STM32H7B3VIT6Q

STM32H7B3xI Datasheet 32-bit Arm® Cortex®-M7 280 MHz MCUs, 2-Mbyte Flash memory, 1.4 Mbyte RAM, 46 com. and analog interfaces, SMPS, crypto FBGA Features Includes ST state-of-the-art patented technology LQFP64 (10 x 10 mm) LQFP100 (14 x 14 mm) LQFP144 (20x20 mm) LQFP176 (24 x 24 mm) TFBGA100 (8 x 8 mm) TFBGA216 (13x13 mm) TFBGA225 (13x13 mm) FBGA UFBGA169 (7 x 7 mm) UFBGA176+25 (10x10 mm) WLCSP132 (4.57 X 4.37 mm) Product summary STM32H7B3xI STM32H7B3RI, STM32H7B3VI, STM32H7B3QI, STM32H7B3ZI, STM32H7B3AI, STM32H7B3II, STM32H7B3NI, STM32H7B3LI Core • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache allowing to fill one cache line in a single access from the 128-bit embedded Flash memory; frequency up to 280 MHz, MPU, 599 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions Memories • 2 Mbytes of Flash memory with read while write support, plus 1 Kbyte of OTP memory • ~1.4 Mbytes of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 1.18 Mbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain • 2x Octo-SPI memory interfaces with on-the-fly decryption, I/O multiplexing and support for serial PSRAM/NOR, Hyper RAM/Flash frame formats, running up to 140 MHz in SRD mode and up to 110 MHz in DTR mode • Flexible external memory controller with up to 32-bit data bus: – SRAM, PSRAM, NOR Flash memory clocked up to 125 MHz in Synchronous mode – SDRAM/LPSDR SDRAM – 8/16-bit NAND Flash memories • CRC calculation unit Security • ROP, PC-ROP, active tamper, secure firmware upgrade support, Secure access mode General-purpose input/outputs • Up to 168 I/O ports with interrupt capability – Fast I/Os capable of up to 133 MHz – Up to 164 5-V-tolerant I/Os Low-power consumption • Stop: down to 32 µA with full RAM retention • Standby: 2.8 µA (Backup SRAM OFF, RTC/LSE ON, PDR OFF) • VBAT: 0.8 µA (RTC and LSE ON) Clock management • Internal oscillators: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI • External oscillators: 4-50 MHz HSE, 32.768 kHz LSE • 3× PLLs (1 for the system clock, 2 for kernel clocks) with fractional mode DS13139 - Rev 7 - May 2021 For further information contact your local STMicroelectronics sales office. www.st.com STM32H7B3xI Reset and power management • 2 separate power domains, which can be independently clock gated to maximize power efficiency: CPU domain (CD) for Arm® Cortex® core and its peripherals, which can be independently switched in Retention mode – Smart run domain (SRD) for reset and clock control, power management and some peripherals 1.62 to 3.6 V application supply and I/Os POR, PDR, PVD and BOR Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs Dedicated SDMMC power supply High power efficiency SMPS step-down converter regulator to directly supply VCORE or an external circuitry – • • • • • • • • • • Embedded regulator (LDO) with configurable scalable output to supply the digital circuitry Voltage scaling in Run and Stop mode Backup regulator (~0.9 V) Low-power modes: Sleep, Stop and Standby VBAT battery operating mode with charging capability • CPU and domain power state monitoring pins Interconnect matrix • 3 bus matrices (1 AXI and 2 AHB) • Bridges (5× AHB2APB, 3× AXI2AHB) 5 DMA controllers to unload the CPU • 1× high-speed general-purpose master direct memory access controller (MDMA) • 2× dual-port DMAs with FIFO and request router capabilities • 1× basic DMA with request router capabilities • 1x basic DMA dedicated to DFSDM Up to 35 communication peripherals • 4× I2C FM+ interfaces (SMBus/PMBus) • 5× USART/5x UARTs (ISO7816 interface, LIN, IrDA, modem control) and 1x LPUART • 6× SPIs, including 4 with muxed full-duplex I2S audio class accuracy via internal audio PLL or external clock and 1 x SPI/I2S in LP domain (up to 125 MHz) • 2x SAIs (serial audio interface) • SPDIFRX interface • SWPMI single-wire protocol master interface • MDIO Slave interface • 2× SD/SDIO/MMC interfaces (up to 133 MHz) • 2× CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN) • 1× USB OTG interfaces (1HS/FS) • HDMI-CEC • 8- to 14-bit camera interface up to 80 MHz • 8-/16-bit parallel synchronous data input/output slave interface (PSSI) DS13139 - Rev 7 page 2/231 STM32H7B3xI 11 analog peripherals • 2× ADCs with 16-bit max. resolution (up to 24 channels, up to 3.6 MSPS) • 1× analog and 1x digital temperature sensors • 1× 12-bit single-channel DAC (in SRD domain) + 1× 12-bit dual-channel DAC • 2× ultra-low-power comparators • 2× operational amplifiers (8 MHz bandwidth) • 2× digital filters for sigma delta modulator (DFSDM), 1x with 8 channels/8 filters and 1x in SRD domain with 2 channels/1 filter Graphics • LCD-TFT controller up to XGA resolution • Chrom-ART graphical hardware Accelerator (DMA2D) to reduce CPU load • Hardware JPEG Codec • Chrom-GRC™ (GFXMMU) Up to 19 timers and 2 watchdogs • 2× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to 280 MHz) • 2× 16-bit advanced motor control timers (up to 280 MHz) • 10× 16-bit general-purpose timers (up to 280 MHz) • 3× 16-bit low-power timers (up to 280 MHz) • 2× watchdogs (independent and window) • 1× SysTick timer • RTC with sub-second accuracy and hardware calendar Cryptographic acceleration • AES chaining modes: ECB,CBC,CTR,GCM,CCM for 128, 192 or 256 • HASH (MD5, SHA-1, SHA-2), HMAC • 2x OTFDEC AES-128 in CTR mode for Octo-SPI memory encryption/decryption • 1x 32-bit, NIST SP 800-90B compliant, true random generator Debug mode • SWD and JTAG interfaces • 4 KB Embedded Trace Buffer 96-bit unique ID All packages are ECOPACK2 compliant DS13139 - Rev 7 page 3/231 STM32H7B3xI Introduction 1 Introduction This datasheet provides the ordering information and mechanical device characteristics of the STM32H7B3xI microcontrollers. This document should be read in conjunction with the STM32H7B3xI reference manual (RM0455). The reference manual is available from the STMicroelectronics website . For information on the device errata with respect to the datasheet and reference manual, refer to the STM32H7B3xI errata sheet (ES0478), available on the STMicroelectronics website . For information on the Arm® Cortex®-M7 core, refer to the Cortex®-M7 Technical Reference Manual, available from the www.arm.com website Note: DS13139 - Rev 7 Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere. page 4/231 STM32H7B3xI Description 2 Description STM32H7B3xI devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 280 MHz. The Cortex® -M7 core features a floating point unit (FPU) which supports Arm® double-precision (IEEE 754 compliant) and single-precision data-processing instructions and data types. STM32H7B3xI devices support a full set of DSP instructions and a memory protection unit (MPU) to enhance application security. STM32H7B3xI devices incorporate high-speed embedded memories with a dual-bank Flash memory of 2 Mbytes, around 1.4 Mbyte of RAM (including 192 Kbytes of TCM RAM, 1.18 Mbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to four APB buses, three AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access. All the devices offer two ADCs, two DACs (one dual and one single DAC), two ultra-low power comparators, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, three low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell and a HASH processor. The devices support nine digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces. • Standard peripherals – – Four I2Cs Five USARTs, five UARTs and one LPUART Six SPIs, four I2Ss in full-duplex mode. To achieve audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL or via an external clock to allow synchronization. – Two SAI serial audio interfaces, out of which one with PDM – One SPDIFRX interface – One single wire protocol master interface (SWPMI) – One 16-bit parallel synchronous slave interface (PSSI) sharing the same interface as the digital camera) – Management Data Input/Output (MDIO) slaves – Two SDMMC interfaces (one can be supplied from a supply voltage separate from that of all other I/Os) – A USB OTG high-speed with full-speed capability (with the ULPI) – One FDCAN plus one TT-CAN interface – Chrom-ART Accelerator – HDMI-CEC Advanced peripherals including – • – – – – – – A flexible memory control (FMC) interface Two octo-SPI memory interface with on-the-fly decryption (OTFDEC) A digital camera interface for CMOS sensors (DCMI) A graphic memory management unit (GFXMMU) An LCD-TFT display controller (LTDC) A JPEG hardware compressor/decompressor Refer to Table 1. STM32H7B3xI features and peripheral counts for the list of peripherals available on each part number. STM32H7B3xI devices operate in the –40 to +85 °C ambient temperature range from a 1.62 to 3.6 V power supply. The supply voltage can drop down to 1.62 V by using an external power supervisor (see Section 3.5.2 Power supply supervisor) and connecting the PDR_ON pin to VSS. Otherwise the supply voltage must stay above 1.71 V with the embedded power voltage detector enabled. The USB OTG_HS/FS interfaces can be supplied either by the integrated USB regulator or through a separate supply input. A dedicated supply input is available for one of the SDMMC interface for package with more than 100 pins. It allows running from a different voltage level than all other I/Os. A comprehensive set of power-saving mode allows the design of low-power applications. The CPU and domain states can be directly monitored on some GPIOs configured as alternate functions. STM32H7B3xI devices are offers in several packages ranging from 64 pins to 225 pins/balls. The set of included peripherals changes with the device chosen. DS13139 - Rev 7 page 5/231 STM32H7B3xI Description These features make the STM32H7B3xI microcontrollers suitable for a wide range of applications: • • • • • • • • Motor drive and application control Medical equipment Industrial applications: PLC, inverters, circuit breakers Printers, and scanners Alarm systems, video intercom, and HVAC Home audio appliances Mobile applications, Internet of Things Wearable devices: smart watches. Figure 1. STM32H7B3xI block diagram shows the general block diagram of the device family. DS13139 - Rev 7 page 6/231 DS13139 - Rev 7 Table 1. STM32H7B3xI features and peripheral counts Flash memory (Kbytes) SRAM in Kbytes TCM RAM in Kbytes 1024 SRAM on AHB (CD domain) 128 SRAM on AHB (SRD domain) 32 ITCM RAM (instruction) 64 DTCM RAM (data) 128 Backup SRAM (Kbytes) 4 Interface 1 FMC x (2) x 16-bit NAND Flash memory x Octo-SPI interfaces(3) x x(2) 2 2 (4) x(2) - - x(2) x(2) - 2 (5) 1 1 QuadSPI page 7/231 Generalpurpose 10 Advancedcontrol (PWM) 2 Basic 2 Low-power 3 Window watchdog / independent watchdog STM32H7B3RIT STM32H7B3VIT STM32H7B3VIH STM32H7B3ZIT STM32H7B3IIT x(2) x 1/1 - x x(2) - x x(2) - x x(2) 2 2(4) 1 1 QuadSPI STM32H7B3xI Timers x Multiplexed I/O NOR Flash memory SDRAM controller STM32H7B3IIK 2048 SRAM on AXI NOR Flash memory/RAM controller STM32H7B3NIH STM32H7B3VIT STM32H7B3VIH STM32H7B3QIY no-SMPS STM32H7B3ZIT STM32H7B3AII STM32H7B3IIT STM32H7B3IIK Peripherals STM32H7B3LIH SMPS (1) Real-time Clock (RTC) Tamper pins (6) Passive 3 2 Active 2 1 1 Cryptographic accelerator 1 Hash processor (HASH) 1 for external Octo-SPI memory 2 SPI/I2S (7) 6/4 5(2)/5 /1 /1 /1 2/1 2(2)/1(2) /LPUART SAI/PDM SPDIFRX STM32H7B3RIT STM32H7B3VIT STM32H7B3VIH STM32H7B3IIT 2 2(2) 5(2)/4 6/4 5/4 4/4 4(2)/5(2) 5/5 5(2)/5 4(2)/3(2) /1 /1 /1 /1 2/1 2(2)/1 1(2)/- 2(2)/1 4 inputs - 4 inputs 1 MDIOS 1 SDMMC 2 2 FDCAN/TTCAN (11) 1 3 SWPMI Digital camera interface/PSSI 2 4 5(2)/5(2) 5/5 USB OTG_HS ULPI, OTG_FS PHY 2 2 5/4 I2C 3 2(2) 2 USART/UART Communication interfaces STM32H7B3IIK 1 Random number generator On-the-fly decryption STM32H7B3NIH STM32H7B3VIT STM32H7B3VIH STM32H7B3QIY STM32H7B3ZIT STM32H7B3AII STM32H7B3IIT STM32H7B3IIK STM32H7B3LIH Peripherals no-SMPS STM32H7B3ZIT DS13139 - Rev 7 SMPS (1) (8) 2(8) 2 1/1(2) 1/1 1 1(9) 1 1(9) 1 1(9) 1 1 (9) 1 (10) 1/1(2) 1/1 1 JPEG Codec 1 Chrom-ART Accelerator (DMA2D) 1 Graphic memory management unit (GFXMMU) 1 STM32H7B3xI page 8/231 LCD-TFT display controller HDMI CEC 1 DFSDM 2 Number of filters for DFSDM1/ DFSDM2 8/1 DACs Number of channels STM32H7B3RIT STM32H7B3VIT STM32H7B3VIH STM32H7B3ZIT STM32H7B3IIT STM32H7B3IIK 7/1 8 to 16 bits ADCs STM32H7B3NIH STM32H7B3VIT STM32H7B3VIH STM32H7B3QIY no-SMPS STM32H7B3ZIT STM32H7B3AII STM32H7B3IIT STM32H7B3IIK Peripherals STM32H7B3LIH DS13139 - Rev 7 SMPS (1) 8/1 7/1 2 24 24 20 (12) 18(12) 24 17(12) 16(12) 20(12) 12 bits 2 Number of channels 3 (1 single channel + 1 dual-channel interfaces) 16(12) Comparators 2 2(2) 2 1 Operational amplifier 2 2(2) 2 1 GPIOs Wakeup pins 168 128 119 121 97 6 87 75 68 138 112 80 6 80 49 4 280 SMPS step-down converter 1 USB internal regulator - 1 - USB separate supply pad - 1 VDDMMC separate supply pad - 1 - VREF+ separate pad and internal buffer 1 1 - 1 Operating voltage 1.62 to 3.6 V - 1 - (13) Ambient temperature range: −40 to 85 °C Operating temperatures Junction temperature range: −40 to 130 °C(14) TFBGA UFBGA LQFP UFBGA LQFP WLCSP TFBGA LQFP TFBGA UFBGA LQFP LQFP TFBGA LQFP LQFP 225 176+25 176 169 144 132 100 100 216 176+25 176 144 100 100 64 USART, I2C, SPI, USB-DFU USART, I2C, SPI, USBDFU, FDCAN USART, I2C, SPI, USB-DFU, FDCAN USART, I2C, SPI, USB-DFU USART, I2C, SPI, USB-DFU, FDCAN USART, I2C, SPI, USB-DFU STM32H7B3xI page 9/231 Bootloader 138 4 Maximum CPU frequency (MHz) Packages 166 DS13139 - Rev 7 1. The devices with SMPS correspond to commercial code STM32H7B3xIxxQ. 2. For limitations on peripheral features depending on packages, check the available pins/balls in Table 7. STM32H7B3xI pin/ball definition. 3. To maximize the performance, the I/O high-speed at low-voltage feature (HSLV) must be activated when VDD < 2.7 V. This feature is not available on all I/Os (see Table 89. OCTOSPI characteristics in SDR mode, and Table 90. OCTOSPI characteristics in DTR mode (with DQS)/Octal and Hyperbus). 4. The I/O high-speed at low-voltage feature (HSLV) at VDD < 2.7 V is not available for OCTOSPIM_P2. 5. The two OCTOSPIs are available only in Muxed mode. 6. A tamper pin can be configured either as passive or active (not both). 7. SPI1, SPI2, SPI3 and SPI6 interfaces give the flexibility to work in an exclusive way in either SPI mode or I2S audio mode. 8. Dedicated I/O supply pad (VDDMMC) or external level shifter are not supported. 9. The ULPI interface is supported. PC2 and PC3 are available on PC2_C and PC3_C, respectively, by closing the internal analog switch (see Table 7. STM32H7B3xI pin/ball definition). 10. The ULPI interface is not supported. 11. DCMI and PSSI cannot be used simultaneously since they share the same circuitry. 12. For limitations on fast pads or channels depending on packages, check to the available pins/balls in Table 7. STM32H7B3xI pin/ball definition. 13. VDD/VDDA can drop down to 1.62 V by using an external power supervisor (see Section 3.5.2 Power supply supervisor) and connecting PDR_ON pin to VSS. Otherwise the supply voltage must stay above 1.71 V with the embedded power voltage detector enabled. 14. The junction temperature is limited to 105 °C in VOS0 voltage range. STM32H7B3xI page 10/231 STM32H7B3xI Figure 1. STM32H7B3xI block diagram SDMMC_ D[7:0], CMD, CK as AF DP, DM, ID, VBUS To APB1-2 peripherals AHB1 DMA1 AXI/AHB12 (280 MHz) 1 MB FLASH D-Cache 16KB AHBS AHB3 (280 MHz) 4 channels, ETR as AF TIM5 4 channels TIM12 2 channels as AF TIM13 1 channel as AF TIM14 1 channel as AF 16b TIM17 AHB4 16b 16b RX, TX as AF A P B 10 MHz 3 I2C2/SMBUS I2C3/SMBUS FDCAN2 IWDG AHB/ APB APB4 140 MHz (max) I2C4 SYSCFG LPUART1 EXTI WKUP @VDD CSI DAC1_OUT1 as AF DAC1_OUT2 as AF CSI RC 4MHz HSI48 LSI Temp USB regulator Monitor Vbat charging @VSW VDD LSE XTAL 32 kHz RTC Backup registers AWU LPTIM1_IN1, LPTIM1_IN2, LPTIM2_OUT as AF OPAMPx_VINM OPAMPx_VINP OPAMPx_VOUT as AF VDD VDDMMC VSS VCAP, VDDLDO VDDSMPS, VSSSMPS VLXSMPS, VFBSMPS VDD50USB VDD33USB VBAT OSC32_IN OSC32_OUT RTC_TS RTC_TAMP[1:3] RTC_OUT RTC_REFIN @VDD HSE XTAL OSC 4 - 48MHz HSI RC 64MHz OSC_IN OSC_OUT WDG_LS_D1 HSI48 RC 48MHz LSI RC 32kHz 16b BBgen + POWER MNGT PLL1+PLL2+PLL3 VREF Vref internal HDMI_CEC as AF DAC DAC Voltage SMPS regulator Step-down 3.3 to 1.2V converter LS SPI6/I2S6 SYNC @VDD33 LS 16b TX, RX SPDIFRX[3:0] as AF OPAMP1&2 DAC2 TX, RX HDMI-CEC DAC1 VDD12 SCL, SDA, SMBAL as AF SCL, SDA, SMBAL as AF MDC, MDIO SPIF-RX1 AHB4 RCC Reset & Clock Control Digital Temp Sensor RX, TX, CK, CTS, RTS as AF SCL, SDA, SMBAL as AF MDIOS TT-FDCAN1 LPTIM1 Tamper monitor 16b RX, TX as AF MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF SPI3/I2S3 I2C1/SMBUS 4 KB BKP_SRAM COMP1&2 LPTIM3 RX, TX as AF UART7 UART8 RAM I/F PWRCTRL DFSDM2 1ftr RX, TX as AF SPI2/I2S2 AHB4 280 MHz (max) GPIO PORTK RX, TX, SCK CTS, RTS as AF UART5 CRS 32 KB SRD_SRAM RX, TX, SCK, CTS, RTS as AF 16b SWPMI 32-bit AHB BUS-MATRIX irDA 16b TIM7 16b GPIO PORTA.. J LPTIM2 irDA UART4 DAP BDMA2 HSI DS13139 - Rev 7 4 channels, ETR as AF TIM4 smcard DMA Mux2 MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF VREF+ 4 channels, ETR as AF FIFO SCL, SDA, SMBAL as AF TIM2 TIM3 USART2 AHB4 16b TIM16 TIM8/PWM LPTIM3_OUT as AF 16b APB1 140 MHz (max) TIM15 4 compl. chan. (TIM1_CH1[1:4]N), 4 chan. (TIM1_CH1[1:4]ETR, BKIN as AF LPTIM2_OUT as AF 32b 10 KB SRAM smcard irDA USART10 TIM1/PWM DAC2_OUT1 as AF 16b 16b TIM6 UART9 4 compl. chan. (TIM1_CH1[1:4]N), 4 chan. (TIM1_CH1[1:4]ETR, BKIN as AF COMPx_INP, COMPx_INM, COMPx_OUT as AF AHB3 AHB4 280 MHz (max) RX, TX, SCK, CTS, RTS as AF DFSDM_CKOUT, DFSDM_DATAIN[1:0], DFSDM_CKIN[1:0] DB-SDMMC2 Up to 20 analog inputs Digital filter smcard irDA USART1 smcard irDA USART6 PK[7:0] 3DES/AES AHB1 280 MHz (max) SPI/I2S1 RX, TX, SCK, CTS, RTS as AF PA..J[15:0] 32b 16b 16b FIFO FIFO SAI2 SPI4 1 compl. chan.(TIM17_CH1N), 1 chan. (TIM17_CH1, BKIN as AF RNG HSEM HASH Up to 20 analog inputs Some inputs are common to ADC1&2 Analog Temp Sensor USART3 SPI5 2 compl. chan.(TIM15_CH1[1:2]N), 2 chan. (TIM_CH15[1:2], BKIN as AF 1 compl. chan.(TIM16_CH1N), 1 chan. (TIM16_CH1, BKIN as AF AHB/APB CRC smcard SAI1/PDM MOSI, MISO, SCK, NSS as AF RX, TX, SCK, CTS, RTS as AF ADC2 DFSDM1 8ftrs MOSI, MISO, SCK, NSS as AF RX, TX as AF ADC1 AHB2 280 MHz (max) APB2 140 MHz (max) MOSI, MISO, SCK, NSS / SDO, SDI, CK, WS, MCK, as AF OCTOSPI1 AXI/AHB34 (280 MHz) DCMI PSSI DMA Mux1 AHB_SRAM1 AHB_SRAM2 64 KB 64 KB AHB4 SD, SCK, FS, MCLK, AF OTFDEC1 FIFO SDMMC1 OCTOSPI2_signals DB-SDMMC1 DB-OCTOSPI1 DB-OCTOSPI2 APB4 SD, SCK, FS, MCLK, PDM_D[3:1], PDM_CK[2:1] as AF OCTOSPI2 JPEG AHB3 (280 MHz) AHB/APB OTFDEC2 WWDG FIFO AHB/APB DFSDM_CKOUT, DFSDM_DATAIN[7:0], DFSDM_CKIN[7:0] 64-bit AXI BUS-MATRIX LCD-TFT OCTOSPI1_signals APB4 HSYNC, VSYNC, PIXCLK, D[13:0] PDCK, DE, RDY, D[15:0] FIFO FMC_signals AHB4 280 MHz (max) SDMMC_D[7:0],SDMMC_D[7:3,1]Dir SDMMC_D0dir, SDMMC_D2dir CMD, CMDdir, CK, Ckin, CKio as AF APB3 (140 MHz) CHROM-ART (DMA2D) LCD_R[7:0], LCD_G[7:0], LCD_B[7:0], LCD_HSYNC, LCD_VSYNC, LCD_DE, LCD_CLK FIFO FMC 16 Streams FIFO MDMA DMA/ FIFO 32-bit AHB BUS-MATRIX AHB2 (280 MHz) I-Cache 16KB SDMMC2 BDMA1 8ch for DFSDM AHB1 (280 MHz) ETM TRACED[3:0] DMA2 8 Stream 8 Stream FIFOs FIFOs 256 KB AXI_SRAM1 384 KB AXI_SRAM2 384 KB AXI_SRAM3 AXIM OCTOSPIM TRACECK JTAG/SW AHB4 JTRST, JTDI, JTCK/SWCLK JTDO/SWD, JTDO PHY OTG_FS 1 MB FLASH AHBP ARM CPU Cortex-M7 280 MHz AHB2 CPU_AHBP D-TCM 64KB AHB4 (280 MHz) D-TCM 64KB AHB1 280 MHz (max) I-TCM 64KB MCO1 MCO2 @VDD POR reset Int SUPPLY SUPERVISION POR/PDR/BOR PVD VDDA, VSSA NRESET WKUP[6:1] page 11/231 STM32H7B3xI Functional overview 3 Functional overview 3.1 Arm® Cortex®-M7 with FPU The Arm® Cortex®-M7 with double-precision FPU processor is the latest generation of Arm processors for embedded systems. It was developed to provide a low-cost platform that meets the needs of MCU implementation, with a reduced pin count and optimized power consumption, while delivering outstanding computational performance and low interrupt latency. The Cortex®-M7 processor is a highly efficient high-performance featuring: • • • • • • Six-stage dual-issue pipeline Dynamic branch prediction Harvard architecture with L1 caches (16 Kbytes of I-cache and 16 Kbytes of D-cache) 64-bit AXI4 interface 64-bit ITCM interface 2x32-bit DTCM interfaces The following memory interfaces are supported: • • • • Separate Instruction and Data buses (Harvard Architecture) to optimize CPU latency Tightly Coupled Memory (TCM) interface designed for fast and deterministic SRAM accesses AXI Bus interface to optimize Burst transfers Dedicated low-latency AHB-Lite peripheral bus (AHBP) to connect to peripherals. The processor supports a set of DSP instructions which allow efficient signal processing and complex algorithm execution. It also supports single and double precision FPU (floating point unit) speeds up software development by using metalanguage development tools, while avoiding saturation. Refer to Figure 1. STM32H7B3xI block diagram for the general block diagram of the STM32H7B3xI family. Note: Cortex®-M7 with FPU core is binary compatible with the Cortex®-M4 core. 3.2 Memory protection unit (MPU) The memory protection unit (MPU) manages the CPU access rights and the attributes of the system resources. It has to be programmed and enabled before use. Its main purposes are to prevent an untrusted user program to accidentally corrupt data used by the OS and/or by a privileged task, but also to protect data processes or read-protect memory regions. The MPU defines access rules for privileged accesses and user program accesses. It allows defining up to 16 protected regions that can in turn be divided into up to 8 independent subregions, where region address, size, and attributes can be configured. The protection area ranges from 32 bytes to 4 Gbytes of addressable memory. When an unauthorized access is performed, a memory management exception is generated. 