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STPIC6A259MTR

STPIC6A259MTR

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOIC24_300MIL

  • 描述:

    IC LATCH POWER LOGIC 24 SOIC

  • 数据手册
  • 价格&库存
STPIC6A259MTR 数据手册
STPIC6A259 POWER LOGIC 8-BIT ADDRESSABLE LATCH PRELIMINARY DATA ■ ■ ■ ■ ■ ■ ■ LOW RDS(on): 1Ω TYP OUTPUT SHORT-CIRCUIT PROTECTION 75mJ AVAILANCHE ENERGY EIGHT 350mA DMOS OUTPUTS 50V SWITCHING CAPABILITY FOUR DISTINCT FUNCTION MODES LOW POWER CONSUMPTION DESCRIPTION This power logic 8-bit addressable latch controls open-drain DMOS transistor outputs and is designed for general-purpose storage applications in digital systems. Specific uses include working registers, serial-holding registers, and decoders or demultiplexers. This is a multifunctional device capable of operating as eight addressable latches or an 8-line demultiplexer with active-low DMOS outputs. Each open-drain DMOS transistor features an independent chopping current-limiting circuit to prevent damage in the case of a short circuit. Four distinct modes of operation are selectable by controlling the clear (CLR) and enable (G) inputs and enumerated in the function table. In the addressable-latch mode, data at the data-in (D) terminal is written into the addressed latch. The addressed DMOS-transistor output inverts the data input with all unadressed DMOS-transistor output remaining in their previuous state. In the MOS-transistor outputs remain in their previous states and are unaffected by the data or address inputs. To eliminate the possibility of entering erroneus data in the latch, enable G should be ) s ( ct u d o r P e t e l o SOP c u d ) s t( held high (inactive) while the address lines are changing. In the 8-line demoultiplexing mode, the addressed output is inverted with respectto the D input and all other output are high. In the clear mode, all outputs are high and unaffected by the address and data inputs. Separate power ground (PGND) and logic ground (LGND) terminals are providied to facilitate maximum system flexibility. All PGND terminals are interally connected, and each pGND terminal must be externally connected to the power system ground in order to minimize parasitic impedance. A single-point connection between LGND and PGND must be made externally in a manner that reduces crosstalk between the logi and load circuits. The STPIC6A259 is offered in a termally enhanced SO-24 package. The STPIC6A259 is characterized for operation over the operating case temperature range -40°C to 125°C. e t le o r P o s b O - ORDERING CODES s b O Type Package Comments STPIC6A259M STPIC6A259MTR SO-24 Batwing (Tube) SO-24 Batwing (Tape & Reel) 50parts per tube / 20tube per box 2500 parts per reel March 2001 1/13 This is preliminary information on a new product now in development are or undergoing evaluation. Details subject to change without notice. STPIC6A259 LOGIC SYMBOL AND PIN CONFIGURATION c u d FUNCTIONAL TABLE INPUTS CLR G H L H L Qio H L L H Qio H H X Qio Qio L L L L L H H L X L H H H H H r P e o s b O - Addressable Latch Memory ) s ( ct u d o 2/13 e t le SELECT INPUTS FUNCTION 8-Line Demultiplexer Clear INPUT AND OUTPUT EQUIVALENT CIRCUITS s b O o r P FUNCTIONAL TABLE OUTPUT OF EACH ADDRESSED OTHER D DRAIN DRAIN t e l o ) s t( S2 L L L L H H H H DRAIN ADDRESSED S1 S0 L L H H L L H H L H L H L H L H 0 1 2 3 4 5 6 7 STPIC6A259 ABSOLUTE MAXIMUM RATINGS