STM32H750VBT6TR

STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 32-bit Arm® Cortex®-M7 480MHz MCUs, 128 Kbyte Flash, 1 Mbyte RAM, 46 com. and analog interfaces, crypto Datasheet - production data Features Includes ST state-of-the-art patented technology Core • 32-bit Arm® Cortex®-M7 core with doubleprecision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache; frequency up to 480 MHz, MPU, 1027 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions Memories • 128 Kbytes of Flash memory • 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 864 Kbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain • Dual mode Quad-SPI memory interface running up to 133 MHz • Flexible external memory controller with up to 32-bit data bus: – SRAM, PSRAM, NOR Flash memory clocked up to 133 MHz in synchronous mode – SDRAM/LPSDR SDRAM – 8/16-bit NAND Flash memories • CRC calculation unit • ROP, PC-ROP, active tamper, secure firmware upgrade support, Secure access mode General-purpose input/outputs • Up to 168 I/O ports with interrupt capability This is information on a product in full production. TFBGA240+25 (14x14 mm) UFBGA176+25 (10x10 mm) Reset and power management • 3 separate power domains which can be independently clock-gated or switched off: – D1: high-performance capabilities – D2: communication peripherals and timers – D3: reset/clock control/power management • 1.62 to 3.6 V application supply and I/Os • POR, PDR, PVD and BOR • Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs • Embedded regulator (LDO) with configurable scalable output to supply the digital circuitry • Voltage scaling in Run and Stop mode (6 configurable ranges) • Backup regulator (~0.9 V) • Voltage reference for analog peripheral/VREF+ • Low-power modes: Sleep, Stop, Standby and VBAT supporting battery charging Low-power consumption Security February 2021 LQFP100 (14 x 14 mm) LQFP144 (20 x 20 mm) LQFP176 (24 x 24 mm) • VBAT battery operating mode with charging capability • CPU and domain power state monitoring pins • 2.95 µA in Standby mode (Backup SRAM OFF, RTC/LSE ON) DS12556 Rev 6 1/336 www.st.com STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Clock management • 2× operational amplifiers (7.3 MHz bandwidth) • Internal oscillators: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI • 1× digital filters for sigma delta modulator (DFSDM) with 8 channels/4 filters • External oscillators: 4-48 MHz HSE, 32.768 kHz LSE Graphics • 3× PLLs (1 for the system clock, 2 for kernel clocks) with Fractional mode • LCD-TFT controller up to XGA resolution Interconnect matrix • Hardware JPEG Codec • 3 bus matrices (1 AXI and 2 AHB) • Bridges (5× AHB2-APB, 2× AXI2-AHB) • Chrom-ART graphical hardware Accelerator (DMA2D) to reduce CPU load Up to 22 timers and watchdogs • 1× high-resolution timer (2.1 ns max resolution) 4 DMA controllers to unload the CPU • 1× high-speed master direct memory access controller (MDMA) with linked list support • 2× dual-port DMAs with FIFO • 2× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to 240 MHz) • 1× basic DMA with request router capabilities • 2× 16-bit advanced motor control timers (up to 240 MHz) Up to 35 communication peripherals • 10× 16-bit general-purpose timers (up to 240 MHz) • 4× I2Cs FM+ interfaces (SMBus/PMBus) • 4× USARTs/4x UARTs (ISO7816 interface, LIN, IrDA, up to 12.5 Mbit/s) and 1x LPUART • 5× 16-bit low-power timers (up to 240 MHz) • 6× SPIs, 3 with muxed duplex I2S audio class accuracy via internal audio PLL or external clock, 1x I2S in LP domain (up to 150 MHz) • 1× SysTick timer • 4x SAIs (serial audio interface) • 2× watchdogs (independent and window) • RTC with sub-second accuracy and hardware calendar • SPDIFRX interface Cryptographic acceleration • SWPMI single-wire protocol master I/F • AES 128, 192, 256, TDES, • MDIO Slave interface • HASH (MD5, SHA-1, SHA-2), HMAC • 2× SD/SDIO/MMC interfaces (up to 125 MHz) • True random number generators • 2× CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN) Debug mode • 2× USB OTG interfaces (1FS, 1HS/FS) crystalless solution with LPM and BCD • Ethernet MAC interface with DMA controller • HDMI-CEC • 8- to 14-bit camera interface (up to 80 MHz) • SWD & JTAG interfaces • 4-Kbyte Embedded Trace Buffer 96-bit unique ID All packages are ECOPACK2 compliant 11 analog peripherals • 3× ADCs with 16-bit max. resolution (up to 36 channels, up to 3.6 MSPS) • 1× temperature sensor • 2× 12-bit D/A converters (1 MHz) • 2× ultra-low-power comparators 2/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.1 Arm® Cortex®-M7 with FPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.2 Memory protection unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.3 Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.3.1 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.3.2 Secure access mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.3.3 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.4 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.5 Power supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.5.1 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.5.2 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.5.3 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.6 Low-power strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.7 Reset and clock controller (RCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.7.1 Clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.7.2 System reset sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.8 General-purpose input/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.9 Bus-interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.10 DMA controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 3.11 Chrom-ART Accelerator (DMA2D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 3.12 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . . 32 3.13 Extended interrupt and event controller (EXTI) . . . . . . . . . . . . . . . . . . . . 32 3.14 Cyclic redundancy check calculation unit (CRC) . . . . . . . . . . . . . . . . . . . 32 3.15 Flexible memory controller (FMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 3.16 Quad-SPI memory interface (QUADSPI) . . . . . . . . . . . . . . . . . . . . . . . . . 33 3.17 Analog-to-digital converters (ADCs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 3.18 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.19 VBAT operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 DS12556 Rev 6 3/336 7 Contents 4/336 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 3.20 Digital-to-analog converters (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 3.21 Ultra-low-power comparators (COMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 3.22 Operational amplifiers (OPAMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 3.23 Digital filter for sigma-delta modulators (DFSDM) . . . . . . . . . . . . . . . . . . 36 3.24 Digital camera interface (DCMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 3.25 LCD-TFT controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 3.26 JPEG Codec (JPEG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 3.27 True random number generator (RNG) . . . . . . . . . . . . . . . . . . . . . . . . . . 38 3.28 Cryptographic acceleration (CRYP and HASH) . . . . . . . . . . . . . . . . . . . . 39 3.29 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.29.1 High-resolution timer (HRTIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 3.29.2 Advanced-control timers (TIM1, TIM8) . . . . . . . . . . . . . . . . . . . . . . . . . 42 3.29.3 General-purpose timers (TIMx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 3.29.4 Basic timers TIM6 and TIM7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 3.29.5 Low-power timers (LPTIM1, LPTIM2, LPTIM3, LPTIM4, LPTIM5) . . . . 43 3.29.6 Independent watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 3.29.7 Window watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 3.29.8 SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 3.30 Real-time clock (RTC), backup SRAM and backup registers . . . . . . . . . . 44 3.31 Inter-integrated circuit interface (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 3.32 Universal synchronous/asynchronous receiver transmitter (USART) . . . 45 3.33 Low-power universal asynchronous receiver transmitter (LPUART) . . . . 46 3.34 Serial peripheral interfaces (SPI)/integrated interchip sound interfaces (I2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 3.35 Serial audio interfaces (SAI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 3.36 SPDIFRX Receiver Interface (SPDIFRX) . . . . . . . . . . . . . . . . . . . . . . . . . 48 3.37 Single wire protocol master interface (SWPMI) . . . . . . . . . . . . . . . . . . . . 48 3.38 Management Data Input/Output (MDIO) slaves . . . . . . . . . . . . . . . . . . . . 49 3.39 SD/SDIO/MMC card host interfaces (SDMMC) . . . . . . . . . . . . . . . . . . . . 49 3.40 Controller area network (FDCAN1, FDCAN2) . . . . . . . . . . . . . . . . . . . . . 49 3.41 Universal serial bus on-the-go high-speed (OTG_HS) . . . . . . . . . . . . . . . 50 3.42 Ethernet MAC interface with dedicated DMA controller (ETH) . . . . . . . . . 50 3.43 High-definition multimedia interface (HDMI) - consumer electronics control (CEC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 3.44 Debug infrastructure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Contents 4 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 5 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6 Electrical characteristics (rev Y) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 6.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 6.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 6.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 6.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 6.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 6.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 6.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 6.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 6.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 6.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 6.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 6.3.2 VCAP external capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 6.3.3 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 99 6.3.4 Embedded reset and power control block characteristics . . . . . . . . . . 100 6.3.5 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 6.3.6 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 6.3.7 Wakeup time from low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . 115 6.3.8 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 116 6.3.9 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 120 6.3.10 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 6.3.11 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 6.3.12 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 6.3.13 Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . 127 6.3.14 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 6.3.15 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 6.3.16 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 6.3.17 FMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 6.3.18 Quad-SPI interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 157 6.3.19 Delay block (DLYB) characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 6.3.20 16-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 6.3.21 DAC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 6.3.22 Voltage reference buffer characteristics . . . . . . . . . . . . . . . . . . . . . . . 168 DS12556 Rev 6 5/336 7 Contents 7 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 169 6.3.24 Temperature and VBAT monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 6.3.25 Voltage booster for analog switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171 6.3.26 Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 6.3.27 Operational amplifier characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 173 6.3.28 Digital filter for Sigma-Delta Modulators (DFSDM) characteristics . . . 176 6.3.29 Camera interface (DCMI) timing specifications . . . . . . . . . . . . . . . . . . 178 6.3.30 LCD-TFT controller (LTDC) characteristics . . . . . . . . . . . . . . . . . . . . . 179 6.3.31 Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181 6.3.32 Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182 6.3.33 JTAG/SWD interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 196 Electrical characteristics (rev V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 7.1 6/336 6.3.23 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 7.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 7.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 7.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 7.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 7.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 7.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 7.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . 201 7.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201 7.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 7.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 7.3.2 VCAP external capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 7.3.3 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . 205 7.3.4 Embedded reset and power control block characteristics . . . . . . . . . . 206 7.3.5 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 7.3.6 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208 7.3.7 Wakeup time from low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . 220 7.3.8 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 221 7.3.9 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 225 7.3.10 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228 7.3.11 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230 7.3.12 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231 7.3.13 Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . 233 7.3.14 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 234 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 8 Contents 7.3.15 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235 7.3.16 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242 7.3.17 FMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242 7.3.18 Quad-SPI interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 264 7.3.19 Delay block (DLYB) characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 267 7.3.20 16-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267 7.3.21 DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276 7.3.22 Voltage reference buffer characteristics . . . . . . . . . . . . . . . . . . . . . . . 280 7.3.23 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 281 7.3.24 Temperature and VBAT monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282 7.3.25 Voltage booster for analog switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282 7.3.26 Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283 7.3.27 Operational amplifier characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 284 7.3.28 Digital filter for Sigma-Delta Modulators (DFSDM) characteristics . . . 286 7.3.29 Camera interface (DCMI) timing specifications . . . . . . . . . . . . . . . . . . 289 7.3.30 LCD-TFT controller (LTDC) characteristics . . . . . . . . . . . . . . . . . . . . . 290 7.3.31 Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 292 7.3.32 Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 292 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 311 8.1 LQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .311 8.2 LQFP144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 315 8.3 LQFP176 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 319 8.4 UFBGA176+25 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . 323 8.5 TFBGA240+25 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . 326 8.6 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 329 8.6.1 Reference documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 330 9 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 331 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332 DS12556 Rev 6 7/336 7 List of tables STM32H750VB STM32H750ZB STM32H750IB STM32H750XB List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 41. Table 42. Table 43. Table 44. 8/336 STM32H750xB features and peripheral counts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 System vs domain low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 DFSDM implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 USART features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 STM32H750xB pin/ball definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Port A alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Port B alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Port C alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Port D alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Port E alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Port F alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Port G alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Port H alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Port I alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Port J alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Port K alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 VCAP operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Operating conditions at power-up / power-down (regulator ON) . . . . . . . . . . . . . . . . . . . . 99 Reset and power control block characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 Internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Typical and maximum current consumption in Run mode, code with data processing running from ITCM, regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Typical and maximum current consumption in Run mode, code with data processing running from Flash memory, cache ON, regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Typical and maximum current consumption in Run mode, code with data processing running from Flash memory, cache OFF, regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Typical consumption in Run mode and corresponding performance versus code position . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Typical current consumption batch acquisition mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Typical and maximum current consumption in Sleep mode, regulator ON. . . . . . . . . . . . 105 Typical and maximum current consumption in Stop mode, regulator ON. . . . . . . . . . . . . 106 Typical and maximum current consumption in Standby mode . . . . . . . . . . . . . . . . . . . . . 106 Typical and maximum current consumption in VBAT mode . . . . . . . . . . . . . . . . . . . . . . . 107 Peripheral current consumption in Run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Peripheral current consumption in Stop, Standby and VBAT mode . . . . . . . . . . . . . . . . . 114 Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 4-48 MHz HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 HSI48 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 45. Table 46. Table 47. Table 48. Table 49. Table 50. Table 51. Table 52. Table 53. Table 54. Table 55. Table 56. Table 57. Table 58. Table 59. Table 60. Table 61. Table 62. Table 63. Table 64. Table 65. Table 66. Table 67. Table 68. Table 69. Table 70. Table 71. Table 72. Table 73. Table 74. Table 75. Table 76. Table 77. Table 78. Table 79. Table 80. Table 81. Table 82. Table 83. Table 84. Table 85. Table 86. Table 87. Table 88. Table 89. Table 90. Table 91. Table 92. Table 93. Table 94. Table 95. Table 96. List of tables HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 CSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 PLL characteristics (wide VCO frequency range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 PLL characteristics (medium VCO frequency range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 Flash memory programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 Output voltage characteristics for all I/Os except PC13, PC14, PC15 and PI8 . . . . . . . . 131 Output voltage characteristics for PC13, PC14, PC15 and PI8 . . . . . . . . . . . . . . . . . . . . 132 Output timing characteristics (HSLV OFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133 Output timing characteristics (HSLV ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . 139 Asynchronous non-multiplexed SRAM/PSRAM/NOR read - NWAIT timings . . . . . . . . . . 139 Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . 140 Asynchronous non-multiplexed SRAM/PSRAM/NOR write - NWAIT timings. . . . . . . . . . 141 Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . 142 Asynchronous multiplexed PSRAM/NOR read-NWAIT timings . . . . . . . . . . . . . . . . . . . . 142 Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . 143 Asynchronous multiplexed PSRAM/NOR write-NWAIT timings . . . . . . . . . . . . . . . . . . . . 144 Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 149 Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 Switching characteristics for NAND Flash read cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 Switching characteristics for NAND Flash write cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . 