_ETR, SPI1_NSS/I2S1_WS, SPI3_NSS/I2S3_WS, USART2_CK, SPI6_NSS, OTG_HS_SOF, DCMI_HSYNC, LCD_VSYNC, EVENTOUT ADC12_INP18, DAC1_OUT1 - D2PWREN, TIM2_CH1/TIM2_ETR, TIM8_CH1N, SPI1_SCK/I2S1_CK, SPI6_SCK, OTG_HS_ULPI_CK, LCD_R4, EVENTOUT ADC12_INN18, ADC12_INP19, DAC1_OUT2 - TIM1_BKIN, TIM3_CH1, TIM8_BKIN, SPI1_MISO/I2S1_SDI, SPI6_MISO, TIM13_CH1, TIM8_BKIN_COMP12, MDIOS_MDC, TIM1_BKIN_COMP12, DCMI_PIXCLK, LCD_G2, EVENTOUT ADC12_INP3 - TIM1_CH1N, TIM3_CH2, TIM8_CH1N, SPI1_MOSI/I2S1_SDO, ADC12_INN3, SPI6_MOSI, TIM14_CH1, ADC12_INP7, ETH_MII_RX_DV/ETH_R OPAMP1_VINM MII_CRS_DV, FMC_SDNWE, EVENTOUT 28 29 30 31 G3 H3 J3 K3 40 41 42 43 H6 L4 K5 J6 N4 P4 P3 R3 50 51 52 53 LQFP208 N3 LQFP176 37 UFBGA169 K2 LQFP144 25 TIM2_CH4, TIM5_CH4, LPTIM5_OUT, TIM15_CH2, USART2_RX, LCD_B2, OTG_HS_ULPI_D0, ETH_MII_COL, LCD_B5, EVENTOUT TFBGA100 Alternate functions LQFP100 Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 UFBGA176+25 Pin/ball name 53 54 55 56 U3 T3 R3 R5 PA4 PA5 PA6 PA7 I/O I/O I/O I/O DS12110 Rev 9 TT_a TT_ ha FT_a TT_a Additional functions ADC12_INP15 69/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Table 9. Pin/ball definition (continued) 32 G4 44 K6 N5 54 57 T4 PC4 I/O TT_a Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 TFBGA100 LQFP100 Pin/ball name Alternate functions Additional functions - DFSDM1_CKIN2, I2S1_MCK, SPDIFRX1_IN3, ETH_MII_RXD0/ETH_R MII_RXD0, FMC_SDNE0, EVENTOUT ADC12_INP4, OPAMP1_ VOUT, COMP1_INM ADC12_INN4, ADC12_INP8, OPAMP1_ VINM 33 H4 45 N5 P5 55 58 U4 PC5 I/O TT_a - SAI1_D3, DFSDM1_DATIN2, SPDIFRX1_IN4, SAI4_D3, ETH_MII_RXD1/ETH_R MII_RXD1, FMC_SDCKE0, COMP1_OUT, EVENTOUT - - - N4 - - 59 G13 VDD S - - - - - - - H12 J9 - 60 R4 VSS S - - - - - TIM1_CH2N, TIM3_CH3, TIM8_CH2N, DFSDM1_CKOUT, UART4_CTS, LCD_R3, OTG_HS_ULPI_D1, ETH_MII_RXD2, LCD_G1, EVENTOUT ADC12_INN5, ADC12_INP9, OPAMP1_VINP, COMP1_INP - TIM1_CH3N, TIM3_CH4, TIM8_CH3N, DFSDM1_DATIN1, LCD_R6, OTG_HS_ULPI_D2, ETH_MII_RXD3, LCD_G0, EVENTOUT ADC12_INP5, COMP1_INM COMP1_INP 34 35 J4 K4 46 47 M5 L5 R5 R4 56 57 61 62 U5 T5 PB0 PB1 I/O I/O FT_a TT_a 36 G5 48 L6 M6 58 63 R6 PB2 I/O FT_ ha - RTC_OUT, SAI1_D1, DFSDM1_CKIN1, SAI1_SD_A, SPI3_MOSI/I2S3_SDO, SAI4_SD_A, QUADSPI_CLK, SAI4_D1, EVENTOUT - - - - - - 64 P5 PI15 I/O FT - LCD_G2, LCD_R0, EVENTOUT - - - - J4 - - 65 N6 PJ0 I/O FT - LCD_R7, LCD_R1, EVENTOUT - - - - H5 - - 66 P6 PJ1 I/O FT - LCD_R2, EVENTOUT - - - - - - - 67 T6 PJ2 I/O FT - LCD_R3, EVENTOUT - 70/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Pin descriptions Table 9. Pin/ball definition (continued) LQFP100 TFBGA100 LQFP144 UFBGA169 UFBGA176+25 LQFP176 LQFP208 TFBGA240 +25 Pin name (function after reset) Pin type I/O structure Notes Pin/ball name Alternate functions - - - - - - 68 U6 PJ3 I/O FT - LCD_R4, EVENTOUT - - - - - - - 69 U7 PJ4 I/O FT - LCD_R5, EVENTOUT - - - 49 M6 R6 59 70 T7 PF11 I/O FT_a - SPI5_MOSI, SAI2_SD_B, FMC_SDNRAS, DCMI_D12, EVENTOUT ADC1_INP2 - - 50 N6 P6 60 71 R7 PF12 I/O FT_ ha - FMC_A6, EVENTOUT ADC1_INN2, ADC1_INP6 - - 51 M11 M8 61 72 J3 VSS S - - - - - - 52 - N8 62 73 H5 VDD S - - - - - - 53 G7 N6 63 74 P7 PF13 I/O FT_ ha - DFSDM1_DATIN6, I2C4_SMBA, FMC_A7, EVENTOUT ADC2_INP2 - - 54 H7 R7 64 75 P8 PF14 I/O FT_ fha - DFSDM1_CKIN6, I2C4_SCL, FMC_A8, EVENTOUT ADC2_INN2, ADC2_INP6 - - 55 J7 P7 65 76 R9 PF15 I/O FT_fh - I2C4_SDA, FMC_A9, EVENTOUT - - - 56 K7 N7 66 77 T8 PG0 I/O FT_h - FMC_A10, EVENTOUT - - - - M2 F6 - - J16 VSS S - - - - - - - A10 - - - H13 VDD S - - - - - - 57 L7 M7 67 78 U8 PG1 I/O TT_h - FMC_A11, EVENTOUT OPAMP2_ VINM - TIM1_ETR, DFSDM1_DATIN2, UART7_RX, QUADSPI_BK2_IO0, FMC_D4/FMC_DA4, EVENTOUT OPAMP2_ VOUT, COMP2_INM - TIM1_CH1N, DFSDM1_CKIN2, UART7_TX, QUADSPI_BK2_IO1, FMC_D5/FMC_DA5, COMP2_OUT, EVENTOUT OPAMP2_ VINM 37 38 39 H5 J5 K5 58 59 60 G8 H8 J8 R8 P8 P9 68 69 70 79 80 81 U9 T9 P9 PE7 PE8 PE9 I/O I/O I/O DS12110 Rev 9 TT_ ha TT_ ha TT_ ha - Additional functions TIM1_CH1, DFSDM1_CKOUT, UART7_RTS/UART7_DE OPAMP2_VINP, COMP2_INP , QUADSPI_BK2_IO2, FMC_D6/FMC_DA6, EVENTOUT 71/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Table 9. Pin/ball definition (continued) TFBGA100 LQFP144 UFBGA169 UFBGA176+25 LQFP176 LQFP208 TFBGA240 +25 Pin name (function after reset) Pin type I/O structure - - 61 C12 M9 71 82 J17 VSS S - - - - - - 62 C13 N9 72 83 J13 VDD S - - - - - TIM1_CH2N, DFSDM1_DATIN4, UART7_CTS, QUADSPI_BK2_IO3, FMC_D7/FMC_DA7, EVENTOUT COMP2_INM - TIM1_CH2, DFSDM1_CKIN4, SPI4_NSS, SAI2_SD_B, FMC_D8/FMC_DA8, LCD_G3, EVENTOUT COMP2_INP - TIM1_CH3N, DFSDM1_DATIN5, SPI4_SCK, SAI2_SCK_B, FMC_D9/FMC_DA9, COMP1_OUT, LCD_B4, EVENTOUT - - 40 41 42 G6 H6 J6 63 64 65 M8 N8 L8 R9 P10 R10 73 74 75 84 85 86 N9 P10 R10 PE10 PE11 PE12 I/O FT_ ha I/O FT_ ha I/O FT_h Notes LQFP100 Pin/ball name Alternate functions Additional functions 43 K6 66 K8 N11 76 87 T10 PE13 I/O FT_h - TIM1_CH3, DFSDM1_CKIN5, SPI4_MISO, SAI2_FS_B, FMC_D10/FMC_DA10, COMP2_OUT, LCD_DE, EVENTOUT - - - L12 F7 - - T12 VSS S - - - - - - - H13 - - - K13 VDD S - - - - - TIM1_CH4, SPI4_MOSI, SAI2_MCLK_B, FMC_D11/FMC_DA11, LCD_CLK, EVENTOUT - - TIM1_BKIN, FMC_D12/FMC_DA12, TIM1_BKIN_COMP12/ COMP_TIM1_BKIN, LCD_R7, EVENTOUT - 44 45 G7 H7 72/361 67 68 J9 N9 P11 R11 77 78 88 89 U10 R11 PE14 PE15 I/O I/O DS12110 Rev 9 FT_h FT_h STM32H742xI/G STM32H743xI/G Pin descriptions Table 9. Pin/ball definition (continued) J7 L9 R12 79 90 P11 PB10 I/O I/O structure Pin type TFBGA240 +25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 69 Pin name (function after reset) FT_f Notes 46 TFBGA100 LQFP100 Pin/ball name Alternate functions Additional functions - TIM2_CH3, HRTIM_SCOUT, LPTIM2_IN1, I2C2_SCL, SPI2_SCK/I2S2_CK, DFSDM1_DATIN7, USART3_TX, QUADSPI_BK1_NCS, OTG_HS_ULPI_D3, ETH_MII_RX_ER, LCD_G4, EVENTOUT - - 47 K7 70 M9 R13 80 91 P12 PB11 I/O FT_f - TIM2_CH4, HRTIM_SCIN, LPTIM2_ETR, I2C2_SDA, DFSDM1_CKIN7, USART3_RX, OTG_HS_ULPI_D4, ETH_MII_TX_EN/ETH_R MII_TX_EN, LCD_G5, EVENTOUT 48 F8 71 N10 M10 81 92 U11 VCAP S - - - - 49 E4 - - K7 - 93 - VSS S - - - - - - - M10 - - - U12 (8) S - - - - 50 - 72 M1 N10 82 94 L13 VDD S - - - - - - - - - - 95 R12 PJ5 I/O FT - LCD_R6, EVENTOUT - - VDDLDO - - - - M11 83 96 T11 PH6 I/O FT - TIM12_CH1, I2C2_SMBA, SPI5_SCK, ETH_MII_RXD2, FMC_SDNE1, DCMI_D8, EVENTOUT - - - - N12 84 97 U13 PH7 I/O FT_fa - I2C3_SCL, SPI5_MISO, ETH_MII_RXD3, FMC_SDCKE1, DCMI_D9, EVENTOUT - - TIM5_ETR, I2C3_SDA, FMC_D16, DCMI_HSYNC, LCD_R2, EVENTOUT - - - - - M12 85 98 T13 PH8 I/O FT_fh a - - - - F8 - - - VSS S - - - - - - - L13 - - - M13 VDD S - - - - DS12110 Rev 9 73/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Table 9. Pin/ball definition (continued) Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 TFBGA100 LQFP100 Pin/ball name Alternate functions Additional functions - - - - - M13 86 99 R13 PH9 I/O FT_h - TIM12_CH2, I2C3_SMBA, FMC_D17, DCMI_D0, LCD_R3, EVENTOUT - - - K9 L13 87 100 P13 PH10 I/O FT_h - TIM5_CH1, I2C4_SMBA, FMC_D18, DCMI_D1, LCD_R4, EVENTOUT - - - - L10 L12 88 101 P14 PH11 I/O FT_fh - TIM5_CH2, I2C4_SCL, FMC_D19, DCMI_D2, LCD_R5, EVENTOUT - - - - K10 K12 89 102 R14 PH12 I/O FT_fh - TIM5_CH3, I2C4_SDA, FMC_D20, DCMI_D3, LCD_R6, EVENTOUT - - - - - H12 90 - N16 VSS S - - - - - - - N11 J12 91 103 P17 VDD S - - - - - TIM1_BKIN, I2C2_SMBA, SPI2_NSS/I2S2_WS, DFSDM1_DATIN1, USART3_CK, FDCAN2_RX, OTG_HS_ULPI_D5, ETH_MII_TXD0/ETH_RM II_TXD0, OTG_HS_ID, TIM1_BKIN_COMP12, UART5_RX, EVENTOUT - TIM1_CH1N, LPTIM2_OUT, SPI2_SCK/I2S2_CK, DFSDM1_CKIN1, USART3_CTS/USART3_ NSS, FDCAN2_TX, OTG_HS_ULPI_D6, ETH_MII_TXD1/ETH_RM II_TXD1, UART5_TX, EVENTOUT 51 52 K8 J8 74/361 73 74 N12 L11 P12 P13 92 93 104 105 T14 U14 PB12(9) PB13(9) I/O I/O DS12110 Rev 9 FT_u FT_u OTG_HS_ VBUS STM32H742xI/G STM32H743xI/G Pin descriptions Table 9. Pin/ball definition (continued) 53 54 55 56 H10 G10 K9 J9 75 76 77 78 N13 M13 M12 K11 R14 R15 P15 P14 94 95 96 97 106 107 108 109 U15 T15 U16 T17 PB14 PB15 PD8 PD9 I/O I/O I/O I/O FT_u FT_u FT_h FT_h Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 TFBGA100 LQFP100 Pin/ball name Alternate functions Additional functions - TIM1_CH2N, TIM12_CH1, TIM8_CH2N, USART1_TX, SPI2_MISO/I2S2_SDI, DFSDM1_DATIN2, USART3_RTS/ USART3_DE, UART4_RTS/UART4_DE , SDMMC2_D0, OTG_HS_DM, EVENTOUT - - RTC_REFIN, TIM1_CH3N, TIM12_CH2, TIM8_CH3N, USART1_RX, SPI2_MOSI/I2S2_SDO, DFSDM1_CKIN2, UART4_CTS, SDMMC2_D1, OTG_HS_DP, EVENTOUT - - DFSDM1_CKIN3, SAI3_SCK_B, USART3_TX, SPDIFRX1_IN2, FMC_D13/FMC_DA13, EVENTOUT - - DFSDM1_DATIN3, SAI3_SD_B, USART3_RX, FMC_D14/FMC_DA14, EVENTOUT - - 57 H9 79 K12 N15 98 110 T16 PD10 I/O FT_h - DFSDM1_CKOUT, SAI3_FS_B, USART3_CK, FMC_D15/FMC_DA15, LCD_B3, EVENTOUT - - - N7 - - - N12 VDD S - - - - - - - - F9 - - U17 VSS S - - - - DS12110 Rev 9 75/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Table 9. Pin/ball definition (continued) 59 G9 K10 81 J10 K13 N14 N13 99 100 111 112 R15 R16 PD11 PD12 I/O I/O I/O structure Pin type TFBGA240 +25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 80 Pin name (function after reset) FT_h FT_fh Notes 58 TFBGA100 LQFP100 Pin/ball name Alternate functions Additional functions - LPTIM2_IN2, I2C4_SMBA, USART3_CTS/USART3_ NSS, QUADSPI_BK1_IO0, SAI2_SD_A, FMC_A16, EVENTOUT - - LPTIM1_IN1, TIM4_CH1, LPTIM2_IN1, I2C4_SCL, USART3_RTS/USART3_ DE, QUADSPI_BK1_IO1, SAI2_FS_A, FMC_A17, EVENTOUT - - 60 J10 82 J11 M15 101 113 R17 PD13 I/O FT_fh - LPTIM1_OUT, TIM4_CH2, I2C4_SDA, QUADSPI_BK1_IO3, SAI2_SCK_A, FMC_A18, EVENTOUT - - 83 - K8 102 114 - VSS S - - - - - - 84 - J13 103 115 N11 VDD S - - - - - TIM4_CH3, SAI3_MCLK_B, UART8_CTS, FMC_D0/FMC_DA0, EVENTOUT - - 61 H8 85 J13 M14 104 116 P16 PD14 I/O FT_h 62 G8 86 J12 L14 105 117 P15 PD15 I/O FT_h - TIM4_CH4, SAI3_MCLK_A, UART8_RTS/UART8_DE , FMC_D1/FMC_DA1, EVENTOUT - - - - - - 118 N15 PJ6 I/O FT - TIM8_CH2, LCD_R7, EVENTOUT - - - - - - - 119 N14 PJ7 I/O FT - TRGIN, TIM8_CH2N, LCD_G0, EVENTOUT - - - - - - - - N10 VDD S - - - - - - F10 - - R8 VSS S - - - - - - - - 120 N13 PJ8 I/O FT - TIM1_CH3N, TIM8_CH1, UART8_TX, LCD_G1, EVENTOUT - - - - - - - 121 M14 PJ9 I/O FT - TIM1_CH3, TIM8_CH1N, UART8_RX, LCD_G2, EVENTOUT - 76/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Pin descriptions Table 9. Pin/ball definition (continued) LQFP100 TFBGA100 LQFP144 UFBGA169 UFBGA176+25 LQFP176 LQFP208 TFBGA240 +25 Pin name (function after reset) Pin type I/O structure Notes Pin/ball name Alternate functions - - - - - - 122 L14 PJ10 I/O FT - TIM1_CH2N, TIM8_CH2, SPI5_MOSI, LCD_G3, EVENTOUT - - - - - - - 123 K14 PJ11 I/O FT - TIM1_CH2, TIM8_CH2N, SPI5_MISO, LCD_G4, EVENTOUT - - - - - - - 124 N8 VDD S - - - - G6 - 125 U1 VSS S - - - - - - - - - - - NC - - - - - - - - - - - - NC - - - - - - - - - - - - (2) NC - - - - - - - - - - - - K15 - - - - - - - N17 (2) M16 (2) M17 - Additional functions - VSS S - - - - L16 (2) NC - - - - - L17 (2) NC - - - - - NC - - - - - (2) NC - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - L15 VSS S - - - - - - - - - - 126 J14 PK0 I/O FT - TIM1_CH1N, TIM8_CH3, SPI5_SCK, LCD_G5, EVENTOUT - - - - - - - 127 J15 PK1 I/O FT - TIM1_CH1, TIM8_CH3N, SPI5_NSS, LCD_G6, EVENTOUT - - - - - - - 128 H17 PK2 I/O FT - TIM1_BKIN, TIM8_BKIN, TIM8_BKIN_COMP12, TIM1_BKIN_COMP12, LCD_G7, EVENTOUT - - - 87 H9 L15 106 129 H16 PG2 I/O FT_h - TIM8_BKIN, TIM8_BKIN_COMP12, FMC_A12, EVENTOUT - - - 88 H10 K15 107 130 H15 PG3 I/O FT_h - TIM8_BKIN2, TIM8_BKIN2_COMP12, FMC_A13, EVENTOUT - - - - - G7 - - - VSS S - - - - K16 (2) K17 DS12110 Rev 9 77/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Table 9. Pin/ball definition (continued) UFBGA169 UFBGA176+25 LQFP176 LQFP208 TFBGA240 +25 - - - - - - N7 VDD S Notes LQFP144 - I/O structure TFBGA100 Pin name (function after reset) Pin type LQFP100 Pin/ball name Alternate functions Additional functions - - - - - - - 89 F8 K14 108 131 H14 PG4 I/O FT_h - TIM1_BKIN2, TIM1_BKIN2_COMP12, FMC_A14/FMC_BA0, EVENTOUT - - 90 H11 K13 109 132 G14 PG5 I/O FT_h - TIM1_ETR, FMC_A15/FMC_BA1, EVENTOUT - - TIM17_BKIN, HRTIM_CHE1, QUADSPI_BK1_NCS, FMC_NE3, DCMI_D12, LCD_R7, EVENTOUT - - HRTIM_CHE2, SAI1_MCLK_A, USART6_CK, FMC_INT, DCMI_D13, LCD_CLK, EVENTOUT - - - - - - 91 92 G9 G10 J15 J14 110 111 133 134 G15 F16 PG6 PG7 I/O I/O FT_h FT_h - - 93 G11 H14 112 135 F15 PG8 I/O FT_h - TIM8_ETR, SPI6_NSS, USART6_RTS/USART6_ DE, SPDIFRX1_IN3, ETH_PPS_OUT, FMC_SDCLK, LCD_G7, EVENTOUT - - 94 - G12 113 136 G16 VSS S - - - - - - - G12 - - - G17 VDD50 USB(10) S - - - - - F6 95 G13 H13 114 137 F17 VDD33 USB S - - - - - - - - - - - M5 VDD S - - - - - HRTIM_CHA1, TIM3_CH1, TIM8_CH1, DFSDM1_CKIN3, I2S2_MCK, USART6_TX, SDMMC1_D0DIR, FMC_NWAIT, SDMMC2_D6, SDMMC1_D6, DCMI_D0, LCD_HSYNC, EVENTOUT SWPMI_IO 63 F10 78/361 96 F9 H15 115 138 F14 PC6 I/O DS12110 Rev 9 FT_h STM32H742xI/G STM32H743xI/G Pin descriptions Table 9. Pin/ball definition (continued) 64 65 E10 F9 97 98 F10 F12 G15 G14 116 117 139 140 F13 E13 PC7 PC8 I/O I/O FT_h FT_h Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 TFBGA100 LQFP100 Pin/ball name Alternate