STNRG011

STNRG011 Datasheet Digital combo multi-mode PFC and time-shift LLC resonant controller Features • • • • • • • • • Digital combo multi-mode PFC + time-shift LLC resonant half-bridge controller Onboard 800 V startup circuit, line sense and X-cap discharge compliant with IEC 62368-1, for reduced standby power Enhanced fixed on time multi-mode TM PFC controller with input voltage feedforward, THD optimizer and frequency limitation Complete set of PFC protections Time-shift control of resonant half-bridge Enhanced burst-mode at light load with fast transient response and line adaptive half- bridge brown-out protection Complete set of half-bridge protections Available in SO20 package Applications • • • • Open frame SMPS Flat screen TV SMPS ATX power supply AC-DC adapter Figure 1. Block diagram Product status link HVG STNRG011 FGND Product summary Order code STNRG011 Package Packing STNRG011T R SO20 Tube BOOT LVG LLC_CS LLC_AUX LLC_FB HV AC line interface LLC controller PFC controller VAC VCC PFC_GD PFC_CS PFC_FB PFC_ZCD Tape & Reel TX Product label HV half-bridge driver RX DS12075 - Rev 4 - February 2021 For further information contact your local STMicroelectronics sales office. Power management and communication VCORE www.st.com STNRG011 Description 1 Description The STNRG011 embodies a multi-mode (transition-mode and DCM) PFC controller, a high- voltage double-ended controller for the LLC resonant half-bridge, an 800 V-rated startup generator and a sophisticated digital engine, that manage optimal operation of three blocks. The device comes in a 20-pin SO package and offers an advanced solution for power- factor-corrected highefficiency converters supposed to comply with the most stringent energy saving regulations. The power system and the control algorithms are managed by an 8-bit core with dedicated fast peripherals (SMED). Optimized digital algorithms together with HW analog IPs are implemented to guarantee a very high performance, BOM optimization and robustness. The digital algorithms are stored into an internal ROM memory and all key application parameters can be stored into a device's NVM (non-volatile memory) memory during the production phase allowing wide configurability and calibration. The device can also externally communicate through a 2-pin UART, allowing the monitoring function, the black box storing into an external E2PROM and the software patch upload from the external E2PROM. DS12075 - Rev 4 page 2/31 STNRG011 Pin connection 2 Pin connection Figure 2. Pin connection (top view) BOOT 1 20 VAC HVG 2 19 N.C. FGND 3 18 VCC N.C. 4 17 PFC_GD LVG 5 16 PGND TX 6 15 SGND RX 7 14 VCORE LLC_CS 8 13 PFC_FB LLC_AUX 9 12 PFC_CS 10 11 PFC_ZCD LLC_FB DS12075 - Rev 4 page 3/31 STNRG011 Absolute maximum ratings and thermal data 3 Absolute maximum ratings and thermal data Table 1. Absolute maximum ratings Symbol Pin VVAC VAC VBOOT BOOT VFGND Value Unit -1 to 800 V Floating supply voltage, referred to GND -0.3 to 600 + VCC V FGND Floating ground voltage, connected to the half-bridge node -3 up to a value included in the range BOOT - VCC and BOOT +0.3 V dVFGND /dt FGND Floating ground max. slew rate 50 V/ns VHVG HVG HVG voltage FGND -0.3 to BOOT +0.3 V VVCC VCC IC supply voltage -0.3 to 19 V VLVG Parameter Voltage range LVG, PFC_GD Voltage range -0.3 to VCC V VVCORE VCORE Voltage range -0.3 to 5.5 V IPFC_CS, ILLC_CS, IPFC_ZCD, PFC_CS, LLC_CS, PFC_ZCD 2 mA VPFC_CS, VLLC_CS, VPFC_ZCD PFC_CS, LLC_CS, PFC_ZCD Positive voltage range VCORE +0.3 V VPFC_FB, VLLC_FB PFC_FB. LLC_FB Voltage range -0.3 to VCORE +0.3 V VRX RX Voltage range -0.3 to VCORE +0.3 V VTX TX Voltage range -0.3 to VCORE+ 0.3 V VPFC_GD Clamped source current (pin voltage: < 0 V, self-limited) Table 2. Thermal data Symbol Parameter Rth j-amb Max. thermal resistance, junction to ambient Tj Tstg DS12075 - Rev 4 Value Unit 120 °C/W Junction temperature operating range -40 to 150 °C Storage temperature -55 to 150 °C page 4/31 STNRG011 Detailed block diagram 4 Detailed block diagram Figure 3. Detailed block diagram SGND VCORE VCC BIAS VCC mngt VAC Vline_sen BOOT HVG AC interface FGND LLC SMED VCC SURGE Comp LVG PGND 430 V eq. VCC LLC ZCD Comp Oscillator PFC SMED PFC_GD SGND PGND LLC OC1 Comp EW signal LLC_CS 700 mV LLC OC2 Comp LLC BURST Comp LLC_FB SHUTDOWN Comp 125 mV Power manager and burst mode engine LLC OVP Comp 2.5 V LLC_AUX 16x 16 MAC PFC_CS 500 mV 900 mV PFC ZCD Comp PFC_ZCD Communication interface TX 16 kB ROM PFC_FB module LLC_FB DS12075 - Rev 4 PFC_FB PFC RECOT Comp PFC OC2 Comp 0.9 V Int_temp 2.3 V PFC OC1 Comp Ext. BM Comp Vline_sen PFC OVP Comp ADC 4 kB RAM 256 b NVM RX page 5/31 STNRG011 Pin function 5 Pin function Table 3. Pin function detailed description No. Name Function High-side gate-drive floating supply voltage. 1 BOOT The bootstrap capacitor is connected between this pin and FGND. A fast diode has to be connected from this pin and VCC to guarantee recharge of the bootstrap capacitor. High-side gate-drive output. 2 HVG The driver is capable of 0.5 A source and 0.75 A sink peak current (minimum values) to drive the upper MOSFET of the half-bridge leg. A resistor internally connected to FGND ensures that the pin is never floating. High-side gate-drive floating ground. 3 FGND It is the return path for the high-side gate-drive current. Layout carefully the connection of this pin to avoid too large spikes below ground. High-voltage spacer. 4 N.C. The pin is not internally connected to isolate the high-voltage section and ease compliance with safety regulations (creepage distance) on the PCB. Low-side gate-drive output. 