3.3 Memories 3.3.1 Embedded Flash memory The STM32H7B3xI devices embed up to 2 Mbytes of Flash memory that can be used for storing programs and data. The Flash memory is organized as 137-bit Flash words memory that can be used for storing both code and data constants. Each word consists of: • • DS13139 - Rev 7 One Flash word (4 words, 16 bytes or 128 bits) 9 ECC bits. page 12/231 STM32H7B3xI Memories The Flash memory is organized as follows: • • • 3.3.2 Two independent 1 Mbyte banks of user Flash memory, each one containing 128 user sectors of 8 Kbytes each. 128 Kbytes of System Flash memory from which the device can boot. 1 Kbyte of OTP (one-time programmable) memory containing option bytes for user configuration. Secure access mode In addition to other typical memory protection mechanism (RDP, PCROP), STM32H7B3xI devices embed the Secure access mode, an enhanced security feature. This mode allows developing user-defined secure services by ensuring, on the one hand code and data protection and on the other hand code safe execution. Two types of secure services are available: • STMicroelectronics Root Secure Services: These services are embedded in System memory. They provide a secure solution for firmware and third-party modules installation. These services rely on cryptographic algorithms based on a device unique private key. • User-defined secure services: These services are embedded in user Flash memory. Examples of user secure services are proprietary user firmware update solution, secure Flash integrity check or any other sensitive applications that require a high level of protection. The secure firmware is embedded in specific user Flash memory areas configured through option bytes. Secure services are executed just after a reset and preempt all other applications to guarantee protected and safe execution. Once executed, the corresponding code and data are no more accessible. The above secure services are available only for Cortex®-M7 core operating in Secure access mode. The other masters cannot access the option bytes involved in Secure access mode settings or the Flash secured areas. 3.3.3 Embedded SRAM All devices feature: • 1 Mbyte of AXI-SRAM mapped onto AXI bus matrix in CPU domain (CD) split into: • – AXI-SRAM1: 256 Kbytes – AXI-SRAM2: 384 Kbytes – AXI-SRAM3: 384 Kbytes 128 Kbytes of AHB-RAM mapped onto AHB bus matrix in CPU domain (CD) split into: • • – AHB-SRAM1: 64 Kbytes – AHB-SRAM2: 64 Kbytes 32 Kbytes of SRD-SRAM mapped in Smart Run Domain (SRD) 4 Kbytes of backup SRAM The content of this area is protected against possible unwanted write accesses, and is retained in Standby or VBAT mode. • RAM mapped to TCM interface (ITCM and DTCM): Both ITCM and DTCM RAMs are 0 wait state memories that are accessible from the CPU or the MDMA (even in Sleep mode) through a specific AHB slave of the CPU(AHBP). • 64 Kbytes of ITCM-RAM (instruction RAM) This RAM is connected to ITCM 64-bit interface designed for execution of critical real-times routines by the CPU. • 128 Kbytes of DTCM-RAM (2x 64 Kbyte DTCM-RAMs on 2x32-bit DTCM ports) The DTCM-RAM could be used for critical real-time data, such as interrupt service routines or stack/heap memory. Both DTCM-RAMs can be used in parallel (for load/store operations) thanks to the Cortex®-M7 dual issue capability. DS13139 - Rev 7 page 13/231 STM32H7B3xI Boot modes 3.4 Boot modes At startup, the boot memory space is selected by the BOOT pin and BOOT_ADDx option bytes, allowing to program any boot memory address from 0x0000 0000 to 0x3FFF FFFF which includes: • • • All Flash address space All RAM address space: ITCM, DTCM RAMs and SRAMs The system memory bootloader The boot loader is located in non-user System memory. It is used to reprogram the Flash memory through a serial interface (USART, I2C, SPI, USB-DFU, FDCAN). Refer to STM32 microcontroller system memory boot mode application note (AN2606) for details. 3.5 Power supply management 3.5.1 Power supply scheme • VDD = 1.62 to 3.6 V: external power supply for I/Os, provided externally through VDD pins. • VDDLDO = 1.62 to 3.6 V: supply voltage for the internal regulator supplying VCORE • VDDA = 1.62 to 3.6 V: external analog power supplies for ADC, DAC, Reset blocks, RCs and PLL. • VDD33USB and VDD50USB: VDD50USB can be supplied through the USB cable to generate the VDD33USB via the USB internal regulator. This allows supporting a VDD supply different from 3.3 V. The USB regulator can be bypassed to supply directly VDD33USB if VDD = 3.3 V. • • • Note: VDDMMC = 1.62 to 3.6 V external power supply for independent I/Os. VDDMMC can be higher than VDD. VDDMMC pin should be tied to VDD when it is not used. VBAT = 1.2 to 3.6 V: power supply for the VSW domain when VDD is not present. VCAP: VCORE supply, which value depends on voltage scaling (0.74 V, 0.9 V, 1.0 V, 1.1 V, 1.2 V or 1.3 V). It is configured through VOS bits in PWR_CR3 register. The VCORE domain is split into two domains the CPU domain (CD) and the Smart Run Domain (SRD). • – CD domain containing most of the peripherals and the Arm® Cortex®-M7 core – SRD domain containing some peripherals and the system control. VDDSMPS = 1.62 to 3.6 V: step-down converter power supply • VLXSMPS = VCORE or 1.8 to 2.5 V: external regulated step-down converter output • VFBSMPS = VCORE or 1.8 to 2.5 V: external step-down converter feedback voltage sense input For I/O speed optimization at low VDD supply, refer to Section 3.8 General-purpose input/outputs (GPIOs). The features available on the device depend on the package (refer to Table 1. STM32H7B3xI features and peripheral counts). During power-up and power-down phases, the following power sequence requirements must be respected (see Figure 2. Power-up/power-down sequence): • • When VDD is below 1 V, other power supplies (VDDA, VDD33USB and VDD50USB) must remain below VDD + 300 mV. When VDD is above 1 V, all power supplies are independent (except for VDDSMPS, which must remain at the same level as VDD). During the power-down phase, VDD can temporarily become lower than other supplies only if the energy provided to the microcontroller remains below 1 mJ. This allows external decoupling capacitors to be discharged with different time constants during the power-down transient phase. DS13139 - Rev 7 page 14/231 STM32H7B3xI Power supply management Figure 2. Power-up/power-down sequence V 3.6 VDDX(1) VDD VPOR VPDR 1 0.3 Power-on Invalid supply area 3.5.2 Operating mode VDDX < VDD + 300 mV Power-down time VDDX independent from VDD 1. VDDx refers to any power supply among VDDA, VDD33USB and VDD50USB. 2. VDD and VDDSMPS must be wired together into order to follow the same voltage sequence. Power supply supervisor The devices have an integrated power-on reset (POR)/ power-down reset (PDR) circuitry coupled with a Brownout reset (BOR) circuitry: • Power-on reset (POR) The POR supervisor monitors VDD power supply and compares it to a fixed threshold. The devices remain in reset mode when VDD is below this threshold, • Power-down reset (PDR) The PDR supervisor monitors VDD power supply. A reset is generated when VDD drops below a fixed threshold. The PDR supervisor can be enabled/disabled through PDR_ON pin. • Brownout reset (BOR) The BOR supervisor monitors VDD power supply. Three BOR thresholds (from 2.1 to 2.7 V) can be configured through option bytes. A reset is generated when VDD drops below this threshold. • Programmable voltage detector (PVD) The PVD monitors the VDD power supply by comparing it with a threshold selected from a set of predefined values. It can also monitor the voltage level of the PVD_IN pin by comparing it with an internal VREFINT voltage reference level. • Analog voltage detector (AVD) The AVD monitors the VDDA power supply by comparing it with a threshold selected from a set of predefined values. • VBAT threshold • Temperature threshold A dedicated temperature sensor monitors the junction temperature and compare it with two threshold levels. The VBAT battery voltage level can be monitored by comparing it with two thresholds levels. DS13139 - Rev 7 page 15/231 STM32H7B3xI Low-power modes 3.5.3 Voltage regulator The same voltage regulator supplies the two power domains (CD and SRD). The CD domain can be independently switched off. Voltage regulator output can be adjusted according to application needs through six power supply levels: • Run mode (VOS0 to VOS3) • – Scale 0 and scale 1: high performance – Scale 2: medium performance and consumption – Scale 3: optimized performance and low-power consumption Stop mode (SVOS3 to SVOS5) – – Scale 3: peripheral with wakeup from stop mode capabilities (UART, SPI, I2C, LPTIM) are operational Scale 4 and 5 where the peripheral with wakeup from Stop mode is disabled The peripheral functionality is disabled but wakeup from Stop mode is possible through GPIO or asynchronous interrupt. 3.5.4 SMPS step-down converter The built-in SMPS step-down converter is a highly power-efficient DC/DC non-linear switching regulator that provides lower power consumption than a conventional voltage regulator (LDO). The step-down converter can be used to: • Directly supply the VCORE domain – • the SMPS step-down converter operating modes follow the device system operating modes (Run, Stop, Standby). – the SMPS step-down converter output voltage are set according to the selected VOS and SVOS bits (voltage scaling) Provide intermediate voltage level to supply the internal voltage regulator (LDO) – • The SMPS step-down converter operating modes follow the device system operating modes (Run, Stop, Standby). – The SMPS step-down converter output equals 1.8 V or 2.5 V according to the selected step-down level Provide an external supply – – The SMPS step-down converter is forced to external operating mode The SMPS step-down converter output equals 1.8 V or 2.5 V according to the selected step-down level The 1.8 V or 2.5 V SMPS step-down converter output voltage imposes a minimum VDDSMPS supply of 2.5 V or 3.3 V, respectively. It defines indirectly the minimum VDD supply and I/O level. 3.6 Low-power modes There are several ways to reduce power consumption on STM32H7B3xI: • • Decrease dynamic power consumption by slowing down the system clocks even in Run mode and individually clock gating the peripherals that are not used. Save power consumption when the CPU is idle, by selecting among the available low-power mode according to the user application needs. This allows achieving the best compromise between short startup time, low-power consumption, as well as available wakeup sources. The devices feature several low-power modes: • • • • • • DS13139 - Rev 7 System Run with CSleep (CPU clock stopped) Autonomous with CD domain in DStop (CPU and CPU Domain bus matrix clocks stopped) Autonomous with CD domain in DStop2 (CPU and CPU Domain bus matrix clocks stopped, CPU domain in retention mode) System Stop (SRD domain clocks stopped) and CD domain in DStop (CPU and CPU Domain bus matrix clocks stopped) System Stop (SRD domain clocks stopped) and CD domain in DStop2 (CPU and CPU Domain bus matrix clocks stopped, CPU domain in retention mode) Standby (System, CD and SRD domains powered down) page 16/231 STM32H7B3xI Reset and clock controller (RCC) CSleep and CStop low-power modes are entered by the MCU when executing the WFI (Wait for Interrupt) or WFE (Wait for Event) instructions, or when the SLEEPONEXIT bit of the Cortex®-M7 core is set after returning from an interrupt service routine. The CPU domain can enter low-power mode (DStop or DStop2) when the processor, its subsystem and the peripherals allocated in the domain enter low-power mode. If part of the domain is not in low-power mode, the domain remains in the current mode. Finally the system can enter Stop or Standby when all EXTI wakeup sources are cleared and the power domains are in DStop or DStop2 mode. Table 2. System vs domain low-power mode System power mode CD domain power mode SRD domain power mode Run DRun/DStop/DStop2 DRun Stop DStop/DStop2 DStop Standby Standby Standby Some GPIO pins can be used to monitor CPU and domain power states: Table 3. Overview of low-power mode monitoring pins 3.7 Power state monitoring pins Description PWR_CSLEEP CPU clock OFF PWR_CSTOP CPU domain in low-power mode PWR_NDSTOP2 CPU domain retention mode selection Reset and clock controller (RCC) The clock and reset controller is located in the SRD domain. The RCC manages the generation of all the clocks, as well as the clock gating and the control of the system and peripheral resets. It provides a high flexibility in the choice of clock sources and allows to apply clock ratios to improve the power consumption. In addition, on some communication peripherals that are capable to work with two different clock domains (either a bus interface clock or a kernel peripheral clock), the system frequency can be changed without modifying the baud rate. 3.7.1 Clock management The devices embed four internal oscillators, two oscillators with external crystal or resonator, two internal oscillators with fast startup time and three PLLs. The RCC receives the following clock source inputs: • Internal oscillators: • – 64 MHz HSI clock (1% accuracy) – 48 MHz RC oscillator – 4 MHz CSI clock – 32 kHz LSI clock External oscillators: – – 4-50 MHz HSE clock 32.768 kHz LSE clock The RCC provides three PLLs: one for system clock, two for kernel clocks. The system starts on the HSI clock. The user application can then select the clock configuration. A high precision can be achieved for the 48 MHz clock by using the embedded clock recovery system (CRS). It uses the USB SOF signal, the LSE or an external signal (SYNC) to fine tune the oscillator frequency on-the- fly. DS13139 - Rev 7 page 17/231 STM32H7B3xI General-purpose input/outputs (GPIOs) 3.7.2 System reset sources Power-on reset initializes all registers while system reset reinitializes the system except for the debug, part of the RCC and power controller status registers, as well as the backup power domain. A system reset is generated in the following cases: • • • • • • • • 3.8 Power-on reset (pwr_por_rst) Brownout reset Low level on NRST pin (external reset) Window watchdog Independent watchdog Software reset Low-power mode security reset Exit from Standby General-purpose input/outputs (GPIOs) Each of the GPIO pins can be configured by software as output (push-pull or open-drain, with or without pull-up or pull-down), as input (floating, with or without pull-up or pull-down) or as peripheral alternate function. Most of the GPIO pins are shared with digital or analog alternate functions. All GPIOs are high-current-capable and have speed selection to better manage internal noise, power consumption and electromagnetic emission. After reset, all GPIOs are in Analog mode to reduce power consumption. The I/O configuration can be locked if needed by following a specific sequence in order to avoid spurious writing to the I/Os registers. To maximize the performance, the I/O high-speed feature, HSLV, must be activated at low device supply voltage. This is needed to achieve the performance required for peripherals such as the SDMMC, FMC and OCTOSPI. The GPIOs are divided into four groups which can be optimized separately (refer to the description of HSLVx bits of SYSCFG_CCCSR register in RM0455). The I/O high-speed feature must be used only when VDD is lower than 2.7 V, and both the HSLV user option bits (VDDIO_HSLV and VDDMMC_HSLV) and HSLVx bits must be set to enable it (refer to RM0455 for details). DS13139 - Rev 7 page 18/231 DS13139 - Rev 7 3.9 Bus-interconnect matrix The devices feature an AXI bus matrix, two AHB bus matrices and bus bridges that allow interconnecting bus masters with bus slaves (see Figure 3. STM32H7B3xI bus matrix). Figure 3. STM32H7B3xI bus matrix AHBS CPU ITCM 64 Kbytes Cortex-M7 I$ D$ 16KB 16KB DTCM 128 Kbytes LTDC AXI to AHB SDMMC2 USBHS1 BDMA1 DMA2_PERIPH DMA2D DMA2 DMA2_MEM MDMA DMA1_PERIPH SDMMC1 DMA1_MEM AHBP AXIM DMA1 AHB SRAM1 64 Kbytes GFX-MMU AHB3 FLIFT AHB SRAM2 64 Kbytes APB3 AHB1 Flash Bank 1 1 Mbyte AHB2 Flash Bank 2 1 Mbyte APB1 FMC APB2 OTFDEC1 OCTOSPI1 OTFDEC2 OCTOSPI2 AXI SRAM1 256 Kbytes AXI SRAM2 384 Kbytes AXI SRAM3 384 Kbytes 32-bit AHB bus matrix CD domain 64-bit AXI bus matrix CD domain CD-to-SRD AHB BDMA2 TCM AHB AXI APB AHB4 64-bit bus Master interface Bus multiplexer Slave interface SRD SRAM 32 Kbytes page 19/231 32-bit AHB bus matrix SRD domain Backup SRAM 4 Kbytes APB4 STM32H7B3xI 32-bit bus Bus-interconnect matrix Legend STM32H7B3xI DMA controllers 3.10 DMA controllers The devices feature five DMA instances to unload CPU activity: • A master direct memory access (MDMA) The MDMA is a high-speed DMA controller, which is in charge of all types of memory transfers (peripheral to memory, memory to memory, memory to peripheral), without any CPU action. It features a master AXI interface and a dedicated AHB interface to access Cortex®-M7 TCM memories. The MDMA is located in the CD domain. It is able to interface with the other DMA controllers located in this domain to extend the standard DMA capabilities, or can manage peripheral DMA requests directly. Each of the 16 channels can perform single block transfers, repeated block transfers and linked list transfers. • • • Two dual-port DMAs (DMA1, DMA2) located in the CD domain and connected to the AHB matrix, with FIFO and request router capabilities. One basic DMA (BDMA1) located in the CD domain and connected to the AHB matrix. This DMA is dedicated to the DFSDM (see Section 3.26 Digital filter for sigma-delta modulators (DFSDM)) One basic DMA (BDMA2) located in the SRD domain, with request router capabilities. The DMA request router could be considered as an extension of the DMA controller. It routes the DMA peripheral requests to the DMA controller itself. This allowing managing the DMA requests with a high flexibility, maximizing the number of DMA requests that run concurrently, as well as generating DMA requests from peripheral output trigger or DMA event. 3.11 Chrom-ART Accelerator (DMA2D) The Chrom-Art Accelerator (DMA2D) is a graphical accelerator which offers advanced bit blitting, row data copy and pixel format conversion. It supports the following functions: • • • • Rectangle filling with a fixed color Rectangle copy Rectangle copy with pixel format conversion Rectangle composition with blending and pixel format conversion Various image format coding are supported, from indirect 4bpp color mode up to 32bpp direct color. It embeds dedicated memory to store color lookup tables. The DMA2D also supports block based YCbCr to handle JPEG decoder output. An interrupt can be generated when an operation is complete or at a programmed watermark. All the operations are fully automatized and are running independently from the CPU or the DMAs. 3.12 Chrom-GRC™ (GFXMMU) The Chrom-GRC™ is a graphical oriented memory management unit aimed at: • • • Optimizing memory usage according to the display shape Manage cache linear accesses to the frame buffer Prefetch data The display shape is programmable to store only the visible image pixels. A virtual memory space is provided which is seen by all system masters and can be physically mapped to any system memory. An interrupt can be generated in case of buffer overflow or memory transfer error. 3.13 Nested vectored interrupt controller (NVIC) The devices embed a nested vectored interrupt controller which is able to manage 16 priority levels, and handle up to 150 maskable interrupt channels plus the 16 interrupt lines of the Cortex®-M7 with FPU core. • • • • • DS13139 - Rev 7 Closely coupled NVIC gives low-latency interrupt processing Interrupt entry vector table address passed directly to the core Allows early processing of interrupts Processing of late arriving, higher-priority interrupts Support tail chaining page 20/231 STM32H7B3xI Extended interrupt and event controller (EXTI) • • Processor context automatically saved Interrupt entry restored on interrupt exit with no instruction overhead This hardware block provides flexible interrupt management features with minimum interrupt latency. 