STP16CPC26TTR

STP16CPC26TTR

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TSSOP24

  • 描述:

    低压16位恒定电流LED灌驱动器

  • 数据手册
  • 价格&库存
STP16CPC26TTR 数据手册
STP16CPC26 Low voltage 16-bit constant current LED sink driver Datasheet - production data Description The STP16CPC26 is a monolithic, low voltage, 16-bit constant current LED sink driver. The device contains a 16-bit shift register and data latches, which convert serial input data into parallel output format. In the output stage sixteen regulated current generators provide 5 mA to 90 mA constant current to drive LEDs. The current is externally adjusted through a resistor. LED brightness can be adjusted from 0% to 100% via OE pin. The STP16CPC26 guarantees a 20 V driving capability, allowing users to connect more LEDs in series to each current source. Features         16 constant current output channels Adjustable output current through external resistor Output current: 5 mA to 90 mA ±1% typical current accuracy bit to bit Max clock frequency: 30 MHz 20 V current generators rated voltage 3 - 5.5 V power supply Thermal shutdown for overtemperature protection The high 30 MHz clock frequency makes the device suitable for high data rate transmission. The thermal shutdown (170 °C with about 15 °C hysteresis) assures protection from overtemperature events. The STP16CPC26 is housed in four different packages: QSOP24, SO-24, TSSOP-24 and HTSSOP-24 (with exposed pad). Applications   Video display panel LED driver Special lighting Table 1: Device summary Order code Package Packing STP16CPC26MTR SO-24 1000 parts per reel STP16CPC26TTR TSSOP24 2500 parts per reel STP16CPC26XTR TSSOP24 exposed pad 2500 parts per reel STP16CPC26PTR QSOP-24 2500 parts per reel April 2017 DocID18469 Rev 6 This is information on a product in full production. 1/28 www.st.com Contents STP16CPC26 Contents 1 Pin description ................................................................................ 3 2 Electrical ratings ............................................................................. 4 2.1 Absolute maximum ratings ................................................................ 4 2.2 Thermal data ..................................................................................... 4 3 Electrical characteristics ................................................................ 5 4 Simplified internal block diagram .................................................. 8 5 Typical application circuit............................................................... 8 6 7 Equivalent circuit and outputs ....................................................... 9 Typical test circuits ....................................................................... 11 8 Timing diagrams ............................................................................ 12 9 Current generators characteristics .............................................. 15 9.1 Current setting................................................................................. 15 9.2 Current accuracy ............................................................................. 15 9.3 Generators voltage drop ................................................................. 16 10 Thermal shutdown......................................................................... 16 11 Package information ..................................................................... 17 11.1 QSOP-24 package information ....................................................... 18 11.2 SO-24 package information ............................................................ 20 11.3 TSSOP24 package information ....................................................... 