5 LVG The driver is capable of 0.5 A source and 0.75 A sink peak current (minimum values) to drive the lower MOSFET of the half-bridge leg. The pin is actively pulled to GND during UVLO. 6 TX TX pin for UART/SDA pin for I2C interface 7 RX RX pin for UART/SCL pin for I2C interface 8 LLC_CS 9 LLC_AUX 10 LLC_FB 11 PFC_ZCD LLC tank current sensing input. A voltage proportional to the tank current (usually obtained with a capacitive divider) has to be applied to this pin. The information is used for zero-crossing detection (required by time-shift algorithm), the first and second level OCP. LLC_AUX is connected to a divider sensing the auxiliary voltage from the LLC transformer. The LLC OVP detection is active on this pin. The voltage from this pin is used as the LLC feedback voltage. It has to be connected to the feedback phototransistor collector and a pull-up resistor to VCORE. PFC ZCD input, connected to the PFC AUX winding through a resistor divider detecting the PFC inductor demagnetization. Current sense input for PFC. 12 PFC_CS The current flowing in the MOSFET is sensed through a resistor, and the resulting voltage is applied to this pin. After GD turns on, a first voltage threshold cross allows enhanced COT control implementation. A second level can be detected for overcurrent protection. DS12075 - Rev 4 13 PFC_FB Input for PFC output voltage. It is used for closing the PFC loop and OVP protection. It has to be connected with a voltage divider to the bulk capacitor. If the early warning feature is enabled this pin is brought to 5 V when the EW pulse is released. 14 VCORE Internal VCORE bypass capacitor connection. 15 SGND Signal ground. Reference ground for analog signals. 16 PGND Power ground. Current return for the PFC gate-driver and the low-side gate-driver of the half- bridge. Keep the PCB trace that goes from this pin to the sources of the PFC and the low-side MOSFETs separate from the trace that collects the grounding of the bias components. 17 PFC_GD PFC gate-driver output. The output stage is able to drive power MOSFETs, it is capable of 0.7 A source current and page 6/31 STNRG011 Pin function No. Name Function 0.8 A sink current (minimum values). 18 VCC 19 N.C. Supply voltage of both the signal part of the IC and the gate-drivers. A bypass capacitor to GND is necessary to sustain the IC during startup and low power modes. The voltage on the pin is internally clamped to protect the internal circuits from temporary excessive supply voltages. The pin is not internally connected to isolate the high-voltage section and ease compliance with safety regulations (creepage distance) on the PCB. High-voltage startup generator input. The pin has to be connected directly to the mains voltage through two dedicated diodes. If the voltage on the pin is higher than 50 V, an internal current source charges the capacitor connected between the pin VCC and GND until the voltage on the VCC pin reaches the startup threshold. 20 VAC Normally, the generator is re-enabled when the voltage on the VCC pin falls below the UVLO threshold. The pin is also used as the line voltage sensing input. This pin is internally connected to a 20 MΩ resistor divider. It is used for all line sense related functions: the AC brown-out, surge detection, line disconnection, input voltage feed-forward, line synchronization. When a line disconnection is detected, the internal current source is activated to discharge the X-capacitor. DS12075 - Rev 4 page 7/31 STNRG011 Electrical characteristics 6 Electrical characteristics Tj = 0 to +125 °C, VCC = VBOOT = 15 V, CHVG = CLVG = CPFC_GD = 1 nF; unless otherwise specified. Note: Adjust Vcc above VccOn before setting at 15 V. Table 4. Electrical characteristics Symbol Parameter Test condition Min. Typ. Max. Unit 19 - - V Supply voltage Vccz Vcc clamp voltage - Vcc Operating range After turn-on 9.5 - 19 V VccOn Processing turn-on threshold Voltage rising(1) 16 17 18 V VccOff Processing turn-off threshold Voltage falling(1) 8 8.7 9.4 V Hysteresis - - 8.3 - V VccCoreOn VCC threshold for VCore turn-on Voltage rising(1) - 8 - V VccCoreOff VCC threshold for VCore turn-off Voltage falling(1) - 7 - V Operating range Isource 0 to 1 mA 4.75 - 5.25 V T 25 °C - 0.5 - mA PFC and LLC off - 18 - PFC driver only (during PFC SS) - 20 - All drivers - 22 - 800 - - - 1 - - 6 - - 6 - Hys VCore Supply current IVccs Quiescent current during sleep (BM) IVccop Operating supply current at fsw = 50 kHz, C = 1 nF, VCC = 12 V mA High-voltage startup generator VVAC_BR Breakdown voltage IHV < 50 µA VCC > VccOn VVAC > 40 V VCC < 0.8 V VVAC > 40 V 0.8 V < VCC < VccCoreOn VVAC > 100 V IVAC_on ON-state VAC input current VccCoreOn < VCC < 14 V VVAC > 100 V 4 - - 20 - - 10 - VVAC > 40 V VCC < 0.8 V -0.5 -0.75 -1.3 VVAC > 40 V -3.5 -5 -8 40 V < VVAC < 100 V VccCoreOn < VCC < 14 V 40 V < VVAC < 100 V 14 V < VCC < VccOn IVcc_charge DS12075 - Rev 4 ON-state VCC charge current mA - 14 V < VCC < VccOn V mA page 8/31 STNRG011 Electrical characteristics Symbol Parameter Test condition Min. Typ. Max. - -5 - - -3.5 - - -18 - - -8 - Unit 0.8 V < VCC < VccCoreOn VVAC > 100 V VccCoreOn < VCC < 14 V VVAC > 100 V IVcc_charge ON-state VCC charge current 14 V < VCC < VccOn 40 V < VVAC < 100 V VccCoreOn < VCC < 14 V 40 V < VVAC < 100 V 14 V < VCC < VccOn IVAC_off IVAC_HV_SINK mA OFF-state VAC input current VVAC = 400 V, VCC > VccOn - 20 40 µA VAC reading improvement current VVAC = 100 V - 100 - µA - - 0.7 V 9.85 9.95 - V PFC - gate-driver VOL Output low voltage Isink = 100 mA Isource = -10 mA VOH Output high voltage VCC = 10 V, VCC = 18 V 17.9 17.95 - nF(2) -0.7 -1.1 - A 0.8 1.3 - A Isrcpk Peak source current Cgate = 4.7 Isnkpk Peak sink current Cgate = 4.7 nF(2) tf Voltage fall time - - 25 - ns tr Voltage rise time - - 30 - ns PFC_GD_uvlo UVLO saturation VCC = 0 to VccOn, Isink = 1 mA - 0.9 1.15 V - - 0.7 V VCC = 10 V 9.85 9.9 - V VCC = 18 V 17.85 17.9 - Low-side gate-driver (voltages referred to GND) VOL Output low voltage Isink = 