STPD0175BTI3

® STPC CLIENT PC Compatible Embedded Microprocessor • • • • • • • • • • • • • • • • • • • POWERFUL X86 PROCESSOR 64-BIT 66MHz BUS INTERFACE 64-BIT DRAM CONTROLLER SVGA GRAPHICS CONTROLLER UMA ARCHITECTURE VIDEO SCALER VIDEO OUTPUT PORT VIDEO INPUT PORT CRT CONTROLLER 135MHz RAMDAC 2 OR 3 LINE FLICKER FILTER SCAN CONVERTER PCI MASTER / SLAVE / ARBITER ISA MASTER/SLAVE IDE CONTROLLER DMA CONTROLLER INTERRUPT CONTROLLER TIMER / COUNTERS POWER MANAGEMENT PCI VIP TV Output PBGA388 Figure 1. Logic Diagram ISA BUS x86 Core Host I/F ISA IPC PCI EID EIDE STPC CLIENT OVERVIEW The STPC Client integrates a standard 5th generation x86 core, a DRAM controller, a graphics subsystem, a video pipeline, and support logic including PCI, ISA, and IDE controllers to provide a single Consumer orientated PC compatible subsystem on a single device. The device is based on a tightly coupled Unified Memory Architecture (UMA), sharing the same memory array between the CPU main memory and the graphics and video frame buffers. Extra facilities are implemented to handle video streams. Features include smooth scaling and colour space conversion of the video input stream and mixing of the video stream with non-video data from the frame buffer. The chip also includes anti-flicker filters to provide a stable, high-quality Digital TV output. The STPC Client is packaged in a 388 Plastic Ball Grid Array (PBGA). PCI BUS CCIR Input AntiColVid2D CRT DRAM Colour HW SYNC Output Monitor February 8, 2000 Issue 1.7 1/48 STPC CLIENT • • • • • • • • • X86 Processor core Fully static 32-bit 5-stage pipeline, x86 processor with DOS, Windows and UNIX compatibility. Can access up to 4GB of external memory. KBytes unified instruction and data cache with write back and write through capability. Parallel processing integral floating point unit, with automatic power down. Clock core speeds up to of 75 MHz. Fully static design for dynamic clock control. Low power and system management modes. Optimized design for 3.3V operation. • • • • • • • • • • • • • • • • • • • • • • DRAM Controller Integrated system memory and graphic frame memory. Supports up to 128 MBytes system memory in 4 banks and as little as MBytes. Supports 4MBytes, 8MBites, 16MBites, 32MBites single-sided and double-sided DRAM SIMMs. Four quad-word write buffers for CPU to DRAM and PCI to DRAM cycles. Four 4-word read buffers for PCI masters. Supports Fast Page Mode & EDO DRAMs. Programmable timing for DRAM parameters including CAS pulse width, CAS pre-charge time, and RAS to CAS delay. 60, 70, 80 & 100ns DRAM speeds. Memory hole size of 1 MByte to 8 MBytes supported for PCI/ISA buses. Hidden refresh. • CRT Controller Integrated 135MHz triple RAMDAC allowing up to 1024 x 768 x 75Hz display. 8-, 16-, 24-bit per pixels. Interlaced or non-interlaced output. Video Pipeline Two-tap interpolative horizontal filter. Two-tap interpolative vertical filter. Colour space conversion (RGB to YUV and YUV to RGB). Programmable window size. Chroma and colour keying allowing video overlay. Programmable two tap filter with gamma correction or three tap flicker filter. Progressive to interlaced scan converter. • • • • • • Video Input port Decodes video inputs in ITU-R 601/656 compatible formats. Optional 2:1 decimator Stores captured video in off setting area of the onboard frame buffer. Video pass through to the onboard PAL/ NTSC encoder for full screen video images. HSYNC and B/T generation or lock onto external video timing source. • • • • • • To check if your memory device is supported by the STPC, please refer to Table 7-69 in the Programming Manual. • • • • • • • Graphics Controller 64-bit windows accelerator. Backward compatibility to SVGA standards. Hardware acceleration for text, bitblts, transparent blts and fills. Up to 64 x 64 bit graphics hardware cursor. Up to 4MB long linear frame buffer. 8-, 16-, and 24-bit pixels. PCI Controller Integrated PCI arbitration interface able to directly manage up to 3 PCI masters at a time. Translation of PCI cycles to ISA bus. Translation of ISA master initiated cycle to PCI. Support for burst read/write from PCI master. The PCI clock runs at a third or half CPU clock speed. 2/48 Issue 1.7 - February 8, 2000 STPC CLIENT • • • • • • • • • • • • • • • • ISA master/slave The ISA clock generated from either 14.318MHz oscillator clock or PCI clock Supports programmable extra wait state for ISA cycles Supports I/O recovery time for back to back I/ O cycles. Fast Gate A20 and Fast reset. Supports the single ROM that C, D, or E. blocks shares with F block BIOS ROM. Supports flash ROM. Buffered DMA & ISA master cycles to reduce bandwidth utilization of the PCI and Host bus. IDE Interface Supports PIO Supports up to Mode 5 Timings Supports up to 4 IDE devices Individual drive timing for all four IDE devices Concurrent channel operation (PIO modes) 4 x 32-Bit Buffer FIFO per channel Support for PIO mode 3 & 4 Support for 11.1/16.6 MB/s, I/O Channel Ready PIO data transfers. • • • • • • • • Supports both legacy & native IDE modes Supports hard drives larger than 528MB Support for CD-ROM and tape peripherals Backward compatibility with IDE (ATA-1). Integrated peripheral controller 2X8237/AT compatible 7-channel DMA controller. 2X8259/AT compatible interrupt Controller. 16 interrupt inputs - ISA and PCI. Three 8254 compatible Timer/Counters. • • • • • • • • Power Management Four power saving modes: On, Doze, Standby, Suspend. Programmable system activity detector Supports SMM. Supports STOPCLK. Supports IO trap & restart. Independent peripheral time-out timer to monitor hard disk, serial & parallel ports. Supports RTC, interrupts and DMAs wake-up Issue 1.7 - February 8, 2000 3/48 STPC CLIENT 4/48 Issue 1.7 - February 8, 2000 U PDATE HISTORY FOR OVERVIEW UPDATE HISTORY FOR OVERVIEW The following changes have been made to the Board Layout Chapter on 02/02/2000. Section Change Added Text To check if your memory device is supported by the STPC, please refer to Table 7-69 Host Address to MA Bus Mappingin the Programming Manual. The following changes have been made to the Board Layout Chapter from Revision 1.0 to Release 1.2. Section N/A N/A N/A N/A N/A N/A Change Replaced Replaced Removed Removed Replaced Replaced Text N/A Replaced “fully PC compatible” With “with DOS, Windows and UNIX compatibility” “133 MHz” With 75 MHz” “Drivers for Windows and other operating systems.” “Requires external frequency synthesizer and reference sources.” “Chroma and colour keying for integrated video overlay.” With “Chroma and colour keying allowing video overlay. “Accepts video inputs in CCIR 601/656 or ITU-R 601/656, and decodes the stream.” With “Decodes video inputs in ITU-R 601/656 compatible formats . “Fully compliant with PCI 2.1 specification. Integrated PCI arbitration interface. Up to 3 masters can connect directly. External PAL allows for greater than 3 masters.” With N/A N/A N/A N/A N/A N/A N/A Replaced Removed Replaced Replaced Replaced Removed Added N/A Replaced N/A Removed “Integrated PCI arbitration interface able to directly manage up to 3 PCI masters at a time.” “0.33X and 0.5X CPU clock PCI clock.” With “The PCI clock runs at a third or half CPU clock speed.” “Supports flash ROM.” “Supports ISA hidden refresh.” With “Supports flash ROM.” “Buffered DMA & ISA master cycles to reduce bandwidth utilization of the PCI and Host bus. NSP compliant.” With “Buffered DMA & ISA master cycles to reduce bandwidth utilization of the PCI and Host bus. “ “Supports PIO and Bus Master IDE” With “Supports PIO” “Transfer Rates to 22 MBytes/sec” “Individual drive timing for all four IDE devices “ “Concurrent channel operation (PIO & DMA modes) - 4 x 32-Bit Buffer FIFO per channel” With “Concurrent channel operation (PIO modes) - 4 x 32-Bit Buffer FIFO per channel” “Support for DMA mode 1 & 2.” “Support for 11.1/16.6 MB/s, I/O Channel Ready PIO data transfers.” “Supports 13.3/16.6 MB/s DMA data transfers” “Bus Master with scatter/gather capability “ “Multi-word DMA support for fast IDE drives “ “Individual drive timing for all four IDE devices “ “Supports both legacy & native IDE modes” “Supports hard drives larger than 528MB” “Support for CD-ROM and tape peripherals” “Backward compatibility with IDE (ATA-1).” “Drivers for Windows and other OSes” Issue 1.7 - February 8, 2000 5/48 UPDATE HISTORY FOR OVERVIEW Section Change Text N/A Added N/A N/A N/A Removed Replaced Removed “Support for 11.1/16.6 MB/s, I/O Channel Ready PIO data transfers.” “Supports both legacy & native IDE modes” “Supports hard drives larger than 528MB” “Support for CD-ROM and tape peripherals” “Backward compatibility with IDE (ATA-1).” “Co-processor error support logic.” “Supports SMM and APM” With “Supports SMM” “Slow system clock down to 8MHz” “Slow Host clock down to 8Hz” “Slow graphic clock down to 8Hz” 6/48 Issue 1.7 - February 8, 2000 GENERAL DESCRIPTION 1.GENERAL DESCRIPTION At the heart of the STPC Client is an advanced processor block, dubbed the ST X86. The ST X86 includes a powerful x86 processor core along with a 64-bit DRAM controller, advanced 64bit accelerated graphics and video controller, a high speed PCI local-bus controller and Industry standard PC chip set functions (Interrupt controller, DMA Controller, Interval timer and ISA bus) and EIDE controller. The STPC Client has in addition to the 5ST86 a Video subsystem and high quality digital Television output. The STMicroelectronics x86 processor core is embedded with standard and application specific peripheral modules on the same silicon die. The core has all the functionality of the ST Microelectronics standard x86 processor products, including the low power System Management Mode (SMM). System Management Mode (SMM) provides an additional interrupt and address space that can