STM961-15B

® STM961-15B RF POWER MODULE DIGITAL CELLULAR APPLICATIONS s s s s s s LINEAR POWER AMPLIFIER 915-960 MHz 26 VOLTS INPUT/OUTPUT 50 OHMS POUT = 42 dBm CW or PEP GAIN = 30 dB DESCRIPTION The STM961-15B module is designed for digital cellular radio base station applications in the 915-960 MHz frequency range operating at 26V. The STM961-15B is designed to meet the low distortion, high linearity requirements of modern digital cellular base station equipment. CASE STYLE H110 ORDER CODE STM961-15B BRANDING STM961-15B PIN CONNECTION 1. RF Input 2. VS1, 26V 3.VB, 26V 4. RF Output ABSOLUTE MAXIMUM RATINGS (Tcase = 85 oC) Symbol V S1, V S2 VB PI N P OUT T STG DC Supply Voltage DC Bias Voltage RF Input Power RF Output Power (V = 26V) Storage Temperature Parameter Valu e 28 28 14 43 - 30 to + 100 Un it Vdc Vdc dBm CW dBm CW o C June 1999 1/7 STM961-15B ELECTRICAL SPECIFICATION (Tcase = -10 oC to +85oC, VS1 = 26 V, VB = 26 V to 27 V) DYNAMIC Symb ol BW GP h Parameter Frequency Range Power G ain Efficiency VSWR IQ 2F O 3F O F P 1 dB Quiescent Current Harmonics Harmonics Gain F latness Output Power @ 1 dB Compression Load Mismatch Stability VSW R = 3:1 POUT = +42 dBm CW P OUT = +42 dBm CW P OUT = +42 dBm CW P OUT = +42 dBm CW P IN = 0 dBm P OUT = +42 dBm CW P OUT = +42 dBm CW P OUT = +42 dBm CW 41 1 Z S , ZL = 50 Ω 580 -30 -50 T est Con ditio ns Min. 915 28 32 30 35 2:1 Typ . Max. 960 Un it MHz dB % VSW R mA dBc dBc dB dBm No Degradation in Output Power All Spurious O utputs more than 60db Below Carrier REF. 1017332I P OUT = +10 dBm to +42 dBm Load VSW R = 3:1 All phase angles MODULE DC AND TEST FIXTURE CONFIGURATION REF. 1014532D 2/7 STM961-15B TYPICAL PERFORMANCE Power Gain vs Output Power Power Gain vs Output Power 34 27.0 v 26.0 v Tcase = -10 deg.C 34.5 26. 0 v 27.0 v 26.0 v 27.0 v Tcase=-10 deg.C 33 27.0 v POWER GAIN [dB] 25. 0 v 25. 0 v POWER GAIN [dB] 33.5 25.0 v 26.0 v 32 Tcase= +25 deg.C 27. 0 v 32.5 25.0 v 27.0 v 31 26. 0 v Tcase=+25 deg.C 31.5 26.0 v 25.0 v 30 25.0 v 30.5 Tcase= +85 deg.C f=960 MHz f=915 MHz 29.5 10 20 Tcase =+85 deg.C 29 10 20 30 34 36 38 40 42 30 34 36 38 40 42 OUTPUT POWER [dBm] OUTPUT POWER [dBm] Power Gain vs Frequency & Temperature 34 3rd Order IMD vs Output Power & Temperature -25 Tc=-10 deg.C 33 POWER GAIN [dB] -30 Tcase=-10 deg.C 32 Tc=+25 deg .C 3rd IMD [dBT] -35 Tcase=+85 deg.C 31 -40 Tcase=+25 deg.C -45 Tc=+85 deg .C 30 Po=42 dBm CW Vs=26.0 V 29 900 910 920 930 940 950 960 970 980 -50 20 22 24 26 28 30 32 34 FREQUENCY [MHz] PEP [dBm] Freq.=960 MHz Vs=26.0 V 36 38 40 42 see note 1 3rd Order IMD vs Output Power & Temperature -26.5 5th Order IMD vs Output Power & Temperature -33 -31.5 Tcase=-10 deg.C 3rd IMD [dBT] -36.5 3rd IMD [dBT] -38 Tcase=-10 deg.C -43 Tcase=+85 deg.C -48 Tcase=+85 deg.C Tcase=+25 deg.C -41.5 Tcase=+25 deg.C -53 -46.5 Freq.=915 MHz Vs=26.0 V 22 24 26 28 30 32 34 36 38 40 42 -58 20 22 24 26 28 30 32 Freq.=960 MHz Vs=26.0 V 34 36 38 40 42 PEP [dBm] 20 PEP [dBm] see note 1 see note 1 3/7 STM961-15B TYPICAL PERFORMANCE 5th Order IMD vs Output Power & Temperature -33 38.5 -38 Tcase=-10 deg.C EFFICIENCY [%] 37.5 Vs=25.0 V Tcase=+25 deg.C Po=42 dBm CW Efficiency vs Frequency 3rd IMD [dBT] -43 Tcase=+25 deg.C -48 Tcase=+85 deg.C 36.5 Vs=26.0 V -53 35.5 -58 20 22 24 26 28 30 32 34 Freq.=915 MHz Vs=26.0 V 36 38 40 42 PEP [dBm] Vs=27.0 V 34.5 900 910 920 930 940 950 960 970 980 FREQUENCY [MHz] see note 1 CW Efficiency vs Output Power & Temperature CW Efficiency vs Output Power & Temperature 37 32 Tcase=-10 deg.C Tcase=+25 deg.C 37 32 Tcase=-10 deg.C Tcase=+25 deg.C CW EFFICIENCY [%] 27 22 17 CW EFFICIENCY [%] 27 22 17 Tcase=+85 deg.C Tcase=+85 deg.C 12 7 32 Freq.