100 mA Isource = -10 mA VOH Output high voltage Isrcpk Peak source current Cgate = 4.7 nF(2) -0.5 -0.8 - A Isnkpk Peak sink current Cgate = 4.7 nF(2) 0.75 1.2 - A tf Voltage fall time - - 25 - ns tr Voltage rise time - - 40 - ns LVG_uvlo UVLO saturation VCC = 0 to VccOn, Isink = 1 mA - 0.9 1.1 V - - 0.7 V Isource = -10 mA VBOOT= 10 V, 9.85 9.9 - VBOOT = 18 V 17.85 17.9 - High-side gate-driver (voltages referred to FGND) VOL Output low voltage VOH Output high voltage Isrcpk Peak source current Cgate = 4.7 nF(2) -0.5 -0.8 - A Isnkpk Peak sink current Cgate = 4.7 nF(2) 0.75 1.2 - A Voltage fall time - - 25 - ns tf DS12075 - Rev 4 Isink = 100 mA V page 9/31 STNRG011 Electrical characteristics Symbol tr Parameter Test condition Min. Typ. Max. Unit Voltage rise time - - 40 - ns HVG_pdw HVG-FGND pull-down resistor - - 25 - kΩ IFGND Current from VBOOT to FGND VBOOT = 200 V - 1.5 - µA X-CAP discharge XCD_inact_time IXCD Inactivity detection time - - 50 - ms Discharge current - 4 - - mA Vline rising 112 114 116 V Vline falling - 108 - V Brown-in/out BI BO BIBO_H BO_mask TH HYST - 5.25 6 6.75 V Brown-out time - - 45 - ms Overtemperature (by design) TH T rising 130 140 150 °C HYST T falling - -30 - °C 57 60 63.7 MHz Vin ADC > 50 mV - 10 - bit CS 0 - 1.5 V Other 0 - 2.5 V Differential non linearity Vin ADC > 50 mV - ±1.5 - lsb Clock frequency Vin ADC > 50 mV - 15 - MHz Ts Sampling time Vin ADC > 50 mV - 7 - Tc Total conversion time (sampling included) Vin ADC > 50 mV - 18 - OTP CK Fck System clock in run mode ADC ADC_res FSR_L FSR_H DNL Fck_ADC Resolution Conversion range ADC Ck cycles ADC Ck cycles Comparators PFC_CS RECOT(3) TH RISING (DAC 6 bits) FSR = 125 STEP = 1.95 Input pin PFC_CS HYST PFC_CS OC1 PFC_CS OC2 PFC_ZCD ZCD(3) PFC_FB OVP LLC_FB(3) BURST DS12075 - Rev 4 TH RISING TH FALLING TH RISING TH FALLING TH FALLING (TH_F) TH RISING (TH_R) TH RISING HYST TH RISING mV 5 Input pin PFC_CS Input pin PFC_CS Input pin PFC_ZCD Input pin PFC_FB Input pin LLC_FB - 500 - - 450 - - 900 - - 850 - 0/50/100/200 210/110(4)/310/ TH_F +10 mV mV mV - 2.33 - V - 75 - mV 0.75/1/1.25 V page 10/31 STNRG011 Electrical characteristics Symbol LLC_FB(3) BURST LLC_FB SHUTDOWN LLC_AUX OVP LLC_AUX Ext. BM LINE SURGE LLC_CS OC1(3) Parameter HYST TH RISING TH FALLING TH RISING TH FALLING TH RISING TH FALLING TH RISING TH FALLING TH RISING Test condition Min. Input pin LLC_FB Input pin LLC_FB Input pin LLC_AUX Input pin LLC_AUX Input pin VAC TH RISING TH FALLING Max. 5/10 Unit mV - 145 - - 125 - - 2.5 - - 2.4 - - 0.9 - - 0.8 - - 430 - - 410 - mV V V V FSR = 500 STEP = 15.6 Input pin LLC_CS HYST LLC_CS OC2 Typ. mV 20 Input pin LLC_CS - 700 - - 650 - mV 1. Parameters tracking each other. 2. Guaranteed by design, not production tested. 3. Thresholds and hysteresis are programmed by the software in use. 4. The selection for TH_R = 110 mV is not allowed if TH_F = 200 mV. DS12075 - Rev 4 page 11/31 DS12075 - Rev 4 7 Application schematics Figure 4. Typical application schematic D1 L1 D2 C1 + D3 Q1 R1 + EMI filter - C2 R2 C3 D4 D5 R3 R4 R5 R6 VCC D8 Optional for surge 3 2 1 D6 VCC J1 Mains input R7 U1 20 19 18 D9 17 C5 16 15 R10 14 13 12 11 D12 C11 VAC BOOT N.C. HVG VCC FGND PFC_GD N.C. PGND LVG SGND TX VCORE RX PFC_FB LLC_CS PFC_CS LLC_AUX PFC_ZCD 1 D7 C4 R8 2 T1 3 J2 D10 1 2 4 R9 5 6 1 2 3 7 D11 R11 9 C7 10 C9 C8 R13 R12 C10 R14 R16 R15 R18 ISO1 R17 C13 VOUT C6 8 LLC_FB + Q3 J3 UART STNRG011 C12 Q2 C14 R19 R20 C15 R21 D13 VCC Q4 R23 + C16 C18 D14 D15 D16 D17 U2 TL431 R22 + C17 STNRG011 page 12/31 Application schematics D18 STNRG011 Architecture 8 Architecture The PFC and LLC external MOSFETs gates are managed by the “State Machine Event Driven” (SMEDs): 2 for PFC (PFC SMEDs) and 2 for LLC (LLC SMEDs). The SMEDs are programmable state machine driven by events: • External events – Analog comparators outputs – Power manager generated events (protections) • Internal events – Timer events PFC SMEDs • Input events: PFC RECOT, PFC OC1, PFC ZCD • Outputs: PFC_GD LLC SMEDs • Input events: LLC ZCD • Outputs: LVG, HVG The µP subsystem dynamically manages the control loop. • Analog comparators thresholds setting • SMED configuration • SMED timers • ADC scheduler • Interrupt management The multichannel ADC is controlled by a programmable event driven scheduler: sampling sequence can be configured and every sample can be triggered by a specific SMED state occurrence and an internal timer value. Different priorities can be programmed to allow fast sampling for real time control and slow sampling for state control (i.e., temperature). The scheduler can be programmed to generate interrupts after completion of selectable conversions. A dedicated AC line monitor easily follows the AC line providing system triggers. The µP reads data from the ADC and performs the loop calculation with the support of a dedicated 16-b x 16-b multiplier and a 32-b accumulator unit. A Power management and burst-mode machine manages the system power state in order to have very low idle consumption and fast activity restart during the burst-mode operation. Hard protections are managed with a very low propagation delay; the protection enable and the latched/not latched response are programmable. The power manager controls also the brown-in/out, VCC charge/discharge, AC monitor and X-cap discharge. A Watchdog resets the system in case of missed µP signal for a long time. A communication peripheral allows serial communication at startup and during the normal operation for: • External memory communication for – Black box external recording – Patch SW upload • Monitoring • Internal memory R/W and OTP management • Test mode DS12075 - Rev 4 page 13/31 STNRG011 Functional description 9 Functional description The main functions are: • HV startup and VCC management • Line monitor and