STM32L071x8 STM32L071xB
STM32L071xZ
Access line ultra-low-power 32-bit MCU Arm®-based Cortex®-M0+,
up to 192KB Flash, 20KB SRAM, 6KB EEPROM, ADC
Datasheet - production data
Features
FBGA
•
•
•
•
•
•
•
•
Ultra-low-power platform
– 1.65 V to 3.6 V power supply
– -40 to 125 °C temperature range
– 0.29 µA Standby mode (3 wakeup pins)
– 0.43 µA Stop mode (16 wakeup lines)
– 0.86 µA Stop mode + RTC + 20-Kbyte RAM
retention
– Down to 93 µA/MHz in Run mode
– 5 µs wakeup time (from Flash memory)
– 41 µA 12-bit ADC conversion at 10 ksps
Core: Arm® 32-bit Cortex®-M0+ with MPU
– From 32 kHz up to 32 MHz max.
– 0.95 DMIPS/MHz
Memories
– Up to 192-Kbyte Flash memory with ECC(2
banks with read-while-write capability)
– 20 -Kbyte RAM
– 6 Kbytes of data EEPROM with ECC
– 20-byte backup register
– Sector protection against R/W operation
Up to 84 fast I/Os (78 I/Os 5V tolerant)
Reset and supply management
– Ultra-safe, low-power BOR (brownout reset)
with 5 selectable thresholds
– Ultra-low-power POR/PDR
– Programmable voltage detector (PVD)
Clock sources
– 1 to 25 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– High speed internal 16 MHz factory-trimmed RC
(+/- 1%)
– Internal low-power 37 kHz RC
– Internal multispeed low-power 65 kHz to
4.2 MHz RC
– PLL for CPU clock
Pre-programmed bootloader
– USART, I2C, SPI supported
Development support
– Serial wire debug supported
November 2019
This is information on a product in full production.
LQFP32 (7x7 mm)
LQFP48 (7x7 mm)
LQFP64 (10x10 mm)
LQFP100 (14x14 mm)
UFQFxPN32
(5x5 mm)
UFQFPN48
(7x7 mm)
UFBGA64
TFBGA64
(5x5mm)
FBGA
UFBGA100
(7x7 mm)
WLCSP49
(3.294x3.258 mm)
•
•
•
•
•
•
Rich Analog peripherals
– 12-bit ADC 1.14 Msps up to 16 channels (down
to 1.65 V)
– 2x ultra-low-power comparators (window mode
and wake up capability, down to 1.65 V)
7-channel DMA controller, supporting ADC, SPI,
I2C, USART, Timers
Up to 10x peripheral communication interfaces
– 4x USART (2 with ISO 7816, IrDA), 1x UART
(low power)
– Up to 6x SPI 16 Mbits/s
– 3x I2C (2 with SMBus/PMBus)
11x timers: 2x 16-bit with up to 4 channels, 2x 16-bit
with up to 2 channels, 1x 16-bit ultra-low-power
timer, 1x SysTick, 1x RTC, 2x 16-bit basic, and 2x
watchdogs (independent/window)
CRC calculation unit, 96-bit unique ID
All packages are ECOPACK2
Table 1. Device summary
Reference
Part number
STM32L071x8
STM32L071V8, STM32L071K8,
STM32L071C8
STM32L071xB
STM32L071VB, STM32L071RB,
STM32L071CB, STM32L071KB
STM32L071xZ
STM32L071VZ, STM32L071RZ,
STM32L071CZ, STM32L071KZ
DS10690 Rev 7
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www.st.com
Contents
STM32L071xx
Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3
2.1
Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.2
Ultra-low-power device continuum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1
Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.2
Interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3
Arm® Cortex®-M0+ core with MPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.4
Reset and supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.4.1
Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.4.2
Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.4.3
Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.5
Clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.6
Low-power real-time clock and backup registers . . . . . . . . . . . . . . . . . . . 25
3.7
General-purpose inputs/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.8
Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.9
Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.10
Direct memory access (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.11
Analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.12
Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.12.1
3.13
Ultra-low-power comparators and reference voltage . . . . . . . . . . . . . . . . 28
3.14
Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.15
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Internal voltage reference (VREFINT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.14.1
General-purpose timers (TIM2, TIM3, TIM21 and TIM22) . . . . . . . . . . . 29
3.14.2
Low-power Timer (LPTIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.14.3
Basic timer (TIM6, TIM7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.14.4
SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.14.5
Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.14.6
Window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
DS10690 Rev 7
STM32L071xx
Contents
3.15.1
I2C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.15.2
Universal synchronous/asynchronous receiver transmitter (USART) . . 32
3.15.3
Low-power universal asynchronous receiver transmitter (LPUART) . . . 32
3.15.4
Serial peripheral interface (SPI)/Inter-integrated sound (I2S) . . . . . . . . 33
3.16
Cyclic redundancy check (CRC) calculation unit . . . . . . . . . . . . . . . . . . . 33
3.17
Serial wire debug port (SW-DP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4
Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5
Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
6.1
Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
6.1.1
Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
6.1.2
Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
6.1.3
Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
6.1.4
Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
6.1.5
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
6.1.6
Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
6.1.7
Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
6.2
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
6.3
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
6.3.1
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
6.3.2
Embedded reset and power control block characteristics . . . . . . . . . . . 62
6.3.3
Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 63
6.3.4
Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
6.3.5
Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
6.3.6
External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
6.3.7
Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
6.3.8
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
6.3.9
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
6.3.10
EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
6.3.11
Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
6.3.12
I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
6.3.13
I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
6.3.14
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
6.3.15
12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
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STM32L071xx