functions Additional functions - TRGIO, HRTIM_CHA2, TIM3_CH2, TIM8_CH2, DFSDM1_DATIN3, I2S3_MCK, USART6_RX, SDMMC1_D123DIR, FMC_NE1, SDMMC2_D7, SWPMI_TX, SDMMC1_D7, DCMI_D1, LCD_G6, EVENTOUT - - TRACED1, HRTIM_CHB1, TIM3_CH3, TIM8_CH3, USART6_CK, UART5_RTS/UART5_DE , FMC_NE2/FMC_NCE, SWPMI_RX, SDMMC1_D0, DCMI_D2, EVENTOUT - MCO2, TIM3_CH4, TIM8_CH4, I2C3_SDA, I2S_CKIN, UART5_CTS, QUADSPI_BK1_IO0, LCD_G3, SWPMI_SUSPEND, SDMMC1_D1, DCMI_D3, LCD_B2, EVENTOUT - 66 E9 99 F11 F14 118 141 E14 PC9 I/O FT_fh - - - - - G8 - - - VSS S - - - - - - - - - - L5 VDD S - - - 67 68 D9 C9 100 101 E12 E11 F15 E15 119 120 142 143 E15 D15 PA8 PA9 I/O I/O DS12110 Rev 9 FT_ fha FT_u - MCO1, TIM1_CH1, HRTIM_CHB2, TIM8_BKIN2, I2C3_SCL, USART1_CK, OTG_FS_SOF, UART7_RX, TIM8_BKIN2_COMP12, LCD_B3, LCD_R6, EVENTOUT - - TIM1_CH2, HRTIM_CHC1, LPUART1_TX, I2C3_SMBA, SPI2_SCK/I2S2_CK, USART1_TX, DCMI_D0, LCD_R5, EVENTOUT OTG_FS_VBUS 79/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Table 9. Pin/ball definition (continued) 69 70 D10 C10 102 103 E10 F13 D15 C15 121 122 144 145 D14 E17 PA10 PA11 I/O I/O FT_u FT_u Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 TFBGA100 LQFP100 Pin/ball name Alternate functions Additional functions - TIM1_CH3, HRTIM_CHC2, LPUART1_RX, USART1_RX, OTG_FS_ID, MDIOS_MDIO, LCD_B4, DCMI_D1, LCD_B1, EVENTOUT - - TIM1_CH4, HRTIM_CHD1, LPUART1_CTS, SPI2_NSS/I2S2_WS, UART4_RX, USART1_CTS/USART1_ NSS, FDCAN1_RX, OTG_FS_DM, LCD_R4, EVENTOUT - - 71 B10 104 E13 B15 123 146 E16 PA12 I/O FT_u - TIM1_ETR, HRTIM_CHD2, LPUART1_RTS/ LPUART1_DE, SPI2_SCK/I2S2_CK, UART4_TX, USART1_RTS/USART1_ DE, SAI2_FS_B, FDCAN1_TX, OTG_FS_DP, LCD_R5, EVENTOUT 72 A10 105 D11 A15 124 147 C15 PA13 (JTMS/SW DIO) I/O FT - JTMS-SWDIO, EVENTOUT - 73 E7 106 D13 F13 125 148 D17 VCAP S - - - - 74 E5 107 - F12 126 149 - VSS S - - - - - - - D12 - - - C17 - - - - 75 - 108 - G13 127 150 K5 VDD S - - - - - - - - E12 128 151 D16 PH13 I/O FT_h - TIM8_CH1N, UART4_TX, FDCAN1_TX, FMC_D21, LCD_G2, EVENTOUT - - TIM8_CH2N, UART4_RX, FDCAN1_RX, FMC_D22, DCMI_D4, LCD_G3, EVENTOUT - - 80/361 - - - E13 129 152 B17 VDDLDO (8) PH14 I/O DS12110 Rev 9 FT_h STM32H742xI/G STM32H743xI/G Pin descriptions Table 9. Pin/ball definition (continued) UFBGA169 UFBGA176+25 LQFP176 LQFP208 TFBGA240 +25 - - - D13 130 153 B16 PH15 I/O FT_h Notes LQFP144 - I/O structure TFBGA100 Pin name (function after reset) Pin type LQFP100 Pin/ball name Alternate functions Additional functions - TIM8_CH3N, FMC_D23, DCMI_D11, LCD_G4, EVENTOUT - - - - - A13 E14 131 154 A16 PI0 I/O FT_h - TIM5_CH4, SPI2_NSS/I2S2_WS, FMC_D24, DCMI_D13, LCD_G5, EVENTOUT - - - - G9 - - - VSS S - - - - - - - - B13 D14 132 155 A15 PI1 I/O FT_h - TIM8_BKIN2, SPI2_SCK/I2S2_CK, TIM8_BKIN2_COMP12, FMC_D25, DCMI_D8, LCD_G6, EVENTOUT - - - A6 C14 133 156 B15 PI2 I/O FT_h - TIM8_CH4, SPI2_MISO/I2S2_SDI, FMC_D26, DCMI_D9, LCD_G7, EVENTOUT - - - - - B7 C13 134 157 C14 PI3 I/O FT_h - TIM8_ETR, SPI2_MOSI/I2S2_SDO, FMC_D27, DCMI_D10, EVENTOUT - - - - D9 135 - - VSS S - - - - - - - - C9 136 158 - VDD S - - - - 76 A9 109 B12 A14 137 159 B14 PA14 (JTCK/SW CLK) I/O FT - JTCK-SWCLK, EVENTOUT - - JTDI, TIM2_CH1/TIM2_ETR, HRTIM_FLT1, CEC, SPI1_NSS/I2S1_WS, SPI3_NSS/I2S3_WS, SPI6_NSS, UART4_RTS/UART4_DE , UART7_TX, EVENTOUT - - HRTIM_EEV1, DFSDM1_CKIN5, SPI3_SCK/I2S3_CK, USART3_TX, UART4_TX, QUADSPI_BK1_IO1, SDMMC1_D2, DCMI_D8, LCD_R2, EVENTOUT - 77 78 A8 B9 110 111 C11 A12 A13 B14 138 139 160 161 A14 A13 PA15 (JTDI) PC10 I/O I/O DS12110 Rev 9 FT FT_ ha 81/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Table 9. Pin/ball definition (continued) 79 B8 112 B11 B13 140 162 B13 PC11 I/O FT_h Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 TFBGA100 LQFP100 Pin/ball name Alternate functions Additional functions - HRTIM_FLT2, DFSDM1_DATIN5, SPI3_MISO/I2S3_SDI, USART3_RX, UART4_RX, QUADSPI_BK2_NCS, SDMMC1_D3, DCMI_D4, EVENTOUT - - 80 C8 113 A11 A12 141 163 C12 PC12 I/O FT_h - TRACED3, HRTIM_EEV2, SPI3_MOSI/I2S3_SDO, USART3_CK, UART5_TX, SDMMC1_CK, DCMI_D9, EVENTOUT - - - - G10 - - - VSS S - - - - - DFSDM1_CKIN6, SAI3_SCK_A, UART4_RX, FDCAN1_RX, FMC_D2/FMC_DA2, EVENTOUT - - DFSDM1_DATIN6, SAI3_SD_A, UART4_TX, FDCAN1_TX, FMC_D3/FMC_DA3, EVENTOUT - - TRACED2, TIM3_ETR, UART5_RX, SDMMC1_CMD, DCMI_D11, EVENTOUT - - DFSDM1_CKOUT, SPI2_SCK/I2S2_CK, USART2_CTS/USART2_ NSS, FMC_CLK, DCMI_D5, LCD_G7, EVENTOUT - - - 81 82 83 84 D8 E8 B7 C7 114 115 116 117 D10 C10 E9 D9 B12 C12 D12 D11 142 143 144 145 164 165 166 167 D13 E12 D12 B12 PD0 PD1 PD2 PD3 I/O I/O I/O I/O FT_h FT_h FT_h FT_h 85 D7 118 C9 D10 146 168 A12 PD4 I/O FT_h - HRTIM_FLT3, SAI3_FS_A, USART2_RTS/USART2_ DE, FMC_NOE, EVENTOUT 86 B6 119 A9 C11 147 169 A11 PD5 I/O FT_h - HRTIM_EEV3, USART2_TX, FMC_NWE, EVENTOUT 82/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Pin descriptions Table 9. Pin/ball definition (continued) TFBGA100 LQFP144 UFBGA169 UFBGA176+25 LQFP176 LQFP208 TFBGA240 +25 Pin name (function after reset) Pin type I/O structure - - 120 - D8 148 170 - VSS S - - - - - - 121 - C8 149 171 - VDD S - - - - - SAI1_D1, DFSDM1_CKIN4, DFSDM1_DATIN1, SPI3_MOSI/I2S3_SDO, SAI1_SD_A, USART2_RX, SAI4_SD_A, SAI4_D1, SDMMC2_CK, FMC_NWAIT, DCMI_D10, LCD_B2, EVENTOUT - - 87 C6 122 B9 B11 150 172 B11 PD6 I/O FT_h Notes LQFP100 Pin/ball name Alternate functions Additional functions 88 D6 123 D8 A11 151 173 C11 PD7 I/O FT_h - DFSDM1_DATIN4, SPI1_MOSI/I2S1_SDO, DFSDM1_CKIN1, USART2_CK, SPDIFRX1_IN1, SDMMC2_CMD, FMC_NE1, EVENTOUT - - - - - - 174 D11 PJ12 I/O FT - TRGOUT, LCD_G3, LCD_B0, EVENTOUT - - - - - - - 175 E10 PJ13 I/O FT - LCD_B4, LCD_B1, EVENTOUT - - - - - - - 176 D10 PJ14 I/O FT - LCD_B2, EVENTOUT - - - - - - - 177 B10 PJ15 I/O FT - LCD_B3, EVENTOUT - - - - - H6 - - - VSS S - - - - - - - A7 - - - - VDD S - - - - - SPI1_MISO/I2S1_SDI, USART6_RX, SPDIFRX1_IN4, QUADSPI_BK2_IO2, SAI2_FS_B, FMC_NE2/FMC_NCE, DCMI_VSYNC, EVENTOUT - - HRTIM_FLT5, SPI1_NSS/I2S1_WS, LCD_G3, SAI2_SD_B, FMC_NE3, DCMI_D2, LCD_B2, EVENTOUT - - - - - 124 125 C8 A8 C10 B10 152 153 178 179 A10 A9 PG9 PG10 I/O I/O DS12110 Rev 9 FT_h FT_h 83/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Table 9. Pin/ball definition (continued) - - - - - 126 127 128 E8 D7 B9 B8 A8 154 155 156 180 181 182 B9 C9 D9 PG11 PG12 PG13 I/O I/O I/O I/O structure Pin type TFBGA240 +25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 B8 Pin name (function after reset) FT_h FT_h FT_h Notes - LQFP144 TFBGA100 LQFP100 Pin/ball name Alternate functions Additional