3.14 Extended interrupt and event controller (EXTI) The EXTI controller performs interrupt and event management. In addition, it can wake up the processor, power domains and/or SRD domain from Stop mode. The EXTI handles up to 89 independent event/interrupt lines split into 28 configurable events and 61 direct events. Configurable events have dedicated pending flags, active edge selection, and software trigger capable. Direct events provide interrupts or events from peripherals having a status flag. 3.15 Cyclic redundancy check calculation unit (CRC) The CRC (cyclic redundancy check) calculation unit is used to get a CRC code using a programmable polynomial. Among other applications, CRC-based techniques are used to verify data transmission or storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of verifying the Flash memory integrity. The CRC calculation unit helps compute a signature of the software during runtime, to be compared with a reference signature generated at link-time and stored at a given memory location. 3.16 Flexible memory controller (FMC) The FMC controller main features are the following: • • • • • • • • 3.17 Interface with static-memory mapped devices including: – Static random access memory (SRAM) – NOR Flash memory/OneNAND Flash memory – PSRAM (4 memory banks) – NAND Flash memory with ECC hardware to check up to 8 Kbytes of data Interface with synchronous DRAM (SDRAM/Mobile LPSDR SDRAM) memories 8-,16-,32-bit data bus width Independent Chip Select control for each memory bank Independent configuration for each memory bank Write FIFO Read FIFO for SDRAM controller The maximum FMC_CLK/FMC_SDCLK frequency for synchronous accesses is the FMC kernel clock divided by 2. Octo-SPI memory interface (OCTOSPI) The OCTOSPI is a specialized communication interface targeting single, dual, quad or octal SPI memories. The STM32H7B3xI embeds two separate Octo-SPI interfaces. Each OCTOSPI instance supports single/dual/quad/octal SPI formats. Multiplex of single/dual/quad/octal SPI over the same bus can be achieved using the integrated I/O manager. The OCTOSPI can operate in any of the three following modes: • • • Indirect mode: all the operations are performed using the OCTOSPI registers Status-polling mode: the external memory status register is periodically read and an interrupt can be generated in case of flag setting Memory-mapped mode: the external memory is memory mapped and it is seen by the system as if it was an internal memory supporting both read and write operations. The OCTOSPI support two frame formats supported by most external serial memories such as serial PSRAMs, serial NOR Flash memories, Hyper RAMs and Hyper Flash memories: DS13139 - Rev 7 • The classical frame format with the command, address, alternate byte, dummy cycles and data phase • The HyperBus™ frame format. page 21/231 STM32H7B3xI Analog-to-digital converters (ADCs) Multichip package (MCP) combining any of the above mentioned memory types can also be supported. 3.18 Analog-to-digital converters (ADCs) The STM32H7B3xI devices embed two analog-to-digital converters, whose resolution can be configured to 16, 14, 12, 10 or 8 bits. Each ADC shares up to 24 external channels, performing conversions in the single-shot or scan mode. In scan mode, automatic conversion is performed on a selected group of analog inputs. Additional logic functions embedded in the ADC interface allow: • • Simultaneous sample and hold Interleaved sample and hold The ADC can be served by the DMA controller, thus allowing to automatically transfer ADC converted values to a destination location without any software action. In addition, an analog watchdog feature can accurately monitor the converted voltage of one, some or all selected channels. An interrupt is generated when the converted voltage is outside the programmed thresholds. To synchronize A/D conversion and timers, the ADCs could be triggered by any of TIM1, TIM2, TIM3, TIM4, TIM6, TIM8, TIM15, and LPTIM1 timers. 3.19 Analog temperature sensor The STM32H7B3xI embeds an analog temperature sensor that generates a voltage (VTS) that varies linearly with the temperature. This temperature sensor is internally connected to ADC2_IN18. The conversion range is between 1.7 V and 3.6 V. It can measure the device junction temperature ranging from −40 to +125 °C. The temperature sensor have a good linearity, but it has to be calibrated to obtain a good overall accuracy of the temperature measurement. As the temperature sensor offset varies from chip to chip due to process variation, the uncalibrated internal temperature sensor is suitable for applications that detect temperature changes only. To improve the accuracy of the temperature sensor measurement, each device is individually factory-calibrated by ST. The temperature sensor factory calibration data are stored by ST in the System memory area, which is accessible in read-only mode. 3.20 Digital temperature sensor (DTS) The STM32H7B3xI embeds a sensor that converts the temperature into a square wave which frequency is proportional to the temperature. The PCLK or the LSE clock can be used as reference clock for the measurements. A formula given in the product reference manual (RM0455) allows to calculate the temperature according to the measured frequency stored in the DTS_DR register. 3.21 VBAT operation The VBAT power domain contains the RTC, the backup registers and the backup SRAM. To optimize battery duration, this power domain is supplied by VDD when available or by the voltage applied on VBAT pin (when VDD supply is not present). VBAT power is switched when the PDR detects that VDD dropped below the PDR level. The voltage on the VBAT pin could be provided by an external battery, a supercapacitor or directly by VDD, in which case, the VDD mode is not functional. VBAT operation is activated when VDD is not present. The VBAT pin supplies the RTC, the backup registers and the backup SRAM. The devices embed an internal VBAT battery charging circuitry that can be activated when VDD is present. Note: When the microcontroller is supplied from VBAT, external interrupts and RTC alarm/events do not exit it from VBAT operation. When PDR_ON pin is connected to VSS (Internal Reset OFF), the VBAT functionality is no more available and VBAT pin should be connected to VDD. 3.22 Digital-to-analog converters (DAC) The devices features one dual-channel DAC (DAC1), located in the CD domain, plus one single-channel DAC (DAC2), located in the SRD domain. DS13139 - Rev 7 page 22/231 STM32H7B3xI Voltage reference buffer (VREFBUF) The three 12-bit buffered DAC channels can be used to convert three digital signals into three analog voltage signal outputs. The following feature are supported: • • • • • • • • • • three DAC converters: one for each output channel 8-bit or 12-bit monotonic output left or right data alignment in 12-bit mode synchronized update capability noise-wave generation triangular-wave generation Triple DAC channel independent or simultaneous conversions DMA capability for each channel including DMA underrun error detection external triggers for conversion input voltage reference VREF+ or internal VREFBUF reference. The DAC channels are triggered through the timer update outputs that are also connected to different DMA streams. 3.23 Voltage reference buffer (VREFBUF) The built-in voltage reference buffer can be used as voltage reference for ADCs and DACs, as well as voltage reference for external components through the VREF+ pin. Five different voltages are supported (refer to the reference manual for details). 3.24 Ultra-low-power comparators (COMP) The STM32H7B3xI devices embed two rail-to-rail comparators (COMP1 and COMP2). They feature programmable reference voltage (internal or external), hysteresis and speed (low speed for low-power) as well as selectable output polarity. The reference voltage can be one of the following: • • • • • An external I/O A DAC output channel An internal reference voltage or submultiple (1/4, 1/2, 3/4) The analog temperature sensor The VBAT/4 supply. All comparators can wake up from Stop mode, generate interrupts and breaks for the timers, and be combined into a window comparator. 3.25 Operational amplifiers (OPAMP) The STM32H7B3xI devices embed two rail-to-rail operational amplifiers (OPAMP1 and OPAMP2) with external or internal follower routing and PGA capability, and two inputs and one output each. These three I/Os can be connected to the external pins, thus enabling any type of external interconnections. The operational amplifiers can be configured internally as a follower, as an amplifier with a non-inverting gain ranging from 2 to 16 or with inverting gain ranging from -1 to -15. The operational amplifier main features are: • • • • • • PGA with a non-inverting gain ranging of 2, 4, 8 or 16 or inverting gain ranging of -1, -3, -7 or -15 Up to two positive inputs connected to DAC Output connected to internal ADC Low input bias current down to 1 nA Low input offset voltage down to 1.5 mV Gain bandwidth up to 8 MHz The devices embed two operational amplifiers (OPMAP1 and OPAMP2) with two inputs and one output each. These three I/Os can be connected to the external pins, thus enabling any type of external interconnections. The operational amplifiers can be configured internally as a follower, as an amplifier with a non-inverting gain ranging from 2 to 16 or with inverting gain ranging from -1 to -15. DS13139 - Rev 7 page 23/231 STM32H7B3xI Digital filter for sigma-delta modulators (DFSDM) 3.26 Digital filter for sigma-delta modulators (DFSDM) The device embeds two DFSDM interfaces: • • DSFDM1 It is located in the CD domain and features eight external digital serial interfaces (channels) and eight digital filters, or alternately eight internal parallel inputs. DSFDM2 It is located in the SRD domain. DFSDM2 is a lite version including two external digital serial interfaces (channels) and one digital filters. The DFSDM peripherals interface the external Σ∆ modulators to microcontroller and then perform digital filtering of the received data streams (which represent analog value on Σ∆ modulators inputs). DFSDMs can also interface PDM (Pulse Density Modulation) microphones and perform PDM to PCM conversion and filtering in hardware. The DFSDMs feature optional parallel data stream inputs from internal ADC peripherals or microcontroller memory (through DMA/CPU transfers into DFSDM). DFSDM transceivers support several serial interface formats (to support various Σ∆ modulators). DFSDM digital filter modules perform digital processing according user selected filter parameters with up to 24-bit final ADC resolution. The DFSDM peripherals support: DS13139 - Rev 7 • Multiplexed input digital serial channels: • – configurable SPI interface to connect various SD modulator(s) – configurable Manchester coded 1 wire interface support – PDM (Pulse Density Modulation) microphone input support – maximum input clock frequency up to 20 MHz (10 MHz for Manchester coding) – clock output for SD modulator(s): 0..20 MHz Alternative inputs from eight internal digital parallel channels (up to 16 bit input resolution): • – internal sources: ADC data or memory data streams (DMA) Digital filter modules with adjustable digital signal processing: • • • • – Sincx filter: filter order/type (1..5), oversampling ratio (up to 1..1024) – integrator: oversampling ratio (1..256) Up to 24-bit output data resolution, signed output data format Automatic data offset correction (offset stored in register by user) Continuous or single conversion Start-of-conversion triggered by: • – software trigger – internal timers – external events – start-of-conversion synchronously with first digital filter module (DFSDM0) Analog watchdog feature: • – low value and high value data threshold registers – dedicated configurable Sincx digital filter (order = 1..3, oversampling ratio = 1..32) – input from final output data or from selected input digital serial channels – continuous monitoring independently from standard conversion Short circuit detector to detect saturated analog input values (bottom and top range): • • – up to 8-bit counter to detect 1..256 consecutive 0’s or 1’s on serial data stream – monitoring continuously each input serial channel Break signal generation on analog watchdog event or on short circuit detector event Extremes detector: • • – storage of minimum and maximum values of final conversion data – refreshed by software DMA capability to read the final conversion data Interrupts: end of conversion, overrun, analog watchdog, short circuit, input serial channel clock absence page 24/231 STM32H7B3xI Digital camera interface (DCMI) • “Regular” or “injected” conversions: – – 3.27 “regular” conversions can be requested at any time or even in continuous mode without having any impact on the timing of “injected” conversions “injected” conversions for precise timing and with high conversion priority Digital camera interface (DCMI) The devices embed a camera interface that can connect with camera modules and CMOS sensors through an 8-bit to 14-bit parallel interface, to receive video data. The camera interface can achieve a data transfer rate up to 140 Mbyte/s using a 80 MHz pixel clock. It features: • • • • • 3.28 Programmable polarity for the input pixel clock and synchronization signals Parallel data communication can be 8-, 10-, 12- or 14-bit Supports 8-bit progressive video monochrome or raw bayer format, YCbCr 4:2:2 progressive video, RGB 565 progressive video or compressed data (like JPEG) Supports continuous mode or snapshot (a single frame) mode Capability to automatically crop the image Parallel synchronous slave interface (PSSI) The PSSI is a generic synchronous 8-/16-bit parallel data input/output slave interface. It allows the transmitter to send a data valid signal to indicate when the data is valid, and the receiver to output a flow control signal to indicate when it is ready to sample the data. The PSSI main features are: • • • • Slave mode operation 8- or 16-bit parallel data input or output 8-word (32-byte) FIFO Data enable (DE) alternate function input and Ready (RDY) alternate function output. When enabled, these signals can either allow the transmitter to indicate when the data is valid or the receiver to indicate when it is ready to sample the data, or both. The PSSI shares most of the circuitry with the digital camera interface (DCMI). It thus cannot be used simultaneously with the DCMI. 3.29 LCD-TFT display controller (LTDC) The LCD-TFT display controller provides a 24-bit parallel digital RGB (Red, Green, Blue) and delivers all signals to interface directly to a broad range of LCD and TFT panels up to XGA (1024x768) resolution with the following features: • • • • • • • • 3.30 2 display layers with dedicated FIFO (64x32-bit) Color Look-Up table (CLUT) up to 256 colors (256x24-bit) per layer Up to 8 input color formats selectable per layer Flexible blending between two layers using alpha value (per pixel or constant) Flexible programmable parameters for each layer Color keying (transparency color) Up to 4 programmable interrupt events AXI master interface with burst of 16 words JPEG codec (JPEG) The JPEG codec can encode and decode a JPEG stream as defined in the ISO/IEC10918-1 specification. It provides an fast and simple hardware compressor and decompressor of JPEG images with full management of JPEG headers. The JPEG codec main features are as follows: • • • DS13139 - Rev 7 8-bit/channel pixel depths Single clock per pixel encoding and decoding Support for JPEG header generation and parsing page 25/231 STM32H7B3xI True random number generator (RNG) • • • • • • • • • • • • 3.31 Up to four programmable quantization tables Fully programmable Huffman tables (two AC and two DC) Fully programmable minimum coded unit (MCU) Encode/decode support (non simultaneous) Single clock Huffman coding and decoding Two-channel interface: Pixel/Compress In, Pixel/Compressed Out Stallable design Support for single greyscale component Ability to enable/disable header processing Internal register interface Fully synchronous design Configuration for high-speed decode mode True random number generator (RNG) All devices embed an RNG that delivers 32-bit random numbers generated by an integrated analog circuit. The RNG is a true random number generator that provides full entropy outputs to the application as 32-bit samples. It is composed of a live entropy source (analog) and an internal conditioning component. 3.32 Cryptographic acceleration (CRYP and HASH) The devices embed a cryptographic processor that supports the advanced cryptographic algorithms usually required to ensure confidentiality, authentication, data integrity and non-repudiation when exchanging messages with a peer: • Encryption/Decryption – • DES/TDES (data encryption standard/triple data encryption standard): ECB (electronic codebook) and CBC (cipher block chaining) chaining algorithms, 64-, 128- or 192-bit key – AES (advanced encryption standard): ECB, CBC, GCM, CCM, and CTR (counter mode) chaining algorithms, 128, 192 or 256-bit key Universal HASH – – – SHA-1 and SHA-2 (secure HASH algorithms) MD5 HMAC The cryptographic accelerator supports DMA request generation. 3.33 On-the-fly decryption engine (OTFDEC) The embedded OTFDEC decrypts in real-time the encrypted content stored in the external Octo-SPI memories used in Memory-mapped mode. The OTFDEC uses the AES-128 algorithm in counter mode (CTR). Code execution on external Octo-SPI memories can be protected against fault injection thanks to STMicroelectronics enhanced encryption mode (refer to RM0455 for details). The OTFDEC main features are as follow: DS13139 - Rev 7 • On-the-fly 128-bit decryption during STM32 Octo-SPI read operations (single or multiple). • – AES-CTR algorithm with keystream FIFO (depth= 4) – Support for any read size Up to four independent encrypted regions • – Region definition granularity: 4096 bytes – Region configuration write locking mechanism – Two optional decryption modes: execute-only and execute-never 128-bit key for each region, two-byte firmware version, and eight-byte application-defined nonce page 26/231 STM32H7B3xI Timers and watchdogs 3.34 • Encryption keys confidentiality and integrity protection • • – Write only registers with software locking mechanism – Availability of 8-bit CRC as public key information Support for STM32 Octo-SPI prefetching mechanism. Encryption mode Timers and watchdogs The devices include two advanced-control timers, ten general-purpose timers, two basic timers, three low-power timers, two watchdogs and a SysTick timer. All timer counters can be frozen in Debug mode. Table 4. Timer feature comparison compares the features of the advanced-control, general-purpose and basic timers. Table 4. Timer feature comparison Timer type Timer Counter resolution Counter type Prescaler factor DMA request generation Capture/ compare channels Complementary output Max interface clock (MHz) Max timer clock (MHz) (1) TIM1, TIM8 16-bit Up, Down, Up/down Any integer between 1 and 65536 Yes 4 Yes 140 280 TIM2, TIM5 32-bit Up, Down, Up/down Any integer between 1 and 65536 Yes 4 No 140 280 TIM3, TIM4 16-bit Up, Down, Up/down Any integer between 1 and 65536 Yes 4 No 140 280 TIM12 16-bit Up Any integer between 1 and 65536 No 2 No 140 280 TIM13, TIM14 16-bit Up Any integer between 1 and 65536 No 1 No 140 280 TIM15 16-bit Up Any integer between 1 and 65536 Yes 2 1 140 280 TIM16, TIM17 16-bit Up Any integer between 1 and 65536 Yes 1 1 140 280 Basic TIM6, TIM7 16-bit Up Any integer between 1 and 65536 Yes 0 No 140 280 Low-power timer LPTIM1, LPTIM2, LPTIM3 16-bit Up 1, 2, 4, 8, 16, 32, 64, 128 No 0 No 140 280 Advancedcontrol General purpose 1. The maximum timer clock is up to 280 MHz depending on TIMPRE bit in the RCC_CFGR register and CDPRE1/2 bits in RCC_CDCFGR register. 3.34.1 Advanced-control timers (TIM1, TIM8) The advanced-control timers (TIM1, TIM8) can be seen as three-phase PWM generators multiplexed on 6 channels. They have complementary PWM outputs with programmable inserted dead times. They can also be considered as complete general-purpose timers. Their 4 independent channels can be used for: • DS13139 - Rev 7 Input capture page 27/231 STM32H7B3xI Timers and watchdogs • • • Output compare PWM generation (edge- or center-aligned modes) One-pulse mode output If configured as standard 16-bit timers, they have the same features as the general-purpose TIMx timers. If configured as 16-bit PWM generators, they have full modulation capability (0-100%). The advanced-control timer can work together with the TIMx timers via the Timer Link feature for synchronization or event chaining. The advanced-control timers support independent DMA request generation. 3.34.2 General-purpose timers (TIMx) There are ten synchronizable general-purpose timers embedded in the STM32H7B3xI devices (see Table 4. Timer feature comparison for differences). 