6.3.16
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
6.3.17
Comparators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
6.3.18
Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
6.3.19
Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
7.1
LQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
7.2
UFBGA100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116
7.3
LQFP64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118
7.4
UFBGA64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
7.5
TFBGA64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
7.6
WLCSP49 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
7.7
LQFP48 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
7.8
UFQFPN48 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
7.9
LQFP32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
7.10
UFQFPN32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
7.11
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
7.11.1
Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
8
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
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List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ultra-low-power STM32L071xx device features and peripheral counts . . . . . . . . . . . . . . . 12
Functionalities depending on the operating power supply range . . . . . . . . . . . . . . . . . . . . 16
CPU frequency range depending on dynamic voltage scaling . . . . . . . . . . . . . . . . . . . . . . 17
Functionalities depending on the working mode
(from Run/active down to standby) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
STM32L0xx peripherals interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Internal voltage reference measured values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Comparison of I2C analog and digital filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
STM32L071xx I2C implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
USART implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
SPI/I2S implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
STM32L071xxx pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Alternate functions port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Alternate functions port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Alternate functions port C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Alternate functions port D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Alternate functions port E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Alternate functions port H . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 62
Embedded internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Current consumption in Run mode, code with data processing running from
Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Current consumption in Run mode vs code type,
code with data processing running from Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Current consumption in Run mode, code with data processing running from RAM . . . . . . 67
Current consumption in Run mode vs code type,
code with data processing running from RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Current consumption in Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Current consumption in Low-power run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Current consumption in Low-power sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Typical and maximum current consumptions in Stop mode . . . . . . . . . . . . . . . . . . . . . . . . 72
Typical and maximum current consumptions in Standby mode . . . . . . . . . . . . . . . . . . . . . 73
Average current consumption during Wakeup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Peripheral current consumption in Run or Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Peripheral current consumption in Stop and Standby mode . . . . . . . . . . . . . . . . . . . . . . . 77
Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
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List of tables
Table 45.
Table 46.
Table 47.
Table 48.
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Table 70.
Table 71.
Table 72.
Table 73.
Table 74.
Table 75.
Table 76.
Table 77.
Table 78.
Table 79.
Table 80.
Table 81.
Table 82.
Table 83.
Table 84.
Table 85.
Table 86.
Table 87.
Table 88.
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STM32L071xx
LSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
16 MHz HSI16 oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
MSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
RAM and hardware registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Flash memory and data EEPROM characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Flash memory and data EEPROM endurance and retention . . . . . . . . . . . . . . . . . . . . . . . 87
EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
RAIN max for fADC = 16 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Comparator 1 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Comparator 2 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
SPI characteristics in voltage Range 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
SPI characteristics in voltage Range 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
SPI characteristics in voltage Range 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
I2S characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
LQPF100 - 100-pin, 14 x 14 mm low-profile quad flat package
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
UFBGA100 recommended PCB design rules (0.5 mm pitch BGA) . . . . . . . . . . . . . . . . . 117
LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch
ball grid array package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
UFBGA64 recommended PCB design rules (0.5 mm pitch BGA) . . . . . . . . . . . . . . . . . . 122
TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch thin profile fine pitch ball grid
array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
TFBGA64 recommended PCB design rules (0.5 mm pitch BGA). . . . . . . . . . . . . . . . . . . 124
WLCSP49 - 49-pin, 3.294 x 3.258 mm, 0.4 mm pitch wafer level chip scale
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
WLCSP49 recommended PCB design rules (0.4 mm pitch) . . . . . . . . . . . . . . . . . . . . . . 128
LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package mechanical data. . . . . . . . . . . 130
UFQFPN48 - 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package mechanical data. . . . . . . . . . . 136
UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
DS10690 Rev 7
STM32L071xx
Table 89.
