STPS0530Z

STPS0530Z Schottky rectifier Datasheet - production data Description Single Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. K A Packaged in SOD-123, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the small size of the package this device fits GSM and PCMCIA requirements. SOD-123 STPS0503Z Table 1. Device summary IF(AV) 0.5 A VRRM 30 V VF(max) 0.33 V Features • Very small conduction losses • Negligible switching losses • Extremely fast switching April 2014 This is information on a product in full production. DocID9383 Rev 3 1/7 www.st.com Characteristics 1 STPS0530Z Characteristics Table 2. Absolute ratings (limiting values) Symbol Value Unit VRRM Repetitive peak reverse voltage 30 V IF(RMS) Forward rms current 2 A IF(AV) Average forward current δ = 0.5 Ta = 55 °C 0.5 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 5.5 A dV/dt Critical rate of rise of reverse voltage 10000 V/µs -65 to +150 °C -40 to +150 °C 260 °C Value Unit (1) °C/W Tstg 1. Parameter Storage temperature range (1) Tj Operating junction temperature range TL Maximum temperature for soldering during 10 s dPtot --------------dTj < 1 -------------------------Rth ( j – a ) condition to avoid thermal runaway for a diode on its own heatsink Table 3. Thermal resistance Symbol Rth(j-a) Parameter Junction to ambient 340 1. Copper area on PCB S = 2.5 mm2 Table 4. Static electrical characteristics Symbol Parameter Test conditions Tj = 25 °C IR(1) Reverse leakage current Tj = 125 °C Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Typ. VR = 15 V 3 VR = VRRM 9 0.20 12 µA 5 mA 130 µA 21 mA 0.22 V 0.43 IF = 0.5 A 0.31 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the maximum conduction losses use the following equation: P = 0.23 x IF(AV) + 0.18 IF2(RMS) DocID9383 Rev 3 Unit 0.375 IF = 0.1 A 1. Pulse test: tp = 5 ms, δ < 2% 2/7 Max. 0.33 STPS0530Z Characteristics Figure 1. Conduction losses versus average current Figure 2. Average forward current versus ambient temperature (δ = 0.5) PF(AV)(W) IF(AV)(A) 0.22 δ = 0.1 δ = 0.05 0.20 δ = 0.2 0.55 δ = 0.5 0.50 0.18 0.45 0.16 0.40 δ=1 0.14 0.35 0.12 0.30 0.10 0.25 0.08 0.20 Rth(j-a)=340°C/W S=2.5mm² 0.15 0.06 T 0.10 0.04 0.02 IF(AV)(A) 0.0 0.1 0.2 0.05 δ=tp/T 0.00 0.3 0.4 tp 0.5 Tamb(°C) 0.00 0.6 Figure 3. Non repetitive surge peak forward current versus overload duration (maximum values) 0 25 50 75 100 125 Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration IM(A) Zth(j-a)/Rth(j-a) 4.0 1.0E+00 δ = 0.5 3.5 δ = 0.2 3.0 δ = 0.1 1.0E-01 2.5 2.0 Tamb=25°C 1.5 1.0E-02 Tamb=50°C 1.0 T Single pulse IM Tamb=75°C 0.5 t tp(s) t(s) δ=0.5 0.0 δ=tp/T 1.0E-03 1.E-03 1.E-02 1.E-01 1.E+00 Figure 5. Reverse leakage current versus reverse voltage applied (typical values) 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 tp 1.E+02 Figure 6. Reverse leakage current versus junction temperature (typical values) IR(mA) IR(mA) 1.E+01 1.E+01 VR=30V Tj=125°C 1.E+00 1.E+00 Tj=100°C Tj=75°C 1.E-01 1.E-01 Tj=50°C 1.E-02 1.E-02 Tj=25°C Tj(°C) VR(V) 1.E-03 1.E-03 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 0 DocID9383 Rev 3 25 50 75 100 125 3/7 7 Characteristics STPS0530Z Figure 7. Junction capacitance versus reverse voltage applied (typical values) Figure 8. Forward voltage drop versus forward current IFM(A) C(pF) 2.0 1000 F=1MHz VOSC=30mVRMS Tj=25°C 1.8 Tj=125°C (Maximum values) 1.6 1.4 1.2 Tj=25°C (Maximum values) Tj=125°C (Typical values) 1.0 100 0.8 0.6 0.4 0.2 VR(V) 10 1 10 VFM(V) 0.0 0.00 100 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 Figure 9. Thermal resistance junction to ambient versus copper surface under each lead (typical values) Rth(j-a)(°C/W) 350 Epoxy printed circuit board FR4, copper thickness = 35 µm 300 250 200 150 100 50 SCu(mm²) 0 0 4/7 10 20 30 40 50 60 DocID9383 Rev 3 70 80 90 100 STPS0530Z 2 Package information Package information • Epoxy meets UL94, V0. • Band indicates cathode. In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SOD-123 dimensions Dimensions H Ref A2 A1 Millimeters Min. Max. Inches Min. Max. b A E D A c G 1.45 0.057 A1 0 0.1 0 0.004 A2 0.85 1.35 0.033 0.053 b 0.55 Typ. 0.022 Typ. c 0.15 Typ. 0.039 Typ. D 2.55 2.85 0.1 0.112 E 1.4 1.7 0.055 0.067 G 0.25 H 3.55 0.01 3.75 0.14 0.1148 Figure 10. Footprint - dimensions in millimeters (inches) 4.00 (0.157) 0.57 (0.022) 0.65 (0.026) 2.70 (0.106) DocID9383 Rev 3 0.65 (0.026) 5/7 7 Ordering information 3 STPS0530Z Ordering information Table 6. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STPS0530Z Z53 SOD-123 0.01 g 3000 Tape and reel Revision history Table 7. Document revision history 6/7 Date Revision Changes Mar-2003 1A 17-Oct-2006 2 Reformated to current standards. Updated maximum junction temperatures to 150 °C and updated package illustration to show cathode bar on page 1 23-Apr-2014 3 Updated Tj max to Tj range in Table 2. Initial release. 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