21 11.4 TSSOP24 exposed pad package information ................................. 23 11.5 TSSOP24, TSSOP24 exposed pad and ............................................ SO-24 packing information .............................................................. 25 12 2/28 Revision history ............................................................................ 27 DocID18469 Rev 6 STP16CPC26 1 Pin description Pin description Figure 1: Pin connection The exposed-pad (if present) should be electrically connected to a metal land electrically isolated or connected to ground. Table 2: Pin description Pin n° Symbol Name and function 1 GND Ground terminal 2 SDI Serial data input terminal 3 CLK Clock input terminal 4 LE Latch input terminal 5-20 OUT 0-15 21 OE Input terminal of output enable (active low) 22 SDO Serial data out terminal 23 R-EXT 24 VDD Output terminal Input terminal for an external resistor for constant current programming Supply voltage terminal DocID18469 Rev 6 3/28 Electrical ratings STP16CPC26 2 Electrical ratings 2.1 Absolute maximum ratings Stressing the device above the rating listed in the “absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 3: Absolute maximum ratings Symbol 2.2 Parameter Value Unit VDD Supply voltage 0 to 7 V VO Output voltage -0.5 to 20 V IO Output current 90 mA VI Input voltage -0.4 to VDD+0.4 V 1600 mA IGND GND terminal current ESD Electrostatic discharge protection HBM human body model ±2 kV fCLK Clock frequency 30 MHz Value Unit Operating free-air temperature range -40 to +125 °C TOPR Operating temperature range -40 to +150 °C TSTG Storage temperature range -55 to +150 °C 60 °C/W 85 °C/W TSSOP24 exposed pad 37.5 °C/W QSOP-24 72 °C/W Thermal data Table 4: Thermal data Symbol TA Parameter SO-24 TSSOP24 RthJA Thermal resistance junction-ambient(1) (2) Notes: 4/28 (1) According with JEDEC standard 51-7. (2) The exposed pad should be soldered directly to the PCB to realize the thermal benefits. DocID18469 Rev 6 STP16CPC26 3 Electrical characteristics Electrical characteristics VDD = 3.3 V - 5 V, TA = 25 °C, unless otherwise specified. Table 5: Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Vdd Supply voltage VIH Input voltage high level 0.8*Vdd - Vdd VIL Input voltage low level GND - 0.2*Vdd VOL VOH Serial data output voltage (SDO) (1) IOH = - 1 mA IOL = + 1 mA IOH Output leakage current ΔIOL1 Current accuracy channel to channel (2)(3) 3 5.5 - - 0.4 VDD -0.4 - - Vo = 20 V, Outn = OFF - - 0.5 Vds = 0.3 V, REXT = 900 W, IOL = 22 mA - ±1 ±3 ΔIOL2 - ±1 ±3 DIOL3 Vds = 0.3 V, REXT = 900 W, IOL = 22 mA - - ±6 ΔIOL4 Vds = 0.6 V, REXT = 360 W, IOL = 55 mA - ±6 Pull-up resistor for OE pin 250 500 800 Pull-down resistor for LE pin 250 500 800 REXT = OPEN OUT 0 to 15 = OFF - 3 7 REXT = 900 W OUT 0 to 15 = OFF - 7 10 IDD(OFF3) REXT = 360 W OUT 0 to 15 = OFF - 11 13.5 IDD(ON1) REXT = 900 W OUT 0 to 15 = ON - 7 11 REXT = 360 W OUT 0 to 15 = ON - 11 15 VDS from 1.0 V to 3.0 V Io = 22 mA Io = 55 mA - ±0.1 - RIN(down) IDD(OFF1) IDD(OFF2) Supply current (OFF) µA % - RIN(up) V % Vds = 0.6 V, REXT = 360 W, IOL = 55 mA Current accuracy device to device (2) Unit KW mA Supply current (ON) IDD(ON2) %/dVDS Output current vs. output voltage regulation DocID18469 Rev 6 %/V 5/28 Electrical characteristics Symbol %/dVDD Tsd Tsd-hy STP16CPC26 Parameter Test conditions Output current vs. supply voltage regulation (4) Io = 22 mA; VDS = 0.3 V Io = 55 mA; VDS = 0.6 V Thermal shutdown Thermal shutdown hysteresis Min. Typ. Max. Unit - ±1 - %/V - 170 - - 15 20 °C (4) Notes: (1) Specification referred to TJ from -40 °C to +125 °C. Specification over the -40 to +125 °C TJ temperature range are assured by design, characterization and statistical correlation. (2) Tested with just one output ON. (3) ΔIOL+ = ((IOLmax - IOLmean)/ IOLmean)*100, DIOL- = ((IOLmin - IOLmean)/ IOLmean)*100, where IOLmean = (IOLout1+IOLout2+…+IOLout16) / 16. (4) Guaranteed by design. 