be used for system power management or software transparent emulation of peripherals. While running in isolated SMM address space, the SMM interrupt routine can execute without interfering with the operating system or application programs. Further power management facilities include a suspend mode that can be initiated from either hardware or software. Because of the static nature of the core, no internal data is lost. The STPC Client makes use of a tightly coupled Unified Memory Architecture (UMA), where the same memory array is used for CPU main memory and graphics frame-buffer. This significantly reduces total system memory with system performances equal to that of a comparable solution with separate frame buffer and system memory. In addition, memory bandwidth is improved by attaching the graphics engine directly to the 64-bit processor host interface running at the speed of the processor bus rather than the traditional PCI bus. The 64-bit wide memory array provides the system with 320MB/s peak bandwidth, double that of an equivalent system using 32 bits. This allows for higher screen resolutions and greater colour depth. The processor bus runs at the speed of the processor (DX devices) or half the speed (DX2 devices). The ‘standard’ PC chipset functions (DMA, interrupt controller, timers, power management logic) are integrated with the x86 processor core. The PCI bus is the main data communication link to the STPC Client chip. The STPC Client translates appropriate host bus I/O and Memory cycles onto the PCI bus. It also supports the generation of Configuration cycles on the PCI bus. The STPC Client, as a PCI bus agent (host bridge class), fully complies with PCI specification 2.1. The chip-set also implements the PCI mandatory header registers in Type 0 PCI configuration space for easy porting of PCI aware system BIOS. The device contains a PCI arbitration function for three external PCI devices. The STPC Client integrates an ISA bus controller. Peripheral modules such as parallel and serial communications ports, keyboard controllers and additional ISA devices can be accessed by the STPC Client chip set through this bus. An industry standard EIDE (ATA 2) controller is built into the STPC Client and connected internally via the PCI bus. Graphics functions are controlled by the on-chip SVGA controller and the monitor display is managed by the 2D graphics display engine. This Graphics Engine is tuned to work with the host CPU to provide a balanced graphics system with a low silicon area cost. It performs limited graphics drawing operations, which include hardware acceleration of text, bitblts, transparent blts and fills. These operations can operate on offscreen or on-screen areas. The frame buffer size is up to 4 MBytes anywhere in the physical main memory. The graphics resolution supported is a maximum of 1280x1024 in 65536 colours at 75Hz refresh rate and is VGA and SVGA compatible. Horizontal timing fields are VGA compatible while the vertical fields are extended by one bit to accommodate above display resolution. STPC Client provides several additional functions to handle MPEG or similar video streams. The Video Input Port accepts an encoded digital video stream in one of a number of industry standard formats, decodes it, optionally decimates it by a factor of 2:1, and deposits it into an off screen area of the frame buffer. An interrupt request can be generated when an entire field or frame has been captured. The video output pipeline incorporates a videoscaler and colour space converter function and provisions in the CRT controller to display a video window. While repainting the screen the CRT controller fetches both the video as well as the normal non-video frame buffer in two separate internal FIFOs (256-Bytes each). The video stream can be colour-space converted (optionally) and smooth Issue 1.7 - February 8, 2000 7/48 GENERAL DESCRIPTION scaled. Smooth interpolative scaling in both horizontal and vertical direction are implemented. Colour and Chroma key functions are also implemented to allow mixing video stream with non-video frame buffer. The video output passes directly to the RAMDAC for monitor output or through another optional colour space converter (RGB to 4:2:2 YCrCb) to the programmable anti-flicker filter. The flicker filter is configured as either a two line filter with gamma correction (primarily designed for DOS type text) or a 3 line flicker filter (primarily designed for Windows type displays). The flicker filter is optional and can be software disabled for use with large screen area’s of video. The Video output pipeline of the STPC Client interfaces directly to the external digital TV encoder (STV0119). It takes a 24 bit RGB non-interlaced pixel stream and converts to a multiplexed 4:2:2 YCrCb 8 bit output stream, the logic includes a progressive to interlaced scan converter and logic to insert appropriate CCIR656 timing reference codes into the output stream. It facilitates the high quality display of VGA or full screen video streams received via the Video input port to standard NTSC or PAL televisions. The STPC Client core is compliant with the Advanced Power Management (APM) specification to provide a standard method by which the BIOS can control the power used by personal computers. The Power Management Unit module (PMU) controls the power consumption by providing a comprehensive set of features that control the power usage and supports compliance with the United States Environmental Protection Agency’s Energy Star Computer Program. The PMU provides following hardware structures to assist the software in managing the power consumption by the system. - System Activity Detection. - 3 power-down timers detecting system inactivity: - Doze timer (short durations). - Stand-by timer (medium durations). - Suspend timer (long durations). - House-keeping activity detection. - House-keeping timer to cope with short bursts of house-keeping activity while dozing or in standby state. - Peripheral activity detection. - Peripheral timer detecting peripheral inactivity - SUSP# modulation to adjust the system performance in various power down states of the system including full power on state. - Power control outputs to disable power from different planes of the board. Lack of system activity for progressively longer period of times is detected by the three power down timers. These timers can generate SMI interrupts to CPU so that the SMM software can put the system in decreasing states of power consumption. Alternatively, system activity in a power down state can generate SMI interrupt to allow the software to bring the system back up to full power on state. The chip-set supports up to three power down states: Doze state, Stand-by state and Suspend mode. These correspond to decreasing levels of power savings. Power down puts the STPC Client into suspend mode. The processor completes execution of the current instruction, any pending decoded instructions and associated bus cycles. During the suspend mode, internal clocks are stopped. removing power down, the processor resumes instruction fetching and begins execution in the instruction stream at the point it had stopped. A reference design for the STPC Client is available including the schematics and layout files, the design is a PC ATX motherboard design. The design is available as a demonstration board for application and system development. The STPC Client is supported by several BIOS vendors, including the super I/O device used in the reference design. Drivers for 2D accelerator, video features and EIDE are available on various operating systems. The STPC Client has been designed using modern reusable modular design techniques, it is possible to add to or remove the standard features of the STPC Client or other variants of the 5ST86 family. Contact your local STMicroelectonics sales office for further information. 8/48 Issue 1.7 - February 8, 2000 GENERAL DESCRIPTION Figure 1-1. Functional description. x86 Core Host I/F ISA IPC ISA BUS PCI m/s EIDE EIDE PCI m/s PCI BUS VIP CCIR Input TV Output Anti-Flicker Video pipeline 2D SVGA CRTC DRAM Colour Key Chroma HW Cursor Colour Space Monitor SYNC Output Issue 1.7 - February 8, 2000 9/48 GENERAL DESCRIPTION Figure 1-2. Pictorial Block Diagram Typical Application Super I/O RTC Keyboard / Mouse Serial Ports Parallel Port Floppy Flash ISA DMUX MUX 2x EIDE IRQ MUX Monitor SVGA DMA.REQ TV S-VHS RGB PAL NTSC STPC Client DMA.ACK DMUX STV0119 Video CCIR601 CCIR656 PCI 4x 16-bit EDO DRAMs 10/48 Issue 1.7 - February 8, 2000 PIN DESCRIPTION 2.PIN DESCRIPTION 2.1. INTRODUCTION The STPC Client integrates most of the functionalities of the PC architecture. As a result, many of the traditional interconnections between the host PC microprocessor and the peripheral devices are totally assimilated to the STPC Client. This offers improved performance due to the tight coupling of the processor core and its peripherals. As a result many of the external pin connections are made directly to the on-chip peripheral functions. Figure 2-1 shows the STPC Client’s external interfaces. It defines the main busses and their function. Table 2-1 describes the physical implementation listing signals type and their functionality. Table 2-2 provides a full pin listing and description of the pins. Table 2-3 provides a full listing of pin locations of the STPC Client package by physical connection. Please refer to the pin allocation drawing for reference. Table 2-1. Signal Description Group name Basic Clocks reset & Xtal (SYS) Memory Interface (DRAM) PCI interface (excluding VDD5) ISA / IDE / IPC combined interface Video Input (VIP) TV Output (TV) VGA Monitor interface (VGA) Grounds VDD Analog specific VCC/VDD Reserved/Test/ Misc./ Speaker Total