STM32L151x6/8/B-A
STM32L152x6/8/B-A
Ultra-low-power 32-bit MCU ARM®-based Cortex®-M3,
128KB Flash, 32KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC
Datasheet - production data
Features
• Ultra-low-power platform
– 1.65 V to 3.6 V power supply
– -40°C to 105°C temperature range
– 0.28 µA Standby mode (3 wakeup pins)
– 1.11 µA Standby mode + RTC
– 0.44 µA Stop mode (16 wakeup lines)
– 1.38 µA Stop mode + RTC
– 10.9 µA Low-power Run mode
– 185 µA/MHz Run mode
– 10 nA ultra-low I/O leakage
– < 8 µs wakeup time
• Core: ARM® Cortex®-M3 32-bit CPU
– From 32 kHz up to 32 MHz max
– 1.25 DMIPS/MHz (Dhrystone 2.1)
– Memory protection unit
• Reset and supply management
– Ultra-safe, low-power BOR (brownout
reset) with 5 selectable thresholds
– Ultra-low-power POR/PDR
– Programmable voltage detector (PVD)
• Clock sources
– 1 to 24 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– High Speed Internal 16 MHz factorytrimmed RC (+/- 1%)
– Internal low-power 37 kHz RC
– Internal multispeed low-power 65 kHz to
4.2 MHz
– PLL for CPU clock and USB (48 MHz)
• Pre-programmed bootloader
– USART supported
• Development support
– Serial wire debug supported
– JTAG and trace supported
• Up to 83 fast I/Os (73 I/Os 5V tolerant), all
mappable on 16 external interrupt vectors
• Memories
– Up to 128 Kbytes Flash memory with ECC
– Up to 32 Kbytes RAM
– Up to 4 Kbytes of true EEPROM with ECC
– 80-byte backup register
August 2017
This is information on a product in full production.
LQFP100 14 × 14 mm
LQFP64 10 × 10 mm
LQFP48 7 × 7 mm
UFBGA100 7 × 7 mm
TFBGA64 5 × 5 mm
UFQFPN48
7 × 7 mm
• LCD Driver (except STM32L151x6/8/B-A
devices) for up to 8x40 segments
– Support contrast adjustment
– Support blinking mode
– Step-up converter on board
• Rich analog peripherals (down to 1.8 V)
– 12-bit ADC 1 Msps up to 24 channels
– 12-bit DAC 2 channels with output buffers
– 2x ultra-low-power-comparators
(window mode and wake up capability)
• DMA controller 7x channels
• 8x peripheral communication interfaces
– 1x USB 2.0 (internal 48 MHz PLL)
– 3x USART (ISO 7816, IrDA)
– 2x SPI 16 Mbits/s
– 2x I2C (SMBus/PMBus)
• 10x timers: 6x 16-bit with up to 4 IC/OC/PWM
channels, 2x 16-bit basic timers, 2x watchdog
timers (independent and window)
• Up to 20 capacitive sensing channels
supporting touchkey, linear and rotary touch
sensors
• CRC calculation unit, 96-bit unique ID
Table 1. Device summary
Reference
Part number
STM32L151CB-A,
STM32L151C8-A,
STM32L151C6-A,
STM32L151RB-A,
STM32L151R8-A,
STM32L151R6-A,
STM32L151VB-A,
STM32L151V8-A
STM32L151CBxxA
STM32L151C8xxA,
STM32L151C6xxA,
STM32L151RBxxA,
STM32L151R8xxA,
STM32L151R6xxA,
STM32L151VBxxA,
STM32L151V8xxA
STM32L152CB-A,
STM32L152C8-A,
STM32L152C6-A,
STM32L152RB-A,
STM32L152R8-A,
STM32L152R6-A,
STM32L152VB-A,
STM32L152V8-A
STM32L152CBxxA,
STM32L152C8xxA,
STM32L152C6xxA,
STM32L152RBxxA,
STM32L152R8xxA,
STM32L152R6xxA,
STM32L152VBxxA,
STM32L152V8xxA
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Contents
STM32L151x6/8/B-A STM32L152x6/8/B-A
Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3
2/130
2.1
Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
2.2
Ultra-low-power device continuum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.2.1
Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.2.2
Shared peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.2.3
Common system strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.2.4
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1
Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.2
ARM® Cortex®-M3 core with MPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3
Reset and supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3.1
Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3.2
Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3.3
Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.3.4
Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.4
Clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.5
Low-power real-time clock and backup registers . . . . . . . . . . . . . . . . . . . 23
3.6
GPIOs (general-purpose inputs/outputs) . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.7
Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.8
DMA (direct memory access) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.9
LCD (liquid crystal display) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.10
ADC (analog-to-digital converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.10.1
Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.10.2
Internal voltage reference (VREFINT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.11
DAC (digital-to-analog converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.12
Ultra-low-power comparators and reference voltage . . . . . . . . . . . . . . . . 27
3.13
Routing interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.14
Touch sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.15
Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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Contents
3.15.1
General-purpose timers (TIM2, TIM3, TIM4, TIM9, TIM10 and TIM11) . 29
3.15.2
Basic timers (TIM6 and TIM7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.15.3
SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.15.4
Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.15.5
Window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.16.1
I²C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.16.2
Universal synchronous/asynchronous receiver transmitter (USART) . . 30
3.16.3
Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.16.4
Universal serial bus (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.17
CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . . 31
3.18
Development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4
Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5
Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
6.1
Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
6.1.1
Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
6.1.2
Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
6.1.3
Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
6.1.4
Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
6.1.5
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
6.1.6
Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.1.7
Optional LCD power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
6.1.8
Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
6.2
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6.3
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
6.3.1
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
6.3.2
Embedded reset and power control block characteristics . . . . . . . . . . . 57
6.3.3
Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 59
6.3.4
Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
6.3.5
Wakeup time from Low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
6.3.6
External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
6.3.7
Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
6.3.8
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
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6.3.9
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
6.3.10
EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
6.3.11
Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
6.3.12
I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
6.3.13
I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
6.3.14
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
6.3.15
TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
6.3.16
Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
6.3.17
12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
6.3.18
DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
6.3.19
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
6.3.20
Comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
6.3.21
LCD controller (STM32L152x6/8/B-A devices only) . . . . . . . . . . . . . . 105
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
7.1
LQFP100 14 x 14 mm, 100-pin low-profile quad flat package
information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
7.2
LQFP64 10 x 10 mm, 64-pin low-profile quad flat package information . 109
7.3
LQFP48 7 x 7 mm, 48-pin low-profile quad flat package information . . . .112
7.4
UFQFPN48 7 x 7 mm, 0.5 mm pitch, package information . . . . . . . . . . .115
7.5
UFBGA100 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch ball
grid array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118
7.6
TFBGA64 5 x 5 mm, 0.5 mm pitch, thin fine-pitch ball grid
array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
7.7
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
7.7.1
Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
8
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
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List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Table 46.
Table 47.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A device features
and peripheral counts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Functionalities depending on the operating power supply range . . . . . . . . . . . . . . . . . . . . 15
CPU frequency range depending on dynamic voltage scaling . . . . . . . . . . . . . . . . . . . . . . 16
Working mode-dependent functionalities (from Run/active down to standby) . . . . . . . . . . 17
VLCD rail decoupling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
STM32L151x6/8/B-A and STM32L152x6/8/B-A pin definitions . . . . . . . . . . . . . . . . . . . . . 39
Alternate function input/output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 57
Embedded internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Current consumption in Run mode, code with data processing running from Flash. . . . . . 61
Current consumption in Run mode, code with data processing running from RAM . . . . . . 62
Current consumption in Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Current consumption in Low-power run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Current consumption in Low-power sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Typical and maximum current consumptions in Stop mode . . . . . . . . . . . . . . . . . . . . . . . . 66
Typical and maximum current consumptions in Standby mode . . . . . . . . . . . . . . . . . . . . . 68
Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
MSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
RAM and hardware registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Flash memory and data EEPROM characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Flash memory, data EEPROM endurance and data retention . . . . . . . . . . . . . . . . . . . . . . 80
EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
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6
List of tables
Table 48.
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Table 70.
Table 71.
Table 72.
Table 73.
Table 74.
6/130
STM32L151x6/8/B-A STM32L152x6/8/B-A
I2C characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
SCL frequency (fPCLK1= 32 MHz, VDD = VDD_I2C = 3.3 V). . . . . . . . . . . . . . . . . . . . . . . . 90
SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
USB startup time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
USB DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
USB: full speed electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
ADC clock frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Maximum source impedance RAIN max . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Comparator 1 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Comparator 2 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
LCD controller characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
LQPF100 14 x 14 mm, 100-pin low-profile quad flat package
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
LQFP64 10 x 10 mm, 64-pin low-profile quad flat package mechanical data. . . . . . . . . . 109
LQFP48 7 x 7 mm, 48-pin low-profile quad flat package mechanical data. . . . . . . . . . . . 113
UFQFPN48 7 x 7 mm, 0.5 mm pitch, package mechanical data . . . . . . . . . . . . . . . . . . . 116
UFBGA100 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch ball grid array
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
UFBGA100 7 x 7 mm, 0.5 mm pitch, recommended PCB design rules . . . . . . . . . . . . . . 119
TFBGA64 5 x 5 mm, 0.5 mm pitch, thin fine-pitch ball grid array
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
TFBGA64 5 x 5 mm, 0.5 mm pitch, recommended PCB design rules . . . . . . . . . . . . . . . 122
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
DocID024330 Rev 5
STM32L151x6/8/B-A STM32L152x6/8/B-A
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
Figure 43.