protection • Drivers • PFC control and fault management • Resonant LLC HB control and fault management • Power management • Communication and configuration 9.1 HV startup and VCC management The VAC pin voltage is a rectified sine wave at 100 Hz/120 Hz, connected to the mains AC line (Vline) through two dedicated diodes. The VAC pin is the device supply at the startup. The VAC pin voltage is different from the PFC power path (Vin) where big caps are connected: the VAC pin partially follows the Vline also at no load condition while the Vin could be very close to a DC; this assumption allows to detect the AC line disconnection to implement the X-cap discharge function. At the VAC pin a HV DMOS is internally connected to charge the capacitor connected to the VCC pin. From the VCC pin an internal LDO provides the 5 V VCore for analog and digital circuitry; the digital section is supplied by the internal LDO from the VCORE pin. At startup, from the HV DMOS the capacitor connected to the VCC pin is charged to provide the power supply to the whole device; then the HV DMOS is turned off. The VCC pin starts sourcing current to the connected capacitor after a minimum 15 V VAC pin voltage. The VCC capacitor charge current is limited to 0.75 mA during the first charge phase to limit the temperature increase in case the VCC pin is short-circuited at startup. After the VCC pin voltage is above 0.8 V, the charging current rises to 5 mA. VCORE pin voltage rises when the VCC pin crosses 8 V (VccCoreOn). There is a VCORE overload protection that limits the VCC charging current below 1 mA in case the VCORE pin is short-circuited at startup. Then the VCC capacitor charge continues with an average current higher than 6 mA: the current is increased during the time the VAC pin voltage is below 100 V. Once the VCC pin crosses the 17 V VccOn rising threshold the HV DMOS turns off and the whole device starts working: the µP boots. If the VCC pin goes below the 9 V VccOff falling threshold (UVLO threshold) the µP stops working and the HV DMOS turns on again. If the VCC pin falls below 7 V (VccCoreOff) the device stops working and the capacitor connected to the VCORE pin discharges. The VCC pin can rise again only after the voltage on the VCORE pin falls below 1 V. The worst-case average charging current from the 0.8 V to the VccOn threshold is estimated in 4.63 mA and 4.11 mA, in case the mains voltage is 115 Vac - 60 Hz and 230 Vac - 50 Hz respectively. 9.2 AC line monitor and protection A HV voltage divider is internally connected to the VAC pin to generate Vline_sense for the AC line monitoring and protection: • Brown-in/out • Line synchronization • Line disconnection and X-cap discharge • Surge detection and stop • Line monitor for PFC control DS12075 - Rev 4 page 14/31 STNRG011 Gate-drivers 9.2.1 Brown-in/out Brown-in and -out functions are implemented based on the Vline_sense information. The peak VAC voltage is monitored to enable and disable the PFC. The PFC is enabled when the AC line crosses the brown-in threshold. The PFC is disabled after 45 ms the AC line is below the brown-out threshold. In order to improve AC line reading and avoid false brown-in, the HV DMOS is turned on sinking IXCD current for 100 ms in case of brown-out or line disconnection events. This function can be enabled / disabled through the dedicated NVM bit. 9.2.2 Line synchronization A dedicated digital peripheral manages the PFC synchronization with the AC line sine wave. In order to improve AC line reading and synchronization, the HV DMOS is turned on sinking IVAC_HV_SINK current at startup. This function can be enabled / disabled through the dedicated NVM bit. 9.2.3 Line disconnection and X-cap discharge The Vline_sense is monitored to detect the AC line disconnection in order to discharge the X-cap through the internal HV DMOS. The detection is based on AC activity absence on the VAC pin (the X-cap discharge function is triggered if there is no line activity for more than 50 ms). To discharge the X-cap, the HV DMOS turns on sinking a current of 4 mA minimum. In order to improve AC line reading and avoid false brown-in, the HV DMOS is turned on sinking IXCD current for 100 ms in case of brown-out or line disconnection events. This function can be enabled / disabled through the dedicated NVM bit. The discharge current stays on until the VAC pin is discharged or the AC line activity is detected again. 9.2.4 Vline surge stop A surge can be detected on the VAC pin (430 V). During the surge the PFC activity is stopped for one half-cycle. If a line surge is detected during the PFC soft-start, the system shuts down with a not latched fault. 9.2.5 Line monitor for PFC control A 20 MΩ voltage divider for the AC line monitor is internally connected from the VAC pin to GND. 9.2.6 Early warning signal If a brown-out or another stopping event (early warning managed faults) is detected, the STNRG011: • Stops the PFC • LLC continues switching for about 5 ms, trying to keep the LLC output voltage regulated • PFC_FB pin is pulled up to VCore voltage for about 5 ms (early warning signal) The early warning managed faults are: • Brown-out • X-cap • PFC UVP • LLC OLP If any other faults / events occur, the STNRG011 stops both PFC and LLC and generates an early warning signal for about 250 µs. The early warning signal generation is active as soon as the device starts driving the PFC MOSFET. This function can be enabled / disabled through the dedicated NVM bit. 9.3 Gate-drivers The HVG and LVG are matched drivers. Deadtimes are programmable by the user. DS12075 - Rev 4 page 15/31 STNRG011 PFC control and fault management During the burst-mode sleep phase, the HS BOOT capacitor discharges. The burst packets always start with a LVG pulse to recharge the bootstrap capacitor. A fast external bootstrap diode is necessary. 