Pin Count Qty 14 89 54 83 9 10 10 69 26 14 10 388 Note: Several interface pins are multiplexed with other functions, refer to the Pin Description section for further details Figure 2-1. STPC Client External Interfaces X86 STPC CLIENT NORTH DRAM VGA VIP TV PCI SYS SOUTH ISA/IDE IPC 89 10 9 10 54 14 73 10 Issue 1.7 - February 8, 2000 11/48 PIN DESCRIPTION Table 2-2. Definition of Signal Pins Signal Name Dir BASIC CLOCKS RESETS & XTAL SYSRSTI# I SYSRSTO#* O XTALI I XTALO PCI_CLKI PCI_CLKO ISA_CLK ISA_CLK2X OSC14M* HCLK* DEV_CLK GCLK2X* DCLK* DCLK _DIR* VDD_xxx_PLL MEMORY INTERFACE MA[11:0]* RAS#[3:0] CAS#[7:0] MWE# MD[63:0]* PCI INTERFACE AD[31:0]* CBE[3:0]* FRAME#* TRDY#* IRDY#* STOP#* DEVSEL#* PAR* SERR#* LOCK# PCI_REQ#[2:0]* PCI_GNT#[2:0]* PCI_INT[3:0]* VDD5 I/O I O O O O O O I/O I/O I Description System Reset / Power good Reset Output to System 14.3MHz External Oscillator Input 14.3MHz External Oscillator Input 33MHz PCI Input Clock 33MHz PCI Output Clock (from internal PLL) ISA Clock Output - Multiplexer Select Line For IPC ISA Clock x 2 Output - Multiplexer Select Line For IPC ISA bus synchronisation clock Host Clock (Test) 24MHz Peripheral Clock (floppy drive) 80MHz Graphics Clock 135MHz Dot Clock Dot Clock Direction Power Supply for PLL Clocks Qty 1 1 1 1 1 1 1 1 1 1 1 1 1 1 I/O O O O I/O Memory Address Row Address Strobe Column Address Strobe Write Enable Memory Data 12 4 8 1 64 I/O I/O I/O I/O I/O I/O I/O I/O O I I O I I PCI Address / Data Bus Commands / Byte Enables Cycle Frame Target Ready Initiator Ready Stop Transaction Device Select Parity Signal Transactions System Error PCI Lock PCI Request PCI Grant PCI Interrupt Request 5V Power Supply for PCI ESD protection 32 4 1 1 1 1 1 1 1 1 3 3 4 4 ISA AND IDE COMBINED ADDRESS/DATA LA[23:22]*/ SCS3#,SCS1# I/O Unlatched Address (ISA) / Secondary Chip Select (IDE) LA[21:20]*/ PCS3#,PCS1# I/O Unlatched Address (ISA) / Primary Chip Select (IDE) LA[19:17]*/ DA[2:0] O Unlatched Address (ISA) / Address (IDE) RMRTCCS#* / DD[15] I/O ROM/RTC Chip Select / Data Bus bit 15 (IDE) KBCS#* / DD[14] I/O Keyboard Chip Select / Data Bus bit 14 (IDE) 2 2 3 1 1 Note; * denotes theat the pin is V5T (see Section 4. ) 12/48 Issue 1.7 - February 8, 2000 PIN DESCRIPTION Table 2-2. Definition of Signal Pins Signal Name RTCRW#* / DD[13] RTCDS#* / DD[12] SA[19:8]* / DD[11:0] SA[7:0] SD[15:0]* Dir I/O I/O I/O I/O I/O Description RTC Read/Write / Data Bus bit 13 (IDE) RTC Data Strobe / Data Bus bit 12 (IDE) Latched Address (ISA) / Data Bus (IDE) Latched Address (IDE) Data Bus (ISA) Qty 1 1 16 4 16 ISA/IDE COMBINED CONTROL IOCHRDY* / DIORDY I/O ISA CONTROL ALE* O BHE#* I/O MEMR#*, MEMW#* I/O SMEMR#*, SMEMW#* O IOR#*, IOW#* I/O MASTER#* I MCS16#*, IOCS16#* I REF#* O AEN* O IOCHCK#* I ISAOE#* O GPIOCS#* I/O I/O Channel Ready (ISA) - Busy/Ready (IDE) Address Latch Enable System Bus High Enable Memory Read and Memory Write System Memory Read and Memory Write I/O Read and Write Add On Card Owns Bus Memory/IO Chip Select16 Refresh Cycle. Address Enable I/O Channel Check. Bidirectional OE Control General Purpose Chip Select 1 1 1 2 2 2 1 2 1 1 1 1 1 IDE CONTROL PIRQ* SIRQ* PDRQ* SDRQ* PDACK#* SDACK#* PIOR#* PIOW#* SIOR#* SIOW#* IPC IRQ_MUX[3:0]* DREQ_MUX[1:0]* DACK_ENC[2:0]* TC* MONITOR INTERFACE RED, GREEN, BLUE VSYNC* HSYNC* VREF_DAC RSET COMP SCL / DDC[1]* I I I I O O I/O O I/O O I I O O Primary Interrupt Request Secondary Interrupt Request Primary DMA Request Secondary DMA Request Primary DMA Acknowledge Secondary DMA Acknowledge Primary I/O Read Primary I/O Write Secondary I/O Read Secondary I/O Write Multiplexed Interrupt Request Multiplexed DMA Request DMA Acknowledge ISA Terminal Count 1 1 1 1 1 1 1 1 1 1 4 2 3 1 O O O I I I I/O Red, Green, Blue Vertical Synchronization Horizontal Synchronization DAC Voltage reference Resistor Set Compensation I C Interface - Clock / Can be used for VGA DDC[1] signal 3 1 1 1 1 1 1 Note; * denotes theat the pin is V5T (see Section 4. ) Issue 1.7 - February 8, 2000 13/48 PIN DESCRIPTION Table 2-2. Definition of Signal Pins Signal Name SDA / DDC[0]* VIDEO INPUT VCLK* VIN[7:0]* DIGITAL TV OUTPUT TV_YUV[7:0]* ODD_EVEN* VCS* MISCELLANEOUS ST[6:0] CLKDEL[2:0]* Dir I/O Description I C Interface - Data / Can be used for VGA DDC[0] signal Qty 1 I I Pixel Clock YUV Video Data Input CCIR 601 or 656 1 8 O O O Digital Video Outputs Frame Synchronisation Horizontal Line Synchronisation 8 1 1 I/O I/O Test/Misc. pins Reserved (Test/Misc pins) 7 3 Note; * denotes theat the pin is V5T (see Section 4. ) 14/48 Issue 1.7 - February 8, 2000 PIN DESCRIPTION 2.2.SIGNAL DESCRIPTIONS these signals can be adjusted by software to match the timings of most DRAM modules. MD[63:0] Memory Data I/O. This is the 64-bit memory data bus. If only half of a bank is populated, MD63-32 is pulled high, data is on MD31-0. MD[40-0] are read by the device strap option registers during rising edge of PWGD. RAS#[3:0] Row Address Strobe Output. There are 4 active low row address strobe outputs, one for each bank of the memory. Each bank contains 4 or 8-Bytes of data. The memory controller allows half of a bank (4 Bytes) to be populated to enable memory upgrade at finer granularity. The RAS# signals drive the SIMMs directly without any external buffering. These pins are always outputs, but they can also simultaneously be inputs, to allow the memory controller to monitor the value of the RAS# signals at the pins. CAS#[7:0] Column Address Strobe Output. There are 8 active low column address strobe outputs, one for each Byte of the memory. The CAS# signals drive the SIMMs either directly or through external buffers. These pins are always outputs, but they can also simultaneously be inputs, to allow the memory controller to monitor the value of the CAS# signals at the pins. MWE# Write Enable Output. Write enable specifies whether the memory access is a read (MWE# = H) or a write (MWE# = L). This single write enable controls all DRAMs. It can be externally buffered to boost the maximum number of loads (DRAM chips) supported. The MWE# signals drive the SIMMs directly without any external buffering. 2.2.1. BASIC CLOCKS RESETS & XTAL PWGD System Reset/Power good. This input is low when the reset switch is depressed. Otherwise, it reflects the power supply’s power good signal. PWGD is asynchronous to all clocks, and acts as a negative active reset. The reset circuit initiates a hard reset on the rising edge of PWGD. XTALI 14.3MHz Pull Down (10 k Ω) XTALO 14.3MHz External Oscillator Input These pins are the 14.318 MHz external oscillator input; This clock is used as the reference clock for the internal frequency synthesizer to generate the HCLK, CLK24M, GCLK2X and DCLK clocks. HCLK Host Clock. This is the host 1X clock. Its frequency can vary from 25 to 75 MHz. All host transactions and PCI transactions are synchronized to this clock. This clock drives the DRAM controller to execute the host transactions. In normal mode, this output clock is generated by the internal PLL. GCLK2X 80MHz Graphics Clock. This is the Graphics 2X clock, which drives the graphics engine and the DRAM controller to execute the graphics and display cycles. Normally GCLK2X is generated by the internal frequency synthesizer, and this pin is an output. By setting a bit in Strap Register 2, this pin can be made an input so that an external clock can replace the internal frequency synthesizer. DCLK 135MHz Dot Clock. This is the dot clock, which drives graphics display cycles. Its frequency can go from 8MHz (using internal PLL) up to 135 MHz, and it is required to have a worst case duty cycle of 60-40. DCLK_DIR Dot Clock Direction. Specifies if DCLK is an input (0) or an output (1). DEV_CLK 24MHz Peripheral Clock Output. This 24MHZ signal is provided as a convenience for the system integration of a floppy disk driver function in an external chip. 2.2.3. VIDEO INPUT VCLK Pixel Clock Input. VIN[7:0] YUV Video Data Input CCIR 601 or 656. Time multiplexed 4:2:2 luminance and chrominance data as defined in ITU-R Rec601-2 and Rec656 (except for TTL input levels). This bus interfaces with an MPEG video decoder output port and typically carries a stream of Cb, Y, Cr, Y digital video at VCLK frequency, clocked on the rising edge (by default) of VCLK. A 54-Mbit/s ‘double’ Cb, Y, Cr, Y input multiplex is supported for double encoding applications (rising and falling edge of CKREF are operating). 2.2.2. MEMORY INTERFACE MA[11:0] Memory Address Output. These 12 multiplexed memory address pins support external DRAM with up to 4K refresh. These include all 16M x N and some 4M x N DRAM modules. The address signals must be externally buffered to support more than 16 DRAM chips. The timing of 2.2.4. TV OUTPUT TV_YUV[7:0] Digital video outputs. Issue 1.7 - February 8, 2000 15/48 PIN DESCRIPTION ODD_EVEN Frame Synchronization. VCS Horizontal Line Synchronization. cycle on the PCI bus to determine if a PCI slave device has decoded itself to be the target of the current transaction. It is asserted as an output either when the STPC Client is the target of the current PCI transaction or when no other device asserts DEVSEL# prior to the subtractive decode phase of the current PCI transaction. PAR Parity Signal Transactions. This is the parity signal of the PCI bus. This signal is used to guarantee even parity across AD[31:0], CBE#[3:0], and PAR. This signal is driven by the master during the address phase and data phase of write transactions. It is driven by the target during data phase of read transactions. (Its assertion is identical to that of the AD bus delayed by one PCI clock cycle) SERR# System Error. This is the system error signal of the PCI bus. It may, if enabled, be asserted for one PCI clock cycle if the target aborts an STPC Client initiated PCI transaction. Its assertion by either the STPC Client or by another PCI bus agent will trigger the assertion of NMI to the host CPU. This is an open drain output. LOCK# PCI Lock. This is the lock signal of the PCI bus and is used to implement the exclusive bus operations when acting as a PCI target agent. PCI_REQ#[2:0] PCI Request. These pins are the three external PCI master request pins. They indicate to the PCI arbiter that the external agents require use of the bus. PCI_GNT#[2:0] PCI Grant. These pins indicate that the PCI bus has been granted master, requesting it on its PCI_REQ#. 