153 SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 LPSDR SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 SDRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156 LPSDR SDRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156 QUADSPI characteristics in SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157 QUADSPI characteristics in DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 Dynamics characteristics: Delay Block characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 DAC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 VREFBUF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169 Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 VBAT charging characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 Temperature monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 Voltage booster for analog switch characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171 COMP characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 DS12556 Rev 6 9/336 12 List of tables Table 97. Table 98. Table 99. Table 100. Table 101. Table 102. Table 103. Table 104. Table 105. Table 106. Table 107. Table 108. Table 109. Table 110. Table 111. Table 112. Table 113. Table 114. Table 115. Table 116. Table 117. Table 118. Table 119. Table 120. Table 121. Table 122. Table 123. Table 124. Table 125. Table 126. Table 127. Table 128. Table 129. Table 130. Table 131. Table 132. Table 133. Table 134. Table 135. Table 136. Table 137. Table 138. Table 139. Table 140. Table 141. Table 142. 10/336 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB OPAMP characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173 DFSDM measured timing - 1.62-3.6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 DCMI characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 LTDC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181 Minimum i2c_ker_ck frequency in all I2C modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182 I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182 SPI dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183 I2S dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186 SAI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 MDIO Slave timing parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 Dynamic characteristics: SD / MMC characteristics, VDD = 2.7 to 3.6 V . . . . . . . . . . . . . 190 Dynamic characteristics: eMMC characteristics, VDD = 1.71 to 1.9 V . . . . . . . . . . . . . . . 191 USB OTG_FS electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193 Dynamic characteristics: USB ULPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193 Dynamics characteristics: Ethernet MAC signals for SMI. . . . . . . . . . . . . . . . . . . . . . . . . 194 Dynamics characteristics: Ethernet MAC signals for RMII . . . . . . . . . . . . . . . . . . . . . . . . 195 Dynamics characteristics: Ethernet MAC signals for MII . . . . . . . . . . . . . . . . . . . . . . . . . 196 Dynamics JTAG characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197 Dynamics SWD characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197 Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201 Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 Supply voltage and maximum frequency configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 204 VCAP operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 Operating conditions at power-up / power-down (regulator ON) . . . . . . . . . . . . . . . . . . . 205 Reset and power control block characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 Internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208 Typical and maximum current consumption in Run mode, code with data processing running from ITCM, LDO regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209 Typical and maximum current consumption in Run mode, code with data processing running from Flash memory, cache ON, LDO regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210 Typical and maximum current consumption in Run mode, code with data processing running from Flash memory, cache OFF, LDO regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210 Typical and maximum current consumption batch acquisition mode, LDO regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211 Typical and maximum current consumption in Stop, LDO regulator ON . . . . . . . . . . . . . 211 Typical and maximum current consumption in Sleep mode, LDO regulator . . . . . . . . . . 212 Typical and maximum current consumption in Standby . . . . . . . . . . . . . . . . . . . . . . . . . . 212 Typical and maximum current consumption in VBAT mode . . . . . . . . . . . . . . . . . . . . . . . 213 Peripheral current consumption in Run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215 Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221 Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222 4-48 MHz HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223 Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 HSI48 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225 HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 143. Table 144. Table 145. Table 146. Table 147. Table 148. Table 149. Table 150. Table 151. Table 152. Table 153. Table 154. Table 155. Table 156. Table 157. Table 158. Table 159. Table 160. Table 161. Table 162. Table 163. Table 164. Table 165. Table 166. Table 167. Table 168. Table 169. Table 170. Table 171. Table 172. Table 173. Table 174. Table 175. Table 176. Table 177. Table 178. Table 179. Table 180. Table 181. Table 182. Table 183. Table 184. Table 185. Table 186. Table 187. Table 188. Table 189. Table 190. Table 191. Table 192. Table 193. Table 194. List of tables CSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226 LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227 PLL characteristics (wide VCO frequency range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228 PLL characteristics (medium VCO frequency range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230 Flash memory programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230 Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231 EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231 EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232 ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233 Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233 I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234 I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235 Output voltage characteristics for all I/Os except PC13, PC14, PC15 and PI8 . . . . . . . . 237 Output voltage characteristics for PC13, PC14, PC15 and PI8 . . . . . . . . . . . . . . . . . . . . 238 Output timing characteristics (HSLV OFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 Output timing characteristics (HSLV ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242 Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . 244 Asynchronous non-multiplexed SRAM/PSRAM/NOR read-NWAIT timings . . . . . . . . . . . 244 Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . 246 Asynchronous non-multiplexed SRAM/PSRAM/NOR write-NWAIT timings. . . . . . . . . . . 246 Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . 248 Asynchronous multiplexed PSRAM/NOR read-NWAIT timings . . . . . . . . . . . . . . . . . . . . 248 Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . 249 Asynchronous multiplexed PSRAM/NOR write-NWAIT timings . . . . . . . . . . . . . . . . . . . . 249 Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 251 Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253 Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 255 Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257 Switching characteristics for NAND Flash read cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . 260 Switching characteristics for NAND Flash write cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . 260 SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262 LPSDR SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262 SDRAM Write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263 LPSDR SDRAM Write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264 QUADSPI characteristics in SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265 QUADSPI characteristics in DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266 Delay Block characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267 ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267 Minimum sampling time vs RAIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271 ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273 DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276 DAC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278 VREFBUF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281 Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281 VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282 VBAT charging characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282 Temperature monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282 Voltage booster for analog switch characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282 COMP characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283 DS12556 Rev 6 11/336 12 List of tables Table 195. Table 196. Table 197. Table 198. Table 199. Table 200. Table 201. Table 202. Table 203. Table 204. Table 205. Table 206. Table 207. Table 208. Table 209. Table 210. Table 211. Table 212. Table 213. Table 214. Table 215. Table 216. Table 217. Table 218. Table 219. Table 220. Table 221. Table 222. Table 223. 12/336 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Operational amplifier characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284 DFSDM measured timing - 1.62-3.6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287 DCMI characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289 LTDC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290 TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 292 Minimum i2c_ker_ck frequency in all I2C modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293 I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293 USART characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 294 SPI dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296 I2S dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299 SAI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 MDIO Slave timing parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 302 Dynamics characteristics: SD / MMC characteristics, VDD = 2.7 to 3.6 V . . . . . . . . . . . . 303 Dynamics characteristics: eMMC characteristics VDD = 1.71V to 1.9V . . . . . . . . . . . . . . 304 Dynamics characteristics: USB ULPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306 Dynamics characteristics: Ethernet MAC signals for SMI . . . . . . . . . . . . . . . . . . . . . . . . 307 Dynamics characteristics: Ethernet MAC signals for RMII . . . . . . . . . . . . . . . . . . . . . . . . 308 Dynamics characteristics: Ethernet MAC signals for MII . . . . . . . . . . . . . . . . . . . . . . . . . 308 Dynamics JTAG characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 309 Dynamics SWD characteristics: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 310 LQPF100 package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312 LQFP144 package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 316 LQFP176 package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 319 UFBGA176+25 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323 UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA) . . . . . . . . . . . . . 324 TFBG240+25 ball package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 327 TFBGA240+25 recommended PCB design rules (0.8 mm pitch) . . . . . . . . . . . . . . . . . . . 328 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 329 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. Figure 45. Figure 46. Figure 47. Figure 48. STM32H750xB block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Power-up/power-down sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 STM32H750xB bus matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 LQFP144 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 LQFP176 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 UFBGA176+25 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 TFBGA240+25 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 External capacitor CEXT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 VIL/VIH for all I/Os except BOOT0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms . . . . . . . . . . . . . . 138 Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms . . . . . . . . . . . . . . 140 Asynchronous multiplexed PSRAM/NOR read waveforms. . . . . . . . . . . . . . . . . . . . . . . . 141 Asynchronous multiplexed PSRAM/NOR write waveforms . . . . . . . . . . . . . . . . . . . . . . . 143 Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 145 Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147 Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 149 Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 NAND controller waveforms for read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151 NAND controller waveforms for write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 NAND controller waveforms for common memory read access . . . . . . . . . . . . . . . . . . . . 152 NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . 153 SDRAM read access waveforms (CL = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 SDRAM write access waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 Quad-SPI timing diagram - SDR mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 Quad-SPI timing diagram - DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 ADC accuracy characteristics (example for 12-bit resolution) . . . . . . . . . . . . . . . . . . . . . 162 Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 Power supply and reference decoupling (VREF+ not connected to VDDA). . . . . . . . . . . . . 164 Power supply and reference decoupling (VREF+ connected to VDDA). . . . . . . . . . . . . . . . 164 12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 Channel transceiver timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 DCMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 LCD-TFT horizontal timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 LCD-TFT vertical timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184 SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187 DS12556 Rev 6 13/336 15 List of figures Figure 49. Figure 50. Figure 51. Figure 52. Figure 53. Figure 54. Figure 55. Figure 56. Figure 57. Figure 58. Figure 59. Figure 60. Figure 61. Figure 62. Figure 63. Figure 64. Figure 65. Figure 66. Figure 67. Figure 68. Figure 69. Figure 70. Figure 71. Figure 72. Figure 73. Figure 74. Figure 75. Figure 76. Figure 77. Figure 78. Figure 79. Figure 80. Figure 81. Figure 82. Figure 83. Figure 84. Figure 85. Figure 86. Figure 87. Figure 88. Figure 89. Figure 90. Figure 91. Figure 92. Figure 93. Figure 94. Figure 95. Figure 96. Figure 97. Figure 98. Figure 99. Figure 100. 14/336 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187 SAI master timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 SAI slave timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 MDIO Slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190 SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 ULPI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194 Ethernet SMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195 Ethernet RMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195 Ethernet MII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196 JTAG timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198 SWD timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198 Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201 External capacitor CEXT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 221 Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222 Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225 VIL/VIH for all I/Os except BOOT0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236 Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242 Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms . . . . . . . . . . . . . . 243 Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms . . . . . . . . . . . . . . 245 Asynchronous multiplexed PSRAM/NOR read waveforms. . . . . . . . . . . . . . . . . . . . . . . . 247 Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252 Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 254 Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 256 NAND controller waveforms for read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 258 NAND controller waveforms for write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259 NAND controller waveforms for common memory read access . . . . . . . . . . . . . . . . . . . . 259 NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . 260 SDRAM read access waveforms (CL = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 261 SDRAM write access waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263 QUADSPI timing diagram - SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266 Quad-SPI timing diagram - DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267 ADC accuracy characteristics (example for 12-bit resolution) . . . . . . . . . . . . . . . . . . . . . 274 Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 Power supply and reference decoupling (VREF+ not connected to VDDA). . . . . . . . . . . . . 275 Power supply and reference decoupling (VREF+ connected to VDDA). . . . . . . . . . . . . . . . 275 12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279 Channel transceiver timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288 DCMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289 LCD-TFT horizontal timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291 LCD-TFT vertical timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291 USART timing diagram in Master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 294 USART timing diagram in Slave mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 295 SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297 SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Figure 101. Figure 102. Figure 103. Figure 104. Figure 105. Figure 106. Figure 107. Figure 108. Figure 109. Figure 110. Figure 111. Figure 112. Figure 113. Figure 114. Figure 115. Figure 116. Figure 117. Figure 118. Figure 119. Figure 120. Figure 121. Figure 122. Figure 123. Figure 124. Figure 125. Figure 126. Figure 127. Figure 128. Figure 129. Figure 130. List of figures SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 298 I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299 I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 SAI master timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 302 SAI slave timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 302 MDIO Slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 303 SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305 SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305 DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305 ULPI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306 Ethernet SMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 307 Ethernet RMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 308 Ethernet MII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 309 JTAG timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 310 SWD timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 310 LQFP100 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 311 LQFP100 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 313 LQFP100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314 LQFP144 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 315 LQFP144 package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317 LQFP144 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 318 LQFP176 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 319 LQFP176 package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 321 LQFP176 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 322 UFBGA176+25 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323 UFBGA176+25 package recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 UFBGA176+25 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 TFBGA240+25 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 326 TFBGA240+25 package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 327 TFBGA240+25 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . 328 DS12556 Rev 6 15/336 15 Introduction 1 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Introduction This document provides information on STM32H750xB microcontrollers, such as description, functional overview, pin assignment and definition, electrical characteristics, packaging, and ordering information. This document should be read in conjunction with the STM32H750xB reference manual (RM0433), available from the STMicroelectronics website www.st.com. For information on the Arm®(a) Cortex®-M7 core, please refer to the Cortex®-M7 Technical Reference Manual, available from the http://www.arm.com website. a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere. 16/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 2 Description Description STM32H750xB devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 480 MHz. The Cortex® -M7 core features a floating point unit (FPU) which supports Arm® double-precision (IEEE 754 compliant) and single-precision dataprocessing instructions and data types. STM32H750xB devices support a full set of DSP instructions and a memory protection unit (MPU) to enhance application security. STM32H750xB devices incorporate high-speed embedded memories with a Flash memory of 128 Kbytes, up to 1 Mbyte of RAM (including 192 Kbytes of TCM RAM, up to 864 Kbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access. All the devices offer three ADCs, two DACs, two ultra-low power comparators, a low-power RTC, a high-resolution timer, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support four digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces. • Standard peripherals – • Four I2Cs – Four USARTs, four UARTs and one LPUART – Six SPIs, three I2Ss in Half-duplex mode. To achieve audio class accuracy, the I2S peripherals can be clocked by a dedicated internal audio PLL or by an external clock to allow synchronization. – Four SAI serial audio interfaces – One SPDIFRX interface – One SWPMI (Single Wire Protocol Master Interface) – Management Data Input/Output (MDIO) slaves – Two SDMMC interfaces – A USB OTG full-speed and a USB OTG high-speed interface with full-speed capability (with the ULPI) – One FDCAN plus one TT-FDCAN interface – An Ethernet interface – Chrom-ART Accelerator – HDMI-CEC Advanced peripherals including – A flexible memory control (FMC) interface – A Quad-SPI Flash memory interface – A camera interface for CMOS sensors – An LCD-TFT display controller – A JPEG hardware compressor/decompressor Refer to Table 1: STM32H750xB features and peripheral counts for the list of peripherals available on each part number. DS12556 Rev 6 17/336 52 Description STM32H750VB STM32H750ZB STM32H750IB STM32H750XB STM32H750xB devices operate in the –40 to +85 °C temperature range from a 1.62 to 3.6 V power supply. The supply voltage can drop down to 1.62 V by using an external power supervisor (see Section 3.5.2: Power supply supervisor) and connecting the PDR_ON pin to VSS. Otherwise the supply voltage must stay above 1.71 V with the embedded power voltage detector enabled. Dedicated supply inputs for USB (OTG_FS and OTG_HS) are available on all packages except LQFP100 to allow a greater power supply choice. A comprehensive set of power-saving modes allows the design of low-power applications. STM32H750xB devices are offered in 3 packages ranging from 100 pins to 240 pins/balls. The set of included peripherals changes with the device chosen. These features make STM32H750xB microcontrollers suitable for a wide range of applications: • Motor drive and application control • Medical equipment • Industrial applications: PLC, inverters, circuit breakers • Printers, and scanners • Alarm systems, video intercom, and HVAC • Home audio appliances • Mobile applications, Internet of Things • Wearable devices: smart watches. Figure 1 shows the device block diagram. Table 1. STM32H750xB features and peripheral counts Peripherals STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Flash memory in Kbytes 128 SRAM in Kbytes TCM RAM in Kbytes SRAM mapped onto AXI bus 512 SRAM1 (D2 domain) 128 SRAM2 (D2 domain) 128 SRAM3 (D2 domain) 32 SRAM4 (D3 domain) 64 ITCM RAM (instruction) 64 DTCM RAM (data) 128 Backup SRAM (Kbytes) 4 FMC Yes General-purpose input/outputs 18/336 82 114 140 Quad-SPI interface Yes Ethernet Yes DS12556 Rev 6 168 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Description Table 1. STM32H750xB features and peripheral counts (continued) Peripherals Timers STM32H750VB STM32H750ZB STM32H750IB STM32H750XB High-resolution 1 General-purpose 10 Advanced-control (PWM) 2 Basic 2 Low-power 5 Wakeup pins Tamper pins 4 2 6 3 Random number generator Yes Cryptographic processor Yes SPI / I2S 6/3(1) I2C 4 USART/UART/ LPUART 4/4 /1 SAI 4 SPDIFRX 4 inputs SWPMI Yes MDIO Yes SDMMC 2 FDCAN/TT-FDCAN 1/1 USB OTG_FS Yes USB OTG_HS Yes Communication interfaces Ethernet and camera interface Yes LCD-TFT Yes JPEG Codec Yes Chrom-ART Accelerator (DMA2D) Yes 16-bit ADCs Number of Direct channels Number of Fast channels Number of Slow channels 3 2 3 11 2 9 17 2 9 21 12-bit DAC Number of channels Yes 2 Comparators 2 Operational amplifiers 2 DFSDM Yes Maximum CPU frequency Operating voltage 4 9 23 480MHz 1.71 to 3.6 V(4) DS12556 Rev 6 (2)(3)/400 MHz 1.62 to 3.6 V(5) 19/336 52 Description STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 1. STM32H750xB features and peripheral counts (continued) Peripherals STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Ambient temperatures: –40 up to +85 °C(6) Operating temperatures Package Junction temperature: –40 to + 125 °C LQFP100 LQFP144 LQFP176, TFBGA240+25 UFBGA176+25 1. The SPI1, SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode. 2. The maximum CPU frequency of 480 MHz can be obtained on devices revision V. 3. The product junction temperature must be kept within the –40 to +105 °C temperature range. 4. Since the LQFP100 package does not feature the PDR_ON pin (tied internally to VDD), the minimum VDD value for this package is 1.71 V. 5. VDD/VDDA can drop down to 1.62 V by using an external power supervisor (see Section 3.5.2: Power supply supervisor) and connecting PDR_ON pin to VSS. Otherwise the supply voltage must stay above 1.71 V with the embedded power voltage detector enabled. 6. The product junction temperature must be kept within the –40 to +125 °C temperature range. 20/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Description Figure 1. STM32H750xB block diagram MII / RMII To APB1-2 peripherals MDIO as AF AHB1 D-TCM 64KB D-TCM 64KB DMA1 AXIM DMA/ FIFO FIFO D-Cache 16KB 512 KB AXI SRAM LCD-TFT WWDG FIFO JPEG FMC_signals Quad-SPI RNG HASH 3DES/AES SRAM1 SRAM2 SRAM3 128 KB 128 KB 32 KB ADC1 32b TIM6 16b 16b TIM7 16b 16b AHB/APB SWPMI FIFO SDMMC1 32b 16b Delay block A P B 10 MHz 3 DAP AHB4 SPI1/I2S1 TIM1/PWM 16b 16b HSEM CRC ADC3 RX, TX as AF UART7 RX, TX as AF RX, TX as AF SPI2/I2S2 MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF SPI3/I2S3 MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF SCL, SDA, SMBAL as AF I2C2/SMBUS I2C3/SMBUS MDIOs MDC, MDIO TT-FDCAN1 FDCAN2 4 KB BKP RAM SPDIFRX1 LPTIM3 AHB/APB VREF I2C4 MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF SPI6/I2S6 RX, TX, CK, CTS, RTS as AF LPUART1 LPTIM2 LPTIM1 CEC as AF DAC_OUT1, DAC_OUT2 as AF 16b OPAMP1&2 @VDD33 VDD12 BBgen + POWER MNGT PWRCTRL RCC Reset & control SAI4 LPTIM3_OUT as AF TX, RX TX, RX IN[1:4] as AF HDMI-CEC COMP1&2 LPTIM4 SCL, SDA, SMBAL as AF SCL, SDA, SMBAL as AF USBCR 64 KB SRAM GPIO PORTK LPTIM5 RX, TX, SCK CTS, RTS as AF RX, TX as AF DAC GPIO PORTA.. J RX, TX, SCK, CTS, RTS as AF UART5 I2C1/SMBUS RAM I/F 32-bit AHB BUS-MATRIX AHB4 (200MHz) smcard irDA USART6 smcard irDA USART1 TIM8/PWM irDA UART8 APB1 100 MHz (max) 10 KB SRAM BDMA AHB4 AHB4 DMA Mux2 AHB4 SPI4 AHB4 TIM15 LPTIM4_OUT as AF LPTIM2_IN1, LPTIM2_IN2 and LPTIM2_OUT APB2 100 MHz (max) TIM17 TIM16 LPTIM5_OUT as AF SCL, SDA, SMBAL as AF FIFO FIFO FIFO SPI5 Voltage regulator 3.3 to 1.2V LPTIM1_IN1, LPTIM1_IN2, LPTIM1_OUT as AF OPAMPx_VINM OPAMPx_VINP OPAMPx_VOUT as AF VDDMMC33 = 1.8 to 3.6V VDDUSB33 = 3.0 to 3.6 V VDD = 1.8 to 3.6 V VSS VCAP @VSW SYSCFG XTAL 32 kHz LS EXTI WKUP IWDG Temperature sensor @VDD CSI HSI48 HSI LSI HS RC LS RC RTC Backup registers LS SD, SCK, FS, MCLK, D[3;1], CK[2:1] as AF COMPx_INP, COMPx_INM, COMPx_OUT as AF irDA UART4 AHB4 (200MHz) PK[7:0] 1 channel as AF USART3 APB4 MHz (max) APB4 100100 MHz (max) PA..J[15:0] 1 channel as AF smcard AHB4 4 compl. chan. (TIM1_CH1[1:4]N), 4 chan. (TIM1_CH1[1:4]ETR, BKIN as AF 4 compl. chan.(TIM8_CH1[1:4]N), 4 chan. (TIM8_CH1[1:4], ETR, BKIN as AF Up to 17 analog inputs common to ADC1 and 2 2 channels as AF TIM13 FIFO RX, TX, SCK, CTS, RTS as AF 4 channels TIM12 USART2 APB4 100 MHz (max) RX, TX, SCK, CTS, RTS as AF 4 channels, ETR as AF TIM5 Digital filter MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF 4 channels, ETR as AF TIM4 AHB/APB SAI3 SAI1 MOSI, MISO, SCK, NSS as AF 4 channels, ETR as AF TIM14 16b DFSDM1 SD, SCK, FS, MCLK, D[3:1], CK[2:1] as AF 2 compl. chan.(TIM15_CH1[1:2]N), 2 chan. (TIM_CH15[1:2], BKIN as AF TIM2 TIM3 smcard SAI2 1 compl. chan.(TIM17_CH1N), 1 chan. (TIM17_CH1, BKIN as AF 1 compl. chan.(TIM16_CH1N), 1 chan. (TIM16_CH1, BKIN as AF 16b HRTIM1 SD, SCK, FS, MCLK, CK[2:1] as AF MOSI, MISO, SCK, NSS as AF AHB2 (200MHz) DCMI Up to 20 analog inputs common to ADC1 & 2 ADC2 AHB/APB CLK, CS,D[7:0] AXI/AHB34 (200MHz) AHB3 LCD_R[7:0], LCD_G[7:0], LCD_B[7:0], LCD_HSYNC, LCD_VSYNC, LCD_DE, LCD_CLK FIFO DMA Mux1 FMC 64-bit AXI BUS-MATRIX 16 Streams FIFO CHROM-ART (DMA2D) HRTIM1_CH[A..E]x HRTIM1_FLT[5:1], HRTIM1_FLT[5:1]_in, SYSFLT DFSDM1_CKOUT, DFSDM1_DATAIN[0:7], DFSDM1_CKIN[0:7] SD, SCK, FS, MCLK, D/CK[4:1] as AF DMA/ FIFO 32-bit AHB BUS-MATRIX I-Cache 16KB AHBS HSYNC, VSYNC, PIXCLK, D[13:0] PHY OTG_FS 128 KB FLASH ETM MDMA SDMMC_D[7:0],SDMMC_D[7:3,1]Dir SDMMC_D0dir, SDMMC_D2dir CMD, CMDdir, CK, Ckin, CKio as AF DMA/ FIFO 8 Stream 8 Stream FIFOs FIFOs AXI/AHB12 (200MHz) AHB2 (200MHz) TRACECK TRACED[3:0] PHY ETHER SDMMC2 OTG_HS MAC AHBP Arm CPU Cortex-M7 480 MHz JTAG/SW AHB4 (200MHz) JTRST, JTDI, JTCK/SWCLK JTDO/SWD, JTDO DMA2 (200MHz) AHB1 (200MHz) I-TCM 64KB DP, DM, STP, SDMMC_ NXT,ULPI:CK DP, DM, ID, D[7:0], VBUS , D[7:0], DIR, CMD, CK as AF ID, VBUS AWU OSC32_IN OSC32_OUT RTC_TS RTC_TAMP[1:3] RTC_OUT RTC_REFIN VBAT = 1.8 to 3.6 V @VDD XTAL OSC 4- 48 MHz PLL1+PLL2+PLL3 OSC_IN OSC_OUT WDG_LS_D1 @VDD POR reset Int SUPPLY SUPERVISION POR/PDR/BOR PVD VDDA, VSSA NRESET WKUP[5:0] MSv50638V4 DS12556 Rev 6 21/336 52 Functional overview STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 3 Functional overview 3.1 Arm® Cortex®-M7 with FPU The Arm® Cortex®-M7 with double-precision FPU processor is the latest generation of Arm processors for embedded systems. It was developed to provide a low-cost platform that meets the needs of MCU implementation, with a reduced pin count and optimized power consumption, while delivering outstanding computational performance and low interrupt latency. The Cortex®-M7 processor is a highly efficient high-performance featuring: • Six-stage dual-issue pipeline • Dynamic branch prediction • Harvard architecture with L1 caches (16 Kbytes of I-cache and 16 Kbytes of D-cache) • 64-bit AXI interface • 64-bit ITCM interface • 2x32-bit DTCM interfaces The following memory interfaces are supported: • Separate Instruction and Data buses (Harvard Architecture) to optimize CPU latency • Tightly Coupled Memory (TCM) interface designed for fast and deterministic SRAM accesses • AXI Bus interface to optimize Burst transfers • Dedicated low-latency AHB-Lite peripheral bus (AHBP) to connect to peripherals. The processor supports a set of DSP instructions which allow efficient signal processing and complex algorithm execution. It also supports single and double precision FPU (floating point unit) speeds up software development by using metalanguage development tools, while avoiding saturation. Figure 1 shows the general block diagram of the STM32H750xB family. Note: Cortex®-M7 with FPU core is binary compatible with the Cortex®-M4 core. 3.2 Memory protection unit (MPU) The memory protection unit (MPU) manages the CPU access rights and the attributes of the system resources. It has to be programmed and enabled before use. Its main purposes are to prevent an untrusted user program to accidentally corrupt data used by the OS and/or by a privileged task, but also to protect data processes or read-protect memory regions. The MPU defines access rules for privileged accesses and user program accesses. It allows defining up to 16 protected regions that can in turn be divided into up to 8 independent subregions, where region address, size, and attributes can be configured. The protection area ranges from 32 bytes to 4 Gbytes of addressable memory. When an unauthorized access is performed, a memory management exception is generated. 22/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 3.3 Memories 3.3.1 Embedded Flash memory Functional overview The STM32H750xB devices embed 128 Kbytes of Flash memory that can be used for storing programs and data. The Flash memory is organized as follows: 3.3.2 • 128 Kbytes of user Flash memory containing 128 Kbytes of System Flash memory from which the device can boot • 2 Kbytes (64 Flash words) of user option bytes for user configuration Secure access mode In addition to other typical memory protection mechanism (RDP, PCROP), STM32H750xB devices introduce the Secure access mode, a new enhanced security feature. This mode allows developing user-defined secure services by ensuring, on the one hand code and data protection and on the other hand code safe execution. Two types of secure services are available: • STMicroelectronics Root Secure Services: These services are embedded in System memory. They provide a secure solution for firmware and third-party modules installation. These services rely on cryptographic algorithms based on a device unique private key. • User-defined secure services: These services are embedded in user Flash memory. Examples of user secure services are proprietary user firmware update solution, secure Flash integrity check or any other sensitive applications that require a high level of protection. The secure firmware is embedded in specific user Flash memory areas configured through option bytes. Secure services are executed just after a reset and preempt all other applications to guarantee protected and safe execution. Once executed, the corresponding code and data are no more accessible. The above secure services are available only for Cortex®-M7 core operating in Secure access mode. The other masters cannot access the option bytes involved in Secure access mode settings or the Flash secured areas. DS12556 Rev 6 23/336 52 Functional overview 3.3.3 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Embedded SRAM All devices feature: • 512 Kbytes of AXI-SRAM mapped onto AXI bus on D1 domain. • SRAM1 mapped on D2 domain: 128 Kbytes • SRAM2 mapped on D2 domain: 128 Kbytes • SRAM3 mapped on D2 domain: 32 Kbytes • SRAM4 mapped on D3 domain: 64 Kbytes • 4 Kbytes of backup SRAM The content of this area is protected against possible unwanted write accesses, and is retained in Standby or VBAT mode. • RAM mapped to TCM interface (ITCM and DTCM): Both ITCM and DTCM RAMs are 0 wait state memories. either They can be accessed either from the CPU or the MDMA (even in Sleep mode) through a specific AHB slave of the CPU(AHBP): – 64 Kbytes of ITCM-RAM (instruction RAM) This RAM is connected to ITCM 64-bit interface designed for execution of critical real-times routines by the CPU. – 128 Kbytes of DTCM-RAM (2x 64-Kbyte DTCM-RAMs on 2x32-bit DTCM ports) The DTCM-RAM could be used for critical real-time data, such as interrupt service routines or stack/heap memory. Both DTCM-RAMs can be used in parallel (for load/store operations) thanks to the Cortex®-M7 dual issue capability. The MDMA can be used to load code or data in ITCM or DTCM RAMs. Error code correction (ECC) Over the product lifetime, and/or due to external events such as radiations, invalid bits in memories may occur. They can be detected and corrected by ECC. This is an expected behavior that has to be managed at final-application software level in order to ensure data integrity through ECC algorithms implementation. SRAM data are protected by ECC: • 7 ECC bits are added per 32-bit word. • 8 ECC bits are added per 64-bit word for AXI-SRAM and ITCM-RAM. The ECC mechanism is based on the SECDED algorithm. It supports single-error correction and double-error detection. 3.4 Boot modes At startup, the boot memory space is selected by the BOOT pin and BOOT_ADDx option bytes, allowing to program any boot memory address from 0x0000 0000 to 0x3FFF FFFF which includes: 24/336 • All Flash address space • All RAM address space: ITCM, DTCM RAMs and SRAMs • The System memory bootloader DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Functional overview The boot loader is located in non-user System memory. It is used to reprogram the Flash memory through a serial interface (USART, I2C, SPI, USB-DFU). Refer to STM32 microcontroller System memory Boot mode application note (AN2606) for details. 3.5 Power supply management 3.5.1 Power supply scheme STM32H750xB power supply voltages are the following: • VDD = 1.62 to 3.6 V: external power supply for I/Os, provided externally through VDD pins. • VDDLDO = 1.62 to 3.6 V: supply voltage for the internal regulator supplying VCORE • VDDA = 1.62 to 3.6 V: external analog power supplies for ADC, DAC, COMP and OPAMP. • VDD33USB and VDD50USB: VDD50USB can be supplied through the USB cable to generate the VDD33USB via the USB internal regulator. This allows supporting a VDD supply different from 3.3 V. The USB regulator can be bypassed to supply directly VDD33USB if VDD = 3.3 V. • VBAT = 1.2 to 3.6 V: power supply for the VSW domain when VDD is not present. • VCAP: VCORE supply voltage, which values depend on voltage scaling (1.0 V, 1.1 V, 1.2 V or 1.35 V). They are configured through VOS bits in PWR_D3CR register and ODEN bit in the SYSCFG_PWRCR register. The VCORE domain is split into the following power domains that can be independently switch off. – D1 domain containing some peripherals and the Cortex®-M7 core. – D2 domain containing a large part of the peripherals. – D3 domain containing some peripherals and the system control. During power-up and power-down phases, the following power sequence requirements must be respected (see Figure 2): • When VDD is below 1 V, other power supplies (VDDA, VDD33USB, VDD50USB) must remain below VDD + 300 mV. • When VDD is above 1 V, all power supplies are independent. During the power-down phase, VDD can temporarily become lower than other supplies only if the energy provided to the microcontroller remains below 1 mJ. This allows external decoupling capacitors to be discharged with different time constants during the power-down transient phase. DS12556 Rev 6 25/336 52 Functional overview STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Figure 2. Power-up/power-down sequence V 3.6 VDDX(1) VDD VBOR0 1 0.3 Power-on Invalid supply area Operating mode VDDX < VDD + 300 mV Power-down time VDDX independent from VDD MSv47490V1 1. VDDx refers to any power supply among VDDA, VDD33USB, VDD50USB. 3.5.2 Power supply supervisor The devices have an integrated power-on reset (POR)/ power-down reset (PDR) circuitry coupled with a Brownout reset (BOR) circuitry: • Power-on reset (POR) The POR supervisor monitors VDD power supply and compares it to a fixed threshold. The devices remain in Reset mode when VDD is below this threshold, • Power-down reset (PDR) The PDR supervisor monitors VDD power supply. A reset is generated when VDD drops below a fixed threshold. The PDR supervisor can be enabled/disabled through PDR_ON pin. • Brownout reset (BOR) The BOR supervisor monitors VDD power supply. Three BOR thresholds (from 2.1 to 2.7 V) can be configured through option bytes. A reset is generated when VDD drops below this threshold. 26/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 3.5.3 Functional overview Voltage regulator The same voltage regulator supplies the 3 power domains (D1, D2 and D3). D1 and D2 can be independently switched off. Voltage regulator output can be adjusted according to application needs through 6 power supply levels: • • Run mode (VOS0 to VOS3) – Scale 0: boosted performance (available only with LDO regulator) – Scale 1: high performance – Scale 2: medium performance and consumption – Scale 3: optimized performance and low-power consumption Stop mode (SVOS3 to SVOS5) – Scale 3: peripheral with wakeup from Stop mode capabilities (UART, SPI, I2C, LPTIM) are operational – Scale 4 and 5 where the peripheral with wakeup from Stop mode is disabled The peripheral functionality is disabled but wakeup from Stop mode is possible through GPIO or asynchronous interrupt. 3.6 Low-power strategy There are several ways to reduce power consumption on STM32H750xB: • Decrease the dynamic power consumption by slowing down the system clocks even in Run mode and by individually clock gating the peripherals that are not used. • Save power consumption when the CPU is idle, by selecting among the available lowpower mode according to the user application needs. This allows achieving the best compromise between short startup time, low-power consumption, as well as available wakeup sources. The devices feature several low-power modes: • CSleep (CPU clock stopped) • CStop (CPU sub-system clock stopped) • DStop (Domain bus matrix clock stopped) • Stop (System clock stopped) • DStandby (Domain powered down) • Standby (System powered down) CSleep and CStop low-power modes are entered by the MCU when executing the WFI (Wait for Interrupt) or WFE (Wait for Event) instructions, or when the SLEEPONEXIT bit of the Cortex®-Mx core is set after returning from an interrupt service routine. A domain can enter low-power mode (DStop or DStandby) when the processor, its subsystem and the peripherals allocated in the domain enter low-power mode. If part of the domain is not in low-power mode, the domain remains in the current mode. Finally the system can enter Stop or Standby when all EXTI wakeup sources are cleared and the power domains are in DStop or DStandby mode. DS12556 Rev 6 27/336 52 Functional overview STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 2. System vs domain low-power mode D1 domain power mode System power mode Run 3.7 D2 domain power mode D3 domain power mode DRun/DStop/DStandby DRun/DStop/DStandby DRun Stop DStop/DStandby DStop/DStandby DStop Standby DStandby DStandby DStandby Reset and clock controller (RCC) The clock and reset controller is located in D3 domain. The RCC manages the generation of all the clocks, as well as the clock gating and the control of the system and peripheral resets. It provides a high flexibility in the choice of clock sources and allows to apply clock ratios to improve the power consumption. In addition, on some communication peripherals that are capable to work with two different clock domains (either a bus interface clock or a kernel peripheral clock), the system frequency can be changed without modifying the baudrate. 