9.4 PFC control and fault management 9.4.1 PFC resources Table 5. Related pins Pin name Description Level 0 - 125 mV PFC_CS PFC MOSFET current sense PFC_ZCD PFC auxiliary connection for ZCD detection 6-bit ramp enhanced COT feature 500 mV OCP1 900 mV OCP2 fault - - PFC_FB Reading for PFC Vout estimation ADC, 10 bits - VAC ADC, 10 bits - - - Mains line voltage reading PFC_GD PFC MOSFET gate-driver 9.4.2 Function Vin reading Input line voltage peak (Vin) reading on the VAC pin by the ADC at the AC line peak. 9.4.3 PFC output voltage feedback reading PFC output voltage reading on the PFC_FB pin by the ADC. 9.4.4 PFC OVP comparator The PFC OVP comparator sets the limit for the PFC output voltage. It monitors the PFC_FB pin with respect to a fixed 2.3 V threshold. 9.4.5 PFC RECOT comparator The PFC RECOT comparator implements the TON adjustment for the ramp enhanced constant on-time (RECOT) control. It monitors the PFC_CS pin with respect to a programmable threshold. Its output communicates to the PFC SMED. 9.4.6 PFC OC1 comparator The PFC OC1 comparator sets the limit for the operational maximum allowed peak current into the PFC MOSFET. If the OC1 threshold is hit the PFC_GD is turned off. This protection works cycle by cycle. It monitors the PFC_CS pin with respect to a fixed 500 mV threshold. Its output communicates to the PFC SMED. 9.4.7 PFC OC2 comparator The PFC OC2 comparator sets an HW limit for the current flowing into the PFC MOSFET: it triggers the OCP fault. It monitors the PFC_CS pin with respect to a fixed 900 mV threshold. 9.4.8 PFC ZCD The PFC ZCD comparator performs the zero cross detection to implement the soft switching of the PFC MOSFET. It monitors the PFC_ZCD pin with respect to two programmable rising and falling thresholds. Its output communicates to the PFC SMED. DS12075 - Rev 4 page 16/31 STNRG011 PFC algorithm 9.4.9 PFC state machine event driven (SMED) The PFC high frequency operations are managed by a programmable 8-state ”State Machine Event Driven” (2 coupled 4-state SMEDs). The SMED controls the PFC MOSFET based on the PFC comparators output and internally controlled counters. It generates also the comparators' enable signals. It works at 60 MHz. 9.5 PFC algorithm The PFC operates based on a multi-mode scheme. A constant on-time (COT) control is implemented; TON is calculated from the PFC feedback and the measured Vin peak. TON is calculated and updated at the line cycle valley. Based on the working PFC's operating state variables the working mode is changed to optimize the overall efficiency. 9.5.1 Ramp enhanced COT improved (patented) The PFC control is based on the constant on-time scheme, with a proprietary improved algorithm: the calculated TON is applied only after the PFC RECOT comparator is triggered to balance the recovery diode energy and the EMI capacitor current. The PFC RECOT comparator threshold is adjusted by the core with a 6-bit DAC and allows to apply the programmed base and ramp (defined by user into NVM). This feature allows improving the total harmonic distortion (THD) and the power factor (PF) of the application. 9.5.2 Operating modes The PFC manager changes the operating modes by dynamically reconfiguring the SMEDs, obtaining optimal performances in term of both efficiency and THD/PF. • Transition mode (TM mode) • Valley skipping • Discontinuous mode (DCM) 9.6 PFC protections 9.6.1 PFC OVP In case the bulk voltage triggers the PFC OVP comparator, the system enters the fault state; the overvoltage protection can be programmed as latched or not latched. The device implements also software overvoltage protection (SW OVP) that allows turning off the PFC until the next line valley in case the SW OVP threshold is reached. The SW OVP threshold is a NVM parameter. 9.6.2 PFC OCP2 If the PFC OC2 comparator is triggered, the PFC gate is truncated and remains off until the beginning of a new line half cycle. In case the PFC OC2 comparator is triggered for more than a programmable number of consecutive half line cycles the device enters the OCP2 fault and it is turned off. The OCP2 fault can be programmed as latched or not latched. 9.6.3 Surge When the surge comparator signal is high the PFC MOSFET is turned off and an interrupt is generated. The device will turn on the PFC MOSFET at the new line half cycle if the surge comparator output is low. 9.6.4 PFC soft-start timeout If the PFC soft-start is not finished after 1 s the system enters the PFC soft-start timeout fault state and it is turned off. The fault is not latched. DS12075 - Rev 4 page 17/31 STNRG011 LLC control and fault management 9.6.5 PFC UVP If the PFC_FB pin is below a threshold set by the user the device enters the PFC UVP fault and it is shut down. The system provides two different times of intervention configurable by NVM: adaptive and slow. The slow intervention allows to shut off the system in case the UVP threshold is confirmed for at least 100 ms. The adaptive one allows to shut off the device immediately in case also the mains AC line is sensed below the brownout threshold for at least 1 half line cycle. On the contrary, the shut off will be delayed as if the intervention is set to slow, until the UVP and the mains conditions remain. 