STM32L151RBT6A

STM32L151x6/8/B-A STM32L152x6/8/B-A Ultra-low-power 32-bit MCU ARM®-based Cortex®-M3, 128KB Flash, 32KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC Datasheet - production data Features • Ultra-low-power platform – 1.65 V to 3.6 V power supply – -40°C to 105°C temperature range – 0.28 µA Standby mode (3 wakeup pins) – 1.11 µA Standby mode + RTC – 0.44 µA Stop mode (16 wakeup lines) – 1.38 µA Stop mode + RTC – 10.9 µA Low-power Run mode – 185 µA/MHz Run mode – 10 nA ultra-low I/O leakage – < 8 µs wakeup time • Core: ARM® Cortex®-M3 32-bit CPU – From 32 kHz up to 32 MHz max – 1.25 DMIPS/MHz (Dhrystone 2.1) – Memory protection unit • Reset and supply management – Ultra-safe, low-power BOR (brownout reset) with 5 selectable thresholds – Ultra-low-power POR/PDR – Programmable voltage detector (PVD) • Clock sources – 1 to 24 MHz crystal oscillator – 32 kHz oscillator for RTC with calibration – High Speed Internal 16 MHz factorytrimmed RC (+/- 1%) – Internal low-power 37 kHz RC – Internal multispeed low-power 65 kHz to 4.2 MHz – PLL for CPU clock and USB (48 MHz) • Pre-programmed bootloader – USART supported • Development support – Serial wire debug supported – JTAG and trace supported • Up to 83 fast I/Os (73 I/Os 5V tolerant), all mappable on 16 external interrupt vectors • Memories – Up to 128 Kbytes Flash memory with ECC – Up to 32 Kbytes RAM – Up to 4 Kbytes of true EEPROM with ECC – 80-byte backup register August 2017 This is information on a product in full production. LQFP100 14 × 14 mm LQFP64 10 × 10 mm LQFP48 7 × 7 mm UFBGA100 7 × 7 mm TFBGA64 5 × 5 mm UFQFPN48 7 × 7 mm • LCD Driver (except STM32L151x6/8/B-A devices) for up to 8x40 segments – Support contrast adjustment – Support blinking mode – Step-up converter on board • Rich analog peripherals (down to 1.8 V) – 12-bit ADC 1 Msps up to 24 channels – 12-bit DAC 2 channels with output buffers – 2x ultra-low-power-comparators (window mode and wake up capability) • DMA controller 7x channels • 8x peripheral communication interfaces – 1x USB 2.0 (internal 48 MHz PLL) – 3x USART (ISO 7816, IrDA) – 2x SPI 16 Mbits/s – 2x I2C (SMBus/PMBus) • 10x timers: 6x 16-bit with up to 4 IC/OC/PWM channels, 2x 16-bit basic timers, 2x watchdog timers (independent and window) • Up to 20 capacitive sensing channels supporting touchkey, linear and rotary touch sensors • CRC calculation unit, 96-bit unique ID Table 1. Device summary Reference Part number STM32L151CB-A, STM32L151C8-A, STM32L151C6-A, STM32L151RB-A, STM32L151R8-A, STM32L151R6-A, STM32L151VB-A, STM32L151V8-A STM32L151CBxxA STM32L151C8xxA, STM32L151C6xxA, STM32L151RBxxA, STM32L151R8xxA, STM32L151R6xxA, STM32L151VBxxA, STM32L151V8xxA STM32L152CB-A, STM32L152C8-A, STM32L152C6-A, STM32L152RB-A, STM32L152R8-A, STM32L152R6-A, STM32L152VB-A, STM32L152V8-A STM32L152CBxxA, STM32L152C8xxA, STM32L152C6xxA, STM32L152RBxxA, STM32L152R8xxA, STM32L152R6xxA, STM32L152VBxxA, STM32L152V8xxA DocID024330 Rev 5 1/130 www.st.com Contents STM32L151x6/8/B-A STM32L152x6/8/B-A Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3 2/130 2.1 Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 2.2 Ultra-low-power device continuum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.2.1 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.2.2 Shared peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.2.3 Common system strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.2.4 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.1 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.2 ARM® Cortex®-M3 core with MPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.3 Reset and supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.3.1 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.3.2 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.3.3 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.3.4 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.4 Clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.5 Low-power real-time clock and backup registers . . . . . . . . . . . . . . . . . . . 23 3.6 GPIOs (general-purpose inputs/outputs) . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.7 Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.8 DMA (direct memory access) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.9 LCD (liquid crystal display) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.10 ADC (analog-to-digital converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.10.1 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.10.2 Internal voltage reference (VREFINT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.11 DAC (digital-to-analog converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.12 Ultra-low-power comparators and reference voltage . . . . . . . . . . . . . . . . 