Table 90.
List of tables
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
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7
List of figures
STM32L071xx
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
8/148
STM32L071xx block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
STM32L071xx LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
STM32L071xx UFBGA100 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
STM32L071xx LQFP64 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
STM32L071xx UFBGA64/TFBGA64 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
STM32L071xx WLCSP49 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
STM32L071xx LQFP48 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
STM32L071xx UFQFPN48 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
STM32L071xx LQFP32 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
STM32L071xx UFQFPN32 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
IDD vs VDD, at TA= 25/55/85/105 °C, Run mode, code running from
Flash memory, Range 2, HSE, 1WS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
IDD vs VDD, at TA= 25/55/85/105 °C, Run mode, code running from
Flash memory, Range 2, HSI16, 1WS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
IDD vs VDD, at TA= 25 °C, Low-power run mode, code running
from RAM, Range 3, MSI (Range 0) at 64 KHz, 0 WS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
IDD vs VDD, at TA= 25/55/ 85/105/125 °C, Stop mode with RTC enabled
and running on LSE Low drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
IDD vs VDD, at TA= 25/55/85/105/125 °C, Stop mode with RTC disabled,
all clocks OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
HSE oscillator circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
HSI16 minimum and maximum value versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . 84
VIH/VIL versus VDD (CMOS I/Os) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
VIH/VIL versus VDD (TTL I/Os) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Power supply and reference decoupling (VREF+ not connected to VDDA) . . . . . . . . . . . . 101
Power supply and reference decoupling (VREF+ connected to VDDA). . . . . . . . . . . . . . . . 102
SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
LQFP100 - 100-pin, 14 x 14 mm low-profile quad flat package outline . . . . . . . . . . . . . . 113
LQFP100 - 100-pin, 14 x 14 mm low-profile quad flat
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
LQFP100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball
DS10690 Rev 7
STM32L071xx
Figure 43.
Figure 44.
Figure 45.
Figure 46.
Figure 47.
Figure 48.
Figure 49.
Figure 50.
Figure 51.
Figure 52.
Figure 53.
Figure 54.
Figure 55.
Figure 56.
Figure 57.
Figure 58.
Figure 59.
Figure 60.
Figure 61.
Figure 62.
Figure 63.
Figure 64.
Figure 65.
Figure 66.
Figure 67.
List of figures
grid array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball
grid array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . 118
LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat recommended footprint . . . . . . . . . . 119
LQFP64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch
ball grid array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch
ball grid array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch thin profile fine pitch ball
grid array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball
,grid array recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
TFBGA64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
WLCSP49 - 49-pin, 3.294 x 3.258 mm, 0.4 mm pitch wafer level chip scale
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
WLCSP49 - 49-pin, 3.294 x 3.258 mm, 0.4 mm pitch wafer level chip scale
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
WLCSP49 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 129
LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat recommended footprint . . . . . . . . . . . . 130
LQFP48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
UFQFPN48 - 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
UFQFPN48 - 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
UFQFPN48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 135
LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat recommended footprint . . . . . . . . . . . . 136
LQFP32 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
UFQFPN32 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
Thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
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9
Introduction
1
STM32L071xx
Introduction
The ultra-low-power STM32L071xx are offered in 10 different package types from 32 pins to
100 pins. Depending on the device chosen, different sets of peripherals are included, the
description below gives an overview of the complete range of peripherals proposed in this
family.
These features make the ultra-low-power STM32L071xx microcontrollers suitable for a wide
range of applications:
•
Gas/water meters and industrial sensors
•
Healthcare and fitness equipment
•
Remote control and user interface
•
PC peripherals, gaming, GPS equipment
•
Alarm system, wired and wireless sensors, video intercom
This STM32L071xx datasheet should be read in conjunction with the STM32L0x1xx
reference manual (RM0377).