2.2.5. PCI INTERFACE PCI_CLKI 33MHz PCI Input Clock This signal is the PCI bus clock input and should be driven from the PCI_CLKO pin. PCI_CLKO 33MHz PCI Output Clock. This is the master PCI bus clock output. AD[31:0] PCI Address/Data. This is the 32-bit PCI multiplexed address and data bus. This bus is driven by the master during the address phase and data phase of write transactions. It is driven by the target during data phase of read transactions. CBE#[3:0] Bus Commands/Byte Enables. These are the multiplexed command and Byte enable signals of the PCI bus. During the address phase they define the command and during the data phase they carry the Byte enable information. These pins are inputs when a PCI master other than the STPC Client owns the bus and outputs when the STPC Client owns the bus. FRAME# Cycle Frame. This is the frame signal of the PCI bus. It is an input when a PCI master owns the bus and is an output when STPC Client owns the PCI bus. TRDY# Target Ready. This is the target ready signal of the PCI bus. It is driven as an output when the STPC Client is the target of the current bus transaction. It is used as an input when STPC Client initiates a cycle on the PCI bus. IRDY# Initiator Ready. This is the initiator ready signal of the PCI bus. It is used as an output when the STPC Client initiates a bus cycle on the PCI bus. It is used as an input during the PCI cycles targeted to the STPC Client to determine when the current PCI master is ready to complete the current transaction. STOP# Stop Transaction. Stop is used to implement the disconnect, retry and abort protocol of the PCI bus. It is used as an input for the bus cycles initiated by the STPC Client and is used as an output when a PCI master cycle is targeted to the STPC Client. DEVSEL# I/O Device Select. This signal is used as an input when the STPC Client initiates a bus 2.2.6. ISA/IDE COMBINED ADDRESS/DATA LA[23]/SCS3# Unlatched Address (ISA) / Secondary Chip Select (IDE). This pin has two functions, depending on whether the ISA bus is active or the IDE bus is active. When the ISA bus is active, this pins is ISA Bus unlatched address bit 23 for 16-bit devices. When ISA bus is accessed by any cycle initiated from PCI bus, this pin is in output mode. When an ISA bus master owns the bus, this pins is in input mode. When the IDE bus is active, this signals is used as the active high secondary slave IDE chip select signal. This signal is to be externally NANDed with the ISAOE# signal before driving the IDE devices to guarantee it is active only when ISA bus is idle. 16/48 Issue 1.7 - February 8, 2000 PIN DESCRIPTION LA[22]/SCS1# Unlatched Address (ISA) / Secondary Chip Select (IDE) This pin has two functions, depending on whether the ISA bus is active or the IDE bus is active. When the ISA bus is active, this pin is ISA bus unlatched address bit 22 for 16-bit devices. When ISA bus is accessed by any cycle initiated from PCI bus, this pin is in output mode. When an ISA bus master owns the bus, this pin is in input mode. When the IDE bus is active, this signal is used as the active high secondary slave IDE chip select signal. This signal is to be externally ANDed with the ISAOE# signal before driving the IDE devices to guarantee it is active only when ISA bus is idle. LA[21]/PCS3# Unlatched Address (ISA) / Primary Chip Select (IDE). This pin has two functions, depending on whether the ISA bus is active or the IDE bus is active. When the ISA bus is active, this pin is ISA Bus unlatched address bit 21 for 16-bit devices. When ISA bus is accessed by any cycle initiated from PCI bus, this pin is in output mode. When an ISA bus master owns the bus, this pin is in input mode. When the IDE bus is active, this signas is used as the active high primary slave IDE chip select signal. This signal is to be externally NANDed with the ISAOE# signal before driving the IDE devices to guarantee it is active only when ISA bus is idle. LA[20]/PCS1# Unlatched Address (ISA) / Primary Chip Select (IDE). This pin has two functions, depending on whether the ISA bus is active or the IDE bus is active. When the ISA bus is active, this pin is ISA Bus unlatched address bit 20 for 16-bit devices. When the ISA bus is accessed by any cycle initiated from PCI bus, this pin is in output mode. When an ISA bus master owns the bus, this pin is in input mode. When the IDE bus is active, this signals is used as the active high primary slave IDE chip select signal. This signal is to be externally NANDed with the ISAOE# signal before driving the IDE devices to guarantee it is active only when ISA bus is idle. LA[19:17]/DA[2:0] Unlatched Address (ISA) / Address (IDE). These pins are multi-function pins. They are used as the ISA bus unlatched address bits [19:17] for ISA bus or the three address bits for the IDE bus devices. When used by the ISA bus, these pins are ISA bus unlatched address bits 19-17 on 16-bit devices. When the ISA bus is accessed by any cycle initiated from the PCI bus, these pins are in output mode. When an ISA bus master owns the bus, these pins are tristated. For IDE devices, these signals are used as the DA[2:0] and are connected directly or through a buffer to DA[2:0] of the IDE devices. If the toggling of signals are to be masked during ISA bus cycles, they can be externally ORed before being connected to the IDE devices. SA[19:8]/DD[11:0] Unlatched Address (ISA) / Data Bus (IDE). These are multifunction pins. When the ISA bus is active, they are used as the ISA bus system address bits 19-8. When the IDE bus is active, they serve as IDE signals DD[11:0]. These pins are used as an input when an ISA bus master owns the bus and are outputs at all other times. IDE devices are connected to SA[19:8] directly and the ISA bus is connected to these pins through two LS245 transceivers. The transceiver OEs are connected to ISAOE# and the DIR is connected to MASTER #. The transceiver bus signals are connected to the CPC and IDE DD busses and B bus signals are connected to ISA SA bus. DD[15:12] Databus (IDE). The high 4 bits of the IDE databus are combined with several of the Xbus lines. Refer to the following section for X-bus pins for further information. SA[7:0] ISA Bus address bits [7:0]. These are the 8 low bits of the system address bus of ISA on 8bit slot. These pins are used as an input when an ISA bus master owns the bus and are outputs at all other times. SD[15:0] I/O Data Bus (ISA). These pins are the external databus to the ISA bus. 2.2.7. ISA/IDE COMBINED CONTROL IOCHRDY/DIORDY Channel Ready (ISA) / Busy / Ready (IDE). This is a multi-function pin. When the ISA bus is active, this pin is IOCHRDY. When the IDE bus is active, this serves as IDE signal DIORDY. IOCHRDY is the I/O channel ready signal of the ISA bus and is driven as an output in response to an ISA master cycle targeted to the host bus or an internal register of the STPC Client. The STPC Client monitors this signal as an input when performing an ISA cycle on behalf of the host CPU, DMA master or refresh. ISA masters which do not monitor IOCHRDY are not guaranteed to work with the STPC Client since the access to the system memory can be considerably delayed due to CRT refresh or a write back cycle. Issue 1.7 - February 8, 2000 17/48 PIN DESCRIPTION 2.2.8. ISA CONTROL SMEMW# System Memory Write. The STPC Client generates SMEMW# signal of the ISA bus only when the address is below 1MByte. IOR# I/O Read. This is the I/O read command signal of the ISA bus. It is an input when an ISA master owns the bus and is an output at all other times. IOW# I/O Write. This is the I/O write command signal of the ISA bus. It is an input when an ISA master owns the bus and is an output at all other times. MASTER# Add On Card Owns Bus. This signal is active when an ISA device has been granted bus ownership. MCS16# Memory Chip Select 16. This is the decode of LA23-17 address pins of the ISA address bus without any qualification of the command signal lines. MCS16# is always an input. The STPC Client ignores this signal during I/O and refresh cycles. IOCS16# I/O Chip Select 16. This signal is the decode of SA15-0 address pins of the ISA address bus without any qualification of the command signals. The STPC Client does not drive IOCS16# (similar to PC-AT design). An ISA master access to an internal register of the STPC Client is executed as an extended 8-bit I/O cycle. REF# Refresh Cycle. This is the refresh command signal of the ISA bus. It is driven as an output when the STPC Client performs a refresh cycle on the ISA bus. It is used as an input when an ISA master owns the bus and is used to trigger a refresh cycle. The STPC Client performs a pseudo hidden refresh. It requests the host bus for two host clocks to drive the refresh address and capture it in external buffers. The host bus is then relinquished while the refresh cycle continues on the ISA bus. AEN Address Enable. Address Enable is enabled when the DMA controller is the bus owner to indicate that a DMA transfer will occur. The enabling of the signal indicates to I/O devices to ignore the IOR#/IOW# signal during DMA transfers. IOCHCK# I/O Channel Check. I/O Channel Check is enabled by any ISA device to signal an error