STM32MP157C/F
Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU,
TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog, crypto
Datasheet - production data
Features
TFBGA
LFBGA
Includes ST state-of-the-art patented
technology
LFBGA448 (18 × 18mm)
LFBGA354 (16 × 16mm)
Pitch 0.8mm
Core
• 32-bit dual-core Arm® Cortex®-A7
– L1 32-Kbyte I / 32-Kbyte D for each core
– 256-Kbyte unified level 2 cache
– Arm® NEON™ and Arm® TrustZone®
®
®
• 32-bit Arm Cortex -M4 with FPU/MPU
– Up to 209 MHz (Up to 703 CoreMark®)
Memories
• External DDR memory up to 1 Gbyte
– up to LPDDR2/LPDDR3-1066 16/32-bit
– up to DDR3/DDR3L-1066 16/32-bit
• 708 Kbytes of internal SRAM: 256 Kbytes of
AXI SYSRAM + 384 Kbytes of AHB SRAM +
64 Kbytes of AHB SRAM in Backup domain
and 4 Kbytes of SRAM in Backup domain
• Dual mode Quad-SPI memory interface
• Flexible external memory controller with up to
16-bit data bus: parallel interface to connect
external ICs and SLC NAND memories with up
to 8-bit ECC
Security/safety
• Secure boot, TrustZone® peripherals, active
tamper
• Cortex®-M4 resources isolation
Reset and power management
• 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
• POR, PDR, PVD and BOR
• On-chip LDOs (RETRAM, BKPSRAM, DSI
1.2 V, USB 1.8 V, 1.1 V)
TFBGA361 (12 × 12 mm)
TFBGA257 (10 × 10 mm)
min Pitch 0.5mm
• Internal temperature sensors
• Low-power modes: Sleep, Stop and Standby
• DDR memory retention in Standby mode
• Controls for PMIC companion chip
Low-power consumption
• Total current consumption down to 2 µA
(Standby mode, no RTC, no LSE, no
BKPSRAM, no RETRAM)
Clock management
• Internal oscillators: 64 MHz HSI oscillator,
4 MHz CSI oscillator, 32 kHz LSI oscillator
• External oscillators: 8-48 MHz HSE oscillator,
32.768 kHz LSE oscillator
• 6 × PLLs with fractional mode
General-purpose input/outputs
• Up to 176 I/O ports with interrupt capability
– Up to 8 secure I/Os
– Up to 6 Wakeup, 3 tampers, 1 active
tamper
Interconnect matrix
• 2 bus matrices
– 64-bit Arm® AMBA® AXI interconnect, up to
266 MHz
– 32-bit Arm® AMBA® AHB interconnect, up
to 209 MHz
3 DMA controllers to unload the CPU
• 48 physical channels in total
• Backup regulator (~0.9 V)
May 2021
This is information on a product in full production.
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STM32MP157C/F
• 1 × high-speed general-purpose master direct
memory access controller (MDMA)
• 2 × dual-port DMAs with FIFO and request
router capabilities for optimal peripheral
management
Up to 37 communication peripherals
– up to WXGA (1366 × 768) @60 fps or up to
Full HD (1920 × 1080) @30 fps
– Pixel clock up to 90 MHz
– Two layers with programmable colour LUT
• MIPI® DSI 2 data lanes up to 1 Gbps each
Up to 29 timers and 3 watchdogs
2
• 6 × I C FM+ (1 Mbit/s, SMBus/PMBus)
• 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816
interface, LIN, IrDA, SPI slave)
• 6 × SPI (50 Mbit/s, including 3 with full duplex
I2S audio class accuracy via internal audio PLL
or external clock)
• 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
• SPDIF Rx with 4 inputs
• 2 × 32-bit timers with up to 4 IC/OC/PWM or
pulse counter and quadrature (incremental)
encoder input
• 2 × 16-bit advanced motor control timers
• 10 × 16-bit general-purpose timers (including 2
basic timers without PWM)
• 5 × 16-bit low-power timers
• RTC with sub-second accuracy and hardware
calendar
• HDMI-CEC interface
• MDIO Slave interface
• 3 × SDMMC up to 8-bit (SD / e•MMC™ / SDIO)
• 2 × CAN controllers supporting CAN FD
protocol, out of which one supports timetriggered CAN (TTCAN)
• 2 × 4 Cortex®-A7 system timers (secure, nonsecure, virtual, hypervisor)
• 1 × SysTick M4 timer
• 3 × watchdogs (2 × independent and window)
• 2 × USB 2.0 high-speed Host
+ 1 × USB 2.0 full-speed OTG simultaneously
– or 1 × USB 2.0 high-speed Host
+ 1 × USB 2.0 high-speed OTG
simultaneously
• 10/100M or Gigabit Ethernet GMAC
– IEEE 1588v2 hardware,
MII/RMII/GMII/RGMII
Hardware acceleration
• AES 128, 192, 256, TDES
• HASH (MD5, SHA-1, SHA224, SHA256),
HMAC
• 2 × true random number generator
(3 oscillators each)
• 2 × CRC calculation unit
• 8- to 14-bit camera interface up to 140 Mbyte/s
Debug mode
6 analog peripherals
• Arm® CoreSight™ trace and debug: SWD and
JTAG interfaces
• 2 × ADCs with 16-bit max. resolution (12 bits
up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up
to 3.6 Msps)
• 1 × temperature sensor
• 2 × 12-bit D/A converters (1 MHz)
• 1 × digital filters for sigma delta modulator
(DFSDM) with 8 channels/6 filters
• 8-Kbyte embedded trace buffer
3072-bit fuses including 96-bit unique ID,
up to 1184-bit available for user
All packages are ECOPACK2 compliant
• Internal or external ADC/DAC reference VREF+
Graphics
• 3D GPU: Vivante® - OpenGL® ES 2.0
– Up to 26 Mtriangle/s, 133 Mpixel/s
• LCD-TFT controller, up to 24-bit // RGB888
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Contents
Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3
Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.1
Dual-core Arm® Cortex®-A7 subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.1.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.1.2
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.2
Arm® Cortex®-M4 with FPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.3
Graphic processing unit (GPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.4
Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.4.1
External SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.4.2
Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.5
DDR3/DDR3L/LPDDR2/LPDDR3 controller (DDRCTRL) . . . . . . . . . . . . 26
3.6
TrustZone address space controller for DDR (TZC) . . . . . . . . . . . . . . . . 27
3.7
Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.8
Power supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.8.1
Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.8.2
Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.9
Low-power strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.10
Reset and clock controller (RCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3.10.1
Clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3.10.2
