STPS10150C

STPS10150C High voltage power Schottky rectifier Main product characteristics IF(AV) VRRM Tj VF(max) 2x5A 150 V 175° C 0.75 V A1 K A2 A2 K A1 TO-220FPAB STPS10150CFP K Features and benefits ■ ■ ■ ■ ■ HIgh junction temperature capability Good trade off between leakage current and forward voltage drop Low leakage current Avalanche capability specified Insulated package – TO-220FPAB Insulating voltage = 2000 V Typical package capacitance 12 pF A2 A1 A1 A2 K D2PAK STPS10150CG TO-220AB STPS10150CT Order Codes Part Number STPS10150CT STPS10150CG STPS10150CG-TR STPS10150CFP Marking STPS10150CT STPS10150CG STPS10150CG STPS10150CFP Description Dual center tap schottky rectifier designed for high frequency Switched Mode Power Supplies. Table 1. Symbol VRRM IF(RMS) IF(AV) IFSM PARM Tstg Tj dV/dt 1. dPtot --------------dTj Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage RMS forward voltage Average forward current δ = 0.5 TO-220AB D2PAK TO-220FPAB TC = 155° C TC = 145° C Per diode Per device Value 150 10 5 10 120 3100 -65 to + 175 (1) Unit V A A Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature Critical rate of rise of reverse voltage tp = 10 ms sinusoidal tp = 1 µs Tj = 25° C A W °C °C V/µs 175 10000 1 < -------------------------- condition to avoid thermal runaway for a diode on its own heatsink Rth ( j – a ) June 2006 Rev 6 1/9 www.st.com 9 Characteristics STPS10150C 1 Table 2. Symbol Characteristics Thermal resistance Parameter TO-220AB, D2PAK Per diode TO-220FPAB Rth(j-c) Junction to case TO-220AB, D2 PAK Total TO-220FPAB TO-220AB, D2PAK Rth(c) Coupling TO-220FPAB 3.7 5.3 0.7 7 2.4 ° C/W Value 4 Unit When the diodes 1 and 2 are used simultaneously: ∆Tj(diode 1) = P(diode 1) x Rth(j-l)(Per diode) + P(diode 2) x Rth(c) Table 3. Symbol IR (1) Static electrical characteristics (per diode) Parameter Reverse leakage current Tests conditions Tj = 25° C Tj = 125° C Tj = 25° C VR = VRRM Min. Typ Max. 2.0 0.40 2.0 0.92 IF = 5 A 0.69 0.75 V 1 IF = 1 0 A 0.79 0.85 Unit µA mA VF (2) Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C 1. tp = 5 ms, δ < 2% 2. tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.65 x IF(AV) + 0.02 IF2(RMS) Figure 1. Average forward power dissipation versus average forward current (per diode) Figure 2. Average forward current versus ambient temperature (δ = 0.5, per diode) PF(av)(W) 5.0 δ = 0.2 δ = 0.5 δ = 0.1 4.5 4.0 δ = 0.05 3.5 δ=1 3.0 2.5 2.0 1.5 T 1.0 0.5 IF(av) (A) tp δ=tp/T 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.0 5.0 4.0 3.0 IF(av)(A) Rth(j-a)=Rth(j-c) TO-220FPAB TO-220AB/D²PAK Rth(j-a)=15 °C/W 2.0 T 1.0 d=tp/T tp Tamb(°C) 50 75 100 125 150 175 0.0 0 25 2/9 STPS10150C Characteristics Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature 1 PARM (t p ) PARM (1µs) 1.2 1 PARM (t p ) PARM (25°C) 0.1 0.8 0.6 0.01 0.4 0.2 Tj (°C) 0.001 0.01 t p (µs) 0 0.1 1 10 100 1000 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration - maximum values, per diode (TO-220AB, D2PAK) Figure 6. Non repetitive surge peak forward current versus overload duration - maximum values, per diode (TO-220FPAB) IM(A) 80 70 60 50 40 30 20 10 0 1E-3 IM t 70 60 50 Tc=50°C IM(A) 40 30 20 10 IM t d =0.5 TC=50 °C Tc=75°C TC=75 °C TC=125 °C Tc=125°C δ=0.5 t(s) 1E-2 1E-1 1E+0 t(s) 0 1.E-3 1.E-2 1.E-1 1.E+0 Figure 7. Relative variation of thermal Figure 8. impedance junction to case versus pulse duration (TO-220AB, D2PAK) 1.0 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) 1.0 Zth(j-c)/Rth(j-c) Single pulse TO-220AB D²PAK Zth(j-c)/Rth(j-c) Single pulse TO-220FPAB 0.1 0.1 1.E-3 tp(s) 1.E-2 1.E-1 1.E+0 0.0 1.E-3 tp(s) 1.E-2 1.E-1 1.E+0 1.E+1 3/9 Characteristics STPS10150C Figure 9. Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 10. Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) IR(µA) 1E+5 1E+4 1E+3 1E+2 1E+1 1E+0 1E-1 1E-2 VR(V) 0 25 50 75 100 125 150 Tj=75°C Tj=175°C Tj=150°C Tj=125°C 1000 F=1 MHz VOSC=30 mVRMS Tj=25 °C 100 Tj=25°C VR(V) 10 1 10 100 1000 Figure 11. Forward voltage drop versus forward current (per diode) Figure 12. Thermal resistance, junction to ambient, versus copper surface under tab - Epoxy printed circuit board, ecu 35 µm (D2PAK only) 80 70 60 Rth(j-a) (°C/W) D²PAK 100 IFM(A) Tj=125 °C (Maximum values) 10 Tj=125 °C (Typical values) Tj=25 °C (Maximum values) 50 40 30 20 1 VFM(V) 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 10 0 SCU(cm²) 0 5 10 15 20 25 30 35 40 Figure 13. Thermal resistance, junction to ambient, versus copper surface under tab - Epoxy printed circuit board, ecu 35 µm (TO220FPAB only) 100 90 80 70 60 50 40 30 20 10 0 Rth(j-a) (°C/W) TO220FPAB SCU(cm²) 0 5 10 15 20 25 30 35 40 4/9 STPS10150C Package information 2 Package information Epoxy meets UL94, V0. Table 4. D2PAK Dimensions Dimensions Ref. Millimeters Min. A E L2 C2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 A A1 A2 B D 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 L L3 A1 B2 B G A2 2.0 MIN. FLAT ZONE V2 C R B2 C C2 D E G L L2 L3 M R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 14. D2PAK footprint dimensions (in mm) 16.90 10.30 1.30 5.08 3.70 8.90 5/9 Package information Table 5. TO-220AB Dimensions STPS10150C Dimensions Ref. Millimeters Min. A C H2 Dia L5 C L7 L6 L2 F2 F1 L9 L4 F G1 G M E D A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.066 0.202 0.106 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40 4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10 D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. 16.4 typ. 13 2.65 15.25 6.20 3.50 14 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/9 STPS10150C Table 6. TO-220FPAB Dimensions Package information Dimensions Ref. Millimeters Min. A H B Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 1.70 5.20 2.7 10.4 A B D 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 Dia L6 L2 L3 L5 D F1 L4 F2 L7 E F F1 F2 G G1 H L2 L3 E 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G L4 L5 L6 L7 Dia. In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information STPS10150C 3 Ordering information Ordering type STPS10150CT STPS10150CG STPS10150CG-TR STPS10150CFP Marking STPS10150CT STPS10150CG STPS10150CG STPS10150CFP Package TO-220AB D PAK D2PAK TO-220FPAB 2 Weight 2.20 g 1.48 g 1.48 g 2.0 g Base qty 50 50 1000 50 Delivery mode Tube Tube Tape and reel Tube 4 Revision history Date Jul-2003 19-Jun-2006 Revision 5B 6 Last update. Reformatted to current standard. Added ECOPACK statement. Added TO220FPAB. Description of Changes 8/9 STPS10150C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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