Figure 44.
Figure 45.
Ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A block diagram . . . . . . . . 13
Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
STM32L15xVxxxA UFBGA100 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
STM32L15xVxxxA LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
STM32L15xRxxxA TFBGA64 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
STM32L15xRxxxA LQFP64 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
STM32L15xCxxxA LQFP48 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
STM32L15xCxxxA UFQFPN48 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Optional LCD power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
HSE oscillator circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
I2C bus AC waveforms and measurement circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
USB timings: definition of data signal rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Maximum dynamic current consumption on VREF+ supply pin during ADC
conversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
LQFP100 14 x 14 mm, 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 106
LQPF100 14 x 14 mm, 100-pin low-profile quad flat package recommended footprint . . 108
LQFP100 14 x 14 mm, 100-pin package top view example . . . . . . . . . . . . . . . . . . . . . . . 108
LQFP64 10 x 10 mm, 64-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . 109
LQFP64 10 x 10 mm, 64-pin low-profile quad flat package recommended footprint . . . . 110
LQFP64 10 x 10 mm, 64-pin low-profile quad flat package top view example . . . . . . . . . 111
LQFP48 7 x 7 mm, 48-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . 112
LQFP48 7 x 7 mm, 48-pin low-profile quad flat package recommended footprint . . . . . . 114
LQFP48 7 x 7 mm, 48-pin low-profile quad flat package top view example . . . . . . . . . . . 114
UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
UFQFPN48 7 x 7 mm, 0.5 mm pitch, package recommended footprint . . . . . . . . . . . . . . 116
UFQFPN48 7 x 7 mm, 0.5 mm pitch, package top view example . . . . . . . . . . . . . . . . . . 117
UFBGA100, 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch ball grid array
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
UFBGA100 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch ball grid array
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
UFBGA100 7 x 7 mm, 0.5 mm pitch, package top view example. . . . . . . . . . . . . . . . . . . 120
TFBGA64 5 x 5 mm, 0.5 mm pitch, thin fine-pitch ball grid array
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8
List of figures
Figure 46.
Figure 47.
Figure 48.
Figure 49.
8/130
STM32L151x6/8/B-A STM32L152x6/8/B-A
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
TFBGA64, 5 x 5 mm, 0.5 mm pitch, thin fine-pitch ball grid array
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
TFBGA64 5 x 5 mm, 0.5 mm pitch, package top view example . . . . . . . . . . . . . . . . . . . . 123
Thermal resistance suffix 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Thermal resistance suffix 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
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1
Introduction
Introduction
This datasheet provides the ordering information and mechanical device characteristics of
the STM32L151x6/8/B-A and STM32L152x6/8/B-A ultra-low-power ARM® Cortex®-M3
based microcontrollers product line.
The ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A microcontroller family
includes devices in 3 different package types: from 48 to 100 pins. Depending on the device
chosen, different sets of peripherals are included, the description below gives an overview
of the complete range of peripherals proposed in this family.
These features make the ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A
microcontroller family suitable for a wide range of applications:
•
Medical and handheld equipment
•
Application control and user interface
•
PC peripherals, gaming, GPS and sport equipment
•
Alarm systems, Wired and wireless sensors, Video intercom
•
Utility metering
This STM32L151x6/8/B-A and STM32L152x6/8/B-A datasheet should be read in
conjunction with the STM32L1xxxx reference manual (RM0038). The document "Getting
started with STM32L1xxxx hardware development” AN3216 gives a hardware
implementation overview.
Both documents are available from the STMicroelectronics website www.st.com.
For information on the ARM® Cortex®-M3 core please refer to the Cortex®-M3 Technical
Reference Manual, available from the ARM website.
Figure 1 shows the general block diagram of the device family.
Caution:
This datasheet does not apply to:
– STM32L15xx6/8/B
covered by a separate datasheet.
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51
Description
2
STM32L151x6/8/B-A STM32L152x6/8/B-A
Description
The ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A devices incorporate the
connectivity power of the universal serial bus (USB) with the high-performance ARM®
Cortex®-M3 32-bit RISC core operating at a frequency of 32 MHz (33.3 DMIPS), a memory
protection unit (MPU), high-speed embedded memories (Flash memory up to 128 Kbytes
and RAM up to 32 Kbytes) and an extensive range of enhanced I/Os and peripherals
connected to two APB buses.
All the devices offer a 12-bit ADC, 2 DACs and 2 ultra-low-power comparators, six generalpurpose 16-bit timers and two basic timers, which can be used as time bases.
Moreover, the STM32L151x6/8/B-A and STM32L152x6/8/B-A devices contain standard and
advanced communication interfaces: up to two I2Cs and SPIs, three USARTs and a USB.