9.6.6 PFC_FB disconnection If the PFC_FB is stuck low the system enters the PFC_FB disconnection fault state (latched) and it is turned off if the disconnection faults detection is enabled in NVM. 9.6.7 PFC_CS disconnection If the PFC_CS pin is stuck low (or high) during the the PFC soft-start the system enters the PFC_CS disconnection fault state (latched) and it is shut down if the disconnection faults detection is enabled in NVM. In case the PFC_CS is stuck high during the operative mode the system enters the PFC_CS disconnection fault state and it is turned off if the disconnection faults detection is enabled in NVM. 9.6.8 PFC_ZCD disconnection If the PFC_ZCD pin is stuck low or high during the PFC soft-start, the system enters the PFC_ZCD disconnection fault (latched) and it is turned off if the disconnection faults detection is enabled in NVM. 9.7 LLC control and fault management 9.7.1 LLC related resources Table 6. Pin descriptions Pin name LLC_CS Description Low-side current sense LLC_AUX LLC auxiliary winding voltage sense LLC_FB 9.7.2 LLC OPTO feedback sense, burst comparator and SHUTDOWN comparator Level Function 0 - 500 mV 5-bit OLP 700 mV OCP2 fault 0.9 V External burst-mode 2.5 V LLC output OVP ADC, 10 bits Feedback sense Programmable Burst comparator 125 mV Shutdown comparator HVG High-side gate driving - - LVG Low-side gate driving - - LLC OC1 comparator The LLC OC1 comparator implements the overload protection (OLP). It monitors the LLC_CS pin with respect to a programmable threshold. If the LLC_CS pin goes every cycle over the OC1 threshold for a programmable time, the IC shuts down and enters the OLP fault. Both threshold and duration are programmable trough NVM parameters. 9.7.3 LLC OC2 comparator The LLC OC2 comparator sets an HW limit for the current flowing into the LLC resonant tank: it triggers the OCP2 fault. DS12075 - Rev 4 page 18/31 STNRG011 LLC protections It monitors the LLC_CS pin with respect to a fixed 700 mV threshold. If this threshold is triggered for a programmable consecutive number of cycles, the OCP2 fault is triggered and the system shuts down. 9.7.4 LLC ZCD comparator The LLC ZCD comparator detects the LLC current zero-crossing during the normal operation to implement the time-shift control and the anti capacitive protection. Its output communicates to the LLC SMED. The comparator’s hysteresis is programmable by NVM choosing between the available values 5 mV or 10 mV. 9.7.5 LLC_FB voltage reading: OPTO feedback loop error The LLC_FB pin is connected to the optocoupler and its voltage is the error signal of the LLC loop. The LLC_FB voltage is sampled by the ADC to calculate the time-shift. 9.7.6 Shutdown feature If the LLC_FB pin is forced below 125 mV, the device shuts down. If the voltage returns over such threshold the system restarts performing the soft-start. This feature can be enabled / disabled using a NVM bit. 9.7.7 SMEDs HVG and LVG are driven by an event driven 60 MHz state machine (2 coupled 4-state SMEDs). Driving events are the ZCD event and the elapsing of the programmable time which sets the high-side and low-side time-shift values and drivers deadtime. 9.7.8 Algorithm The LLC operation is based on “Symmetric Time-Shift Control” (STSC), an improved version of time-shift control that guarantees 50% of the HB duty cycle. The time-shift value is calculated from the LLC_FB pin. 9.7.9 Time-shift (patented) The TSC methodology consists in controlling the amount of time elapsing from a zero- crossing of the tank current to the switch-off of the MOSFET currently on. Conceptually, with TSC an inner loop is closed and the outer loop that regulates the output voltage provides the reference for the inner loop. This inner loop is completely managed by SMEDs using the zero current detection information. 9.8 LLC protections 9.8.1 Anti-capacitive protection Anti-capacitive control is applied at the SMEDs level using ZCD time events. The IC monitors the phase relationship between the LLC tank current sensed on the LLC_CS pin and the voltage at the HVG and LVG, checking the time between the gate rising edge and the tank current zero cross detection. If this time is below a programmable threshold, which is indicative of impending the capacitive-mode operation, the monitoring circuit activates the “Soft” ACP procedure: the time-shift is reduced (and therefore the switching frequency is increased) in order to keep the converter away from that dangerous condition. If the time reaches “zero” the device is stopped immediately. This is called “Hard” ACP. Both hard and soft ACP can be enabled and disabled through NVM. 9.8.2 LLC OLP If the LLC OC1 comparator is triggered the system could enter the overload protection (OLP). During this phase the system regulates the output and checks for a programmable time if the OCP1 event is still present, in this case the device is shut down entering the OLP fault state that can be programmed as latched or not latched. DS12075 - Rev 4 page 19/31 STNRG011 ADC 9.8.3 LLC OCP2 If the LLC OC2 comparator is triggered for a number of times greater than a threshold set by the user the device sets the OCP2 fault and it is shut down. The OCP2 fault can be programmed as latched or not latched. 9.8.4 LLC soft-start timeout If the LLC output voltage cannot reach the regulation value within 100 ms, the device enters the LLC soft-start timeout fault and it is shut down. The fault can be programmed as latched or not latched. 9.8.5 LLC OVP If the LLC_AUX pin voltage is higher than the LLC OVP comparator threshold (2.5 V), the system enters the LLC OVP fault state and it is turned off. The fault can be programmed as latched or not latched and can be disabled. 