STP/F30NM60ND-STW30NM60ND STB30NM60ND-STI30NM60ND
N-channel 600V - 0.11Ω - 25A TO-220/FP/D2PAK/I2PAK/TO-247 FDmesh™ II Power MOSFET (with fast diode)
Preliminary Data
Features
Type STB30NM60ND STI30NM60ND STF30NM60ND STP30NM60ND STW30NM60ND VDSS 600V 600V 600V 600V 600V RDS(on) Max < 0.13Ω < 0.13Ω < 0.13Ω < 0.13Ω < 0.13Ω ID 25A 25A 25A(1) 25A 25A
3
3 1 2
3 1 2
1
TO-220
D2PAK
TO-220FP
1. Limited only by maximum temperature allowed ■ ■ ■ ■ ■
The world’s best RDS(on)*in TO-220 amongst the fast recovery diode devices 100% avalanche tested Low input capacitance and gate charge Low gate input resistance Extremely high dv/dt and avalanche capabilities Figure 1.
3 12
2 1
3
I2PAK
TO-247
Internal schematic diagram
Application
■
Switching applications
Description
The FDmesh™ II series belongs to the second generation of MDmesh™ technology. This revolutionary Power MOSFET associates a new vertical structure to the company's strip layout and associates all advantages of reduced onresistance and fast switching with an intrinsic fastrecovery body diode.It is therefore strongly recommended for bridge topologies, in particular ZVS phase-shift converters. Table 1. Device summary
Order codes STB30NM60ND STI30NM60ND STF30NM60ND STP30NM60ND STW30NM60ND November 2007 Marking 30NM60ND 30NM60ND 30NM60ND 30NM60ND 30NM60ND Rev 1 Package D²PAK I²PAK TO-220FP TO-220 TO-247 Packaging Tape & reel Tube Tube Tube Tube 1/15
www.st.com 15
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
Contents
STP/F30NM60ND - STB30NM60ND - STI30NM60ND - STW30NM60ND
Contents
1 2 3 4 5 6 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test circuit ................................................ 6
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
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Electrical ratings
1
Electrical ratings
Table 2.
Symbol
Absolute maximum ratings
Value Parameter TO-220/D2PAK I2PAK / TO-247 600 ±30 25 15.75 100 190 1.51 40 -–55 to 150 150 2500 25
(1)
Unit TO-220FP V V A A A W W/°C V/ns V
VDS VGS ID ID IDM
(2)
Drain-source voltage (VGS = 0) Gate- source voltage Drain current (continuous) at TC = 25°C Drain current (continuous) at TC = 100°C Drain current (pulsed) Total dissipation at TC = 25°C Derating factor
15.75(1) 100(1) 40 0.24
PTOT dv/dt(3) Viso Tstg TJ
Peak diode recovery voltage slope Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1s;TC=25°C) Storage temperature Max. operating junction temperature
°C
1. Limited only by maximum temperature allowed 2. Pulse width limited by safe operating area 3. ISD ≤ 25A, di/dt ≤ 600A/µs, VDD = 80% V(BR)DSS
Table 3.
Symbol
Thermal data
Parameter TO-220 TO-247 TO-220FP D²PAK/I²PAK 0.66 62.5 50 300 3.1 62.5 Unit °C/W °C/W °C
Rthj-case Thermal resistance junction-case max Rthj-amb Thermal resistance junction-ambient max Tl Maximum lead temperature for soldering purpose
Table 4.
Symbol IAS EAS
Avalanche characteristics
Parameter Avalanche current, repetitive or notrepetitive (pulse width limited by TJ max) Single pulse avalanche energy (starting TJ = 25 °C, ID = IAS, VDD = 50 V) Max value TBD TBD Unit A mJ
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Electrical characteristics
STP/F30NM60ND - STB30NM60ND - STI30NM60ND - STW30NM60ND
2
Electrical characteristics
(TCASE=25°C unless otherwise specified) Table 5.
Symbol
On/off states
Value Parameter Drain-source breakdown voltage Drain source voltage slope Zero gate voltage drain current (VGS = 0) Gate-body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance Test conditions Min. Typ. Max. V 48 1 10 100 3 4 0.11 5 0.13 V/ns µA µA nA V Ω Unit
V(BR)DSS dv/dt(1) IDSS IGSS VGS(th) RDS(on)
ID = 1mA, VGS = 0 VDD= 480V, ID= 25A, VGS= 10V VDS = Max rating VDS = Max rating @125°C VGS = ± 20V VDS = VGS, ID = 250 µA VGS = 10V, ID = 12.5 A
600
1. Characteristic value at turn off on inductive load
Table 6.
Symbol gfs
(1)
Dynamic
Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Equivalent output capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge Gate input resistance Test conditions VDS = 15 V, ID = 12.5 A VDS = 25V, f = 1 MHz, VGS = 0 VGS = 0V, VDS = 0V to 480V VDD =300 V, ID = 12.5A RG = 4.7Ω VGS = 10V (see Figure 7), (see Figure 2) VDD = 480V, ID = 25A, VGS = 10V, (see Figure 3) f=1MHz Gate DC Bias=0 Test signal level=20mV Open drain Min. Typ. TBD 3000 600 90 TBD TBD TBD TBD TBD 100 TBD TBD 1.6 Max. Unit S pF pF pF
Ciss Coss Crss Coss eq.(2) td(on) tr td(off) tf Qg Qgs Qgd Rg
pF ns ns ns ns nC nC nC Ω
1. Pulsed: pulse duration=300µs, duty cycle 1.5% 2. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS
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Electrical characteristics
Table 7.
