STPS1045FP

STPS1045 Power Schottky rectifier Main product characteristics A IF(AV) 10 A VRRM 45 V VF 0.57 V K Features and Benefits ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ Low forward voltage drop ■ Insulated package: TO-220FPAC Insulating voltage = 2000V DC Capacitance = 12 pF ■ Avalanche capability specified A A K K TO-220AC STPS1045D TO-220FPAC STPS1045FP Description Single chip Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. This device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. March 2007 Rev 6 1/8 www.st.com 8 Characteristics 1 STPS1045 Characteristics Table 1. Absolute Ratings (limiting values) Symbol Parameter Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) RMS forward voltage 30 A 10 A IF(AV) Average forward current δ = 0.5 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 180 A Repetitive peak reverse current tp = 2 µs F = 1 kHz 1 A Repetitive peak avalanche power tp = 1 µs Tj = 25° C 4000 W -65 to + 175 °C 175 °C 10000 V/µs Value Unit PARM Tstg Tj dV/dt Table 2. Rth(j-c) Table 3. Symbol IR(1) VF(2) TO-220AC Tc = 150° C TO-220FPAC Tc = 145° C Storage temperature range Maximum junction temperature Critical rate of rise of reverse voltage Thermal resistances Symbol Parameter TO-220AC 2.2 TO-220FPAC 4.5 Junction to case °C/W Static electrical characteristics Parameter Reverse leakage current Test Conditions Tj = 25° C Tj = 125° C Forward voltage drop VR = VRRM Min. Typ. Max. Unit 100 µA 15 mA Tj = 25° C IF = 20 A 0.84 Tj = 125° C IF = 20 A 0.72 Tj = 125° C IF = 10 A 0.60 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.015 IF2(RMS) 2/8 Value V STPS1045 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) PF(AV)(W) 12 8 δ = 0.1 7 δ = 0.05 δ = 0.2 Rth(j-a)=Rth(j-c) δ = 0.5 TO-220AC 10 6 TO-220FPAC 8 5 δ=1 Rth(j-a)=15°C/W 6 4 3 4 T 2 T 2 1 δ=tp/T IF(AV)(A) tp δ=tp/T 0 0 0 1 2 3 Figure 3. 4 5 6 7 8 9 10 11 12 Normalized avalanche power derating versus pulse duration 0 25 50 Figure 4. PARM(tp) PARM(1µs) Tamb(°C) tp 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(tp) PARM(25°C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220AC) 50 Figure 6. 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220FPAC) IM(A) IM(A) 100 160 90 140 80 120 70 100 60 80 TC=50°C 50 60 TC=100°C 40 TC=50°C TC=100°C 30 40 TC=150°C IM 20 t 10 t(s) δ=0.5 0 1E-3 1E-2 20 1E-1 1E+0 0 1E-3 TC=150°C IM t t(s) δ=0.5 1E-2 1E-1 1E+0 3/8 Characteristics Figure 7. STPS1045 Figure 8. Relative variation of thermal transient impedance junction to case versus pulse duration (TO-220AC) Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.8 0.8 0.6 Relative variation of thermal transient impedance junction to case versus pulse duration (TO-220FPAC) δ = 0.5 0.6 δ = 0.5 0.4 0.4 δ = 0.2 δ = 0.2 T δ = 0.1 0.2 0.0 1E-4 tp(s) Single pulse 1E-3 Figure 9. δ=tp/T 1E-2 tp 1E-1 T δ = 0.1 0.2 tp(s) Single pulse 1E+0 Reverse leakage current versus reverse voltage applied (typical values) 0.0 1E-3 1E-2 δ=tp/T 1E-1 tp 1E+0 1E+1 Figure 10. Reverse leakage current versus reverse voltage applied (typical values) IR(µA) C(pF) 1000 1E+5 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C 1E+4 Tj=125°C 500 Tj=100°C 1E+3 Tj=75°C 1E+2 Tj=50°C 1E+1 200 Tj=25°C 1E+0 VR(V) VR(V) 100 1E-1 0 5 10 15 20 25 30 35 40 45 Figure 11. Forward voltage drop versus forward current (maximum values) IFM(A) 100.0 Tj=125°C (typical values) Tj=25°C 10.0 Tj=125°C 1.0 VFM(V) 0.1 0.0 4/8 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1 2 5 10 20 50 STPS1045 2 Package Information Package Information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.55 Nm ● Maximum torque value: 0.70 Nm Figure 12. TO-220AC dimensions Dimensions Ref A H2 ØI C Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L5 L7 L6 L2 F1 D L9 L2 L4 F M E G 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 5/8 Package Information STPS1045 Figure 13. TO-220FPAC dimensions Dimensions Ref A B H Dia Millimeters Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L6 L7 L2 L3 L5 F1 D L4 L2 F G1 G E 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 STPS1045 3 4 Ordering Information Ordering Information Ordering type Marking Package Weight Base qty Delivery mode STPS1045D STPS1045D TO-220AC 1.86 g 50 Tube STPS1045FP STPS1045FP TO-220FPAC 1.9 g 50 Tube Revision history Date Revision Jul-2003 5D 22-Mar-2007 6 Description of Changes Last release. Removed ISOWATT package. 7/8 STPS1045 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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