STPS1045BY-TR

STPS1045B-Y Automotive power Schottky rectifier Features ■ Negligible switching losses ■ Low forward voltage drop ■ Low capacitance K K A ■ High reverse avalanche surge capability ■ Avalanche specification ■ AEC-Q101 qualified A DPAK STPS1045BY Description j Table 1. High voltage Schottky rectifier suited for switch mode power supplies and other power converters. Packaged in DPAK, this device is intended for use in high frequency circuits where low switching losses are required. May 2011 Doc ID 17265 Rev 1 Device summary IF(AV) 10 A VRRM 45 V Tj 175 °C VF(max) 0.57 V 1/7 www.st.com 7 Characteristics 1 STPS1045B-Y Characteristics Table 2. Absolute maximum ratings Symbol VRRM Parameter Repetitive peak reverse voltage IF(RMS)/pin Forward rms current 45 V 7 A Average forward current Tc = 150 °C δ = 0.5 10 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A IRRM Repetitive peak reverse current tp = 2 µs, F= 1 kHz 1 A PARM Repetitive peak avalanche power tp = 1 µs, Tj = 25 °C 4000 W -65 to +175 °C -40 to +175 °C 10000 V/µs Value Unit 3 °C/W Storage temperature range Operating junction temperature Tj dV/dt dPtot --------------dTj < Table 3. Rth(j-c) Table 4. Symbol IR(1) range(1) Critical rate of rise of reverse voltage 1 -------------------------Rth ( j – a ) condition to avoid thermal runaway for a diode on its own heatsink Thermal parameters Symbol Parameter Junction to case Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 10 A Min. Typ. Max. Unit - - 100 μA - 7 15 mA - - 0.63 - 0.50 0.57 - - 0.84 - 0.65 0.72 V IF = 20 A 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.015 IF2(RMS) 2/7 Unit IF(AV) Tstg 1. Value Doc ID 17265 Rev 1 STPS1045B-Y Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current PF(AV)(W) Average forward current versus ambient temperature ( δ = 0.5) IF(AV)(A) 8 δ = 0.1 δ = 0.05 7 12 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-c) 10 6 δ=1 5 8 Rth(j-a)=15°C/W 4 6 3 Rth(j-a)=70°C/W 4 2 T 2 1 IF(AV)(A) δ=tp/T 0 0 1 2 3 Figure 3. 4 5 6 7 8 9 10 Tamb(°C) tp 11 0 12 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1µs) 1.2 1 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 0.1 0.8 0.6 0.01 0.4 0.2 tp(µs) 0.001 0.01 0.1 Figure 5. 1 Tj(°C) 10 100 1000 Non repetitive surge peak forward current versus overload duration (maximum values) 0 25 50 Figure 6. 75 100 125 150 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) IM(A) 1.0 120 100 0.8 80 TC=50°C 0.6 δ = 0.5 60 TC=100°C 0.4 δ = 0.2 40 20 TC=150°C IM t 1E-3 1E-2 T δ = 0.1 Single pulse t(s) δ=0.5 0 0.2 1E-1 1E+0 0.0 1E-4 Doc ID 17265 Rev 1 1E-3 tp(s) 1E-2 δ=tp/T 1E-1 tp 1E+0 3/7 Characteristics Figure 7. STPS1045B-Y Reverse leakage current versus reverse voltage applied (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values) C(pF) IR(µA) 1000 1E+5 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C 1E+4 Tj=125°C 1E+3 500 Tj=100°C Tj=75°C 1E+2 Tj=50°C 1E+1 200 Tj=25°C 1E+0 VR(V) VR(V) 1E-1 100 0 5 Figure 9. 100.0 10 15 20 25 30 35 40 45 Forward voltage drop versus forward current 1 5 10 20 50 Figure 10. Thermal resistance junction to ambient versus copper surface under tab IFM(A) 100 Tj=125°C (maximum values) Rth(j-a)(°C/W) Epoxy printed circuit board, copper thickness: 35 µm 80 Tj=125°C (typical values) 10.0 2 60 Tj=25°C (maximum values) 40 1.0 20 2 VFM(V) 0.1 0.0 4/7 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 S(Cu)(cm ) 0 0 Doc ID 17265 Rev 1 2 4 6 8 10 12 14 16 18 20 STPS1045B-Y 2 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. DPAK dimensions Dimensions Ref. E Millimeters Inches Min. Max Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 A B2 C2 L2 D R H L4 A1 B R G C A2 0.60 MIN. V2 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° Figure 11. DPAK footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 Doc ID 17265 Rev 1 5/7 Ordering information 3 Ordering information Table 6. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS1045BY-TR S1045Y DPAK 0.30 g 2500 Tape and reel Revision history Table 7. 6/7 STPS1045B-Y Document revision history Date Revision 23-May-2011 1 Changes Initial release. Doc ID 17265 Rev 1 STPS1045B-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 17265 Rev 1 7/7