3.34.3 • TIM2, TIM3, TIM4 and TIM5 The devices include 4 full-featured general-purpose timers: TIM2, TIM3, TIM4 and TIM5. TIM2 and TIM5 are based on a 32-bit auto-reload up/downcounter and a 16-bit prescaler while TIM3 and TIM4 are based on a 16-bit auto-reload up/downcounter and a 16-bit prescaler. All timers feature 4 independent channels for input capture/output compare, PWM or one-pulse mode output. This gives up to 16 input capture/output compare/PWMs on the largest packages. TIM2, TIM3, TIM4 and TIM5 general-purpose timers can work together, or with the other general-purpose timers and the advanced-control timers (TIM1, TIM8) via the Timer Link feature for synchronization or event chaining. Any of these general-purpose timers can be used to generate PWM outputs. TIM2, TIM3, TIM4 and TIM5 all have independent DMA request generation. They are capable of handling quadrature (incremental) encoder signals and the digital outputs from 1 to 4 hall-effect sensors. • TIM12, TIM13, TIM14, TIM15, TIM16 and TIM17 These timers are based on a 16-bit auto-reload upcounter and a 16-bit prescaler. TIM13, TIM14, TIM16 and TIM17 feature one independent channel, whereas TIM12 and TIM15 have two independent channels for input capture/output compare, PWM or one-pulse mode output. They can be synchronized with the TIM2, TIM3, TIM4 and TIM5 full-featured general-purpose timers or used as simple time bases. Basic timers (TIM6 and TIM7) These timers are mainly used for DAC trigger and waveform generation. They can also be used as a generic 16-bit time base. TIM6 and TIM7 support independent DMA request generation. 3.34.4 Low-power timers (LPTIM1, LPTIM2, LPTIM3) The low-power timers feature an independent clock and are running also in Stop mode if they are clocked by LSE, LSI or an external clock. The low-power timers are able to wakeup the devices from Stop mode. The low-power timers support the following features: • • • • • • • • • • DS13139 - Rev 7 16-bit up counter with 16-bit autoreload register 16-bit compare register Configurable output: pulse, PWM Continuous / one-shot mode Selectable software / hardware input trigger Selectable clock source: Internal clock source: LSE, LSI, HSI or APB clock External clock source over LPTIM input (working even with no internal clock source running, used by the Pulse Counter Application) Programmable digital glitch filter Encoder mode page 28/231 STM32H7B3xI Real-time clock (RTC) 3.34.5 Independent watchdog The independent watchdog is based on a 12-bit downcounter and 8-bit prescaler. It is clocked from an independent 32 kHz internal RC and as it operates independently from the main clock, it can operate in Stop and Standby modes. It can be used either as a watchdog to reset the device when a problem occurs, or as a free-running timer for application timeout management. It is hardware- or software-configurable through the option bytes. 3.34.6 Window watchdog The window watchdog is based on a 7-bit downcounter that can be set as free-running. It can be used as a watchdog to reset the device when a problem occurs. It is clocked from the main clock. It has an early warning interrupt capability and the counter can be frozen in debug mode. 3.34.7 SysTick timer This timer is dedicated to real-time operating systems, but could also be used as a standard downcounter. It features: • • • • 3.35 A 24-bit downcounter Autoreload capability Maskable system interrupt generation when the counter reaches 0 Programmable clock source. Real-time clock (RTC) The RTC is an independent BCD timer/counter. It supports the following features: • • • • • • • • Calendar with subsecond, seconds, minutes, hours (12 or 24 format), week day, date, month, year, in BCD (binary-coded decimal) format. Automatic correction for 28, 29 (leap year), 30, and 31 days of the month. Two programmable alarms. On-the-fly correction from 1 to 32767 RTC clock pulses. This can be used to synchronize it with a master clock. Reference clock detection: a more precise second source clock (50 or 60 Hz) can be used to enhance the calendar precision. Digital calibration circuit with 0.95 ppm resolution, to compensate for quartz crystal inaccuracy. Timestamp feature which can be used to save the calendar content. This function can be triggered by an event on the timestamp pin, or by a tamper event, or by a switch to VBAT mode. 17-bit auto-reload wakeup timer (WUT) for periodic events with programmable resolution and period. The RTC is supplied through a switch that takes power either from the VDD supply when present or from the VBAT pin. The RTC clock sources can be: • • • • A 32.768 kHz external crystal (LSE) An external resonator or oscillator (LSE) The internal low-power RC oscillator (LSI, with typical frequency of 32 kHz) The high-speed external clock (HSE) divided by 32. The RTC is functional in VBAT mode and in all low-power modes when it is clocked by the LSE. When clocked by the LSI, the RTC is not functional in VBAT mode, but is functional in all low-power modes. All RTC events (Alarm, Wakeup Timer, Timestamp or Tamper) can generate an interrupt and wakeup the device from the low-power modes. 3.36 Tamper and backup registers (TAMP) The TAMP main features are the following: • 32 backup registers: – DS13139 - Rev 7 The backup registers (TAMP_BKPxR) are implemented in the RTC domain that remains powered-on by VBAT when the VDD power is switched off. page 29/231 STM32H7B3xI Inter-integrated circuit interface (I2C) • Three external tamper detection events • • • – Each external event can be configured to be active or passive – External passive tampers with configurable filter and internal pull-up Seven internal tamper events Any tamper detection can generate an RTC timestamp event Any tamper detection can erase the RTC backup registers, the backup SRAM and the memory regions protected by the on-the-fly decryption engine (OTFDEC) Monotonic counter • 3.37 Inter-integrated circuit interface (I2C) The STM32H7B3xI embed four I2C interfaces. The I2C bus interface handles communications between the microcontroller and the serial I2C bus. It controls all I2C bus-specific sequencing, protocol, arbitration and timing. The I2C peripheral supports: • I2C-bus specification and user manual rev. 5 compatibility: • – Slave and master modes, multimaster capability – Standard-mode (Sm), with a bit rate up to 100 kbit/s – Fast-mode (Fm), with a bit rate up to 400 kbit/s – Fast-mode Plus (Fm+), with a bit rate up to 1 Mbit/s and 20 mA output drive I/Os – 7-bit and 10-bit addressing mode, multiple 7-bit slave addresses – Programmable setup and hold times – Optional clock stretching System management bus (SMBus) specification rev 2.0 compatibility: – – – • • • • • 3.38 Hardware PEC (packet error checking) generation and verification with ACK control Address resolution protocol (ARP) support SMBus alert Power system management protocol (PMBus™) specification rev 1.1 compatibility Independent clock: a choice of independent clock sources allowing the I2C communication speed to be independent from the PCLK reprogramming. Wakeup from Stop mode on address match Programmable analog and digital noise filters 1-byte buffer with DMA capability Universal synchronous/asynchronous receiver transmitter (USART) The STM32H7B3xI devices have five embedded universal synchronous receiver transmitters (USART1, USART2, USART3, USART6 and USART10) and five universal asynchronous receiver transmitters (UART4, UART5, UART7, UART8 and UART9). Refer to the table below for a summary of USARTx and UARTx features. These interfaces provide asynchronous communication, IrDA SIR ENDEC support, multiprocessor communication mode, single-wire half-duplex communication mode and have LIN Master/Slave capability. They provide hardware management of the CTS and RTS signals, and RS485 Driver Enable. They are able to communicate at speeds of up to 10Mbit/s. USART1, USART2, USART3, USART6 and USART10 also provide Smartcard mode (ISO 7816 compliant) and SPI-like communication capability. The USARTs embed a Transmit FIFO (TXFIFO) and a Receive FIFO (RXFIFO). FIFO mode is enabled by software and is disabled by default. All USART have a clock domain independent from the CPU clock, allowing the USARTx to wake up the MCU from Stop mode.The wakeup from Stop mode are programmable and can be done on: • • • • DS13139 - Rev 7 Start bit detection Any received data frame A specific programmed data frame Specific TXFIFO/RXFIFO status when FIFO mode is enabled. page 30/231 STM32H7B3xI Low-power universal asynchronous receiver transmitter (LPUART) All USART interfaces can be served by the DMA controller. Table 5. USART features X = supported. USART modes/features USART1/2/3/6/10 UART4/5/7/8/9 Hardware flow control for modem X X Continuous communication using DMA X X Multiprocessor communication X X Synchronous mode (Master/Slave) X - Smartcard mode X - Single-wire Half-duplex communication X X IrDA SIR ENDEC block X X LIN mode X X Dual clock domain and wakeup from low power mode X X Receiver timeout interrupt X X Modbus communication X X Auto baud rate detection X X Driver Enable X X USART data length Tx/Rx FIFO Tx/Rx FIFO size 3.39 7, 8 and 9 bits X X 16 Low-power universal asynchronous receiver transmitter (LPUART) The device embeds one Low-power UART (LPUART1). The LPUART supports asynchronous serial communication with minimum power consumption. It supports half duplex single wire communication and modem operations (CTS/RTS). It allows multiprocessor communication. The LPUART embeds a Transmit FIFO (TXFIFO) and a Receive FIFO (RXFIFO). FIFO mode is enabled by software and is disabled by default. The LPUART has a clock domain independent from the CPU clock, and can wakeup the system from Stop mode. The wakeup from Stop mode are programmable and can be done on: • • • • Start bit detection Any received data frame A specific programmed data frame Specific TXFIFO/RXFIFO status when FIFO mode is enabled. Only a 32.768 kHz clock (LSE) is needed to allow LPUART communication up to 9600 baud. Therefore, even in Stop mode, the LPUART can wait for an incoming frame while having an extremely low energy consumption. Higher speed clock can be used to reach higher baud rates. LPUART interface can be served by the DMA controller. 3.40 Serial peripheral interfaces (SPI)/integrated interchip sound interfaces (I2S) The devices feature up to six SPIs (SPI1/I2S1, SPI2/I2S2, SPI3/I2S3, SPI6/I2S6 and SPI4, SPI5) that allow communicating up to 125 Mbits/s in master and slave modes, in half-duplex, full-duplex and simplex modes. The 3-bit prescaler gives 8 master mode frequencies and the frame is configurable from 4 to 32 bits for SPI1/I2S1, SPI2/I2S2, SPI3/I2S3, from 4 to 16 bits for the others. All SPI interfaces support NSS pulse mode, TI mode, Hardware CRC calculation, and 16x 8-bit embedded Rx and Tx FIFOs (SPI1/I2S1, SPI2/I2S2, SPI3/I2S3) or 8x 8-bit embedded Rx and Tx FIFOs (SPI4, SPI5, SPI6/I2S6), all with DMA capability. . DS13139 - Rev 7 page 31/231 STM32H7B3xI Serial audio interfaces (SAI) Four standard I2S interfaces (multiplexed with SPI1, SPI2, SPI3, SPI6) are available. They can be operated in master or slave mode, in simplex communication modes, and can be configured to operate with a 16-/32-bit resolution as an input or output channel. Audio sampling frequencies from 8 kHz up to 192 kHz are supported. When one or all I2S interfaces is/are configured in master mode, the master clock can be output to the external DAC/codec at 256 times the sampling frequency. All I2S interfaces support 16x 8-bit embedded Rx and Tx FIFOs with DMA capability. 3.41 Serial audio interfaces (SAI) The devices embed two SAIs (SAI1, SAI2) that allow designing many stereo or mono audio protocols such as I2S, LSB or MSB-justified, PCM/DSP, TDM or AC’97. An SPDIF output is available when the audio block is configured as a transmitter. To bring this level of flexibility and reconfigurability, the SAI contains two independent audio sub-blocks. Each block has it own clock generator and I/O line controller. Audio sampling frequencies up to 192 kHz are supported. One of the SAI supports up to 8 microphones thanks to an embedded PDM interface. The SAI can work in master or slave configuration. The audio sub-blocks can be either receiver or transmitter and can work synchronously or asynchronously (with respect to the other one). The SAI can be connected with other SAIs to work synchronously. 3.42 SPDIFRX receiver interface (SPDIFRX) The SPDIFRX peripheral is designed to receive an S/PDIF flow compliant with IEC-60958 and IEC-61937. These standards support simple stereo streams up to high sample rate, and compressed multi-channel surround sound, such as those defined by Dolby or DTS (up to 5.1). The main SPDIFRX features are the following: • • • • • • • • • Up to 4 inputs available Automatic symbol rate detection Maximum symbol rate: 12.288 MHz Stereo stream from 32 to 192 kHz supported Supports Audio IEC-60958 and IEC-61937, consumer applications Parity bit management Communication using DMA for audio samples Communication using DMA for control and user channel information Interrupt capabilities The SPDIFRX receiver provides all the necessary features to detect the symbol rate, and decode the incoming data stream. The user can select the wanted SPDIF input, and when a valid signal will be available, the SPDIFRX will re-sample the incoming signal, decode the Manchester stream, recognize frames, sub-frames and blocks elements. It delivers to the CPU decoded data, and associated status flags. The SPDIFRX also offers a signal named spdif_frame_sync, which toggles at the S/PDIF sub-frame rate that will be used to compute the exact sample rate for clock drift algorithms. 3.43 Single wire protocol master interface (SWPMI) The single wire protocol master interface (SWPMI) is the master interface corresponding to the contactless frontend (CLF) defined in the ETSI TS 102 613 technical specification. The main features are: • • • • full-duplex communication mode automatic SWP bus state management (active, suspend, resume) configurable bit rate up to 2 Mbit/s automatic SOF, EOF and CRC handling SWPMI can be served by the DMA controller. 3.44 Management data input/output (MDIO) slaves The devices embed an MDIO slave interface it includes the following features: DS13139 - Rev 7 page 32/231 STM32H7B3xI SD/SDIO/MMC card host interfaces (SDMMC) 3.45 • 32 MDIO register addresses, each of which is managed using separate input and output data registers: • • – 32 x 16-bit firmware read/write, MDIO read-only output data registers – 32 x 16-bit firmware read-only, MDIO write-only input data registers Configurable slave (port) address Independently maskable interrupts/events: • – MDIO register write – MDIO register read – MDIO protocol error Able to operate in and wake up from STOP mode SD/SDIO/MMC card host interfaces (SDMMC) Two SDMMC host interfaces are available. They support MultiMediaCard System Specification version 4.51 in three different databus modes: 1 bit (default), 4 bits and 8 bits. One of the SDMMC interface can be supplied through a separate VDDMMC supply. If required, it can thus operate at a different voltage level than all other I/Os. Both interfaces support the SD memory card specifications version 4.1. and the SDIO card specification version 4.0. in two different databus modes: 1 bit (default) and 4 bits. Each SDMMC host interface supports only one SD/SDIO/MMC card at any one time and a stack of MMC Version 4.51 or previous. The SDMMC host interface embeds a dedicated DMA controller allowing high-speed transfers between the interface and the SRAM. 3.46 Controller area network (FDCAN1, FDCAN2) The controller area network (CAN) subsystem consists of two CAN modules, a shared message RAM memory and a clock calibration unit. Both CAN modules (FDCAN1 and FDCAN2) are compliant with ISO 11898-1 (CAN protocol specification version 2.0 part A, B) and CAN FD protocol specification version 1.0. FDCAN1 supports time triggered CAN (TTCAN) specified in ISO 11898-4, including event synchronized time-triggered communication, global system time, and clock drift compensation. FDCAN1 contains additional registers, specific to the time triggered feature. The CAN FD option can be used together with event-triggered and time-triggered CAN communication. A 10 Kbyte message RAM memory implements filters, receive FIFOs, receive buffers, transmit event FIFOs, transmit buffers (and triggers for TTCAN). This message RAM is shared between the two FDCAN1 and FDCAN2 modules. The common clock calibration unit is optional. It can be used to generate a calibrated clock for both FDCAN1 and FDCAN2 from the HSI internal RC oscillator and the PLL, by evaluating CAN messages received by the FDCAN1. 3.47 Universal serial bus on-the-go high-speed (OTG_HS) The devices embed an USB OTG high-speed (up to 480 Mbit/s) device/host/OTG peripheral that supports both full-speed and high-speed operations. It integrates the transceivers for full-speed operation (12 Mbit/s) and a UTMI low-pin interface (ULPI) for high-speed operation (480 Mbit/s). When using the USB OTG_HS interface in HS mode, an external PHY device connected to the ULPI is required. The USB OTG_HS peripheral is compliant with the USB 2.0 specification and with the OTG 2.0 specification. It features software-configurable endpoint setting and supports suspend/resume. The USB OTG_HS controller requires a dedicated 48 MHz clock that is generated by a PLL connected to the HSE oscillator. DS13139 - Rev 7 page 33/231 STM32H7B3xI High-definition multimedia interface (HDMI) - consumer electronics control (CEC) The main features are: • • • • • • • • • Combined Rx and Tx FIFO size of 4 Kbytes with dynamic FIFO sizing Supports the session request protocol (SRP) and host negotiation protocol (HNP) 8 bidirectional endpoints 16 host channels with periodic OUT support Software configurable to OTG1.3 and OTG2.0 modes of operation USB 2.0 LPM (Link Power Management) support Battery Charging Specification Revision 1.2 support Internal FS OTG PHY support External HS or HS OTG operation supporting ULPI in SDR mode The OTG PHY is connected to the microcontroller ULPI port through 12 signals. It can be clocked using the 60 MHz output. • • • 3.48 Internal USB DMA HNP/SNP/IP inside (no need for any external resistor) For OTG/Host modes, a power switch is needed in case bus-powered devices are connected High-definition multimedia interface (HDMI) - consumer electronics control (CEC) The device embeds a HDMI-CEC controller that provides hardware support for the consumer electronics control (CEC) protocol (supplement 1 to the HDMI standard). This protocol provides high-level control functions between all audiovisual products in an environment. It is specified to operate at low speeds with minimum processing and memory overhead. It has a clock domain independent from the CPU clock, allowing the HDMI-CEC controller to wake up the MCU from Stop mode on data reception. 3.49 Debug infrastructure The devices offer a comprehensive set of debug and trace features to support software development and system integration. • • • • • • • • Breakpoint debugging Code execution tracing Software instrumentation JTAG debug port Serial-wire debug port Trigger input and output Serial-wire trace port Trace port • Arm® CoreSight™ debug and trace components The debug can be controlled via a JTAG/Serial-wire debug access port, using industry standard debugging tools. The trace port performs data capture for logging and analysis. DS13139 - Rev 7 page 34/231 STM32H7B3xI Memory mapping 4 Memory mapping Refer to the product line reference manual (RM0455) for details on the memory mapping as well as the boundary addresses for all peripherals. DS13139 - Rev 7 page 35/231 STM32H7B3xI Pin descriptions 5 Pin descriptions 1. DS13139 - Rev 7 PC12 PC11 PC10 PA15 PA14 51 50 49 PB5 57 52 PB6 58 53 PB7 59 54 BOOT0 60 PB4 PB8 61 PB3 PD2 PB9 62 55 VSS 63 56 VDD 64 Figure 4. LQFP64 (STM32H7B3xI without SMPS) pinout VBAT 1 48 VDD PC13 2 47 VSS PC14-OSC32_IN 3 46 VCAP PC15-OSC32_OUT 4 45 PA13 PH0-OSC_IN 5 44 PA12 PH1-OSC_OUT 6 43 PA11 NRST 7 42 PA10 PC0 8 41 PA9 PC1 9 40 PA8 PC2 10 39 PC9 PC3 11 38 PC7 VSSA 12 37 PC6 VDDA 13 36 PB15 PA0 14 35 PB14 PA1 15 34 PB13 PA2 16 33 PB12 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 PA3 VSS VDD PA4 PA5 PA6 PA7 PC4 PC5 PB0 PB1 PB2 PB10 VCAP VSS VDD LQFP64 The above figure shows the package top view. page 36/231 STM32H7B3xI Pin descriptions VDD33USB PA15 PA14 PC10 PC11 PC12 PD0 PD1 PD2 PD3 PD4 PD5 VDD PB3 PB4 PB5 PB6 PB7 BOOT0 PB8 PB9 VSS PE0 VDDLDO VDD Figure 5. LQFP100 (STM32H7B3xI with SMPS) pinout 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 1. 