condition that can not be corrected. NMI signal becomes active upon seeing IOCHCK# active if the corresponding bit in Port B is enabled. SYSRSTO# Reset Output to System. This is the system reset signal and is used to reset the rest of the components (not on Host Bus) in the system. The ISA bus reset is an externally inverted buffered version of this output and the PCI bus reset is an externally buffered version of this output. ISA_CLK ISA Clock Output (also Multiplexer Select Line For IPC). This pin produces the Clock signal for the ISA bus. It is also used with ISA_CLK2X as the multiplexor control lines for the Interrupt Controller Interrupt input lines. This is a divided down version of either the PCICLK or OSC14M. ISA_CLKX2 ISA Clock Output (also Multiplexer Select Line For IPC). This pin produces a signal at twice the frequency of the Clock signal for the ISA bus. It is also used with ISA_CLK as the multiplexor control lines for the Interrupt Controller Interrupt input lines. OSC14M ISA Bus Synchronization Clock Output. This is the buffered 14.318 Mhz clock to the ISA bus. ALE Address Latch Enable. This is the address latch enable output of the ISA bus and is asserted by the STPC Client to indicate that LA23-17, SA19-0, AEN and SBHE# signals are valid. The ALE is driven high during refresh, DMA master or ISA master cycles by the STPC Client. ALE is driven low after reset. BHE# System Bus High Enable. This signal, when asserted, indicates that a data Byte is being transferred on SD15-8 lines. It is used as an input when an ISA master owns the bus and is an output at all other times. MEMR# Memory Read. This is the memory read command signal of the ISA bus. It is used as an input when an ISA master owns the bus and is an output at all other times. The MEMR# signal is active during refresh. MEMW# Memory Write. This is the memory write command signal of the ISA bus. It is used as an input when an ISA master owns the bus and is an output at all other times. SMEMR# System Memory Read. The STPC Client generates SMEMR# signal of the ISA bus only when the address is below 1MByte or the cycle is a refresh cycle. 18/48 Issue 1.7 - February 8, 2000 PIN DESCRIPTION ISAOE# Bidirectional OE Control. This signal controls the OE signal of the external transceiver that connects the IDE DD bus and ISA SA bus. GPIOCS# I/O General Purpose Chip Select 1. This output signal is used by the external latch on ISA bus to latch the data on the SD[7:0] bus. The latch can be used by the PMU unit to control the external peripheral devices to power down or any other desired function. This pin is also serves as a strap input during reset. IDE DD[15] signal. This signal must be ORed externally with ISAOE# and is then connected to ROM and RTC. An LS244 or equivalent function can be used if OE# is connected to ISAOE# and the output is provided with a weak pull-up resistor. KBCS# / DD[14] Keyboard Chip Select. This pin is a multi-function pin. When ISAOE# is active, this signal is used as KBCS#. This signal is asserted if a keyboard access is decoded during a I/O cycle. When ISAOE# is inactive, this signal is used as IDE DD[14] signal. This signal must be ORed externally with ISAOE# and is then connected to the keyboard. An LS244 or equivalent function can be used if OE# is connected to ISAOE# and the output is provided with a weak pull-up resistor. RTCRW# / DD[13] Real Time Clock RW. This pin is a multi-function pin. When ISAOE# is active, this signal is used as RTCRW#. This signal is asserted for any I/O write to port 71H. When ISAOE# is inactive, this signal is used as IDE DD[13] signal. This signal must be ORed externally with ISAOE# and then connected to the RTC. An LS244 or equivalent function can be used if OE# is connected to ISAOE# and the output is provided with a weak pull-up resistor. RTCDS# / DD[12] Real Time Clock DS. This pin is a multi-function pin. When ISAOE# is active, this signal is used as RTCDS. This signal is asserted for any I/O read to port 71H. When ISAOE# is inactive, this signal is used as IDE DD[12] signal. This signal must be ORed externally with ISAOE# and is then connected to RTC. An LS244 or equivalent function can be used if OE# is connected to ISAOE# and the output is provided with a weak pull-up resistor. 2.2.9. IDE CONTROL PIRQ Primary Interrupt Request. Interrupt request from primary IDE channel. SIRQ Secondary Interrupt Request. Interrupt request from secondary IDE channel. PDRQ Primary DMA Request. DMA request from primary IDE channel. SDRQ Secondary DMA Request. DMA request from secondary IDE channel. PDACK# Primary DMA Acknowledge. DMA acknowledge to primary IDE channel. SDACK# Secondary DMA Acknowledge. DMA acknowledge to secondary IDE channel. PIOR# Primary I/O Read. Primary channel read. Active low output. PIOW# Primary I/O Write. Primary channel write. Active low output. SIOR# Secondary I/O Read. Secondary channel read. Active low output. SIOW# Secondary I/O Write. Secondary channel write. Active low output. 2.2.11. IPC 2.2.10. X-BUS INTERFACE PINS / IDE DATA RMRTCCS# / DD[15] ROM/Real Time Clock Chip Select. This pin is a multi-function pin. When ISAOE# is active, this signal is used as RMRTCCS#. This signal is asserted if a ROM access is decoded during a memory cycle. It should be combined with MEMR# or MEMW# signals to properly access the ROM. During an I/O cycle, this signal is asserted if access to the Real Time Clock (RTC) is decoded. It should be combined with IOR#+ or IOW# signals to properly access the real time clock. When ISAOE# is inactive, this signal is used as IRQ_MUX[3:0] Multiplexed Interrupt Request. These are the ISA bus interrupt signals. They are to be encoded before connection to the STPC Client using ISACLK and ISACLKX2 as the input selection strobes. Note that IRQ8B, which by convention is connected to the RTC, is inverted before being sent to the interrupt controller, so that it may be connected directly to the IRQ pin of the RTC. PCI_INT[3:0] PCI Interrupt Request. These are the PCI bus interrupt signals. They are to be encoded before connection to the STPC Client using Issue 1.7 - February 8, 2000 19/48 PIN DESCRIPTION ISACLK and ISACLKX2 as the input selection strobes. DREQ_MUX[1:0] ISA Bus Multiplexed DMA Request. These are the ISA bus DMA request signals. They are to be encoded before connection to the STPC Client using ISACLK and ISACLKX2 as the input selection strobes. DACK_ENC[2:0] DMA Acknowledge. These are the ISA bus DMA acknowledge signals. They are encoded by the STPC Client before output and should be decoded externally using ISACLK and ISACLKX2 as the control strobes. TC ISA Terminal Count. This is the terminal count output of the DMA controller and is connected to the TC line of the ISA bus. It is asserted during the last DMA transfer, when the Byte count expires. RSET Resistor Current Set. This reference current input to the RAMDAC is used to set the fullscale output of the RAMDAC. COMP Compensation. This is the RAMDAC compensation pin. Normally, an external capacitor (typically 10nF) is connected between this pin and VDD to damp oscillations. DDC[1:0] Direct Data Channel Serial Link. These bidirectional pins are connected to CRTC register 3Fh to implement DDC capabilities. They conform to I2C electrical specifications, they have opencollector output drivers which are internally connected to VDD through pull-up resistors. They can instead be used for accessing I C devices on board. DDC1 and DDC0 correspond to SCL and SDA respectively. 2.2.12. MONITOR INTERFACE RED, GREEN, BLUE RGB Video Outputs. These are the 3 analog color outputs from the RAMDACs VSYNC Vertical Synchronization Pulse. This is the vertical synchronization signal from the VGA controller. HSYNC Horizontal Synchronization Pulse. This is the horizontal synchronization signal from the VGA controller. VREF_DAC DAC Voltage reference. An external voltage reference is connected to this pin to bias the DAC. 2.2.13. MISCELLANEOUS ST[6], Reserved. ST[5] This is used for speaker output. ST[4] Reserved. ST[3:0] The pins are for testing the STPC. The default settings on these pins should be 1111 for the STPC to function correctly. By setting the ST[3:0] to 0111, the STPC is tristated. CLKDEL[2:0] Reserved. The pins are reserved for Test and Miscellaneous functions) 20/48 Issue 1.7 - February 8, 2000 PIN DESCRIPTION Table 2-3. Pinout. Pin # AF3 AF15 AE16 G23 F25 AC5 AD5 AF5 AD15 AF16 AC15 AE17 AD16 AF17 AC17 AE18 AD17 AF18 AE19 AF19 AD18 AE20 AC19 AF20 AE21 AC20 AF21 AD20 AE22 AF22 AD21 AE23 AC22 AF23 AE24 AF24 AD25 AC25 AC26 AB24 AA25 AA24 Y25 Y24 V23 W24 V26 V24 Pin name PWGD XTALI XTALO HCLK DEV_CLK GCLK2X DCLK DCLK_DIR MA[0] MA[1] MA[2] MA[3] MA[4] MA[5] MA[6] MA[7] MA[8] MA[9] MA[10] MA[11] RAS#[0] RAS#[1] RAS#[2] RAS#[3] CAS#[0] CAS#[1] CAS#[2] CAS#[3] CAS#[4] CAS#[5] CAS#[6] CAS#[7] MWE# MD[0] MD[1] MD[2] MD[3] MD[4] MD[5] MD[6] MD[7] MD[8] MD[9] MD[10] MD[11] MD[12] MD[13] MD[14] Pin # U23 U24 R26 P25 P26 N25 N26 M25 M26 M24 M23 L24 J25 J26 H26 G25 G26 AD22 AD23 AE26 AD26 AC24 AB25 AB26 Y23 AA26 Y26 W25 W26 V25 U25 U26 T25 R25 T24 R23 R24 N23 P24 N24 L25 L26 K25 K26 K24 H25 J24 H23 H24 Pin name MD[15] MD[16] MD[17] MD[18] MD[19] MD[20] MD[21] MD[22] MD[23] MD[24] MD[25] MD[26] MD[27] MD[28] MD[29] MD[30] MD[31] MD[32] MD[33] MD[34] MD[35] MD[36] MD[37] MD[38] MD[39] MD[40] MD[41] MD[42] MD[43] MD[44] MD[45] MD[46] MD[47] MD[48] MD[49] MD[50] MD[51] MD[52] MD[53] MD[54] MD[55] MD[56] MD[57] MD[58] MD[59] MD[60] MD[61] MD[62] MD[63] Pin # F24 D25 A20 C20 B19 A19 C19 B18 A18 B17 C18 A17 D17 B16 C17 B15 A15 C16 D15 A14 C15 B13 D13 A13 C14 C13 A12 B11 C12 A11 D12 B10 C11 A10 D10 C10 A9 B8 A8 B7 D8 A7 C8 B6 D7 A6 C21 A21 B20 Pin name PCI_CLKI PCI_CLKO