The STM32L151x6/8/B-A and STM32L152x6/8/B-A devices offer up to 20 capacitive
sensing channels to simply add touch sensing functionality to any application.
They also include a real-time clock with sub-second counting and a set of backup registers
that remain powered in Standby mode.
Finally, the integrated LCD controller (except STM32L151x6/8/B-A devices) has a built-in
LCD voltage generator that allows to drive up to 8 multiplexed LCDs with contrast
independent of the supply voltage.
The ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A devices operate from a
1.8 to 3.6 V power supply (down to 1.65 V at power down) with BOR and from a 1.65 to
3.6 V power supply without BOR option. They are available in the -40 to +85 °C and -40 to
+105°C temperature ranges. A comprehensive set of power-saving modes allows the
design of low-power applications.
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2.1
Description
Device overview
Table 2. Ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A device features
and peripheral counts
Peripheral
Flash (Kbytes)
STM32L15xCxxxA
STM32L15xRxxxA
32
32
64
128
Data EEPROM (Kbytes)
RAM (Kbytes)
Timers
Communication
interfaces
32
32
16
32
Generalpurpose
6
Basic
2
SPI
2
I2C
2
USART
3
USB
1
12-bit synchronized ADC
Number of channels
Operating temperatures
32
32
32
83
1
14 channels
1
20/19 channels(1)
1
24 channels
2
2
4x32/4x31(1)
8x28/8x27(1)
4x16
4x44
8x40
2
13
20
Max. CPU frequency
Operating voltage
128
51/50(1)
Comparator
Capacitive sensing channels
64
37
12-bit DAC
Number of channels
LCD (STM32L152xxxxA Only)
COM x SEG
128
4
16
GPIOs
Packages
64
STM32L15xVxxxA
32 MHz
1.8 V to 3.6 V (down to 1.65 V at power-down) with BOR option
1.65 V to 3.6 V without BOR option
Ambient operating temperatures: –40 to +85 °C / –40 to + 105 °C
Junction temperature: -40 to +110°C
LQFP48, UFQFPN48
LQFP64, TFBGA64
LQFP100, UFBGA100
1. For TFBGA64 package (instead of PC3 pin there is VREF+ pin).
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51
Description
2.2
STM32L151x6/8/B-A STM32L152x6/8/B-A
Ultra-low-power device continuum
The ultra-low-power family offers a large choice of cores and features. From a proprietary 8bit core up to the Cortex-M3, including the Cortex-M0+, the STM8Lx and STM32Lx series
offer the best range of choices to meet your requirements in terms of ultra-low-power
features. The STM32 Ultra-low-power series is an ideal fit for applications like gas/water
meters, keyboard/mouse, or wearable devices for fitness and healthcare. Numerous built-in
features like LCD drivers, dual-bank memory, low-power Run mode, op-amp, AES-128bit,
DAC, crystal-less USB and many others, allow to build highly cost-optimized applications by
reducing the BOM.
Note:
STMicroelectronics as a reliable and long-term manufacturer ensures as much as possible
the pin-to-pin compatibility between any STM8Lx and STM32Lx devices and between any of
the STM32Lx and STM32Fx series. Thanks to this unprecedented scalability, your existing
applications can be upgraded to respond to the latest market features and efficiency
demand.
2.2.1
Performance
All families incorporate highly energy-efficient cores with both Harvard architecture and
pipelined execution: advanced STM8 core for STM8L families and ARM Cortex-M3 core for
STM32L family. In addition specific care for the design architecture has been taken to
optimize the mA/DMIPS and mA/MHz ratios.
This allows the ultra-Low-power performance to range from 5 up to 33.3 DMIPs.
2.2.2
Shared peripherals
STM8L15xxx and STM32L1xxxx share identical peripherals which ensure a very easy
migration from one family to another:
2.2.3
•
Analog peripherals: ADC, DAC and comparators
•
Digital peripherals: RTC and some communication interfaces
Common system strategy
To offer flexibility and optimize performance, the STM8L15xxx and STM32L1xxxx families
use a common architecture:
2.2.4
•
Common power supply range from 1.65 V to 3.6 V, (1.65 V at power down only for
STM8L15xxx devices)
•
Architecture optimized to reach ultra-low consumption both in low-power modes and
Run mode
•
Fast startup strategy from low-power modes
•
Flexible system clock
•
Ultra-safe reset: same reset strategy including power-on reset, power-down reset,
brownout reset and programmable voltage detector.
Features
ST ultra-low-power continuum also lies in feature compatibility:
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•
More than 10 packages with pin count from 20 to 144 pins and size down to 3 x 3 mm
•
Memory density ranging from 4 to 512 Kbytes
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STM32L151x6/8/B-A STM32L152x6/8/B-A
Functional overview
Figure 1 shows the block diagram.
Figure 1. Ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A block
diagram
dZ