Symbol VCC VI Parameter Logic Supply Voltage (See Note 2) Logic Input Voltage Range Value Unit 7 V -0.3 to 7 V VDS Power DMOS Drain to Source Voltage (See Note 2) 50 V IDS Continuous Source to Drain Diode Anode Current 1 A IDS Pulsed Source to Drain Diode Anode Current (See Note 3) 2 A ID 1.1 A ID Pulsed Drain Current, Each Output, All Output ON (TC=25°C) Continuous Current, Each Output, All Output ON (TC=25°C) 350 mA ID Peak Drain Current Single Output (TC=25°C) (See Note 3) 1.1 A EAS Single Pulse Avalanche Energy (See Note 6) 75 mJ IAS Avalanche Current (See Note 4) 600 mA Pd Continuous total dissipation (TC ≤ 25°C) 1750 mW Pd 350 mW TJ Continuous total dissipation (TC = 125°C) Operating Virtual Junction Temperature Range -40 to +150 TC Operating Case Temperature Range -40 to +125 Tstg Storage Temperature Range -65 to +150 TL Lead Temperature 1.6mm (1/16inch) from case for 10 seconds °C uc od 260 r P e t le ) s t( °C °C °C Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these condition is not implied. THERMAL DATA Symbol Parameter Rthj-case Thermal Resistance Junction-case Rthj-amb Thermal Resistance Junction-ambient ) s ( ct RECOMMENDED OPERATING CONDITIONS Symbol u d o o s b O - Parameter Unit 10 °C/W 50 °C/W Min. Max. Unit 4.5 5.5 V VCC Logic Supply Voltage VIH High Level Input Voltage 0.85VCC VCC V VIL Low Level Input Voltage 0 0.15VCC V IDP Pulse Drain Output Current (TC=25°C, VCC=5V) (see note 3, 5) -1.8 0.6 tsu Set-up Time, D High Before G ↑ (see Figure 2) th Hold Time, D High Before G ↑ (see Figure 2) 5 ns Pulse Duration (see Figure 2) 15 ns Operating Case Temperature -40 t e l o s b O tW r P e TC 10 A ns 125 °C 3/13 STPIC6A259 DC CHARACTERISTICS (V CC=5V, TC= 25°C, unless otherwise specified.) Symbol Parameter Test Conditions Min. V(BR)DSX Drain-to-Source breakdown ID = 1mA Voltage VSD Source-to-Drain Diode IF = 350 mA (See Note 3) Forward Voltage IIH High Level Input Current VI = VCC IIL Low Level Input Current VI = 0 ICC Logic Supply Current IO = 0 IOK Output Current at Which Chopping Starts TC = 25°C (See 3, 4) VDS(on) = 0.5V VCC = 5V (See Note 5, 6, 7) VDS = 40V I(nom) ID Nominal Current Off-State Drain Current RDS(on) Termination Resistance (See Note 5, 6 and figg. 9, 10) Typ. Max. 50 V 0.8 Note 3 and Figg. 0.6 Unit 1.1 V 1 µA -1 µA 0.5 5 mA 0.8 1.1 A I(nom) = ID TC=85°C 350 mA TC=25°C 0.1 1 µA VDS = 40V TC=125°C 0.2 5 µA ID = 350mA TC=25°C 1 1.5 Ω ID = 350mA TC=125°C 1.7 2.5 Ω Max. Unit c u d o r P ) s t( SWITCHING CHARACTERISTICS (VCC=5V, TC= 25°C, unless otherwise specified.) Symbol tPHL Parameter tr Propagation Dealy Time, High to Low Level Output from D Propagation Dealy Time, Low to High Level Output from D Rise Time, Drain Output tf Fall Time, Drain Output ta Reverse Recovery Current Rise Time Reverse Recovery Time tPLH trr Test Conditions Min. e t le CL = 30pF ID = 350mA (See Figg. 1, 2, 11) so u d o ) s ( ct b O - IF = 350mA di/dt = 20A/µs (See Note 5, 6 and Fig. 5) Typ. 30 ns 125 ns 60 ns 30 ns 100 ns 300 ns Note 1: All Voltage valuea are with respect to LGND and PGND Note 2: Each power DMOS source is internally connected to GND Note 3: Pulse duration ≤ 100ms and duty cycle ≤ 2% Note 4: Drain Supply Voltage = 15V, starting junction temperature (TJS) = 25°C. L = 210µH and IAS = 600mA (See Fig. 6) Note 5: Technique should limit TJ - TC to 10°C maximum Note 6: These parameters are measured with voltage