System reset sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3.11
Hardware semaphore (HSEM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3.12
Inter-processor communication controller (IPCC) . . . . . . . . . . . . . . . . . . 34
3.12.1
IPCC main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.13
General-purpose input/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.14
TrustZone protection controller (ETZPC) . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.15
Bus-interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
3.16
DMA controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3.17
Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . . 38
3.18
Extended interrupt and event controller (EXTI) . . . . . . . . . . . . . . . . . . . . 38
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3.19
Cyclic redundancy check calculation unit (CRC1, CRC2) . . . . . . . . . . . . 39
3.20
Flexible memory controller (FMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3.21
Dual Quad-SPI memory interface (QUADSPI) . . . . . . . . . . . . . . . . . . . . . 39
3.22
Analog-to-digital converters (ADCs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
3.23
Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
3.24
Digital temperature sensor (DTS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
3.25
VBAT operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
3.26
Digital-to-analog converters (DAC1, DAC2) . . . . . . . . . . . . . . . . . . . . . . . 41
3.27
Voltage reference buffer (VREFBUF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
3.28
Digital filter for sigma delta modulators (DFSDM1) . . . . . . . . . . . . . . . . . 42
3.29
Digital camera interface (DCMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
3.30
LCD-TFT display controller (LTDC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
3.31
Display serial interface (DSI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3.32
True random number generator (RNG1, RNG2) . . . . . . . . . . . . . . . . . . . 45
3.33
Cryptographic and hash processors (CRYP1, CRYP2 and
HASH1, HASH2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.34
Boot and security and OTP control (BSEC) . . . . . . . . . . . . . . . . . . . . . . . 46
3.35
Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.35.1
Advanced-control timers (TIM1, TIM8) . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.35.2
General-purpose timers (TIM2, TIM3, TIM4, TIM5, TIM12, TIM13,
TIM14, TIM15, TIM16, TIM17) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.35.3
Basic timers TIM6 and TIM7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.35.4
Low-power timer (LPTIM1, LPTIM2, LPTIM3, LPTIM4, LPTIM5) . . . . . 49
3.35.5
Independent watchdog (IWDG1, IWDG2) . . . . . . . . . . . . . . . . . . . . . . . 49
3.35.6
System window watchdog (WWDG1) . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.35.7
SysTick timer (Cortex-M4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.35.8
Generic timers (Cortex-A7 CNT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
3.36
System timer generation (STGEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
3.37
Real-time clock (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
3.38
Tamper and backup registers (TAMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
3.39
Inter-integrated circuit interface (I2C1, I2C2, I2C3, I2C4, I2C5, I2C6) . . . 53
3.40
Universal synchronous asynchronous receiver transmitter
(USART1, USART2, USART3, USART6 and UART4, UART5,
UART7, UART8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
3.41
Serial peripheral interface (SPI1, SPI2, SPI3, SPI4, SPI5,
SPI6)– inter- integrated sound interfaces (I2S1, I2S2, I2S3) . . . . . . . . . . 54
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Contents
3.42
Serial audio interfaces (SAI1, SAI2, SAI3, SAI4) . . . . . . . . . . . . . . . . . . . 55
3.43
SPDIF receiver interface (SPDIFRX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
3.44
Management data input/output (MDIOS) . . . . . . . . . . . . . . . . . . . . . . . . . 56
3.45
Secure digital input/output MultiMediaCard interface
(SDMMC1, SDMMC2, SDMMC3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
3.46
Controller area network (FDCAN1, FDCAN2) . . . . . . . . . . . . . . . . . . . . . 56
3.47
Universal serial bus high-speed host (USBH) . . . . . . . . . . . . . . . . . . . . . 57
3.48
USB on-the-go high-speed (OTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
3.49
Gigabit Ethernet MAC interface (ETH1) . . . . . . . . . . . . . . . . . . . . . . . . . . 58
3.50
High-definition multimedia interface (HDMI) – Consumer
electronics control (CEC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
3.51
Debug infrastructure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
4
Pinouts, pin description and alternate functions . . . . . . . . . . . . . . . . . 60
5
Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
6.1
Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
6.1.1
Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
6.1.2
Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
6.1.3
Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
6.1.4
Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
6.1.5
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
6.1.6
Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
6.1.7
Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . 125
6.2
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
6.3
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
6.3.1
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
6.3.2
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . 129
6.3.3
Embedded reset and power control block characteristics . . . . . . . . . . 131
6.3.4
Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
6.3.5
Embedded regulators characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 134
6.3.6
Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
6.3.7
Wakeup time from low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . 147
6.3.8
External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 149