3.7.1 Clock management The devices embed four internal oscillators, two oscillators with external crystal or resonator, two internal oscillators with fast startup time and three PLLs. The RCC receives the following clock source inputs: • • Internal oscillators: – 64 MHz HSI clock – 48 MHz RC oscillator – 4 MHz CSI clock – 32 kHz LSI clock External oscillators: – HSE clock: 4-50 MHz (generated from an external source) or 4-48 MHz(generated from a crystal/ceramic resonator) – LSE clock: 32.768 kHz The RCC provides three PLLs: one for system clock, two for kernel clocks. The system starts on the HSI clock. The user application can then select the clock configuration. 28/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 3.7.2 Functional overview System reset sources Power-on reset initializes all registers while system reset reinitializes the system except for the debug, part of the RCC and power controller status registers, as well as the backup power domain. A system reset is generated in the following cases: • 3.8 Power-on reset (pwr_por_rst) • Brownout reset • Low level on NRST pin (external reset) • Window watchdog • Independent watchdog • Software reset • Low-power mode security reset • Exit from Standby General-purpose input/outputs (GPIOs) Each of the GPIO pins can be configured by software as output (push-pull or open-drain, with or without pull-up or pull-down), as input (floating, with or without pull-up or pull-down) or as peripheral alternate function. Most of the GPIO pins are shared with digital or analog alternate functions. All GPIOs are high-current-capable and have speed selection to better manage internal noise, power consumption and electromagnetic emission. After reset, all GPIOs (except debug pins) are in Analog mode to reduce power consumption (refer to GPIOs register reset values in the device reference manual). The I/O configuration can be locked if needed by following a specific sequence in order to avoid spurious writing to the I/Os registers. 3.9 Bus-interconnect matrix The devices feature an AXI bus matrix, two AHB bus matrices and bus bridges that allow interconnecting bus masters with bus slaves (see Figure 3). DS12556 Rev 6 29/336 52 Functional overview 30/336 Figure 3. STM32H750xB bus matrix AHBS CPU ITCM 64 Kbyte MDMA DMA2D DMA1_MEM SDMMC1 LTDC D1-to-D2 AHB DMA2 DMA2_MEM DMA1 Ethernet SDMMC2 USBHS1 MAC USBHS2 DMA2_PERIPH DTCM 128 Kbyte AHBP AXIM I$ D$ 16KB 16KB DMA1_PERIPH Cortex-M7 APB3 SRAM1 128 Kbyte AHB3 SRAM2 128 Kbyte DS12556 Rev 6 AHB1 AHB2 AXI SRAM 512 Kbyte APB1 QSPI APB2 FMC 64-bit AXI bus matrix D1 domain 32-bit AHB bus matrix D2 domain D2-to-D1 AHB D2-to-D3 AHB D1-to-D3 AHB BDMA 32-bit AHB bus matrix D3 domain Legend 32-bit bus AHB4 TCM AHB AXI APB 64-bit bus Master interface Bus multiplexer Slave interface APB4 SRAM4 64 Kbyte Backup SRAM 4 Kbyte MSv50639V2 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB SRAM3 32 Kbyte Flash memory 128 Kbytes STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 3.10 Functional overview DMA controllers The devices feature four DMA instances to unload CPU activity: • A master direct memory access (MDMA) The MDMA is a high-speed DMA controller, which is in charge of all types of memory transfers (peripheral to memory, memory to memory, memory to peripheral), without any CPU action. It features a master AXI interface and a dedicated AHB interface to access Cortex®-M7 TCM memories. The MDMA is located in D1 domain. It is able to interface with the other DMA controllers located in D2 domain to extend the standard DMA capabilities, or can manage peripheral DMA requests directly. Each of the 16 channels can perform single block transfers, repeated block transfers and linked list transfers. • Two dual-port DMAs (DMA1, DMA2) located in D2 domain, with FIFO and request router capabilities. • One basic DMA (BDMA) located in D3 domain, with request router capabilities. The DMA request router could be considered as an extension of the DMA controller. It routes the DMA peripheral requests to the DMA controller itself. This allowing managing the DMA requests with a high flexibility, maximizing the number of DMA requests that run concurrently, as well as generating DMA requests from peripheral output trigger or DMA event. 3.11 Chrom-ART Accelerator (DMA2D) The Chrom-Art Accelerator (DMA2D) is a graphical accelerator which offers advanced bit blitting, row data copy and pixel format conversion. It supports the following functions: • Rectangle filling with a fixed color • Rectangle copy • Rectangle copy with pixel format conversion • Rectangle composition with blending and pixel format conversion Various image format coding are supported, from indirect 4bpp color mode up to 32bpp direct color. It embeds dedicated memory to store color lookup tables. The DMA2D also supports block based YCbCr to handle JPEG decoder output. An interrupt can be generated when an operation is complete or at a programmed watermark. All the operations are fully automatized and are running independently from the CPU or the DMAs. DS12556 Rev 6 31/336 52 Functional overview 3.12 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Nested vectored interrupt controller (NVIC) The devices embed a nested vectored interrupt controller which is able to manage 16 priority levels, and handle up to 150 maskable interrupt channels plus the 16 interrupt lines of the Cortex®-M7 with FPU core. • Closely coupled NVIC gives low-latency interrupt processing • Interrupt entry vector table address passed directly to the core • Allows early processing of interrupts • Processing of late arriving, higher-priority interrupts • Support tail chaining • Processor context automatically saved on interrupt entry, and restored on interrupt exit with no instruction overhead This hardware block provides flexible interrupt management features with minimum interrupt latency. 3.13 Extended interrupt and event controller (EXTI) The EXTI controller performs interrupt and event management. In addition, it can wake up the processor, power domains and/or D3 domain from Stop mode. The EXTI handles up to 89 independent event/interrupt lines split as 28 configurable events and 61 direct events . Configurable events have dedicated pending flags, active edge selection, and software trigger capable. Direct events provide interrupts or events from peripherals having a status flag. 3.14 Cyclic redundancy check calculation unit (CRC) The CRC (cyclic redundancy check) calculation unit is used to get a CRC code using a programmable polynomial. Among other applications, CRC-based techniques are used to verify data transmission or storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of verifying the Flash memory integrity. The CRC calculation unit helps compute a signature of the software during runtime, to be compared with a reference signature generated at linktime and stored at a given memory location. 32/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 3.15 Functional overview Flexible memory controller (FMC) The FMC controller main features are the following: • Interface with static-memory mapped devices including: – 3.16 Static random access memory (SRAM) – NOR Flash memory/OneNAND Flash memory – PSRAM (4 memory banks) – NAND Flash memory with ECC hardware to check up to 8 Kbytes of data • Interface with synchronous DRAM (SDRAM/Mobile LPSDR SDRAM) memories • 8-,16-,32-bit data bus width • Independent Chip Select control for each memory bank • Independent configuration for each memory bank • Write FIFO • Read FIFO for SDRAM controller • The maximum FMC_CLK/FMC_SDCLK frequency for synchronous accesses is the FMC kernel clock divided by 2. Quad-SPI memory interface (QUADSPI) All devices embed a Quad-SPI memory interface, which is a specialized communication interface targeting Single, Dual or Quad-SPI Flash memories. It supports both single and double datarate operations. It can operate in any of the following modes: • Direct mode through registers • External Flash status register polling mode • Memory mapped mode. Up to 256 Mbytes of external Flash memory can be mapped, and 8-, 16- and 32-bit data accesses are supported as well as code execution. The opcode and the frame format are fully programmable. 3.17 Analog-to-digital converters (ADCs) The STM32H750xB devices embed three analog-to-digital converters, which resolution can be configured to 16, 14, 12, 10 or 8 bits. Each ADC shares up to 20 external channels, performing conversions in the Single-shot or Scan mode. In Scan mode, automatic conversion is performed on a selected group of analog inputs. Additional logic functions embedded in the ADC interface allow: • Simultaneous sample and hold • Interleaved sample and hold The ADC can be served by the DMA controller, thus allowing to automatically transfer ADC converted values to a destination location without any software action. DS12556 Rev 6 33/336 52 Functional overview STM32H750VB STM32H750ZB STM32H750IB STM32H750XB In addition, an analog watchdog feature can accurately monitor the converted voltage of one, some or all selected channels. An interrupt is generated when the converted voltage is outside the programmed thresholds. To synchronize A/D conversion and timers, the ADCs could be triggered by any of TIM1, TIM2, TIM3, TIM4, TIM6, TIM8, TIM15, HRTIM1 and LPTIM1 timer. 3.18 Temperature sensor STM32H750xB devices embed a temperature sensor that generates a voltage (VTS) that varies linearly with the temperature. This temperature sensor is internally connected to ADC3_IN18. The conversion range is between 1.7 V and 3.6 V. It can measure the device junction temperature ranging from − 40 up to +125 °C. The temperature sensor have a good linearity, but it has to be calibrated to obtain a good overall accuracy of the temperature measurement. As the temperature sensor offset varies from chip to chip due to process variation, the uncalibrated internal temperature sensor is suitable for applications that detect temperature changes only. To improve the accuracy of the temperature sensor measurement, each device is individually factory-calibrated by ST. The temperature sensor factory calibration data are stored by ST in the System memory area, which is accessible in Read-only mode. 3.19 VBAT operation The VBAT power domain contains the RTC, the backup registers and the backup SRAM. To optimize battery duration, this power domain is supplied by VDD when available or by the voltage applied on VBAT pin (when VDD supply is not present). VBAT power is switched when the PDR detects that VDD dropped below the PDR level. The voltage on the VBAT pin could be provided by an external battery, a supercapacitor or directly by VDD, in which case, the VBAT mode is not functional. VBAT operation is activated when VDD is not present. The VBAT pin supplies the RTC, the backup registers and the backup SRAM. Note: When the microcontroller is supplied from VBAT, external interrupts and RTC alarm/events do not exit it from VBAT operation. When PDR_ON pin is connected to VSS (Internal Reset OFF), the VBAT functionality is no more available and VBAT pin should be connected to VDD. 34/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 3.20 Functional overview Digital-to-analog converters (DAC) The two 12-bit buffered DAC channels can be used to convert two digital signals into two analog voltage signal outputs. This dual digital Interface supports the following features: • two DAC converters: one for each output channel • 8-bit or 12-bit monotonic output • left or right data alignment in 12-bit mode • synchronized update capability • noise-wave generation • triangular-wave generation • dual DAC channel independent or simultaneous conversions • DMA capability for each channel including DMA underrun error detection • external triggers for conversion • input voltage reference VREF+ or internal VREFBUF reference. The DAC channels are triggered through the timer update outputs that are also connected to different DMA streams. 3.21 Ultra-low-power comparators (COMP) STM32H750xB devices embed two rail-to-rail comparators (COMP1 and COMP2). They feature programmable reference voltage (internal or external), hysteresis and speed (low speed for low-power) as well as selectable output polarity. The reference voltage can be one of the following: • An external I/O • A DAC output channel • An internal reference voltage or submultiple (1/4, 1/2, 3/4). All comparators can wake up from Stop mode, generate interrupts and breaks for the timers, and be combined into a window comparator. 3.22 Operational amplifiers (OPAMP) STM32H750xB devices embed two rail-to-rail operational amplifiers (OPAMP1 and OPAMP2) with external or internal follower routing and PGA capability. The operational amplifier main features are: • PGA with a non-inverting gain ranging of 2, 4, 8 or 16 or inverting gain ranging of -1, -3, -7 or -15 • One positive input connected to DAC • Output connected to internal ADC • Low input bias current down to 1 nA • Low input offset voltage down to 1.5 mV • Gain bandwidth up to 7.3 MHz DS12556 Rev 6 35/336 52 Functional overview STM32H750VB STM32H750ZB STM32H750IB STM32H750XB The devices embeds two operational amplifiers (OPAMP1 and OPAMP2) with two inputs and one output each. These three I/Os can be connected to the external pins, thus enabling any type of external interconnections. The operational amplifiers can be configured internally as a follower, as an amplifier with a non-inverting gain ranging from 2 to 16 or with inverting gain ranging from -1 to -15. 3.23 Digital filter for sigma-delta modulators (DFSDM) The devices embed one DFSDM with 4 digital filters modules and 8 external input serial channels (transceivers) or alternately 8 internal parallel inputs support. The DFSDM peripheral is dedicated to interface the external Σ∆ modulators to microcontroller and then to perform digital filtering of the received data streams (which represent analog value on Σ∆ modulators inputs). DFSDM can also interface PDM (Pulse Density Modulation) microphones and perform PDM to PCM conversion and filtering in hardware. DFSDM features optional parallel data stream inputs from internal ADC peripherals or microcontroller memory (through DMA/CPU transfers into DFSDM). DFSDM transceivers support several serial interface formats (to support various Σ∆ modulators). DFSDM digital filter modules perform digital processing according user selected filter parameters with up to 24-bit final ADC resolution. The DFSDM peripheral supports: • • 8 multiplexed input digital serial channels: – configurable SPI interface to connect various SD modulator(s) – configurable Manchester coded 1 wire interface support – PDM (Pulse Density Modulation) microphone input support – maximum input clock frequency up to 20 MHz (10 MHz for Manchester coding) – clock output for SD modulator(s): 0..20 MHz alternative inputs from 8 internal digital parallel channels (up to 16 bit input resolution): – • – Sincx filter: filter order/type (1..5), oversampling ratio (up to 1..1024) – integrator: oversampling ratio (1..256) • up to 24-bit output data resolution, signed output data format • automatic data offset correction (offset stored in register by user) • continuous or single conversion • start-of-conversion triggered by: • 36/336 internal sources: ADC data or memory data streams (DMA) 4 digital filter modules with adjustable digital signal processing: – software trigger – internal timers – external events – start-of-conversion synchronously with first digital filter module (DFSDM0) analog watchdog feature: – low value and high value data threshold registers – dedicated configurable Sincx digital filter (order = 1..3, oversampling ratio = 1..32) – input from final output data or from selected input digital serial channels – continuous monitoring independently from standard conversion DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB • Functional overview short circuit detector to detect saturated analog input values (bottom and top range): – up to 8-bit counter to detect 1..256 consecutive 0’s or 1’s on serial data stream – monitoring continuously each input serial channel • break signal generation on analog watchdog event or on short circuit detector event • extremes detector: – storage of minimum and maximum values of final conversion data – refreshed by software • DMA capability to read the final conversion data • interrupts: end of conversion, overrun, analog watchdog, short circuit, input serial channel clock absence • “regular” or “injected” conversions: – “regular” conversions can be requested at any time or even in Continuous mode without having any impact on the timing of “injected” conversions – “injected” conversions for precise timing and with high conversion priority Table 3. DFSDM implementation DFSDM features 3.24 DFSDM1 Number of filters 4 Number of input transceivers/channels 8 Internal ADC parallel input X Number of external triggers 16 Regular channel information in identification register X Digital camera interface (DCMI) The devices embed a camera interface that can connect with camera modules and CMOS sensors through an 8-bit to 14-bit parallel interface, to receive video data. The camera interface can achieve a data transfer rate up to 140 Mbyte/s using a 80 MHz pixel clock. It features: • Programmable polarity for the input pixel clock and synchronization signals • Parallel data communication can be 8-, 10-, 12- or 14-bit • Supports 8-bit progressive video monochrome or raw bayer format, YCbCr 4:2:2 progressive video, RGB 565 progressive video or compressed data (like JPEG) • Supports Continuous mode or Snapshot (a single frame) mode • Capability to automatically crop the image DS12556 Rev 6 37/336 52 Functional overview 3.25 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB LCD-TFT controller The LCD-TFT display controller provides a 24-bit parallel digital RGB (Red, Green, Blue) and delivers all signals to interface directly to a broad range of LCD and TFT panels up to XGA (1024x768) resolution with the following features: 3.26 • 2 display layers with dedicated FIFO (64x64-bit) • Color Look-Up table (CLUT) up to 256 colors (256x24-bit) per layer • Up to 8 input color formats selectable per layer • Flexible blending between two layers using alpha value (per pixel or constant) • Flexible programmable parameters for each layer • Color keying (transparency color) • Up to 4 programmable interrupt events • AXI master interface with burst of 16 words JPEG Codec (JPEG) The JPEG Codec can encode and decode a JPEG stream as defined in the ISO/IEC 109181 specification. It provides an fast and simple hardware compressor and decompressor of JPEG images with full management of JPEG headers. The JPEG codec main features are as follows: 3.27 • 8-bit/channel pixel depths • Single clock per pixel encoding and decoding • Support for JPEG header generation and parsing • Up to four programmable quantization tables • Fully programmable Huffman tables (two AC and two DC) • Fully programmable minimum coded unit (MCU) • Encode/decode support (non simultaneous) • Single clock Huffman coding and decoding • Two-channel interface: Pixel/Compress In, Pixel/Compressed Out • Support for single greyscale component • Ability to enable/disable header processing • Fully synchronous design • Configuration for High-speed decode mode True random number generator (RNG) The RNG is a true random number generator that provides full entropy outputs to the application as 32-bit samples. It is composed of a live entropy source (analog) and an internal conditioning component. 38/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 3.28 Functional overview Cryptographic acceleration (CRYP and HASH) The devices embed a cryptographic processor that supports the advanced cryptographic algorithms usually required to ensure confidentiality, authentication, data integrity and nonrepudiation when exchanging messages with a peer: • • Encryption/Decryption – DES/TDES (data encryption standard/triple data encryption standard): ECB (electronic codebook) and CBC (cipher block chaining) chaining algorithms, 64-, 128- or 192-bit key – AES (advanced encryption standard): ECB, CBC, GCM, CCM, and CTR (Counter mode) chaining algorithms, 128, 192 or 256-bit key Universal HASH – SHA-1 and SHA-2 (secure HASH algorithms) – MD5 – HMAC The cryptographic accelerator supports DMA request generation. 3.29 Timers and watchdogs The devices include one high-resolution timer, two advanced-control timers, ten generalpurpose timers, two basic timers, five low-power timers, two watchdogs and a SysTick timer. All timer counters can be frozen in Debug mode. Table 4 compares the features of the advanced-control, general-purpose and basic timers. Table 4. Timer feature comparison Timer type Timer Highresolution HRTIM1 timer Advanced -control TIM1, TIM8 DMA Capture/ Counter Counter Prescaler request compare resolution type factor generation channels 16-bit 16-bit Complementary output Max interface clock (MHz) Max timer clock (MHz) (1) /1 /2 /4 (x2 x4 x8 x16 x32, with DLL) Yes 10 Yes 480 480 Any Up, integer Down, between 1 Up/down and 65536 Yes 4 Yes 120 240 Up DS12556 Rev 6 39/336 52 Functional overview STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 4. Timer feature comparison (continued) Timer type Timer TIM2, TIM5 TIM3, TIM4 TIM12 DMA Capture/ Counter Counter Prescaler request compare resolution type factor generation channels TIM15 TIM16, TIM17 Max interface clock (MHz) Max timer clock (MHz) 32-bit Yes 4 No 120 240 16-bit Any Up, integer Down, between 1 Up/down and 65536 Yes 4 No 120 240 16-bit Up Any integer between 1 and 65536 No 2 No 120 240 Up Any integer between 1 and 65536 No 1 No 120 240 Up Any integer between 1 and 65536 Yes 2 1 120 240 Up Any integer between 1 and 65536 Yes 1 1 120 240 Yes 0 No 120 240 No 0 No 120 240 16-bit 16-bit 16-bit Basic TIM6, TIM7 16-bit Up Any integer between 1 and 65536 Lowpower timer LPTIM1, LPTIM2, LPTIM3, LPTIM4, LPTIM5 16-bit Up 1, 2, 4, 8, 16, 32, 64, 128 1. The maximum timer clock is up to 480 MHz depending on TIMPRE bit in the RCC_CFGR register and D2PRE1/2 bits in RCC_D2CFGR register. 