=960 MHz Vs=26.0 V 34 36 38 40 42 O UTPUT POWER [dBm] 12 7 32 Freq.=915 MHz Vs=26.0 V 34 36 38 40 42 OUTPUT POWER [dBm] VSWR vs Frequency & Temperature 2 Vs=26.0 V Po=42 dBm CW 1.8 Tcase=+85 deg.C 1.6 VSWR Note (1) : Two-tone test; 20KHz separation; IMD (in dBT) is referenced to the individual tone level. 1.4 Tcase=+25 deg.C 1.2 Tcase=-10 deg.C 1 900 910 920 930 940 950 960 970 980 FREQUENCY [MHz] 4/7 STM961-15B APPLICATIONS RECOMMENDATIONS OPERATION LIMITS The STM961-15B power module should never be operated under any condition which exceeds the Absolute Maximum Ratings presented on this data sheet. Nor should the module be operated continuously at any of the specified maximum ratings. If the module is to be subjected to one or more of the maximum rating conditions, care must be taken to monitor other parameters which may be affected. DECOUPLING Failure to properly decouple any of the voltage supply pins will result in oscillations at certain operating frequencies. Therefore, it is recommended that these pins be bypassed as indicated in the Module DC and Test Fixture Configuration drawing of this data sheet. MODULE MOUNTING To insure adequate thermal transfer from the module to the heatsink, it is recommended that a satisfactory thermal compound such as Dow Corning 340, Wakefield 120-2 or equivalent be applied between the module flange and the heatsink. The heatsink mounting surface under the module should be flat to within ± 0.05mm (± 0.002 inch). The module should be mounted to the heatsink using 3.5 mm (or 6-32) or equivalent screws torqued to 5-6 kg-cm (4-6 in-lb). The module leads should be attached to equipment PC board using 180°C solder applied to the leads with a properly grounded soldering iron tip, not to exceed 195°C, applied a minimum of 2 mm (0.080 inch) from the body of the module for a duration not to exceed 15 seconds per lead. It is imperative that no other portion of the module, other than the leads, be subjected to temperatures in excess of 100°C (maximum storage temperature), for any period of time, as the plastic moulded cover, internal components and sealing adhesives may be adversely affected by such conditions. Due to the construction techniques and materials used within the module, reflow soldering of the flange heatsink or leads, is not recommended. THERMAL CONSIDERATIONS It will be necessary to provide a suitable heatsink in order to maintain the module flange temperature at or below to maximum case operating temperature. In a case where the module output power limited to +42 dBm CW and designing for the worst case efficiency of 32%, the power dissipated by the module will be 33.6 Watts. The heatsink must be designed such that the thermal rise will be less than the difference between the maximum operating case temperature of the module while dissipating 33.6 W. At Tcase = +85 oC, V = 26V, ZL = 50 Ω and POUT = 42 dBm, maximum junction temperatures for the individual transistors should be below the following values: Q1 = 140 oC, Q2 = 145 oC, Q3 = 130 oC. 5/7 STM961-15B H110 MECHANICAL DATA DIM. MIN. A B C D E F G H J K M N P Q R S T 0.38 3.81 17.40 8.77 4.52 0.13 40.64 35.94 33.40 15.62 13.08 0.63 4.06 19.55 9.77 5.72 0.015 0.150 0.685 0.345 0.178 48.01 29.72 15.12 8.89 3.05 4.06 0.38 0.005 1.600 1.415 1.315 0.615 0.515 0.025 0.160 0.770 0.385 0.225 mm TYP. MAX. 48.51 30.22 15.49 9.55 3.42 MIN. 1.890 1.170 0.595 0.350 0.120 0.160 0.015 inch TYP. MAX. 1.910 1.190 0.610 0.376 0.135 1014273H 6/7 STM961-15B Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 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