Symbol ISD ISDM (1) VSD (2) trr Qrr IRRM trr Qrr IRRM
Source drain diode
Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 25A, VGS = 0 ISD = 25A, VDD = 60V di/dt=100A/µs (see Figure 4) ISD = 25A,VDD = 60V di/dt=100A/µs, TJ = 150°C (see Figure 4) TBD TBD TBD TBD TBD TBD Test conditions Min. Typ. Max. 25 100 1.6 Unit A A V ns µC A ns µC A
1. Pulse width limited by safe operating area 2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.
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Test circuit
STP/F30NM60ND - STB30NM60ND - STI30NM60ND - STW30NM60ND
3
Figure 2.
Test circuit
Switching times test circuit for resistive load Figure 3. Gate charge test circuit
Figure 4.
Test circuit for inductive load Figure 5. switching and diode recovery times
Unclamped Inductive load test circuit
Figure 6.
Unclamped inductive waveform
Figure 7.
Switching time waveform
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STP/F30NM60ND - STB30NM60ND - STI30NM60ND - STW30NM60ND
Package mechanical data
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
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Package mechanical data
STP/F30NM60ND - STB30NM60ND - STI30NM60ND - STW30NM60ND
TO-220 mechanical data
mm Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 ∅P Q 4.40 0.61 1.14 0.49 15.25 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 Typ Max 4.60 0.88 1.70 0.70 15.75 Min 0.173 0.024 0.044 0.019 0.6
inch Typ Max 0.181 0.034 0.066 0.027 0.62 0.050 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 0.151 0.116
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STP/F30NM60ND - STB30NM60ND - STI30NM60ND - STW30NM60ND
Package mechanical data
TO-220FP mechanical data
mm. Min. 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 16 28.6 9.8 2.9 15.9 9 3 30.6 10.6 3.6 16.4 9.3 3.2 1.126 .0385 0.114 0.626 0.354 0.118 Typ. Max. 4.6 2.7 2.75 0.7 1 1.7 1.7 5.2 2.7 10.4 Min. 0.173 0.098 0.098 0.017 0.030 0.045 0.045 0.195 0.094 0.393 0.630 1.204 0.417 0.141 0.645 0.366 0.126 inch Typ. Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.204 0.106 0.409
DIM. A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 Ø
A
B
L3 L6 L7
F1 F
D
G1
E H
F2
L2 L5
123
L4
G
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Package mechanical data
STP/F30NM60ND - STB30NM60ND - STI30NM60ND - STW30NM60ND
TO-262 (I2PAK) mechanical data
mm. DIM. Min. A A1 b b1 c c2 D e e1 E L L1 L2 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 Typ. Max. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 Min. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.194 0.393 0.511 0.137 0.050 Typ. Max. 0.181 0.107 0.034 0.066 0.027 0.052 0.368 0.106 0.202 0.410 0.551 0.154 0.055 inch
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STP/F30NM60ND - STB30NM60ND - STI30NM60ND - STW30NM60ND
Package mechanical data
D²PAK mechanical data
mm Dim Min A A1 A2 B B2 C C2 D D1 E E1 G L L2 L3 M R V2 4.4 2.49 0.03 0.7 1.14 0.45 1.23 8.95 8 10 8.5 4.88 15 1.27 1.4 2.4 0.4 0° 4° 5.28 15.85 1.4 1.75 3.2 0.192 0.590 0.50 0.055 0.094 10.4 0.393 Typ Max 4.6 2.69 0.23 0.93 1.7 0.6 1.36 9.35 Min 0.173 0.098 0.001 0.027 0.044 0.017 0.048 0.352
inch Typ Max 0.181 0.106 0.009 0.036 0.067 0.023 0.053 0.368 0.315 0.409 0.334 0.208 0.625 0.55 0.68 0.126 0.015
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Package mechanical data
STP/F30NM60ND - STB30NM60ND - STI30NM60ND - STW30NM60ND
TO-247 MECHANICAL DATA
mm. MIN. 4.85 2.20 1.0 2.0 3.0 0.40 19.85 15.45 5.45 14.20 3.70 18.50 3.55 4.50 5.50 3.65 5.50 0.140 0.177 0.216 14.80 4.30 0.560 0.14 0.728 0.143 0.216 TYP MAX. 5.15 2.60 1.40 2.40 3.40 0.80 20.15 15.75 MIN. 0.19 0.086 0.039 0.079 0.118 0.015 0.781 0.608 0.214 0.582 0.17 inch TYP. MAX. 0.20 0.102 0.055 0.094 0.134 0.03 0.793 0.620
DIM. A A1 b b1 b2 c D E e L L1 L2 øP øR S
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Packing mechanical data
5
Packing mechanical data
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM. A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0795 0.960 1.039 3.937 1.197 BULK QTY 1000 inch MIN. MAX. 12.992
TAPE MECHANICAL DATA
DIM. A0 B0 D D1 E F K0 P0 P1 P2 R T W mm MIN. 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 24.3 MAX. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 inch MIN. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 0.35 0.0098 0.0137 0.933 0.956
BASE QTY 1000
* on sales type
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Revision history
STP/F30NM60ND - STB30NM60ND - STI30NM60ND - STW30NM60ND
6
Revision history
Table 8.
Date 06-Nov-2007
Document revision history
Revision 1 initial release. Changes
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