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6.3.9
External clock source security characteristics . . . . . . . . . . . . . . . . . . . 155
6.3.10
Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 155
6.3.11
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
6.3.12
PLL spread spectrum clock generation (SSCG) characteristics . . . . . 161
6.3.13
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
6.3.14
EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
6.3.15
Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . 165
6.3.16
I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
6.3.17
I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
6.3.18
NRST and NRST_CORE pin characteristics . . . . . . . . . . . . . . . . . . . . 175
6.3.19
FMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176
6.3.20
QUADSPI interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
6.3.21
Delay block (DLYB) characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
6.3.22
16-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
6.3.23
DAC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
6.3.24
Voltage reference buffer characteristics . . . . . . . . . . . . . . . . . . . . . . . 207
6.3.25
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
6.3.26
DTS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
6.3.27
VBAT ADC monitoring characteristics and charging characteristics . . 210
6.3.28
Temperature and VBAT monitoring characteristics for
tamper detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
6.3.29
VDDCORE monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 211
6.3.30
Voltage booster for analog switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
6.3.31
Compensation cell . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
6.3.32
Digital filter for sigma-delta modulators (DFSDM) characteristics . . . . 211
6.3.33
Camera interface (DCMI) characteristics . . . . . . . . . . . . . . . . . . . . . . . 214
6.3.34
LCD-TFT controller (LTDC) characteristics . . . . . . . . . . . . . . . . . . . . . 215
6.3.35
Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
6.3.36
Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
6.3.37
USART interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235
6.3.38
USB High-Speed PHY characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 236
6.3.39
DSI PHY characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238
6.3.40
JTAG/SWD interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 238
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241
7.1
TFBGA257 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241
7.2
LFBGA354 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
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7.3
TFBA361 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248
7.4
LFBGA448 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
7.5
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255
7.5.1
Reference documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 256
8
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257
9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 258
DS12505 Rev 6
7/262
7
List of tables
STM32MP157C/F
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
8/262
STM32MP157C/F features and peripheral counts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Boot modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
System versus domain power mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
USART features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
STM32MP157C/F pin and ball definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Alternate function AF0 to AF7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Alternate function AF8 to AF15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 131
Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Embedded reference voltage calibration value. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
REG1V1 embedded regulator (USB_PHY) characteristics . . . . . . . . . . . . . . . . . . . . . . . 134
REG1V2 embedded regulator (DSI) characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
REG1V8 embedded regulator (USB+DSI) characteristics . . . . . . . . . . . . . . . . . . . . . . . . 135
Current consumption (IDDCORE) in Run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Current consumption (IDD) in Run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
Current consumption in Stop mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
Current consumption in LPLV-Stop mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
Current consumption in Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
Current consumption in VBAT mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
Wakeup time using USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
High-speed external user clock characteristics
(digital bypass) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
High-speed external user clock characteristics
(analog bypass) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
Low-speed external user clock characteristics
(analog bypass) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
Low-speed external user clock characteristics (digital bypass) . . . . . . . . . . . . . . . . . . . . 151
8-48 MHz HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
High-speed external user clock security system (HSE CSS) . . . . . . . . . . . . . . . . . . . . . . 155
HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
CSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
PLL1_1600, PLL2_1600 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
PLL3_800, PLL4_800 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
USB_PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
DSI_PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
SSCG parameters constraint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
OTP characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
DC specifications – DDR3 or DDR3L mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
DS12505 Rev 6
STM32MP157C/F
Table 46.
