STPS10170C

STPS10170C High voltage power Schottky rectifier Main product characteristics IF(AV) VRRM Tj VF (typ) 2x5A 170 V 175° C 0.69 V A1 K A2 Features and benefits ■ ■ ■ ■ A2 A1 K TO-220AB STPS10170CT 2 A2 A1 K I PAK STPS10170CR High junction temperature capability Good trade-off between leakage current and forward voltage drop Low leakage current Avalanche capability specified K A2 A1 DPAK STPS10170CB K A2 A1 D2PAK STPS10170CG Description Dual centre tab Schottky rectifier designed for high frequency switch mode power supplies. Order codes Part Number STPS10170CT STPS10170CG STPS10170CG-TR STPS10170CR STPS10170CB STPS10170CB-TR Marking STPS10170CT STPS10170CG STPS10170CG STPS10170CR PS10170CB PS10170CB July 2006 Rev 1 www.st.com 1/10 Characteristics STPS10170C 1 Table 1. Symbol VRRM IF(RMS) IF(AV) IFSM PARM Tstg Tj dV/dt 1. Characteristics Absolute ratings (limiting values per diode, Tamb = 25° C unless otherwise specified) Parameter Repetitive peak reverse voltage RMS forward current Average forward current, δ = 0.5 Surge non repetitive forward current Relative peak avalanche power Storage temperature range Maximum operating junction temperature(1) Critical rate of rise of reverse voltage thermal runaway condition for a diode on its own heatsink Value 170 10 Per diode 5 Unit V A A Tc = 155° C tp = 10 ms Sinusoidal Tj = 25° C Total package 10 75 tp = 1µs A W °C °C V/µs 3100 -65 to + 175 175 10 000 dP tot 1 -------------- < ------------------------dT j R th ( j – a ) Table 2. Symbol Rth(j-c) Rth(c) Thermal parameters Parameter Per diode Junction to case Total Coupling 2.4 0.7 °C/W Value 4 Unit Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Tj = 25° C VR = VRRM Min. Typ Max. 10 10 0.92 IF = 5 A 0.69 0.75 V 1 IF = 10 A 0.79 0.85 Unit µA mA VF(2) Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 0.65 x IF(AV) + 0.02 x IF2(RMS) 2/10 STPS10170C Characteristics Figure 1. Conduction losses versus average Figure 2. forward current (per diode) Average forward current versus ambient temperature (δ = 0.5, per diode) PF(AV)(W) 5 δ=0.1 δ=0.2 δ=0.5 IF(AV)(A) 6.0 5.5 5.0 4.5 δ=1 Rth(j-a)=Rth(j-c) 4 δ=0.05 4.0 3.5 3.0 Rth(j-a)=15°C/W 3 2 T 2.5 2.0 1.5 1.0 T 1 IF(AV)(A) 0 1 2 3 4 δ=tp/T 5 tp 0.5 0.0 0 δ=tp/T 25 tp Tamb (°C) 50 75 100 125 150 175 0 6 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1µs) 1 1.2 1 PARM(tp) PARM(25°C) 0.1 0.8 0.6 0.4 0.2 0.01 0.001 0.01 0.1 1 tp(µs) 10 100 1000 Tj(°C) 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values, per diode) Figure 6. Relative variation of thermal impedance, junction to case versus pulse duration 80 70 60 50 IM(A) Zth(j-c)/Rth(j-c) 1.0 Single pulse TO-220AB DPAK I²PAK D²PAK TC=50°C 40 30 20 IM TC=75°C TC=125°C 10 0 1.E-03 t δ =0.5 t(s) tp(s) 0.1 1.E-01 1.E+00 1.E-02 1.E-03 1.E-02 1.E-01 1.E+00 3/10 Characteristics STPS10170C Figure 7. Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 8. Junction capacitance versus reverse voltage applied (typical values, per diode) F=1MHz VOSC=30mVRMS Tj=25°C 1.E+05 1.E+04 1.E+03 1.E+02 IR(µA) C(pF) 1000 Tj=175°C Tj=150°C Tj=125°C 100 1.E+01 1.E+00 1.E-01 Tj=25°C Tj=75°C 1.E-02 0 25 50 75 VR(V) 100 125 150 175 VR(V) 10 1 10 100 1000 Figure 9. Forward voltage drop versus forward current (per diode) Figure 10. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 µm - DPAK) Rth( -a) (°C/W) 100 DPAK 100.0 90.0 80.0 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0 IFM(A) 90 80 70 Tj=125°C (Maximum values) 60 50 Tj=125°C (Typical values) j 40 30 Tj=25°C (Maximum values) 20 VFM(V) 10 2.0 SCU(cm²) 0 5 10 15 20 25 30 35 40 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 Figure 11. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 µm - D2PAK) 80 70 60 50 40 30 20 10 SCU(cm²) 0 0 5 10 15 20 25 30 35 40 Rth(j-a) (°C/W) D²PAK 4/10 STPS10170C Package dimensions 2 Package dimensions Epoxy meets UL94, V0 Table 4. T0-220AB dimensions Dimensions Ref. Millimeters Min. H2 Dia L5 L7 L6 L2 F2 F1 L9 L4 F G1 G M E D C A Inches Min. Max. Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. 4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10 0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.044 0.066 0.194 0.202 0.094 0.106 10.40 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116 16.4 typ. 13 2.65 14 2.95 15.25 15.75 0.600 0.620 6.20 3.50 6.60 3.93 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151 2.6 typ. 3.75 3.85 5/10 Package dimensions Table 5. I2PAK dimensions STPS10170C Dimensions Ref. A E L2 c2 Millimeters Min. Max. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 Inches Min. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.195 0.394 0.512 0.138 0.050 Max. 0.181 0.107 0.035 0.067 0.028 0.052 0.368 0.106 0.203 0.409 0.551 0.155 0.055 A A1 b b1 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 D c c2 L1 L b1 A1 D e e1 E b e e1 c L L1 L2 6/10 STPS10170C Table 6. DPAK dimensions Package dimensions Dimensions Ref. Millimeters Min. E B2 L2 C2 A Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 A A1 A2 B D 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 B2 C C2 H L4 B G A1 R R C D E G A2 0.60 MIN. H L2 V2 0.80 typ. 0.60 0° 1.00 8° 0.031 typ. 0.023 0° 0.039 8° L4 V2 Figure 12. DPAK footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 7/10 Package dimensions Table 7. D2PAK dimensions STPS10170C Dimensions Ref. A E L2 C2 Millimeters Min. Max 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 A A1 A2 D 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 B B2 L3 A1 B2 B G R C C2 C D E G A2 L L2 M * V2 L3 M * FLAT ZONE NO LESS THAN 2mm R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 13. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STPS10170C Ordering information 3 Ordering information Part number STPS10170CT STPS10170CG STPS10170CG-TR STPS10170CB STPS10170CB-TR STPS10170CR Marking STPS10170CT STPS10170CG STPS10170CG PS10170CB PS10170CB STPS10170CR Package TO-220AB D PAK D2PAK DPAK DPAK I PAK 2 2 Weight 2.23 g 1.48 g 1.48 g 0.3 g 0.3 g 1.49 g Base qty 50 50 1000 75 2500 50 Delivery mode Tube Tube Tape and reel Tube Tape and reel Tube 4 Revision history Date 13-Jul-2006 Revision 1 First issue. Description of changes 9/10 STPS10170C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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