40/336 (1) Any Up, integer Down, between 1 Up/down and 65536 General purpose TIM13, TIM14 Complementary output DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 3.29.1 Functional overview High-resolution timer (HRTIM1) The high-resolution timer (HRTIM1) allows generating digital signals with high-accuracy timings, such as PWM or phase-shifted pulses. It consists of 6 timers, 1 master and 5 slaves, totaling 10 high-resolution outputs, which can be coupled by pairs for deadtime insertion. It also features 5 fault inputs for protection purposes and 10 inputs to handle external events such as current limitation, zero voltage or zero current switching. The HRTIM1 timer is made of a digital kernel clocked at 480 MHz The high-resolution is available on the 10 outputs in all operating modes: variable duty cycle, variable frequency, and constant ON time. The slave timers can be combined to control multiswitch complex converters or operate independently to manage multiple independent converters. The waveforms are defined by a combination of user-defined timings and external events such as analog or digital feedbacks signals. HRTIM1 timer includes options for blanking and filtering out spurious events or faults. It also offers specific modes and features to offload the CPU: DMA requests, Burst mode controller, Push-pull and Resonant mode. It supports many topologies including LLC, Full bridge phase shifted, buck or boost converters, either in voltage or current mode, as well as lighting application (fluorescent or LED). It can also be used as a general purpose timer, for instance to achieve high-resolution PWM-emulated DAC. DS12556 Rev 6 41/336 52 Functional overview 3.29.2 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Advanced-control timers (TIM1, TIM8) The advanced-control timers (TIM1, TIM8) can be seen as three-phase PWM generators multiplexed on 6 channels. They have complementary PWM outputs with programmable inserted dead times. They can also be considered as complete general-purpose timers. Their 4 independent channels can be used for: • Input capture • Output compare • PWM generation (Edge- or Center-aligned modes) • One-pulse mode output If configured as standard 16-bit timers, they have the same features as the general-purpose TIMx timers. If configured as 16-bit PWM generators, they have full modulation capability (0100%). The advanced-control timer can work together with the TIMx timers via the Timer Link feature for synchronization or event chaining. TIM1 and TIM8 support independent DMA request generation. 3.29.3 General-purpose timers (TIMx) There are ten synchronizable general-purpose timers embedded in the STM32H750xB devices (see Table 4 for differences). • TIM2, TIM3, TIM4, TIM5 The devices include 4 full-featured general-purpose timers: TIM2, TIM3, TIM4 and TIM5. TIM2 and TIM5 are based on a 32-bit auto-reload up/downcounter and a 16-bit prescaler while TIM3 and TIM4 are based on a 16-bit auto-reload up/downcounter and a 16-bit prescaler. All timers feature 4 independent channels for input capture/output compare, PWM or One-pulse mode output. This gives up to 16 input capture/output compare/PWMs on the largest packages. TIM2, TIM3, TIM4 and TIM5 general-purpose timers can work together, or with the other general-purpose timers and the advanced-control timers TIM1 and TIM8 via the Timer Link feature for synchronization or event chaining. Any of these general-purpose timers can be used to generate PWM outputs. TIM2, TIM3, TIM4, TIM5 all have independent DMA request generation. They are capable of handling quadrature (incremental) encoder signals and the digital outputs from 1 to 4 hall-effect sensors. • TIM12, TIM13, TIM14, TIM15, TIM16, TIM17 These timers are based on a 16-bit auto-reload upcounter and a 16-bit prescaler. TIM13, TIM14, TIM16 and TIM17 feature one independent channel, whereas TIM12 and TIM15 have two independent channels for input capture/output compare, PWM or One-pulse mode output. They can be synchronized with the TIM2, TIM3, TIM4, TIM5 full-featured general-purpose timers or used as simple timebases. 42/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 3.29.4 Functional overview Basic timers TIM6 and TIM7 These timers are mainly used for DAC trigger and waveform generation. They can also be used as a generic 16-bit time base. TIM6 and TIM7 support independent DMA request generation. 3.29.5 Low-power timers (LPTIM1, LPTIM2, LPTIM3, LPTIM4, LPTIM5) The low-power timers have an independent clock and is running also in Stop mode if it is clocked by LSE, LSI or an external clock. It is able to wakeup the devices from Stop mode. This low-power timer supports the following features: 3.29.6 • 16-bit up counter with 16-bit autoreload register • 16-bit compare register • Configurable output: pulse, PWM • Continuous / One-shot mode • Selectable software / hardware input trigger • Selectable clock source: • Internal clock source: LSE, LSI, HSI or APB clock • External clock source over LPTIM input (working even with no internal clock source running, used by the Pulse Counter Application) • Programmable digital glitch filter • Encoder mode Independent watchdog The independent watchdog is based on a 12-bit downcounter and 8-bit prescaler. It is clocked from an independent 32 kHz internal RC and as it operates independently from the main clock, it can operate in Stop and Standby modes. It can be used either as a watchdog to reset the device when a problem occurs, or as a free-running timer for application timeout management. It is hardware- or software-configurable through the option bytes. 3.29.7 Window watchdog The window watchdog is based on a 7-bit downcounter that can be set as free-running. It can be used as a watchdog to reset the device when a problem occurs. It is clocked from the main clock. It has an early warning interrupt capability and the counter can be frozen in Debug mode. 3.29.8 SysTick timer This timer is dedicated to real-time operating systems, but could also be used as a standard downcounter. It features: • A 24-bit downcounter • Autoreload capability • Maskable system interrupt generation when the counter reaches 0 • Programmable clock source. DS12556 Rev 6 43/336 52 Functional overview 3.30 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Real-time clock (RTC), backup SRAM and backup registers The RTC is an independent BCD timer/counter. It supports the following features: • Calendar with subsecond, seconds, minutes, hours (12 or 24 format), week day, date, month, year, in BCD (binary-coded decimal) format. • Automatic correction for 28, 29 (leap year), 30, and 31 days of the month. • Two programmable alarms. • On-the-fly correction from 1 to 32767 RTC clock pulses. This can be used to synchronize it with a master clock. • Reference clock detection: a more precise second source clock (50 or 60 Hz) can be used to enhance the calendar precision. • Digital calibration circuit with 0.95 ppm resolution, to compensate for quartz crystal inaccuracy. • Three anti-tamper detection pins with programmable filter. • Timestamp feature which can be used to save the calendar content. This function can be triggered by an event on the timestamp pin, or by a tamper event, or by a switch to VBAT mode. • 17-bit auto-reload wakeup timer (WUT) for periodic events with programmable resolution and period. The RTC and the 32 backup registers are supplied through a switch that takes power either from the VDD supply when present or from the VBAT pin. The backup registers are 32-bit registers used to store 128 bytes of user application data when VDD power is not present. They are not reset by a system or power reset, or when the device wakes up from Standby mode. The RTC clock sources can be: • A 32.768 kHz external crystal (LSE) • An external resonator or oscillator (LSE) • The internal low-power RC oscillator (LSI, with typical frequency of 32 kHz) • The high-speed external clock (HSE) divided by 32. The RTC is functional in VBAT mode and in all low-power modes when it is clocked by the LSE. When clocked by the LSI, the RTC is not functional in VBAT mode, but is functional in all low-power modes. All RTC events (Alarm, Wakeup Timer, Timestamp or Tamper) can generate an interrupt and wakeup the device from the low-power modes. 44/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 3.31 Functional overview Inter-integrated circuit interface (I2C) STM32H750xB devices embed four I2C interfaces. The I2C bus interface handles communications between the microcontroller and the serial I2C bus. It controls all I2C bus-specific sequencing, protocol, arbitration and timing. The I2C peripheral supports: • • 3.32 I2C-bus specification and user manual rev. 5 compatibility: – Slave and Master modes, multimaster capability – Standard-mode (Sm), with a bitrate up to 100 kbit/s – Fast-mode (Fm), with a bitrate up to 400 kbit/s – Fast-mode Plus (Fm+), with a bitrate up to 1 Mbit/s and 20 mA output drive I/Os – 7-bit and 10-bit addressing mode, multiple 7-bit slave addresses – Programmable setup and hold times – Optional clock stretching System Management Bus (SMBus) specification rev 2.0 compatibility: – Hardware PEC (Packet Error Checking) generation and verification with ACK control – Address resolution protocol (ARP) support – SMBus alert • Power System Management Protocol (PMBusTM) specification rev 1.1 compatibility • Independent clock: a choice of independent clock sources allowing the I2C communication speed to be independent from the PCLK reprogramming. • Wakeup from Stop mode on address match • Programmable analog and digital noise filters • 1-byte buffer with DMA capability Universal synchronous/asynchronous receiver transmitter (USART) STM32H750xB devices have four embedded universal synchronous receiver transmitters (USART1, USART2, USART3 and USART6) and four universal asynchronous receiver transmitters (UART4, UART5, UART7 and UART8). Refer to Table 5 for a summary of USARTx and UARTx features. These interfaces provide asynchronous communication, IrDA SIR ENDEC support, multiprocessor communication mode, single-wire Half-duplex communication mode and have LIN Master/Slave capability. They provide hardware management of the CTS and RTS signals, and RS485 Driver Enable. They are able to communicate at speeds of up to 12.5 Mbit/s. USART1, USART2, USART3 and USART6 also provide Smartcard mode (ISO 7816 compliant) and SPI-like communication capability. The USARTs embed a Transmit FIFO (TXFIFO) and a Receive FIFO (RXFIFO). FIFO mode is enabled by software and is disabled by default. DS12556 Rev 6 45/336 52 Functional overview STM32H750VB STM32H750ZB STM32H750IB STM32H750XB All USART have a clock domain independent from the CPU clock, allowing the USARTx to wake up the MCU from Stop mode.The wakeup from Stop mode is programmable and can be done on: • Start bit detection • Any received data frame • A specific programmed data frame • Specific TXFIFO/RXFIFO status when FIFO mode is enabled. All USART interfaces can be served by the DMA controller. Table 5. USART features USART modes/features(1) USART1/2/3/6 UART4/5/7/8 Hardware flow control for modem X X Continuous communication using DMA X X Multiprocessor communication X X Synchronous mode (Master/Slave) X - Smartcard mode X - Single-wire Half-duplex communication X X IrDA SIR ENDEC block X X LIN mode X X Dual clock domain and wakeup from low power mode X X Receiver timeout interrupt X X Modbus communication X X Auto baud rate detection X X Driver Enable X X USART data length 7, 8 and 9 bits Tx/Rx FIFO X Tx/Rx FIFO size X 16 1. X = supported. 3.33 Low-power universal asynchronous receiver transmitter (LPUART) The device embeds one Low-Power UART (LPUART1). The LPUART supports asynchronous serial communication with minimum power consumption. It supports half duplex single wire communication and modem operations (CTS/RTS). It allows multiprocessor communication. The LPUARTs embed a Transmit FIFO (TXFIFO) and a Receive FIFO (RXFIFO). FIFO mode is enabled by software and is disabled by default. 46/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Functional overview The LPUART has a clock domain independent from the CPU clock, and can wakeup the system from Stop mode. The wakeup from Stop mode are programmable and can be done on: • Start bit detection • Any received data frame • A specific programmed data frame • Specific TXFIFO/RXFIFO status when FIFO mode is enabled. Only a 32.768 kHz clock (LSE) is needed to allow LPUART communication up to 9600 baud. Therefore, even in Stop mode, the LPUART can wait for an incoming frame while having an extremely low energy consumption. Higher speed clock can be used to reach higher baudrates. LPUART interface can be served by the DMA controller. 3.34 Serial peripheral interfaces (SPI)/integrated interchip sound interfaces (I2S) The devices feature up to six SPIs (SPI2S1, SPI2S2, SPI2S3, SPI4, SPI5 and SPI6) that allow communicating up to 150 Mbits/s in Master and Slave modes, in Half-duplex, Fullduplex and Simplex modes. The 3-bit prescaler gives 8 master mode frequencies and the frame is configurable from 4 to 16 bits. All SPI interfaces support NSS pulse mode, TI mode, Hardware CRC calculation and 8x 8-bit embedded Rx and Tx FIFOs with DMA capability. Three standard I2S interfaces (multiplexed with SPI1, SPI2 and SPI3) are available. They can be operated in Master or Slave mode, in Simplex or Full-duplex communication mode, and can be configured to operate with a 16-/32-bit resolution as an input or output channel. Audio sampling frequencies from 8 kHz up to 192 kHz are supported. When either or both of the I2S interfaces is/are configured in Master mode, the master clock can be output to the external DAC/CODEC at 256 times the sampling frequency. All I2S interfaces support 16x 8bit embedded Rx and Tx FIFOs with DMA capability. 3.35 Serial audio interfaces (SAI) The devices embed 4 SAIs (SAI1, SAI2, SAI3 and SAI4) that allow designing many stereo or mono audio protocols such as I2S, LSB or MSB-justified, PCM/DSP, TDM or AC’97. An SPDIF output is available when the audio block is configured as a transmitter. To bring this level of flexibility and reconfigurability, the SAI contains two independent audio sub-blocks. Each block has it own clock generator and I/O line controller. Audio sampling frequencies up to 192 kHz are supported. In addition, up to 8 microphones can be supported thanks to an embedded PDM interface. The SAI can work in master or slave configuration. The audio sub-blocks can be either receiver or transmitter and can work synchronously or asynchronously (with respect to the other one). The SAI can be connected with other SAIs to work synchronously. DS12556 Rev 6 47/336 52 Functional overview 3.36 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB SPDIFRX Receiver Interface (SPDIFRX) The SPDIFRX peripheral is designed to receive an S/PDIF flow compliant with IEC-60958 and IEC-61937. These standards support simple stereo streams up to high sample rate, and compressed multi-channel surround sound, such as those defined by Dolby or DTS (up to 5.1). The main SPDIFRX features are the following: • Up to 4 inputs available • Automatic symbol rate detection • Maximum symbol rate: 12.288 MHz • Stereo stream from 32 to 192 kHz supported • Supports Audio IEC-60958 and IEC-61937, consumer applications • Parity bit management • Communication using DMA for audio samples • Communication using DMA for control and user channel information • Interrupt capabilities The SPDIFRX receiver provides all the necessary features to detect the symbol rate, and decode the incoming data stream. The user can select the wanted SPDIF input, and when a valid signal will be available, the SPDIFRX will re-sample the incoming signal, decode the Manchester stream, recognize frames, sub-frames and blocks elements. It delivers to the CPU decoded data, and associated status flags. The SPDIFRX also offers a signal named spdif_frame_sync, which toggles at the S/PDIF sub-frame rate that will be used to compute the exact sample rate for clock drift algorithms. 3.37 Single wire protocol master interface (SWPMI) The Single wire protocol master interface (SWPMI) is the master interface corresponding to the Contactless Frontend (CLF) defined in the ETSI TS 102 613 technical specification. The main features are: • Full-duplex communication mode • automatic SWP bus state management (active, suspend, resume) • configurable bitrate up to 2 Mbit/s • automatic SOF, EOF and CRC handling SWPMI can be served by the DMA controller. 48/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 3.38 Functional overview Management Data Input/Output (MDIO) slaves The devices embed an MDIO slave interface it includes the following features: • – 32 x 16-bit firmware read/write, MDIO read-only output data registers – 32 x 16-bit firmware read-only, MDIO write-only input data registers • Configurable slave (port) address • Independently maskable interrupts/events: • 3.39 32 MDIO Registers addresses, each of which is managed using separate input and output data registers: – MDIO Register write – MDIO Register read – MDIO protocol error Able to operate in and wake up from Stop mode SD/SDIO/MMC card host interfaces (SDMMC) Two SDMMC host interfaces are available. They support MultiMediaCard System Specification Version 4.51 in three different databus modes: 1 bit (default), 4 bits and 8 bits. Both interfaces support the SD memory card specifications version 4.1. and the SDIO card specification version 4.0. in two different databus modes: 1 bit (default) and 4 bits. Each SDMMC host interface supports only one SD/SDIO/MMC card at any one time and a stack of MMC Version 4.51 or previous. The SDMMC host interface embeds a dedicated DMA controller allowing high-speed transfers between the interface and the SRAM. 3.40 Controller area network (FDCAN1, FDCAN2) The controller area network (CAN) subsystem consists of two CAN modules, a shared message RAM memory and a clock calibration unit. Both CAN modules (FDCAN1 and FDCAN2) are compliant with ISO 11898-1 (CAN protocol specification version 2.0 part A, B) and CAN FD protocol specification version 1.0. FDCAN1 supports time triggered CAN (TT-FDCAN) specified in ISO 11898-4, including event synchronized time-triggered communication, global system time, and clock drift compensation. The FDCAN1 contains additional registers, specific to the time triggered feature. The CAN FD option can be used together with event-triggered and time-triggered CAN communication. A 10-Kbyte message RAM memory implements filters, receive FIFOs, receive buffers, transmit event FIFOs, transmit buffers (and triggers for TT-FDCAN). This message RAM is shared between the two FDCAN1 and FDCAN2 modules. The common clock calibration unit is optional. It can be used to generate a calibrated clock for both FDCAN1 and FDCAN2 from the HSI internal RC oscillator and the PLL, by evaluating CAN messages received by the FDCAN1. DS12556 Rev 6 49/336 52 Functional overview 3.41 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Universal serial bus on-the-go high-speed (OTG_HS) The devices embed two USB OTG high-speed (up to 480 Mbit/s) device/host/OTG peripheral. OTG-HS1 supports both full-speed and high-speed operations, while OTG-HS2 supports only full-speed operations. They both integrate the transceivers for full-speed operation (12 Mbit/s) and are able to operate from the internal HSI48 oscillator. OTG-HS1 features a UTMI low-pin interface (ULPI) for high-speed operation (480 Mbit/s). When using the USB OTG-HS1 in HS mode, an external PHY device connected to the ULPI is required. The USB OTG HS peripherals are compliant with the USB 2.0 specification and with the OTG 2.0 specification. They have software-configurable endpoint setting and supports suspend/resume. The USB OTG controllers require a dedicated 48 MHz clock that is generated by a PLL connected to the HSE oscillator. The main features are: • Combined Rx and Tx FIFO size of 4 Kbytes with dynamic FIFO sizing • Supports the session request protocol (SRP) and host negotiation protocol (HNP) • 9 bidirectional endpoints (including EP0) • 16 host channels with periodic OUT support • Software configurable to OTG1.3 and OTG2.0 modes of operation • USB 2.0 LPM (Link Power Management) support • Battery Charging Specification Revision 1.2 support • Internal FS OTG PHY support • External HS or HS OTG operation supporting ULPI in SDR mode (OTG_HS1 only) The OTG PHY is connected to the microcontroller ULPI port through 12 signals. It can be clocked using the 60 MHz output. 3.42 • Internal USB DMA • HNP/SNP/IP inside (no need for any external resistor) • For OTG/Host modes, a power switch is needed in case bus-powered devices are connected Ethernet MAC interface with dedicated DMA controller (ETH) The devices provide an IEEE-802.3-2002-compliant media access controller (MAC) for ethernet LAN communications through an industry-standard medium-independent interface (MII) or a reduced medium-independent interface (RMII). The microcontroller requires an external physical interface device (PHY) to connect to the physical LAN bus (twisted-pair, fiber, etc.). The PHY is connected to the device MII port using 17 signals for MII or 9 signals for RMII, and can be clocked using the 25 MHz (MII) from the microcontroller. 