Table 47.
Table 48.
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Table 70.
Table 71.
Table 72.
Table 73.
Table 74.
Table 75.
Table 76.
Table 77.
Table 78.
Table 79.
Table 80.
Table 81.
Table 82.
Table 83.
Table 84.
Table 85.
Table 86.
Table 87.
Table 88.
Table 89.
Table 90.
Table 91.
Table 92.
Table 93.
Table 94.
Table 95.
Table 96.
List of tables
DC specifications – LPDDR2 or LPDDR3 mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
Output voltage characteristics for all I/Os except PC13, PC14, PC15 and PI8 . . . . . . . . 169
Output voltage characteristics for PC13, PC14, PC15 and PI8 . . . . . . . . . . . . . . . . . . . . 170
Output timing characteristics (HSLV OFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
Output timing characteristics (HSLV ON, _h IO structure) . . . . . . . . . . . . . . . . . . . . . . . . 173
Output timing characteristics (HSLV ON, _vh IO structure) . . . . . . . . . . . . . . . . . . . . . . . 174
NRST and NRST_CORE pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176
Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . 178
Asynchronous non-multiplexed SRAM/PSRAM/NOR read - NWAIT timings . . . . . . . . . . 178
Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . 179
Asynchronous non-multiplexed SRAM/PSRAM/NOR write - NWAIT timings. . . . . . . . . . 180
Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . 181
Asynchronous multiplexed PSRAM/NOR read-NWAIT timings . . . . . . . . . . . . . . . . . . . . 181
Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . 183
Asynchronous multiplexed PSRAM/NOR write-NWAIT timings . . . . . . . . . . . . . . . . . . . . 183
Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 188
Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
Switching characteristics for NAND Flash read cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
Switching characteristics for NAND Flash write cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . 193
QUADSPI characteristics in SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
QUADSPI characteristics in DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
Dynamics characteristics: Delay block characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
Minimum sampling time versus RAIN with 47 pF PCB capacitor
up to 125 °C and VDDA = 1.6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
Minimum delay for interleaved conversion versus resolution . . . . . . . . . . . . . . . . . . . . . . 201
DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
DAC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206
VREFBUF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
DTS characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
VBAT ADC monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
VBAT charging characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
Temperature and VBAT monitoring characteristics for temper detection . . . . . . . . . . . . . 210
VDDCORE monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
Voltage booster for analog switch characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
Compensation cell characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
DFSDM measured timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212
DCMI characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
LTDC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
LPTIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
DS12505 Rev 6
9/262
10
List of tables
Table 97.
Table 98.
Table 99.
Table 100.
Table 101.
Table 102.
Table 103.
Table 104.
Table 105.
Table 106.
Table 107.
Table 108.
Table 109.
Table 110.
Table 111.
Table 112.
Table 113.
Table 114.
Table 115.
Table 116.
Table 117.
Table 118.
Table 119.
Table 120.
Table 121.
Table 122.
Table 123.
Table 124.
Table 125.
Table 126.
Table 127.