9.8.6 LLC_CS disconnection If the LLC_CS pin is stuck at 0 V or 5 V during the soft-start the system enters the LLC_CS disconnection fault (latched) and it is shut down if the disconnection faults detection is enabled in NVM. 9.8.7 LLC_AUX disconnection If the pure external burst-mode is enabled and the LLC_AUX pin is stuck at 0 V during the burst and the LLC_FB pin is higher than the burst comparator threshold, after 32 burst packets, the system enters LLC_AUX disconnection protection (latched) and it is shut down if the disconnection faults detection is enabled in NVM. 9.9 ADC The system ADC is an 8-channel 15-MHz SAR 10-bit A/D converter. It needs 7 cycles (470 ns) for sampling and 11 cycles (740 ns) to convert the data. It is controlled by a SW programmable scheduler allowing flexible system signals reading: • Fixed time sequence conversion • Event driven sequence conversion Table 7. ADC input signals 9.10 9.10.1 Signal Pin Notes FSR Input line voltage VAC Internal voltage divider PFC feedback voltage PFC_FB Direct reading 2.5 V LLC feedback voltage LLC_FB Direct reading 2.5 V 484.5 V Burst-mode Specific resources Burst comparator on LLC_FB pin The LLC BURST comparator at the LLC_FB pin is used to wake-up the system, in order to perform a burst sequence. The comparator is alive also during sleep and the wake-up threshold is programmable (0.75 V, 1 V, 1.25 V). External burst-mode comparator on LLC_AUX pin The external burst-mode comparator with the 0.9 V threshold on the LLC_AUX pin is used to enter / exit the burst-mode using an external digital signal. The external burst-mode operation can be enabled / disabled using a NVM bit. 30-kHz system oscillator A 30-kHz oscillator (always on) keeps the system alive. DS12075 - Rev 4 page 20/31 STNRG011 Communication and configuration 9.10.2 Algorithm The system can manage the deep sleep state with very low VCC current consumption (500 µA). The system in deep sleep • Monitors the AC line for X-cap discharge and brown-out condition • Monitors the burst comparator to detect wake condition • Monitors the VCC for data integrity • All RAM data are maintained The device implements two different burst-mode algorithms: the LLC_FB burst or external burst. The first one is based on just the LLC_FB pin voltage, the second one is based on the external BM comparator on the LLC_AUX pin that can be driven sensing the output current. The burst-mode can be programmed to depends either on the LLC_FB pin only, or LLC_AUX pin only, or both. This third possibility is called hybrid external burst. In case of the LLC_FB burst-mode, the device enters the sleep mode if the LLC_FB pin voltage goes below a programmable threshold. The burst switching activity is enabled after the burst comparator is triggered. The normal switching activity is restored if the time between two bursts is lower than a programmable threshold. This time defines a precise power level at which the controller exits the burst-mode. In order to have a faster response to the big load transient the system exits the burst-mode also if the LLC_FB pin voltage is still above the burst comparator threshold after one burst packet. In case of the LLC_AUX pin driven burst mode, two types of external burst mode could be defined: • Pure external burst mode: only the external BM comparator manages the burst mode entering / exiting; • Hybrid external burst mode: if the external BM comparator is high, the system stays out of burst mode while if the external BM comparator is low, burst mode entering / exiting is managed by the LLC_FB pin settings. In both external burst mode cases, the burst switching activity is anyway managed by the LLC_FB pin and the burst comparator. The PFC and LLC switching activities during the burst-mode are synchronized. The LLC can perform a burst without the PFC, depending on the system conditions. 9.11 Communication and configuration The device communicates with an external digital device through a serial interface. The serial interface uses two dedicated pins with a standard UART protocol. It implements also an I2C protocol for external E2PROM writing and reading. The serial interface allows the user to: • write the NVM to configure the device in a specific application: 20 bytes are available. • write into the RAM for test and SW patch purpose • read the NVM content • read the RAM content • read register content • configure the device for specific tests Based on a specific code into the NVM the serial interface functionality can be reduced for security reasons. 9.11.1 Monitor Some internal data can be provided to an external digital device trough the UART interface for monitoring purposes. 9.11.2 Black box Black box data are written into the external E2PROM during the normal operation. 9.11.3 Patches SW patches (if necessary) are uploaded by the device from the external E2PROM at the startup. Maximum patch size is 2.5 kB. DS12075 - Rev 4 page 21/31 STNRG011 Package information 10 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 10.1 SO20 package information Figure 5. SO20 package outline DS12075 - Rev 4 page 22/31 STNRG011 SO20 package information Table 8. SO20 package mechanical data Dimensions mm Symbol Min. Typ. Max. Typ. Max. A 2.35 - 2.65 0.093 - 0.104 A1 0.10 - 0.30 0.004 - 0.012 B 0.33 - 0.51 0.013 - 0.020 C 0.23 - 0.32 0.009 - 0.013 D 12.60 - 13.00 0.496 - 0.512 E 7.40 - 7.60 0.291 - 0.299 e - 1.27 - H 10.00 - 10.65 0.394 - 0.419 h 0.25 - 0.75 0.010 - 0.030 L 0.40 - 1.27 0.016 - 0.050 K DS12075 - Rev 4 inch Min. - 0.050 - 0° (min.), 8° (max.) page 23/31 STNRG011 Ordering information 11 Ordering information Table 9. Order codes DS12075 - Rev 4 Part number Package Packing STNRG011 SO20 Tube STNRG011TR SO20 Tape and reel page 24/31 STNRG011 Revision history Table 10. Document revision history Date Version Changes 25-Oct-2017 1 Initial release. 15-Dec-2017 2 Updated Figure 4: Typical application schematic on page 15 (replaced by new figure). 