27 3.13 Routing interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.14 Touch sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.15 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 DocID024330 Rev 5 STM32L151x6/8/B-A STM32L152x6/8/B-A 3.16 Contents 3.15.1 General-purpose timers (TIM2, TIM3, TIM4, TIM9, TIM10 and TIM11) . 29 3.15.2 Basic timers (TIM6 and TIM7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.15.3 SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.15.4 Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.15.5 Window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.16.1 I²C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.16.2 Universal synchronous/asynchronous receiver transmitter (USART) . . 30 3.16.3 Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.16.4 Universal serial bus (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.17 CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . . 31 3.18 Development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 4 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 5 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 6 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 6.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 6.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 6.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 6.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 6.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 6.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 6.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.1.7 Optional LCD power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 6.1.8 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 6.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 6.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 6.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 6.3.2 Embedded reset and power control block characteristics . . . . . . . . . . . 57 6.3.3 Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 59 6.3.4 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 6.3.5 Wakeup time from Low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 6.3.6 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 6.3.7 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 6.3.8 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 DocID024330 Rev 5 3/130 4 Contents 7 STM32L151x6/8/B-A STM32L152x6/8/B-A 6.3.9 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 6.3.10 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 6.3.11 Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 6.3.12 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 6.3.13 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 6.3.14 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 6.3.15 TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 6.3.16 Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 6.3.17 12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 6.3.18 DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 6.3.19 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 6.3.20 Comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 6.3.21 LCD controller (STM32L152x6/8/B-A devices only) . . . . . . . . . . . . . . 105 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 7.1 LQFP100 14 x 14 mm, 100-pin low-profile quad flat package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 7.2 LQFP64 10 x 10 mm, 64-pin low-profile quad flat package information . 109 7.3 LQFP48 7 x 7 mm, 48-pin low-profile quad flat package information . . . .112 7.4 UFQFPN48 7 x 7 mm, 0.5 mm pitch, package information . . . . . . . . . . .115 7.5 UFBGA100 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch ball grid array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118 7.6 TFBGA64 5 x 5 mm, 0.5 mm pitch, thin fine-pitch ball grid array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 7.7 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 7.7.1 Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 8 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 4/130 DocID024330 Rev 5 STM32L151x6/8/B-A STM32L152x6/8/B-A List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 41. Table 42. Table 43. Table 44. Table 45. Table 46. Table 47. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A device features and peripheral counts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Functionalities depending on the operating power supply range . . . . . . . . . . . . . . . . . . . . 