2. DS13139 - Rev 7 VDD VDDLDO VSS VCAP PA13 PA12 PA11 PA10 PA9 PA8 PC9 PC8 PC7 PC6 PD15 PD14 VDD VSS PD13 PD12 PD11 PD10 PD9 PD8 PB15 PB14 PB13 PB12 VDD VDDLDO VSS VCAP PB11 PB10 PE8 PE7 PB2 PB1 PB0 PC5 PC4 PA7 PA6 PA5 PA4 VDD PA1 VDD VSS VSSA VREF+ VDDA PA0 VSS NRST PC0 PC1 PC2_C PC3_C 75 74 73 72 71 70 69 68 67 66 65 64 LQFP100 63 62 61 60 59 58 57 56 55 54 53 52 51 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 PA3 VLXSMPS VDDSMPS VFBSMPS PH0-OSC_IN PH1-OSC_OUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 PA2 PE2 PE4 PE5 VDD VBAT PC13 PC14-OSC32_ON PC15-OSC32_OUT VSSMPS The above figure shows the package top view. The devices with SMPS correspond to commercial code STM32H7B3VIT6Q. page 37/231 STM32H7B3xI Pin descriptions PA15 PA14 PC10 PC11 PC12 PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 PB3 PB4 PB5 PB6 PB7 BOOT0 PB8 PB9 PE0 PE1 VSS VDD Figure 6. LQFP100 (STM32H7B3xI without SMPS) pinout 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 1. DS13139 - Rev 7 VDD VSS VCAP PA13 PA12 PA11 PA10 PA9 PA8 PC9 PC8 PC7 PC6 PD15 PD14 PD13 PD12 PD11 PD10 PD9 PD8 PB15 PB14 PB13 PB12 VDD VSS VCAP PB11 PB10 PE15 PE14 PE13 PE12 PE11 PE10 PE9 PE8 PE7 PB2 PB1 PB0 PC5 PC4 PA7 PA6 PA5 PA4 75 74 73 72 71 70 69 68 67 66 65 64 LQFP100 63 62 61 60 59 58 57 56 55 54 53 52 51 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 VSS NRST PC0 PC1 PC2_C PC3_C VSSA VREF+ VDDA PA0 PA1 PA2 PA3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 VDD PE2 PE3 PE4 PE5 PE6 VBAT PC13 PC14-OSC32_ON PC15-OSC32_OUT VSS VDD PH0-OSC_IN PH1-OSC_OUT The above figure shows the package top view. page 38/231 STM32H7B3xI Pin descriptions Figure 7. TFBGA100 (STM32H7B3xI with SMPS) pinout A B C 1 2 3 4 5 6 7 8 9 10 PE6 PE5 PE2 PB8 BOOT0 PB5 PD6 PD3 PD2 PC12 PE3 PE0 PB7 PB3 PD4 PD1 PC11 PC10 PE4 PE1 PB4 PD7 PD0 PA15 PA14 PA13 PC15PC14OSC32_ OSC32_IN OUT VSS VBAT D VSSSMPS VLXSMPS PDR_ON PB6 VSS VDD PD5 VCAP PA12 PA11 E VDDSMPS VFBSMPS PB9 PC13 VDD VDDLDO VSS VDD33 USB PA9 PA10 F PC1 NRST PC0 PC2_C VSS VDD VDD50 USB PC6 PC9 PA8 G PH0OSC_IN PH1OSC_OUT PA0 PC3_C PA3 VCAP PD14 PD15 PC7 PC8 H VDDA VSSA PA2 PC4 PE7 PE10 PD11 PD9 PD12 PD13 J VREF+ PA1 PA6 PC5 PB2 PE8 PB11 PB13 PD8 PD10 K PA4 PA5 PA7 PB0 PB1 PE9 PB10 PB12 PB14 PB15 1. 2. The above figure shows the package top view. The devices with SMPS correspond to commercial code STM32H7B3VIH6Q. Figure 8. TFBGA100 (STM32H7B3xI without SMPS) pinout 1 2 3 4 5 6 7 8 9 10 A PC14OSC32_IN PC13 PE2 PB9 PB7 PB4 PB3 PA15 PA14 PA13 B PC15OSC32_ OUT VBAT PE3 PB8 PB6 PD5 PD2 PC11 PC10 PA12 C PH0OSC_IN VSS PE4 PE1 PB5 PD6 PD3 PC12 PA9 PA11 D PH1OSC_OUT VDD PE5 PE0 BOOT0 PD7 PD4 PD0 PA8 PA10 E NRST PC2_C PE6 VSS VSS VSS VCAP PD1 PC9 PC7 F PC0 PC1 PC3_C VDD VDD VDD33 USB PDR_ON VCAP PC8 PC6 G VSSA PA0 PA4 PC4 PB2 PE10 PE14 PD15 PD11 PB15 H VDDA PA1 PA5 PC5 PE7 PE11 PE15 PD14 PD10 PB14 J VSS PA2 PA6 PB0 PE8 PE12 PB10 PB13 PD9 PD13 K VDD PA3 PA7 PB1 PE9 PE13 PB11 PB12 PD8 PD12 1. DS13139 - Rev 7 The above figure shows the package top view. page 39/231 STM32H7B3xI Pin descriptions Figure 9. WLCSP132 (STM32H7B3xI with SMPS) ballout A B 2 3 4 5 6 7 8 9 10 11 VSS VDD PC10 PD3 VSS PG10 VDD PB3 BOOT0 VCAP VDDLDO VDD VSS VDD PC14OSC32_ IN VDDLDO VSS PC12 PD4 VDD MMC PG11 VSS VDDMMC PB8 C PA12 VCAP PA15 PD0 PD5 PG12 PG14 PB6 PE1 PE6 PC15OSC32_ OUT D PA11 PA10 PA13 PC11 PD2 PG9 PG13 PB7 PDR_ON PE5 VBAT 12 VSS VSSSMPS E PC7 PC9 PA8 PA14 PD1 PD7 PB4 PB9 PE3 PC13 F VDD33 USB VDD50 USB PC6 PA9 PB10 PD6 PB5 PE0 PE4 NRST VSS G VDD VSS PD12 PD11 PE15 PE10 PA6 PA1 PC3 PC0 PH0OSC_IN VFBSMPS VLXSMPS VDD VDDSMPS H PD15 PD13 PD8 PB15 PE14 PE8 PC4 PA2 VSS VDD PC1 PH1OSC_OUT J PD14 PD9 PB14 PB11 PE11 PE9 PB1 PC5 PA3 VDDA VREF+ PC2 K PD10 PB13 VDDLDO VSS PE12 VSS PF14 PB0 PA7 PA4 PA0 VSSA L VDD PB12 VDD VCAP PE13 VDD PE7 PB2 VSS VDD PA5 VSS 1. DS13139 - Rev 7 1 The above figure shows the package top view. page 40/231 STM32H7B3xI Pin descriptions 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 VDD VDDLDO PDR_ON VSS VCAP PE1 PE0 PB9 PB8 BOOT0 PB7 PB6 PB5 PB4 PB3 VDD VSS PG14 PG13 PG12 PG11 PG10 PG9 PD7 PD6 VDDMMC VSS PD5 PD4 PD3 PD2 PD1 PD0 PC12 PC11 PC10 Figure 10. LQFP144 (STM32H7B3xI with SMPS) pinout 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 LQFP144 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 PA15 PA14 VDD VDDLDO VSS VCAP PA13 PA12 PA11 PA10 PA9 PA8 PC9 PC8 PC7 PC6 VDD VDD33USB VDD50USB VSS PG8 PG7 PG6 PD15 PD14 PD13 PD12 PD11 VSS VDD PD10 PD9 PD8 PB15 PB14 PB13 PA0 PA1 PA2 PA3 VSS VDD PA4 PA5 PA6 PA7 PC4 PC5 PB0 PB1 PB2 PF11 PF14 PF15 VSS VDD PE7 PE8 PE9 PE10 PE11 PE12 PE13 PE14 PE15 PB10 PB11 VCAP VSS VDDLDO VDD PB12 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 PE2 PE3 PE4 PE5 PE6 VSS VDD VBAT PC13 PC14-OSC32_IN PC15-OSC32_OUT VSS VDD VSSSMPS VLXSMPS VDDSMPS VFBSMPS VSS VDD PF6 PF7 PF8 PF9 PF10 PH0-OSC_IN PH1-OSC_OUT NRST PC0 PC1 PC2_C PC3_C VDD VSS VSSA VREF+ VDDA 1. 2. DS13139 - Rev 7 The above figure shows the package top view. The devices with SMPS correspond to commercial code STM32H7B3ZIT6Q. page 41/231 STM32H7B3xI Pin descriptions 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 VDD PDR_ON PE1 PE0 PB9 PB8 BOOT0 PB7 PB6 PB5 PB4 PB3 PG15 VDD VSS PG14 PG13 PG12 PG11 PG10 PG9 PD7 PD6 VDDMMC VSS PD5 PD4 PD3 PD2 PD1 PD0 PC12 PC11 PC10 PA15 PA14 Figure 11. LQFP144 (STM32H7B3xI without SMPS) pinout 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 LQPF144 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 VDD VSS VCAP PA13 PA12 PA11 PA10 PA9 PA8 PC9 PC8 PC7 PC6 VDD33USB VSS PG8 PG7 PG6 PG5 PG4 PG3 PG2 PD15 PD14 VDD VSS PD13 PD12 PD11 PD10 PD9 PD8 PB15 PB14 PB13 PB12 PA3 VSS VDD PA4 PA5 PA6 PA7 PC4 PC5 PB0 PB1 PB2 PF11 PF12 VSS VDD PF13 PF14 PF15 PG0 PG1 PE7 PE8 PE9 VSS VDD PE10 PE11 PE12 PE13 PE14 PE15 PB10 PB11 VCAP VDD 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 PE2 PE3 PE4 PE5 PE6 VBAT PC13 PC14-OSC32_IN PC15-OSC32_OUT PF0 PF1 PF2 PF3 PF4 PF5 VSS VDD PF6 PF7 PF8 PF9 PF10 PH0-OSC_IN PH1-OSC_OUT NRST PC0 PC1 PC2_C PC3_C VDD VSSA VREF+ VDDA PA0 PA1 PA2 1. DS13139 - Rev 7 The above figure shows the package top view. page 42/231 STM32H7B3xI Pin descriptions 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 VDD VDDLDO PDR_ON VSS VCAP PE1 PE0 PB9 PB8 BOOT0 PB7 PB6 PB5 PB4 PB3 PG15 VDD VSS PG14 PG13 PG12 PG11 PG10 PG9 VDDMMC VSS PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 PC12 PC11 PC10 PA15 PA14 VSS VDD VDDLDO VSS VCAP Figure 12. LQFP176 (STM32H7B3xI with SMPS) pinout 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 LQFP176 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 PA13 PA12 PA11 PA10 PA9 PA8 VDD PC9 PC8 PC7 PC6 VDD33USB VDD50USB VSS PG8 PG7 PG6 PG5 PG4 VDD VSS PG3 PG2 PK2 PK1 PK0 VSS VDD PJ11 PJ10 PJ9 PJ8 VSS VDD PD15 PD14 PD13 PD12 PD11 VSS VDD PD10 PD9 PD8 VSS PA3 VSS VDD PA4 PA5 PA6 PA7 PC4 PC5 PB0 PB1 PB2 PF11 PF12 PF13 PF14 PF15 PG0 VSS VDD PG1 PE7 PE8 PE9 VSS VDD PE10 PE11 PE12 PE13 PE14 PE15 PB10 PB11 VCAP VSS VDDLDO VSS VDD PB12 PB13 PB14 PB15 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 PE2 PE3 PE4 PE5 PE6 VSS VDD VBAT PC13 PC14-OSC32_IN PC15-OSC32_OUT VSS VDD VSSSMPS VLXSMPS VDDSMPS VFBSMPS PF0 PF1 PF2 PF3 PF4 PF5 VSS VDD PF6 PF7 PF8 PF9 PF10 PH0-OSC_IN PH1-OSC_OUT NRST PC0 PC1 PC2_C PC3_C VSSA VREF+ VDDA PA0 PA1 PA2 VDD 1. 2. DS13139 - Rev 7 The above figure shows the package top view. The devices with SMPS correspond to commercial code STM32H7B3IIT6Q. page 43/231 STM32H7B3xI Pin descriptions 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 PI7 PI6 PI5 PI4 VDD PDR_ON PE1 PE0 PB9 PB8 BOOT0 PB7 PB6 PB5 PB4 PB3 PG15 VDD VSS PG14 PG13 PG12 PG11 PG10 PG9 PD7 PD6 VDDMMC VSS PD5 PD4 PD3 PD2 PD1 PD0 PC12 PC11 PC10 PA15 PA14 VDD VSS PI3 PI2 Figure 13. LQFP176 (STM32H7B3xI without SMPS) pinout 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 LQFP176 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 PI1 PI0 PH15 PH14 PH13 VDD VSS VCAP PA13 PA12 PA11 PA10 PA9 PA8 PC9 PC8 PC7 PC6 VDD33USB VSS PG8 PG7 PG6 PG5 PG4 PG3 PG2 PD15 PD14 VDD VSS PD13 PD12 PD11 PD10 PD9 PD8 PB15 PB14 PB13 PB12 VDD VSS PH12 PH4 PH5 PA3 VSS VDD PA4 PA5 PA6 PA7 PC4 PC5 PB0 PB1 PB2 PF11 PF12 VSS VDD PF13 PF14 PF15 PG0 PG1 PE7 PE8 PE9 VSS VDD PE10 PE11 PE12 PE13 PE14 PE15 PB10 PB11 VCAP VDD PH6 PH7 PH8 PH9 PH10 PH11 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 PE2 PE3 PE4 PE5 PE6 VBAT PI8 PC13 PC14-OSC32_IN PC15-OSC32_OUT PI9 PI10 PI11 VSS VDD PF0 PF1 PF2 PF3 PF4 PF5 VSS VDD PF6 PF7 PF8 PF9 PF10 PH0-OSC_IN PH1-OSC_OUT NRST PC0 PC1 PC2_C PC3_C VDD VSSA VREF+ VDDA PA0 PA1 PA2 PH2 PH3 1. DS13139 - Rev 7 The above figure shows the package top view. page 44/231 STM32H7B3xI Pin descriptions Figure 14. TFBGA216 (STM32H7B3xI without SMPS) ballout 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 A PE4 PE3 PE2 PG14 PE1 PE0 PB8 PB5 PB4 PB3 PD7 PC12 PA15 PA14 B PE5 PE6 PG13 PB9 PB7 PB6 PG15 PG11 PJ13 PJ12 PD6 PD0 PC11 PC10 PA12 C VBAT PI8 PI4 PK7 PK6 PK5 PG12 PG10 PJ14 PD5 PD3 PD1 PI3 PI2 PA11 PC13 PF0 PI5 PI7 PI10 PI6 PK4 PK3 PG9 PJ15 PD4 PD2 PH15 PI1 PA10 PF1 PI12 PI9 PDR _ON BOOT0 VDD VDD VDD MMC VDD VCAP PH13 PH14 PI0 PA9 VSS PI11 VDD VDD VSS VSS VSS VSS VSS VDD PK1 PK2 PC9 PA8 PF2 PI13 PI15 VDD VSS VSS VDD33 USB PJ11 PK0 PC8 PC7 PF3 PI14 PH4 VDD VSS VSS VDD PJ8 PJ10 PG8 PC6 VSS VDD PJ7 PJ9 PG7 PG6 D E F G H PC14OSC32_ IN PC15OSC32_ OUT PH0OSC_ IN PH1OSC_ OUT PA13 J NRST PF4 PH5 PH3 VDD VSS K PF7 PF6 PF5 PH2 VDD VSS VSS VSS VSS VSS VDD PJ6 PD15 PB13 PD10 L PF10 PF9 PF8 PC3_C VSS VSS VDD VDD VDD VDD VCAP PD14 PB12 PD9 PD8 M VSSA PC0 PC1 PC2_C PB2 PF12 PG1 PF15 PJ4 PD12 PD13 PG3 PG2 PJ5 PH12 N VREF− PA1 PA0 PA4 PC4 PF13 PG0 PJ3 PE8 PD11 PG5 PG4 PH7 PH9 PH11 P VREF+ PA2 PA6 PA5 PC5 PF14 PJ2 PF11 PE9 PE11 PE14 PB10 PH6 PH8 PH10 R VDDA PA3 PA7 PB1 PB0 PJ0 PJ1 PE7 PE10 PE12 PE15 PE13 PB11 PB14 PB15 1. DS13139 - Rev 7 The above figure shows the package top view. page 45/231 STM32H7B3xI Pin descriptions Figure 15. TFBGA225 (STM32H7B3xI with SMPS) ballout 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 A VSS PI4 PB9 PB6 PG15 PK5 PG14 PG10 PG9 PD7 PD4 PD1 PC10 PI3 VSS B PE3 PI5 PE0 PB8 PB4 PK6 PK3 PG11 PJ15 PD6 PD2 PC12 PA14 PH15 PH14 PE4 PI6 PE1 BOOT0 PB3 PK4 PG12 PJ14 PD5 PD0 PA15 PI0 PA12 PA11 C D PI8 PC14OSC32_IN PC15OSC32_ OUT PE5 PI7 PK7 PG13 PJ13 PD3 PC11 PI2 PH13 VSS VDD50 USB VCAP PB5 VDD MMC PJ12 VDDLDO PI1 PA13 PA10 PC9 PC7 VDDLDO VSS VDD VSS VDD VSS VCAP PA9 PC8 PC6 PG8 PI11 VDD VDD VSS VDD VDD PA8 PG7 PG6 PG5 PG3 PG4 PG2 PK2 PK1 PDR_ON E VSS VBAT PI9 PE6 PE2 F VLX SMPS VFB SMPS PI10 PC13 G VDD SMPS VSS SMPS PF1 PF0 PB7 H PF2 PI12 PF4 PI14 PI13 VSS VSS VSS VSS VSS VDD33 USB J PF3 PF5 PF6 PF7 PC2 VDD VDD VSS VDD VDD PJ11 PK0 PJ10 PJ9 PJ8 PF8 PF9 NRST VREF− VSSA VSS VDD VSS VDD VSS PD13 PD14 PD15 PJ6 PJ7 PC0 VREF+ VDDA PA4 PB1 VCAP PE12 VDDLDO PH12 PD8 PD10 PD11 PD12 K PH0OSC_IN L PH1OSC_OUT VSS PC1 PF10 PH2 PH4 PC4 PI15 PF13 PE7 PE13 PH6 PH10 PB13 PB14 PB15 N PC2_C PC3_C PC3 PH3 PA5 PC5 PJ0 PF11 PF15 PE14 PE10 PJ5 PH9 PB12 PD9 P PA0 PA1 PA0_C PH5 PA6 PB0 PJ1 PJ4 PF14 PG1 PE9 PE15 PB11 PH8 PH11 R VSS PA2 PA1_C PA3 PA7 PB2 PJ2 PJ3 PF12 PG0 PE8 PE11 PB10 PH7 VSS M 1. The above figure shows the package top view. Figure 16. UFBGA169 (STM32H7B3xI with SMPS) ballout 1 2 3 4 5 A PE4 PE2 VDD VCAP PB6 B PC15OSC32_ OUT PE3 VSS VDDLDO PB8 C PC14OSC32_IN PE6 PE5 PDR_ON PB9 VSS PC13 PE1 D VDD 6 7 8 9 10 11 12 13 VDDMMC VDD PG10 PD5 VDD PC12 PC10 PH14 PB4 VSS PG11 PD6 VSS PC11 PA14 PH13 PB5 PG14 PG9 PD4 PD1 PA15 VSS VDD PE0 PB7 PG13 PD7 PD3 PD0 PA13 VDDLDO VCAP PG15 PG12 PD2 PA10 PA9 PA8 PA12 PB3 PG4 PC6 PC7 PC9 PC8 PA11 E VLXSMPS VSSSMPS VBAT PF1 PF3 BOOT0 F VDDSMPS VFBSMPS PF0 PF2 PF5 PF7 VSS PF4 PF6 PF9 NRST PF13 PE7 PG6 PG7 PG8 PF10 PF8 PC2 PA4 PF14 PE8 PG2 PG3 PG5 VSS VDD G VDD PH1OSC_OUT VDD50USB VDD33USB H PH0OSC_IN J PC0 PC1 VSSA PC3 PA0 PA7 PF15 PE9 PE14 PD11 PD13 PD15 PD14 K PC3_C PC2_C PA0_C PA1 PA6 PC4 PG0 PE13 PH10 PH12 PD9 PD10 PD12 L VDDA VREF+ PA1_C PA5 PB1 PB2 PG1 PE12 PB10 PH11 PB13 VSS VDD M VDD VSS PH3 VSS PB0 PF11 VSS PE10 PB11 VDDLDO VSS PD8 PB15 N PA2 PH2 PA3 VDD PC5 PF12 VDD PE11 PE15 VCAP VDD PB12 PB14 1. DS13139 - Rev 7 The above figure shows the package top view. page 46/231 STM32H7B3xI Pin descriptions Figure 17. UFBGA176+25 (STM32H7B3xI with SMPS) ballout 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 PA14 VDDLDO VCAP VSS A VSS PB8 VDDLDO VCAP PB6 PB3 PG11 PG9 PD3 PD1 PA15 B PE4 PE3 PB9 PE0 PB7 PB4 PG13 PD7 PD5 PD2 PC12 PH14 PA13 PA8 PA12 C PC13 VSS PE2 PE1 BOOT0 PB5 PG14 PG10 PD4 PD0 PC11 PC10 PH13 PA10 PA11 PC14OSC32_IN PE5 PDR_ON VDD MMC VSS PG15 PG12 PD6 VSS VDD PH15 PA9 PC8 PC7 VDD PC9 PC6 VDD50 USB D PC15OSC32_ OUT E VSS VBAT PE6 VDD F VLX SMPS VSS SMPS PF1 PF0 VSS VSS VSS VSS VSS VSS VDD33 USB PG6 PG5 G VDD SMPS VFB SMPS PF2 VDD VSS VSS VSS VSS VSS PG8 PG7 PG4 PG2 H PF6 PF4 PF5 PF3 VSS VSS VSS VSS VSS VDD PG3 PD14 PD13 J PH0OSC_IN PF8 PF7 PF9 VSS VSS VSS VSS VSS PD15 PD11 VSS PD12 K PH1OSC_ OUT VSS PF10 VDD VSS VSS VSS VSS VSS VSS PD9 PB15 PB14 L NRST PC0 PC1 VREF− VDD PD10 PD8 PB13 M PC2 PC3 VREF+ VDDA VDD VSS PC5 PB1 VDD VSS PH7 PE14 PH11 PH9 PB12 N PC2_C PC3_C VSSA PH2 PA3 PA7 PF11 PE8 PG1 PF15 PF13 PB10 PH8 PH10 PH12 P PA0 PA1 PA1_C PH4 PA4 PA5 PB2 PG0 PE7 PB11 PF12 PE12 PE13 PE15 PH6 R VSS PA2 PA0_C PH3 PH5 PC4 PA6 PB0 PE10 PF14 PE9 PE11 VCAP VDDLDO VSS 1. 2. DS13139 - Rev 7 The above figure shows the package top view. The devices with SMPS correspond to commercial code STM32H7B3IIK6Q. page 47/231 STM32H7B3xI Pin descriptions Figure 18. UFBGA176+25 (STM32H7B3xI without SMPS) ballout 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PB4 PB3 PD7 PC12 PA15 PA14 15 A PE3 PE2 PE1 PE0 PB8 PB5 PG14 PG13 B PE4 PE5 PE6 PB9 PB7 PB6 PG15 PG12 PG11 PG10 PD6 PD0 PC11 PC10 PA12 C VBAT PI7 PI6 PI5 VDD PDR_ON VDD VDD MMC VDD PG9 PD5 PD1 PI3 PI2 PA11 D PC13 PI8 PI9 PI4 VSS BOOT0 VSS VSS VSS PD4 PD3 PD2 PH15 PI1 PA10 E PC14OSC32_ IN PF0 PI10 PI11 PH13 PH14 PI0 PA9 F PC15OSC32_ OUT VSS VDD PH2 VSS VSS VSS VSS VSS VSS VCAP PC9 PA8 G PH0OSC_IN VSS VDD PH3 VSS VSS VSS VSS VSS VSS VDD PC8 PC7 H PH1OSC_ OUT PF2 PF1 PH4 VSS VSS VSS VSS VSS VSS VDD33 USB PG8 PC6 J NRST PF3 PF4 PH5 VSS VSS VSS VSS VSS VDD VDD PG7 PG6 K PF7 PF6 PF5 VDD VSS VSS VSS VSS VSS PH12 PG5 PG4 PG3 L PF10 PF9 PF8 VSS PH11 PH10 PD15 PG2 M VSSA PC0 PC1 PC2_C PC3_C PB2 PG1 VSS VSS VCAP PH6 PH8 PH9 PD14 PD13 VREF− PA1 PA0 PA4 PC4 PF13 PG0 VDD VDD VDD PE13 PH7 PD12 PD11 PD10 P VREF+ PA2 PA6 PA5 PC5 PF12 PF15 PE8 PE9 PE11 PE14 PB12 PB13 PD9 PD8 R VDDA PA3 PA7 PB1 PB0 PF11 PF14 PE7 PE10 PE12 PE15 PB10 PB11 PB14 PB15 N 1. PA13 The above figure shows the package top view. Table 6. Legend/abbreviations used in the pinout table Name Pin name Pin type I/O structure Abbreviation Definition Unless otherwise specified in brackets below the pin name, the pin function during and after reset is the same as the actual pin name S Supply pin I Input only pin I/O Input / output pin ANA Analog-only Input FT 5 V tolerant I/O TT 3.3 V tolerant I/O B Dedicated BOOT0 pin RST Bidirectional reset pin with embedded weak pull-up resistor Option for TT and FT I/Os _f DS13139 - Rev 7 I2C FM+ option page 48/231 STM32H7B3xI Pin descriptions Name I/O structure Abbreviation Definition _a analog option (supplied by VDDA) _u USB option (supplied by VDD33USB) _h0 (1) High-speed low voltage (mainly SDMMC2 on VDDMMC power rail) _h1(1) High-speed low voltage (mainly for OCTOSPI) _h2(1) High-speed low voltage (mainly for FMC) _h3(1) High-speed low voltage _s Secondary supply (supplied by VDDMMC) (2) Unless otherwise specified by a note, all I/Os are set as floating inputs during and after reset. Notes Pin functions Alternate functions Functions selected through GPIOx_AFR registers Additional functions Functions directly selected/enabled through peripheral registers 1. Refer to SYSCFG_CCCSR register in the device reference manual for how to set a group of I/Os in High-speed low-voltage mode. Depending on the chosen I/Os (for example OCTOSPI), it can belong to several groups of I/Os and several HSLVx bits need to be set (refer to Table Pin/ball definition). Take care that the VDDIO_HSLV and/or VDDMMC_HSLV option bits must also be set. 2. Refer to the table Features and peripheral counts for the list of packages featuring a VDDMMC separate supply pad. Table 7. STM32H7B3xI pin/ball definition TFBGA216 LQFP176 UFBGA176+25 LQFP144 LQFP100 TFBGA100 LQFP64 TFBGA225 with SMPS LQFP176 with SMPS UFBGA176+25 with SMPS UFBGA169 with SMPS WLCSP132 with SMPS LQFP144 with SMPS TFBGA100 with SMPS LQFP100 with SMPS Pin/ball name(1) (2) Pin name (function after reset) Pin I/O type structure Alternate functions Additional functions - 1 A3 1 - A2 C3 1 E5 - A3 1 1 A2 1 A3 PE2 I/O FT_h2 TRACECLK, SAI1_CK1, SPI4_SCK, SAI1_MCLK_A, OCTOSPIM_P1_IO2, USART10_RX, FMC_A23, EVENTOUT - B3 2 E9 B2 B2 2 B1 - B3 2 2 A1 2 A2 PE3 I/O FT_h2 TRACED0, TIM15_BKIN, SAI1_SD_B, USART10_TX, FMC_A19, EVENTOUT - FT_h2 TRACED1, SAI1_D2, DFSDM1_DATIN3, TIM15_CH1N, SPI4_NSS, SAI1_FS_A, FMC_A20, DCMI_D4/PSSI_D4, LCD_B0, EVENTOUT - 2 C3 3 DS13139 - Rev 7 F9 A1 B1 3 C2 - C3 3 3 B1 3 A1 PE4 I/O page 49/231 STM32H7B3xI Pin descriptions 3 - A2 4 A1 5 D10 C3 D3 4 D3 - D3 4 4 B2 4 TFBGA216 LQFP176 UFBGA176+25 LQFP144 LQFP100 TFBGA100 LQFP64 TFBGA225 with SMPS LQFP176 with SMPS UFBGA176+25 with SMPS UFBGA169 with SMPS WLCSP132 with SMPS LQFP144 with SMPS TFBGA100 with SMPS LQFP100 with SMPS Pin/ball name(1) (2) B1 C10 C2 E3 5 E4 - E3 5 5 B3 5 B2 Pin name (function after reset) PE5 Pin I/O type structure I/O Alternate functions Additional functions FT_h2 TRACED2, SAI1_CK2, DFSDM1_CKIN3, TIM15_CH1, SPI4_MISO, SAI1_SCK_A, FMC_A21, DCMI_D6/ PSSI_D6, LCD_G0, EVENTOUT - - PE6 I/O FT_h2 TRACED3, TIM1_BKIN2, SAI1_D1, TIM15_CH2, SPI4_MOSI, SAI1_SD_A, SAI2_MCK_B, TIM1_BKIN2_COMP12, FMC_A22, DCMI_D7/ PSSI_D7, LCD_G1, EVENTOUT - - 6 - B3 A1 6 F6 - - - - D5 - G6 VSS S - - - 4 E5 7 B11 A3 - 7 F7 - - - - C5 - F5 VDD S - - - 5 C2 8 D11 E3 E2 8 E2 1 B2 6 6 C1 6 C1 VBAT S - - - - C1 - - D2 A15 - A15 - - - - - - - VSS S - - - - - - - - - - C1 - - - - D2 7 C2 PI8 I/O FT EVENTOUT TAMP_IN2/ TAMP_OUT3, RTC_OUT2, WKUP4 6 E4 9 E10 D3 C1 9 F4 2 A2 7 7 D1 8 D1 PC13 I/O FT EVENTOUT TAMP_IN1/ TAMP_OUT2/ TAMP_OUT3, RTC_OUT1/ RTC_TS, WKUP3 - - - C12 - C2 - A1 - - - - F7 - - VSS S - - - 7 B1 10 B12 C1 D2 10 D1 3 A1 8 8 E1 9 E1 PC14OSC32_IN (OSC32_IN) I/O FT EVENTOUT OSC32_IN 8 B2 11 C11 B1 D1 11 D2 4 B1 9 9 F1 10 F1 PC15OSC32_OUT (OSC32_OUT) I/O FT EVENTOUT OSC32_OUT - - - - - - - - E3 - - - - D3 11 E4 PI9 I/O FT_h2 OCTOSPIM_P2_IO0, UART4_RX, FDCAN1_RX, FMC_D30, LCD_VSYNC, EVENTOUT - - - - - - - F3 - - - - E3 12 D5 PI10 I/O FT_h2 OCTOSPIM_P2_IO1, FMC_D31, PSSI_D14, LCD_HSYNC, EVENTOUT - - - - - - - - G5 - - - - E4 13 F3 PI11 I/O FT OCTOSPIM_P2_IO2, LCD_G6, OTG_HS_ULPI_DIR, PSSI_D15, EVENTOUT WKUP5 - - 12 - - D10 12 E1 - - - - F2 14 F2 VSS S - - - - D6 13 G12 D1 D11 13 G6 - - - - F3 15 F4 VDD S - - - 9 D1 14 D12 E2 F2 14 G2 - - - - - - - VSSSMPS S - - - 10 D2 15 E12 E1 F1 15 F1 - - - - - - - VLXSMPS S - - - DS13139 - Rev 7 page 50/231 STM32H7B3xI Pin descriptions LQFP100 with SMPS TFBGA100 with SMPS LQFP144 with SMPS WLCSP132 with SMPS UFBGA169 with SMPS UFBGA176+25 with SMPS LQFP176 with SMPS TFBGA225 with SMPS LQFP64 TFBGA100 LQFP100 LQFP144 UFBGA176+25 LQFP176 TFBGA216 Pin/ball name(1) (2) Pin name (function after reset) 11 E1 16 F12 F1 G1 16 G1 - - - - - - - VDDSMPS S - 12 E2 17 E11 F2 G2 17 F2 - - - - - - - VFBSMPS S - - - Pin I/O type structure Alternate functions Additional functions - - - - - - F3 F4 18 G4 - - - 10 E2 16 D2 PF0 I/O FT_f I2C2_SDA, OCTOSPIM_P2_IO0, FMC_A0, EVENTOUT - - - - E4 F3 19 G3 - - - 11 H3 17 E2 PF1 I/O FT_f I2C2_SCL, OCTOSPIM_P2_IO1, FMC_A1, EVENTOUT - - - - - F4 G3 20 H1 - - - 12 H2 18 G2 PF2 I/O FT_h2 I2C2_SMBA, OCTOSPIM_P2_IO2, FMC_A2, EVENTOUT - - - - - - - - H2 - - - - - - E3 PI12 I/O FT_h1 OCTOSPIM_P2_IO3, LCD_HSYNC, EVENTOUT - - - - - - - - H5 - - - - - - G3 PI13 I/O FT_h1 OCTOSPIM_P2_CLK, LCD_VSYNC, EVENTOUT - - - - - - - - H4 - - - - - - H3 PI14 I/O FT_h1 OCTOSPIM_P2_NCLK, LCD_CLK, EVENTOUT - - - - - E5 H4 21 J1 - - - 13 J2 19 H2 PF3 I/O FT_h2 OCTOSPIM_P2_IO3, FMC_A3, EVENTOUT - - - - - G3 H2 22 H3 - - - 14 J3 20 J2 PF4 I/O FT_h2 OCTOSPIM_P2_CLK, FMC_A4, EVENTOUT - - - - - F5 H3 23 J2 - - - 15 K3 21 K3 PF5 I/O FT_h2 OCTOSPIM_P2_NCLK, FMC_A5, EVENTOUT - - F5 18 F11 B7 E1 24 H6 - C2 10 16 G2 22 H6 VSS S - - - - F6 19 - A7 E4 25 J6 - D2 11 17 G3 23 H5 VDD S - - - FT_h1 TIM16_CH1, SPI5_NSS, SAI1_SD_B, UART7_Rx, OCTOSPIM_P1_IO3, EVENTOUT - FT_h1 TIM17_CH1, SPI5_SCK, SAI1_MCLK_B, UART7_Tx, OCTOSPIM_P1_IO2, EVENTOUT - FT_h1 TIM16_CH1N, SPI5_MISO, SAI1_SCK_B, UART7_RTS, TIM13_CH1, OCTOSPIM_P1_IO0, EVENTOUT - - - - - - - - - 20 21 22 - - - G4 F6 H4 H1 J3 J2 26 27 28 J3 J4 K1 - - - - - - - - - 18 19 20 K2 K1 L3 24 25 26 K2 K1 L3 PF6 PF7 PF8 I/O I/O I/O - - 23 - G5 J4 29 K2 - - - 21 L2 27 L2 PF9 I/O FT_h1 TIM17_CH1N, SPI5_MOSI, SAI1_FS_B, UART7_CTS, TIM14_CH1, OCTOSPIM_P1_IO1, EVENTOUT - - 24 - H3 K3 30 M3 - - - 22 L1 28 L1 PF10 I/O FT_h1 TIM16_BKIN, SAI1_D3, PSSI_D15, OCTOSPIM_P1_CLK, DCMI_D11/PSSI_D11, LCD_DE, EVENTOUT DS13139 - Rev 7 page 51/231 STM32H7B3xI Pin descriptions LQFP100 with SMPS TFBGA100 with SMPS LQFP144 with SMPS WLCSP132 with SMPS UFBGA169 with SMPS UFBGA176+25 with SMPS LQFP176 with SMPS TFBGA225 with SMPS LQFP64 TFBGA100 LQFP100 LQFP144 UFBGA176+25 LQFP176 TFBGA216 Pin/ball name(1) (2) 13 G1 25 G11 H1 J1 31 L1 5 C1 12 23 G1 29 G1 PH0OSC_IN(PH0) I/O FT EVENTOUT OSC_IN 14 G2 26 H12 H2 K1 32 L2 6 D1 13 24 H1 30 H1 PH1OSC_OUT (PH1) I/O FT EVENTOUT OSC_OUT 15 F2 27 F10 G6 L1 33 K3 7 E1 14 25 J1 31 J1 NRST I/O RST - - FT_a DFSDM1_CKIN0, DFSDM1_DATIN4, SAI2_FS_B, FMC_A25, OTG_HS_ULPI_STP, LCD_G2, FMC_SDNWE, LCD_R5, EVENTOUT ADC12_INP10 FT_ah0 