15-Mar-2018 3 Updated Table 9: Order codes on page 32. In Table 4. Electrical characteristics: - updated IVcc_charge Max. values for tests: 26-Feb-2021 4 -- (i) VVAC > 40 V, VCC < 0.8 V -- (ii) VVAC > 40 V, 0.8 V < VCC < VccCoreOn - updated Fck Max. value DS12075 - Rev 4 page 25/31 STNRG011 Contents Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 2 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 3 Absolute maximum ratings and thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Detailed block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Pin function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 6 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7 Application schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 8 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 9 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 9.1 HV startup and VCC management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 9.2 AC line monitor and protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 9.2.1 Brown-in/out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.2.2 Line synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.2.3 Line disconnection and X-cap discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.2.4 Vline surge stop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.2.5 Line monitor for PFC control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.2.6 Early warning signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.3 Gate-drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.4 PFC control and fault management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.5 9.4.1 PFC resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.4.2 Vin reading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.4.3 PFC output voltage feedback reading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.4.4 PFC OVP comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.4.5 PFC RECOT comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.4.6 PFC OC1 comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.4.7 PFC OC2 comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.4.8 PFC ZCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.4.9 PFC state machine event driven (SMED) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 PFC algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 9.5.1 DS12075 - Rev 4 Ramp enhanced COT improved (patented). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 page 26/31 STNRG011 Contents 9.5.2 9.6 9.7 9.8 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 PFC protections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 9.6.1 PFC OVP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 9.6.2 PFC OCP2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 9.6.3 Surge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 9.6.4 PFC soft-start timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 9.6.5 PFC UVP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 9.6.6 PFC_FB disconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 9.6.7 PFC_CS disconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 9.6.8 PFC_ZCD disconnection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 LLC control and fault management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 9.7.1 LLC related resources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 9.7.2 LLC OC1 comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 9.7.3 LLC OC2 comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 9.7.4 LLC ZCD comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 9.7.5 LLC_FB voltage reading: OPTO feedback loop error . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 9.7.6 Shutdown feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 9.7.7 SMEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 9.7.8 Algorithm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 9.7.9 Time-shift (patented) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 LLC protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 9.8.1 Anti-capacitive protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 9.8.2 LLC OLP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 9.8.3 LLC OCP2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 9.8.4 LLC soft-start timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 9.8.5 LLC OVP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 9.8.6 LLC_CS disconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 9.8.7 LLC_AUX disconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 9.9 ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 9.10 Burst-mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 DS12075 - Rev 4 9.10.1 Specific resources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 9.10.2 Algorithm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 page 27/31 STNRG011 Contents 9.11 10 9.11.1 Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 9.11.2 Black box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 9.11.3 Patches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 10.1 11 Communication and configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SO20 package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 DS12075 - Rev 4 page 28/31 STNRG011 List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. DS12075 - Rev 4 Block diagram . . . . . . . . . . . Pin connection (top view) . . . . Detailed block diagram . . . . . Typical application schematic . SO20 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 . 3 . 5 12 22 page 29/31 STNRG011 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Absolute maximum ratings . . . . Thermal data. . . . . . . . . . . . . . Pin function detailed description. Electrical characteristics . . . . . . Related pins . . . . . . . . . . . . . . Pin descriptions . . . . . . . . . . . . ADC input signals . . . . . . . . . . SO20 package mechanical data Order codes . . . . . . . . . . . . . . Document revision history . . . . . DS12075 - Rev 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 . 4 . 6 . 8 16 18 20 23 24 25 page 30/31 STNRG011 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved DS12075 - Rev 4 page 31/31