functions - LPTIM1_IN2, HRTIM_EEV4, SPI1_SCK/I2S1_CK, SPDIFRX1_IN1, SDMMC2_D2, ETH_MII_TX_EN/ETH_R MII_TX_EN, DCMI_D3, LCD_B3, EVENTOUT - - LPTIM1_IN1, HRTIM_EEV5, SPI6_MISO, USART6_RTS/USART6_ DE, SPDIFRX1_IN2, LCD_B4, ETH_MII_TXD1/ETH_RM II_TXD1, FMC_NE4, LCD_B1, EVENTOUT - - TRACED0, LPTIM1_OUT, HRTIM_EEV10, SPI6_SCK, USART6_CTS/USART6_ NSS, ETH_MII_TXD0/ETH_RM II_TXD0, FMC_A24, LCD_R0, EVENTOUT - - - - 129 C7 A7 157 183 D8 PG14 I/O FT_h - TRACED1, LPTIM1_ETR, SPI6_MOSI, USART6_TX, QUADSPI_BK2_IO3, ETH_MII_TXD1/ETH_RM II_TXD1, FMC_A25, LCD_B0, EVENTOUT - - 130 - D7 158 184 - VSS S - - - - - - 131 - C7 159 185 - VDD S - - - - - - - - - - 186 C8 PK3 I/O FT - LCD_B4, EVENTOUT - - - - - - - 187 B8 PK4 I/O FT - LCD_B5, EVENTOUT - - - - - - - 188 A8 PK5 I/O FT - LCD_B6, EVENTOUT - - - - - - - 189 C7 PK6 I/O FT - LCD_B7, EVENTOUT - - - - - - - 190 D7 PK7 I/O FT - LCD_DE, EVENTOUT - - - - - H7 - - - VSS S - - - - 84/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Pin descriptions Table 9. Pin/ball definition (continued) UFBGA169 UFBGA176+25 LQFP176 LQFP208 TFBGA240 +25 - 132 E7 B7 160 191 D6 PG15 89 90 A7 A6 133 134 F7 B6 A10 A9 161 162 192 193 C6 B7 PB3(JTDO /TRACES WO) PB4(NJTR ST) I/O FT_h I/O I/O FT FT Notes LQFP144 - I/O structure TFBGA100 Pin name (function after reset) Pin type LQFP100 Pin/ball name Alternate functions Additional functions - USART6_CTS/USART6_ NSS, FMC_SDNCAS, DCMI_D13, EVENTOUT - - JTDO/TRACESWO, TIM2_CH2, HRTIM_FLT4, SPI1_SCK/I2S1_CK, SPI3_SCK/I2S3_CK, SPI6_SCK, SDMMC2_D2, CRS_SYNC, UART7_RX, EVENTOUT - - NJTRST, TIM16_BKIN, TIM3_CH1, HRTIM_EEV6, SPI1_MISO/I2S1_SDI, SPI3_MISO/I2S3_SDI, SPI2_NSS/I2S2_WS, SPI6_MISO, SDMMC2_D3, UART7_TX, EVENTOUT - - 91 C5 135 C6 A6 163 194 A5 PB5 I/O FT - TIM17_BKIN, TIM3_CH2, HRTIM_EEV7, I2C1_SMBA, SPI1_MOSI/I2S1_SDO, I2C4_SMBA, SPI3_MOSI/I2S3_SDO, SPI6_MOSI, FDCAN2_RX, OTG_HS_ULPI_D7, ETH_PPS_OUT, FMC_SDCKE1, DCMI_D10, UART5_RX, EVENTOUT - - - - H8 - - - VSS S - - - - - TIM16_CH1N, TIM4_CH1, HRTIM_EEV8, I2C1_SCL, CEC, I2C4_SCL, USART1_TX, LPUART1_TX, FDCAN2_TX, QUADSPI_BK1_NCS, DFSDM1_DATIN5, FMC_SDNE1, DCMI_D5, UART5_TX, EVENTOUT - 92 B5 136 A5 B6 164 195 B5 PB6 I/O DS12110 Rev 9 FT_f 85/361 101 Pin descriptions STM32H742xI/G STM32H743xI/G Table 9. Pin/ball definition (continued) Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 LQFP208 LQFP176 UFBGA176+25 UFBGA169 LQFP144 TFBGA100 LQFP100 Pin/ball name Alternate functions Additional functions PVD_IN 93 A5 137 D6 B5 165 196 C5 PB7 I/O FT_fa - TIM17_CH1N, TIM4_CH2, HRTIM_EEV9, I2C1_SDA, I2C4_SDA, USART1_RX, LPUART1_RX, DFSDM1_CKIN5, FMC_NL, DCMI_VSYNC, EVENTOUT 94 D5 138 E6 D6 166 197 E8 BOOT0 I B - - VPP - TIM16_CH1, TIM4_CH3, DFSDM1_CKIN7, I2C1_SCL, I2C4_SCL, SDMMC1_CKIN, UART4_RX, FDCAN1_RX, SDMMC2_D4, ETH_MII_TXD3, SDMMC1_D4, DCMI_D6, LCD_B6, EVENTOUT - - TIM17_CH1, TIM4_CH4, DFSDM1_DATIN7, I2C1_SDA, SPI2_NSS/I2S2_WS, I2C4_SDA, SDMMC1_CDIR, UART4_TX, FDCAN1_TX, SDMMC2_D5, I2C4_SMBA, SDMMC1_D5, DCMI_D7, LCD_B7, EVENTOUT - - 95 96 B4 A4 139 140 B5 C5 A5 B4 167 168 198 199 D5 D4 PB8 PB9 I/O I/O FT_fh FT_fh 97 D4 141 D5 A4 169 200 C4 PE0 I/O FT_h - LPTIM1_ETR, TIM4_ETR, HRTIM_SCIN, LPTIM2_ETR, UART8_RX, SAI2_MCLK_A, FMC_NBL0, DCMI_D2, EVENTOUT 98 C4 142 D4 A3 170 201 B4 PE1 I/O FT_h - LPTIM1_IN2, HRTIM_SCOUT, UART8_TX, FMC_NBL1, DCMI_D3, EVENTOUT - - - - - - - - A7 VCAP S - - - - 99 - - - D5 - 202 - VSS S - - - - 86/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Pin descriptions Table 9. Pin/ball definition (continued) UFBGA169 UFBGA176+25 LQFP176 LQFP208 TFBGA240 +25 F7 143 C4 C6 171 203 E7 PDR_ON - F4 - B4 - - - A6 100 - 144 - C5 172 204 - - - - - D4 173 205 A4 I (8) S VDD S VDDLDO PI4 I/O Notes LQFP144 - I/O structure TFBGA100 Pin name (function after reset) Pin type LQFP100 Pin/ball name Alternate functions Additional functions FT - - - - - - - - - - - - TIM8_BKIN, SAI2_MCLK_A, TIM8_BKIN_COMP12, FMC_NBL2, DCMI_D5, LCD_B4, EVENTOUT - - FT_h - - - - C4 174 206 A3 PI5 I/O FT_h - TIM8_CH1, SAI2_SCK_A, FMC_NBL3, DCMI_VSYNC, LCD_B5, EVENTOUT - - - A4 C3 175 207 A2 PI6 I/O FT_h - TIM8_CH2, SAI2_SD_A, FMC_D28, DCMI_D6, LCD_B6, EVENTOUT - - - - E2 C2 176 208 B3 PI7 I/O FT_h - TIM8_CH3, SAI2_FS_A, FMC_D29, DCMI_D7, LCD_B7, EVENTOUT - - - - - H9 - - - VSS S - - - - - - - - K9 - - - VSS S - - - - - - - - K10 - - M15 VSS S - - - - 1. When this pin/ball was previously configured as an oscillator, the oscillator function is kept during and after a reset. This is valid for all resets except for power-on reset. 2. This ball should remain floating. 3. This ball should not remain floating. It can be connected to VSS or VDD. It is reserved for future use. 4. This ball should be connected to VSS. 5. Pxy_C and Pxy pins/balls are two separate pads (analog switch open). The analog switch is configured through a SYSCFG register. Refer to the product reference manual for a detailed description of the switch configuration bits. 6. There is a direct path between Pxy_C and Pxy pins/balls, through an analog switch. Pxy alternate functions are available on Pxy_C when the analog switch is closed. The analog switch is configured through a SYSCFG register. Refer to the product reference manual for a detailed description of the switch configuration bits. 7. VREF+ pin, and consequently the internal voltage reference, are not available on the TFBGA100 package. On this package, this pin is double-bonded to VDDA which can be connected to an external reference. The internal voltage reference buffer is not available and must be kept disabled 8. When it is not available on a package, the VDDLDO pin is internally tied to VDD. 9. When the pin is used in USB configuration (OTG_HS_ID/OTG_HS_VBUS), the I/O is supplied by VDD33USB, otherwise it is supplied by VDD. 10. When it is not available on a package, the VDD50USB pin is internally tied to VDD33USB. DS12110 Rev 9 87/361 101 AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1/ 3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PA0 - TIM2_CH1/ TIM2_ETR TIM5_CH1 TIM8_ETR TIM15_BKIN - - USART2_ CTS/ USART2_ NSS UART4_TX SDMMC2_ CMD SAI2_SD_B ETH_MII_ CRS - - - EVENTOUT PA1 - TIM2_CH2 TIM5_CH2 LPTIM3_ OUT TIM15_ CH1N - - USART2_ RTS/ USART2_ DE UART4_RX QUADSPI_ BK1_IO3 SAI2_MCLK _B ETH_MII_ RX_CLK/ ETH_RMII_ REF_CLK - - LCD_R2 EVENTOUT PA2 - TIM2_CH3 TIM5_CH3 LPTIM4_ OUT TIM15_CH1 - - USART2_ TX SAI2_SCK_ B - - ETH_MDIO MDIOS_ MDIO - LCD_R1 EVENTOUT PA3 - TIM2_CH4 TIM5_CH4 LPTIM5_ OUT TIM15_CH2 - - USART2_ RX - LCD_B2 OTG_HS_ ULPI_D0 ETH_MII_ COL - - LCD_B5 EVENTOUT PA4 D1 PWREN - TIM5_ETR - - SPI1_NSS/ I2S1_WS SPI3_NSS/ I2S3_WS USART2_ CK SPI6_NSS - - - OTG_HS_ SOF DCMI_ HSYNC LCD_ VSYNC EVENTOUT PA5 D2 PWREN TIM2_CH1/ TIM2_ETR - TIM8_ CH1N - SPI1_SCK /I2S1_CK - - SPI6_SCK - OTG_HS_ ULPI_CK - - - LCD_R4 EVENTOUT PA6 - TIM1_BKIN TIM3_CH1 TIM8_BKIN - SPI1_MISO /I2S1_SDI - - SPI6_MISO TIM13_ CH1 TIM8_BKIN _COMP12 MDIOS_ MDC TIM1_BKIN _COMP12 DCMI_PIX CLK LCD_G2 EVENTOUT PA7 - TIM1_CH1N TIM3_CH2 TIM8_CH1 N - SPI1_MOSI /I2S1_SDO - - SPI6_MOSI TIM14_ CH1 - ETH_MII_ RX_DV/ ETH_RMII_ CRS_DV FMC_SDN WE - - EVENTOUT PA8 MCO1 TIM1_CH1 HRTIM_CH B2 TIM8_BKIN 2 I2C3_SCL - - USART1_ CK - - OTG_FS_ SOF UART7_RX TIM8_BKIN 2_COMP12 LCD_B3 LCD_R6 EVENTOUT PA9 - TIM1_CH2 HRTIM_CH C1 LPUART1_ TX I2C3_SMBA SPI2_SCK/ I2S2_CK - USART1_ TX - - - - - DCMI_D0 LCD_R5 EVENTOUT PA10 - TIM1_CH3 HRTIM_CH C2 LPUART1_ RX - - - USART1_ RX - - OTG_FS_ID MDIOS_ MDIO LCD_B4 DCMI_D1 LCD_B1 EVENTOUT PA11 - TIM1_CH4 HRTIM_CH D1 LPUART1_ CTS - SPI2_NSS /I2S2_WS UART4_RX USART1_ CTS/ USART1_ NSS - FDCAN1_ RX OTG_FS_ DM - - - LCD_R4 EVENTOUT PA12 - TIM1_ETR HRTIM_CH D2 LPUART1_ RTS/ LPUART1_ DE - SPI2_SCK/ I2S2_CK UART4_TX USART1_ RTS/ USART1_ DE SAI2_FS_B FDCAN1_ TX OTG_FS_ DP - - - LCD_R5 EVENTOUT DS12110 Rev 9 STM32H742xI/G STM32H743xI/G SYS LPUART/ TIM8/ LPTIM2/3/4/ 5/HRTIM1/ DFSDM1 Port Port A AF1 Pin descriptions 88/361 Table 10. Port A alternate functions AF2 AF3 AF4 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4/ 5/HRTIM1/ DFSDM1 PA13 JTMSSWDIO - - PA14 JTCKSWCLK - PA15 JTDI TIM2_CH1/ TIM2_ETR Port A Port AF1 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1/ 3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS - - - - - - - - - - - - EVENTOUT - - - - - - - - - - - - - EVENTOUT HRTIM_ FLT1 - CEC SPI1_NSS/ I2S1_WS SPI3_NSS/ I2S3_WS SPI6_NSS UART4_ RTS/ UART4_ DE - - UART7_TX - - - EVENTOUT STM32H742xI/G STM32H743xI/G Table 10. Port A alternate functions (continued) AF0 Table 11. Port B alternate functions AF2 AF3 AF4 AF1 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/5/ 6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/3 /6/UART7/S DMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/ DCMI/LCD /COMP UART5/ LCD SYS PB0 - TIM1_CH2N TIM3_CH3 TIM8_ CH2N - - DFSDM1_ CKOUT - UART4_ CTS LCD_R3 OTG_HS_ ULPI_D1 ETH_MII_ RXD2 - - LCD_G1 EVENTOUT PB1 - TIM1_CH3N TIM3_CH4 TIM8_ CH3N - - DFSDM1_ DATIN1 - - LCD_R6 OTG_HS_ ULPI_D2 ETH_MII_ RXD3 - - LCD_G0 EVENTOUT PB2 RTC_OUT - SAI1_D1 - DFSDM1_ CKIN1 - SAI1_SD_A SPI3_ MOSI/I2S3_ SDO SAI4_SD_ A QUADSPI_ CLK SAI4_D1 - - - - EVENTOUT PB3 JTDO/TRA CESWO TIM2_CH2 HRTIM_ FLT4 - - SPI1_SCK/ I2S1_CK SPI3_SCK/ I2S3_CK - SPI6_SCK SDMMC2_ D2 CRS_SYNC UART7_RX - - - EVENTOUT PB4 NJTRST TIM16_ BKIN TIM3_CH1 HRTIM_ EEV6 - SPI1_MISO/ I2S1_SDI SPI3_MISO/ I2S3_SDI SPI2_NSS/I 2S2_WS SPI6_ MISO SDMMC2_ D3 - UART7_TX - - - EVENTOUT PB5 - TIM17_ BKIN TIM3_CH2 HRTIM_ EEV7 I2C1_SMBA SPI1_MOSI/ I2S1_SDO I2C4_SMBA SPI3_MOSI/ I2S3_SDO SPI6_ MOSI FDCAN2_ RX OTG_HS_ ULPI_D7 ETH_PPS_ OUT FMC_ SDCKE1 DCMI_ D10 UART5_ RX EVENTOUT PB6 - TIM16_ CH1N TIM4_CH1 HRTIM_ EEV8 I2C1_SCL CEC I2C4_SCL USART1_ TX LPUART1_ TX FDCAN2_ TX QUADSPI_ BK1_NCS DFSDM1_ DATIN5 FMC_ SDNE1 DCMI_D5 UART5_ TX EVENTOUT PB7 - TIM17_ CH1N TIM4_CH2 HRTIM_ EEV9 I2C1_SDA - I2C4_SDA USART1_ RX LPUART1_ RX - - DFSDM1_ CKIN5 FMC_NL DCMI_ VSYNC - EVENTOUT Pin descriptions 89/361 AF5 Port Port B DS12110 Rev 9 AF0 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/5/ 6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/3 /6/UART7/S DMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/ DCMI/LCD /COMP UART5/ LCD SYS PB8 - TIM16_CH1 TIM4_CH3 DFSDM1_ CKIN7 I2C1_SCL - I2C4_SCL SDMMC1_ CKIN UART4_RX FDCAN1_ RX SDMMC2_ D4 ETH_MII_ TXD3 SDMMC1_ D4 DCMI_D6 LCD_B6 EVENTOUT PB9 - TIM17_CH1 TIM4_CH4 DFSDM1_ DATIN7 I2C1_SDA SPI2_NSS/ I2S2_WS I2C4_SDA SDMMC1_ CDIR UART4_TX FDCAN1_ TX SDMMC2_ D5 I2C4_ SMBA SDMMC1_ D5 DCMI_D7 LCD_B7 EVENTOUT PB10 - TIM2_CH3 HRTIM_ SCOUT LPTIM2_IN 1 I2C2_SCL SPI2_SCK/ I2S2_CK DFSDM1_ DATIN7 USART3_ TX - QUADSPI_ BK1_NCS OTG_HS_ ULPI_D3 ETH_MII_ RX_ER - - LCD_G4 EVENTOUT PB11 - TIM2_CH4 HRTIM_ SCIN LPTIM2_ ETR I2C2_SDA - DFSDM1_ CKIN7 USART3_ RX - - OTG_HS_ ULPI_D4 ETH_MII_ TX_EN/ ETH_RMII_ TX_EN - - LCD_G5 EVENTOUT PB12 - TIM1_BKIN - - I2C2_SMBA SPI2_NSS/ I2S2_WS DFSDM1_ DATIN1 USART3_ CK - FDCAN2_ RX OTG_HS_ ULPI_D5 ETH_MII_ TXD0/ETH_ RMII_TXD0 OTG_HS_ ID TIM1_ BKIN_ COMP12 UART5_ RX EVENTOUT PB13 - TIM1_CH1N - LPTIM2_ OUT - SPI2_SCK/ I2S2_CK DFSDM1_ CKIN1 USART3_ CTS/ USART3_ NSS - FDCAN2_ TX OTG_HS_ ULPI_D6 ETH_MII_ TXD1/ETH_ RMII_TXD1 - - UART5_ TX EVENTOUT PB14 - TIM1_CH2N TIM12_ CH1 TIM8_ CH2N USART1_TX SPI2_MISO/ I2S2_SDI DFSDM1_ DATIN2 USART3_ RTS/ USART3_ DE UART4_ RTS/ UART4_ DE SDMMC2_ D0 - - OTG_HS_ DM - - EVENTOUT PB15 RTC_ REFIN TIM1_CH3N TIM12_ CH2 TIM8_ CH3N USART1_RX SPI2_MOSI/ I2S2_SDO DFSDM1_ CKIN2 - UART4_ CTS SDMMC2_ D1 - - OTG_HS_ DP - - EVENTOUT DS12110 Rev 9 Port B Port AF1 Pin descriptions 90/361 Table 11. Port B alternate functions (continued) AF0 STM32H742xI/G STM32H743xI/G AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PC0 - - - DFSDM1_ CKIN0 - - DFSDM1_ DATIN4 - SAI2_FS_B - OTG_HS_ ULPI_STP - FMC_ SDNWE - LCD_R5 EVENTOUT PC1 TRACED0 - SAI1_D1 DFSDM1_ DATIN0 DFSDM1_ CKIN4 SPI2_ MOSI/I2S2 _SDO SAI1_SD_A - SAI4_SD_ A SDMMC2_ CK SAI4_D1 ETH_MDC MDIOS_ MDC - - EVENTOUT PC2 CDSLEEP - - DFSDM1_ CKIN1 - SPI2_ MISO/I2S2 _SDI DFSDM1_ CKOUT - - - OTG_HS_ ULPI_DIR ETH_MII_ TXD2 FMC_SDNE 0 - - EVENTOUT PC3 CSLEEP - - DFSDM1_ DATIN1 - SPI2_ MOSI/I2S2 _SDO - - - - OTG_HS_ ULPI_NXT ETH_MII_ TX_CLK FMC_SDCK E0 - - EVENTOUT PC4 - - - DFSDM1_ CKIN2 - I2S1_ MCK - - - SPDIFRX1 _IN3 - ETH_MII_ RXD0/ETH_ RMII_RXD0 FMC_SDNE 0 - - EVENTOUT PC5 - - SAI1_D3 DFSDM1_ DATIN2 - - - - SPDIFRX1 _IN4 SAI4_D3 ETH_MII_ RXD1/ETH_ RMII_RXD1 FMC_SDCK E0 COMP1_ OUT - EVENTOUT PC6 - HRTIM_CH A1 TIM3_CH1 TIM8_CH1 DFSDM1_ CKIN3 I2S2_ MCK - USART6_ TX SDMMC1_ D0DIR FMC_ NWAIT SDMMC2_ D6 - SDMMC1_ D6 DCMI_D0 LCD_ HSYNC EVENTOUT PC7 TRGIO HRTIM_CH A2 TIM3_CH2 TIM8_CH2 DFSDM1_ DATIN3 - I2S3_MCK USART6_ RX SDMMC1_ D123DIR FMC_NE1 SDMMC2_ D7 SWPMI_TX SDMMC1_ D7 DCMI_D1 LCD_G6 EVENTOUT PC8 TRACED1 HRTIM_CH B1 TIM3_CH3 TIM8_CH3 - - - USART6_ CK UART5_ RTS/ UART5_ DE FMC_NE2/ FMC_NCE - SWPMI_RX SDMMC1_ D0 DCMI_D2 - EVENTOUT PC9 MCO2 - TIM3_CH4 TIM8_CH4 I2C3_SDA I2S_CKIN - - UART5_ CTS QUADSPI_ BK1_IO0 LCD_G3 SWPMI_ SUSPEND SDMMC1_ D1 DCMI_D3 