6/28 DocID18469 Rev 6 STP16CPC26 VDD = 3.3 V - 5 V, Tj = 25 °C, unless otherwise specified. Electrical characteristics Table 6: Switching characteristics Symbol Parameter fclk Clock frequency tPLH1 CLK - OUTn tPLH2 LE - OUTn tPLH3 tPLHa tPLHb OE – OUTn CLK - OUTn tPHL2 LE - OUTn tPHL3 OE – OUTn tPHLb CLK tw(L) LE tw(OE) OE Typ. Max. Unit - - 30 MHz - 100 - - 100 - - 100 - VDD = 3.3 V - 30 - VDD = 5 V - 20 - - 28 - - 28 - Propagation delay time (“H” to “L”) CLK - SDO tw(CLK) Min. Propagation delay time (“L” to “H”) CLK - SDO tPHL1 tPHLa Conditions Pulse width VDS = 0.8 V VIH = VDD VIL = GND REXT = 900 Ω RL = 50 Ω CL = 10 pF - 25 - VDD = 3.3 V - 30 - VDD = 5 V - 20 - 20 - - 20 - - 150 - - tsu(L) Setup time for LE 5 - - th(L) Hold time for LE 5 - - tsu(D) Setup time for SDI 5 - - th(D) Hold time for SDI 10 - - tr (1) Maximum CLK rise time - - 5000 (1) Maximum CLK fall time - - 5000 tor1a Output rise time of Vout tor1b Output rise time of Vout tof1a Output fall time of Vout tof1b Output fall time of Vout tor2a Output rise time of Vout tor2b Output rise time of Vout tof2a Output fall time of Vout tof2b Output fall time of Vout tf Iout-ov Output current turn-on overshoot VIH = VDD, VIL = GND VDS = 0.8 V, RL = 50 Ω CL = 10 pF Iout = 22 mA VDD = 3.3 V - 95 - VDD = 5 V - 85 - VDD = 3.3 V - 40 - VDD = 5 V - 25 - VIH = VDD, VIL = GND VDS = 0.8 V RL = 50 Ω CL = 10 pF Iout = 55 mA VDD = 3.3 V - 80 - VDD = 5 V - 70 - VDD = 3.3 V - 40 - VDD = 5 V - 30 - - - 0 VDS = 0.6 to 3V CL = 10 pF Iout = 5 to 60 mA ns % Notes: (1)If devices are connected in cascade and tr or tf is large, it may be critical to achieve the timing required for data transfer between two cascaded devices. DocID18469 Rev 6 7/28 Simplified internal block diagram 4 STP16CPC26 Simplified internal block diagram Figure 2: STP16CPC26 simplified block diagram 5 Typical application circuit Figure 3: Typical application circuit 8/28 DocID18469 Rev 6 STP16CPC26 6 Equivalent circuit and outputs Equivalent circuit and outputs Figure 4: OE terminal Figure 5: LE terminal Figure 6: CLK, SDI terminal DocID18469 Rev 6 9/28 Equivalent circuit and outputs STP16CPC26 Figure 7: SDO terminal 10/28 DocID18469 Rev 6 STP16CPC26 7 Typical test circuits Typical test circuits Figure 8: "Typical test circuit for electrical characteristics" and Figure 9: "Typical test circuit for switching characteristics" show respectively the typical test circuit used measuring electrical (e.g. input voltage high/low level, output leakage current, supply current, etc.) and switching characteristics (propagation delays, set-up and hold time, rise and fall time of VOUT, etc.). The resistor RL and capacitor CL in parallel connected to each output in Figure 8: "Typical test circuit for electrical characteristics" simulate a LED behavior. Figure 8: Typical test circuit for electrical characteristics Figure 9: Typical test circuit for switching characteristics DocID18469 Rev 6 11/28 Timing diagrams 8 STP16CPC26 Timing diagrams The timing diagram shown in Figure 10: "Timing diagram" and the truth table in Table 7: "Truth table" explain how to send data to the device. This can be summarized in the following points:  LE and OE are level sensitive and not synchronized with the CLK signal   When LE is at low level, the latch circuit holds previous data If LE is high level, data present in the shift register are latched  When OE is at low level, the status of the outputs OUT0 to OUT15 depends on the data in the latch circuits  With OE at high level, all outputs are switched off independently on the data stored  in the latch circuits Every rising edge of the CLK signal, a new data on SDI pin is sampled. This data is loaded into the shift register, whereas a bit is shifted out from SDO Figure 10: Timing diagram Table 7: Truth table LE OE _|¯ H L Dn Dn ..... Dn - 7 ..... Dn -15 Dn - 15 _|¯ L L Dn + 1 No change Dn - 14 _|¯ H L Dn + 2 Dn + 2 ..... Dn - 5 ..... Dn -13 Dn - 13 ¯|_ X L Dn + 3 Dn + 2 ..... Dn - 5 ..... Dn -13 Dn - 13 ¯|_ X H Dn + 3 OFF Dn - 13 Serial-IN OUT0 ............. OUT7 ................ OUT15 Notes: (1) 12/28 (1) Clock OUTn = ON when Dn = H, OUTn = OFF when Dn = L. DocID18469 Rev 6 SDO STP16CPC26 Timing diagrams Figure 11: Timing for clock signal, serial-in and serial out data The correct sampling of the data depends on the stability of the data at SDI on the rising edge of the clock signal and it is assured by a proper data setup and hold time (tSETUP1 And tHOLD), as shown in Figure 11: "Timing for clock signal, serial-in and serial out data". The same figure shows the propagation delay from CLK to SDO (t PLH/tPHL). Figure 12: "Timing for clock signal serial-in data, latch enable, output enable and outputs" describes the setup times for LE and OE signals (tSETUP2 and tSETUP3 respectively), the minimum duration of these signals (tWLAT and tWENA respectively) and the propagation delay from CLK to OUT n, LE to OUTn and OE to OUTn (tPLH1/tPHL1, tPLH2/tPHL2 and tPLH3/tPHL3 respectively). Finally Figure 13: "Outputs" defines the turn-on and turn-off time (tr and tf) of the current generators. DocID18469 Rev 6 13/28 Timing diagrams STP16CPC26 Figure 12: Timing for clock signal serial-in data, latch enable, output enable and outputs Figure 13: Outputs 14/28 DocID18469 Rev 6 STP16CPC26 Current generators characteristics 9 Current generators characteristics 9.1 Current setting The current of all outputs is programmed through an external resistor connected to R-EXT pin, as shown in Figure 14: "Resistor for current programming". The curve in Figure 15: "Output current vs R-EXT resistor" describes the relation between the current and the resistor connected to R-EXT pin, whereas the Table 8: "Recommended values of Rext for some output current value" shows how to set some typical current values. Figure 14: Resistor for current programming Figure 15: Output current vs R-EXT resistor Table 8: Recommended values of Rext for some output current value 9.2 Output current [mA] Rext [Ω] Closer standard value (E24 series) [Ω] 5 4129 4300 10 2005 200 20 999 1000 40 471 470 60 322 330 90 217 220 Current accuracy A typical current accuracy of ±1% (±3% maximum) between channels is guaranteed at 22 mA and 55 mA output current (refer to Table 6: "Switching characteristics") and ± 6% (maximum) current accuracy between ICs. DocID18469 Rev 6 15/28 Thermal shutdown 9.3 STP16CPC26 Generators voltage drop In order to correctly regulate the current, a minimum dropout voltage must be assured across the current generators. Figure 16: "Dropout voltage vs output current" and Table 9: "Dropout voltage vs output current" provides just an indicative idea about the dropout voltage to assure over the current range. However it is recommended to use value of VDROP slightly higher than those indicated in Figure 16: "Dropout voltage vs output current" and Table 9: "Dropout voltage vs output current". Figure 16: Dropout voltage vs output current Table 9: Dropout voltage vs output current 10 Output current [mA] VDROP @ 3.3 V [mV] VDROP @ 5 V [mV] 5 44 44 10 85 85 20 170 170 40 350 330 60 530 500 90 820 770 Thermal shutdown The STP16CPC26 is featured with a thermal shutdown. This protection is triggered if the junction temperature reaches 170 °C. When the thermal shutdown is activated, all outputs are turned off independently on the data latched. Once the temperature decreases (thermal shutdown hysteresis is typically 15 °C), the outputs are enabled again and the device keeps on working. Once the temperature decreases (thermal shutdown hysteresis is typically 15°C), the outputs are enabled again and the device keeps on working. 