10/262
STM32MP157C/F
Minimum i2c_ker_ck frequency in all I2C modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218
I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218
I2C FM+ pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219
SPI dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
I2S dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
SAI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
MDIOS timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
Dynamic characteristics: SD / MMC / e•MMC characteristics,
VDD = 2.7 V to 3.6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228
Dynamic characteristics: SD / MMC / e•MMC characteristics
VDD = 1.71 V to 1.9 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228
USB OTG_FS electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230
Dynamics characteristics: Ethernet MAC timings for MDIO/SMA. . . . . . . . . . . . . . . . . . . 231
Dynamics characteristics: Ethernet MAC timings for RMII . . . . . . . . . . . . . . . . . . . . . . . . 231
Dynamics characteristics: Ethernet MAC timings for MII . . . . . . . . . . . . . . . . . . . . . . . . . 232
Dynamics characteristics: Ethernet MAC signals for GMII . . . . . . . . . . . . . . . . . . . . . . . 233
Dynamics characteristics: Ethernet MAC signals for RGMII . . . . . . . . . . . . . . . . . . . . . . 234
USART characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235
USB High-Speed PHY characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236
DSI PHY characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238
Dynamics characteristics: JTAG characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239
Dynamics characteristics: SWD characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239
TFBGA257 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242
TFBGA257 - Recommended PCB design rules (0.5/0.65 mm pitch, BGA) . . . . . . . . . . . 243
LFBGA354 - Mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
LFBGA354 - Recommended PCB design rules (0.8 mm pitch, BGA) . . . . . . . . . . . . . . . 247
TFBGA361 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249
TFBGA361 - Recommended PCB design rules (0.5/0.65 mm pitch BGA) . . . . . . . . . . . . 250
LFBGA448 - Mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
LFBGA448 - Recommended PCB design rules (0.8 mm pitch, BGA) . . . . . . . . . . . . . . . 253
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255
STM32MP157C/F ordering information scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 258
DS12505 Rev 6
STM32MP157C/F
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
Figure 43.
Figure 44.
Figure 45.
Figure 46.
Figure 47.
Figure 48.
STM32MP157C/F block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Power-up/down sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
STM32MP157C/F bus matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Voltage reference buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
STM32MP157C/FADxx TFBGA257 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
STM32MP157C/FABxx LFBGA354 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
STM32MP157C/FACxx TFBGA361 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
STM32MP157C/FAAxx LFBGA448 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
VDDCORE rise time from reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
VDDCORE rise time from LPLV-Stop. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
High-speed external clock source AC timing diagram (digital bypass) . . . . . . . . . . . . . . . 149
High-speed external clock source AC timing diagram (analog bypass) . . . . . . . . . . . . . . 150
Low-speed external clock source AC timing diagram (analog bypass) . . . . . . . . . . . . . . 151
Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
Typical application with a 24 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153
Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
PLL output clock waveforms in center spread mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
PLL output clock waveforms in down spread mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
VIL/VIH for FT I/Os . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
Recommended NRST and NRST_CORE pin protection . . . . . . . . . . . . . . . . . . . . . . . . . 176
Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms . . . . . . . . . . . . . . 177
Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms . . . . . . . . . . . . . . 179
Asynchronous multiplexed PSRAM/NOR read waveforms. . . . . . . . . . . . . . . . . . . . . . . . 180
Asynchronous multiplexed PSRAM/NOR write waveforms . . . . . . . . . . . . . . . . . . . . . . . 182
Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 184
Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 188
Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
NAND controller waveforms for read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
NAND controller waveforms for write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
NAND controller waveforms for common memory read access . . . . . . . . . . . . . . . . . . . . 192
NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . 192
QUADSPI timing diagram - SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
QUADSPI timing diagram - DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
Channel transceiver timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
DCMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
LCD-TFT horizontal timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
LCD-TFT vertical timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
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12
List of figures
Figure 49.
Figure 50.
Figure 51.
Figure 52.
Figure 53.
Figure 54.
Figure 55.
Figure 56.
Figure 57.
Figure 58.
Figure 59.
Figure 60.
Figure 61.
Figure 62.
Figure 63.
Figure 64.
Figure 65.
Figure 66.
Figure 67.
Figure 68.
Figure 69.
Figure 70.
Figure 71.
Figure 72.
Figure 73.
Figure 74.
Figure 75.
Figure 76.
Figure 77.