15 CPU frequency range depending on dynamic voltage scaling . . . . . . . . . . . . . . . . . . . . . . 16 Working mode-dependent functionalities (from Run/active down to standby) . . . . . . . . . . 17 VLCD rail decoupling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 STM32L151x6/8/B-A and STM32L152x6/8/B-A pin definitions . . . . . . . . . . . . . . . . . . . . . 39 Alternate function input/output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 57 Embedded internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Current consumption in Run mode, code with data processing running from Flash. . . . . . 61 Current consumption in Run mode, code with data processing running from RAM . . . . . . 62 Current consumption in Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Current consumption in Low-power run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Current consumption in Low-power sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Typical and maximum current consumptions in Stop mode . . . . . . . . . . . . . . . . . . . . . . . . 66 Typical and maximum current consumptions in Standby mode . . . . . . . . . . . . . . . . . . . . . 68 Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 MSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 RAM and hardware registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Flash memory and data EEPROM characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Flash memory, data EEPROM endurance and data retention . . . . . . . . . . . . . . . . . . . . . . 80 EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 DocID024330 Rev 5 5/130 6 List of tables Table 48. Table 49. Table 50. Table 51. Table 52. Table 53. Table 54. Table 55. Table 56. Table 57. Table 58. Table 59. Table 60. Table 61. Table 62. Table 63. Table 64. Table 65. Table 66. Table 67. Table 68. Table 69. Table 70. Table 71. Table 72. Table 73. Table 74. 6/130 STM32L151x6/8/B-A STM32L152x6/8/B-A I2C characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 SCL frequency (fPCLK1= 32 MHz, VDD = VDD_I2C = 3.3 V). . . . . . . . . . . . . . . . . . . . . . . . 90 SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 USB startup time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 USB DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 USB: full speed electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 ADC clock frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Maximum source impedance RAIN max . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Comparator 1 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Comparator 2 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 LCD controller characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 LQPF100 14 x 14 mm, 100-pin low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 LQFP64 10 x 10 mm, 64-pin low-profile quad flat package mechanical data. . . . . . . . . . 109 LQFP48 7 x 7 mm, 48-pin low-profile quad flat package mechanical data. . . . . . . . . . . . 113 UFQFPN48 7 x 7 mm, 0.5 mm pitch, package mechanical data . . . . . . . . . . . . . . . . . . . 116 UFBGA100 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch ball grid array package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 UFBGA100 7 x 7 mm, 0.5 mm pitch, recommended PCB design rules . . . . . . . . . . . . . . 119 TFBGA64 5 x 5 mm, 0.5 mm pitch, thin fine-pitch ball grid array package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 TFBGA64 5 x 5 mm, 0.5 mm pitch, recommended PCB design rules . . . . . . . . . . . . . . . 122 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 DocID024330 Rev 5 STM32L151x6/8/B-A STM32L152x6/8/B-A List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. Figure 45. Ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A block diagram . . . . . . . . 13 Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 STM32L15xVxxxA UFBGA100 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 STM32L15xVxxxA LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 STM32L15xRxxxA TFBGA64 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 STM32L15xRxxxA LQFP64 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 STM32L15xCxxxA LQFP48 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 STM32L15xCxxxA UFQFPN48 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Optional LCD power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 HSE oscillator circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 I2C bus AC waveforms and measurement circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 USB timings: definition of data signal rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Maximum dynamic current consumption on VREF+ supply pin during ADC conversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 LQFP100 14 x 14 mm, 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 106 LQPF100 14 x 14 mm, 100-pin low-profile quad flat package recommended footprint . . 