TRACED0, SAI1_D1, DFSDM1_DATIN0, DFSDM1_CKIN4, SPI2_MOSI/I2S2_SDO, SAI1_SD_A, SDMMC2_CK, OCTOSPIM_P1_IO4, MDIOS_MDC, LCD_G5, EVENTOUT ADC12_INP11, ADC12_INN10, TAMP_IN3, WKUP6 ADC12_INP12, ADC12_INN11 16 17 F3 F1 - - 18(4) F4(4) - - 28 29 - 30 (4) - 19(4) G4(4) 31(4) 20 G10 H11 J12 - J1 J2 L2 L3 H5 M1 (3) (3) K2 N1 (3) (3) G9 J4(3) M2(3) - K1(3) N2(3) H10 G1 E12 - 32 21 - 33 H9 G2 22 H2 34 K12 J3 34 35 - 36(4) - L3 M2 J5 (3) N1 (3) N3(3) 37(4) N2(3) 8 9 10 - F1 F2 - 15 16 - 26 27 - M2 M3 - 32 33 - M2 M3 - E2(4) 17(4) 28(4) M4(4) 34(4) M4(4) 11 - - F3(4) - - - - - - 18(4) 29(4) M5(4) 35(4) - 30 K4 36 Pin name (function after reset) PC0 PC1 Pin I/O type structure I/O I/O Alternate functions Additional functions PC2 I/O FT_a PWR_CSTOP, DFSDM1_CKIN1, SPI2_MISO/I2S2_SDI, DFSDM1_CKOUT, OCTOSPIM_P1_IO2, OTG_HS_ULPI_DIR, OCTOSPIM_P1_IO5, FMC_SDNE0, EVENTOUT PC2_C ANA TT_a - ADC2_INP0, ADC2_INN1 ADC12_INP13, ADC12_INN12 - PC3 I/O FT_a PWR_CSLEEP, DFSDM1_DATIN1, SPI2_MOSI/I2S2_SDO, OCTOSPIM_P1_IO0, OTG_HS_ULPI_NXT, OCTOSPIM_P1_IO6, FMC_SDCKE0, EVENTOUT L4(4) PC3_C ANA TT_a - ADC2_INP1 J5 VDD S - - - K7 F6 - R1 - - - - - - J6 VSS S - - N3 38 K5 12 G1 19 31 M1 37 M1 VSSA S - - - - - - - L4 - K4 - - - - N1 - N1 VREF- S - - 23 J1 35 J11 L2 M3 39 L4 - - 20 32 P1 38 P1 VREF+ S - - 24 H1 36 J10 L1 M4 40 L5 13 H1 21 33 R1 39 R1 VDDA S - - I/O TIM2_CH1/TIM2_ETR, TIM5_CH1, TIM8_ETR, TIM15_BKIN, SPI6_NSS/I2S6_WS, USART2_CTS/ USART2_NSS, UART4_TX, SDMMC2_CMD, SAI2_SD_B, EVENTOUT ADC1_INP16, WKUP1 25 G3 37 DS13139 - Rev 7 K11 J5(3) P1(3) 41 P1(3) 14 G2 22 34 N3 40 N3 PA0 FT_a page 52/231 STM32H7B3xI Pin descriptions LQFP100 with SMPS TFBGA100 with SMPS LQFP144 with SMPS WLCSP132 with SMPS UFBGA169 with SMPS UFBGA176+25 with SMPS LQFP176 with SMPS TFBGA225 with SMPS LQFP64 TFBGA100 LQFP100 LQFP144 UFBGA176+25 LQFP176 TFBGA216 Pin/ball name(1) (2) Pin name (function after reset) - - - - K3(3) R3(3) - P3(3) - - - - - - - PA0_C Pin I/O type structure ANA Alternate functions Additional functions TT_a - ADC1_INP0, ADC1_INN1 ADC1_INP17, ADC1_INN16 26 J2 38 G8 K4(3) P2(3) 42 P2(3) 15 H2 23 35 N2 41 N2 PA1 I/O FT_ah1 TIM2_CH2, TIM5_CH2, LPTIM3_OUT, TIM15_CH1N, USART2_RTS, UART4_RX, OCTOSPIM_P1_IO3, SAI2_MCK_B, OCTOSPIM_P1_DQS, LCD_R2, EVENTOUT - - - - L3(3) P3(3) - R3(3) - - - - - - - PA1_C ANA TT_a - ADC1_INP1 FT_a TIM2_CH3, TIM5_CH3, TIM15_CH1, DFSDM2_CKIN1, USART2_TX, SAI2_SCK_B, MDIOS_MDIO, LCD_R1, EVENTOUT ADC1_INP14, WKUP2 - 27 H3 39 H8 N1 R2 43 R2 16 J2 24 36 P2 42 P2 PA2 I/O - - - - N2 N4 - M4 - - - - F4 43 K4 PH2 I/O FT_h2 LPTIM1_IN2, OCTOSPIM_P1_IO4, SAI2_SCK_B, FMC_SDCKE0, LCD_R0, EVENTOUT - - - - M1 G4 44 J7 - - - - - - - VDD S - - - - - - L12 M2 F7 45 M1 - J1 - - F6 - K6 VSS S - - - - - - - - M3 R4 - N4 - - - - G4 44 J4 PH3 I/O FT_ah2 OCTOSPIM_P1_IO5, SAI2_MCK_B, FMC_SDNE0, LCD_R1, EVENTOUT - - - - - P4 - M5 - - - - H4 45 H4 PH4 I/O FT_fa I2C2_SCL, LCD_G5, OTG_HS_ULPI_NXT, PSSI_D14, LCD_G4, EVENTOUT - - - - - - R5 - P4 - - - - J4 46 J3 PH5 I/O FT_fa I2C2_SDA, SPI5_NSS, FMC_SDNWE, EVENTOUT - ADC1_INP15 28 G5 40 J9 N3 29 - 41 - 30 - 42 - 31 K1 43 DS13139 - Rev 7 K10 N5 46 M4 F8 N4 H12 H6 P5 R4 17 K2 25 37 R2 47 47 K6 18 E6 26 38 L4 48 48 G7 19 K1 27 39 - 49 49 L6 20 G3 28 40 N4 50 PA3 I/O FT_ah1 TIM2_CH4, TIM5_CH4, OCTOSPIM_P1_CLK, TIM15_CH2, I2S6_MCK, USART2_RX, LCD_B2, OTG_HS_ULPI_D0, LCD_B5, EVENTOUT L5 VSS S - - - K5 VDD S - - - TT_a TIM5_ETR, SPI1_NSS/I2S1_WS, SPI3_NSS/I2S3_WS, USART2_CK, SPI6_NSS/I2S6_WS, DCMI_HSYNC/ PSSI_DE, LCD_VSYNC, EVENTOUT ADC1_INP18, DAC1_OUT1 R2 N4 PA4 I/O page 53/231 STM32H7B3xI Pin descriptions 32 33 34 35 K2 J3 K3 H4 44 45 46 47 L11 G7 K9 H7 L4 K5 J6 K6 P6 R7 N6 R6 50 51 52 53 N5 P5 R5 M6 21 22 23 24 H3 J3 K3 G4 29 30 31 32 41 42 43 44 P4 P3 R3 N5 51 52 53 54 TFBGA216 LQFP176 UFBGA176+25 LQFP144 LQFP100 TFBGA100 LQFP64 TFBGA225 with SMPS LQFP176 with SMPS UFBGA176+25 with SMPS UFBGA169 with SMPS WLCSP132 with SMPS LQFP144 with SMPS TFBGA100 with SMPS LQFP100 with SMPS Pin/ball name(1) (2) P4 P3 R3 N5 Pin name (function after reset) PA5 PA6 PA7 PC4 Pin I/O type structure I/O I/O I/O I/O Alternate functions Additional functions TT_ah0 PWR_NDSTOP2, TIM2_CH1/TIM2_ETR, TIM8_CH1N, SPI1_SCK/I2S1_CK, SPI6_SCK/I2S6_CK, OTG_HS_ULPI_CK, PSSI_D14, LCD_R4, EVENTOUT ADC1_INP19, ADC1_INN18, DAC1_OUT2 TT_ah1 TIM1_BKIN, TIM3_CH1, TIM8_BKIN, SPI1_MISO/I2S1_SDI, OCTOSPIM_P1_IO3, SPI6_MISO/I2S6_SDI, TIM13_CH1, TIM8_BKIN_COMP12, MDIOS_MDC, TIM1_BKIN_COMP12, DCMI_PIXCLK/ PSSI_PDCK, LCD_G2, EVENTOUT ADC12_INP3, DAC2_OUT1 FT_ah1 TIM1_CH1N, TIM3_CH2, TIM8_CH1N, DFSDM2_DATIN1, SPI1_MOSI/I2S1_SDO, SPI6_MOSI/I2S6_SDO, TIM14_CH1, OCTOSPIM_P1_IO2, FMC_SDNWE, LCD_VSYNC, EVENTOUT ADC12_INP7, ADC12_INN3, OPAMP1_VINM FT_a DFSDM1_CKIN2, I2S1_MCK, SPDIFRX1_IN2, FMC_SDNE0, LCD_R7, EVENTOUT ADC12_INP4, OPAMP1_VOUT, COMP1_INM ADC12_INP8, ADC12_INN4, OPAMP1_VINM 36 J4 48 J8 N5 M7 54 N6 25 H4 33 45 P5 55 P5 PC5 I/O FT_ah1 SAI1_D3, DFSDM1_DATIN2, PSSI_D15, SPDIFRX1_IN3, OCTOSPIM_P1_DQS, FMC_SDCKE0, COMP1_OUT, LCD_DE, EVENTOUT - - - L10 N7 K4 - - - - - - - - L7 VDD S - - - - - - L9 M7 F9 - - - - - - M9 - L6 VSS S - - - FT_ah0 TIM1_CH2N, TIM3_CH3, TIM8_CH2N, DFSDM2_CKOUT, DFSDM1_CKOUT, UART4_CTS, LCD_R3, OTG_HS_ULPI_D1, OCTOSPIM_P1_IO1, LCD_G1, EVENTOUT ADC12_INP9, ADC12_INN5, OPAMP1_VINP, COMP1_INP FT_ah0 TIM1_CH3N, TIM3_CH4, TIM8_CH3N, DFSDM1_DATIN1, LCD_R6, OTG_HS_ULPI_D2, OCTOSPIM_P1_IO0, LCD_G0, EVENTOUT ADC12_INP5, COMP1_INM 37 38 K4 K5 49 50 DS13139 - Rev 7 K8 J7 M5 L5 R8 M8 55 56 P6 L7 26 27 J4 K4 34 35 46 47 R5 R4 56 57 R5 R4 PB0 PB1 I/O I/O page 54/231 STM32H7B3xI Pin descriptions TFBGA216 LQFP176 UFBGA176+25 LQFP144 LQFP100 TFBGA100 LQFP64 TFBGA225 with SMPS LQFP176 with SMPS UFBGA176+25 with SMPS UFBGA169 with SMPS WLCSP132 with SMPS LQFP144 with SMPS TFBGA100 with SMPS LQFP100 with SMPS Pin/ball name(1) (2) Pin name (function after reset) Pin I/O type structure Alternate functions Additional functions COMP1_INP 39 J5 51 L8 L6 P7 57 R6 28 G5 36 48 M6 58 M5 PB2 I/O FT_ah1 RTC_OUT2, SAI1_D1, DFSDM1_CKIN1, SAI1_SD_A, SPI3_MOSI/I2S3_SDO, OCTOSPIM_P1_CLK, OCTOSPIM_P1_DQS, EVENTOUT - - - - - - - M7 - - - - - - G4 PI15 I/O FT LCD_G2, LCD_R0, EVENTOUT - - - - - - - - N7 - - - - - - R6 PJ0 I/O FT LCD_R7, LCD_R1, EVENTOUT - - - - - - - - P7 - - - - - - R7 PJ1 I/O FT_ah1 OCTOSPIM_P2_IO4, LCD_R2, EVENTOUT - - - - - - - - R7 - - - - - - P7 PJ2 I/O FT_ah1 OCTOSPIM_P2_IO5, LCD_R3, EVENTOUT - - - - - - - - R8 - - - - - - N8 PJ3 I/O FT UART9_RTS, LCD_R4, EVENTOUT - - - - - - - - P8 - - - - - - M9 PJ4 I/O FT UART9_CTS, LCD_R5, EVENTOUT - ADC1_INP2 - - 52 - M6 N7 58 N8 - - - 49 R6 59 P8 PF11 I/O FT_ah1 SPI5_MOSI, OCTOSPIM_P1_NCLK, SAI2_SD_B, FMC_SDNRAS, DCMI_D12/PSSI_D12, EVENTOUT - - - - N6 P11 59 R9 - - - 50 P6 60 M6 PF12 I/O FT_ah2 OCTOSPIM_P2_DQS, FMC_A6, EVENTOUT ADC1_INP6, ADC1_INN2 - - - - - F10 - K8 - - - 51 M8 61 K7 VSS S - - - - - - - - L12 - K9 - - - 52 N8 62 L8 VDD S - - - - - - - G7 N11 60 M8 - - - 53 N6 63 N6 PF13 I/O FT_ah2 DFSDM1_DATIN6, I2C4_SMBA, FMC_A7, EVENTOUT ADC2_INP2 - - 53 K7 H7 R10 61 P9 - - - 54 R7 64 P6 PF14 I/O FT_fah2 DFSDM1_CKIN6, I2C4_SCL, FMC_A8, EVENTOUT ADC2_INP6, ADC2_INN2 - - 54 - J7 N10 62 N9 - - - 55 P7 65 M8 PF15 I/O FT_fh2 I2C4_SDA, FMC_A9, EVENTOUT - - - - - K7 P8 63 R10 - - - 56 N7 66 N7 PG0 I/O FT_h2 OCTOSPIM_P2_IO4, UART9_RX, FMC_A10, EVENTOUT - - - 55 - - F12 64 - - - - - K8 - - VSS S - - - - - 56 - - M5 65 - - - - - N10 - - VDD S - - - FT_h2 OCTOSPIM_P2_IO5, UART9_TX, FMC_A11, EVENTOUT OPAMP2_VINM FT_ah2 TIM1_ETR, DFSDM1_DATIN2, UART7_Rx, OCTOSPIM_P1_IO4, FMC_D4/FMC_DA4, EVENTOUT OPAMP2_VOUT, COMP2_INM - 40 - H5 - 57 DS13139 - Rev 7 - L7 L7 G8 N9 P9 66 67 P10 M9 - - - H5 - 37 57 58 M7 R8 67 68 M7 R8 PG1 PE7 I/O I/O page 55/231 STM32H7B3xI Pin descriptions 41 J6 58 H6 H8 N8 68 R11 - J5 38 59 P8 69 TFBGA216 LQFP176 UFBGA176+25 LQFP144 LQFP100 TFBGA100 LQFP64 TFBGA225 with SMPS LQFP176 with SMPS UFBGA176+25 with SMPS UFBGA169 with SMPS WLCSP132 with SMPS LQFP144 with SMPS TFBGA100 with SMPS LQFP100 with SMPS Pin/ball name(1) (2) N9 Pin name (function after reset) PE8 Pin I/O type structure I/O Alternate functions Additional functions FT_ah2 TIM1_CH1N, DFSDM1_CKIN2, UART7_Tx, OCTOSPIM_P1_IO5, FMC_D5/FMC_DA5, COMP2_OUT, EVENTOUT OPAMP2_VINM OPAMP2_VINP, COMP2_INP - K6 59 J6 J8 R11 69 P11 - K5 39 60 P9 70 P9 PE9 I/O FT_ah2 TIM1_CH1, DFSDM1_CKOUT, UART7_RTS, OCTOSPIM_P1_IO6, FMC_D6/FMC_DA6, EVENTOUT - - - K6 M11 G6 70 K10 - - - 61 K9 71 K8 VSS S - - - - - - L6 N11 M9 71 J10 - - - 62 N9 72 L9 VDD S - - - FT_ah2 TIM1_CH2N, DFSDM1_DATIN4, UART7_CTS, OCTOSPIM_P1_IO7, FMC_D7/FMC_DA7, EVENTOUT COMP2_INM FT_ah2 TIM1_CH2, DFSDM1_CKIN4, SPI4_NSS, SAI2_SD_B, OCTOSPIM_P1_NCS, FMC_D8/FMC_DA8, LCD_G3, EVENTOUT COMP2_INP FT_h2 TIM1_CH3N, DFSDM1_DATIN5, SPI4_SCK, SAI2_SCK_B, FMC_D9/FMC_DA9, COMP1_OUT, LCD_B4, EVENTOUT - FT_h2 TIM1_CH3, DFSDM1_CKIN5, SPI4_MISO, SAI2_FS_B, FMC_D10/FMC_DA10, COMP2_OUT, LCD_DE, EVENTOUT - FT_h2 TIM1_CH4, SPI4_MOSI, SAI2_MCK_B, FMC_D11/FMC_DA11, LCD_CLK, EVENTOUT - FT_h2 TIM1_BKIN, USART10_CK, FMC_D12/FMC_DA12, TIM1_BKIN_COMP12, LCD_R7, EVENTOUT - FT_f TIM2_CH3, LPTIM2_IN1, I2C2_SCL, SPI2_SCK/I2S2_CK, DFSDM1_DATIN7, USART3_TX, OCTOSPIM_P1_NCS, OTG_HS_ULPI_D3, LCD_G4, EVENTOUT - - - - - - - 42 H6 - - - - - K7 60 61 62 63 64 65 66 DS13139 - Rev 7 G6 J5 K5 L5 H5 G5 F5 M8 N8 L8 K8 J9 N9 L9 R9 R12 P12 P13 M12 P14 N12 72 73 74 75 76 77 78 N11 R12 L9 M10 N10 P12 R13 - - - - - - 29 G6 H6 J6 K6 G7 H7 J7 40 41 42 43 44 45 46 63 64 65 66 67 68 69 R9 P10 R10 N11 P11 R11 R12 73 74 75 76 77 78 79 R9 P10 R10 R12 P11 R11 P12 PE10 PE11 PE12 PE13 PE14 PE15 PB10 I/O I/O I/O I/O I/O I/O I/O page 56/231 STM32H7B3xI Pin descriptions TFBGA216 LQFP176 UFBGA176+25 LQFP144 LQFP100 TFBGA100 LQFP64 TFBGA225 with SMPS LQFP176 with SMPS UFBGA176+25 with SMPS UFBGA169 with SMPS WLCSP132 with SMPS LQFP144 with SMPS TFBGA100 with SMPS LQFP100 with SMPS Pin/ball name(1) (2) Pin name (function after reset) Pin I/O type structure Alternate functions Additional functions - 43 J7 67 J4 M9 P10 79 P13 - K7 47 70 R13 80 R13 PB11 I/O FT_f TIM2_CH4, LPTIM2_ETR, I2C2_SDA, DFSDM1_CKIN7, USART3_RX, OTG_HS_ULPI_D4, LCD_G5, EVENTOUT 44 G6 68 L4 N10 R13 80 L8 30 F8 48 71 M10 81 L11 VCAP S - - - 45 D5 69 K4 - M10 81 - 31 - 49 - - - K9 VSS S - - - 46 E6 70 K3 M10 R14 82 L10 - - - - - - - VDDLDO S - - - 47 - 71 L1 - - - - 32 - 50 72 J12 82 L10 VDD S - - - - - - - - - - N12 - - - - - - M14 PJ5 I/O FT LCD_R6, EVENTOUT - - - - - - - P15 - M11 - - - - M11 83 P13 PH6 I/O FT TIM12_CH1, I2C2_SMBA, SPI5_SCK, FMC_SDNE1, DCMI_D8/PSSI_D8, EVENTOUT - - - - - M11 - R14 - - - - N12 84 N13 PH7 I/O FT_f I2C3_SCL, SPI5_MISO, FMC_SDCKE1, DCMI_D9/PSSI_D9, EVENTOUT - FT_fh2 TIM5_ETR, I2C3_SDA, FMC_D16, DCMI_HSYNC/ PSSI_DE, LCD_R2, EVENTOUT - FT_h2 TIM12_CH2, I2C3_SMBA, FMC_D17, DCMI_D0/ PSSI_D0, LCD_R3, EVENTOUT - - - - - - - - - - - - N13 M14 - - P14 N13 - - - - - - - - M12 M13 85 86 P14 N14 PH8 PH9 I/O I/O - - - - K9 N14 - M12 - - - - L13 87 P15 PH10 I/O FT_h2 TIM5_CH1, I2C4_SMBA, FMC_D18, DCMI_D1/ PSSI_D1, LCD_R4, EVENTOUT - - - - L10 M13 - P15 - - - - L12 88 N15 PH11 I/O FT_fh2 TIM5_CH2, I2C4_SCL, FMC_D19, DCMI_D2/ PSSI_D2, LCD_R5, EVENTOUT - - - - - K10 N15 - L11 - - - - K12 89 M15 PH12 I/O FT_fh2 TIM5_CH3, I2C4_SDA, FMC_D20, DCMI_D3/ PSSI_D3, LCD_R6, EVENTOUT - - E7 - - L12 G10 83 R15 - - - - H12 90 K10 VSS S - - - - - - L3 L13 - 84 - - - - - G13 91 K11 VDD S - - - FT_h1 TIM1_BKIN, OCTOSPIM_P1_NCLK, I2C2_SMBA, SPI2_NSS/I2S2_WS, DFSDM1_DATIN1, USART3_CK, FDCAN2_RX, OTG_HS_ULPI_D5, DFSDM2_DATIN1, TIM1_BKIN_COMP12, UART5_RX, EVENTOUT - 48 K8 72 DS13139 - Rev 7 L2 N12 M15 85 N14 33 K8 51 73 P12 92 L13 PB12 I/O page 57/231 STM32H7B3xI Pin descriptions 49 50 51 J8 K9 K10 73 74 75 K2 J3 H4 L11 N13 M13 L15 K15 K14 86 87 88 M13 M14 M15 34 35 36 J8 H10 G10 52 53 54 74 75 76 P13 R14 R15 93 94 95 TFBGA216 LQFP176 UFBGA176+25 LQFP144 LQFP100 TFBGA100 LQFP64 TFBGA225 with SMPS LQFP176 with SMPS UFBGA176+25 with SMPS UFBGA169 with SMPS WLCSP132 with SMPS LQFP144 with SMPS TFBGA100 with SMPS LQFP100 with SMPS Pin/ball name(1) (2) K14 R14 R15 Pin name (function after reset) PB13 PB14 PB15 Pin I/O type structure I/O I/O I/O Alternate functions Additional functions FT_h0 TIM1_CH1N, LPTIM2_OUT, DFSDM2_CKIN1, SPI2_SCK/I2S2_CK, DFSDM1_CKIN1, USART3_CTS/ USART3_NSS, FDCAN2_TX, OTG_HS_ULPI_D6, SDMMC1_D0, DCMI_D2/PSSI_D2, UART5_TX, EVENTOUT - FT_h0 TIM1_CH2N, TIM12_CH1, TIM8_CH2N, USART1_TX, SPI2_MISO/I2S2_SDI, DFSDM1_DATIN2, USART3_RTS, UART4_RTS, SDMMC2_D0, LCD_CLK, EVENTOUT - FT_h0 RTC_REFIN, TIM1_CH3N, TIM12_CH2, TIM8_CH3N, USART1_RX, SPI2_MOSI/I2S2_SDO, DFSDM1_CKIN2, UART4_CTS, SDMMC2_D1, LCD_G7, EVENTOUT - - 52 J9 76 H3 M12 L14 89 L12 - K9 55 77 P15 96 L15 PD8 I/O FT_h2 DFSDM1_CKIN3, USART3_TX, SPDIFRX1_IN1, FMC_D13/FMC_DA13, EVENTOUT 53 H8 77 J2 K11 K13 90 N15 - J9 56 78 P14 97 L14 PD9 I/O FT_h2 DFSDM1_DATIN3, USART3_RX, FMC_D14/FMC_DA14, EVENTOUT - 54 J10 78 K1 K12 L13 91 L13 - H9 57 79 N15 98 K15 PD10 I/O FT_h2 DFSDM1_CKOUT, DFSDM2_CKOUT, USART3_CK, FMC_D15/FMC_DA15, LCD_B3, EVENTOUT - - - 79 - - - 92 - - F4 - - - - - VDD S - - - - - 80 - - H6 93 - - - - - J10 - - VSS S - - - FT_h2 LPTIM2_IN2, I2C4_SMBA, USART3_CTS/ USART3_NSS, OCTOSPIM_P1_IO0, SAI2_SD_A, FMC_A16/ FMC_CLE, EVENTOUT - FT_fh2 LPTIM1_IN1, TIM4_CH1, LPTIM2_IN1, I2C4_SCL, USART3_RTS, OCTOSPIM_P1_IO1, SAI2_FS_A, FMC_A17/ FMC_ALE, DCMI_D12/ PSSI_D12, EVENTOUT - 55 56 H7 H9 81 82 DS13139 - Rev 7 G4 G3 J10 K13 J13 J15 94 95 L14 L15 - - G9 K10 58 59 80 81 N14 N13 99 100 N10 M10 PD11 PD12 I/O I/O page 58/231 STM32H7B3xI Pin descriptions TFBGA216 LQFP176 UFBGA176+25 LQFP144 LQFP100 TFBGA100 LQFP64 TFBGA225 with SMPS LQFP176 with SMPS UFBGA176+25 with SMPS UFBGA169 with SMPS WLCSP132 with SMPS LQFP144 with SMPS TFBGA100 with SMPS LQFP100 with SMPS Pin/ball name(1) (2) Pin name (function after reset) Pin I/O type structure Alternate functions Additional functions - 57 H10 83 H2 J11 H15 96 K11 - J10 60 82 M15 101 M11 PD13 I/O FT_fh2 LPTIM1_OUT, TIM4_CH2, I2C4_SDA, OCTOSPIM_P1_IO3, SAI2_SCK_A, UART9_RTS, FMC_A18, DCMI_D13/ PSSI_D13, EVENTOUT 58 - - - H12 R1 - H7 - - - 83 J9 102 J10 VSS S - - - 59 - - - H13 - - - - - - 84 J13 103 J11 VDD S - - - - 60 G7 84 J1 J13 H14 97 K12 - H8 61 85 M14 104 L12 PD14 I/O FT_h2 TIM4_CH3, UART8_CTS, UART9_RX, FMC_D0/ FMC_DA0, EVENTOUT 61 G8 85 H1 J12 J12 98 K13 - G8 62 86 L14 105 K13 PD15 I/O FT_h2 TIM4_CH4, UART8_RTS, UART9_TX, FMC_D1/ FMC_DA1, EVENTOUT - - - - - - - - K14 - - - - - - K12 PJ6 I/O FT TIM8_CH2, LCD_R7, EVENTOUT - - - - - - - - K15 - - - - - - J12 PJ7 I/O FT TRGIN, TIM8_CH2N, LCD_G0, EVENTOUT - - - - G1 - - 99 - - - - - - - - VDD S - - - - - - G2 - D6 100 H10 - - - - - - - VSS S - - - - - - - - - - 101 J15 - - - - - - H12 PJ8 I/O FT TIM1_CH3N, TIM8_CH1, UART8_TX, LCD_G1, EVENTOUT - - - - - - 102 J14 - - - - - - J13 PJ9 I/O FT TIM1_CH3, TIM8_CH1N, UART8_RX, LCD_G2, EVENTOUT - - - - - - - 103 J13 - - - - - - H13 PJ10 I/O FT TIM1_CH2N, TIM8_CH2, SPI5_MOSI, LCD_G3, EVENTOUT - - - - - - - 104 J11 - - - - - - G12 PJ11 I/O FT TIM1_CH2, TIM8_CH2N, SPI5_MISO, LCD_G4, EVENTOUT - - - - - - - 105 G9 - - - - - - H11 VDD S - - - - - - - - G7 106 H8 - - - - K10 - H10 VSS S - - - - - - - - - 107 J12 - - - - - - G13 PK0 I/O FT TIM1_CH1N, TIM8_CH3, SPI5_SCK, LCD_G5, EVENTOUT - - - - - - 108 H15 - - - - - - F12 PK1 I/O FT TIM1_CH1, TIM8_CH3N, SPI5_NSS, LCD_G6, EVENTOUT - - - - - - - - - 109 H14 - - - - - - F13 PK2 I/O FT TIM1_BKIN, TIM8_BKIN, TIM8_BKIN_COMP12, TIM1_BKIN_COMP12, LCD_G7, EVENTOUT - - - - H9 G15 110 H13 - - - 87 L15 106 M13 PG2 I/O FT_h2 TIM8_BKIN, TIM8_BKIN_COMP12, FMC_A12, EVENTOUT DS13139 - Rev 7 page 59/231 STM32H7B3xI Pin descriptions LQFP100 with SMPS TFBGA100 with SMPS LQFP144 with SMPS WLCSP132 with SMPS UFBGA169 with SMPS UFBGA176+25 with SMPS LQFP176 with SMPS TFBGA225 with SMPS LQFP64 TFBGA100 LQFP100 LQFP144 UFBGA176+25 LQFP176 TFBGA216 Pin/ball name(1) (2) Pin name (function after reset) - - - - H10 H13 111 G15 - - - 88 K15 107 M12 PG3 I/O FT_h2 TIM8_BKIN2, TIM8_BKIN2_COMP12, FMC_A13, EVENTOUT - - - - - C12 H10 112 J8 - - - - G10 - - VSS S - - - - - - - C13 - 113 J9 - - - - - - - VDD S - - - - Pin I/O type structure Alternate functions Additional functions - - - - F8 G14 114 H12 - - - 89 K14 108 N12 PG4 I/O FT_h2 TIM1_BKIN2, TIM1_BKIN2_COMP12, FMC_A14/FMC_BA0, EVENTOUT - - - - H11 F15 115 G14 - - - 90 K13 109 N11 PG5 I/O FT_h2 TIM1_ETR, FMC_A15/ FMC_BA1, EVENTOUT - FT_h2 TIM17_BKIN, OCTOSPIM_P1_NCS, FMC_NE3, DCMI_D12/ PSSI_D12, LCD_R7, EVENTOUT - FT_h2 SAI1_MCLK_A, USART6_CK, OCTOSPIM_P2_DQS, FMC_INT, DCMI_D13/ PSSI_D13, LCD_CLK, EVENTOUT - - - - - - 86 87 - - G9 G10 F14 G13 116 117 G13 G12 - - - - - - 91 92 J15 J14 110 111 J15 J14 PG6 PG7 I/O I/O - - 88 - G11 G12 118 F15 - - - 93 H14 112 H14 PG8 I/O FT_h2 TIM8_ETR, SPI6_NSS/I2S6_WS, USART6_RTS, SPDIFRX1_IN2, FMC_SDCLK, LCD_G7, EVENTOUT - - 89 - - J6 119 H9 - - - 94 H8 113 G10 VSS S - - - - F7 90 F2 G12 E15 120 D15 - - - - - - - VDD50USB S - - - - E8 91 F1 G13 F13 121 H11 - F6 - 95 H13 114 G11 VDD33USB S - - - - - 92 - - - - G10 - - - - - - - VDD S - - - FT_h0 TIM3_CH1, TIM8_CH1, DFSDM1_CKIN3, I2S2_MCK, USART6_TX, SDMMC1_D0DIR, FMC_NWAIT, SDMMC2_D6, SDMMC1_D6, DCMI_D0/PSSI_D0, LCD_HSYNC, EVENTOUT SWPMI_IO FT_h0 TRGIO, TIM3_CH2, TIM8_CH2, DFSDM1_DATIN3, I2S3_MCK, USART6_RX, SDMMC1_D123DIR, FMC_NE1, SDMMC2_D7, SWPMI_TX, SDMMC1_D7, DCMI_D1/PSSI_D1, LCD_G6, EVENTOUT - 62 63 F8 G9 93 94 DS13139 - Rev 7 F3 E1 F9 F10 E14 D15 122 123 F14 E15 37 38 F10 E10 63 64 96 97 H15 G15 115 116 H15 G15 PC6 PC7 I/O I/O page 60/231 STM32H7B3xI Pin descriptions 64 G10 95 - F12 D14 65 F9 96 E2 F11 E13 - - - - - - - - - - 66 67 68 69 F10 E9 E10 D10 97 98 99 100 E3 F4 D2 D1 E12 E11 E10 F13 124 F13 - F9 65 98 G14 117 TFBGA216 LQFP176 UFBGA176+25 LQFP144 LQFP100 TFBGA100 LQFP64 TFBGA225 with SMPS LQFP176 with SMPS UFBGA176+25 with SMPS UFBGA169 with SMPS WLCSP132 with SMPS LQFP144 with SMPS TFBGA100 with SMPS LQFP100 with SMPS Pin/ball name(1) (2) G14 VSS S - - - VDD S - - - FT_fh0 MCO1, TIM1_CH1, TIM8_BKIN2, I2C3_SCL, USART1_CK, OTG_HS_SOF, UART7_RX, TIM8_BKIN2_COMP12, LCD_B3, LCD_R6, EVENTOUT - FT_u TIM1_CH2, LPUART1_TX, I2C3_SMBA, SPI2_SCK/I2S2_CK, USART1_TX, DCMI_D0/PSSI_D0, LCD_R5, EVENTOUT OTG_HS_VBUS FT_u TIM1_CH3, LPUART1_RX, USART1_RX, OTG_HS_ID, MDIOS_MDIO, LCD_B4, DCMI_D1/ PSSI_D1, LCD_B1, EVENTOUT - FT_u TIM1_CH4, LPUART1_CTS, SPI2_NSS/I2S2_WS, UART4_RX, USART1_CTS/ USART1_NSS, FDCAN1_RX, LCD_R4, EVENTOUT OTG_HS_DM OTG_HS_DP F14 118 F14 J7 - D14 - - - - F10 - - 126 - - - - - - - D13 C14 C15 128 129 130 F12 E13 C15 41 42 43 C9 D10 C10 68 69 70 100 101 102 103 F15 E15 D15 C15 119 120 121 122 - - 99 67 - - 66 D9 FT_h0 TRACED1, TIM3_CH3, TIM8_CH3, USART6_CK, UART5_RTS, FMC_NE2/FMC_NCE, FMC_INT, SWPMI_RX, SDMMC1_D0, DCMI_D2/PSSI_D2, EVENTOUT FT_fh0 E9 40 Additional functions I/O 39 G11 I/O Alternate functions PC9 E14 127 PC8 Pin I/O type structure MCO2, TIM3_CH4, TIM8_CH4, I2C3_SDA, I2S_CKIN, UART5_CTS, OCTOSPIM_P1_IO0, LCD_G3, SWPMI_SUSPEND, SDMMC1_D1, DCMI_D3/PSSI_D3, LCD_B2, EVENTOUT 125 B14 Pin name (function after reset) F15 E15 D15 C15 PA8 PA9 PA10 PA11 I/O I/O I/O I/O 70 D9 101 C1 E13 B15 131 C14 44 B10 71 104 B15 123 B15 PA12 I/O FT_u TIM1_ETR, LPUART1_RTS, SPI2_SCK/I2S2_CK, UART4_TX, USART1_RTS, SAI2_FS_B, FDCAN1_TX, LCD_R5, EVENTOUT 71 C10 102 D3 D11 B13 132 E12 45 A10 72 105 A15 124 A15 PA13(JTMS/ SWDIO) I/O FT JTMS/SWDIO, EVENTOUT - 72 D8 103 C2 D13 A14 133 F11 46 E7 73 106 F13 125 E11 VCAP S - - - DS13139 - Rev 7 page 61/231 STM32H7B3xI Pin descriptions WLCSP132 with SMPS UFBGA169 with SMPS UFBGA176+25 with SMPS LQFP176 with SMPS TFBGA225 with SMPS LQFP64 TFBGA100 104 A1 B10 M6 134 F10 47 E5 74 - 105 B1 D12 A13 135 E10 - - 75 - 106 - A10 - 136 F9 48 F5 76 - - - - - - - - - - - - B13 C13 - D13 - - 107 F12 - - - 75 108 - - - - - - E12 TFBGA216 - 74 LQFP176 - UFBGA176+25 LQFP144 with SMPS - LQFP144 TFBGA100 with SMPS 73 LQFP100 LQFP100 with SMPS Pin/ball name(1) (2) Pin name (function after reset) 126 F10 VSS S - - - - - VDDLDO S - - - 127 F11 VDD S - - - - VDD33USB S - - - FT_h2 TIM8_CH1N, UART4_TX, FDCAN1_TX, FMC_D21, LCD_G2, EVENTOUT - - 128 E12 PH13 Pin I/O type structure I/O Alternate functions Additional functions - - - - A13 B12 - B15 - - - - E13 129 E13 PH14 I/O FT_h2 TIM8_CH2N, UART4_RX, FDCAN1_RX, FMC_D22, DCMI_D4/ PSSI_D4, LCD_G3, EVENTOUT - - - - - D12 - B14 - - - - D13 130 D13 PH15 I/O FT_h2 TIM8_CH3N, FMC_D23, DCMI_D11/ PSSI_D11, LCD_G4, EVENTOUT - - - - - - - - C13 - - - - E14 131 E14 PI0 I/O FT_h2 TIM5_CH4, SPI2_NSS/ I2S2_WS, FMC_D24, DCMI_D13/PSSI_D13, LCD_G5, EVENTOUT - - - - B2 - J9 - A15 - - - - G8 - - VSS S - - - FT_h2 TIM8_BKIN2, SPI2_SCK/I2S2_CK, TIM8_BKIN2_COMP12, FMC_D25, DCMI_D8/ PSSI_D8, LCD_G6, EVENTOUT - - - - - - - - - E11 - - - - D14 132 D14 PI1 I/O - - - - - - - D12 - - - - C14 133 C14 PI2 I/O FT_h2 TIM8_CH4, SPI2_MISO/I2S2_SDI, FMC_D26, DCMI_D9/ PSSI_D9, LCD_G7, EVENTOUT - - - - - - - A14 - - - - C13 134 C13 PI3 I/O FT_h2 TIM8_ETR, SPI2_MOSI/I2S2_SDO, FMC_D27, DCMI_D10/ PSSI_D10, EVENTOUT - - - - - - J10 137 F8 - - - - D9 135 F9 VSS S - - - - - - A2 - - - - - - - - C9 136 E10 VDD S - - - 77 C9 107 E4 B12 A12 138 B13 49 A9 76 109 A14 137 A14 PA14(JTCK/ SWCLK) I/O FT