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STM32MP157C/F
I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
I2S master timing diagram (Philips protocol)(1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
SAI master timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226
SAI slave timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226
MDIOS timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230
Ethernet MDIO/SMA timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
Ethernet RMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232
Ethernet MII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
Ethernet GMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
Ethernet RGMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
USART timing diagram in master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236
USART timing diagram in slave mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236
JTAG timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240
SWD timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240
TFBGA257 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241
TFBGA257 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243
TFBGA257 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244
LFBGA354 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
LFBGA354 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 246
LFBGA354 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247
TFBGA361 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248
TFBGA361 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250
TFBGA361 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251
LFBGA448 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
LFBGA448 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253
LFBGA448 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254
DS12505 Rev 6
STM32MP157C/F
1
Introduction
Introduction
This datasheet provides the ordering information and mechanical device characteristics of
the STM32MP157C/F microprocessors.
This document should be read in conjunction with the STM32MP157 reference manual
(RM0436), available from the STMicroelectronics website www.st.com.
For information on the Arm®(a) Cortex®-A7 and Cortex®-M4 cores, refer to the Cortex®-A7
and Cortex®-M4 Technical Reference Manuals.
For information on the device errata with respect to the datasheet and reference manual,
refer to the STM32MP157C/F errata sheet (ES0438), available on the STMicroelectronics
website www.st.com.
a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
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Description
2
STM32MP157C/F
Description
The STM32MP157C/F devices are based on the high-performance dual-core Arm®
Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor
includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each
CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient
application processor designed to provide rich performance in high-end wearables, and
other low-power embedded and consumer applications. It provides up to 20% more single
thread performance than the Cortex-A5 and provides similar performance than the CortexA9.
The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and CortexA17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4
AXI bus interface.
The STM32MP157C/F devices also embed a Cortex® -M4 32-bit RISC core operating at up
to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision
which supports Arm® single-precision data-processing instructions and data types. The
Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU)
which enhances application security.
The STM32MP157C/F devices also embed a 3D graphic processing unit
(Vivante® - OpenGL® ES 2.0) running at up to 533 MHz, with performances up to 26
Mtriangle/s, 133 Mpixel/s.
The STM32MP157C/F devices provide an external SDRAM interface supporting external
memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L
up to 533 MHz.
The STM32MP157C/F devices incorporate high-speed embedded memories with
708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes
each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in
backup domain), as well as an extensive range of enhanced I/Os and peripherals connected
to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI
interconnect supporting internal and external memories access.
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STM32MP157C/F
Description
All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit
timers, two PWM timers for motor control, five low-power timers, a true random number
generator (RNG), and a cryptographic acceleration cell. The devices support six digital
filters for external sigma delta modulators (DFSDM). They also feature standard and
advanced communication interfaces.
•
Standard peripherals
–
•
Six I2Cs
–
Four USARTs and four UARTs
–
Six SPIs, three I2Ss full-duplex master/slave. To achieve audio class accuracy, the
I2S peripherals can be clocked via a dedicated internal audio PLL or via an
external clock to allow synchronization.
–
Four SAI serial audio interfaces
–
One SPDIF Rx interface
–
Management data input/output slave (MDIOS)
–
Three SDMMC interfaces
–
An USB high-speed Host with two ports two high-speed PHYs and a USB OTG
high-speed with full-speed PHY or high-speed PHY shared with second port of
USB Host.
–
Two FDCAN interface, including one supporting TTCAN mode
–
A Gigabit Ethernet interface
–
HDMI-CEC
Advanced peripherals including
–
A flexible memory control (FMC) interface
–
A Quad-SPI Flash memory interface
–
A camera interface for CMOS sensors
–
An LCD-TFT display controller
–
A DSI Host interface.
Refer to Table 1: STM32MP157C/F features and peripheral counts for the list of peripherals
available on each part number.
A comprehensive set of power-saving mode allows the design of low-power applications.
The STM32MP157C/F devices are proposed in 4 packages ranging from 257 to 448 balls
with pitch 0.5 mm to 0.8 mm. The set of included peripherals changes with the device
chosen.
These features make the STM32MP157C/F suitable for a wide range of consumer,
industrial, white goods and medical applications.
Figure 1 shows the general block diagram of the device family.
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Description
STM32MP157C/F
STM32MP157CABxx
STM32MP157FABxx
STM32MP157CACxx
STM32MP157FACxx
STM32MP157CAAxx
STM32MP157FAAxx
TFBGA257
LFBGA354
TFBGA361
LFBGA448
Body size (mm)
10x10
16x16
12x12
18x18
Pitch (mm)
0.5(1)
0.8
0.5(1)
0.8
Ball size (mm)
0.30
0.40
0.30
0.40
Thickness (mm)
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