sensing contacts separate from the current-carrying contacts. Note 7: Nominal Current is defined for a consistent comparison between devices from different sources. It is the current that produces a voltage drop of 0.5V at TC = 85°C. r P e t e l o s b O 4/13 STPIC6A259 LOGIC DIAGRAM c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 5/13 STPIC6A259 TYPICAL OPERATION MODE TEST CIRCUITS TYPICAL OPERATION MODE WAVEFORMS c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o NOTE: A) The word generator has the following characteristics: tr ≤ 10ns, tf ≤ 10ns, tW = 300ns, pulse repetition rate (PRR) = 5KHz, Z O = 50Ω B) CL includes probe and jig capacitance. s b O 6/13 STPIC6A259 TYPICAL OPERATION MODE TEST CIRCUITS SWITCHING TIME WAVEFORM c u d e t le ) s ( ct ) s t( o r P o s b O - u d o INPUT SETUP AND HOLD WAVEFORM r P e t e l o s b O NOTE: A) The word generator has the following characteristics: tr ≤ 10ns, tf ≤ 10ns, tW = 300ns, pulse repetition rate (PRR) = 5KHz, Z O = 50Ω B) CL includes probe and jig capacitance. 7/13 STPIC6A259 REVERSE RECOVERY CURRENT TEST CIRCUITS c u d SOURCE DRAIN DIODE WAVEFORM e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O NOTE: A) The VGG amplitude and RG are adjusted for di/dt = 20A/µs. A V GG double-pulse trainn is used to set IF = 0.35A. where t 1 = 10µs, t2 = 7µs and t3 = 3µs B) The Drain terminal under test is connected to the TPK test point. All other terminals are connected together and connected to the TPA test point. C) IRM = maximum recovery current. 8/13 STPIC6A259 SINGLE PULSE AVALANCHE ENERGY TEST CIRCUITS SINGLE PULSE AVALANCHE ENERGY WAVEFORM c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o NOTE: A) The word generator has the following characteristics: tr ≤ 10ns, tf ≤ 10ns, ZO = 50Ω B) Input pulse duration, tW is increased until peak current IAS = 600 mA. Energy test level is defined as EAS = (IAS x V (BR)DSX x tAV )/2 = 75mJ. s b O 9/13 STPIC6A259 TYPICAL PERFORMANCE CHARACTERISTICS (unless otherwise specified Tj = 25°C) Figure 1 : Maximum Continuous Drain Current vs Number of Outputs Conducting Simultaneously Figure 2 : Static Drain-Source ON-State Resistance vs Drain Current Figure 4 : Static Drain-Source ON-State Resistance vs Logic Supply Voltage c u d Figure 5 : Chopping Mode Characteristics e t le ) s ( ct u d o r P e Figure 3 : MaximumPeak Drain Current vs Number of Outputs Conducting Simultaneously t e l o s b O 10/13 ) s t( o r P o s b O - Figure 6 : Output Current vs Case Temperature STPIC6A259 Figure 7 : Switching Time vs Case Temperature Figure 8 : Switching Time vs Case Temperature c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 11/13 STPIC6A259 SO-24 MECHANICAL DATA mm DIM. MIN. inch TYP. MAX. A MIN. TYP. MAX. 2.65 a1 0.10 0.104 0.20 a2 0.004 0.007 2.45 0.096 b 0.35 0.49 0.013 0.019 b1 0.23 0.32 0.009 0.012 C 0.50 0.020 c1 45 (typ.) D 15.20 15.60 0.598 E 10.00 10.65 0.393 e 1.27 e3 13.97 ) s t( 0.614 c u d 0.05 o r P 0.420 0.55 F 7.40 7.60 L 0.50 1.27 S 0.291 e t le 0.19 8 (max.) o s b O - 0.299 0.050 r P e t e l o C e3 b1 s E D 24 13 1 12 F s b O e a1 u d o b c1 A ) s ( ct a2 L P013T 12/13 STPIC6A259 c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. © The ST logo is a registered trademark of STMicroelectronics © 2001 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom © http://www.st.com 13/13
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