AD[0] AD[1] AD[2] AD[3] AD[4] AD[5] AD[6] AD[7] AD[8] AD[9] AD[10] AD[11] AD[12] AD[13] AD[14] AD[15] AD[16] AD[17] AD[18] AD[19] AD[20] AD[21] AD[22] AD[23] AD[24] AD[25] AD[26] AD[27] AD[28] AD[29] AD[30] AD[31] CBE[0] CBE[1] CBE[2] CBE[3] FRAME# TRDY# IRDY# STOP# DEVSEL# PAR SERR# LOCK# PCI_REQ#[0] PCI_REQ#[1] PCI_REQ#[2] Issue 1.7 - February 8, 2000 21/48 PIN DESCRIPTION Pin # C22 B21 D20 D24 C26 A25 B24 F2 G4 F3 F1 G2 G3 H2 J4 H1 H3 J2 J1 K2 J3 K1 K4 L2 K3 L1 M2 M1 L3 N2 M4 N1 M3 P4 P3 R2 N3 P1 R1 T2 R3 T1 R4 U2 T3 U1 U4 V2 Pin name PCI_GNT#[0] PCI_GNT#[1] PCI_GNT#[2] PCI_INT[0] PCI_INT[1] PCI_INT[2] PCI_INT[3] LA[17]/DA[0] LA[18]/DA[1] LA[19]/DA[2] LA[20]/PCS1# LA[21]/PCS3# LA[22]/SCS1# LA[23]/SCS3# SA[0] SA[1] SA[2] SA[3] SA[4] SA[5] SA[6] SA[7] SA[8]/DD[0] SA[9]/DD[1] SA[10]/DD[2] SA[11]/DD[3] SA[12] / DD[4] SA[13] / DD[5] SA[14] / DD[6] SA[15] / DD[7] SA[16] / DD[8] SA[17] / DD[9] SA[18] / DD[10] SA[19] / DD[11] RTCDS / DD[12] RTCRW# / DD[13] KBCS# / DD[14] RMRTCCS# / DD[15] SD[0] SD[1] SD[2] SD[3] SD[4] SD[5] SD[6] SD[7] SD[8] SD[9] Pin # U3 V1 W2 W1 V3 Y2 AE4 AD4 AE5 C6 W3 AA2 Y4 AA1 Y3 AB2 AA3 AC2 AB4 AC1 AB3 AD2 AC3 AD1 AF2 AE3 Y1 B1 C2 C1 D2 D3 D1 E2 E4 E3 E1 E23 D26 E24 C25 A24 B23 C23 A23 B22 D22 Pin name SD[10] SD[11] SD[12] SD[13] SD[14] SD[15] SYSRSTO# ISA_CLK ISA_CLK2X OSC14M ALE BHE# MEMR# MEMW# SMEMR# SMEMW# IOR# IOW# MASTER# MCS16# IOCS16# REF# AEN IOCHCK# ISAOE# GPIOCS# IOCHRDY PIRQ SIRQ PDRQ SDRQ PDACK# SDACK# PIOR# PIOW# SIOR# SIOW# IRQ_MUX[0] IRQ_MUX[1] IRQ_MUX[2] IRQ_MUX[3] DREQ_MUX[0] DREQ_MUX[1] DACK_ENC[0] DACK_ENC[1] DACK_ENC[2] TC Pin # AE6 AD6 AF6 AE9 AF9 AD7 AE8 AC9 AF8 AD8 AD14 AE13 AC12 AD12 AE14 AC14 AF14 AD13 AE15 AF10 AC10 AE11 AD10 AF11 AE12 AF12 AD11 AE10 AD9 B4 D5 A4 C5 B3 C4 A3 C7 B5 A5 AC7 AF4 W4 AB1 F26 G24 Pin name RED GREEN BLUE VSYNC HSYNC VREF_DAC RSET COMP DDC[1] / SCL DDC[0] / SDA VCLK VIN[0] VIN[1] VIN[2] VIN[3] VIN[4] VIN[5] VIN[6] VIN[7] VTV_YUV[0] VTV_YUV[1] VTV_YUV[2] VTV_YUV[3] VTV_YUV[4] VTV_YUV[5] VTV_YUV[6] VTV_YUV[7] VCS ODD_EVEN ST[0] ST[1] ST[2] ST[3] ST[4] ST[5] ST[6] CLKDEL[0] CLKDEL[1] CLKDEL[2] VDD_DAC1 VDD_DAC2 VDD_GCLK_PLL VDD_DCLK_PLL VDD_HCLK_PLL VDD_DEVCLK_PLL 22/48 Issue 1.7 - February 8, 2000 PIN DESCRIPTION Pin # A16 B12 B9 D18 A22 B14 C9 D6 D11 D16 D21 F4 F23 G1 K23 L4 L23 P2 T4 T23 T26 AA4 AA23 AB23 AC6 AC11 AC16 AC21 AD19 AF13 AE7 AF7 E25 E26 A1:2 A26 B2 B25:26 C3 C24 D4 D9 D14 D19 D23 H4 J23 L11:16 Pin name VDD5 VDD5 VDD5 VDD5 VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS_DAC1 VSS_DAC2 VSS_DLL VSS_DLL VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Pin # M11:16 N4 N11:16 P11:16 P23 R11:16 T11:16 V4 W23 AC4 AC8 AC13 AC18 AC23 AD3 AD24 AE1:2 AE25 AF1 AF25 AF26 Pin name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Issue 1.7 - February 8, 2000 23/48 PIN DESCRIPTION 24/48 Issue 1.7 - February 8, 2000 UPDATE HISTORY FOR PIN DESCRIPTION CHAPTER 2.3 UPDATE HISTORY FOR PIN DESCRIPTION CHAPTER The following changes have been made to the Pin Description Chapter on 08/02/2000 Section 2.2.3. Change Replaced Text Signals VIDEO_D[7:0] with VIN, VTV_BT# with ODD_EVEN, VTV_SYNCH with VCS. The following changes have been made to the Pin Description Chapter on 13/01/2000 Section 2.2. Change Added Text “to a minimum of 8MHz” DCLK Dot Clock / Pixel clock. This clock supplies the display controller, the video pipeline, the ramdac, and the TV output logic. Its value is dependent on the selected display mode. Its frequency can be as high as 135 MHz. This signal is either driven by the internal PLL to a minimum of 8MHz or by an external oscillator. The direction can be controlled by a strap option or an internal register bit. The following changes have been made to the Pin Description Chapter on 28/09/99 Section Change Table 2-1. Changed Figure 2-1. Changed Table 2-2. Replaced 2.2.1. 2.2.1. 2.2.3. Moved Moved Replaced Text Updated signal pin counts and added abbreviations to table. Updated External interface pin count “PWGD” with “SYSRSTI#” PCI_CLKI and PCI_CLKO moved from 2.2.1. to 2.2.5. ISA_CLK and ISA_CLKX2 moved from 2.2.1. to 2.2.8. “Video Interface” with “Video Input” The following changes have been made to the Pin Description Chapter on 23/09/99 Section 2.2.13. Change Added Text “Note; By setting signals ST[3:0] to the following value allows the STPC to be put Tristate. This means the STPC is switched off and no signals are being driven.“ The following changes have been made to the Pin Description Chapter on 11/08/99 Removed statement; “The direction can be controlled by a strap option or an internal register bit.” Issue 1.7 - February 8, 2000 25/48 UPDATE HISTORY FOR PIN DESCRIPTION CHAPTER The following changes have been made to the Pin Description Chapter from Revision 1.0 to Release 1.2. Section 2.1. Change Replaced Text 2.2.1. Replaced 2.2.1. Replaced “internal” With “assimilated “ “The DRAM controller to execute the host transactions is also driven by this clock” With “This clock drives the DRAM controller to execute the host transactions” “AD[31:0] PCI Address/Data. This is the 32-bit multiplexed address and data bus of the PCI. This bus is driven by the master during the address phase and data phase of write transactions. It is driven by the target during data phase of read transactions.” With “AD[31:0] PCI Address/Data. This is the 32-bit PCI multiplexed address and data bus. This bus is driven by the master during the address phase and data phase of write transactions. It is driven by the target during data phase of read transactions.” “IDE devices are connected to SA[19:8] directly and ISA bus is connected to these pins through two LS245 transceivers. The OE of the transceivers are connected to ISAOE# and the DIR is connected to MASTER#. The A bus signals of the transceivers are connected to CPC and IDE DD bus and the B bus signals are connected to ISA SA bus.” With “IDE devices are connected to SA[19:8] directly and the ISA bus is connected to these pins through two LS245 transceivers. The transceiver OEs are connected to ISAOE# and the DIR is connected to MASTER#. The transceiver bus signals are connected to the CPC and IDE DD busses and B bus signals are connected to ISA SA bus.” “For IDE devices, these signals are used as the DA[2:0] and are connected to DA[2:0] of IDE devices directly or through a buffer. If the toggling of signals is to be masked during ISA bus cycles, they can be externally ORed before being connected to the IDE devices.” With “For IDE devices, these signals are used as the DA[2:0] and are connected directly or through a buffer to DA[2:0] of the IDE devices. If the toggling of signals are to be masked during ISA bus cycles, they can be externally ORed before being connected to the IDE devices.” “IOCS16# IO Chip Select16. This signal is the decode of the ISA bus SA15-0 address pins of without any qualification of the command signals. The STPC Client does not drive IOCS16# (similar to PC-AT design). An ISA master access to an internal register of the STPC Client is executed as an extended 8-bit IO cycle.” With “IOCS16# IO Chip Select16. This signal is the decode of SA15-0 address pins of the ISA address bus without any qualification of the command signals. The STPC Client does not drive IOCS16# (similar to PC-AT design). An ISA master access to an internal register of the STPC Client is executed as an extended 8bit IO cycle.” “They can instead be used for accessing I C devices on board. DDC1 and DDC0 correspond to SCL and SDA respectively.” Updated table 3 Issue 1.7 - February 8, 2000 2.2.6. Replaced 2.2.6. Replaced 2.2.8. Replaced 2.2.12. 2.2.12. Added Replaced 26/48 STRAP OPTION 3. STRAP OPTION This chapter defines the STPC Client Strap Options and their location Memory Data Refer to Lines MD0 MD1 MD2 DRAM Bank 1 MD3 MD4 MD5 DRAM Bank 0 MD6 MD7 MD8 MD9 MD10 DRAM Bank 3 MD11 MD12 MD13 DRAM Bank 2 MD14 MD15 MD16 MD17 PCI Clock MD18 MD19 MD20 MD21 MD22 MD23 MD24 HCLK MD25 MD26 Designation Reserved Reserved Speed Speed Type Speed Speed Type Reserved Reserved Speed Speed Type Speed Speed Type Reserved PCI_CLKO Divisor Reserved Reserved Location Index 4A, bit 2 Index 4A, bit 3 Index 4A, bit 4 Index 4A, bit 5 Index 4A, bit 6 Index 4A, bit 7 Index 4B, bit 0 Index 4B, bit 1 Index 4B, bit 2 Index 4B, bit 3 Index 4B, bit 4 Index 4B, bit 5 Index 4B, bit 6 Index 4B, bit 7 Index 4C, bit 0 Index 4C, bit 1 Index 4C, bit 2Index 4C, bit 3 Index 4C, bit 4 Index 5F, bit 0 Index 5F, bit 1 Index 5F, bit 2 Index 5F, bit 3 Index 5F, bit 4 Index 5F, bit 5 Actual Settings User defined Pull up User defined User defined Pull up User defined Pull up User defined Pull up User defined User defined Pull up User defined Pull up User defined Pull up Pull up Pull up Pull up Pull up Pull up User defined User defined User defined User defined User defined User defined User defined User defined Pull up Pull up Pull up Pull up Pull down Pull up Pull up Pull down Pull up - Set to ’0’ 70 ns EDO 70 ns EDO 70 ns EDO 70 ns EDO HCLK /2 000 001 010 011 100 101 110 111 - Set to ’1’ 60 ns FPM 60 ns FPM 60 ns FPM 60 ns FPM HCLK /3 Reserved Reserved Reserved 25 MHz 50 MHz 60 MHz 66 MHz 75 MHz - Reserved Reserved Reserved Reserved HCLK PLL Speed MD27 MD28 MD29 MD30 MD31 MD32 MD33 MD34 MD35 MD36 MD37 - Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved - Issue 1.7 - February 8, 2000 27/48 STRAP OPTION Memory Data Refer to Lines MD38 MD39 MD40 MD41 MD42 MD43 Actual Settings - Designation Reserved Reserved Reserved Reserved Reserved Reserved Location Set to ’0’ - Set to ’1’ - Note; Setting of Strap Options MD [15:2] have no effect on the DRAM Controller but are purely meant for software issues. i.e. Readable in a register. 