LCD_B2 EVENTOUT PC10 - - HRTIM_ EEV1 DFSDM1_ CKIN5 - - SPI3_SCK/ I2S3_CK USART3_ TX UART4_TX QUADSPI_ BK1_IO1 - - SDMMC1_ D2 DCMI_D8 LCD_R2 EVENTOUT PC11 - - HRTIM_ FLT2 DFSDM1_ DATIN5 - - SPI3_MISO/ I2S3_SDI USART3_ RX UART4_RX QUADSPI_ BK2_NCS - - SDMMC1_ D3 DCMI_D4 - EVENTOUT PC12 TRACED3 - HRTIM_ EEV2 - - - SPI3_MOSI/ I2S3_SDO USART3_ CK UART5_TX - - - SDMMC1_ CK DCMI_D9 - EVENTOUT PC13 - - - - - - - - - - - - - - - EVENTOUT DS12110 Rev 9 91/361 Pin descriptions SYS LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 Port Port C AF1 STM32H742xI/G STM32H743xI/G Table 12. Port C alternate functions AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS PC14 - - - - - - - - - - - - - - - EVENTOUT PC15 - - - - - - - - - - - - - - - EVENTOUT AF0 AF1 AF2 AF3 AF4 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 PD0 - - - PD1 - - PD2 TRACED2 PD3 Port C Port AF1 Pin descriptions 92/361 Table 12. Port C alternate functions (continued) AF0 Table 13. Port D alternate functions AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS DFSDM1_ CKIN6 - - SAI3_SCK_ A - UART4_RX FDCAN1_ RX - - FMC_D2/ FMC_DA2 - - EVENTOUT - DFSDM1_ DATIN6 - - SAI3_SD_A - UART4_TX FDCAN1_ TX - - FMC_D3/ FMC_DA3 - - EVENTOUT - TIM3_ETR - - - - - UART5_RX - - - SDMMC1_ CMD DCMI_D11 - EVENTOUT - - - DFSDM1_ CKOUT - SPI2_SCK/ I2S2_CK - USART2_ CTS/ USART2_ NSS - - - - FMC_CLK DCMI_D5 LCD_G7 EVENTOUT PD4 - - HRTIM_ FLT3 - - - SAI3_FS_A USART2_ RTS/ USART2_ DE - - - - FMC_NOE - - EVENTOUT PD5 - - HRTIM_ EEV3 - - - - USART2_ TX - - - - FMC_NWE - - EVENTOUT PD6 - - SAI1_D1 DFSDM1_ CKIN4 DFSDM1_ DATIN1 SPI3_ MOSI/I2S3 _SDO SAI1_SD_A USART2_ RX SAI4_SD_ A - SAI4_D1 SDMMC2_ CK FMC_ NWAIT DCMI_D10 LCD_B2 EVENTOUT PD7 - - - DFSDM1_ DATIN4 - SPI1_ MOSI/I2S1 _SDO DFSDM1_ CKIN1 USART2_ CK - SPDIFRX1_ IN1 - SDMMC2_ CMD FMC_NE1 - - EVENTOUT Port D DS12110 Rev 9 Port STM32H742xI/G STM32H743xI/G AF5 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS PD8 - - - DFSDM1_ CKIN3 - - SAI3_SCK_ B USART3_ TX - SPDIFRX1_ IN2 - - FMC_D13/ FMC_DA13 - - EVENTOUT PD9 - - - DFSDM1_ DATIN3 - - SAI3_SD_B USART3_ RX - - - - FMC_D14/ FMC_DA14 - - EVENTOUT PD10 - - - DFSDM1_ CKOUT - - SAI3_FS_B USART3_ CK - - - - FMC_D15/ FMC_DA15 - LCD_B3 EVENTOUT PD11 - - - LPTIM2_ IN2 I2C4_SMBA - - USART3_ CTS/ USART3_N SS - QUADSPI_ BK1_IO0 SAI2_SD_A - FMC_A16 - - EVENTOUT PD12 - LPTIM1_IN1 TIM4_CH1 LPTIM2_ IN1 I2C4_SCL - - USART3_ RTS/ USART3_ DE - QUADSPI_ BK1_IO1 SAI2_FS_A - FMC_A17 - - EVENTOUT PD13 - LPTIM1_ OUT TIM4_CH2 - I2C4_SDA - - - QUADSPI_ BK1_IO3 SAI2_SCK_ A - FMC_A18 - - EVENTOUT PD14 - - TIM4_CH3 - - - SAI3_MCLK _B - UART8_ CTS - - - FMC_D0/ FMC_DA0 - - EVENTOUT PD15 - - TIM4_CH4 - - - SAI3_MCLK _A - UART8_ RTS/ UART8_ DE - - - FMC_D1/ FMC_DA1 - - EVENTOUT DS12110 Rev 9 Port D Port AF1 STM32H742xI/G STM32H743xI/G Table 13. Port D alternate functions (continued) AF0 Pin descriptions 93/361 AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/2/16/1 7/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PE0 - LPTIM1_ ETR TIM4_ETR HRTIM_ SCIN LPTIM2_ ETR - - - UART8_RX - SAI2_ MCLK_A - FMC_NBL0 DCMI_D2 - EVENTOUT PE1 - LPTIM1_IN2 - HRTIM_ SCOUT - - - - UART8_TX - - - FMC_NBL1 DCMI_D3 - EVENTOUT PE2 TRACE CLK - SAI1_CK1 - - SPI4_SCK SAI1_MCLK _A - SAI4_ MCLK_A QUADSPI_ BK1_IO2 SAI4_CK1 ETH_MII_ TXD3 FMC_A23 - - EVENTOUT PE3 TRACED0 - - - TIM15_BKIN - SAI1_SD_B - SAI4_SD_ B - - - FMC_A19 - - EVENTOUT PE4 TRACED1 - SAI1_D2 DFSDM1_ DATIN3 TIM15_CH1 N SPI4_NSS SAI1_FS_A - SAI4_FS_A - SAI4_D2 - FMC_A20 DCMI_D4 LCD_B0 EVENTOUT PE5 TRACED2 - SAI1_CK2 DFSDM1_ CKIN3 TIM15_CH1 SPI4_ MISO SAI1_SCK_ A - SAI4_SCK _A - SAI4_CK2 - FMC_A21 DCMI_D6 LCD_G0 EVENTOUT PE6 TRACED3 TIM1_ BKIN2 SAI1_D1 - TIM15_CH2 SPI4_ MOSI SAI1_SD_A - SAI4_SD_ A SAI4_D1 SAI2_ MCLK_B TIM1_BKIN 2_COMP12 FMC_A22 DCMI_D7 LCD_G1 EVENTOUT PE7 - TIM1_ETR - DFSDM1_ DATIN2 - - - UART7_RX - - QUADSPI_ BK2_IO0 - FMC_D4/ FMC_DA4 - - EVENTOUT PE8 - TIM1_CH1N - DFSDM1_ CKIN2 - - - UART7_TX - - QUADSPI_ BK2_IO1 - FMC_D5/ FMC_DA5 COMP2_ OUT - EVENTOUT PE9 - TIM1_CH1 - DFSDM1_ CKOUT - - - UART7_ RTS/ UART7_ DE - - QUADSPI_ BK2_IO2 - FMC_D6/ FMC_DA6 - - EVENTOUT PE10 - TIM1_CH2N - DFSDM1_ DATIN4 - - - UART7_ CTS - - QUADSPI_ BK2_IO3 - FMC_D7/ FMC_DA7 - - EVENTOUT PE11 - TIM1_CH2 - DFSDM1_ CKIN4 - SPI4_NSS - - - - SAI2_SD_B - FMC_D8/ FMC_DA8 - LCD_G3 EVENTOUT PE12 - TIM1_CH3N - DFSDM1_ DATIN5 - SPI4_SCK - - - - SAI2_SCK_ B - FMC_D9/ FMC_DA9 COMP1_ OUT LCD_B4 EVENTOUT PE13 - TIM1_CH3 - DFSDM1_ CKIN5 - SPI4_ MISO - - - - SAI2_FS_B - FMC_D10/ FMC_DA10 COMP2_ OUT LCD_DE EVENTOUT PE14 - TIM1_CH4 - - - SPI4_ MOSI - - - - SAI2_ MCLK_B - FMC_D11/ FMC_DA11 - LCD_CLK EVENTOUT PE15 - TIM1_BKIN - - - - - - - - - FMC_D12/ FMC_DA12 TIM1_BKIN _COMP12/ COMP_ TIM1_BKIN LCD_R7 EVENTOUT DS12110 Rev 9 STM32H742xI/G STM32H743xI/G SYS LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 Port Port E AF1 Pin descriptions 94/361 Table 14. Port E alternate functions AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PF0 - - - - I2C2_SDA - - - - - - - FMC_A0 - - EVENTOUT PF1 - - - - I2C2_SCL - - - - - - - FMC_A1 - - EVENTOUT PF2 - - - - I2C2_SMBA - - - - - - - FMC_A2 - - EVENTOUT PF3 - - - - - - - - - - - - FMC_A3 - - EVENTOUT PF4 - - - - - - - - - - - - FMC_A4 - - EVENTOUT PF5 - - - - - - - - - - - - FMC_A5 - - EVENTOUT PF6 - TIM16_CH1 - - - SPI5_NSS SAI1_SD_B UART7_RX SAI4_SD_ B QUADSPI_ BK1_IO3 - - - - - EVENTOUT PF7 - TIM17_CH1 - - - SPI5_SCK SAI1_MCLK _B UART7_TX SAI4_ MCLK_B QUADSPI_ BK1_IO2 - - - - - EVENTOUT PF8 - TIM16_ CH1N - - - SPI5_ MISO SAI1_SCK_ B UART7_ RTS/ UART7_ DE SAI4_SCK _B TIM13_ CH1 QUADSPI_ BK1_IO0 - - - - EVENTOUT PF9 - TIM17_ CH1N - - - SPI5_ MOSI SAI1_FS_B UART7_ CTS SAI4_FS_B TIM14_CH 1 QUADSPI_ BK1_IO1 - - - - EVENTOUT PF10 - TIM16_ BKIN SAI1_D3 - - - - - - QUADSPI_ CLK SAI4_D3 - - DCMI_D11 LCD_DE EVENTOUT PF11 - - - - - SPI5_ MOSI - - - - SAI2_SD_B - FMC_ SDNRAS DCMI_D12 - EVENTOUT PF12 - - - - - - - - - - - - FMC_A6 - - EVENTOUT PF13 - - - DFSDM1_ DATIN6 I2C4_SMBA - - - - - - - FMC_A7 - - EVENTOUT PF14 - - - DFSDM1_ CKIN6 I2C4_SCL - - - - - - - FMC_A8 - - EVENTOUT PF15 - - - - I2C4_SDA - - - - - - - FMC_A9 - - EVENTOUT DS12110 Rev 9 95/361 Pin descriptions SYS LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 Port Port F AF1 STM32H742xI/G STM32H743xI/G Table 15. Port F alternate functions AF0 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SAI2/4/TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/UART7 /SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/ DCMI/LCD /COMP UART5/ LCD SYS SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 - - - - - - - - FMC_A10 - - EVENT -OUT - - - - - - - - - FMC_A11 - - EVENT -OUT - TIM8_BKIN - - - - - - - TIM8_BKIN_ COMP12 FMC_A12 - - EVENT -OUT - - TIM8_ BKIN2 - - - - - - - TIM8_BKIN2 _COMP12 FMC_A13 - - EVENT -OUT - TIM1_ BKIN2 - - - - - - - - - TIM1_BKIN2 _COMP12 FMC_A14/ FMC_BA0 - - EVENT -OUT PG5 - TIM1_ETR - - - - - - - - - - FMC_A15/ FMC_BA1 - - EVENT -OUT PG6 - TIM17_ BKIN HRTIM_ CHE1 - - - - - - - QUADSPI_ BK1_NCS - FMC_NE3 DCMI_ D12 LCD_ R7 EVENT -OUT PG7 - - HRTIM_ CHE2 - - - SAI1_ MCLK_A USART6_ CK - - - - FMC_INT DCMI_ D13 LCD_ CLK EVENT -OUT PG8 - - - TIM8_ETR - SPI6_NSS - USART6_ RTS/ USART6_ DE SPDIFRX1 _IN3 - - ETH_PPS_ OUT FMC_ SDCLK - LCD_ G7 EVENT -OUT PG9 - - - - - SPI1_ MISO/I2S1 _SDI - USART6_ RX SPDIFRX1 _IN4 QUADSPI_ BK2_IO2 SAI2_FS_B - FMC_NE2/ FMC_NCE DCMI_ VSYNC - EVENT -OUT PG10 - - HRTIM_ FLT5 - - SPI1_NSS/ I2S1_WS - - - LCD_G3 SAI2_SD_B - FMC_NE3 DCMI_D2 LCD_ B2 EVENT -OUT PG11 - LPTIM1_IN2 HRTIM_ EEV4 - - SPI1_SCK/ I2S1_CK - - SPDIFRX1 _IN1 - SDMMC2_D2 ETH_MII_ TX_EN/ ETH_RMII_ TX_EN - DCMI_D3 LCD_ B3 EVENT -OUT PG12 - LPTIM1_IN1 HRTIM_ EEV5 - - SPI6_ MISO USART6_ RTS/ USART6_ DE SPDIFRX1 _IN2 LCD_B4 - ETH_MII_ TXD1/ETH_ RMII_TXD1 FMC_NE4 - LCD_ B1 EVENT -OUT PG13 TRACED0 LPTIM1_ OUT HRTIM_ EEV10 - - SPI6_SCK USART6_ CTS/ USART6_ NSS - - - ETH_MII_ TXD0/ETH_ RMII_TXD0 FMC_A24 - LCD_ R0 EVENT -OUT SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC PG0 - - - - PG1 - - - PG2 - - PG3 - PG4 DS12110 Rev 9 - STM32H742xI/G STM32H743xI/G SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SAI4/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 Port Port G AF1 Pin descriptions 96/361 Table 16. Port G alternate functions AF1 AF2 AF3 AF4 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 PG14 TRACED1 LPTIM1_ ETR - PG15 - - - AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/UART7 /SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/ DCMI/LCD /COMP UART5/ LCD SYS - - SPI6_ MOSI - USART6_ TX QUADSPI_ BK2_IO3 - ETH_MII_ TXD1/ETH_ RMII_TXD1 FMC_A25 - LCD_ B0 EVENT -OUT - - - - USART6_ CTS/ USART6_ NSS - - - FMC_ SDNCAS DCMI_ D13 - EVENT -OUT Port G Port AF5 - STM32H742xI/G STM32H743xI/G Table 16. Port G alternate functions (continued) AF0 DS12110 Rev 9 Pin descriptions 97/361 AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PH0 - - - - - - - - - - - - - - - EVENTOUT PH1 - - - - - - - - - - - - - - - EVENTOUT PH2 - LPTIM1_IN2 - - - - - - - QUADSPI_ BK2_IO0 SAI2_SCK_ B ETH_MII_ CRS FMC_ SDCKE0 - LCD_R0 EVENTOUT PH3 - - - - - - - - - QUADSPI_ BK2_IO1 SAI2_ MCLK_B ETH_MII_ COL FMC_ SDNE0 - LCD_R1 EVENTOUT PH4 - - - - I2C2_SCL - - - - LCD_G5 OTG_HS_ ULPI_NXT - - - LCD_G4 EVENTOUT PH5 - - - - I2C2_SDA SPI5_NSS - - - - - - FMC_ SDNWE - - EVENTOUT PH6 - - TIM12_ CH1 - I2C2_SMBA SPI5_SCK - - - - - ETH_MII_ RXD2 FMC_ SDNE1 DCMI_D8 - EVENTOUT PH7 - - - - I2C3_SCL SPI5_ MISO - - - - - ETH_MII_ RXD3 FMC_ SDCKE1 DCMI_D9 - EVENTOUT PH8 - - TIM5_ETR - I2C3_SDA - - - - - - - FMC_D16 DCMI_ HSYNC LCD_R2 EVENTOUT PH9 - - TIM12_ CH2 - I2C3_SMBA - - - - - - - FMC_D17 DCMI_D0 LCD_R3 EVENTOUT PH10 - - TIM5_CH1 - I2C4_SMBA - - - - - - - FMC_D18 DCMI_D1 LCD_R4 EVENTOUT PH11 - - TIM5_CH2 - I2C4_SCL - - - - - - - FMC_D19 DCMI_D2 LCD_R5 EVENTOUT PH12 - - TIM5_CH3 - I2C4_SDA - - - - - - - FMC_D20 DCMI_D3 LCD_R6 EVENTOUT PH13 - - - TIM8_ CH1N - - - - UART4_TX FDCAN1_ TX - - FMC_D21 - LCD_G2 EVENTOUT PH14 - - - TIM8_ CH2N - - - - UART4_RX FDCAN1_ RX - - FMC_D22 DCMI_D4 LCD_G3 EVENTOUT PH15 - - - TIM8_ CH3N - - - - - - - - FMC_D23 DCMI_D11 LCD_G4 EVENTOUT DS12110 Rev 9 STM32H742xI/G STM32H743xI/G SYS LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 Port Port H AF1 Pin descriptions 98/361 Table 17. Port H alternate functions AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PI0 - - TIM5_CH4 - - SPI2_NSS/ I2S2_WS - - - - - - FMC_D24 DCMI_D13 LCD_G5 EVENTOUT PI1 - - - TIM8_ BKIN2 - SPI2_SCK/ I2S2_CK - - - - - TIM8_BKIN 2_COMP12 FMC_D25 DCMI_D8 LCD_G6 EVENTOUT PI2 - - - TIM8_CH4 - SPI2_ MISO/I2S2 _SDI - - - - - - FMC_D26 DCMI_D9 LCD_G7 EVENTOUT PI3 - - - TIM8_ETR - SPI2_ MOSI/I2S2 _SDO - - - - - - FMC_D27 DCMI_D10 - EVENTOUT PI4 - - - TIM8_BKIN - - - - - - SAI2_ MCLK_A TIM8_BKIN _COMP12 FMC_NBL2 DCMI_D5 LCD_B4 EVENTOUT PI5 - - - TIM8_CH1 - - - - - - SAI2_SCK_ A - FMC_NBL3 DCMI_ VSYNC LCD_B5 EVENTOUT PI6 - - - TIM8_CH2 - - - - - - SAI2_SD_A - FMC_D28 DCMI_D6 LCD_B6 EVENTOUT PI7 - - - TIM8_CH3 - - - - - - SAI2_FS_A - FMC_D29 DCMI_D7 LCD_B7 EVENTOUT PI8 - - - - - - - - - - - - - - - EVENTOUT PI9 - - - - - - - - UART4_RX FDCAN1_ RX - - FMC_D30 - LCD_ VSYNC EVENTOUT PI10 - - - - - - - - - - - ETH_MII_ RX_ER FMC_D31 - LCD_ HSYNC EVENTOUT PI11 - - - - - - - - - LCD_G6 OTG_HS_ ULPI_DIR - - - - EVENTOUT PI12 - - - - - - - - - - - - - - LCD_ HSYNC EVENTOUT PI13 - - - - - - - - - - - - - - LCD_ VSYNC EVENTOUT PI14 - - - - - - - - - - - - - - LCD_CLK EVENTOUT PI15 - - - - - - - - - LCD_G2 - - - - LCD_R0 EVENTOUT DS12110 Rev 9 99/361 Pin descriptions SYS LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 Port Port I AF1 STM32H742xI/G STM32H743xI/G Table 18. Port I alternate functions AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PJ0 - - - - - - - - - LCD_R7 - - - - LCD_R1 EVENTOUT PJ1 - - - - - - - - - - - - - - LCD_R2 EVENTOUT PJ2 - - - - - - - - - - - - - - LCD_R3 EVENTOUT PJ3 - - - - - - - - - - - - - - LCD_R4 EVENTOUT PJ4 - - - - - - - - - - - - - - LCD_R5 EVENTOUT PJ5 - - - - - - - - - - - - - - LCD_R6 EVENTOUT PJ6 - - - TIM8_CH2 - - - - - - - - - - LCD_R7 EVENTOUT PJ7 TRGIN - - TIM8_ CH2N - - - - - - - - - - LCD_G0 EVENTOUT PJ8 - TIM1_CH3N - TIM8_CH1 - - - - UART8_TX - - - - - LCD_G1 EVENTOUT PJ9 - TIM1_CH3 - TIM8_ CH1N - - - - UART8_RX - - - - - LCD_G2 EVENTOUT PJ10 - TIM1_CH2N - TIM8_CH2 - SPI5_ MOSI - - - - - - - - LCD_G3 EVENTOUT PJ11 - TIM1_CH2 - TIM8_ CH2N - SPI5_ MISO - - - - - - - - LCD_G4 EVENTOUT PJ12 TRGOUT - - - - - - - - LCD_G3 - - - - LCD_B0 EVENTOUT PJ13 - - - - - - - - - LCD_B4 - - - - LCD_B1 EVENTOUT PJ14 - - - - - - - - - - - - - - LCD_B2 EVENTOUT PJ15 - - - - - - - - - - - - - - LCD_B3 EVENTOUT DS12110 Rev 9 STM32H742xI/G STM32H743xI/G SYS LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 Port Port J AF1 Pin descriptions 100/361 Table 19. Port J alternate functions AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH SYS TIM1/2/16/1 7/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 PK0 - TIM1_CH1N - TIM8_CH3 - SPI5_SCK - - - - - - - - LCD_G5 EVENTOUT PK1 - TIM1_CH1 - TIM8_ CH3N - SPI5_NSS - - - - - - - - LCD_G6 EVENTOUT PK2 - TIM1_BKIN - TIM8_BKIN - - - - - - TIM8_BKIN _COMP12 TIM1_BKIN _COMP12 - - LCD_G7 EVENTOUT PK3 - - - - - - - - - - - - - - LCD_B4 EVENTOUT PK4 - - - - - - - - - - - - - - LCD_B5 EVENTOUT PK5 - - - - - - - - - - - - - - LCD_B6 EVENTOUT PK6 - - - - - - - - - - - - - - LCD_B7 EVENTOUT PK7 - - - - - - - - - - - - - - LCD_DE EVENTOUT Port Port K AF1 STM32H742xI/G STM32H743xI/G Table 20. Port K alternate functions DS12110 Rev 9 Pin descriptions 101/361 Electrical characteristics (rev Y) 6 STM32H742xI/G STM32H743xI/G Electrical characteristics (rev Y) 6.1 Parameter conditions Unless otherwise specified, all voltages are referenced to VSS. 6.