For information on the Arm®(a) Cortex®-M0+ core please refer to the Cortex®-M0+ Technical
Reference Manual, available from the www.arm.com website.
Figure 1 shows the general block diagram of the device family.
a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
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DS10690 Rev 7
STM32L071xx
2
Description
Description
The access line ultra-low-power STM32L071xx microcontrollers incorporate the highperformance Arm Cortex-M0+ 32-bit RISC core operating at a 32 MHz frequency, a memory
protection unit (MPU), high-speed embedded memories (up to 192 Kbytes of Flash program
memory, 6 Kbytes of data EEPROM and 20 Kbytes of RAM) plus an extensive range of
enhanced I/Os and peripherals.
The STM32L071xx devices provide high power efficiency for a wide range of performance.
It is achieved with a large choice of internal and external clock sources, an internal voltage
adaptation and several low-power modes.
The STM32L071xx devices offer several analog features, one 12-bit ADC with hardware
oversampling, two ultra-low-power comparators, several timers, one low-power timer
(LPTIM), four general-purpose 16-bit timers and two basic timer, one RTC and one SysTick
which can be used as timebases. They also feature two watchdogs, one watchdog with
independent clock and window capability and one window watchdog based on bus clock.
Moreover, the STM32L071xx devices embed standard and advanced communication
interfaces: up to three I2Cs, two SPIs, one I2S, four USARTs, a low-power UART
(LPUART), .
The STM32L071xx also include a real-time clock and a set of backup registers that remain
powered in Standby mode.
The ultra-low-power STM32L071xx devices operate from a 1.8 to 3.6 V power supply (down
to 1.65 V at power down) with BOR and from a 1.65 to 3.6 V power supply without BOR
option. They are available in the -40 to +125 °C temperature range. A comprehensive set of
power-saving modes allows the design of low-power applications.
DS10690 Rev 7
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33
Description
2.1
STM32L071xx
Device overview
Table 2. Ultra-low-power STM32L071xx device features and peripheral counts
Peripheral
STM32L
071K8
STM32L
071C8
Flash (Kbytes)
64 Kbytes
Data EEPROM
(Kbytes)
3 Kbytes
STM32L
071V8
STM32L
071KB
STM32L
071CB
4
Basic
2
LPTIME
R
1
1/1/1/1
4(3)(1)/0
6(4)(2)/1
4(3)(1)/0
6(4)(2)/1
4(3)(1)/0
6(4)(2)/1
I 2C
2
3
2
3
2
3
USART
3
4
4(3)
4
4(3)
4
GPIOs
1
23
37
84
25(3)
40(4)
Clocks:
HSE/LSE/HSI/MSI/LS
I
12-bit synchronized
ADC
Number of channels
84
51(5)
25(3)
40(4)
84
51(5)
1
16(5)
1
10
1
13(4)
1
16
1
16(5)
1/1/1/1/1
1
10
1
13
1
16
1
10
1
16
1
13(4)
Comparators
2
Max. CPU frequency
Operating voltage
STM32
L
071RZ
20 Kbytes
LPUART
32 MHz
1.8 V to 3.6 V (down to 1.65 V at power-down) with BOR option 1.65 to 3.6 V without BOR option
Operating
temperatures
Ambient temperature: –40 to +125 °C
Junction temperature: –40 to +130 °C
LQFP/
UFQFPN
UFQFPN
32
48
LQFP/
UFBGA
100
LQFP/
UFQFPN/
UFQFPN48
LQFP32
WLCSP49
LQFP/
UFBGA
100
1. 3 SPI interfaces are USARTs operating in SPI master mode.
2. 4 SPI interfaces are USARTs operating in SPI master mode.
3. UFQFPN32 has 2 GPIOs and 1 UART less than LQFP32.
4. LQFP48 and UFQFPN48 have three GPIOs less than WLCSP49.
5. TFBGA64 has one GPIO, one ADC input less than LQFP64.
12/148
STM32L
071VZ
192 Kbytes
Generalpurpose
SPI/I2S
Packages
STM32L
071CZ
6 Kbytes
RTC/SYSTICK/IWDG
/WWDG
Com.