3.1 Power on strap registers description 3.1.2 Strap register 1 Index 4Bh (Strap1) Bits 7-0; This register reflect the status of pins MD[15:8] respectively. They are expected to be connected on the system board to the SIMM configuration pins as follows: 3.1.1 Strap register 0 Index 4Ah (Strap0) Bits 7-0; This register reflect the status of pins MD[7:0] respectively. They are expected to be connected on the system board to the SIMM configuration pins as follows: Bit Sampled Bit 7 Bits 6-5 Bit 4 Bits 3-2 Bit 1 Bit 0 Description SIMM 2 DRAM type SIMM 2 speed SIMM 3 dram type SIMM 3 speed Reserved Reserved Bit Sampled Bit 7 Bits 6-5 Bit 4 Bits 3-2 Bit 1 Bit 0 Description SIMM 0 DRAM type SIMM 0 speed SIMM 1 DRAM type: SIMM 1 speed Reserved Reserved Note that the SIMM speed and type information read here is meant only for the software and is not used by the hardware. The software must program the Host and graphics dram controller configuration registers appropriately based on these bits. This register defaults to the values sampled on MD[15:8] pins after reset. Note that the SIMM speed and type information read here is meant only for the software and is not used by the hardware. The software must program the Host and graphics dram controller configuration registers appropriately based on these bits. This register defaults to the values sampled on MD[7:0] pins after reset. 3.1.3 Strap register 2 Index 4Ch (Strap2) Bits 4-0; This register reflect the status of pins MD[20:16] respectively.They are use by the chip as follows: Bit 4-2; Reserved. Bit 1; This bit reflects the value sampled on MD[17] pin and controls the PCI clock output as follows: 0: PCI clock output = HCLK / 2 1: PCI clock output = HCLK / 3. Bit 0; Reserved. This register defaults to the values sampled on MD[20:16] pins after reset. 28/48 Issue 1.7 - February 8, 2000 STRAP OPTION 3.1.4 HCLK PLL Strap register Index 5Fh (HCLK_Strap) Bits 5-0 of this register reflect the status of the MD[26:21] & are used as follows: Bit 5-3 These pins reflect the value sampled on MD[26:24] pins respectively and control the Host clock frequency synthesizer Bit 2- 0 Reserved This register defaults to the values sampled on above pins after reset. These pin must not be pulled low for normal system operation. Strap Registers [43:27] are reserved. Issue 1.7 - February 8, 2000 29/48 ELECTRICAL SPECIFICATIONS 4. ELECTRICAL SPECIFICATIONS 4.1 INTRODUCTION The electrical specifications in this chapter are valid for the STPC Client. through a 20 kW (±10%) pull-up resistor to prevent spurious operation. 4.2.3 RESERVED DESIGNATED PINS Pins designated reserved should be left disconnected. Connecting a reserved pin to a pull-up resistor, pull-down resistor, or an active signal could cause unexpected results and possible circuit malfunctions. 4.2 ELECTRICAL CONNECTIONS 4.2.1 POWER/GROUND CONNECTIONS/ DECOUPLING Due to the high frequency of operation of the STPC Client, it is necessary to install and test this device using standard high frequency techniques. The high clock frequencies used in the STPC Client and its output buffer circuits can cause transient power surges when several output buffers switch output levels simultaneously. These effects can be minimized by filtering the DC power leads with low-inductance decoupling capacitors, using low impedance wiring, and by utilizing all of the VSS and VDD pins. 4.2.2 UNUSED INPUT PINS All inputs not used by the designer and not listed in the table of pin connections in Chapter 3 should be connected either to VDD or to VSS. Connect active-high inputs to VDD through a 20 kW (±10%) pull-down resistor and active-low inputs to VSS and connect active-low inputs to VCC Table 4-1. Absolute Maximum Ratings Symbol VDDx VI , VO V5T V ESD TSTG TCASE PTOT Parameter DC Supply Voltage Digital Input and Output Voltage 5Volt Tolerance ESD Capacity (Human body mode) Storage Temperature Operating Case Temperature (Note 1) Total Power Dissipation 4.3 ABSOLUTE MAXIMUM RATINGS The following table lists the absolute maximum ratings for the STPC Client device. Stresses beyond those listed under Table 4-1 limits may cause permanent damage to the device. These are stress ratings only and do not imply that operation under any conditions other than those specified in section ”Operating Conditions”. Exposure to conditions beyond Table 4-1 may (1) reduce device reliability and (2) result in premature failure even when there is no immediately apparent sign of failure. Prolonged exposure to conditions at or near the absolute maximum ratings (Table 4-1) may also result in reduced useful life and reliability. Minimum -0.3 -0.3 2.5 -40 -40 Maximum 4.0 VDD + 0.3 5 1500 +150 +100 4.8 Units V V V V °C °C W Note 1 : -40 °C limit of TCASE (extended temperature range) is given a s a preliminary specification and so as all the -40° C related data. 30/48 Issue 1.7 - February 8, 2000 ELECTRICAL SPECIFICATIONS 4.4 DC CHARACTERISTICS Table 4-2. DC Characteristics Recommended Operating conditions : VDD = 3.3V ± 0.3V, Tcase = 0 to 100°C (Commercial Range) or -40 to 100°C (Industrial Range) unless otherwise specified Symbol VDD VDD5 PDD H CLK VREF VOL VOH VIL VIH ILK C IN C OUT C CLK Parameter Operating Voltage 5V operating voltage Supply Power Internal Clock DAC Voltage Reference Output Low Voltage Output High Voltage Input Low Voltage Input High Voltage Input Leakage Current Input Capacitance Output Capacitance Clock Capacitance Test conditions Note 3 VDD = 3.3V, HCLK = 66Mhz (Note 1) ILoad =1.5 to 8mA depending of the pin ILoad =-0.5 to -8mA depending of the pin Except XTALI XTALI Except XTALI XTALI Input, I/O (Note 2) (Note 2) (Note 2) Min 3.0 4.5 Typ 3.3 5 3.2 1.235 Unit V V W MHz V V V 0.8 V 0.9 V VDD+0.3 V VDD+0.3 V 5 µA pF pF pF Max 3.6 5.5 3.9 75 1.255 0.5 1.215 2.4 -0.3 -0.3 2.1 2.35 -5 Notes: 1. MHz ratings refer to CPU clock frequency. 2. Not 100% tested. 3. Detail of pins refer to Section 2.2. measurement points identified in Figure 4-1 and Figure 4-2. The rising clock edge reference level VREF , and other reference levels are shown in Table 4-3 below for the STPC Client. Input or output signals must cross these levels during testing. Figure 4-1 shows output delay (A and B) and input setup and hold times (C and D). Input setup and hold times (C and D) are specified minimums, defining the smallest acceptable sampling window a synchronous input signal must be stable for correct operation. 4.5 AC CHARACTERISTICS Table 4-4 through Table 4-8 list the AC characteristics including output delays, input setup requirements, input hold requirements and output float delays. These measurements are based on the Table 4-3. Drive Level and Measurement Points for Switching Characteristics Symbol VREF VIHD V ILD Value 1.5 3.0 0.0 Units V V V Note: Refer to Figure 4-1. Issue 1.7 - February 8, 2000 31/48 ELECTRICAL SPECIFICATIONS Figure 4-1 Drive Level and Measurement Points for Switching Characteristics Tx VIHD CLK: A B MIN VRef Valid Output n+1 MAX VRef VILD OUTPUTS: Valid Output n C D VIHD INPUTS: Valid Input VRef VILD LEGEND: A B C D - Maximum Output Delay Specification - Minimum Output Delay Specification - Minimum Input Setup Specification - Minimum Input Hold Specification Figure 4-2 CLK Timing Measurement Points T1 T2 VIH (MIN) VRef CLK VIL (MAX) T5 T3 T4 32/48 Issue 1.7 - February 8, 2000 ELECTRICAL SPECIFICATIONS Table 4-4. PCI Bus AC Timing Name t1 t2 t3 t4 t5 T6 T7 T8 T9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 Parameter PCI_CLKI to AD[31:0] valid PCI_CLKI to FRAME# valid PCI_CLKI to CBE#[3:0] valid PCI_CLKI to PAR valid PCI_CLKI to TRDY# valid PCI_CLKI to IRDY# valid PCI_CLKI to STOP# valid PCI_CLKI to DEVSEL# valid PCI_CLKI to PCI_GNT# valid AD[31:0] bus setup to PCI_CLKI AD[31:0] bus hold from PCI_CLKI PCI_REQ#[2:0] setup to PCI_CLKI PCI_REQ#[2:0] hold from PCI_CLKI CBE#[3:0] setup to PCI_CLKI CBE#[3:0] hold to PCI_CLKI IRDY# setup to PCI_CLKI IRDY# hold to PCI_CLKI FRAME# setup to PCI_CLKI FRAME# hold from PCI_CLKI Min 2 2 2 2 2 2 2 2 2 7 3 10 1 7 5 7 4 7 3 Max 13 11 12 12 13 11 14 11 14 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Table 4-5. DRAM Bus AC Timing Name t22 t23 t24 t25 t26 t27 t28 t29 t30 t31 t32 t33 Parameter HCLK to RAS#[3:0] valid HCLK to CAS#[7:0] bus valid HCLK to MA[11:0] bus valid HCLK to MWE# valid HCLK to MD[63:0] bus valid MD[63:0] Generic setup GCLK2X to RAS#[3:0] valid GCLK2X to CAS#[7:0] valid GCLK2X to MA[11:0] bus valid GCLK2X to MWE# valid GCLK2X to MD[63:0] bus valid MD[63:0] Generic hold Min Max 17 17 17 17 25 17 17 17 17 23 0 Unit ns ns ns ns ns ns ns ns ns ns ns ns 7 Issue 1.7 - February 8, 2000 33/48 ELECTRICAL SPECIFICATIONS Table 4-6. Video Input/TV Output AC Timing Name t34 t35 t36 t37 t38 t39 t40 t41 t42 Parameter DCLK to TV_YUV[7:0] bus valid VIN[7:0] setup to VCLK VIN[7:0] hold from VCLK VCLK to ODD_EVEN valid VCLK to VCS valid ODD_EVEN setup to VCLK ODD_EVEN hold from VCLK VCS setup to VCLK VCS hold from VCLK Min 5 3 21 21 10 5 10 5 Max 18 Unit ns ns ns ns ns ns ns ns ns Table 4-7. Graphics Adapter (VGA) AC Timing Name t43 t44 Parameter DCLK to VSYNC valid DCLK to HSYNC valid Min Max 45 45 Unit ns ns Table 4-8. ISA Bus AC Timing Name t45 t46 t47 t48 t49 t50 t51 t52 t53 t54 t55 t56 t57 Parameter XTALO to LA[23:17] bus active XTALO to SA[19:0] bus active XTALO to BHE# valid XTALO to SD[15:0] bus active PCI_CLKI to ISAOE# valid XTALO to GPIOCS# valid XTALO to ALE valid XTALO to MEMW# valid XTALO to MEMR# valid XTALO to SMEMW# valid XTALO to SMEMR# valid XTALO to IOR# valid XTALO to IOW# valid Min Max 60 60 62 35 28 60 62 50 50 50 50 50 50 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns 34/48 Issue 1.7 - February 8, 2000 MECHANICAL DATA 5. MECHANICAL DATA 5.1 388-Pin Package Dimension The pin numbering for the STPC 388-pin Plastic BGA package is shown in Figure 5-1. Figure 5-1. 388-Pin PBGA Package - Top View Dimensions are shown in Figure 5-2, Table 5-1 and Figure 5-3, Table 5-2. 