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of junction temperature, supply voltage and frequencies by tests in production on 100% of the devices with an junction temperature at TJ = 25 °C and TJ = TJmax (given by the selected temperature range). Data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes. Based on characterization, the minimum and maximum values refer to sample tests and represent the mean value plus or minus three times the standard deviation (mean±3σ). 6.1.2 Typical values Unless otherwise specified, typical data are based on TJ = 25 °C, VDD = 3.3 V (for the 1.7 V ≤ VDD ≤ 3.6 V voltage range). They are given only as design guidelines and are not tested. Typical ADC accuracy values are determined by characterization of a batch of samples from a standard diffusion lot over the full temperature range, where 95% of the devices have an error less than or equal to the value indicated (mean±2σ). 6.1.3 Typical curves Unless otherwise specified, all typical curves are given only as design guidelines and are not tested. 6.1.4 Loading capacitor The loading conditions used for pin parameter measurement are shown in Figure 13. 6.1.5 Pin input voltage The input voltage measurement on a pin of the device is described in Figure 14. Figure 13. Pin loading conditions Figure 14. Pin input voltage MCU pin MCU pin C = 50 pF VIN MS19011V2 102/361 DS12110 Rev 9 MS19010V2 STM32H742xI/G STM32H743xI/G 6.1.6 Electrical characteristics (rev Y) Power supply scheme Figure 15. Power supply scheme VDD50USB 100 nF 100 nF VDD33USB 1μF VDD33USB USB IOs USB regulator Level shifter Power switch VSS IOs N(1) x 100 nF + 1 x 4.7 μF VDD D3 domain (System logic, EXTI, IO logic Peripherals, RAM) D2 domain (peripherals, RAM) D1 domain (CPU, peripherals, RAM) VDD domain VBAT charging HSI, LSI, CSI, HSI48, HSE, PLLs Backup domain Backup VBKP regulator VSW VBAT Power switch Power switch LSE, RTC, Wakeup logic, backup IO registers, logic Reset BKUP IOs VREF 100 nF + 1 x 1 μF 100 nF + 1 x 1 μF VDDA VDDA Flash VSS VDD VBAT 1.2 to 3.6V VSS Core domain (VCORE) Voltage regulator VDDLDO 4.7μF 2 x 2.2μF VDDLDO VCAP Power switch VSS VDD50USB VSS Analog domain REF_BUF VREF+ ADC, DAC VREF+ VREF- VREF- Backup RAM VSS OPAMP, Comparator VSSA MSv46116V5 1. N corresponds to the number of VDD pins available on the package. 2. A tolerance of +/- 20% is acceptable on decoupling capacitors. Caution: Each power supply pair (VDD/VSS, VDDA/VSSA ...) must be decoupled with filtering ceramic capacitors as shown above. These capacitors must be placed as close as possible to, or below, the appropriate pins on the underside of the PCB to ensure good operation of the DS12110 Rev 9 103/361 319 Electrical characteristics (rev Y) STM32H742xI/G STM32H743xI/G device. It is not recommended to remove filtering capacitors to reduce PCB size or cost. This might cause incorrect operation of the device. 6.1.7 Current consumption measurement Figure 16. Current consumption measurement scheme IDD_VBAT VBAT IDD VDD VDDA ai14126 6.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 21: Voltage characteristics, Table 22: Current characteristics, and Table 23: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and the functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 Qualification Standard, extended mission profiles are available on demand. Table 21. Voltage characteristics (1) Symbols VDDX - VSS VIN(2) Ratings Min Max Unit −0.3 4.0 V Input voltage on FT_xxx pins VSS−0.3 Min(VDD, VDDA, VDD33USB, VBAT) +4.0(3)(4) V Input voltage on TT_xx pins VSS-0.3 4.0 V Input voltage on BOOT0 pin VSS 9.0 V VSS-0.3 4.0 V - 50 mV - 50 mV External main supply voltage (including VDD, VDDLDO, VDDA, VDD33USB, VBAT) Input voltage on any other pins |∆VDDX| Variations between different VDDX power pins of the same domain |VSSx-VSS| Variations between all the different ground pins 1. All main power (VDD, VDDA, VDD33USB, VBAT) and ground (VSS, VSSA) pins must always be connected to the external power supply, in the permitted range. 2. VIN maximum must always be respected. Refer to Table 59 for the maximum allowed injected current values. 104/361 DS12110 Rev 9 STM32H742xI/G STM32H743xI/G Electrical characteristics (rev Y) 3. This formula has to be applied on power supplies related to the IO structure described by the pin definition table. 4. To sustain a voltage higher than 4V the internal pull-up/pull-down resistors must be disabled. Table 22. Current characteristics Symbols Ratings Max ΣIVDD Total current into sum of all VDD power lines (source)(1) 620 ΣIVSS (sink)(1) 620 Total current out of sum of all VSS ground lines IVDD Maximum current into each VDD power pin (source)(1) 100 IVSS Maximum current out of each VSS ground pin (sink)(1) 100 Output current sunk by any I/O and control pin IIO ΣI(PIN) IINJ(PIN) (3)(4) ΣIINJ(PIN) Total output current sunk by sum of all I/Os and control Unit 20 pins(2) mA 140 Total output current sourced by sum of all I/Os and control pins(2) 140 Injected current on FT_xxx, TT_xx, RST and B pins except PA4, PA5 −5/+0 Injected current on PA4, PA5 −0/0 Total injected current (sum of all I/Os and control pins)(5) ±25 1. All main power (VDD, VDDA, VDD33USB) and ground (VSS, VSSA) pins must always be connected to the external power supplies, in the permitted range. 2. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be sunk/sourced between two consecutive power supply pins referring to high pin count QFP packages. 3. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value. 4. A positive injection is induced by VIN>VDD while a negative injection is induced by VIN