JTCK/SWCLK, EVENTOUT - FT JTDI, TIM2_CH1/ TIM2_ETR, HDMI_CEC, SPI1_NSS/I2S1_WS, SPI3_NSS/I2S3_WS, SPI6_NSS/I2S6_WS, UART4_RTS, LCD_R3, UART7_TX, LCD_B6, EVENTOUT - 78 C8 108 DS13139 - Rev 7 C3 C11 A11 139 C12 50 A8 77 110 A13 138 A13 PA15(JTDI) I/O page 62/231 STM32H7B3xI Pin descriptions 79 80 B10 B9 109 110 A3 D4 A12 B11 C12 C11 140 141 A13 D11 51 52 B9 B8 78 79 111 112 B14 B13 139 140 TFBGA216 LQFP176 UFBGA176+25 LQFP144 LQFP100 TFBGA100 LQFP64 TFBGA225 with SMPS LQFP176 with SMPS UFBGA176+25 with SMPS UFBGA169 with SMPS WLCSP132 with SMPS LQFP144 with SMPS TFBGA100 with SMPS LQFP100 with SMPS Pin/ball name(1) (2) B14 B13 Pin name (function after reset) PC10 PC11 Pin I/O type structure I/O I/O Alternate functions Additional functions FT_h0 DFSDM1_CKIN5, DFSDM2_CKIN0, SPI3_SCK/I2S3_CK, USART3_TX, UART4_TX, OCTOSPIM_P1_IO1, LCD_B1, SWPMI_RX, SDMMC1_D2, DCMI_D8/PSSI_D8, LCD_R2, EVENTOUT - FT_h0 DFSDM1_DATIN5, DFSDM2_DATIN0, SPI3_MISO/I2S3_SDI, USART3_RX, UART4_RX, OCTOSPIM_P1_NCS, SDMMC1_D3, DCMI_D4/PSSI_D4, LCD_B4, EVENTOUT - - 81 A10 111 B3 A11 B11 142 B12 53 C8 80 113 A12 141 A12 PC12 I/O FT_h0 TRACED3, TIM15_CH1, DFSDM2_CKOUT, SPI6_SCK/I2S6_CK, SPI3_MOSI/I2S3_SDO, USART3_CK, UART5_TX, SDMMC1_CK, DCMI_D9/PSSI_D9, LCD_R6, EVENTOUT - - - - - J14 - - - - - - G7 - - VSS S - - - - 82 C7 112 C4 D10 C10 143 C11 - D8 81 114 B12 142 B12 PD0 I/O FT_h2 DFSDM1_CKIN6, UART4_RX, FDCAN1_RX, UART9_CTS, FMC_D2/ FMC_DA2, LCD_B1, EVENTOUT 83 B8 113 E5 C10 A10 144 A12 - E8 82 115 C12 143 C12 PD1 I/O FT_h2 DFSDM1_DATIN6, UART4_TX, FDCAN1_TX, FMC_D3/ FMC_DA3, EVENTOUT - FT_h0 TRACED2, TIM3_ETR, TIM15_BKIN, UART5_RX, LCD_B7, SDMMC1_CMD, DCMI_D11/PSSI_D11, LCD_B2, EVENTOUT - - 84 A9 114 D5 E9 B10 145 B11 54 B7 83 116 D12 144 D12 PD2 I/O 85 A8 115 A4 D9 A9 146 D10 - C7 84 117 D11 145 C11 PD3 I/O FT_h2 DFSDM1_CKOUT, SPI2_SCK/I2S2_CK, USART2_CTS/ USART2_NSS, FMC_CLK, DCMI_D5/ PSSI_D5, LCD_G7, EVENTOUT 86 B7 116 B4 C9 C9 147 A11 - D7 85 118 D10 146 D11 PD4 I/O FT_h1 USART2_RTS, OCTOSPIM_P1_IO4, FMC_NOE, EVENTOUT - 87 D7 117 C5 A9 B9 148 C10 - B6 86 119 C11 147 C10 PD5 I/O FT_h1 USART2_TX, OCTOSPIM_P1_IO5, FMC_NWE, EVENTOUT - - - 118 - - K2 - - - - - 120 G9 148 F8 VSS S - - - - - 119 - - - - - - - - 121 - 149 - VDDMMC S - - - DS13139 - Rev 7 page 63/231 STM32H7B3xI Pin descriptions LQFP100 with SMPS TFBGA100 with SMPS LQFP144 with SMPS WLCSP132 with SMPS UFBGA169 with SMPS UFBGA176+25 with SMPS LQFP176 with SMPS TFBGA225 with SMPS LQFP64 TFBGA100 LQFP100 LQFP144 UFBGA176+25 LQFP176 TFBGA216 Pin/ball name(1) (2) Pin name (function after reset) 88 - - - - - - - - - - - - - - VDD - A7 120 F6 B9 D9 149 B10 - C6 87 122 B11 150 B11 PD6 Pin I/O type structure S I/O Alternate functions Additional functions - - - FT_sh3 SAI1_D1, DFSDM1_CKIN4, DFSDM1_DATIN1, SPI3_MOSI/I2S3_SDO, SAI1_SD_A, USART2_RX, OCTOSPIM_P1_IO6, SDMMC2_CK, FMC_NWAIT, DCMI_D10/PSSI_D10, LCD_B2, EVENTOUT - - - C6 121 E6 D8 B8 150 A10 - D6 88 123 A11 151 A11 PD7 I/O FT_sh3 DFSDM1_DATIN4, SPI1_MOSI/I2S1_SDO, DFSDM1_CKIN1, USART2_CK, SPDIFRX1_IN0, OCTOSPIM_P1_IO7, SDMMC2_CMD, FMC_NE1, EVENTOUT - - - - - - - E9 - - - - - - B10 PJ12 I/O FT TRGOUT, LCD_G3, LCD_B0, EVENTOUT - - - - - - - - D9 - - - - - - B9 PJ13 I/O FT LCD_B4, LCD_B1, EVENTOUT - - - - - - - - C9 - - - - - - C9 PJ14 I/O FT LCD_B2, EVENTOUT - - - - - - - - B9 - - - - - - D10 PJ15 I/O FT LCD_B3, EVENTOUT - - - - A5 - K6 151 - - - - - H7 - - VSS S - - - - - - B5 A6 D5 152 E8 - - - - C8 - E9 VDDMMC S - - - FT_sh3 SPI1_MISO/I2S1_SDI, USART6_RX, SPDIFRX1_IN3, OCTOSPIM_P1_IO6, SAI2_FS_B, SDMMC2_D0, FMC_NE2/FMC_NCE, DCMI_VSYNC/ PSSI_RDY, EVENTOUT - FT_sh3 OCTOSPIM_P2_IO6, SPI1_NSS/I2S1_WS, LCD_G3, SAI2_SD_B, SDMMC2_D1, FMC_NE3, DCMI_D2/ PSSI_D2, LCD_B2, EVENTOUT - FT_sh3 LPTIM1_IN2, SPI1_SCK/I2S1_CK, SPDIFRX1_IN0, OCTOSPIM_P2_IO7, SDMMC2_D2, USART10_RX, DCMI_D3/PSSI_D3, LCD_B3, EVENTOUT - - - - - - - 122 123 124 DS13139 - Rev 7 D6 A6 B6 C8 A8 B8 A8 C8 A7 153 154 155 A9 A8 B8 - - - - - - - - - 124 125 126 C10 B10 B9 152 153 154 D9 C8 B8 PG9 PG10 PG11 I/O I/O I/O page 64/231 STM32H7B3xI Pin descriptions - - - - 125 126 C6 D7 E8 D7 D8 B7 156 157 C8 D8 - - - - - - 127 128 B8 A8 155 156 TFBGA216 LQFP176 UFBGA176+25 LQFP144 LQFP100 TFBGA100 LQFP64 TFBGA225 with SMPS LQFP176 with SMPS UFBGA176+25 with SMPS UFBGA169 with SMPS WLCSP132 with SMPS LQFP144 with SMPS TFBGA100 with SMPS LQFP100 with SMPS Pin/ball name(1) (2) C7 B3 Pin name (function after reset) PG12 PG13 Pin I/O type structure I/O I/O Alternate functions Additional functions FT_sh3 LPTIM1_IN1, OCTOSPIM_P2_NCS, SPI6_MISO/I2S6_SDI, USART6_RTS, SPDIFRX1_IN1, LCD_B4, SDMMC2_D3, USART10_TX, FMC_NE4, LCD_B1, EVENTOUT - FT_sh3 TRACED0, LPTIM1_OUT, SPI6_SCK/I2S6_CK, USART6_CTS/ USART6_NSS, SDMMC2_D6, USART10_CTS/ USART10_NSS, FMC_A24, LCD_R0, EVENTOUT - - - - 127 C7 C7 C7 158 A7 - - - 129 A7 157 A4 PG14 I/O FT_sh3 TRACED1, LPTIM1_ETR, SPI6_MOSI/I2S6_SDO, USART6_TX, OCTOSPIM_P1_IO7, SDMMC2_D7, USART10_RTS, FMC_A25, LCD_B0, EVENTOUT - - - - - K7 159 - - - - 130 H6 158 F7 VSS S - - - - - - A7 - - 160 - - - - 131 C7 159 E8 VDD S - - - - - - - - - - B7 - - - - - - D8 PK3 I/O FT_h1 OCTOSPIM_P2_IO6, LCD_B4, EVENTOUT - - - - - - - C7 - - - - - - D7 PK4 I/O FT_h1 OCTOSPIM_P2_IO7, LCD_B5, EVENTOUT - - - - - - - - A6 - - - - - - C6 PK5 I/O FT_h1 OCTOSPIM_P2_NCS, LCD_B6, EVENTOUT - - - - - - - - B6 - - - - - - C5 PK6 I/O FT_h1 OCTOSPIM_P2_DQS, LCD_B7, EVENTOUT - - - - - - - - D7 - - - - - - C4 PK7 I/O FT LCD_DE, EVENTOUT - - - 128 B7 - K8 - G8 - - - - - - - VSS S - - - - - 129 - - - - - - - - - - - G5 VDD S - - - - - - B8 - - - - - - - - - - - VDDMMC - - - FT_h1 USART6_CTS/ USART6_NSS, OCTOSPIM_P2_DQS, USART10_CK, FMC_SDNCAS, DCMI_D13/PSSI_D13, EVENTOUT - FT_h0 JTDO/TRACESWO, TIM2_CH2, SPI1_SCK/I2S1_CK, SPI3_SCK/I2S3_CK, SPI6_SCK/I2S6_CK, SDMMC2_D2, CRS_SYNC, UART7_RX, EVENTOUT - - 89 - B6 - 130 DS13139 - Rev 7 - A8 E7 F7 D7 A6 161 162 A5 C6 - 55 - A7 - 89 132 133 B7 A10 160 161 B7 A10 PG15 PB3(JTDO/ TRACESWO) I/O I/O page 65/231 STM32H7B3xI Pin descriptions 90 91 92 C5 A6 D4 131 132 133 E7 F7 C8 B6 C6 A5 B6 C6 A5 163 164 165 B5 E7 A4 56 57 58 A6 C5 B5 90 91 92 134 135 136 A9 A6 B6 162 163 164 TFBGA216 LQFP176 UFBGA176+25 LQFP144 LQFP100 TFBGA100 LQFP64 TFBGA225 with SMPS LQFP176 with SMPS UFBGA176+25 with SMPS UFBGA169 with SMPS WLCSP132 with SMPS LQFP144 with SMPS TFBGA100 with SMPS LQFP100 with SMPS Pin/ball name(1) (2) A9 A8 B6 Pin name (function after reset) PB4(NJTRST) PB5 PB6 Pin I/O type structure I/O I/O I/O Alternate functions Additional functions FT_h0 NJTRST, TIM16_BKIN, TIM3_CH1, SPI1_MISO/I2S1_SDI, SPI3_MISO/I2S3_SDI, SPI2_NSS/I2S2_WS, SPI6_MISO/I2S6_SDI, SDMMC2_D3, UART7_TX, EVENTOUT - FT_h0 TIM17_BKIN, TIM3_CH2, I2C1_SMBA, SPI1_MOSI/I2S1_SDO, I2C4_SMBA, SPI3_MOSI/I2S3_SDO, SPI6_MOSI/I2S6_SDO, FDCAN2_RX, OTG_HS_ULPI_D7, LCD_B5, FMC_SDCKE1, DCMI_D10/PSSI_D10, UART5_RX, EVENTOUT - FT_f TIM16_CH1N, TIM4_CH1, I2C1_SCL, HDMI_CEC, I2C4_SCL, USART1_TX, LPUART1_TX, FDCAN2_TX, OCTOSPIM_P1_NCS, DFSDM1_DATIN5, FMC_SDNE1, DCMI_D5/PSSI_D5, UART5_TX, EVENTOUT - TIM17_CH1N, TIM4_CH2, I2C1_SDA, I2C4_SDA, USART1_RX, LPUART1_RX, DFSDM1_CKIN5, FMC_NL, DCMI_VSYNC/ PSSI_RDY, EVENTOUT PVD_IN 93 B5 134 D8 D6 B5 166 D6 59 A5 93 137 B5 165 B5 PB7 I/O FT_fa 94 A5 135 A9 E6 C5 167 C5 60 D5 94 138 D6 166 E6 BOOT0 I B - VPP FT_fsh3 TIM16_CH1, TIM4_CH3, DFSDM1_CKIN7, I2C1_SCL, I2C4_SCL, SDMMC1_CKIN, UART4_RX, FDCAN1_RX, SDMMC2_D4, SDMMC1_D4, DCMI_D6/PSSI_D6, LCD_B6, EVENTOUT - FT_fsh3 TIM17_CH1, TIM4_CH4, DFSDM1_DATIN7, I2C1_SDA, SPI2_NSS/ I2S2_WS, I2C4_SDA, SDMMC1_CDIR, UART4_TX, FDCAN1_TX, SDMMC2_D5, I2C4_SMBA, - 95 96 A4 E3 136 137 DS13139 - Rev 7 B9 E8 B5 C5 A2 B3 168 169 B4 A3 61 62 B4 A4 95 96 139 140 A5 B4 167 168 A7 B4 PB8 PB9 I/O I/O page 66/231 STM32H7B3xI Pin descriptions TFBGA216 LQFP176 UFBGA176+25 LQFP144 LQFP100 TFBGA100 LQFP64 TFBGA225 with SMPS LQFP176 with SMPS UFBGA176+25 with SMPS UFBGA169 with SMPS WLCSP132 with SMPS LQFP144 with SMPS TFBGA100 with SMPS LQFP100 with SMPS Pin/ball name(1) (2) Pin name (function after reset) Pin I/O type structure Alternate functions Additional functions SDMMC1_D5, DCMI_D7/PSSI_D7, LCD_B7, EVENTOUT 97 B4 138 F8 D5 B4 170 B3 - D4 97 141 A4 169 A6 PE0 I/O FT_h2 LPTIM1_ETR, TIM4_ETR, LPTIM2_ETR, UART8_RX, SAI2_MCK_A, FMC_NBL0, DCMI_D2/ PSSI_D2, LCD_R0, EVENTOUT - C4 139 C9 D4 C4 171 C4 - C4 98 142 A3 170 A5 PE1 I/O FT_h2 LPTIM1_IN2, UART8_TX, FMC_NBL1, DCMI_D3/ PSSI_D3, LCD_R6, EVENTOUT - - - - 140 A10 A4 A4 172 E6 - - - - - - - VCAP S - - - 98 - 141 B10 - K10 173 - 63 E4 99 - - - F6 VSS S - - - - D3 142 D9 C4 D4 174 D5 - F7 - 143 C6 171 E5 PDR_ON S - - - 99 - 143 A11 B4 A3 175 F5 - - - - - - - VDDLDO S - - - 100 - - - - - - - 64 - 100 144 - 172 E7 VDD S - - - FT_h2 TIM8_BKIN, SAI2_MCK_A, TIM8_BKIN_COMP12, FMC_NBL2, DCMI_D5/ PSSI_D5, LCD_B4, EVENTOUT - FT_h2 TIM8_CH1, SAI2_SCK_A, FMC_NBL3, DCMI_VSYNC/ PSSI_RDY, LCD_B5, EVENTOUT - - - - - - - - - - - - - - - - A2 B2 - - - - - - - - D4 C4 173 174 C3 D3 PI4 PI5 I/O I/O - - - - - - - C3 - - - - C3 175 D6 PI6 I/O FT_h2 TIM8_CH2, SAI2_SD_A, FMC_D28, DCMI_D6/ PSSI_D6, LCD_B6, EVENTOUT - - - - - - - D4 - - - - C2 176 D4 PI7 I/O FT_h2 TIM8_CH3, SAI2_FS_A, FMC_D29, DCMI_D7/PSSI_D7, LCD_B7, EVENTOUT - - - - - - K12 - - - - - - J6 - - VSS S - - - - - 144 A12 - - 176 - - - - - - - - VDD S - - - - - - - - G8 - - - - - - D7 - - VSS S - - - - - - - - G9 - - - - - - D8 - - VSS S - - - - - - - - H7 - - - - - - F8 - - VSS S - - - - - - - - H8 - - - - - - G12 - - VSS S - - - - - - - - - - - - - - - F9 - - VSS S - - - - - - - - H9 - - - - - - H9 - - VSS S - - - - - - - - J8 - - - - - - H10 - - VSS S - - - - - - - - K9 - - - - - - J7 - - VSS S - - - - - - - - R15 - - - - - - J8 - - VSS S - - - DS13139 - Rev 7 page 67/231 STM32H7B3xI Pin descriptions LQFP100 with SMPS TFBGA100 with SMPS LQFP144 with SMPS WLCSP132 with SMPS UFBGA169 with SMPS UFBGA176+25 with SMPS LQFP176 with SMPS TFBGA225 with SMPS LQFP64 TFBGA100 LQFP100 LQFP144 UFBGA176+25 LQFP176 TFBGA216 Pin/ball name(1) (2) Pin name (function after reset) - - - - - - - - - - - - G6 - - VSS S - - - - - - - - - - - - - - - K6 - - VSS S - - - - - - - - - - - - - - - K7 - - VSS S - - - Pin I/O type structure Alternate functions Additional functions 1. The devices with SMPS correspond to commercial code STM32H7B3xIxxQ. 2. A non-connected I/O in a given package is configured as an output tied to VSS. Any analog peripheral connected to such a pad (such as OPAMP, VREF+) must be disabled. 3. Pxy_C and Pxy pins/balls are two separate pads (analog switch open). The analog switch is configured through a SYSCFG register. Refer to the product reference manual for a detailed description of the switch configuration bits. 4. There is a direct path between Pxy_C and Pxy pins/balls, through an analog switch. Pxy alternate functions are available on Pxy_C when the analog switch is closed. The analog switch is configured through a SYSCFG register. Refer to the product reference manual for a detailed description of the switch configuration bits. DS13139 - Rev 7 page 68/231 DS13139 - Rev 7 Table 8. Port A alternate functions AF0 Port SYS AF1 LPTIM1/ TIM1/2/16/17 AF2 PDM_SAI1/ TIM3/4/5/12/15 AF3 DFSDM1/ LPTIM2/3/ LPUART1/ OCTOSPIM_P1/2/ TIM8 AF4 CEC/DCMI/ PSSI/ DFSDM1/2/ I2C1/2/3/4/ LPTIM2/ TIM15/ USART1 AF5 CEC/SPI1/ I2S1/SPI2/ I2S2/SPI3/ I2S3/ SPI4/5/ SPI6/I2S6 AF6 DFSDM1/2/ I2C4/ OCTOSPIM_P1/ SAI1/SPI3/I2S3/ UART4 AF7 SDMMC1/ SPI2/I2S2/ SPI3/I2S3/ SPI6/I2S6/ UART7/ USART1/2/3/6 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 FMC/LCD/ MDIOS/ SDMMC1/ TIM1/8 COMP/DCMI/ PSSI/LCD/ TIM1 LCD/UART5 SYS - - - EVENTOUT - - LCD_R2 EVENTOUT - MDIOS_MDIO - LCD_R1 EVENTOUT - - - LCD_B5 EVENTOUT - - DCMI_HSYNC/ PSSI_DE LPUART1/ SAI2/ SDMMC1/ SPDIFRX1/ SPI6/I2S6/ UART4/5/8 FDCAN1/2/FMC/ LCD/ OCTOSPIM_P1/2/ SDMMC2/ SPDIFRX1/ TIM13/14 CRS/FMC/LCD/ OCTOSPIM_P1/ OTG1_FS/OTG1_HS/ SAI2/SDMMC2/TIM8 DFSDM1/2/ I2C4/LCD/ MDIOS/ OCTOSPIM_P1/ SDMMC2/ SWPMI1/ TIM1/8/ UART7/9/ USART10 UART4_TX SDMMC2_CMD SAI2_SD_B - USART2_ PA0 TIM2_CH1/ - SPI6_NSS/ TIM5_CH1 TIM8_ETR TIM15_BKIN TIM2_ETR CTS/ - I2S6_WS USART2_ NSS USART2_ PA1 - TIM2_CH2 TIM5_CH2 LPTIM3_OUT TIM15_CH1N - - OCTOSPIM_ UART4_RX RTS PA2 - TIM2_CH3 TIM5_CH3 - TIM15_CH1 DFSDM2_ USART2_ CKIN1 TX - OCTOSPIM_ PA3 - TIM2_CH4 TIM5_CH4 PA4 - - TIM5_ETR - PWR_NDSTOP2 I2S6_MCK - TIM8_CH1N - TIM1_BKIN TIM8_BKIN - Port A DFSDM2_ PA7 - TIM1_CH1N USART2_ SPI6_NSS/ I2S3_WS CK I2S6_WS - - - SPI6_SCK/ TIM3_CH2 TIM8_CH1N DATIN1 P1_IO3 SPI1_MOSI/ I2S1_SDO - - - - MCO1 TIM1_CH1 - TIM8_BKIN2 I2C3_SCL SPI2_SCK/ - TIM1_CH2 - LPUART1_TX I2C3_SMBA SPI6_MISO/ I2S6_SDI TIM13_CH1 SPI6_MOSI/ I2S6_SDO TIM14_CH1 - - - TIM1_CH3 - LPUART1_RX - - TIM8_BKIN_COMP12 - PSSI_D14 TIM1_BKIN_ DCMI_PIXCLK/ COMP12 PSSI_PDCK OCTOSPIM_P1_IO2 - FMC_SDNWE EVENTOUT LCD_G2 EVENTOUT - LCD_VSYNC EVENTOUT LCD_B3 LCD_R6 EVENTOUT LCD_R5 EVENTOUT LCD_B1 EVENTOUT TIM8_BKIN2_ UART7_RX SOF COMP12 DCMI_D0/ - - - - - TX - LCD_R4 MDIOS_MDC OTG_HS_ PSSI_D0 USART1_ PA10 - USART1_ - I2S2_CK EVENTOUT ULPI_CK CK PA9 LCD_ VSYNC OTG_HS_ USART1_ PA8 - I2S6_CK OCTOSPIM_ - ULPI_D0 SPI3_NSS/ SPI1_MISO/ I2S1_SDI P1_DQS OTG_HS_ I2S1_WS I2S1_CK TIM3_CH1 LCD_B2 SPI1_NSS/ - TIM2_ETR PA6 - - SPI1_SCK/ - - RX TIM2_CH1/ PA5 SAI2_SCK_B USART2_ TIM15_CH2 P1_CLK OCTOSPIM_ SAI2_MCK_B P1_IO3 OTG_HS_ - - RX DCMI_D1/ MDIOS_MDIO LCD_B4 ID PSSI_D1 USART1_ SPI2_NSS/ PA11 - TIM1_CH4 - LPUART1_CTS - FDCAN1_ UART4_RX CTS/ - I2S2_WS - - - - LCD_R4 EVENTOUT - - - - LCD_R5 EVENTOUT RX USART1_NSS SPI2_SCK/ PA12 - TIM1_ETR - LPUART1_RTS - USART1_ UART4_TX FDCAN1_ SAI2_FS_B RTS TX JTMS/ PA13 - - - - - - - - - - - - - - EVENTOUT - - - - - - - - - - - - - - EVENTOUT SPI1_NSS/ SPI3_NSS/ SPI6_NSS/ UART4_ - - HDMI_CEC LCD_R3 - UART7_TX - - LCD_B6 EVENTOUT I2S1_WS I2S3_WS I2S6_WS RTS SWDIO JTCK/ page 69/231 PA14 SWCLK TIM2_CH1/ PA15 JTDI TIM2_ETR STM32H7B3xI I2S2_CK DS13139 - Rev 7 Table 9. Port B alternate functions AF0 AF2 AF3 AF4 AF5 SYS LPTIM1/ TIM1/2/16/17 PDM_SAI1/ TIM3/4/5/12/15 DFSDM1/ LPTIM2/3/ LPUART1/ OCTOSPIM_P1/2/ TIM8 CEC/DCMI/PSSI/ DFSDM1/2/ I2C1/2/3/4/ LPTIM2/TIM15/ USART1 CEC/SPI1/ I2S1/SPI2/ I2S2/SPI3/ I2S3/ SPI4/5/ SPI6/I2S6 - TIM1_CH2N TIM3_CH3 TIM8_CH2N DFSDM2_CKOUT - Port PB0 AF1 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 DFSDM1/2/I2C4/ OCTOSPIM_P1/ SAI1/SPI3/I2S3/ UART4 SDMMC1/SPI2/ I2S2/SPI3/I2S3/ SPI6/I2S6/ UART7/ USART1/2/3/6 LPUART1/ SAI2/ SDMMC1/ SPDIFRX1/ SPI6/I2S6/ UART4/5/8 FDCAN1/2/FMC/LC D/OCTOSPIM_P1/2/ SDMMC2/ SPDIFRX1/TIM13/14 CRS/FMC/LCD/ OCTOSPIM_P1/ OTG1_FS/ OTG1_HS/ SAI2/SDMMC2/ TIM8 DFSDM1/2/ I2C4/LCD/MDIOS/ OCTOSPIM_P1/ SDMMC2/SWPMI1/ TIM1/8/UART7/9/ USART10 FMC/LCD/ MDIOS/ SDMMC1/ TIM1/8 COMP/DCMI/ PSSI/LCD/TIM1 LCD/ UART5 SYS DFSDM1_CKOUT - UART4_CTS LCD_R3 OCTOSPIM_P1_IO1 - - LCD_G1 EVENTOUT - - LCD_G0 EVENTOUT - - - - EVENTOUT OTG_HS_ ULPI_D1 PB1 - TIM1_CH3N TIM3_CH4 TIM8_CH3N - - DFSDM1_DATIN1 - - SPI3_MOSI/ PB2 RTC_OUT2 - SAI1_D1 - DFSDM1_CKIN1 - SAI1_SD_A JTDO/ SPI1_SCK/ TIM2_CH2 - - OCTOSPIM_P1_CLK PB4 NJTRST TIM16_BKIN TIM3_CH1 - SPI1_MISO/ SPI3_MISO/ SPI2_NSS/ SPI6_MISO/ I2S1_SDI I2S3_SDI I2S2_WS I2S6_SDI - TIM17_BKIN TIM3_CH2 - SPI3_MOSI/ SPI6_MOSI/ I2S3_SDO I2S6_SDO USART1_TX LPUART1_TX I2C1_SMBA I2C4_SMBA I2S1_SDO SDMMC2_D2 CRS_SYNC UART7_RX - - - EVENTOUT SDMMC2_D3 - UART7_TX - - - EVENTOUT LCD_B5 FMC_SDCKE1 DCMI_D10/ PSSI_D10 UART5_RX EVENTOUT DFSDM1_DATIN5 FMC_SDNE1 DCMI_D5/PSSI_D5 UART5_TX EVENTOUT I2S6_CK - SPI1_MOSI/ PB5 SPI6_SCK/ - I2S1_CK P1_IO0 P1_DQS SPI3_SCK/ I2S3_CK - TRACESWO OCTOSPIM_ ULPI_D2 OCTOSPIM_ I2S3_SDO PB3 OTG_HS_ LCD_R6 OTG_HS_ FDCAN2_RX ULPI_D7 OCTOSPIM_ PB6 - TIM16_CH1N TIM4_CH1 - I2C1_SCL HDMI_CEC I2C4_SCL FDCAN2_TX Port B P1_NCS PB7 - TIM17_CH1N TIM4_CH2 - I2C1_SDA PB8 - TIM16_CH1 TIM4_CH3 DFSDM1_CKIN7 I2C1_SCL - I2C4_SDA USART1_RX LPUART1_RX - - DFSDM1_CKIN5 FMC_NL DCMI_VSYNC/ PSSI_RDY - EVENTOUT - I2C4_SCL SDMMC1_CKIN UART4_RX FDCAN1_RX SDMMC2_D4 - SDMMC1_D4 DCMI_D6/PSSI_D6 LCD_B6 EVENTOUT I2C4_SDA SDMMC1_CDIR UART4_TX FDCAN1_TX SDMMC2_D5 I2C4_SMBA SDMMC1_D5 DCMI_D7/PSSI_D7 LCD_B7 EVENTOUT OCTOSPIM_ OTG_HS_ DFSDM1_DATIN7 USART3_TX - - - - LCD_G4 EVENTOUT P1_NCS ULPI_D3 - - - LCD_G5 EVENTOUT DFSDM2_DATIN1 - TIM1_BKIN_COMP12 UART5_RX EVENTOUT - SDMMC1_D0 DCMI_D2/PSSI_D2 UART5_TX EVENTOUT SPI2_NSS/ PB9 - TIM17_CH1 TIM4_CH4 DFSDM1_DATIN7 I2C1_SDA I2S2_WS SPI2_SCK/ PB10 - TIM2_CH3 - LPTIM2_IN1 I2C2_SCL I2S2_CK OTG_HS_ PB11 - TIM2_CH4 - LPTIM2_ETR I2C2_SDA - DFSDM1_CKIN7 USART3_RX - ULPI_D4 OCTOSPIM_ PB12 - TIM1_BKIN - I2C2_SMBA P1_NCLK SPI2_NSS/ I2S2_WS OTG_HS_ DFSDM1_DATIN1 - TIM1_CH1N - LPTIM2_OUT DFSDM2_CKIN1 - FDCAN2_RX ULPI_D5 SPI2_SCK/ PB13 USART3_CK USART3_CTS/ DFSDM1_CKIN1 I2S2_CK OTG_HS_ - FDCAN2_TX USART3_NSS ULPI_D6 SPI2_MISO/ PB14 - TIM1_CH2N TIM12_CH1 TIM8_CH2N USART1_TX DFSDM1_DATIN2 USART3_RTS UART4_RTS SDMMC2_D0 - - - - LCD_CLK EVENTOUT DFSDM1_CKIN2 - UART4_CTS SDMMC2_D1 - - - - LCD_G7 EVENTOUT I2S2_SDI SPI2_MOSI/ PB15 RTC_REFIN TIM1_CH3N TIM12_CH2 TIM8_CH3N USART1_RX I2S2_SDO STM32H7B3xI page 70/231 DS13139 - Rev 7 Table 10. Port C alternate functions AF0 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 SYS LPTIM1/ TIM1/2/16/17 PDM_SAI1/ TIM3/4/5/12/15 DFSDM1/ LPTIM2/3/ LPUART1/ OCTOSPIM_P1/2/ TIM8 CEC/DCMI/PSSI/ DFSDM1/2/ I2C1/2/3/4/ LPTIM2/TIM15/ USART1 CEC/SPI1/ I2S1/SPI2/ I2S2/SPI3/ I2S3/ SPI4/5/ SPI6/I2S6 DFSDM1/2/I2C4/ OCTOSPIM_P1/ SAI1/SPI3/I2S3/ UART4 SDMMC1/ SPI2/I2S2/ SPI3/I2S3/ SPI6/I2S6/ UART7/ USART1/2/3/6 LPUART1/ SAI2/SDMMC1/ SPDIFRX1/SPI6/ I2S6/UART4/5/8 FDCAN1/2/FMC/LCD /OCTOSPIM_P1/2/ SDMMC2/ SPDIFRX1/TIM13/14 - - - DFSDM1_CKIN0 - - DFSDM1_DATIN4 - SAI2_FS_B FMC_A25 Port PC0 AF1 AF10 AF11 AF12 AF13 AF14 AF15 CRS/FMC/LCD/ OCTOSPIM_P1/ OTG1_FS/ OTG1_HS/ SAI2/SDMMC2/ TIM8 DFSDM1/2/ I2C4/LCD/ MDIOS/ OCTOSPIM_P1/ SDMMC2/ SWPMI1/ TIM1/8/ UART7/9/ USART10 FMC/LCD/ MDIOS/ SDMMC1/ TIM1/8 COMP/DCMI/ PSSI/LCD/ TIM1 LCD/UART5 SYS LCD_G2 FMC_SDNWE - LCD_R5 EVENTOUT - MDIOS_MDC - LCD_G5 EVENTOUT FMC_SDNE0 - - EVENTOUT FMC_SDCKE0 - - EVENTOUT OTG_HS_ ULPI_STP PC1 PC2 PC3 PC4 TRACED0 PWR_CSTOP PWR_CSLEEP - - - - - SAI1_D1 - - - DFSDM1_DATIN0 DFSDM1_CKIN1 DFSDM1_DATIN1 DFSDM1_CKIN2 DFSDM1_CKIN4 - - - OCTOSPIM_ SPI2_MOSI/ I2S2_SDO SAI1_SD_A SPI2_MISO/ I2S2_SDI DFSDM1_CKOUT SPI2_MOSI/ I2S2_SDO - I2S1_MCK - - - SDMMC2_CK P1_IO4 - - - - - - OTG_HS_ OCTOSPIM_ ULPI_DIR P1_IO5 OCTOSPIM_P1_IO2 OTG_HS_ OCTOSPIM_ ULPI_NXT P1_IO6 - - FMC_SDNE0 - LCD_R7 EVENTOUT - FMC_SDCKE0 COMP1_OUT LCD_DE EVENTOUT - SDMMC1_D6 LCD_HSYNC EVENTOUT LCD_G6 EVENTOUT - EVENTOUT LCD_B2 EVENTOUT LCD_R2 EVENTOUT LCD_B4 EVENTOUT LCD_R6 EVENTOUT OCTOSPIM_P1_IO0 SPDIFRX1_IN2 OCTOSPIM_ PC5 - - SAI1_D3 DFSDM1_DATIN2 PSSI_D15 - - - - SPDIFRX1_IN3 P1_DQS DCMI_D0/ PC6 - - TIM3_CH1 TIM8_CH1 DFSDM1_CKIN3 I2S2_MCK - USART6_TX SDMMC1_D0DIR FMC_NWAIT SDMMC2_D6 Port C PSSI_D0 DCMI_D1/ PC7 TRGIO - TIM3_CH2 TIM8_CH2 DFSDM1_DATIN3 - I2S3_MCK USART6_RX SDMMC1_D123DIR FMC_NE1 SDMMC2_D7 SWPMI_TX SDMMC1_D7 PSSI_D1 FMC_NE2/ PC8 TRACED1 - TIM3_CH3 TIM8_CH3 - - - USART6_CK UART5_RTS DCMI_D2/ FMC_INT SWPMI_RX SDMMC1_D0 FMC_NCE PSSI_D2 SWPMI_ PC9 MCO2 - TIM3_CH4 TIM8_CH4 I2C3_SDA I2S_CKIN - - UART5_CTS OCTOSPIM_P1_IO0 LCD_G3 DCMI_D3/ SDMMC1_D1 SUSPEND PSSI_D3 SPI3_SCK/ PC10 - - - DFSDM1_CKIN5 DFSDM2_CKIN0 - DCMI_D8/ USART3_TX UART4_TX OCTOSPIM_P1_IO1 LCD_B1 SWPMI_RX SDMMC1_D2 I2S3_CK PSSI_D8 SPI3_MISO/ PC11 - - - DFSDM1_DATIN5 DFSDM2_DATIN0 - DCMI_D4/ USART3_RX UART4_RX OCTOSPIM_P1_NCS - - SDMMC1_D3 I2S3_SDI PC12 TRACED3 - TIM15_CH1 - SPI6_SCK/ SPI3_MOSI/ I2S6_CK I2S3_SDO DFSDM2_CKOUT PSSI_D4 DCMI_D9/ USART3_CK UART5_TX - - - SDMMC1_CK PSSI_D9 PC13 - - - - - - - - - - - - - - - EVENTOUT PC14 - - - - - - - - - - - - - - - EVENTOUT PC15 - - - - - - - - - - - - - - - EVENTOUT STM32H7B3xI page 71/231 DS13139 - Rev 7 Table 11. Port D alternate functions AF0 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 FMC/LCD/ MDIOS/ SDMMC1/ TIM1/8 COMP/ DCMI/ PSSI/LCD/ TIM1 LCDUART5 SYS - LCD_B1 EVENTOUT - - EVENTOUT LCD_B2 EVENTOUT LCD_G7 EVENTOUT SYS LPTIM1/ TIM1/2/16/17 PDM_SAI1/ TIM3/4/5/12/15 DFSDM1/ LPTIM2/3/ LPUART1/ OCTOSPIM_P1/2/ TIM8 CEC/DCMI/PSSI/ DFSDM1/2/ I2C1/2/3/4/ LPTIM2/TIM15/ USART1 CEC/SPI1/ I2S1/SPI2/ I2S2/SPI3/ I2S3/ SPI4/5/ SPI6/I2S6 DFSDM1/2/I2C4/ OCTOSPIM_P1/ SAI1/SPI3/I2S3/ UART4 SDMMC1/ SPI2/I2S2/ SPI3/I2S3/ SPI6/I2S6/ UART7/ USART1/2/3/6 LPUART1/ SAI2/ SDMMC1/ SPDIFRX1/ SPI6/I2S6/ UART4/5/8 FDCAN1/2/FMC/LC D/OCTOSPIM_P1/2/ SDMMC2/ SPDIFRX1/ TIM13/14 CRS/FMC/LCD/ OCTOSPIM_P1/ OTG1_FS/ OTG1_HS/SAI2/ SDMMC2/TIM8 DFSDM1/2/ I2C4/LCD/ MDIOS/ OCTOSPIM_P1/ SDMMC2/ SWPMI1/ TIM1/8/ UART7/9/ USART10 - - - DFSDM1_CKIN6 - - - - UART4_RX FDCAN1_RX - UART9_CTS Port PD0 AF1 FMC_D2/ FMC_DA2 FMC_D3/ PD1 - - - DFSDM1_DATIN6 - - - - UART4_TX FDCAN1_TX - FMC_DA3 DCMI_D11/ PD2 TRACED2 - TIM3_ETR - TIM15_BKIN - - - UART5_RX LCD_B7 - - SDMMC1_CMD PSSI_D11 SPI2_SCK/ PD3 - - - DFSDM1_CKOUT - USART2_CTS/ - I2S2_CK DCMI_D5/ - - - - FMC_CLK USART2_NSS PSSI_D5 PD4 - - - - - - - USART2_RTS - - OCTOSPIM_P1_IO4 - FMC_NOE - - EVENTOUT PD5 - - - - - - - USART2_TX - - OCTOSPIM_P1_IO5 - FMC_NWE - - EVENTOUT PD6 - - SAI1_D1 DFSDM1_CKIN4 DFSDM1_DATIN1 SAI1_SD_A USART2_RX - - OCTOSPIM_P1_IO6 SDMMC2_CK FMC_NWAIT LCD_B2 EVENTOUT - - EVENTOUT - - EVENTOUT - - EVENTOUT - LCD_B3 EVENTOUT - - EVENTOUT - EVENTOUT - EVENTOUT - - EVENTOUT - - EVENTOUT SPI3_MOSI/ DCMI_D10/ I2S3_SDO PSSI_D10 SPI1_MOSI/ PD7 - - - DFSDM1_DATIN4 - DFSDM1_CKIN1 USART2_CK - SPDIFRX1_IN0 OCTOSPIM_P1_IO7 SDMMC2_CMD - USART3_TX - SPDIFRX1_IN1 - - FMC_NE1 Port D I2S1_SDO FMC_D13/ PD8 - - - DFSDM1_CKIN3 - - FMC_DA13 FMC_D14/ PD9 - - - DFSDM1_DATIN3 - - - USART3_RX - - - FMC_DA14 FMC_D15/ PD10 - - - DFSDM1_CKOUT DFSDM2_CKOUT - - USART3_CK - - - FMC_DA15 PD11 PD12 - - - LPTIM1_IN1 - TIM4_CH1 LPTIM2_IN2 LPTIM2_IN1 I2C4_SMBA I2C4_SCL - - - - FMC_A16/ USART3_CTS/ USART3_NSS - USART3_RTS - OCTOSPIM_P1_IO0 SAI2_SD_A FMC_CLE OCTOSPIM_P1_IO1 SAI2_FS_A FMC_A17/ DCMI_D12/ FMC_ALE PSSI_D12 - DCMI_D13/ PD13 - LPTIM1_OUT TIM4_CH2 - I2C4_SDA - - - - OCTOSPIM_P1_IO3 SAI2_SCK_A UART9_RTS FMC_A18 PSSI_D13 FMC_D0/ PD14 - - TIM4_CH3 - - - - - UART8_CTS - - UART9_RX FMC_DA0 FMC_D1/ PD15 - - TIM4_CH4 - - - - - UART8_RTS - - UART9_TX FMC_DA1 STM32H7B3xI page 72/231 DS13139 - Rev 7 Table 12. Port E alternate functions AF0 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 CEC/SPI1/ I2S1/SPI2/ I2S2/SPI3/ I2S3/ SPI4/5/ SPI6/I2S6 DFSDM1/2/ I2C4/ OCTOSPIM_P1/ SAI1/SPI3/I2S3/ UART4 SDMMC1/ SPI2/I2S2/ SPI3/I2S3/ SPI6/I2S6/ UART7/ USART1/2/3/6 LPUART1/ SAI2/ SDMMC1/ SPDIFRX1/ SPI6/I2S6/ UART4/5/8 FDCAN1/2/FMC/LC D/OCTOSPIM_P1/2/ SDMMC2/ SPDIFRX1/ TIM13/14 CRS/FMC/LCD/ OCTOSPIM_P1/ OTG1_FS/ OTG1_HS/SAI2/ SDMMC2/TIM8 DFSDM1/2/ I2C4/LCD/MDIOS/ OCTOSPIM_P1/ SDMMC2/SWPMI1/ TIM1/8/UART7/9/ USART10 FMC/LCD/ MDIOS/ SDMMC1/ TIM1/8 COMP/DCMI/ PSSI/LCD/TIM1 LCD/ UART5 SYS - - - UART8_Rx - SAI2_MCK_A - FMC_NBL0 LCD_R0 EVENTOUT LCD_R6 EVENTOUT SYS LPTIM1/ TIM1/2/16/17 PDM_SAI1/ TIM3/4/5/12/15 DFSDM1/ LPTIM2/3/ LPUART1/ OCTOSPIM_P1/2/ TIM8 CEC/DCMI/ PSSI/ DFSDM1/2/ I2C1/2/3/4/ LPTIM2/ TIM15/ USART1 - LPTIM1_ETR TIM4_ETR - LPTIM2_ETR Port PE0 AF1 DCMI_D2/ PSSI_D2 DCMI_D3/ PE1 - LPTIM1_IN2 - - - - - - UART8_Tx - - - FMC_NBL1 PSSI_D3 PE2 TRACECLK - SAI1_CK1 - - SPI4_SCK SAI1_MCLK_A - - OCTOSPIM_P1_IO2 - USART10_RX FMC_A23 - - EVENTOUT PE3 TRACED0 - - - TIM15_BKIN - SAI1_SD_B - - - - USART10_TX FMC_A19 - - EVENTOUT PE4 TRACED1 - SAI1_D2 DFSDM1_DATIN3 TIM15_CH1N SPI4_NSS SAI1_FS_A - - - - - FMC_A20 LCD_B0 EVENTOUT LCD_G0 EVENTOUT LCD_G1 EVENTOUT - - EVENTOUT COMP2_OUT - EVENTOUT - - EVENTOUT - - EVENTOUT - LCD_G3 EVENTOUT LCD_B4 EVENTOUT COMP2_OUT LCD_DE EVENTOUT - LCD_CLK EVENTOUT TIM1_BKIN_COMP12 LCD_R7 EVENTOUT DCMI_D4/ PSSI_D4 DCMI_D6/ PE5 TRACED2 - SAI1_CK2 DFSDM1_CKIN3 TIM15_CH1 SPI4_MISO SAI1_SCK_A - - - - - FMC_A21 PSSI_D6 TIM1_BKIN2_ PE6 TRACED3 TIM1_BKIN2 SAI1_D1 - TIM15_CH2 SPI4_MOSI SAI1_SD_A - - - SAI2_MCK_B DCMI_D7/ FMC_A22 COMP12 PSSI_D7 FMC_D4/ PE7 - TIM1_ETR - DFSDM1_DATIN2 - - - UART7_RX - - OCTOSPIM_P1_IO4 - Port E FMC_DA4 FMC_D5/ PE8 - TIM1_CH1N - DFSDM1_CKIN2 - - - UART7_TX - - OCTOSPIM_P1_IO5 FMC_DA5 FMC_D6/ PE9 - TIM1_CH1 - DFSDM1_CKOUT - - - UART7_RTS - - OCTOSPIM_P1_IO6 FMC_DA6 FMC_D7/ PE10 - TIM1_CH2N - DFSDM1_DATIN4 - - - UART7_CTS - - OCTOSPIM_P1_IO7 FMC_DA7 FMC_D8/ PE11 - TIM1_CH2 - DFSDM1_CKIN4 - SPI4_NSS - - - - SAI2_SD_B OCTOSPIM_P1_NCS FMC_DA8 PE12 - TIM1_CH3N - DFSDM1_DATIN5 - SPI4_SCK - - - - SAI2_SCK_B FMC_D9/ COMP1_ FMC_DA9 OUT - FMC_D10/ PE13 - TIM1_CH3 - DFSDM1_CKIN5 - SPI4_MISO - - - - SAI2_FS_B FMC_DA10 FMC_D11/ PE14 - TIM1_CH4 - - SPI4_MOSI - - - - SAI2_MCK_B FMC_DA11 FMC_D12/ PE15 - TIM1_BKIN - - - - - - - - USART10_CK FMC_DA12 STM32H7B3xI page 73/231 DS13139 - Rev 7 Table 13. Port F alternate functions AF0 Port SYS AF1 LPTIM1/ TIM1/2/16/17 AF2 PDM_SAI1/ TIM3/4/5/12/15 AF3 AF4 DFSDM1/ LPTIM2/3/ LPUART1/ OCTOSPIM_P1/2/ TIM8 CEC/DCMI/ PSSI/ DFSDM1/2/ I2C1/2/3/4/ LPTIM2/ TIM15/ USART1 AF5 CEC/SPI1/ I2S1/SPI2/ I2S2/SPI3/ I2S3/SPI4/5/ SPI6/I2S6 AF6 DFSDM1/2/I2C4/ OCTOSPIM_P1/ SAI1/SPI3/I2S3/ UART4 AF7 SDMMC1/SPI2/ I2S2/SPI3/ I2S3/SPI6/ I2S6/UART7/ USART1/2/3/6 AF8 LPUART1/ SAI2/ SDMMC1/ SPDIFRX1/ SPI6/I2S6/ UART4/5/8 AF9 FDCAN1/2/FMC/LCD/ OCTOSPIM_P1/2/ SDMMC2/SPDIFRX1/ TIM13/14 AF10 AF11 AF12 AF13 AF14 AF15 CRS/FMC/LCD/ OCTOSPIM_P1/ OTG1_FS/OTG1_HS/ SAI2/SDMMC2/TIM8 DFSDM1/2/ I2C4/LCD/ MDIOS/ OCTOSPIM_P1/ SDMMC2/ SWPMI1/TIM1/8/ UART7/9/ USART10 FMC/LCD/ MDIOS/ SDMMC1/ TIM1/8 COMP/ DCMI/ PSSI/LCD/ TIM1 LCD/ UART5 SYS PF0 - - - - I2C2_SDA - - - - OCTOSPIM_P2_IO0 - - FMC_A0 - - EVENTOUT PF1 - - - - I2C2_SCL - - - - OCTOSPIM_P2_IO1 - - FMC_A1 - - EVENTOUT PF2 - - - - I2C2_SMBA - - - - OCTOSPIM_P2_IO2 - - FMC_A2 - - EVENTOUT PF3 - - - - - - - - - OCTOSPIM_P2_IO3 - - FMC_A3 - - EVENTOUT PF4 - - - - - - - - - OCTOSPIM_P2_CLK - - FMC_A4 - - EVENTOUT - - FMC_A5 - - EVENTOUT OCTOSPIM_ PF5 - - - - - - - - - Port F P2_NCLK PF6 - TIM16_CH1 - - - SPI5_NSS SAI1_SD_B UART7_Rx - - OCTOSPIM_P1_IO3 - - - - EVENTOUT PF7 - TIM17_CH1 - - - SPI5_SCK SAI1_MCLK_B UART7_Tx - - OCTOSPIM_P1_IO2 - - - - EVENTOUT PF8 - TIM16_CH1N - - - SPI5_MISO SAI1_SCK_B UART7_RTS - TIM13_CH1 OCTOSPIM_P1_IO0 - - - - EVENTOUT PF9 - TIM17_CH1N - - - SPI5_MOSI SAI1_FS_B UART7_CTS - TIM14_CH1 OCTOSPIM_P1_IO1 - - - - EVENTOUT PF10 - TIM16_BKIN SAI1_D3 - PSSI_D15 - - - - OCTOSPIM_P1_CLK - - - LCD_DE EVENTOUT - EVENTOUT - EVENTOUT DCMI_D11/ PSSI_D11 OCTOSPIM_ PF11 - - - - - SPI5_MOSI - - - DCMI_D12/ SAI2_SD_B - FMC_SDNRAS P1_NCLK PSSI_D12 OCTOSPIM_ PF12 - - - - - - - - - - - FMC_A6 - P2_DQS PF13 - - - DFSDM1_DATIN6 I2C4_SMBA - - - - - - - FMC_A7 - - EVENTOUT PF14 - - - DFSDM1_CKIN6 I2C4_SCL - - - - - - - FMC_A8 - - EVENTOUT PF15 - - - - I2C4_SDA - - - - - - - FMC_A9 - - EVENTOUT STM32H7B3xI page 74/231 DS13139 - Rev 7 Table 14. Port G alternate functions AF0 Port SYS AF1 LPTIM1/ TIM1/2/16/17 AF2 PDM_SAI1/ TIM3/4/5/12/15 AF3 DFSDM1/LPTIM2/3/ LPUART1/ OCTOSPIM_P1/2/ TIM8 AF4 CEC/DCMI/ PSSI/ DFSDM1/2/ I2C1/2/3/4/ LPTIM2/ TIM15/ USART1 AF5 CEC/SPI1/ I2S1/SPI2/ I2S2/SPI3/ I2S3/ SPI4/5/ SPI6/I2S6 AF6 DFSDM1/2/ I2C4/ OCTOSPIM_P1/ SAI1/SPI3/I2S3/ UART4 AF7 SDMMC1/ SPI2/I2S2/ SPI3/I2S3/ SPI6/I2S6/ UART7/ USART1/2/3/6 AF8 LPUART1/ SAI2/ SDMMC1/ SPDIFRX1/ SPI6/I2S6/ UART4/5/8 AF9 FDCAN1/2/FMC/LCD /OCTOSPIM_P1/2/ SDMMC2/SPDIFRX1/ TIM13/14 AF10 AF11 AF12 AF13 AF14 AF15 CRS/FMC/LCD/ OCTOSPIM_P1/ OTG1_FS/ OTG1_HS/SAI2/ SDMMC2/TIM8 DFSDM1/2/ I2C4/LCD/ MDIOS/ OCTOSPIM_P1/ SDMMC2/ SWPMI1/ TIM1/8/ UART7/9/ USART10 FMC/LCD/ MDIOS/ SDMMC1/ TIM1/8 COMP/DCMI/ PSSI/LCD/ TIM1 LCD/ UART5 SYS PG0 - - - - - - - - - OCTOSPIM_P2_IO4 - UART9_RX FMC_A10 - - EVENTOUT PG1 - - - - - - - - - OCTOSPIM_P2_IO5 - UART9_TX FMC_A11 - - EVENTOUT PG2 - - - TIM8_BKIN - - - - - - - FMC_A12 - - EVENTOUT FMC_A13 - - EVENTOUT - - EVENTOUT - - EVENTOUT LCD_R7 EVENTOUT LCD_CLK EVENTOUT LCD_G7 EVENTOUT - EVENTOUT LCD_B2 EVENTOUT LCD_B3 EVENTOUT TIM8_BKIN_ COMP12 TIM8_BKIN2_ PG3 - - - TIM8_BKIN2 - - - - - - COMP12 PG4 - TIM1_BKIN2 - - - - - - - - TIM1_BKIN2_ FMC_A14/ COMP12 FMC_BA0 - FMC_A15/ PG5 - TIM1_ETR - - - - - - - - - FMC_BA1 DCMI_D12/ PG6 - TIM17_BKIN - - - - - - - - OCTOSPIM_P1_NCS - FMC_NE3 PSSI_D12 DCMI_D13/ PG7 - - - - - - SAI1_MCLK_A USART6_CK - OCTOSPIM_P2_DQS - - FMC_INT Port G PSSI_D13 SPI6_NSS/ PG8 - - - TIM8_ETR - - USART6_RTS SPDIFRX1_IN2 - - - - USART6_RX SPDIFRX1_IN3 OCTOSPIM_P1_IO6 SAI2_FS_B SDMMC2_D0 FMC_SDCLK - FMC_NE2/ DCMI_VSYNC/ FMC_NCE PSSI_RDY I2S6_WS SPI1_MISO/ PG9 - - - - I2S1_SDI SPI1_NSS/ PG10 - - - OCTOSPIM_P2_IO6 - DCMI_D2/ - - - LCD_G3 SAI2_SD_B SDMMC2_D1 FMC_NE3 I2S1_WS PSSI_D2 SPI1_SCK/ PG11 - LPTIM1_IN2 - - - DCMI_D3/ - - SPDIFRX1_IN0 OCTOSPIM_P2_IO7 SDMMC2_D2 USART10_RX - I2S1_CK PG12 - LPTIM1_IN1 - OCTOSPIM_P2_NCS - SPI6_MISO/ I2S6_SDI PSSI_D3 - SPI6_SCK/ PG13 TRACED0 LPTIM1_OUT - - - USART6_RTS SPDIFRX1_IN1 LCD_B4 SDMMC2_D3 USART6_CTS/ - I2S6_CK USART10_TX - - LCD_B1 EVENTOUT - - LCD_R0 EVENTOUT USART10_CTS/ - - SDMMC2_D6 USART6_NSS USART10_NSS SPI6_MOSI/ PG14 TRACED1 LPTIM1_ETR - - - - USART6_TX - OCTOSPIM_P1_IO7 SDMMC2_D7 USART10_RTS - - LCD_B0 EVENTOUT - OCTOSPIM_P2_DQS - - - DCMI_D13/ PSSI_D13 - EVENTOUT I2S6_SDO USART6_CTS/ PG15 - - - - - - USART6_NSS STM32H7B3xI page 75/231 DS13139 - Rev 7 Table 15. Port H alternate functions AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 FMC/LCD/ MDIOS/ SDMMC1/ TIM1/8 COMP/DCMI/ PSSI/LCD/TIM1 LCD/ UART5 SYS EVENTOUT CEC/DCMI/ PSSI/ DFSDM1/2/ I2C1/2/3/4/ LPTIM2/ TIM15/ USART1 CEC/SPI1/ I2S1/SPI2/ I2S2/SPI3/ I2S3/SPI4/5/ SPI6/I2S6 DFSDM1/2/I2C4/ OCTOSPIM_P1/ SAI1/SPI3/I2S3/ UART4 SDMMC1/SPI2/ I2S2/SPI3/I2S3/ SPI6/I2S6/ UART7/ USART1/2/3/6 LPUART1/ SAI2/ SDMMC1/ SPDIFRX1/ SPI6/I2S6/ UART4/5/8 FDCAN1/2/FMC/LCD /OCTOSPIM_P1/2/ SDMMC2/SPDIFRX1/ TIM13/14 CRS/FMC/LCD/ OCTOSPIM_P1/ OTG1_FS/ OTG1_HS/SAI2/ SDMMC2/TIM8 DFSDM1/2/ I2C4/LCD/ MDIOS/ OCTOSPIM_P1/ SDMMC2/ SWPMI1/TIM1/8/ UART7/9/ USART10 SYS LPTIM1/ TIM1/2/16/17 PDM_SAI1/ TIM3/4/5/12/15 DFSDM1/ LPTIM2/3/ LPUART1/ OCTOSPIM_P1/2/ TIM8 PH0 - - - - - - - - - - - - - - - PH1 - - - - - - - - - - - - - - - EVENTOUT PH2 - LPTIM1_IN2 - - - - - - - OCTOSPIM_P1_IO4 SAI2_SCK_B - FMC_SDCKE0 - LCD_R0 EVENTOUT PH3 - - - - - - - - - OCTOSPIM_P1_IO5 SAI2_MCK_B - FMC_SDNE0 - LCD_R1 EVENTOUT - - PSSI_D14 LCD_G4 EVENTOUT - FMC_SDNWE - - EVENTOUT - EVENTOUT - EVENTOUT LCD_R2 EVENTOUT LCD_R3 EVENTOUT LCD_R4 EVENTOUT LCD_R5 EVENTOUT LCD_R6 EVENTOUT LCD_G2 EVENTOUT LCD_G3 EVENTOUT LCD_G4 EVENTOUT Port OTG_HS_ PH4 - - - - I2C2_SCL - - - - LCD_G5 ULPI_NXT PH5 - - - - I2C2_SDA SPI5_NSS - - - - - DCMI_D8/ PH6 - - TIM12_CH1 - I2C2_SMBA SPI5_SCK - - - - - - FMC_SDNE1 PSSI_D8 DCMI_D9/ PH7 - - - - I2C3_SCL SPI5_MISO - - - - - - FMC_SDCKE1 PSSI_D9 Port H DCMI_HSYNC/ PH8 - - TIM5_ETR - I2C3_SDA - - - - - - - FMC_D16 PSSI_DE DCMI_D0/ PH9 - - TIM12_CH2 - I2C3_SMBA - - - - - - - FMC_D17 PSSI_D0 DCMI_D1/ PH10 - - TIM5_CH1 - I2C4_SMBA - - - - - - - FMC_D18 PSSI_D1 DCMI_D2/ PH11 - - TIM5_CH2 - I2C4_SCL - - - - - - - FMC_D19 PSSI_D2 DCMI_D3/ PH12 - - TIM5_CH3 - I2C4_SDA - - - - - - - FMC_D20 PSSI_D3 PH13 - - - TIM8_CH1N - - - - UART4_TX FDCAN1_TX - - FMC_D21 DCMI_D4/ PH14 - - - TIM8_CH2N - - - - UART4_RX FDCAN1_RX - - FMC_D22 PSSI_D4 PH15 - - - TIM8_CH3N - - - - - - - - FMC_D23 DCMI_D11/ PSSI_D11 STM32H7B3xI page 76/231 DS13139 - Rev 7 Table 16. Port I alternate functions AF0 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 CEC/SPI1/ I2S1/SPI2/ I2S2/SPI3/ I2S3/SPI4/5/ SPI6/I2S6 DFSDM1/2/I2C4/ OCTOSPIM_P1/ SAI1/SPI3/I2S3/ UART4 SDMMC1/ SPI2/I2S2/ SPI3/I2S3/ SPI6/I2S6/ UART7/ USART1/2/3/6 LPUART1/ SAI2/ SDMMC1/ SPDIFRX1/ SPI6/I2S6/ UART4/5/8 FDCAN1/2/FMC/L CD/ OCTOSPIM_P1/2/ SDMMC2/ SPDIFRX1/ TIM13/14 CRS/FMC/LCD/ OCTOSPIM_P1/ OTG1_FS/ OTG1_HS/SAI2/ SDMMC2/TIM8 DFSDM1/2/ I2C4/LCD/MDIOS/ OCTOSPIM_P1/ SDMMC2/SWPMI1/ TIM1/8/UART7/9/ USART10 FMC/LCD/ MDIOS/ SDMMC1/ TIM1/8 COMP/DCMI/ PSSI/LCD/TIM1 LCD/UART5 SYS - - - - - - FMC_D24 DCMI_D13/ PSSI_D13 LCD_G5 EVENTOUT - - - - - TIM8_BKIN2_COMP12 FMC_D25 LCD_G6 EVENTOUT LCD_G7 EVENTOUT - EVENTOUT LCD_B4 EVENTOUT LCD_B5 EVENTOUT LCD_B6 EVENTOUT LCD_B7 EVENTOUT - EVENTOUT SYS LPTIM1/ TIM1/2/16/17 PDM_SAI1/ TIM3/4/5/12/15 DFSDM1/LPTIM2/3/ LPUART1/ OCTOSPIM_P1/2/TIM8 CEC/DCMI/ PSSI/ DFSDM1/2/ I2C1/2/3/4/ LPTIM2/ TIM15/ USART1 - - TIM5_CH4 - - Port PI0 AF1 SPI2_NSS/ I2S2_WS SPI2_SCK/ PI1 - - - TIM8_BKIN2 - DCMI_D8/ I2S2_CK PI2 PI3 - - - - - - TIM8_CH4 TIM8_ETR - - PSSI_D8 DCMI_D9/ SPI2_MISO/ I2S2_SDI - SPI2_MOSI/ I2S2_SDO - - - - - - FMC_D26 PSSI_D9 - - - - - FMC_D27 DCMI_D10/ PSSI_D10 DCMI_D5/ PI4 - - - TIM8_BKIN - - - - - - SAI2_MCK_A TIM8_BKIN_COMP12 FMC_NBL2 PSSI_D5 PI5 - - - TIM8_CH1 - - - - - - SAI2_SCK_A - FMC_NBL3 DCMI_VSYNC/ PSSI_ RDY Port I DCMI_D6/ PI6 - - - TIM8_CH2 - - - - - - SAI2_SD_A - FMC_D28 PSSI_D6 DCMI_D7/ PI7 - - - TIM8_CH3 - - - - - - SAI2_FS_A - FMC_D29 PSSI_D7 PI8 - - - - - - - - - - - - - - LCD_ PI9 - - - OCTOSPIM_P2_IO0 - - - - UART4_RX FDCAN1_RX - - FMC_D30 - EVENTOUT VSYNC LCD_ PI10 - - - OCTOSPIM_P2_IO1 - - - - - - - - FMC_D31 PSSI_D14 EVENTOUT HSYNC OTG_HS_ PI11 - - - OCTOSPIM_P2_IO2 - - - - - LCD_G6 - - PSSI_D15 - EVENTOUT EVENTOUT ULPI_DIR PI12 - - - OCTOSPIM_P2_IO3 - - - - - - - - - - LCD_HSYNC PI13 - - - OCTOSPIM_P2_CLK - - - - - - - - - - LCD_VSYNC EVENTOUT PI14 - - - OCTOSPIM_P2_NCLK - - - - - - - - - - LCD_CLK EVENTOUT PI15 - - - - - - - - - LCD_G2 - - - - LCD_R0 EVENTOUT STM32H7B3xI page 77/231 DS13139 - Rev 7 Table 17. Port J alternate functions AF0 AF1 Port J Port AF2 AF3 AF4 DFSDM1/LPTIM2/3/ LPUART1/ OCTOSPIM_P1/2/ TIM8 CEC/DCMI/ PSSI/ DFSDM1/2/ I2C1/2/3/4/ LPTIM2/ TIM15/ USART1 AF5 CEC/SPI1/ I2S1/SPI2/ I2S2/SPI3/ I2S3/SPI4/5/ SPI6/I2S6 AF6 AF7 SYS PDM_SAI1/ TIM3/4/5/12/15 PJ0 - - - - - - - PJ1 - - - OCTOSPIM_P2_IO4 - - - AF9 AF10 AF11 AF12 AF13 AF14 AF15 CRS/FMC/LCD/ OCTOSPIM_P1/ OTG1_FS/ OTG1_HS/SAI2/ SDMMC2/TIM8 DFSDM1/2/ I2C4/LCD/MDIOS/ OCTOSPIM_P1/ SDMMC2/ SWPMI1/TIM1/8/ UART7/9/ USART10 FMC/LCD/ MDIOS/ SDMMC1/ TIM1/8 COMP/ DCMI/ PSSI/LC D/TIM1 LCD/ UART5 SYS LPUART1/ SAI2/ SDMMC1/ SPDIFRX1/ SPI6/I2S6/ UART4/5/8 FDCAN1/2/FMC/LC D/ OCTOSPIM_P1/2/ SDMMC2/ SPDIFRX1/ TIM13/14 - - LCD_R7 - - - - LCD_R1 EVENTOUT - - - - - - - LCD_R2 EVENTOUT SDMMC1/SPI2/ I2S2/SPI3/I2S3/ SPI6/I2S6/ UART7/ USART1/2/3/6 DFSDM1/2/I2C4/ OCTOSPIM_P1/ SAI1/SPI3/I2S3/ UART4 LPTIM1/ TIM1/2/16/17 AF8 PJ2 - - - OCTOSPIM_P2_IO5 - - - - - - - - - - LCD_R3 EVENTOUT PJ3 - - - - - - - - - - - UART9_RTS - - LCD_R4 EVENTOUT PJ4 - - - - - - - - - - - UART9_CTS - - LCD_R5 EVENTOUT PJ5 - - - - - - - - - - - - - - LCD_R6 EVENTOUT EVENTOUT PJ6 - - - TIM8_CH2 - - - - - - - - - - LCD_R7 PJ7 TRGIN - - TIM8_CH2N - - - - - - - - - - LCD_G0 EVENTOUT PJ8 - TIM1_CH3N - TIM8_CH1 - - - - UART8_TX - - - - - LCD_G1 EVENTOUT PJ9 - TIM1_CH3 - TIM8_CH1N - - - - UART8_RX - - - - - LCD_G2 EVENTOUT PJ10 - TIM1_CH2N - TIM8_CH2 - SPI5_MOSI - - - - - - - - LCD_G3 EVENTOUT PJ11 - TIM1_CH2 - TIM8_CH2N - SPI5_MISO - - - - - - - - LCD_G4 EVENTOUT PJ12 TRGOUT - - - - - - - - LCD_G3 - - - - LCD_B0 EVENTOUT PJ13 - - - - - - - - - LCD_B4 - - - - LCD_B1 EVENTOUT PJ14 - - - - - - - - - - - - - - LCD_B2 EVENTOUT PJ15 - - - - - - - - - - - - - - LCD_B3 EVENTOUT Table 18. Port K alternate functions AF0 AF2 PDM_SAI1/ TIM3/4/5/12/15 AF3 AF4 DFSDM1/LPTIM2/3/ LPUART1/ OCTOSPIM_P1/2/ TIM8 CEC/DCMI/ PSSI/ DFSDM1/2/ I2C1/2/3/4/ LPTIM2/ TIM15/ USART1 AF5 CEC/SPI1/ I2S1/SPI2/ I2S2/SPI3/ I2S3/SPI4/5/ SPI6/I2S6 AF6 DFSDM1/2/I2C4/ OCTOSPIM_P1/ SAI1/SPI3/I2S3/ UART4 AF7 AF8 AF9 SDMMC1/SPI2/ I2S2/SPI3/I2S3/ SPI6/I2S6/ UART7/ USART1/2/3/6 LPUART1/ SAI2/ SDMMC1/ SPDIFRX1/ SPI6/I2S6/ UART4/5/8 FDCAN1/2/FMC/LC D/ OCTOSPIM_P1/2/ SDMMC2/ SPDIFRX1/ TIM13/14 AF10 AF11 AF12 AF13 AF14 AF15 CRS/FMC/LCD/ OCTOSPIM_P1/ OTG1_FS/OTG1_HS/ SAI2/SDMMC2/TIM8 DFSDM1/2/ I2C4/LCD/MDIOS/ OCTOSPIM_P1/ SDMMC2/SWPMI1/ TIM1/8/UART7/9/ USART10 FMC/LCD/ MDIOS/ SDMMC1/ TIM1/8 COMP/ DCMI/ PSSI/LC D/TIM1 LCD/ UART5 SYS SYS LPTIM1/ TIM1/2/16/17 PK0 - TIM1_CH1N - TIM8_CH3 - SPI5_SCK - - - - - - - - LCD_G5 EVENTOUT PK1 - TIM1_CH1 - TIM8_CH3N - SPI5_NSS - - - - - - - - LCD_G6 EVENTOUT EVENTOUT page 78/231 PK2 - TIM1_BKIN - TIM8_BKIN - - - - - - TIM8_BKIN_COMP12 TIM1_BKIN_COMP12 - - LCD_G7 PK3 - - - OCTOSPIM_P2_IO6 - - - - - - - - - - LCD_B4 EVENTOUT PK4 - - - OCTOSPIM_P2_IO7 - - - - - - - - - - LCD_B5 EVENTOUT PK5 - - - OCTOSPIM_P2_NCS - - - - - - - - - - LCD_B6 EVENTOUT PK6 - - - OCTOSPIM_P2_DQS - - - - - - - - - - LCD_B7 EVENTOUT PK7 - - - - - - - - - - - - - LCD_DE EVENTOUT STM32H7B3xI Port K Port AF1 STM32H7B3xI Electrical characteristics 6 Electrical characteristics 6.1 Parameter conditions Unless otherwise specified, all voltages are referenced to VSS. 6.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of junction temperature, supply voltage and frequencies by tests in production on 100% of the devices with an junction temperature at TJ = 25 °C and TJ = TJmax (given by the selected temperature range). Data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes. Based on characterization, the minimum and maximum values refer to sample tests and represent the mean value plus or minus three times the standard deviation (mean±3σ). 6.1.2 Typical values Unless otherwise specified, typical data are based on TJ = 25 °C, VDD = 3.3 V (for the 1.62 V ≤ VDD ≤ 3.6 V voltage range). They are given only as design guidelines and are not tested. Typical ADC accuracy values are determined by characterization of a batch of samples from a standard diffusion lot over the full temperature range, where 95% of the devices have an error less than or equal to the value indicated (mean±2σ). 6.1.3 Typical curves Unless otherwise specified, all typical curves are given only as design guidelines and are not tested. 6.1.4 Loading capacitor The loading conditions used for pin parameter measurement are shown in Figure 19. Pin loading conditions. 6.1.5 Pin input voltage The input voltage measurement on a pin of the device is described in Figure 20. Pin input voltage. Figure 19. Pin loading conditions Figure 20. Pin input voltage MCU pin MCU pin C = 50 pF DS13139 - Rev 7 V IN page 79/231 STM32H7B3xI Parameter conditions 6.1.6 Power supply scheme Figure 21. Power supply scheme VDDSMPS VDDSMPS 10 μF 4.7 μ F 4.7 μF 4.7 μF 2.2 μH SMPS Switched Mode Power Supply step down converter VLXSMPS 100 pF or 200 pF VFBSMPS VSSSMPS SMPS disabled SMPS enabled VCAP1/2 100 nF(1) 2.2 μF LDO enabled LDO disabled LDO Voltage regulator VCAP3 VDDLDO Core domain 100nF VDD Two different possible use cases PDR_ON POR/PDR VDDMMC VDDMMC 100 nF 1 μF VDDMMC IOs 100 nF Two different possible use cases VDD 100 nF(1) VDD IOs VDD VDD 4.7 μF VDD domain 100 nF(1) VSS Two different possible use cases Battery Power switch VBAT 1 μF Backup domain 100 nF BKUP IOs VDD50USB 5V 3.3V 4.7 μF USB regulator VDD33USB 1 μF 1 μF 100 nF USB FS IOs Two different possible use cases VDDA VREF+ VDDA 1 μF 47W Analog domain 100 nF VREF+ 1 μF 1 μF 100 nF VREFVSSA Three different possible use cases Defines different use case options Define power domaines DS13139 - Rev 7 page 80/231 STM32H7B3xI Absolute maximum ratings 1. 2. 100 nF filtering capacitor on each package pin. A tolerance of +/- 20% is acceptable on decoupling capacitors. Note: Refer to Getting started with STM32H7A3/7B3 and STM32H7B0 hardware development(AN5307) for more details. Caution: Each power supply pair (VDD/VSS, VDDA/VSSA ...) must be decoupled with filtering ceramic capacitors as shown above. These capacitors must be placed as close as possible to, or below, the appropriate pins on the underside of the PCB to ensure good operation of the device. It is not recommended to remove filtering capacitors to reduce PCB size or cost. This might cause incorrect operation of the device. 6.1.7 Current consumption measurement Figure 22. Current consumption measurement scheme SMPS ON LDO ON IDD_VBAT IDD_VBAT VBAT VBAT VDDMMC VDDMMC IDD IDD VDD VDD VDDSMPS VDDLDO VDDA VDDA 6.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 19. Voltage characteristics, Table 20. Current characteristics, and Table 21. Thermal characteristics may cause permanent damage to the device. These are stress ratings only and the functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 Qualification Standard, extended mission profiles are available on demand. Table 19. Voltage characteristics All main power (VDD, VDDA, VDD33USB, VDDMMC, VDDSMPS, VBAT) and ground (VSS, VSSA) pins must always be connected to the external power supply, in the permitted range. Symbols VDDX − VSS VIN(1) Ratings Min Max Unit −0.3 4.0 V Input voltage on FT_xxx pins VSS−0.3 Min(VDD, VDDA, VDD33USB, VDDMMC, VBAT) +4.0(2)(3) V Input voltage on TT_xx pins VSS−0.3 4.0 V Input voltage on BOOT0 pin VSS 9.0 V VSS−0.3 4.0 V - 50 mV External main supply voltage (including VDD, VDDLDO, VDDSMPS, VDDA, VDD33USB, VDDMMC, VBAT, VREF+) Input voltage on any other pins |ΔVDDX| DS13139 - Rev 7 Variations between different VDDX power pins of the same domain page 81/231 STM32H7B3xI Absolute maximum ratings Symbols Ratings Min Max Unit - 50 mV |VSSx−VSS| Variations between all the different ground pins 1. VIN maximum value must always be respected. Refer to Table 64. I/O current injection susceptibility for the maximum allowed injected current values. 2. To sustain a voltage higher than 4 V the internal pull-up/pull-down resistors must be disabled. 3. This formula has to be applied on power supplies related to the I/O structure described by the pin definition table. Table 20. Current characteristics Symbols Ratings Max ΣIVDD Total current into sum of all VDD power lines (source)(1) 620 ΣIVSS Total current out of sum of all VSS ground lines (sink)(1) 620 IVDD Maximum current into each VDD power pin (source)(1) 100 IVSS Maximum current out of each VSS ground pin (sink)(1) 100 IIO Output current sunk by any I/O and control pin ΣI(PIN) IINJ(PIN)(3)(4) ΣIINJ(PIN) Total output current sunk by sum of all I/Os and control Unit 20 pins(2) mA 140 Total output current sourced by sum of all I/Os and control pins(2) 140 Injected current on FT_xxx, TT_xx, RST and B pins except PA4, PA5 −5/+0 Injected current on PA4, PA5 −0/0 Total injected current (sum of all I/Os and control pins)(5) ±25 1. All main power (VDD, VDDA, VDDSMPS, VDDLDO, VDD33USB, VDDMMC) and ground (VSS, VSSA) pins must always be connected to the external power supplies, in the permitted range. 2. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be sunk/sourced between two consecutive power supply pins referring to high pin count QFP packages. 3. A positive injection is induced by VIN>VDD while a negative injection is induced by VIN