1 2 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Issue 1.7 - February 8, 2000 35/48 M ECHANICAL DATA Figure 5-2. 388-pin PBGA Package - PCB Dimensions A1 Ball Pad Corner A B A E F D Detail CG Table 5-1. 388-pin PBGA Package - PCB Dimensions Symbols A B C D E F G Min 34.95 1.22 0.58 1.57 0.15 0.05 0.75 mm Typ 35.00 1.27 0.63 1.62 0.20 0.10 0.80 Max 35.05 1.32 0.68 1.67 0.25 0.15 0.85 Min 1.375 0.048 0.023 0.062 0.006 0.002 0.030 inches Typ 1.378 0.050 0.025 0.064 0.008 0.004 0.032 Max 1.380 0.052 0.027 0.066 0.001 0.006 0.034 36/48 Issue 1.7 - February 8, 2000 MECHANICAL DATA Figure 5-3. 388-pin PBGA Package - Dimensions C F D E Solderball Solderball after collapse B A G Table 5-2. 388-pin PBGA Package - Dimensions Symbols A B C D E F G Min 0.50 1.12 0.60 0.52 0.63 0.60 mm Typ 0.56 1.17 0.76 0.53 0.78 0.63 30.0 Max 0.62 1.22 0.92 0.54 0.93 0.66 Min 0.020 0.044 0.024 0.020 0.025 0.024 inches Typ 0.022 0.046 0.030 0.021 0.031 0.025 11.8 Max 0.024 0.048 0.036 0.022 0.037 0.026 Issue 1.7 - February 8, 2000 37/48 M ECHANICAL DATA 5.2 388-Pin Package thermal data 388-pin PBGA package has a Power Dissipation Capability of 4.5W which increases to 6W when used with a Heatsink. Figure 5-4. 388-Pin PBGA structure Structure in shown in Figure 5-4. Thermal dissipation options are illustrated in Figure 5-5 and Figure 5-6. Signal layers Power & Ground layers Thermal balls Figure 5-5. Thermal dissipation without heatsink Board Ambient Rca Case Rjc Junction Rjb Board Rba Ambient Board 8.5 6 Junction Board dimensions: - 10.2 cm x 12.7 cm - 4 layers (2 for signals, 1 GND, 1VCC) 6 Case 125 The PBGA is centered on board There are no other devices 1 via pad per ground ball (8-mil wire) 40% copper on signal layers Copper thickness: - 17µm for internal layers - 34µm for external layers Airflow = 0 Board temperature taken at the center balls Ambient Rja = 13 °C/W 38/48 Issue 1.7 - February 8, 2000 MECHANICAL DATA Figure 5-6. Thermal dissipation with heatsink Board Ambient Rca Case Rjc Junction Rjb Board Rba Ambient Board 8.5 3 Junction Board dimensions: - 10.2 cm x 12.7 cm - 4 layers (2 for signals, 1 GND, 1VCC) 6 Case 50 The PBGA is centered on board There are no other devices 1 via pad per ground ball (8-mil wire) 40% copper on signal layers Copper thickness: - 17µm for internal layers - 34µm for external layers Airflow = 0 Board temperature taken at the center balls Heat sink is 11.1°C/W Ambient Rja = 9.5 ° C/W Issue 1.7 - February 8, 2000 39/48 M ECHANICAL DATA 40/48 Issue 1.7 - February 8, 2000 B OARD LAYOUT 6. BOARD LAYOUT 6.1 THERMAL DISSIPATION Thermal dissipation of the STPC depends mainly on supply voltage. As a result, when the system does not need to work at 3.3V, it may be to reduce the voltage to 3.15V for example. This may save few 100’s of mW. The second area that can be concidered is unused interfaces and functions. Depending on the application, some input signals can be grounded, and some blocks not powered or shutdown. Clock speed dynamic adjustment is also a solution that can be used along with the integrated power management unit. The standard way to route thermal balls to internal ground layer implements only one via pad for each ball pad, connected using a 8-mil wire. With such configuration the Plastic BGA 388 package dissipates 90% of the heat through the ground balls, and especially the central thermal balls which are directly connected to the die, the remaining 10% is dissipated through the case. Adding a heat sink reduces this value to 85%. As a result, some basic rules have to be applied when routing the STPC in order to avoid thermal problems. First of all, the whole ground layer acts as a heat sink and ground balls must be directly connected to it as illustrated in Figure 6-1. If one ground layer is not enough, a second ground plane may be added on the solder side. Figure 6-1. Ground routing Pad for ground ball Thru hole to ground layer Top L ayer : Sign Grou als nd la yer Powe r laye r Botto mLa yer : signa ls + l ocal g round layer (if ne eded ) Note: For better visibility, ground balls are not all routed. Issue 1.7 - February 8, 2000 41/48 BOARD LAYOUT When considering thermal dissipation, the most important - and not the more obvious - part of the layout is the connection between the ground balls and the ground layer. A 1-wire connection is shown in Figure 6-2. The use of a 8-mil wire results in a thermal resistance of 105°C/W assuming copper is used (418 W/ m.°K). This high value is due to the thickness (34 µm) of the copper on the external side of the PCB. Considering only the central matrix of 36 thermal balls and one via for each ball, the global thermal resistance is 2.9°C/W. This can be easily improved by using four 10 mil wires to connect to the four vias around the ground pad link as in Figure 6-3. This gives a total of 49 vias and a global resistance for the 36 thermal balls of 0.6°C/W. The use of a ground plane like in Figure 6-4 is even better. To avoid solder wicking over to the via pads during soldering, it is important to have a solder mask of 4 mil around the pad (NSMD pad), this gives a diameter of 33 mil for a 25 mil ground pad. To obtain the optimum ground layout, place the vias directly under the ball pads. In this case no local boar d distortion is tolerated. The thickness of the copper on PCB layers is typically 34 µm for external layers and 17 µm for internal layers. This means thermal dissipation is not good and temperature of the board is concentrated around the devices and falls quickly with increased distance. When it is possible to place a metal layer inside the PCB, this improves dramatically the heat spreading and hence thermal dissipation of the board. Figure 6-2. Recommended 1-wire ground pad layout Pad for ground ball (diameter = 25 mil) Solder Mask (4 mil) Connection Wire (width = 10 mil) Via (diameter = 24 mil) il . 34 Figure 6-3. Recommended 4-wire ground pad layout 5 m Hole to ground layer (diameter = 12 mil) 1 mil = 0.0254 mm 4 via pads for each ground ball 42/48 Issue 1.7 - February 8, 2000 B OARD LAYOUT Figure 6-4. Optimum layout for central ground ball Clearance = 6mil External diameter = 37 mil Via to Ground layer hole diameter = 14 mil Solder mask diameter = 33 mil Pad for ground ball diameter = 25 mil connections = 10 mil The PBGA Package also dissipates heat through peripheral ground balls. When a heat sink is placed on the device, heat is more uniformely spread throughout the moulding increasing heat dissipation through the peripheral ground balls. The more via pads are connected to each ground ball, the more heat is dissipated . The only limitation is the risk of lossing routing channels. Figure 6-5 shows a routing with a good trade off between thermal dissipation and number of routing channels. Figure 6-5. Global ground layout for good thermal dissipation Via to ground layer Ground pad Issue 1.7 - February 8, 2000 43/48 BOARD LAYOUT Figure 6-6. Bottom side layout and decoupling Ground plane for thermal dissipation Via to ground layer A local ground plane on opposite side of the board as shown in Figure 6-6 improves thermal dissipation. It is used to connect decoupling capacitances but can also be used for connection to a heat sink or to the system’s metal box for better dissipation. This possibility of using the whole system’s box for thermal dissipation is very usefull in case of high temperature inside the system and low temperature outside. In that case, both sides of the PBGA should be thermally connected to the metal chassis in order to propagate the heat through the metal. Figure 6-7 illustrates such an implementation. Figure 6-7. Use of metal plate for thermal dissipation Die Board Metal planes Thermal conductor 44/48 Issue 1.7 - February 8, 2000 B OARD LAYOUT 6.2 HIGH SPEED SIGNALS Some Interfaces of the STPC run at high speed and have to be carefully routed or even shielded. Here is the list of these interfaces, in decreasing speed order: - Memory Interface. - Graphics and video interfaces - PCI bus - 14MHz oscillator stage Figure 6-8. Shielding signals All the clocks have to be routed first and shielded for speeds of 27MHz or more. The high speed signals have the same contrainsts as some of the memory interface control signals. The next interfaces to be routed are Memory, Video/graphics, and PCI. All the analog noise sensitive signals have to be routed in a separate area and hence can be routed indepedently. ground ring shielded signal line ground pad ground pad shielded signal lines Issue 1.7 - February 8, 2000 45/48 ORDERING DATA 7. ORDERING DATA 7.1 ORDERING CODES ST STMicroelectronics Prefix Product Family PC: PC Compatible Product ID D01: Client Core Speed 66: 66MHz 75: 75MHz Package BT: 388 Overmoulded BGA Temperature Range PC D01 66 BT C 3 C: Commercial Case Temperature (Tcase) = 0°C to +100°C I: Industrial Case Temperature (Tcase) = -40° C to +100°C A: Auatomotive Case Temperature (Tcase) = -40° C to +115°C Operating Voltage 3 : 3.3V ± 0.3V 46/48 Issue 1.7 - February 8, 2000 ORDERING DATA 7.2 AVAILABLE PART NUMBERS Part Number STPCD0166BTC3 STPCD0175BTC3 STPCD0166BTI3 STPCD0175BTI3 STPCD0166BTA3 Core Frequency ( MHz ) 66 75 66 75 66 CPU Mode ( DX / DX2 ) DX DX DX DX DX Tcase Range ( °C ) 0°C to +100° C -40°C to +100°C -40°C to +115°C 3.3V ± 0.3V Operating Voltage (V ) 7.3 CUSTOMER SERVICE More information STMicroelectronics www.ST.com/STPC. is available on the internet site http:// Any specific questions are to be addressed directly to the local ST Sales Office. Issue 1.7 - February 8, 2000 47/48 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express writt en approval of STMicroelectronics. © 2000 STMicroelectronics - All Rights Reserved The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands - Singapore Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 48 Issue 1.7