108 LQFP100 14 x 14 mm, 100-pin package top view example . . . . . . . . . . . . . . . . . . . . . . . 108 LQFP64 10 x 10 mm, 64-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . 109 LQFP64 10 x 10 mm, 64-pin low-profile quad flat package recommended footprint . . . . 110 LQFP64 10 x 10 mm, 64-pin low-profile quad flat package top view example . . . . . . . . . 111 LQFP48 7 x 7 mm, 48-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . 112 LQFP48 7 x 7 mm, 48-pin low-profile quad flat package recommended footprint . . . . . . 114 LQFP48 7 x 7 mm, 48-pin low-profile quad flat package top view example . . . . . . . . . . . 114 UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 UFQFPN48 7 x 7 mm, 0.5 mm pitch, package recommended footprint . . . . . . . . . . . . . . 116 UFQFPN48 7 x 7 mm, 0.5 mm pitch, package top view example . . . . . . . . . . . . . . . . . . 117 UFBGA100, 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch ball grid array package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 UFBGA100 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch ball grid array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 UFBGA100 7 x 7 mm, 0.5 mm pitch, package top view example. . . . . . . . . . . . . . . . . . . 120 TFBGA64 5 x 5 mm, 0.5 mm pitch, thin fine-pitch ball grid array DocID024330 Rev 5 7/130 8 List of figures Figure 46. Figure 47. Figure 48. Figure 49. 8/130 STM32L151x6/8/B-A STM32L152x6/8/B-A package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 TFBGA64, 5 x 5 mm, 0.5 mm pitch, thin fine-pitch ball grid array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 TFBGA64 5 x 5 mm, 0.5 mm pitch, package top view example . . . . . . . . . . . . . . . . . . . . 123 Thermal resistance suffix 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 Thermal resistance suffix 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 DocID024330 Rev 5 STM32L151x6/8/B-A STM32L152x6/8/B-A 1 Introduction Introduction This datasheet provides the ordering information and mechanical device characteristics of the STM32L151x6/8/B-A and STM32L152x6/8/B-A ultra-low-power ARM® Cortex®-M3 based microcontrollers product line. The ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A microcontroller family includes devices in 3 different package types: from 48 to 100 pins. Depending on the device chosen, different sets of peripherals are included, the description below gives an overview of the complete range of peripherals proposed in this family. These features make the ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A microcontroller family suitable for a wide range of applications: • Medical and handheld equipment • Application control and user interface • PC peripherals, gaming, GPS and sport equipment • Alarm systems, Wired and wireless sensors, Video intercom • Utility metering This STM32L151x6/8/B-A and STM32L152x6/8/B-A datasheet should be read in conjunction with the STM32L1xxxx reference manual (RM0038). The document "Getting started with STM32L1xxxx hardware development” AN3216 gives a hardware implementation overview. Both documents are available from the STMicroelectronics website www.st.com. For information on the ARM® Cortex®-M3 core please refer to the Cortex®-M3 Technical Reference Manual, available from the ARM website. Figure 1 shows the general block diagram of the device family. Caution: This datasheet does not apply to: – STM32L15xx6/8/B covered by a separate datasheet. DocID024330 Rev 5 9/130 51 Description 2 STM32L151x6/8/B-A STM32L152x6/8/B-A Description The ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A devices incorporate the connectivity power of the universal serial bus (USB) with the high-performance ARM® Cortex®-M3 32-bit RISC core operating at a frequency of 32 MHz (33.3 DMIPS), a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 128 Kbytes and RAM up to 32 Kbytes) and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All the devices offer a 12-bit ADC, 2 DACs and 2 ultra-low-power comparators, six generalpurpose 16-bit timers and two basic timers, which can be used as time bases. Moreover, the STM32L151x6/8/B-A and STM32L152x6/8/B-A devices contain standard and advanced communication interfaces: up to two I2Cs and SPIs, three USARTs and a USB. The STM32L151x6/8/B-A