STPS0540Z_02

® STPS0540Z / STPS0560Z SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM VF (max) 0.5 A 40 / 60V 0.40 / 0.50V FEATURES AND BENEFITS s s s Very small conduction losses Negligible switching losses Extremely fast switching DESCRIPTION Single Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packages in SOD-123, these devices are intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the small size of the package these devices fit GSM and PCMCIA requirements. ABSOLUTE RATINGS (limiting values) Value Symbol VRRM IF(RMS) IF(AV) IFSM dV/dt Tstg Tj TL *: Parameter Repetitive peak reverse voltage RMS forward current Average forward current δ=0.5 Surge non repetitive forward current Critical rate of rise of reverse voltage Storage temperature range Maximum operating junction temperature * Maximum temperature for soldering during 10s STPS0540Z STPS0560Z Ta= 60°C Ta= 40°C tp=10ms sinusoidal 40 2 0.5 5.5 10000 - 65 to + 150 150 260 STPS 0540Z 0560Z 60 V A A A V/µs °C °C °C Unit SOD-123 dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) January 2002 - Ed : 2B 1/5 STPS0540Z / STPS0560Z THERMAL RESISTANCE Symbol Rth (j-a) Junction to ambient (*) Parameter Value 340 Unit °C/W (*) Mounted on epoxy board. STATIC ELECTRICAL CHARACTERISTICS Value Symbol Parameter Tests conditions STPS0540Z typ. IR * Reverse leakage current Forward voltage drop Tj=25°C T =100°C Tj=25°C Tj=100°C Tj=25°C Tj=100°C Pulse test : * tp = 5 ms, δ < 2% ** tp = 380 µs, δ < 2% STPS0560Z typ. max. 50 1 4 0.53 0.44 0.50 0.66 0.58 0.65 Unit max. 40 VR = VRRM 1.5 IF = 0.5 A 0.35 IF = 1 A 0.45 µA mA V 5 0.50 0.40 0.55 0.51 VF ** To evaluate the maximum conduction losses use the following equation : STPS0540Z: P = 0.29 x IF(AV) + 0.22 x IF2(RMS) STPS0560Z: P = 0.35 x IF(AV) + 0.3 x IF2(RMS) 2/5 STPS0540Z / STPS0560Z Fig. 1-1: Average forward power dissipation versus average forward current.(STPS0540Z) PF(av)(W) 0.30 δ = 0.05 δ = 0.1 δ = 0.2 Fig. 1-2: Average forward power dissipation versus average forward current.(STPS0560Z) PF(av)(W) 0.35 0.25 0.20 0.15 0.10 0.05 IF(av) (A) 0.00 0.0 0.1 0.2 0.3 0.4 δ = 0.5 0.30 0.25 δ=1 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 δ=1 0.20 0.15 T 0.10 0.05 tp T δ=tp/T IF(av) (A) 0.1 0.2 0.3 0.4 0.5 0.6 0.00 0.0 δ=tp/T tp 0.5 0.6 Fig. 2: Average forward current versus ambient temperature (δ = 0.5). IF(av)(A) 0.6 0.5 STPS0540Z Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values). IM(A) 4.0 Ta = 25°C 3.5 3.0 2.5 2.0 1.5 T STPS0560Z STPS0540Z 0.4 0.3 0.2 0.1 0.0 δ=tp/T tp STPS0560Z 1.0 IM t Tamb(°C) 50 75 100 125 0.5 0.0 1E-3 δ=0.5 t(s) 1E-2 1E-1 1E+0 0 25 Fig. 4: Relative variation of thermal impedance junction to ambient versus pulse duration (Epoxy printed circuit board FR4 with recommended pad layout). Zth(j-a)/Rth(j-a) 1E+0 δ = 0.5 δ = 0.2 Fig. 5-1: Reverse leakage current versus reverse voltage applied (typical values).(STPS0540Z) IR(mA) 5E+1 1E+1 1E+0 1E-1 Tj=125°C 1E-1 δ = 0.1 Tj=100°C Tj=70°C 1E-2 Single pulse 1E-2 T Tj=25°C tp(s) 1E-3 1E-3 1E-2 1E-1 1E+0 1E-3 δ=tp/T tp VR(V) 1E-4 0 5 10 15 20 25 30 35 40 1E+1 1E+2 3/5 STPS0540Z / STPS0560Z Fig. 5-2: Reverse leakage current versus reverse voltage applied (typical values).(STPS0560Z) IR(mA) 5E+1 1E+1 1E+0 1E-1 1E-2 Tj=25°C Tj=125°C Fig. 6: Reverse leakage current versus junction temperature (typical values). IR[Tj] / IR[Tj=25°C] 1E+3 VR=VRRM Tj=100°C 1E+2 1E+1 1E+0 Tj=70°C 1E-3 VR(V) 1E-4 0 5 10 15 20 25 30 35 40 45 50 55 60 1E-1 0 25 50 Tj(°C) 75 100 125 Fig. 7: Junction capacitance versus reverse voltage applied (typical values). C(pF) 200 F=1MHz Tj=25°C Fig. 8-1: Forward voltage drop versus forward current (maximum values).(STPS0540Z) IFM(A) 5E+0 1E+0 Tj=100°C Typical values 100 50 STPS0540Z Tj=100°C STPS0560Z 1E-1 Tj=25°C 20 VR(V) 10 1 2 5 10 20 40 60 1E-2 VFM(V) 1E-3 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 Fig. 8-2: Forward voltage drop versus forward current (maximum values).(STPS0560Z) Fig. 9: Variation of thermal resistance junction to ambient versus copper surface under each lead (Printed circuit board FR4, e(Cu) = 35µm). Rth(j-a) (°C/W) 350 IFM(A) 5E+0 1E+0 Tj=100°C Tj=100°C Typical values P=0.25W 300 250 Tj=25°C 1E-1 200 1E-2 VFM(V) 1E-3 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 150 S(Cu) (mm²) 100 0 20 40 60 80 100 4/5 STPS0540Z / STPS0560Z PACKAGE MECHANICAL DATA SOD-123 H b E A2 A1 DIMENSIONS REF. Millimeters Min. A A1 0 0.85 A2 b c D E G H Max. 1.45 0.1 1.35 0 0.033 Inches Min. Max. 0.057 0.004 0.053 D c A 0.55 Typ. 0.15 Typ. 2.55 1.4 0.25 3.55 3.95 2.85 1.7 0.022 Typ. 0.039 Typ. 0.1 0.055 0.01 0.14 0.156 0.112 0.067 G FOOTPRINT (in millimeters) 4.45 0.65 0.97 MARKING Type STPS0540Z STPS0560Z s 2.51 0.97 Marking Z54 Z56 Package SOD-123 SOD-123 Weight 0.01 g 0.01 g Base qty 3000 3000 Delivery mode Tape & reel Tape & reel s Epoxy meets UL94, V0. Band indicates cathode. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2002 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5