16/28 DocID18469 Rev 6 STP16CPC26 11 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DocID18469 Rev 6 17/28 Package information 11.1 STP16CPC26 QSOP-24 package information Figure 17: QSOP-24 package outline 18/28 DocID18469 Rev 6 STP16CPC26 Package information Table 10: QSOP-24 mechanical data mm Dim. Min. Typ. Max. A 1.54 1.62 1.73 A1 0.10 0.15 0.25 A2 1.47 b 0.20 0.31 c 0.17 0.254 D 8.56 8.66 8.76 E 5.80 6.00 6.20 E1 3.80 3.91 4.01 e 0.635 L 0.40 0.635 0.89 h 0.25 0.33 0.41 < 0° DocID18469 Rev 6 8° 19/28 Package information 11.2 STP16CPC26 SO-24 package information Figure 18: SO-24 package outline 20/28 DocID18469 Rev 6 STP16CPC26 Package information Table 11: SO-24 mechanical data mm Dim. Min. Typ. A 2.35 2.65 A1 0.10 0.30 B 0.33 0.51 C 0.23 0.32 D 15.20 15.60 E 7.40 e 7.60 1.27 H 10.00 10.65 h 0.25 0.75 L 0.40 1.27 k 0 8 ddd 11.3 Max. 0.10 TSSOP24 package information Figure 19: TSSOP24 package outline DocID18469 Rev 6 21/28 Package information STP16CPC26 Table 12: TSSOP24 mechanical data mm Dim. Min. Typ. A A1 1.1 0.05 A2 0.15 0.9 b 0.19 0.30 c 0.09 0.20 D 7.7 7.9 E 4.3 4.5 e 22/28 Max. 0.65 BSC H 6.25 6.5 K 0° 8° L 0.50 0.70 DocID18469 Rev 6 STP16CPC26 11.4 Package information TSSOP24 exposed pad package information Figure 20: TSSOP24 exposed pad package outline DocID18469 Rev 6 23/28 Package information STP16CPC26 Table 13: TSSOP24 exposed pad mechanical data mm Dim. Min. Max. A 1.20 A1 0.15 A2 0.80 b 0.19 0.30 c 0.09 0.20 1.00 1.05 D 7.70 7.80 7.90 D1 4.80 5.00 5.2 E 6.20 6.40 6.60 E1 4.30 4.40 4.50 E2 3.00 3.20 3.40 e L 0.65 0.45 L1 k 060 075 1.00 0° aaa 24/28 Typ. 8° 0.10 DocID18469 Rev 6 STP16CPC26 11.5 Package information TSSOP24, TSSOP24 exposed pad and SO-24 packing information Figure 21: TSSOP24, TSSOP24 exposed pad and SO-24 reel outline Table 14: TSSOP24 and TSSOP24 exposed pad tape and reel mechanical data mm Dim. Min. A Typ. Max. - 330 13.2 C 12.8 - D 20.2 - N 60 - T - 22.4 Ao 6.8 - 7 Bo 8.2 - 8.4 Ko 1.7 - 1.9 Po 3.9 - 4.1 P 11.9 - 12.1 DocID18469 Rev 6 25/28 Package information STP16CPC26 Table 15: SO-24 tape and reel mechanical data mm Dim. Min. A Max. - 330 13.2 C 12.8 - D 20.2 - N 60 - T 26/28 Typ. - 30.4 Ao 10.8 - 11.0 Bo 15.7 - 15.9 Ko 2.9 - 3.1 Po 3.9 - 4.1 P 11.9 - 12.1 DocID18469 Rev 6 STP16CPC26 12 Revision history Revision history Table 16: Document revision history Date Revision 04-Mar-2011 1 First release 05-Apr-2011 2 Updated Table 6 19-Jul-2012 3 Updated Table 7. 19-Jul-2012 4 Updated characteristics in Table 5: Electrical characteristics and Table 6: Switching characteristics. Minor text changes. 1-Jun-2014 5 Updated template and value Table 13: TSSOP24 exposed pad mechanical data. 6 Updated Figure 11: "Timing for clock signal, serial-in and serial out data" and Figure 12: "Timing for clock signal serial-in data, latch enable, output enable and outputs", Section 11.1: "QSOP-24 package information". Minor text changes. 13-Apr-2017 Changes DocID18469 Rev 6 27/28 STP16CPC26 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 28/28 DocID18469 Rev 6
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STP16CPC26TTR
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STP16CPC26TTR
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STP16CPC26TTR
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STP16CPC26TTR

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