and STM32L152x6/8/B-A devices offer up to 20 capacitive sensing channels to simply add touch sensing functionality to any application. They also include a real-time clock with sub-second counting and a set of backup registers that remain powered in Standby mode. Finally, the integrated LCD controller (except STM32L151x6/8/B-A devices) has a built-in LCD voltage generator that allows to drive up to 8 multiplexed LCDs with contrast independent of the supply voltage. The ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A devices operate from a 1.8 to 3.6 V power supply (down to 1.65 V at power down) with BOR and from a 1.65 to 3.6 V power supply without BOR option. They are available in the -40 to +85 °C and -40 to +105°C temperature ranges. A comprehensive set of power-saving modes allows the design of low-power applications. 10/130 DocID024330 Rev 5 STM32L151x6/8/B-A STM32L152x6/8/B-A 2.1 Description Device overview Table 2. Ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A device features and peripheral counts Peripheral Flash (Kbytes) STM32L15xCxxxA STM32L15xRxxxA 32 32 64 128 Data EEPROM (Kbytes) RAM (Kbytes) Timers Communication interfaces 32 32 16 32 Generalpurpose 6 Basic 2 SPI 2 I2C 2 USART 3 USB 1 12-bit synchronized ADC Number of channels Operating temperatures 32 32 32 83 1 14 channels 1 20/19 channels(1) 1 24 channels 2 2 4x32/4x31(1) 8x28/8x27(1) 4x16 4x44 8x40 2 13 20 Max. CPU frequency Operating voltage 128 51/50(1) Comparator Capacitive sensing channels 64 37 12-bit DAC Number of channels LCD (STM32L152xxxxA Only) COM x SEG 128 4 16 GPIOs Packages 64 STM32L15xVxxxA 32 MHz 1.8 V to 3.6 V (down to 1.65 V at power-down) with BOR option 1.65 V to 3.6 V without BOR option Ambient operating temperatures: –40 to +85 °C / –40 to + 105 °C Junction temperature: -40 to +110°C LQFP48, UFQFPN48 LQFP64, TFBGA64 LQFP100, UFBGA100 1. For TFBGA64 package (instead of PC3 pin there is VREF+ pin). DocID024330 Rev 5 11/130 51 Description 2.2 STM32L151x6/8/B-A STM32L152x6/8/B-A Ultra-low-power device continuum The ultra-low-power family offers a large choice of cores and features. From a proprietary 8bit core up to the Cortex-M3, including the Cortex-M0+, the STM8Lx and STM32Lx series offer the best range of choices to meet your requirements in terms of ultra-low-power features. The STM32 Ultra-low-power series is an ideal fit for applications like gas/water meters, keyboard/mouse, or wearable devices for fitness and healthcare. Numerous built-in features like LCD drivers, dual-bank memory, low-power Run mode, op-amp, AES-128bit, DAC, crystal-less USB and many others, allow to build highly cost-optimized applications by reducing the BOM. Note: STMicroelectronics as a reliable and long-term manufacturer ensures as much as possible the pin-to-pin compatibility between any STM8Lx and STM32Lx devices and between any of the STM32Lx and STM32Fx series. Thanks to this unprecedented scalability, your existing applications can be upgraded to respond to the latest market features and efficiency demand. 2.2.1 Performance All families incorporate highly energy-efficient cores with both Harvard architecture and pipelined execution: advanced STM8 core for STM8L families and ARM Cortex-M3 core for STM32L family. In addition specific care for the design architecture has been taken to optimize the mA/DMIPS and mA/MHz ratios. This allows the ultra-Low-power performance to range from 5 up to 33.3 DMIPs. 2.2.2 Shared peripherals STM8L15xxx and STM32L1xxxx share identical peripherals which ensure a very easy migration from one family to another: 2.2.3 • Analog peripherals: ADC, DAC and comparators • Digital peripherals: RTC and some communication interfaces Common system strategy To offer flexibility and optimize performance, the STM8L15xxx and STM32L1xxxx families use a common architecture: 2.2.4 • Common power supply range from 1.65 V to 3.6 V, (1.65 V at power down only for STM8L15xxx devices) • Architecture optimized to reach ultra-low consumption both in low-power modes and Run mode • Fast startup strategy from low-power modes • Flexible system clock • Ultra-safe reset: same reset strategy including power-on reset, power-down reset, brownout reset and programmable voltage detector. Features ST ultra-low-power continuum also lies in feature compatibility: 12/130 • More than 10 packages with pin count from 20 to 144 pins and size down to 3 x 3 mm • Memory density ranging from 4 to 512 Kbytes DocID024330 Rev 5 STM32L151x6/8/B-A STM32L152x6/8/B-A Functional overview Figure 1 shows the block diagram. Figure 1. Ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A block diagram dZ