interfaces
STM32L
071KZ
128 Kbytes
RAM (Kbytes)
Timers
STM32L STM32L
071VB
071RB
DS10690 Rev 7
LQFP/
TFBGA
64
LQFP/
UFQFPN/
UFQFPN48
LQFP32
WLCSP49
LQFP/
UFBGA
100
LQFP/
TFBGA
64
STM32L071xx
Description
Figure 1. STM32L071xx block diagram
Temp
sensor
SWD
SWD
FLASH
EEPROM
BOOT
FIREWALL
CORTEX M0+ CPU
Fmax:32MHz
ADC1
AINx
SPI1
MISO, MOSI,
SCK, NSS
USART1
RX, TX, RTS,
CTS, CK
RAM
MPU
DBG
DMA1
NVIC
EXTI
A
P
B
2
TIM21
2ch
TIM22
2ch
BRIDGE
PA[0:15]
GPIO PORT A
PB[0:8]
GPIO PORT B
COMP1
INP, INM, OUT
COMP2
INP, INM, OUT
LPTIM1
IN1, IN2,
ETR, OUT
CRC
BRIDGE
RAM 1K
AHB: Fmax 32MHz
TIM6
TIM7
A
P
B
1
OSC_IN,
OSC_OUT
HSE
HSI 16M
LSI
SCL, SDA,
SMBA
I2C2
SCL, SDA
I2C3
SCL, SDA,
SMBA
USART2
RX, TX, RTS,
CTS, CK
USART4
RX, TX, RTS,
CTS, CK
IWDG
TIM2
RX, TX, RTS,
CTS, CK
RX, TX, RTS,
CTS
MISO/MCK,
MOSI/SD,
SCK/CK, NSS/
WS
4ch
TIM3
4ch
USART5
PLL
MSI
RTC
LPUART1
BCKP REG
SPI2/I2S
RESET & CLK
WKUPx
OSC32_IN,
OSC32_OUT
I2C1
WWDG
LSE
PVD_IN
VREF_OUT
PMU
NRST
VDDA
VDD
REGULATOR
MSv35454V1
DS10690 Rev 7
13/148
33
Description
2.2
STM32L071xx
Ultra-low-power device continuum
The ultra-low-power family offers a large choice of core and features, from 8-bit proprietary
core up to Arm® Cortex®-M4, including Arm® Cortex®-M3 and Arm® Cortex®-M0+. The
STM32Lx series are the best choice to answer your needs in terms of ultra-low-power
features. The STM32 ultra-low-power series are the best solution for applications such as
gaz/water meter, keyboard/mouse or fitness and healthcare application. Several built-in
features like LCD drivers, dual-bank memory, low-power run mode, operational amplifiers,
128-bit AES, DAC, crystal-less USB and many other definitely help you building a highly
cost optimized application by reducing BOM cost. STMicroelectronics, as a reliable and
long-term manufacturer, ensures as much as possible pin-to-pin compatibility between all
STM8Lx and STM32Lx on one hand, and between all STM32Lx and STM32Fx on the other
hand. Thanks to this unprecedented scalability, your legacy application can be upgraded to
respond to the latest market feature and efficiency requirements.
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DS10690 Rev 7
STM32L071xx
Functional overview
3
Functional overview
3.1
Low-power modes
The ultra-low-power STM32L071xx support dynamic voltage scaling to optimize its power
consumption in Run mode. The voltage from the internal low-drop regulator that supplies
the logic can be adjusted according to the system’s maximum operating frequency and the
external voltage supply.
There are three power consumption ranges:
•
Range 1 (VDD range limited to 1.71-3.6 V), with the CPU running at up to 32 MHz
•
Range 2 (full VDD range), with a maximum CPU frequency of 16 MHz
•
Range 3 (full VDD range), with a maximum CPU frequency limited to 4.2 MHz
Seven low-power modes are provided to achieve the best compromise between low-power
consumption, short startup time and available wakeup sources:
•
Sleep mode
In Sleep mode, only the CPU is stopped. All peripherals continue to operate and can
wake up the CPU when an interrupt/event occurs. Sleep mode power consumption at
16 MHz is about 1 mA with all peripherals off.
•
Low-power run mode
This mode is achieved with the multispeed internal (MSI) RC oscillator set to the lowspeed clock (max 131 kHz), execution from SRAM or Flash memory, and internal
regulator in low-power mode to minimize the regulator's operating current. In Lowpower run mode, the clock frequency and the number of enabled peripherals are both
limited.
•
Low-power sleep mode
This mode is achieved by entering Sleep mode with the internal voltage regulator in
low-power mode to minimize the regulator’s operating current. In Low-power sleep
mode, both the clock frequency and the number of enabled peripherals are limited; a
typical example would be to have a timer running at 32 kHz.