50/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Functional overview The devices include the following features: 3.43 • Supports 10 and 100 Mbit/s rates • Dedicated DMA controller allowing high-speed transfers between the dedicated SRAM and the descriptors • Tagged MAC frame support (VLAN support) • Half-duplex (CSMA/CD) and full-duplex operation • MAC control sublayer (control frames) support • 32-bit CRC generation and removal • Several address filtering modes for physical and multicast address (multicast and group addresses) • 32-bit status code for each transmitted or received frame • Internal FIFOs to buffer transmit and receive frames. The transmit FIFO and the receive FIFO are both 2 Kbytes. • Supports hardware PTP (precision time protocol) in accordance with IEEE 1588 2008 (PTP V2) with the time stamp comparator connected to the TIM2 input • Triggers interrupt when system time becomes greater than target time High-definition multimedia interface (HDMI) - consumer electronics control (CEC) The devices embed a HDMI-CEC controller that provides hardware support for the Consumer Electronics Control (CEC) protocol (Supplement 1 to the HDMI standard). This protocol provides high-level control functions between all audiovisual products in an environment. It is specified to operate at low speeds with minimum processing and memory overhead. It has a clock domain independent from the CPU clock, allowing the HDMI-CEC controller to wakeup the MCU from Stop mode on data reception. 3.44 Debug infrastructure The devices offer a comprehensive set of debug and trace features to support software development and system integration. • Breakpoint debugging • Code execution tracing • Software instrumentation • JTAG debug port • Serial-wire debug port • Trigger input and output • Serial-wire trace port • Trace port • Arm® CoreSight™ debug and trace components The debug can be controlled via a JTAG/Serial-wire debug access port, using industry standard debugging tools. The trace port performs data capture for logging and analysis. DS12556 Rev 6 51/336 52 Memory mapping 4 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Memory mapping Refer to the product line reference manual for details on the memory mapping as well as the boundary addresses for all peripherals. 52/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 5 Pin descriptions Pin descriptions PA14 PA15 PC10 PC11 PC12 PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 PB3 PB4 PB5 PB6 PB7 BOOT0 PB8 PB9 PE0 PE1 VSS VDD Figure 4. LQFP100 pinout 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 PE2 1 75 VDD PE3 2 74 VSS PE4 3 73 VCAP PE5 4 72 PA13 PE6 5 71 PA12 VBAT 6 70 PA11 PC13 7 69 PA10 PC14-OSC32_IN 8 68 PA9 PC15-OSC32_OUT 9 67 PA8 VSS 10 66 PC9 VDD 11 65 PC8 PH0-OSC_IN 12 64 PC7 100-pins PH1-OSC_OUT 13 63 PC6 NRST 14 62 PD15 PC0 15 61 PD14 PC1 16 60 PD13 PC2_C 17 59 PD12 PC3_C 18 58 PD11 VSSA 19 57 PD10 VREF+ 20 56 PD9 VDDA 21 55 PD8 PA0 22 54 PB15 PA1 23 53 PB14 PA2 24 52 PB13 PA3 25 51 PB12 VDD VSS VCAP PB11 PB10 PE15 PE14 PE13 PE12 PE11 PE10 PE9 PE8 PE7 PB2 PB1 PB0 PC5 PA7 PC4 PA6 PA5 PA4 VDD VSS 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 MSv41918V4 1. The above figure shows the package top view. DS12556 Rev 6 53/336 93 Pin descriptions STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 144-pins 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 VDD VSS VCAP PA13 PA12 PA11 PA10 PA9 PA8 PC9 PC8 PC7 PC6 VDD33USB VSS PG8 PG7 PG6 PG5 PG4 PG3 PG2 PD15 PD14 VDD VSS PD13 PD12 PD11 PD10 PD9 PD8 PB15 PB14 PB13 PB12 PA3 VSS VDD PA4 PA5 PA6 PA7 PC4 PC5 PB0 PB1 PB2 PF11 PF12 VSS VDD PF13 PF14 PF15 PG0 PG1 PE7 PE8 PE9 VSS VDD PE10 PE11 PE12 PE13 PE14 PE15 PB10 PB11 VCAP VDD PE2 PE3 PE4 PE5 PE6 VBAT PC13 PC14-OSC32_IN PC15-OSC32_OUT PF0 PF1 PF2 PF3 PF4 PF5 VSS VDD PF6 PF7 PF8 PF9 PF10 PH0-OSC_IN PH1-OSC_OUT NRST PC0 PC1 PC2_C PC3_C VDD VSSA VREF+ VDDA PA0 PA1 PA2 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 VDD PDR_ON PE1 PE0 PB9 PB8 BOOT0 PB7 PB6 PB5 PB4 PB3 PG15 VDD VSS PG14 PG13 PG12 PG11 PG10 PG9 PD7 PD6 VDD VSS PD5 PD4 PD3 PD2 PD1 PD0 PC12 PC11 PC10 PA15 PA14 Figure 5. LQFP144 pinout MSv41917V4 1. The above figure shows the package top view. 54/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Pin descriptions PE2 PE3 PE4 PE5 PE6 VBAT PI8 PC13 PC14-OSC32_IN PC15-OSC32_OUT PI9 PI10 PI11 VSS VDD PF0 PF1 PF2 PF3 PF4 PF5 VSS VDD PF6 PF7 PF8 PF9 PF10 PH0-OSC_IN PH1-OSC_OUT NRST PC0 PC1 PC2_C PC3_C VDD VSSA VREF+ VDDA PA0 PA1 PA2 PH2 PH3 134 133 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 PINOUT UNDER DEVELOPMENT 169 170 171 172 173 174 175 176 PI7 PI6 PI5 PI4 VDD PDR_ON PE1 PE0 PB9 PB8 BOOT0 PB7 PB6 PB5 PB4 PB3 PG15 VDD VSS PG14 PG13 PG12 PG11 PG10 PG9 PD7 PD6 VDD VSS PD5 PD4 PD3 PD2 PD1 PD0 PC12 PC11 PC10 PA15 PA14 VDD VSS PI3 PI2 Figure 6. LQFP176 pinout 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 176-pins 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 PI1 PI0 PH15 PH14 PH13 VDD VSS VCAP PA13 PA12 PA11 PA10 PA9 PA8 PC9 PC8 PC7 PC6 VDD33USB VSS PG8 PG7 PG6 PG5 PG4 PG3 PG2 PD15 PD14 VDD VSS PD13 PD12 PD11 PD10 PD9 PD8 PB15 PB14 PB13 PB12 VDD VSS PH12 PH4 PH5 PA3 VSS VDD PA4 PA5 PA6 PA7 PC4 PC5 PB0 PB1 PB2 PF11 PF12 VSS VDD PF13 PF14 PF15 PG0 PG1 PE7 PE8 PE9 VSS VDD PE10 PE11 PE12 PE13 PE14 PE15 PB10 PB11 VCAP VDD PH6 PH7 PH8 PH9 PH10 PH11 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 MSv41916V5 1. The above figure shows the package top view. DS12556 Rev 6 55/336 93 Pin descriptions STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Figure 7. UFBGA176+25 ballout 1 2 3 5 6 10 11 A PE3 PE2 PE1 PE0 PB8 PB5 PG14 PG13 PB4 PB3 PD7 B PE4 PE5 PE6 PB9 PB7 PB6 PG15 PG12 PG11 PG10 C VBAT PI7 PI6 PI5 VDD PDR_ON VDD VDD VDD D PC13 PI8 PI9 PI4 VSS BOOT0 VSS VSS VSS PF0 PI10 PI11 VSS VDD PH2 VSS VSS VSS VSS E F PC14OSC32_ IN PC15OSC32_ OUT 4 7 8 9 12 13 14 PC12 PA15 PA14 PA13 15 PD6 PD0 PC11 PC10 PA12 PG9 PD5 PD1 PI3 PI2 PA11 PD4 PD3 PD2 PH15 PI1 PA10 PH13 PH14 PI0 PA9 VSS VSS VCAP PC9 PA8 G PH0OSC_IN VSS VDD PH3 VSS VSS VSS VSS VSS VSS VDD PC8 PC7 H PH1OSC_ OUT PF2 PF1 PH4 VSS VSS VSS VSS VSS VSS VDD 33USB PG8 PC6 J NRST PF3 PF4 PH5 VSS VSS VSS VSS VSS VDD VDD PG7 PG6 K PF7 PF6 PF5 VDD VSS VSS VSS VSS VSS PH12 PG5 PG4 PG3 L PF10 PF9 PF8 VSS PH11 PH10 PD15 PG2 M VSSA PC0 PC1 PC2_C PC3_C PB2 PG1 VSS VSS VCAP PH6 PH8 PH9 PD14 PD13 N VREF- PA1 PA0 PA4 PC4 PF13 PG0 VDD VDD VDD PE13 PH7 PD12 PD11 PD10 P VREF+ PA2 PA6 PA5 PC5 PF12 PF15 PE8 PE9 PE11 PE14 PB12 PB13 PD9 PD8 R VDDA PA3 PA7 PB1 PB0 PF11 PF14 PE7 PE10 PE12 PE15 PB10 PB11 PB14 PB15 MSv41912V3 1. The above figure shows the package top view. 56/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Pin descriptions Figure 8. TFBGA240+25 ballout 1 2 3 4 5 6 7 8 9 10 11 VCAP PK5 PG10 PG9 PD5 12 13 14 15 16 17 PC10 PA15 PI1 PI0 VSS A VSS PI6 PI5 PI4 PB5 VDD LDO B VBAT VSS PI7 PE1 PB6 VSS PB4 PK4 PG11 PJ15 PD6 PD3 PC11 PA14 PI2 PH15 PH14 PE2 PE0 PB7 PB3 PK6 PK3 PG12 VSS PD7 PC12 VSS PI3 PA13 VSS VDD LDO PB9 PB8 PG15 PK7 PG14 PG13 PJ14 PJ12 PD2 PD0 PA10 PA9 PH13 VCAP VDD VDD PJ13 VDD PD1 PC8 PC9 PA8 PA12 PA11 PC6 PG8 PG7 VDD33 USB PG5 PG6 VSS VDD50 USB C D PC15- PC14OSC32_ OSC32_ OUT IN PE5 PE4 PE3 E NC PI9 PC13 PI8 PE6 F NC VSS PI10 PI11 VDD G PF2 NC PF1 PF0 VDD PI13 PI14 PDR_ ON BOO T0 PD4 PC7 VSS VSS VSS VSS VSS VDD VSS VSS VSS VSS VSS VDD H PI12 J PH1PH0OSC_ OSC_IN OUT VSS PF5 PF4 VSS VSS VSS VSS VSS VDD PK0 K NRST PF6 PF7 PF8 VDD VSS VSS VSS VSS VSS VDD L VDDA PC0 PF10 PF9 VDD VSS VSS VSS VSS VSS M VREF+ PC1 PC2 PC3 VDD N VREF- PH2 PA2 PA1 PA0 PJ0 VDD VDD PE10 VDD VDD P VSSA PH3 PH4 PH5 PI15 PJ1 PF13 PF14 PE9 PE11 R PC2_C PC3_C PA6 VSS PA7 PB2 PF12 VSS PF15 T PA0_C PA1_C PA5 PC4 PB1 PJ2 PF11 PG0 U VSS PA3 PA4 PC5 PB0 PJ3 PJ4 PG1 PF3 VDD PG4 PG3 PG2 PK2 PK1 VSS VSS PJ11 VSS NC NC VDD PJ10 VSS NC NC VDD PJ9 VSS NC NC VDD PJ8 PJ7 PJ6 VSS NC PB10 PB11 PH10 PH11 PD15 PD14 VDD PE12 PE15 PJ5 PH9 PH12 PD11 PD12 PD13 PE8 PE13 PH6 VSS PH8 PB12 PB15 PD10 PD9 PE7 PE14 VCAP VDD LDO PH7 PB13 PB14 PD8 VSS MSv41911V3 1. The above figure shows the package top view. DS12556 Rev 6 57/336 93 Pin descriptions STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 6. Legend/abbreviations used in the pinout table Name Pin name Pin type Abbreviation Unless otherwise specified in brackets below the pin name, the pin function during and after reset is the same as the actual pin name S Supply pin I Input only pin I/O Input / output pin ANA Analog-only Input FT 5 V tolerant I/O TT 3.3 V tolerant I/O B Dedicated BOOT0 pin RST I/O structure Notes Pin functions 58/336 Definition Bidirectional reset pin with embedded weak pull-up resistor Option for TT and FT I/Os _f I2C FM+ option _a analog option (supplied by VDDA) _u USB option (supplied by VDD33USB) _h High-speed low-voltage I/O Unless otherwise specified by a note, all I/Os are set as floating inputs during and after reset. Alternate functions Functions selected through GPIOx_AFR registers Additional functions Functions directly selected/enabled through peripheral registers DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Pin descriptions Table 7. STM32H750xB pin/ball definition 1 A2 1 C3 PE2 I/O FT_h - 2 2 A1 2 D3 PE3 I/O FT_h - TRACED0, TIM15_BKIN, SAI1_SD_B, SAI4_SD_B, FMC_A19, EVENTOUT - - TRACED1, SAI1_D2, DFSDM1_DATIN3, TIM15_CH1N, SPI4_NSS, SAI1_FS_A, SAI4_FS_A, SAI4_D2, FMC_A20, DCMI_D4, LCD_B0, EVENTOUT - - TRACED2, SAI1_CK2, DFSDM1_CKIN3, TIM15_CH1, SPI4_MISO, SAI1_SCK_A, SAI4_SCK_A, SAI4_CK2, FMC_A21, DCMI_D6, LCD_G0, EVENTOUT - - 3 4 3 4 B1 B2 LQFP176 1 TRACECLK, SAI1_CK1, SPI4_SCK, SAI1_MCLK_A, SAI4_MCLK_A, QUADSPI_BK1_IO2, SAI4_CK1, ETH_MII_TXD3, FMC_A23, EVENTOUT LQFP144 Alternate functions LQFP100 Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 UFBGA176+25 Pin/ball name 3 4 D2 D1 PE4 PE5 I/O I/O FT_h FT_h Additional functions - 5 5 B3 5 E5 PE6 I/O FT_h - TRACED3, TIM1_BKIN2, SAI1_D1, TIM15_CH2, SPI4_MOSI, SAI1_SD_A, SAI4_SD_A, SAI4_D1, SAI2_MCLK_B, TIM1_BKIN2_COMP12, FMC_A22, DCMI_D7, LCD_G1, EVENTOUT - - H10 - A1 VSS S - - - - - - - - - VDD S - - - - 6 6 C1 6 B1 VBAT S - - - - - - J6 - B2 VSS S - - - - - - D2 7 E4 PI8 I/O FT - EVENTOUT RTC_ TAMP2/ WKUP3 7 7 D1 8 E3 PC13 I/O FT - EVENTOUT RTC_ TAMP1/ RTC_TS/ WKUP2 - - J7 - B6 VSS S - - - - 8 8 E1 9 C2 PC14OSC32_IN (OSC32_IN)(1) I/O FT - EVENTOUT OSC32_IN DS12556 Rev 6 59/336 93 Pin descriptions STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 7. STM32H750xB pin/ball definition (continued) LQFP100 LQFP144 UFBGA176+25 LQFP176 TFBGA240 +25 Pin type I/O structure Notes Pin/ball name Alternate functions 9 9 F1 10 C1 PC15OSC32_OUT (OSC32_OUT)(1) I/O FT - EVENTOUT OSC32_ OUT - - D3 11 E2 PI9 I/O FT_h - UART4_RX, FDCAN1_RX, FMC_D30, LCD_VSYNC, EVENTOUT - - - E3 12 F3 PI10 I/O FT_h - FDCAN1_RXFD_MODE, ETH_MII_RX_ER, FMC_D31, LCD_HSYNC, EVENTOUT - - E4 13 F4 PI11 I/O FT - LCD_G6, OTG_HS_ULPI_DIR, EVENTOUT WKUP4 - - F2 14 A17 VSS S - - - - - - F3 15 E6 - - - Pin name (function after reset) Additional functions VDD S - - - - - E1 (2) NC - - - - - - F1(3) NC - - - - - (4) NC - - - - - - - - - - 10 E2 16 G4 PF0 I/O FT_f - I2C2_SDA, FMC_A0, EVENTOUT - - 11 H3 17 G3 PF1 I/O FT_f - I2C2_SCL, FMC_A1, EVENTOUT - - 12 H2 18 G1 PF2 I/O FT - I2C2_SMBA, FMC_A2, EVENTOUT - - - - - H1 PI12 I/O FT - LCD_HSYNC, EVENTOUT - - - - - H2 PI13 I/O FT - LCD_VSYNC, EVENTOUT - - - - - H3 PI14 I/O FT_h - LCD_CLK, EVENTOUT - - 13 J2 19 H4 PF3 I/O FT_ha - FMC_A3, EVENTOUT ADC3_ INP5 - 14 J3 20 J5 PF4 I/O FT_ha - FMC_A4, EVENTOUT ADC3_ INN5, ADC3_ INP9 - 15 K3 21 J4 PF5 I/O FT_ha - FMC_A5, EVENTOUT ADC3_ INP4 10 16 G2 22 C10 VSS S - - - - 11 17 G3 23 E9 VDD S - - - - - 18 K2 24 K2 PF6 I/O FT_ha - TIM16_CH1, SPI5_NSS, SAI1_SD_B, UART7_RX, SAI4_SD_B, QUADSPI_BK1_IO3, EVENTOUT ADC3_ INN4, ADC3_ INP8 60/336 G2 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Pin descriptions Table 7. STM32H750xB pin/ball definition (continued) 19 25 K3 PF7 I/O I/O structure Pin type TFBGA240 +25 LQFP176 UFBGA176+25 K1 Pin name (function after reset) FT_ha Notes - LQFP144 LQFP100 Pin/ball name Alternate functions Additional functions - TIM17_CH1, SPI5_SCK, SAI1_MCLK_B, UART7_TX, SAI4_MCLK_B, QUADSPI_BK1_IO2, EVENTOUT ADC3_ INP3 ADC3_ INN3, ADC3_ INP7 - 20 L3 26 K4 PF8 I/O FT_ha - TIM16_CH1N, SPI5_MISO, SAI1_SCK_B, UART7_RTS/UART7_DE, SAI4_SCK_B, TIM13_CH1, QUADSPI_BK1_IO0, EVENTOUT - 21 L2 27 L4 PF9 I/O FT_ha - TIM17_CH1N, SPI5_MOSI, SAI1_FS_B, UART7_CTS, SAI4_FS_B, TIM14_CH1, QUADSPI_BK1_IO1, EVENTOUT ADC3_ INP2 ADC3_ INN2, ADC3_ INP6 - 22 L1 28 L3 PF10 I/O FT_ha - TIM16_BKIN, SAI1_D3, QUADSPI_CLK, SAI4_D3, DCMI_D11, LCD_DE, EVENTOUT 12 23 G1 29 J2 PH0-OSC_IN (PH0) I/O FT - EVENTOUT OSC_IN 13 24 H1 30 J1 PH1-OSC_OUT (PH1) I/O FT - EVENTOUT OSC_OUT 14 25 J1 31 K1 NRST I/O RST - - - - DFSDM1_CKIN0, DFSDM1_DATIN4, SAI2_FS_B, OTG_HS_ULPI_STP, FMC_SDNWE, LCD_R5, EVENTOUT ADC123_ INP10 - TRACED0, SAI1_D1, DFSDM1_DATIN0, DFSDM1_CKIN4, SPI2_MOSI/I2S2_SDO, SAI1_SD_A, SAI4_SD_A, SDMMC2_CK, SAI4_D1, ETH_MDC, MDIOS_MDC, EVENTOUT ADC123_ INN10, ADC123_ INP11, RTC_ TAMP3/ WKUP5 15 16 - 26 27 - M2 M3 - 17(6) 28(6) M4(6) 32 33 - 34(6) L2 M2 (5) M3 R1(5) PC0 PC1 I/O I/O FT_a FT_ha PC2 I/O FT_a - PC2_C ANA TT_a - DS12556 Rev 6 CDSLEEP, DFSDM1_CKIN1, SPI2_MISO/I2S2_SDI, DFSDM1_CKOUT, OTG_HS_ULPI_DIR, ETH_MII_TXD2, FMC_SDNE0, EVENTOUT ADC123_ INN11, ADC123_ INP12 ADC3_ INN1, ADC3_ INP0 61/336 93 Pin descriptions STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 7. STM32H750xB pin/ball definition (continued) - - - 18(6) 29(6) M5(6) - M4 (5) Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 LQFP176 UFBGA176+25 LQFP144 LQFP100 Pin/ball name PC3 I/O FT_a - 35(6) R2(5) PC3_C ANA TT_a - Alternate functions CSLEEP, DFSDM1_DATIN1, SPI2_MOSI/I2S2_SDO, OTG_HS_ULPI_NXT, ETH_MII_TX_CLK, FMC_SDCKE0, EVENTOUT Additional functions ADC12_ INN12, ADC12_ INP13 ADC3_ INP1 - 30 G3 36 E11 VDD S - - - - J10 - C13 VSS S - - - - 19 31 M1 37 P1 VSSA S - - - - - - N1 - N1 VREF- S - - - - 20 32 P1 38 M1 VREF+ S - - - - 21 33 R1 39 L1 VDDA S - - - - 22 34 N3 40 N5(5) PA0 I/O FT_a - TIM2_CH1/TIM2_ETR, TIM5_CH1, TIM8_ETR, TIM15_BKIN, USART2_CTS/USART2_NSS, UART4_TX, SDMMC2_CMD, SAI2_SD_B, ETH_MII_CRS, EVENTOUT ADC1_ INP16, WKUP0 - - - - 23 35 N2 41 - - - - 24 36 P2 42 (5) PA0_C ANA TT_a - N4(5) PA1 I/O FT_ha - T2(5) PA1_C ANA TT_a - T1 N3 PA2 I/O FT_a - TIM2_CH2, TIM5_CH2, LPTIM3_OUT, TIM15_CH1N, USART2_RTS/USART2_DE, UART4_RX, QUADSPI_BK1_IO3, SAI2_MCLK_B, ETH_MII_RX_CLK/ETH_RMII_RE F_CLK, LCD_R2, EVENTOUT ADC12_ INN1, ADC12_ INP0 ADC1_ INN16, ADC1_ INP17 ADC12_ INP1 - TIM2_CH3, TIM5_CH3, LPTIM4_OUT, TIM15_CH1, USART2_TX, SAI2_SCK_B, ETH_MDIO, MDIOS_MDIO, LCD_R1, EVENTOUT ADC12_ INP14, WKUP1 ADC3_ INP13 - - F4 43 N2 PH2 I/O FT_ha - LPTIM1_IN2, QUADSPI_BK2_IO0, SAI2_SCK_B, ETH_MII_CRS, FMC_SDCKE0, LCD_R0, EVENTOUT - - - - F5 VDD S - - - - - - J8 - C16 VSS S - - - - 62/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Pin descriptions Table 7. STM32H750xB pin/ball definition (continued) - G4 44 P2 PH3 I/O FT_ha - - - H4 45 P3 PH4 I/O FT_fa - I2C2_SCL, LCD_G5, OTG_HS_ULPI_NXT, LCD_G4, EVENTOUT ADC3_ INN14, ADC3_ INP15 - I2C2_SDA, SPI5_NSS, FMC_SDNWE, EVENTOUT ADC3_ INN15, ADC3_ INP16 ADC12_ INP15 - - J4 LQFP176 - QUADSPI_BK2_IO1, SAI2_MCLK_B, ETH_MII_COL, FMC_SDNE0, LCD_R1, EVENTOUT LQFP144 Alternate functions LQFP100 Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 UFBGA176+25 Pin/ball name 46 P4 PH5 I/O FT_fa Additional functions ADC3_ INN13, ADC3_ INP14 25 37 R2 47 U2 PA3 I/O FT_ha - TIM2_CH4, TIM5_CH4, LPTIM5_OUT, TIM15_CH2, USART2_RX, LCD_B2, OTG_HS_ULPI_D0, ETH_MII_COL, LCD_B5, EVENTOUT 26 38 K6 - F2(4) VSS S - - - - - - L4 48 - VSS S - - - - 27 39 K4 49 G5 VDD S - - - - - D1PWREN, TIM5_ETR, SPI1_NSS/I2S1_WS, SPI3_NSS/I2S3_WS, USART2_CK, SPI6_NSS, OTG_HS_SOF, DCMI_HSYNC, LCD_VSYNC, EVENTOUT ADC12_ INP18, DAC1_ OUT1 - D2PWREN, TIM2_CH1/TIM2_ETR, TIM8_CH1N, SPI1_SCK/I2S1_CK, SPI6_SCK, OTG_HS_ULPI_CK, LCD_R4, EVENTOUT ADC12_ INN18, ADC12_ INP19, DAC1_ OUT2 - TIM1_BKIN, TIM3_CH1, TIM8_BKIN, SPI1_MISO/I2S1_SDI, SPI6_MISO, TIM13_CH1, TIM8_BKIN_COMP12, MDIOS_MDC, TIM1_BKIN_COMP12, DCMI_PIXCLK, LCD_G2, EVENTOUT ADC12_ INP3 28 29 30 40 41 42 N4 P4 P3 50 51 52 U3 T3 R3 PA4 PA5 PA6 I/O I/O I/O TT_a TT_ha FT_a DS12556 Rev 6 63/336 93 Pin descriptions STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 7. STM32H750xB pin/ball definition (continued) 32 43 44 N5 53 54 R5 T4 PA7 PC4 I/O I/O I/O structure Pin type TFBGA240 +25 LQFP176 UFBGA176+25 R3 Pin name (function after reset) TT_a TT_a Notes 31 LQFP144 LQFP100 Pin/ball name Alternate functions Additional functions - TIM1_CH1N, TIM3_CH2, TIM8_CH1N, SPI1_MOSI/I2S1_SDO, SPI6_MOSI, TIM14_CH1, ETH_MII_RX_DV/ETH_RMII_CRS _DV, FMC_SDNWE, EVENTOUT ADC12_ INN3, ADC12_ INP7, OPAMP1_ VINM - DFSDM1_CKIN2, I2S1_MCK, SPDIFRX1_IN3, ETH_MII_RXD0/ETH_RMII_RXD0 , FMC_SDNE0, EVENTOUT ADC12_ INP4, OPAMP1_ VOUT, COMP1_ INM ADC12_ INN4, ADC12_ INP8, OPAMP1_ VINM 33 45 P5 55 U4 PC5 I/O TT_a - SAI1_D3, DFSDM1_DATIN2, SPDIFRX1_IN4, SAI4_D3, ETH_MII_RXD1/ETH_RMII_RXD1 , FMC_SDCKE0, COMP1_OUT, EVENTOUT - - - - G13 VDD S - - - - - - J9 - R4 VSS S - - - - - TIM1_CH2N, TIM3_CH3, TIM8_CH2N, DFSDM1_CKOUT, UART4_CTS, LCD_R3, OTG_HS_ULPI_D1, ETH_MII_RXD2, LCD_G1, EVENTOUT ADC12_ INN5, ADC12_ INP9, OPAMP1_ VINP, COMP1_ INP - TIM1_CH3N, TIM3_CH4, TIM8_CH3N, DFSDM1_DATIN1, LCD_R6, OTG_HS_ULPI_D2, ETH_MII_RXD3, LCD_G0, EVENTOUT ADC12_ INP5, COMP1_ INM COMP1_ INP 34 35 46 47 R5 R4 56 57 U5 T5 PB0 PB1 I/O I/O FT_a TT_u 36 48 M6 58 R6 PB2 I/O FT_ha - RTC_OUT, SAI1_D1, DFSDM1_CKIN1, SAI1_SD_A, SPI3_MOSI/I2S3_SDO, SAI4_SD_A, QUADSPI_CLK, SAI4_D1, EVENTOUT - - - - P5 PI15 I/O FT - LCD_G2, LCD_R0, EVENTOUT - - - - - N6 PJ0 I/O FT - LCD_R7, LCD_R1, EVENTOUT - - - - - P6 PJ1 I/O FT - LCD_R2, EVENTOUT - - - - - T6 PJ2 I/O FT - LCD_R3, EVENTOUT - - - - - U6 PJ3 I/O FT - LCD_R4, EVENTOUT - 64/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Pin descriptions Table 7. STM32H750xB pin/ball definition (continued) LQFP100 LQFP144 UFBGA176+25 LQFP176 TFBGA240 +25 Pin name (function after reset) Pin type I/O structure Notes Pin/ball name Alternate functions - - - - U7 PJ4 I/O FT - LCD_R5, EVENTOUT - - 49 R6 59 T7 PF11 I/O FT_a - SPI5_MOSI, SAI2_SD_B, FMC_SDNRAS, DCMI_D12, EVENTOUT ADC1_ INP2 Additional functions - 50 P6 60 R7 PF12 I/O FT_ha - FMC_A6, EVENTOUT ADC1_ INN2, ADC1_ INP6 - 51 M8 61 J3 VSS S - - - - - 52 N8 62 H5 VDD S - - - - - 53 N6 63 P7 PF13 I/O FT_ha - DFSDM1_DATIN6, I2C4_SMBA, FMC_A7, EVENTOUT ADC2_ INP2 ADC2_ INN2, ADC2_ INP6 - 54 R7 64 P8 PF14 I/O FT_fha - DFSDM1_CKIN6, I2C4_SCL, FMC_A8, EVENTOUT - 55 P7 65 R9 PF15 I/O FT_fh - I2C4_SDA, FMC_A9, EVENTOUT - - 56 N7 66 T8 PG0 I/O FT_h - FMC_A10, EVENTOUT - - - F6 - J16 VSS S - - - - - - - - H13 VDD S - - - - - 57 M7 67 U8 PG1 I/O TT_h - FMC_A11, EVENTOUT OPAMP2_ VINM OPAMP2_ VOUT, COMP2_ INM 37 58 R8 68 U9 PE7 I/O TT_ha - TIM1_ETR, DFSDM1_DATIN2, UART7_RX, QUADSPI_BK2_IO0, FMC_D4/FMC_DA4, EVENTOUT 38 59 P8 69 T9 PE8 I/O TT_ha - TIM1_CH1N, DFSDM1_CKIN2, UART7_TX, QUADSPI_BK2_IO1, FMC_D5/FMC_DA5, COMP2_OUT, EVENTOUT OPAMP2_ VINM OPAMP2_ VINP, COMP2_ INP 39 60 P9 70 P9 PE9 I/O TT_ha - TIM1_CH1, DFSDM1_CKOUT, UART7_RTS/UART7_DE, QUADSPI_BK2_IO2, FMC_D6/FMC_DA6, EVENTOUT - 61 M9 71 J17 VSS S - - - - - 62 N9 72 J13 VDD S - - - - 40 63 R9 73 N9 PE10 I/O FT_ha - TIM1_CH2N, DFSDM1_DATIN4, UART7_CTS, QUADSPI_BK2_IO3, FMC_D7/FMC_DA7, EVENTOUT COMP2_ INM DS12556 Rev 6 65/336 93 Pin descriptions STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 7. STM32H750xB pin/ball definition (continued) 42 64 65 R10 74 75 P10 R10 PE11 PE12 I/O I/O I/O structure Pin type TFBGA240 +25 LQFP176 UFBGA176+25 P10 Pin name (function after reset) FT_ha FT_h Notes 41 LQFP144 LQFP100 Pin/ball name Alternate functions Additional functions - TIM1_CH2, DFSDM1_CKIN4, SPI4_NSS, SAI2_SD_B, FMC_D8/FMC_DA8, LCD_G3, EVENTOUT COMP2_ INP - TIM1_CH3N, DFSDM1_DATIN5, SPI4_SCK, SAI2_SCK_B, FMC_D9/FMC_DA9, COMP1_OUT, LCD_B4, EVENTOUT - - 43 66 N11 76 T10 PE13 I/O FT_h - TIM1_CH3, DFSDM1_CKIN5, SPI4_MISO, SAI2_FS_B, FMC_D10/FMC_DA10, COMP2_OUT, LCD_DE, EVENTOUT - - F7 - T12 VSS S - - - - - - - - K13 VDD S - - - - 44 67 P11 77 U10 PE14 I/O FT_h - TIM1_CH4, SPI4_MOSI, SAI2_MCLK_B, FMC_D11/FMC_DA11, LCD_CLK, EVENTOUT - - TIM1_BKIN, FMC_D12/FMC_DA12, TIM1_BKIN_COMP12/COMP_ TIM1_BKIN, LCD_R7, EVENTOUT - - TIM2_CH3, HRTIM_SCOUT, LPTIM2_IN1, I2C2_SCL, SPI2_SCK/I2S2_CK, DFSDM1_DATIN7, USART3_TX, QUADSPI_BK1_NCS, OTG_HS_ULPI_D3, ETH_MII_RX_ER, LCD_G4, EVENTOUT - - 45 46 68 69 R11 R12 78 79 R11 P11 PE15 PB10 I/O I/O FT_h FT_f 47 70 R13 80 P12 PB11 I/O FT_f - TIM2_CH4, HRTIM_SCIN, LPTIM2_ETR, I2C2_SDA, DFSDM1_CKIN7, USART3_RX, OTG_HS_ULPI_D4, ETH_MII_TX_EN/ETH_RMII_TX_ EN, LCD_G5, EVENTOUT 48 71 M10 81 U11 VCAP S - - - - 49 - K7 - - VSS S - - - - - - - - U12 VDDLDO S - - - - 50 72 N10 82 L13 VDD S - - - - - - - - R12 PJ5 I/O FT - LCD_R6, EVENTOUT - 66/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Pin descriptions Table 7. STM32H750xB pin/ball definition (continued) - M11 83 T11 PH6 I/O FT - - - N12 84 U13 PH7 I/O FT_fa - I2C3_SCL, SPI5_MISO, ETH_MII_RXD3, FMC_SDCKE1, DCMI_D9, EVENTOUT - - - M12 85 T13 PH8 I/O FT_fha - TIM5_ETR, I2C3_SDA, FMC_D16, DCMI_HSYNC, LCD_R2, EVENTOUT - - - F8 - - VSS S - - - - - - - - M13 VDD S - - - - - - M13 86 R13 PH9 I/O FT_h - TIM12_CH2, I2C3_SMBA, FMC_D17, DCMI_D0, LCD_R3, EVENTOUT - - - L13 87 P13 PH10 I/O FT_h - TIM5_CH1, I2C4_SMBA, FMC_D18, DCMI_D1, LCD_R4, EVENTOUT - - - L12 88 P14 PH11 I/O FT_fh - TIM5_CH2, I2C4_SCL, FMC_D19, DCMI_D2, LCD_R5, EVENTOUT - - - K12 89 R14 PH12 I/O FT_fh - TIM5_CH3, I2C4_SDA, FMC_D20, DCMI_D3, LCD_R6, EVENTOUT - - - H12 90 N16 VSS S - - - - - - J12 91 P17 VDD S - - - - - TIM1_BKIN, I2C2_SMBA, SPI2_NSS/I2S2_WS, DFSDM1_DATIN1, USART3_CK, FDCAN2_RX, OTG_HS_ULPI_D5, ETH_MII_TXD0/ETH_RMII_TXD0, OTG_HS_ID, TIM1_BKIN_COMP12, UART5_RX, EVENTOUT - TIM1_CH1N, LPTIM2_OUT, SPI2_SCK/I2S2_CK, DFSDM1_CKIN1, USART3_CTS/USART3_NSS, FDCAN2_TX, OTG_HS_ULPI_D6, ETH_MII_TXD1/ETH_RMII_TXD1, UART5_TX, EVENTOUT 51 52 73 74 P12 P13 LQFP176 - TIM12_CH1, I2C2_SMBA, SPI5_SCK, ETH_MII_RXD2, FMC_SDNE1, DCMI_D8, EVENTOUT LQFP144 Alternate functions LQFP100 Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 UFBGA176+25 Pin/ball name 92 93 T14 U14 PB12 PB13 I/O I/O FT_u FT_u DS12556 Rev 6 Additional functions - OTG_HS_ VBUS 67/336 93 Pin descriptions STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 7. STM32H750xB pin/ball definition (continued) 75 94 U15 PB14 I/O I/O structure Pin type TFBGA240 +25 LQFP176 UFBGA176+25 R14 Pin name (function after reset) FT_u Notes 53 LQFP144 LQFP100 Pin/ball name Alternate functions Additional functions - TIM1_CH2N, TIM12_CH1, TIM8_CH2N, USART1_TX, SPI2_MISO/I2S2_SDI, DFSDM1_DATIN2, USART3_RTS/USART3_DE, UART4_RTS/UART4_DE, SDMMC2_D0, OTG_HS_DM, EVENTOUT - - 54 76 R15 95 T15 PB15 I/O FT_u - RTC_REFIN, TIM1_CH3N, TIM12_CH2, TIM8_CH3N, USART1_RX, SPI2_MOSI/I2S2_SDO, DFSDM1_CKIN2, UART4_CTS, SDMMC2_D1, OTG_HS_DP, EVENTOUT 55 77 P15 96 U16 PD8 I/O FT_h - DFSDM1_CKIN3, SAI3_SCK_B, USART3_TX, SPDIFRX1_IN2, FMC_D13/FMC_DA13, EVENTOUT - - DFSDM1_DATIN3, SAI3_SD_B, USART3_RX, FDCAN2_RXFD_MODE, FMC_D14/FMC_DA14, EVENTOUT - - 56 78 P14 97 T17 PD9 I/O FT_h 57 79 N15 98 T16 PD10 I/O FT_h - DFSDM1_CKOUT, SAI3_FS_B, USART3_CK, FDCAN2_TXFD_MODE, FMC_D15/FMC_DA15, LCD_B3, EVENTOUT - - - - N12 VDD S - - - - - - F9 - U17 VSS S - - - - - LPTIM2_IN2, I2C4_SMBA, USART3_CTS/USART3_NSS, QUADSPI_BK1_IO0, SAI2_SD_A, FMC_A16, EVENTOUT - - - 58 80 N14 99 R15 PD11 I/O FT_h 59 81 N13 100 R16 PD12 I/O FT_fh - LPTIM1_IN1, TIM4_CH1, LPTIM2_IN1, I2C4_SCL, USART3_RTS/USART3_DE, QUADSPI_BK1_IO1, SAI2_FS_A, FMC_A17, EVENTOUT 60 82 M15 101 R17 PD13 I/O FT_fh - LPTIM1_OUT, TIM4_CH2, I2C4_SDA, QUADSPI_BK1_IO3, SAI2_SCK_A, FMC_A18, EVENTOUT 68/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Pin descriptions Table 7. STM32H750xB pin/ball definition (continued) LQFP100 LQFP144 UFBGA176+25 LQFP176 TFBGA240 +25 Pin name (function after reset) Pin type I/O structure Notes Pin/ball name Alternate functions - 83 K8 102 - VSS S - - - - - 84 J13 103 N11 VDD S - - - - 61 85 M14 104 P16 PD14 I/O FT_h - TIM4_CH3, SAI3_MCLK_B, UART8_CTS, FMC_D0/FMC_DA0, EVENTOUT - 62 86 L14 105 P15 PD15 I/O FT_h - TIM4_CH4, SAI3_MCLK_A, UART8_RTS/UART8_DE, FMC_D1/FMC_DA1, EVENTOUT - - - - - N15 PJ6 I/O FT - TIM8_CH2, LCD_R7, EVENTOUT - - - - - N14 PJ7 I/O FT - TRGIN, TIM8_CH2N, LCD_G0, EVENTOUT - - - - - N10 VDD S - - - - F10 - R8 VSS S - - - - - - N13 PJ8 I/O FT - TIM1_CH3N, TIM8_CH1, UART8_TX, LCD_G1, EVENTOUT - - - - - M14 PJ9 I/O FT - TIM1_CH3, TIM8_CH1N, UART8_RX, LCD_G2, EVENTOUT - - - - - L14 PJ10 I/O FT - TIM1_CH2N, TIM8_CH2, SPI5_MOSI, LCD_G3, EVENTOUT - - - - - K14 PJ11 I/O FT - TIM1_CH2, TIM8_CH2N, SPI5_MISO, LCD_G4, EVENTOUT - - - - - N8 VDD S - - G6 - U1 - - - VSS S - - - - - N17 NC - - - - - - M16(2) NC - - - - - (2) NC - - - - - - - - - - - - - - - - (2) - - - Additional functions - M17 K15 VSS S - - - - L16 (2) NC - - - - - L17 (2) NC - - - - - K16 (2) NC - - - - - K17 (2) NC - - - - - - - - - - - - - L15 VSS S - - - - - - - - J14 PK0 I/O FT - TIM1_CH1N, TIM8_CH3, SPI5_SCK, LCD_G5, EVENTOUT - DS12556 Rev 6 69/336 93 Pin descriptions STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 7. STM32H750xB pin/ball definition (continued) LQFP100 LQFP144 UFBGA176+25 LQFP176 TFBGA240 +25 Pin name (function after reset) Pin type I/O structure Notes Pin/ball name Alternate functions - - - - J15 PK1 I/O FT - TIM1_CH1, TIM8_CH3N, SPI5_NSS, LCD_G6, EVENTOUT - - - - - H17 PK2 I/O FT - TIM1_BKIN, TIM8_BKIN, TIM8_BKIN_COMP12, TIM1_BKIN_COMP12, LCD_G7, EVENTOUT - - 87 L15 106 H16 PG2 I/O FT_h - TIM8_BKIN, TIM8_BKIN_COMP12, FMC_A12, EVENTOUT - - 88 K15 107 H15 PG3 I/O FT_h - TIM8_BKIN2, TIM8_BKIN2_COMP12, FMC_A13, EVENTOUT - - - G7 - - VSS S - - - - - - - - N7 VDD S - - - - - 89 K14 108 H14 PG4 I/O FT_h - TIM1_BKIN2, TIM1_BKIN2_COMP12, FMC_A14/FMC_BA0, EVENTOUT - - 90 K13 109 G14 PG5 I/O FT_h - TIM1_ETR, FMC_A15/FMC_BA1, EVENTOUT - - 91 J15 110 G15 PG6 I/O FT_h - TIM17_BKIN, HRTIM_CHE1, QUADSPI_BK1_NCS, FMC_NE3, DCMI_D12, LCD_R7, EVENTOUT - - 92 J14 111 F16 PG7 I/O FT_h - HRTIM_CHE2, SAI1_MCLK_A, USART6_CK, FMC_INT, DCMI_D13, LCD_CLK, EVENTOUT - - Additional functions - 93 H14 112 F15 PG8 I/O FT_h - TIM8_ETR, SPI6_NSS, USART6_RTS/USART6_DE, SPDIFRX1_IN3, ETH_PPS_OUT, FMC_SDCLK, LCD_G7, EVENTOUT - 94 G12 113 G16 VSS S - - - - - - - - G17 VDD50USB S - - - - - 95 H13 114 F17 VDD33USB S - - - - - - - - M5 VDD S - - - - 70/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Pin descriptions Table 7. STM32H750xB pin/ball definition (continued) 64 65 96 97 98 G15 G14 115 116 117 F14 F13 E13 PC6 PC7 PC8 I/O I/O I/O I/O structure Pin type TFBGA240 +25 LQFP176 UFBGA176+25 H15 Pin name (function after reset) FT_h FT_h FT_h Notes 63 LQFP144 LQFP100 Pin/ball name Alternate functions Additional functions - HRTIM_CHA1, TIM3_CH1, TIM8_CH1, DFSDM1_CKIN3, I2S2_MCK, USART6_TX, SDMMC1_D0DIR, FMC_NWAIT, SDMMC2_D6, SDMMC1_D6, DCMI_D0, LCD_HSYNC, EVENTOUT SWPMI_IO - TRGIO, HRTIM_CHA2, TIM3_CH2, TIM8_CH2, DFSDM1_DATIN3, I2S3_MCK, USART6_RX, SDMMC1_D123DIR, FMC_NE1, SDMMC2_D7, SWPMI_TX, SDMMC1_D7, DCMI_D1, LCD_G6, EVENTOUT - - TRACED1, HRTIM_CHB1, TIM3_CH3, TIM8_CH3, USART6_CK, UART5_RTS/UART5_DE, FMC_NE2/FMC_NCE, SWPMI_RX, SDMMC1_D0, DCMI_D2, EVENTOUT - MCO2, TIM3_CH4, TIM8_CH4, I2C3_SDA, I2S_CKIN, UART5_CTS, QUADSPI_BK1_IO0, LCD_G3, SWPMI_SUSPEND, SDMMC1_D1, DCMI_D3, LCD_B2, EVENTOUT - 66 99 F14 118 E14 PC9 I/O FT_fh - - - G8 - - VSS S - - - - - - - L5 VDD S - - - 67 68 100 101 F15 E15 119 120 E15 D15 PA8 PA9 I/O I/O FT_fha FT_u DS12556 Rev 6 - MCO1, TIM1_CH1, HRTIM_CHB2, TIM8_BKIN2, I2C3_SCL, USART1_CK, OTG_FS_SOF, UART7_RX, TIM8_BKIN2_COMP12, LCD_B3, LCD_R6, EVENTOUT - - TIM1_CH2, HRTIM_CHC1, LPUART1_TX, I2C3_SMBA, SPI2_SCK/I2S2_CK, USART1_TX, FDCAN1_RXFD_MODE, DCMI_D0, LCD_R5, EVENTOUT OTG_FS_ VBUS 71/336 93 Pin descriptions STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 7. STM32H750xB pin/ball definition (continued) 70 102 103 C15 121 122 D14 E17 PA10 PA11 I/O I/O I/O structure Pin type TFBGA240 +25 LQFP176 UFBGA176+25 D15 Pin name (function after reset) FT_u FT_u Notes 69 LQFP144 LQFP100 Pin/ball name Alternate functions Additional functions - TIM1_CH3, HRTIM_CHC2, LPUART1_RX, USART1_RX, FDCAN1_TXFD_MODE, OTG_FS_ID, MDIOS_MDIO, LCD_B4, DCMI_D1, LCD_B1, EVENTOUT - - TIM1_CH4, HRTIM_CHD1, LPUART1_CTS, SPI2_NSS/I2S2_WS, UART4_RX, USART1_CTS/USART1_NSS, FDCAN1_RX, OTG_FS_DM, LCD_R4, EVENTOUT - - 71 104 B15 123 E16 PA12 I/O FT_u - TIM1_ETR, HRTIM_CHD2, LPUART1_RTS/LPUART1_DE, SPI2_SCK/I2S2_CK, UART4_TX, USART1_RTS/USART1_DE, SAI2_FS_B, FDCAN1_TX, OTG_FS_DP, LCD_R5, EVENTOUT 72 105 A15 124 C15 PA13 (JTMS/SWDIO) I/O FT - JTMS-SWDIO, EVENTOUT - 73 106 F13 125 D17 VCAP S - - - - 74 107 F12 126 - VSS S - - - - - - - - C17 VDDLDO - - - - 75 108 G13 127 K5 VDD S - - - - - - E12 128 D16 PH13 I/O FT_h - TIM8_CH1N, UART4_TX, FDCAN1_TX, FMC_D21, LCD_G2, EVENTOUT - - - E13 129 B17 PH14 I/O FT_h - TIM8_CH2N, UART4_RX, FDCAN1_RX, FMC_D22, DCMI_D4, LCD_G3, EVENTOUT - - - D13 130 B16 PH15 I/O FT_h - TIM8_CH3N, FDCAN1_TXFD_MODE, FMC_D23, DCMI_D11, LCD_G4, EVENTOUT - - - - - E14 131 A16 PI0 I/O FT_h - TIM5_CH4, SPI2_NSS/I2S2_WS, FDCAN1_RXFD_MODE, FMC_D24, DCMI_D13, LCD_G5, EVENTOUT - - G9 - - VSS S - - - 72/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Pin descriptions Table 7. STM32H750xB pin/ball definition (continued) - D14 132 A15 PI1 I/O FT_h - - - C14 133 B15 PI2 I/O FT_h - TIM8_CH4, SPI2_MISO/I2S2_SDI, FMC_D26, DCMI_D9, LCD_G7, EVENTOUT - - LQFP176 - TIM8_BKIN2, SPI2_SCK/I2S2_CK, TIM8_BKIN2_COMP12, FMC_D25, DCMI_D8, LCD_G6, EVENTOUT LQFP144 Alternate functions LQFP100 Notes I/O structure Pin name (function after reset) Pin type TFBGA240 +25 UFBGA176+25 Pin/ball name Additional functions - - - C13 134 C14 PI3 I/O FT_h - TIM8_ETR, SPI2_MOSI/I2S2_SDO, FMC_D27, DCMI_D10, EVENTOUT - - D9 135 - VSS S - - - - - - C9 136 - VDD S - - - - 76 109 A14 137 B14 PA14 (JTCK/SWCLK) I/O FT - JTCK-SWCLK, EVENTOUT - - JTDI, TIM2_CH1/TIM2_ETR, HRTIM_FLT1, CEC, SPI1_NSS/I2S1_WS, SPI3_NSS/I2S3_WS, SPI6_NSS, UART4_RTS/UART4_DE, UART7_TX, EVENTOUT - - HRTIM_EEV1, DFSDM1_CKIN5, SPI3_SCK/I2S3_CK, USART3_TX, UART4_TX, QUADSPI_BK1_IO1, SDMMC1_D2, DCMI_D8, LCD_R2, EVENTOUT - - HRTIM_FLT2, DFSDM1_DATIN5, SPI3_MISO/I2S3_SDI, USART3_RX, UART4_RX, QUADSPI_BK2_NCS, SDMMC1_D3, DCMI_D4, EVENTOUT - - 77 78 79 110 111 112 A13 B14 B13 138 139 140 A14 A13 B13 PA15 (JTDI) PC10 PC11 I/O I/O I/O FT FT_ha FT_h 80 113 A12 141 C12 PC12 I/O FT_h - TRACED3, HRTIM_EEV2, SPI3_MOSI/I2S3_SDO, USART3_CK, UART5_TX, SDMMC1_CK, DCMI_D9, EVENTOUT - - G10 - - VSS S - - - - 81 114 B12 142 D13 PD0 I/O FT_h - DFSDM1_CKIN6, SAI3_SCK_A, UART4_RX, FDCAN1_RX, FMC_D2/FMC_DA2, EVENTOUT - DS12556 Rev 6 73/336 93 Pin descriptions STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 7. STM32H750xB pin/ball definition (continued) LQFP100 LQFP144 UFBGA176+25 LQFP176 TFBGA240 +25 Pin name (function after reset) Pin type I/O structure Notes Pin/ball name Alternate functions 82 115 C12 143 E12 PD1 I/O FT_h - DFSDM1_DATIN6, SAI3_SD_A, UART4_TX, FDCAN1_TX, FMC_D3/FMC_DA3, EVENTOUT - 83 116 D12 144 D12 PD2 I/O FT_h - TRACED2, TIM3_ETR, UART5_RX, SDMMC1_CMD, DCMI_D11, EVENTOUT - - DFSDM1_CKOUT, SPI2_SCK/I2S2_CK, USART2_CTS/USART2_NSS, FMC_CLK, DCMI_D5, LCD_G7, EVENTOUT - - 84 117 D11 145 B12 PD3 I/O FT_h Additional functions 85 118 D10 146 A12 PD4 I/O FT_h - HRTIM_FLT3, SAI3_FS_A, USART2_RTS/USART2_DE, FDCAN1_RXFD_MODE, FMC_NOE, EVENTOUT 86 119 C11 147 A11 PD5 I/O FT_h - HRTIM_EEV3, USART2_TX, FDCAN1_TXFD_MODE, FMC_NWE, EVENTOUT - - 120 D8 148 - VSS S - - - - - 121 C8 149 - VDD S - - - - - SAI1_D1, DFSDM1_CKIN4, DFSDM1_DATIN1, SPI3_MOSI/I2S3_SDO, SAI1_SD_A, USART2_RX, SAI4_SD_A, FDCAN2_RXFD_MODE, SAI4_D1, SDMMC2_CK, FMC_NWAIT, DCMI_D10, LCD_B2, EVENTOUT - - 87 122 B11 150 B11 PD6 I/O FT_h 88 123 A11 151 C11 PD7 I/O FT_h - DFSDM1_DATIN4, SPI1_MOSI/I2S1_SDO, DFSDM1_CKIN1, USART2_CK, SPDIFRX1_IN1, SDMMC2_CMD, FMC_NE1, EVENTOUT - - - - D11 PJ12 I/O FT - TRGOUT, LCD_G3, LCD_B0, EVENTOUT - - - - - E10 PJ13 I/O FT - LCD_B4, LCD_B1, EVENTOUT - - - - - D10 PJ14 I/O FT - LCD_B2, EVENTOUT - - - - - B10 PJ15 I/O FT - LCD_B3, EVENTOUT - - - H6 - - VSS S - - - - - - - - - VDD S - - - - 74/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Pin descriptions Table 7. STM32H750xB pin/ball definition (continued) - - - - 124 125 126 127 128 B10 B9 B8 A8 152 153 154 155 156 A10 A9 B9 C9 D9 PG9 PG10 PG11 PG12 PG13 I/O I/O I/O I/O I/O I/O structure Pin type TFBGA240 +25 LQFP176 UFBGA176+25 C10 Pin name (function after reset) FT_h FT_h FT_h FT_h FT_h Notes - LQFP144 LQFP100 Pin/ball name Alternate functions Additional functions - SPI1_MISO/I2S1_SDI, USART6_RX, SPDIFRX1_IN4, QUADSPI_BK2_IO2, SAI2_FS_B, FMC_NE2/FMC_NCE, DCMI_VSYNC, EVENTOUT - - HRTIM_FLT5, SPI1_NSS/I2S1_WS, LCD_G3, SAI2_SD_B, FMC_NE3, DCMI_D2, LCD_B2, EVENTOUT - - LPTIM1_IN2, HRTIM_EEV4, SPI1_SCK/I2S1_CK, SPDIFRX1_IN1, SDMMC2_D2, ETH_MII_TX_EN/ETH_RMII_TX_ EN, DCMI_D3, LCD_B3, EVENTOUT - - LPTIM1_IN1, HRTIM_EEV5, SPI6_MISO, USART6_RTS/USART6_DE, SPDIFRX1_IN2, LCD_B4, ETH_MII_TXD1/ETH_RMII_TXD1, FMC_NE4, LCD_B1, EVENTOUT - - TRACED0, LPTIM1_OUT, HRTIM_EEV10, SPI6_SCK, USART6_CTS/USART6_NSS, ETH_MII_TXD0/ETH_RMII_TXD0, FMC_A24, LCD_R0, EVENTOUT - - - 129 A7 157 D8 PG14 I/O FT_h - TRACED1, LPTIM1_ETR, SPI6_MOSI, USART6_TX, QUADSPI_BK2_IO3, ETH_MII_TXD1/ETH_RMII_TXD1, FMC_A25, LCD_B0, EVENTOUT - 130 D7 158 - VSS S - - - - - 131 C7 159 - VDD S - - - - - - - - C8 PK3 I/O FT - LCD_B4, EVENTOUT - - - - - B8 PK4 I/O FT - LCD_B5, EVENTOUT - - - - - A8 PK5 I/O FT - LCD_B6, EVENTOUT - - - - - C7 PK6 I/O FT - LCD_B7, EVENTOUT - - - - - D7 PK7 I/O FT - LCD_DE, EVENTOUT - - - H7 - - VSS S - - - - - 132 B7 160 D6 PG15 I/O FT_h - USART6_CTS/USART6_NSS, FMC_SDNCAS, DCMI_D13, EVENTOUT - DS12556 Rev 6 75/336 93 Pin descriptions STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 7. STM32H750xB pin/ball definition (continued) 90 133 134 A9 161 162 C6 B7 PB3 (JTDO/TRACES WO) PB4(NJTRST) I/O I/O I/O structure Pin type TFBGA240 +25 LQFP176 UFBGA176+25 A10 Pin name (function after reset) FT FT Notes 89 LQFP144 LQFP100 Pin/ball name Alternate functions Additional functions - JTDO/TRACESWO, TIM2_CH2, HRTIM_FLT4, SPI1_SCK/I2S1_CK, SPI3_SCK/I2S3_CK, SPI6_SCK, SDMMC2_D2, CRS_SYNC, UART7_RX, EVENTOUT - - NJTRST, TIM16_BKIN, TIM3_CH1, HRTIM_EEV6, SPI1_MISO/I2S1_SDI, SPI3_MISO/I2S3_SDI, SPI2_NSS/I2S2_WS, SPI6_MISO, SDMMC2_D3, UART7_TX, EVENTOUT - - 91 135 A6 163 A5 PB5 I/O FT - TIM17_BKIN, TIM3_CH2, HRTIM_EEV7, I2C1_SMBA, SPI1_MOSI/I2S1_SDO, I2C4_SMBA, SPI3_MOSI/I2S3_SDO, SPI6_MOSI, FDCAN2_RX, OTG_HS_ULPI_D7, ETH_PPS_OUT, FMC_SDCKE1, DCMI_D10, UART5_RX, EVENTOUT - - H8 - - VSS S - - - - - TIM16_CH1N, TIM4_CH1, HRTIM_EEV8, I2C1_SCL, CEC, I2C4_SCL, USART1_TX, LPUART1_TX, FDCAN2_TX, QUADSPI_BK1_NCS, DFSDM1_DATIN5, FMC_SDNE1, DCMI_D5, UART5_TX, EVENTOUT - PVD_IN VPP 92 136 B6 164 B5 PB6 I/O FT_f 93 137 B5 165 C5 PB7 I/O FT_fa - TIM17_CH1N, TIM4_CH2, HRTIM_EEV9, I2C1_SDA, I2C4_SDA, USART1_RX, LPUART1_RX, FDCAN2_TXFD_MODE, DFSDM1_CKIN5, FMC_NL, DCMI_VSYNC, EVENTOUT 94 138 D6 166 E8 BOOT0 I B - - 76/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Pin descriptions Table 7. STM32H750xB pin/ball definition (continued) 96 97 139 140 141 B4 A4 167 168 169 D5 D4 C4 PB8 PB9 PE0 I/O I/O I/O I/O structure Pin type TFBGA240 +25 LQFP176 UFBGA176+25 A5 Pin name (function after reset) FT_fh FT_fh FT_h Notes 95 LQFP144 LQFP100 Pin/ball name Alternate functions Additional functions - TIM16_CH1, TIM4_CH3, DFSDM1_CKIN7, I2C1_SCL, I2C4_SCL, SDMMC1_CKIN, UART4_RX, FDCAN1_RX, SDMMC2_D4, ETH_MII_TXD3, SDMMC1_D4, DCMI_D6, LCD_B6, EVENTOUT - - TIM17_CH1, TIM4_CH4, DFSDM1_DATIN7, I2C1_SDA, SPI2_NSS/I2S2_WS, I2C4_SDA, SDMMC1_CDIR, UART4_TX, FDCAN1_TX, SDMMC2_D5, I2C4_SMBA, SDMMC1_D5, DCMI_D7, LCD_B7, EVENTOUT - - LPTIM1_ETR, TIM4_ETR, HRTIM_SCIN, LPTIM2_ETR, UART8_RX, FDCAN1_RXFD_MODE, SAI2_MCLK_A, FMC_NBL0, DCMI_D2, EVENTOUT - - 98 142 A3 170 B4 PE1 I/O FT_h - LPTIM1_IN2, HRTIM_SCOUT, UART8_TX, FDCAN1_TXFD_MODE, FMC_NBL1, DCMI_D3, EVENTOUT - - - - A7 VCAP S - - - - 99 - D5 - - VSS S - - - - - 143 C6 171 E7 PDR_ON I FT - - - - - - - A6 VDDLDO S - - - - 100 144 C5 172 - VDD S - - - - - - D4 173 A4 PI4 I/O FT_h - TIM8_BKIN, SAI2_MCLK_A, TIM8_BKIN_COMP12, FMC_NBL2, DCMI_D5, LCD_B4, EVENTOUT - - - C4 174 A3 PI5 I/O FT_h - TIM8_CH1, SAI2_SCK_A, FMC_NBL3, DCMI_VSYNC, LCD_B5, EVENTOUT - - - C3 175 A2 PI6 I/O FT_h - TIM8_CH2, SAI2_SD_A, FMC_D28, DCMI_D6, LCD_B6, EVENTOUT - - - C2 176 B3 PI7 I/O FT_h - TIM8_CH3, SAI2_FS_A, FMC_D29, DCMI_D7, LCD_B7, EVENTOUT - DS12556 Rev 6 77/336 93 Pin descriptions STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 7. STM32H750xB pin/ball definition (continued) LQFP100 LQFP144 UFBGA176+25 LQFP176 TFBGA240 +25 Pin name (function after reset) Pin type I/O structure Notes Pin/ball name Alternate functions - - H9 - - VSS S - - - - - - K9 - - VSS S - - - - - - K10 - M15 VSS S - - - - Additional functions 1. When this pin/ball was previously configured as an oscillator, the oscillator function is kept during and after a reset. This is valid for all resets except for power-on reset. 2. This ball should remain floating. 3. This ball should not remain floating. It can be connected to VSS or VDD. It is reserved for future use. 4. This ball should be connected to VSS. 5. Pxy_C and Pxy pins/balls are two separate pads (analog switch open). The analog switch is configured through a SYSCFG register. Refer to the product reference manual for a detailed description of the switch configuration bits. 6. There is a direct path between Pxy_C and Pxy pins/balls, through an analog switch. Pxy alternate functions are available on Pxy_C when the analog switch is closed. The analog switch is configured through a SYSCFG register. Refer to the product reference manual for a detailed description of the switch configuration bits. 78/336 DS12556 Rev 6 AF0 AF1 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1/ 3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PA0 - TIM2_CH1/ TIM2_ETR TIM5_CH1 TIM8_ETR TIM15_BKIN - - USART2_ CTS/ USART2_ NSS UART4_TX SDMMC2_ CMD SAI2_SD_B ETH_MII_ CRS - - - EVENTOUT PA1 - TIM2_CH2 TIM5_CH2 LPTIM3_ OUT TIM15_ CH1N - - USART2_ RTS/ USART2_ DE UART4_RX QUADSPI_ BK1_IO3 SAI2_MCLK _B ETH_MII_ RX_CLK/ ETH_RMII_ REF_CLK - - LCD_R2 EVENTOUT PA2 - TIM2_CH3 TIM5_CH3 LPTIM4_ OUT TIM15_CH1 - - USART2_ TX SAI2_SCK_ B - - ETH_MDIO MDIOS_ MDIO - LCD_R1 EVENTOUT PA3 - TIM2_CH4 TIM5_CH4 LPTIM5_ OUT TIM15_CH2 - - USART2_ RX - LCD_B2 OTG_HS_ ULPI_D0 ETH_MII_ COL - - LCD_B5 EVENTOUT PA4 D1 PWREN - TIM5_ETR - - SPI1_NSS/ I2S1_WS SPI3_NSS/ I2S3_WS USART2_ CK SPI6_NSS - - - OTG_HS_ SOF DCMI_ HSYNC LCD_ VSYNC EVENTOUT PA5 D2 PWREN TIM2_CH1/ TIM2_ETR - TIM8_ CH1N - SPI1_SCK /I2S1_CK - - SPI6_SCK - OTG_HS_ ULPI_CK - - - LCD_R4 EVENTOUT PA6 - TIM1_BKIN TIM3_CH1 TIM8_BKIN - SPI1_MISO /I2S1_SDI - - SPI6_MISO TIM13_ CH1 TIM8_BKIN _COMP12 MDIOS_ MDC TIM1_BKIN _COMP12 DCMI_PIX CLK LCD_G2 EVENTOUT PA7 - TIM1_CH1N TIM3_CH2 TIM8_CH1 N - SPI1_MOSI /I2S1_SDO - - SPI6_MOSI TIM14_ CH1 - ETH_MII_ RX_DV/ ETH_RMII_ CRS_DV FMC_SDN WE - - EVENTOUT PA8 MCO1 TIM1_CH1 HRTIM_CH B2 TIM8_BKIN 2 I2C3_SCL - - USART1_ CK - - OTG_FS_ SOF UART7_RX TIM8_BKIN 2_COMP12 LCD_B3 LCD_R6 EVENTOUT PA9 - TIM1_CH2 HRTIM_CH C1 LPUART1_ TX I2C3_SMBA SPI2_SCK/ I2S2_CK - USART1_ TX - FDCAN1_ RXFD_ MODE - - - DCMI_D0 LCD_R5 EVENTOUT PA10 - TIM1_CH3 HRTIM_CH C2 LPUART1_ RX - - - USART1_ RX - FDCAN1_ TXFD_ MODE OTG_FS_ID MDIOS_ MDIO LCD_B4 DCMI_D1 LCD_B1 EVENTOUT PA11 - TIM1_CH4 HRTIM_CH D1 LPUART1_ CTS - SPI2_NSS /I2S2_WS UART4_RX USART1_ CTS/ USART1_ NSS - FDCAN1_ RX OTG_FS_ DM - - - LCD_R4 EVENTOUT PA12 - TIM1_ETR HRTIM_CH D2 LPUART1_ RTS/ LPUART1_ DE - SPI2_SCK/ I2S2_CK UART4_TX USART1_ RTS/ USART1_ DE SAI2_FS_B FDCAN1_ TX OTG_FS_ DP - - - LCD_R5 EVENTOUT Port Port A DS12556 Rev 6 79/336 Pin descriptions SYS LPUART/ TIM8/ LPTIM2/3/4/ 5/HRTIM1/ DFSDM1 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 8. Port A alternate functions AF2 AF3 AF4 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4/ 5/HRTIM1/ DFSDM1 PA13 JTMSSWDIO - - PA14 JTCKSWCLK - PA15 JTDI TIM2_CH1/ TIM2_ETR Port A Port AF1 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1/ 3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS - - - - - - - - - - - - EVENTOUT - - - - - - - - - - - - - EVENTOUT HRTIM_ FLT1 - CEC SPI1_NSS/ I2S1_WS SPI3_NSS/ I2S3_WS SPI6_NSS UART4_ RTS/ UART4_ DE - - UART7_TX - - - EVENTOUT Port B DS12556 Rev 6 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/5/ 6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/3 /6/UART7/S DMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/ DCMI/LCD /COMP UART5/ LCD SYS PB0 - TIM1_CH2N TIM3_CH3 TIM8_ CH2N - - DFSDM1_ CKOUT - UART4_ CTS LCD_R3 OTG_HS_ ULPI_D1 ETH_MII_ RXD2 - - LCD_G1 EVENTOUT PB1 - TIM1_CH3N TIM3_CH4 TIM8_ CH3N - - DFSDM1_ DATIN1 - - LCD_R6 OTG_HS_ ULPI_D2 ETH_MII_ RXD3 - - LCD_G0 EVENTOUT PB2 RTC_OUT - SAI1_D1 - DFSDM1_ CKIN1 - SAI1_SD_A SPI3_ MOSI/I2S3_ SDO SAI4_SD_ A QUADSPI_ CLK SAI4_D1 - - - - EVENTOUT PB3 JTDO/TRA CESWO TIM2_CH2 HRTIM_ FLT4 - - SPI1_SCK/ I2S1_CK SPI3_SCK/ I2S3_CK - SPI6_SCK SDMMC2_ D2 CRS_SYNC UART7_RX - - - EVENTOUT PB4 NJTRST TIM16_ BKIN TIM3_CH1 HRTIM_ EEV6 - SPI1_MISO/ I2S1_SDI SPI3_MISO/ I2S3_SDI SPI2_NSS/I 2S2_WS SPI6_ MISO SDMMC2_ D3 - UART7_TX - - - EVENTOUT PB5 - TIM17_ BKIN TIM3_CH2 HRTIM_ EEV7 I2C1_SMBA SPI1_MOSI/ I2S1_SDO I2C4_SMBA SPI3_MOSI/ I2S3_SDO SPI6_ MOSI FDCAN2_ RX OTG_HS_ ULPI_D7 ETH_PPS_ OUT FMC_ SDCKE1 DCMI_ D10 UART5_ RX EVENTOUT PB6 - TIM16_ CH1N TIM4_CH1 HRTIM_ EEV8 I2C1_SCL CEC I2C4_SCL USART1_ TX LPUART1_ TX FDCAN2_ TX QUADSPI_ BK1_NCS DFSDM1_ DATIN5 FMC_ SDNE1 DCMI_D5 UART5_ TX EVENTOUT PB7 - TIM17_ CH1N TIM4_CH2 HRTIM_ EEV9 I2C1_SDA - I2C4_SDA USART1_ RX LPUART1_ RX FDCAN2_ TXFD_ MODE - DFSDM1_ CKIN5 FMC_NL DCMI_ VSYNC - EVENTOUT Port AF1 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 9. Port B alternate functions AF0 Pin descriptions 80/336 Table 8. Port A alternate functions (continued) AF0 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/5/ 6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/3 /6/UART7/S DMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/ DCMI/LCD /COMP UART5/ LCD SYS PB8 - TIM16_CH1 TIM4_CH3 DFSDM1_ CKIN7 I2C1_SCL - I2C4_SCL SDMMC1_ CKIN UART4_RX FDCAN1_ RX SDMMC2_ D4 ETH_MII_ TXD3 SDMMC1_ D4 DCMI_D6 LCD_B6 EVENTOUT PB9 - TIM17_CH1 TIM4_CH4 DFSDM1_ DATIN7 I2C1_SDA SPI2_NSS/ I2S2_WS I2C4_SDA SDMMC1_ CDIR UART4_TX FDCAN1_ TX SDMMC2_ D5 I2C4_ SMBA SDMMC1_ D5 DCMI_D7 LCD_B7 EVENTOUT PB10 - TIM2_CH3 HRTIM_ SCOUT LPTIM2_IN 1 I2C2_SCL SPI2_SCK/ I2S2_CK DFSDM1_ DATIN7 USART3_ TX - QUADSPI_ BK1_NCS OTG_HS_ ULPI_D3 ETH_MII_ RX_ER - - LCD_G4 EVENTOUT PB11 - TIM2_CH4 HRTIM_ SCIN LPTIM2_ ETR I2C2_SDA - DFSDM1_ CKIN7 USART3_ RX - - OTG_HS_ ULPI_D4 ETH_MII_ TX_EN/ ETH_RMII_ TX_EN - - LCD_G5 EVENTOUT PB12 - TIM1_BKIN - - I2C2_SMBA SPI2_NSS/ I2S2_WS DFSDM1_ DATIN1 USART3_ CK - FDCAN2_ RX OTG_HS_ ULPI_D5 ETH_MII_ TXD0/ETH_ RMII_TXD0 OTG_HS_ ID TIM1_ BKIN_ COMP12 UART5_ RX EVENTOUT PB13 - TIM1_CH1N - LPTIM2_ OUT - SPI2_SCK/ I2S2_CK DFSDM1_ CKIN1 USART3_ CTS/ USART3_ NSS - FDCAN2_ TX OTG_HS_ ULPI_D6 ETH_MII_ TXD1/ETH_ RMII_TXD1 - - UART5_ TX EVENTOUT PB14 - TIM1_CH2N TIM12_ CH1 TIM8_ CH2N USART1_TX SPI2_MISO/ I2S2_SDI DFSDM1_ DATIN2 USART3_ RTS/ USART3_ DE UART4_ RTS/ UART4_ DE SDMMC2_ D0 - - OTG_HS_ DM - - EVENTOUT PB15 RTC_ REFIN TIM1_CH3N TIM12_ CH2 TIM8_ CH3N USART1_RX SPI2_MOSI/ I2S2_SDO DFSDM1_ CKIN2 - UART4_ CTS SDMMC2_ D1 - - OTG_HS_ DP - - EVENTOUT DS12556 Rev 6 Port B Port AF1 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 9. Port B alternate functions (continued) AF0 Pin descriptions 81/336 AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PC0 - - - DFSDM1_ CKIN0 - - DFSDM1_ DATIN4 - SAI2_FS_B - OTG_HS_ ULPI_STP - FMC_ SDNWE - LCD_R5 EVENTOUT PC1 TRACED0 - SAI1_D1 DFSDM1_ DATIN0 DFSDM1_ CKIN4 SPI2_ MOSI/I2S2 _SDO SAI1_SD_A - SAI4_SD_ A SDMMC2_ CK SAI4_D1 ETH_MDC MDIOS_ MDC - - EVENTOUT PC2 CDSLEEP - - DFSDM1_ CKIN1 - SPI2_ MISO/I2S2 _SDI DFSDM1_ CKOUT - - - OTG_HS_ ULPI_DIR ETH_MII_ TXD2 FMC_SDNE 0 - - EVENTOUT PC3 CSLEEP - - DFSDM1_ DATIN1 - SPI2_ MOSI/I2S2 _SDO - - - - OTG_HS_ ULPI_NXT ETH_MII_ TX_CLK FMC_SDCK E0 - - EVENTOUT PC4 - - - DFSDM1_ CKIN2 - I2S1_ MCK - - - SPDIFRX1 _IN3 - ETH_MII_ RXD0/ETH_ RMII_RXD0 FMC_SDNE 0 - - EVENTOUT PC5 - - SAI1_D3 DFSDM1_ DATIN2 - - - - SPDIFRX1 _IN4 SAI4_D3 ETH_MII_ RXD1/ETH_ RMII_RXD1 FMC_SDCK E0 COMP1_ OUT - EVENTOUT PC6 - HRTIM_CH A1 TIM3_CH1 TIM8_CH1 DFSDM1_ CKIN3 I2S2_ MCK - USART6_ TX SDMMC1_ D0DIR FMC_ NWAIT SDMMC2_ D6 - SDMMC1_ D6 DCMI_D0 LCD_ HSYNC EVENTOUT PC7 TRGIO HRTIM_CH A2 TIM3_CH2 TIM8_CH2 DFSDM1_ DATIN3 - I2S3_MCK USART6_ RX SDMMC1_ D123DIR FMC_NE1 SDMMC2_ D7 SWPMI_TX SDMMC1_ D7 DCMI_D1 LCD_G6 EVENTOUT PC8 TRACED1 HRTIM_CH B1 TIM3_CH3 TIM8_CH3 - - - USART6_ CK UART5_ RTS/ UART5_ DE FMC_NE2/ FMC_NCE - SWPMI_RX SDMMC1_ D0 DCMI_D2 - EVENTOUT PC9 MCO2 - TIM3_CH4 TIM8_CH4 I2C3_SDA I2S_CKIN - - UART5_ CTS QUADSPI_ BK1_IO0 LCD_G3 SWPMI_ SUSPEND SDMMC1_ D1 DCMI_D3 LCD_B2 EVENTOUT PC10 - - HRTIM_ EEV1 DFSDM1_ CKIN5 - - SPI3_SCK/ I2S3_CK USART3_ TX UART4_TX QUADSPI_ BK1_IO1 - - SDMMC1_ D2 DCMI_D8 LCD_R2 EVENTOUT PC11 - - HRTIM_ FLT2 DFSDM1_ DATIN5 - - SPI3_MISO/ I2S3_SDI USART3_ RX UART4_RX QUADSPI_ BK2_NCS - - SDMMC1_ D3 DCMI_D4 - EVENTOUT PC12 TRACED3 - HRTIM_ EEV2 - - - SPI3_MOSI/ I2S3_SDO USART3_ CK UART5_TX - - - SDMMC1_ CK DCMI_D9 - EVENTOUT PC13 - - - - - - - - - - - - - - - EVENTOUT DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB SYS LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 Port Port C AF1 Pin descriptions 82/336 Table 10. Port C alternate functions AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS PC14 - - - - - - - - - - - - - - - EVENTOUT PC15 - - - - - - - - - - - - - - - EVENTOUT AF0 AF1 AF2 AF3 AF4 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 PD0 - - - PD1 - - PD2 TRACED2 PD3 Port C Port AF1 Table 11. Port D alternate functions AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS DFSDM1_ CKIN6 - - SAI3_SCK_ A - UART4_RX FDCAN1_ RX - - FMC_D2/ FMC_DA2 - - EVENTOUT - DFSDM1_ DATIN6 - - SAI3_SD_A - UART4_TX FDCAN1_ TX - - FMC_D3/ FMC_DA3 - - EVENTOUT - TIM3_ETR - - - - - UART5_RX - - - SDMMC1_ CMD DCMI_D11 - EVENTOUT - - - DFSDM1_ CKOUT - SPI2_SCK/ I2S2_CK - USART2_ CTS/ USART2_ NSS - - - - FMC_CLK DCMI_D5 LCD_G7 EVENTOUT PD4 - - HRTIM_ FLT3 - - - SAI3_FS_A USART2_ RTS/ USART2_ DE - FDCAN1_R XFD_MODE - - FMC_NOE - - EVENTOUT PD5 - - HRTIM_ EEV3 - - - - USART2_ TX - FDCAN1_T XFD_MODE - - FMC_NWE - - EVENTOUT PD6 - - SAI1_D1 DFSDM1_ CKIN4 DFSDM1_ DATIN1 SPI3_ MOSI/I2S3 _SDO SAI1_SD_A USART2_ RX SAI4_SD_ A FDCAN2_R XFD_MODE SAI4_D1 SDMMC2_ CK FMC_ NWAIT DCMI_D10 LCD_B2 EVENTOUT PD7 - - - DFSDM1_ DATIN4 - SPI1_ MOSI/I2S1 _SDO DFSDM1_ CKIN1 USART2_ CK - SPDIFRX1_ IN1 - SDMMC2_ CMD FMC_NE1 - - EVENTOUT Pin descriptions AF6 Port Port D DS12556 Rev 6 83/336 AF5 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 10. Port C alternate functions (continued) AF0 AF2 AF3 AF4 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS PD8 - - - DFSDM1_ CKIN3 - - SAI3_SCK_ B USART3_ TX - SPDIFRX1_ IN2 - - FMC_D13/ FMC_DA13 - - EVENTOUT PD9 - - - DFSDM1_ DATIN3 - - SAI3_SD_B USART3_ RX - FDCAN2_R XFD_MODE - - FMC_D14/ FMC_DA14 - - EVENTOUT PD10 - - - DFSDM1_ CKOUT - - SAI3_FS_B USART3_ CK - FDCAN2_T XFD_MODE - - FMC_D15/ FMC_DA15 - LCD_B3 EVENTOUT PD11 - - - LPTIM2_ IN2 I2C4_SMBA - - USART3_ CTS/ USART3_N SS - QUADSPI_ BK1_IO0 SAI2_SD_A - FMC_A16 - - EVENTOUT PD12 - LPTIM1_IN1 TIM4_CH1 LPTIM2_ IN1 I2C4_SCL - - USART3_ RTS/ USART3_ DE - QUADSPI_ BK1_IO1 SAI2_FS_A - FMC_A17 - - EVENTOUT PD13 - LPTIM1_ OUT TIM4_CH2 - I2C4_SDA - - - QUADSPI_ BK1_IO3 SAI2_SCK_ A - FMC_A18 - - EVENTOUT PD14 - - TIM4_CH3 - - - SAI3_MCLK _B - UART8_ CTS - - - FMC_D0/ FMC_DA0 - - EVENTOUT PD15 - - TIM4_CH4 - - - SAI3_MCLK _A - UART8_ RTS/ UART8_ DE - - - FMC_D1/ FMC_DA1 - - EVENTOUT Port D DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB AF5 Port AF1 Pin descriptions 84/336 Table 11. Port D alternate functions (continued) AF0 AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 TIM1/2/16/1 7/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PE0 - LPTIM1_ ETR TIM4_ETR HRTIM_ SCIN LPTIM2_ ETR - - - UART8_RX FDCAN1_ RXFD_ MODE SAI2_ MCLK_A - FMC_NBL0 DCMI_D2 - EVENTOUT PE1 - LPTIM1_IN2 - HRTIM_ SCOUT - - - - UART8_TX FDCAN1_ TXFD_ MODE - - FMC_NBL1 DCMI_D3 - EVENTOUT PE2 TRACE CLK - SAI1_CK1 - - SPI4_SCK SAI1_MCLK _A - SAI4_ MCLK_A QUADSPI_ BK1_IO2 SAI4_CK1 ETH_MII_ TXD3 FMC_A23 - - EVENTOUT PE3 TRACED0 - - - TIM15_BKIN - SAI1_SD_B - SAI4_SD_ B - - - FMC_A19 - - EVENTOUT PE4 TRACED1 - SAI1_D2 DFSDM1_ DATIN3 TIM15_CH1 N SPI4_NSS SAI1_FS_A - SAI4_FS_A - SAI4_D2 - FMC_A20 DCMI_D4 LCD_B0 EVENTOUT PE5 TRACED2 - SAI1_CK2 DFSDM1_ CKIN3 TIM15_CH1 SPI4_ MISO SAI1_SCK_ A - SAI4_SCK _A - SAI4_CK2 - FMC_A21 DCMI_D6 LCD_G0 EVENTOUT PE6 TRACED3 TIM1_ BKIN2 SAI1_D1 - TIM15_CH2 SPI4_ MOSI SAI1_SD_A - SAI4_SD_ A SAI4_D1 SAI2_ MCLK_B TIM1_BKIN 2_COMP12 FMC_A22 DCMI_D7 LCD_G1 EVENTOUT PE7 - TIM1_ETR - DFSDM1_ DATIN2 - - - UART7_RX - - QUADSPI_ BK2_IO0 - FMC_D4/ FMC_DA4 - - EVENTOUT PE8 - TIM1_CH1N - DFSDM1_ CKIN2 - - - UART7_TX - - QUADSPI_ BK2_IO1 - FMC_D5/ FMC_DA5 COMP2_ OUT - EVENTOUT PE9 - TIM1_CH1 - DFSDM1_ CKOUT - - - UART7_ RTS/ UART7_ DE - - QUADSPI_ BK2_IO2 - FMC_D6/ FMC_DA6 - - EVENTOUT PE10 - TIM1_CH2N - DFSDM1_ DATIN4 - - - UART7_ CTS - - QUADSPI_ BK2_IO3 - FMC_D7/ FMC_DA7 - - EVENTOUT PE11 - TIM1_CH2 - DFSDM1_ CKIN4 - SPI4_NSS - - - - SAI2_SD_B - FMC_D8/ FMC_DA8 - LCD_G3 EVENTOUT PE12 - TIM1_CH3N - DFSDM1_ DATIN5 - SPI4_SCK - - - - SAI2_SCK_ B - FMC_D9/ FMC_DA9 COMP1_ OUT LCD_B4 EVENTOUT PE13 - TIM1_CH3 - DFSDM1_ CKIN5 - SPI4_ MISO - - - - SAI2_FS_B - FMC_D10/ FMC_DA10 COMP2_ OUT LCD_DE EVENTOUT DS12556 Rev 6 85/336 Pin descriptions SYS LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 Port Port E AF1 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 12. Port E alternate functions AF2 AF3 AF4 SYS TIM1/2/16/1 7/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 PE14 - TIM1_CH4 - PE15 - TIM1_BKIN - Port E Port AF1 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS - - SPI4_ MOSI - - - - SAI2_ MCLK_B - FMC_D11/ FMC_DA11 - LCD_CLK EVENTOUT - - - - - - - - FMC_D12/ FMC_DA12 TIM1_BKIN _COMP12/ COMP_ TIM1_BKIN LCD_R7 EVENTOUT Pin descriptions 86/336 Table 12. Port E alternate functions (continued) AF0 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB DS12556 Rev 6 AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PF0 - - - - I2C2_SDA - - - - - - - FMC_A0 - - EVENTOUT PF1 - - - - I2C2_SCL - - - - - - - FMC_A1 - - EVENTOUT PF2 - - - - I2C2_SMBA - - - - - - - FMC_A2 - - EVENTOUT PF3 - - - - - - - - - - - - FMC_A3 - - EVENTOUT PF4 - - - - - - - - - - - - FMC_A4 - - EVENTOUT PF5 - - - - - - - - - - - - FMC_A5 - - EVENTOUT PF6 - TIM16_CH1 - - - SPI5_NSS SAI1_SD_B UART7_RX SAI4_SD_ B QUADSPI_ BK1_IO3 - - - - - EVENTOUT PF7 - TIM17_CH1 - - - SPI5_SCK SAI1_MCLK _B UART7_TX SAI4_ MCLK_B QUADSPI_ BK1_IO2 - - - - - EVENTOUT PF8 - TIM16_ CH1N - - - SPI5_ MISO SAI1_SCK_ B UART7_ RTS/ UART7_ DE SAI4_SCK _B TIM13_ CH1 QUADSPI_ BK1_IO0 - - - - EVENTOUT PF9 - TIM17_ CH1N - - - SPI5_ MOSI SAI1_FS_B UART7_ CTS SAI4_FS_B TIM14_CH 1 QUADSPI_ BK1_IO1 - - - - EVENTOUT PF10 - TIM16_ BKIN SAI1_D3 - - - - - - QUADSPI_ CLK SAI4_D3 - - DCMI_D11 LCD_DE EVENTOUT PF11 - - - - - SPI5_ MOSI - - - - SAI2_SD_B - FMC_ SDNRAS DCMI_D12 - EVENTOUT PF12 - - - - - - - - - - - - FMC_A6 - - EVENTOUT PF13 - - - DFSDM1_ DATIN6 I2C4_SMBA - - - - - - - FMC_A7 - - EVENTOUT PF14 - - - DFSDM1_ CKIN6 I2C4_SCL - - - - - - - FMC_A8 - - EVENTOUT PF15 - - - - I2C4_SDA - - - - - - - FMC_A9 - - EVENTOUT DS12556 Rev 6 87/336 Pin descriptions SYS LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 Port Port F AF1 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 13. Port F alternate functions AF0 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SAI2/4/TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/UART7 /SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/ DCMI/LCD /COMP UART5/ LCD SYS SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 - - - - - - - - FMC_A10 - - EVENT -OUT - - - - - - - - - FMC_A11 - - EVENT -OUT - TIM8_BKIN - - - - - - - TIM8_BKIN_ COMP12 FMC_A12 - - EVENT -OUT - - TIM8_ BKIN2 - - - - - - - TIM8_BKIN2 _COMP12 FMC_A13 - - EVENT -OUT - TIM1_ BKIN2 - - - - - - - - - TIM1_BKIN2 _COMP12 FMC_A14/ FMC_BA0 - - EVENT -OUT PG5 - TIM1_ETR - - - - - - - - - - FMC_A15/ FMC_BA1 - - EVENT -OUT PG6 - TIM17_ BKIN HRTIM_ CHE1 - - - - - - - QUADSPI_ BK1_NCS - FMC_NE3 DCMI_ D12 LCD_ R7 EVENT -OUT PG7 - - HRTIM_ CHE2 - - - SAI1_ MCLK_A USART6_ CK - - - - FMC_INT DCMI_ D13 LCD_ CLK EVENT -OUT PG8 - - - TIM8_ETR - SPI6_NSS - USART6_ RTS/ USART6_ DE SPDIFRX1 _IN3 - - ETH_PPS_ OUT FMC_ SDCLK - LCD_ G7 EVENT -OUT PG9 - - - - - SPI1_ MISO/I2S1 _SDI - USART6_ RX SPDIFRX1 _IN4 QUADSPI_ BK2_IO2 SAI2_FS_B - FMC_NE2/ FMC_NCE DCMI_ VSYNC - EVENT -OUT PG10 - - HRTIM_ FLT5 - - SPI1_NSS/ I2S1_WS - - - LCD_G3 SAI2_SD_B - FMC_NE3 DCMI_D2 LCD_ B2 EVENT -OUT PG11 - LPTIM1_IN2 HRTIM_ EEV4 - - SPI1_SCK/ I2S1_CK - - SPDIFRX1 _IN1 - SDMMC2_D2 ETH_MII_ TX_EN/ ETH_RMII_ TX_EN - DCMI_D3 LCD_ B3 EVENT -OUT PG12 - LPTIM1_IN1 HRTIM_ EEV5 - - SPI6_ MISO USART6_ RTS/ USART6_ DE SPDIFRX1 _IN2 LCD_B4 - ETH_MII_ TXD1/ETH_ RMII_TXD1 FMC_NE4 - LCD_ B1 EVENT -OUT PG13 TRACED0 LPTIM1_ OUT HRTIM_ EEV10 - - SPI6_SCK USART6_ CTS/ USART6_ NSS - - - ETH_MII_ TXD0/ETH_ RMII_TXD0 FMC_A24 - LCD_ R0 EVENT -OUT SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC PG0 - - - - PG1 - - - PG2 - - PG3 - PG4 DS12556 Rev 6 - STM32H750VB STM32H750ZB STM32H750IB STM32H750XB SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 Port Port G AF1 Pin descriptions 88/336 Table 14. Port G alternate functions AF2 AF3 AF4 SYS TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 PG14 TRACED1 LPTIM1_ ETR - PG15 - - - AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SAI2/4/TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/UART7 /SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/ DCMI/LCD /COMP UART5/ LCD SYS - - SPI6_ MOSI - USART6_ TX QUADSPI_ BK2_IO3 - ETH_MII_ TXD1/ETH_ RMII_TXD1 FMC_A25 - LCD_ B0 EVENT -OUT - - - - USART6_ CTS/ USART6_ NSS - - - FMC_ SDNCAS DCMI_ D13 - EVENT -OUT Port G Port AF1 - DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 14. Port G alternate functions (continued) AF0 Pin descriptions 89/336 AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PH0 - - - - - - - - - - - - - - - EVENTOUT PH1 - - - - - - - - - - - - - - - EVENTOUT PH2 - LPTIM1_IN2 - - - - - - - QUADSPI_ BK2_IO0 SAI2_SCK_ B ETH_MII_ CRS FMC_ SDCKE0 - LCD_R0 EVENTOUT PH3 - - - - - - - - - QUADSPI_ BK2_IO1 SAI2_ MCLK_B ETH_MII_ COL FMC_ SDNE0 - LCD_R1 EVENTOUT PH4 - - - - I2C2_SCL - - - - LCD_G5 OTG_HS_ ULPI_NXT - - - LCD_G4 EVENTOUT PH5 - - - - I2C2_SDA SPI5_NSS - - - - - - FMC_ SDNWE - - EVENTOUT PH6 - - TIM12_ CH1 - I2C2_SMBA SPI5_SCK - - - - - ETH_MII_ RXD2 FMC_ SDNE1 DCMI_D8 - EVENTOUT PH7 - - - - I2C3_SCL SPI5_ MISO - - - - - ETH_MII_ RXD3 FMC_ SDCKE1 DCMI_D9 - EVENTOUT PH8 - - TIM5_ETR - I2C3_SDA - - - - - - - FMC_D16 DCMI_ HSYNC LCD_R2 EVENTOUT PH9 - - TIM12_ CH2 - I2C3_SMBA - - - - - - - FMC_D17 DCMI_D0 LCD_R3 EVENTOUT PH10 - - TIM5_CH1 - I2C4_SMBA - - - - - - - FMC_D18 DCMI_D1 LCD_R4 EVENTOUT PH11 - - TIM5_CH2 - I2C4_SCL - - - - - - - FMC_D19 DCMI_D2 LCD_R5 EVENTOUT PH12 - - TIM5_CH3 - I2C4_SDA - - - - - - - FMC_D20 DCMI_D3 LCD_R6 EVENTOUT PH13 - - - TIM8_ CH1N - - - - UART4_TX FDCAN1_ TX - - FMC_D21 - LCD_G2 EVENTOUT PH14 - - - TIM8_ CH2N - - - - UART4_RX FDCAN1_ RX - - FMC_D22 DCMI_D4 LCD_G3 EVENTOUT PH15 - - - TIM8_ CH3N - - - - - FDCAN1_ TXFD_ MODE - - FMC_D23 DCMI_D11 LCD_G4 EVENTOUT DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB SYS LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 Port Port H AF1 Pin descriptions 90/336 Table 15. Port H alternate functions AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PI0 - - TIM5_CH4 - - SPI2_NSS/ I2S2_WS - - - FDCAN1_ RXFD_ MODE - - FMC_D24 DCMI_D13 LCD_G5 EVENTOUT PI1 - - - TIM8_ BKIN2 - SPI2_SCK/ I2S2_CK - - - - - TIM8_BKIN 2_COMP12 FMC_D25 DCMI_D8 LCD_G6 EVENTOUT PI2 - - - TIM8_CH4 - SPI2_ MISO/I2S2 _SDI - - - - - - FMC_D26 DCMI_D9 LCD_G7 EVENTOUT PI3 - - - TIM8_ETR - SPI2_ MOSI/I2S2 _SDO - - - - - - FMC_D27 DCMI_D10 - EVENTOUT PI4 - - - TIM8_BKIN - - - - - - SAI2_ MCLK_A TIM8_BKIN _COMP12 FMC_NBL2 DCMI_D5 LCD_B4 EVENTOUT PI5 - - - TIM8_CH1 - - - - - - SAI2_SCK_ A - FMC_NBL3 DCMI_ VSYNC LCD_B5 EVENTOUT PI6 - - - TIM8_CH2 - - - - - - SAI2_SD_A - FMC_D28 DCMI_D6 LCD_B6 EVENTOUT PI7 - - - TIM8_CH3 - - - - - - SAI2_FS_A - FMC_D29 DCMI_D7 LCD_B7 EVENTOUT PI8 - - - - - - - - - - - - - - - EVENTOUT PI9 - - - - - - - - UART4_RX FDCAN1_ RX - - FMC_D30 - LCD_ VSYNC EVENTOUT PI10 - - - - - - - - - FDCAN1_ RXFD_ MODE - ETH_MII_ RX_ER FMC_D31 - LCD_ HSYNC EVENTOUT PI11 - - - - - - - - - LCD_G6 OTG_HS_ ULPI_DIR - - - - EVENTOUT PI12 - - - - - - - - - - - - - - LCD_ HSYNC EVENTOUT PI13 - - - - - - - - - - - - - - LCD_ VSYNC EVENTOUT PI14 - - - - - - - - - - - - - - LCD_CLK EVENTOUT PI15 - - - - - - - - - LCD_G2 - - - - LCD_R0 EVENTOUT DS12556 Rev 6 91/336 Pin descriptions SYS LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 Port Port I AF1 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 16. Port I alternate functions AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 TIM1/2/16/ 17/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 PJ0 - - - - - - - - - LCD_R7 - - - - LCD_R1 EVENTOUT PJ1 - - - - - - - - - - - - - - LCD_R2 EVENTOUT PJ2 - - - - - - - - - - - - - - LCD_R3 EVENTOUT PJ3 - - - - - - - - - - - - - - LCD_R4 EVENTOUT PJ4 - - - - - - - - - - - - - - LCD_R5 EVENTOUT PJ5 - - - - - - - - - - - - - - LCD_R6 EVENTOUT PJ6 - - - TIM8_CH2 - - - - - - - - - - LCD_R7 EVENTOUT PJ7 TRGIN - - TIM8_ CH2N - - - - - - - - - - LCD_G0 EVENTOUT PJ8 - TIM1_CH3N - TIM8_CH1 - - - - UART8_TX - - - - - LCD_G1 EVENTOUT PJ9 - TIM1_CH3 - TIM8_ CH1N - - - - UART8_RX - - - - - LCD_G2 EVENTOUT PJ10 - TIM1_CH2N - TIM8_CH2 - SPI5_ MOSI - - - - - - - - LCD_G3 EVENTOUT PJ11 - TIM1_CH2 - TIM8_ CH2N - SPI5_ MISO - - - - - - - - LCD_G4 EVENTOUT PJ12 TRGOUT - - - - - - - - LCD_G3 - - - - LCD_B0 EVENTOUT PJ13 - - - - - - - - - LCD_B4 - - - - LCD_B1 EVENTOUT PJ14 - - - - - - - - - - - - - - LCD_B2 EVENTOUT PJ15 - - - - - - - - - - - - - - LCD_B3 EVENTOUT DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB SYS LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 Port Port J AF1 Pin descriptions 92/336 Table 17. Port J alternate functions AF0 AF2 AF3 AF4 I2C1/2/3/4/ USART1/ TIM15/ LPTIM2/ DFSDM1/ CEC AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 SAI2/4/ TIM8/ QUADSPI/ SDMMC2/ OTG1_HS/ OTG2_FS/ LCD I2C4/ UART7/ SWPMI1/ TIM1/8/ DFSDM1/ SDMMC2/ MDIOS/ ETH TIM1/8/FMC /SDMMC1/ MDIOS/ OTG1_FS/ LCD TIM1/DCMI /LCD/ COMP UART5/ LCD SYS SPI1/2/3/4/ 5/6/CEC SPI2/3/SAI1 /3/I2C4/ UART4/ DFSDM1 SPI2/3/6/ USART1/2/ 3/6/UART7/ SDMMC1 SPI6/SAI2/ 4/UART4/5/ 8/LPUART/ SDMMC1/ SPDIFRX1 SAI4/ FDCAN1/2/ TIM13/14/ QUADSPI/ FMC/ SDMMC2/ LCD/ SPDIFRX1 SYS TIM1/2/16/1 7/LPTIM1/ HRTIM1 SAI1/TIM3/ 4/5/12/ HRTIM1 LPUART/ TIM8/ LPTIM2/3/4 /5/HRTIM1/ DFSDM1 PK0 - TIM1_CH1N - TIM8_CH3 - SPI5_SCK - - - - - - - - LCD_G5 EVENTOUT PK1 - TIM1_CH1 - TIM8_ CH3N - SPI5_NSS - - - - - - - - LCD_G6 EVENTOUT PK2 - TIM1_BKIN - TIM8_BKIN - - - - - - TIM8_BKIN _COMP12 TIM1_BKIN _COMP12 - - LCD_G7 EVENTOUT PK3 - - - - - - - - - - - - - - LCD_B4 EVENTOUT PK4 - - - - - - - - - - - - - - LCD_B5 EVENTOUT PK5 - - - - - - - - - - - - - - LCD_B6 EVENTOUT PK6 - - - - - - - - - - - - - - LCD_B7 EVENTOUT PK7 - - - - - - - - - - - - - - LCD_DE EVENTOUT Port Port K AF1 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Table 18. Port K alternate functions Pin descriptions 93/336 Electrical characteristics (rev Y) 6 6.1 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Electrical characteristics (rev Y) Parameter conditions Unless otherwise specified, all voltages are referenced to VSS. 6.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of junction temperature, supply voltage and frequencies by tests in production on 100% of the devices with an junction temperature at TJ = 25 °C and TJ = TJmax (given by the selected temperature range). Data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes. Based on characterization, the minimum and maximum values refer to sample tests and represent the mean value plus or minus three times the standard deviation (mean±3σ). 6.1.2 Typical values Unless otherwise specified, typical data are based on TJ = 25 °C, VDD = 3.3 V (for the 1.7 V ≤ VDD ≤ 3.6 V voltage range). They are given only as design guidelines and are not tested. Typical ADC accuracy values are determined by characterization of a batch of samples from a standard diffusion lot over the full temperature range, where 95% of the devices have an error less than or equal to the value indicated (mean±2σ). 6.1.3 Typical curves Unless otherwise specified, all typical curves are given only as design guidelines and are not tested. 6.1.4 Loading capacitor The loading conditions used for pin parameter measurement are shown in Figure 9. 6.1.5 Pin input voltage The input voltage measurement on a pin of the device is described in Figure 10. Figure 9. Pin loading conditions Figure 10. Pin input voltage MCU pin MCU pin C = 50 pF VIN MS19011V2 94/336 DS12556 Rev 6 MS19010V2 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 6.1.6 Electrical characteristics (rev Y) Power supply scheme Figure 11. Power supply scheme VDD50USB 100 nF 100 nF VDD33USB 1μF VDD33USB USB IOs USB regulator Level shifter Power switch VSS IOs N(1) x 100 nF + 1 x 4.7 μF VDD D3 domain (System logic, EXTI, IO logic Peripherals, RAM) D2 domain (peripherals, RAM) D1 domain (CPU, peripherals, RAM) VDD domain VBAT charging HSI, LSI, CSI, HSI48, HSE, PLLs Backup domain Backup VBKP regulator VSW VBAT Power switch Power switch LSE, RTC, Wakeup logic, backup IO registers, logic Reset BKUP IOs VREF 100 nF + 1 x 1 μF 100 nF + 1 x 1 μF VDDA VDDA Flash VSS VDD VBAT 1.2 to 3.6V VSS Core domain (VCORE) Voltage regulator VDDLDO 4.7μF 2 x 2.2μF VDDLDO VCAP Power switch VSS VDD50USB VSS Analog domain REF_BUF VREF+ ADC, DAC VREF+ VREF- VREF- Backup RAM VSS OPAMP, Comparator VSSA MSv46116V5 1. N corresponds to the number of VDD pins available on the package. 2. A tolerance of +/- 20% is acceptable on decoupling capacitors. Caution: Each power supply pair (VDD/VSS, VDDA/VSSA ...) must be decoupled with filtering ceramic capacitors as shown above. These capacitors must be placed as close as possible to, or below, the appropriate pins on the underside of the PCB to ensure good operation of the DS12556 Rev 6 95/336 311 Electrical characteristics (rev Y) STM32H750VB STM32H750ZB STM32H750IB STM32H750XB device. It is not recommended to remove filtering capacitors to reduce PCB size or cost. This might cause incorrect operation of the device. 6.1.7 Current consumption measurement Figure 12. Current consumption measurement scheme IDD_VBAT VBAT IDD VDD VDDA ai14126 6.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 19: Voltage characteristics, Table 20: Current characteristics, and Table 21: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and the functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 Qualification Standard, extended mission profiles are available on demand. Table 19. Voltage characteristics (1) Symbols VDDX - VSS VIN(2) Ratings Min Max Unit −0.3 4.0 V Input voltage on FT_xxx pins VSS−0.3 Min(VDD, VDDA, VDD33USB, VBAT) +4.0(3)(4) V Input voltage on TT_xx pins VSS-0.3 4.0 V Input voltage on BOOT0 pin VSS 9.0 V VSS-0.3 4.0 V - 50 mV - 50 mV External main supply voltage (including VDD, VDDLDO, VDDA, VDD33USB, VBAT) Input voltage on any other pins |∆VDDX| Variations between different VDDX power pins of the same domain |VSSx-VSS| Variations between all the different ground pins 1. All main power (VDD, VDDA, VDD33USB, VBAT) and ground (VSS, VSSA) pins must always be connected to the external power supply, in the permitted range. 2. VIN maximum must always be respected. Refer to Table 57 for the maximum allowed injected current values. 96/336 DS12556 Rev 6 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Electrical characteristics (rev Y) 3. This formula has to be applied on power supplies related to the IO structure described by the pin definition table. 4. To sustain a voltage higher than 4V the internal pull-up/pull-down resistors must be disabled. Table 20. Current characteristics Symbols Ratings Max ΣIVDD Total current into sum of all VDD power lines (source)(1) 620 ΣIVSS (sink)(1) 620 Total current out of sum of all VSS ground lines IVDD Maximum current into each VDD power pin (source)(1) 100 IVSS Maximum current out of each VSS ground pin (sink)(1) 100 Output current sunk by any I/O and control pin IIO ΣI(PIN) IINJ(PIN) (3)(4) ΣIINJ(PIN) Total output current sunk by sum of all I/Os and control Unit 20 pins(2) 140 Total output current sourced by sum of all I/Os and control pins(2) 140 Injected current on FT_xxx, TT_xx, RST and B pins except PA4, PA5 −5/+0 Injected current on PA4, PA5 −0/0 Total injected current (sum of all I/Os and control pins)(5) ±25 mA 1. All main power (VDD, VDDA, VDD33USB) and ground (VSS, VSSA) pins must always be connected to the external power supplies, in the permitted range. 2. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be sunk/sourced between two consecutive power supply pins referring to high pin count QFP packages. 3. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value. 4. A positive injection is induced by VIN>VDD while a negative injection is induced by VIN