STPS10200SF

STPS10200SF Datasheet 200 V, 10 A power Schottky rectifier Features • • • • • Low profile design – 1.1 mm package typical height Wettable flanks for automatic visual inspection Very low conduction losses High junction temperature capability ECOPACK2 compliant Applications • • • • • • • AC/DC converter, as for LED lighting applications DC/DC converter, especially for server stand by power supply or telecom Secondary rectification DC / DC converter Auxiliary Power supply Freewheeling function Reverse battery protection Description This 10 A, 200 V Schottky diode is suitable for power supply, especially for lighting power, server or telecom. Product status link STPS10200SF Packaged in PSMC (TO-277A), STPS10200SF provides a high level of performance in a compact and flat package which can withstand high operating junction temperature. Product summary Symbol Value IF(AV) 10 A VRRM 200 V Tj (max.) 175 °C VF (typ.) 0.660 V DS13598 - Rev 1 - December 2020 For further information contact your local STMicroelectronics sales office. www.st.com STPS10200SF Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified, anode terminals shortcircuited) Symbol Parameter Value Unit 200 V VRRM Repetitive peak reverse voltage IF(AV) Average forward current, δ = 0.5 square wave Tc = 160 °C 10 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 210 A Tstg Storage temperature range -65 to +175 °C +175 °C Tj Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Rth(j-c) Parameter Junction to case Typ. value Unit 0.84 °C/W For more information, please refer to the following application note: • AN5088: Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics (anode terminals short-circuited) Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 5 A IF = 10 A Min. Typ. - 1.5 - Unit 6 µA 4 mA 0.830 0.600 - Max. 0.665 0.895 0.660 V 0.730 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.60 x IF(AV) + 0.013 x IF2(RMS) For more information, please refer to the following application notes related to the power losses: • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses in a power diode DS13598 - Rev 1 page 2/8 STPS10200SF Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward current versus case temperature (δ = 0.5) Figure 2. Relative variation of thermal impedance junction to case versus pulse duration IF(AV)(A) Zth(j-c) /Rth(j-c) 70 1.0 60 0.9 0.8 50 0.7 0.6 40 0.5 30 0.4 20 0.3 T δ=tp/T 0 0 Single pulse 0.2 10 25 0.1 T c(°C) tp 50 75 100 125 150 175 Figure 3. Reverse leakage current versus reverse voltage applied (typical values) t P(s) 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 4. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1000 1.E+04 F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C Tj = 150 °C 1.E+03 Tj = 125 °C Tj = 100 °C 1.E+02 Tj = 75 °C 100 1.E+01 Tj = 50 °C 1.E+00 Tj = 25 °C 1.E-01 VR(V) 1.E-02 0 20 40 60 80 100 120 140 160 180 VR(V) 10 1 200 Figure 5. Forward voltage drop versus forward current (typical values) 10 100 1000 Figure 6. Thermal resistance junction to ambient versus copper surface under tab (typical values, epoxy printed board FR4, eCu = 70 µm) (PSMC (TO-277A)) IF(A) Rth(j-a) (°C/W) 100.0 120 Epoxy printed board FR4, copper thickness: 70 μm PSMC (TO-277A) 100 10.0 80 Tj = 25 °C 60 Tj = 75 °C 1.0 Tj = 125 °C 40 Tj = 150 °C 20 VF(V) SCu (cm²) 0.1 0.0 0 0.1 DS13598 - Rev 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 1 2 3 4 5 6 7 8 9 10 page 3/8 STPS10200SF Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 PSMC (TO-277A) package information • • Epoxy meets UL94,V0 Cooling method : by conduction (C) Figure 7. PSMC (TO-277A) package outline DS13598 - Rev 1 page 4/8 STPS10200SF PSMC (TO-277A) package information Table 4. PSMC (TO-277A) package mechanical data Dimensions Millimeters Ref. Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 1.00 1.10 1.20 0.039 0.043 0.047 b 1.05 1.20 1.35 0.041 0.047 0.053 b2 1.90 2.05 2.20 0.075 0.081 0.087 b4 0.75 0.029 C 0.15 0.23 0.40 0.006 0.009 0.016 D 4.45 4.60 4.75 0.175 0.181 0.187 D1 4.25 4.40 4.45 0.167 0.173 0.175 D2 3.40 3.60 3.70 0.134 0.142 0.146 E 6.35 6.50 6.65 0.250 0.256 0.262 E1 6.05 6.10 6.15 0.238 0.240 0.242 E2 4.50 4.60 4.70 0.177 0.181 0.185 E3 3.94 1.55 e 2.13 0.084 e1 3.33 0.131 G 1.20 0.047 G1 0.70 0.027 L 0.90 1.05 1.24 0.035 L4 0.02 0.0008 L5 0.02 0.0008 0.041 0.049 Figure 8. PSMC (TO-277A) package footprint in mm (in inches) Note: DS13598 - Rev 1 For package and tape orientation, reel and inner box dimensions and tape outline please check TN1173 page 5/8 STPS10200SF Ordering information 3 Ordering information Table 5. Ordering information DS13598 - Rev 1 Order code Marking Package Weight Base qty. Delivery mode STPS10200SF PS10200 PSMC (TO-277A) 90 mg 6000 Tape and Reel page 6/8 STPS10200SF Revision history Table 6. Document revision history DS13598 - Rev 1 Date Version 01-Dec-2020 1 Changes Initial release. page 7/8 STPS10200SF IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS13598 - Rev 1 page 8/8