When wakeup is triggered by an event or an interrupt, the system reverts to the Run
mode with the regulator on.
Stop mode with RTC
The Stop mode achieves the lowest power consumption while retaining the RAM and
register contents and real time clock. All clocks in the VCORE domain are stopped, the
PLL, MSI RC, HSE crystal and HSI RC oscillators are disabled. The LSE or LSI is still
running. The voltage regulator is in the low-power mode.
Some peripherals featuring wakeup capability can enable the HSI RC during Stop
mode to detect their wakeup condition.
The device can be woken up from Stop mode by any of the EXTI line, in 3.5 µs, the
processor can serve the interrupt or resume the code. The EXTI line source can be any
GPIO. It can be the PVD output, the comparator 1 event or comparator 2 event
(if internal reference voltage is on), it can be the RTC alarm/tamper/timestamp/wakeup
events, the USART/I2C/LPUART/LPTIMER wakeup events.
DS10690 Rev 7
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33
Functional overview
•
STM32L071xx
Stop mode without RTC
The Stop mode achieves the lowest power consumption while retaining the RAM and
register contents. All clocks are stopped, the PLL, MSI RC, HSI and LSI RC, HSE and
LSE crystal oscillators are disabled.
Some peripherals featuring wakeup capability can enable the HSI RC during Stop
mode to detect their wakeup condition.
The voltage regulator is in the low-power mode. The device can be woken up from Stop
mode by any of the EXTI line, in 3.5 µs, the processor can serve the interrupt or
resume the code. The EXTI line source can be any GPIO. It can be the PVD output, the
comparator 1 event or comparator 2 event (if internal reference voltage is on). It can
also be wakened by the USART/I2C/LPUART/LPTIMER wakeup events.
•
Standby mode with RTC
The Standby mode is used to achieve the lowest power consumption and real time
clock. The internal voltage regulator is switched off so that the entire VCORE domain is
powered off. The PLL, MSI RC, HSE crystal and HSI RC oscillators are also switched
off. The LSE or LSI is still running. After entering Standby mode, the RAM and register
contents are lost except for registers in the Standby circuitry (wakeup logic, IWDG,
RTC, LSI, LSE Crystal 32 KHz oscillator, RCC_CSR register).
The device exits Standby mode in 60 µs when an external reset (NRST pin), an IWDG
reset, a rising edge on one of the three WKUP pins, RTC alarm (Alarm A or Alarm B),
RTC tamper event, RTC timestamp event or RTC Wakeup event occurs.
•
Standby mode without RTC
The Standby mode is used to achieve the lowest power consumption. The internal
voltage regulator is switched off so that the entire VCORE domain is powered off. The
PLL, MSI RC, HSI and LSI RC, HSE and LSE crystal oscillators are also switched off.
After entering Standby mode, the RAM and register contents are lost except for
registers in the Standby circuitry (wakeup logic, IWDG, RTC, LSI, LSE Crystal 32 KHz
oscillator, RCC_CSR register).
The device exits Standby mode in 60 µs when an external reset (NRST pin) or a rising
edge on one of the three WKUP pin occurs.
Note:
The RTC, the IWDG, and the corresponding clock sources are not stopped automatically by
entering Stop or Standby mode.
Table 3. Functionalities depending on the operating power supply range
Operating power supply range(1)
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Functionalities depending on the operating power
supply range
ADC operation
Dynamic voltage scaling
range
VDD = 1.65 to 1.71 V
ADC only, conversion time
up to 570 ksps
Range 2 or
range 3
VDD = 1.71 to 1.8 V(2)
ADC only, conversion time
up to 1.14 Msps
Range 1, range 2 or range 3
VDD = 1.8 to 2.0 V(2)
Conversion time up to 1.14
Msps
Range1, range 2 or range 3
DS10690 Rev 7
STM32L071xx
Functional overview
Table 3. Functionalities depending on the operating power supply range (continued)
Operating power supply range(1)
Functionalities depending on the operating power
supply range
ADC operation
Dynamic voltage scaling
range
VDD = 2.0 to 2.4 V
Conversion time up to 1.14
Msps
Range 1, range 2 or range 3
VDD = 2.4 to 3.6 V
Conversion time up to 1.14
Msps
Range 1, range 2 or range 3
1. GPIO speed depends on VDD voltage. Refer to Table 60: I/O AC characteristics for more information about
I/O speed.
2. CPU frequency changes from initial to final must respect "fcpu initial