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STPS10L45CT

STPS10L45CT

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO-220-3

  • 描述:

    DIODE ARRAY SCHOTTKY 45V TO220AB

  • 数据手册
  • 价格&库存
STPS10L45CT 数据手册
STPS10L45C Low drop power Schottky rectifier Main product characteristics IF(AV) VRRM Tj (max) VF(max) 2x5A 45 V 150° C 0.46 V A2 A1 A1 K A2 K A1 K A2 Features and benefits ■ ■ ■ Low forward voltage drop meaning very small conduction losses Low dynamic losses as a result of the Schottky barrier Insulated package: TO-220FPAB Insulating voltage = 2000 V DC Capacitance = 12 pF Avalanche capability specified D2PAK STPS10L45CG I2PAK STPS10L45CR ■ A2 A2 K A1 K A1 Description Dual center tap Schottky rectifiers suited for Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in TO-220AB, TO-220FPAB, I2PAK and D2PAK, these devices are intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. TO-220AB STPS10L45CT TO-220FPAB STPS10L45CFP March 2007 Rev 4 1/10 www.st.com 10 Characteristics STPS10L45C 1 Characteristics Table 1. Symbol VRRM IF(RMS) Absolute ratings (limiting values, per diode) Parameter Repetitive peak reverse voltage RMS forward voltage Average forward current TO-220AB / D2PAK / I2PAK TO-220FPAB Tc =135° C δ = 0.5 Per diode Per device Value 45 20 5 10 5 10 150 1 2 2700 -65 to + 150 150 10000 Unit V A A A A A A IF(AV) Tc = 140° C Per diode δ = 0.5 Per device tp = 10 ms sinusoidal tp = 2 µs square F = 1 kHz tp = 100 µs square tp = 1 µs Tj = 25°C IFSM IRRM IRSM PARM Tstg Tj dV/dt 1. d Ptot --------------dTj Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range W °C °C V/µs Maximum operating junction temperature (1) Critical rate of rise of reverse voltage 1 ------------------------Rth ( j – a ) < condition to avoid thermal runaway for a diode on its own heatsink Table 2. Symbol Rth(j-c) Rth (c) Rth(j-c) Thermal resistances Parameter Junction to case TO-220AB / D2PAK / I2PAK Per diode Total Coupling Per diode Total Coupling Value 3 1.7 0.35 5 3.8 2.5 °C/W Unit °C/W Junction to case TO-220FPAB Rth (c) When the diodes 1 and 2 are used simultaneously : ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 3. Symbol IR(1) Static electrical characteristics (per diode) Parameter Reverse leakage current Test Conditions Tj = 25° C Tj = 100° C Tj = 25° C Tj = 125° C Tj = 25° C Tj = 125° C VR = VRRM IF = 5 A IF = 5 A IF = 10 A IF = 10 A 0.49 0.36 Min. Typ. Max. 0.15 45 90 0.53 0.46 0.67 0.59 V Unit mA mA VF(1) Forward voltage drop 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.33 x IF(AV) + 0.026 IF2(RMS) 2/10 STPS10L45C Characteristics Figure 1. Average forward power dissipation versus average forward current (per diode) Figure 2. Average forward current versus ambient temperature (δ = 0.5, per diode) PF(AV)(W) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 IF(AV)(A) 6 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 5 4 Rth(j-a)=Rth(j-c) TO-220AB / D2PAK / I2PAK δ=1 TO-220FPAB 3 Rth(j-a)=15°C/W 2 T T 1 IF(AV)(A) 3.0 3.5 4.0 4.5 δ=tp/T 5.0 5.5 tp 0 6.0 6.5 δ=tp/T 0 25 tp Tamb(°C) 50 75 100 125 150 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1µs) 1 1.2 1 0.1 0.8 0.6 0.4 0.2 0.001 0.01 0.1 1 PARM(tp) PARM(25°C) 0.01 tp(µs) 10 100 1000 Tj(°C) 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220AB, I2PAK and D2PAK) Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values, per diode) ( TO-220FPAB) IM(A) 100 90 80 60 70 60 50 40 30 20 10 0 1E-3 IM t IM(A) 80 70 50 TC=25°C TC=25°C 40 TC=75°C TC=75°C 30 TC=125°C 20 10 0 1E-3 TC=125°C IM t δ=0.5 t(s) 1E-2 1E-1 1E+0 δ=0.5 t(s) 1E-2 1E-1 1E+0 3/10 Characteristics STPS10L45C Figure 7. Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, I2PAK and D2PAK) 1.0 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) Zth(j-c)/Rth(j-c) 1.0 Zth(j-c)/Rth(j-c) 0.8 δ = 0.5 0.8 0.6 0.6 δ = 0.5 0.4 δ = 0.2 δ = 0.1 0.4 δ = 0.2 T 0.2 Single pulse 0.2 δ = 0.1 T tp(s) 0.0 1E-3 1E-2 1E-1 δ=tp/T tp Single pulse tp(s) 1E-2 1E-1 1E+0 1E+0 0.0 1E-3 δ=tp/T tp 1E+1 Figure 9. Reverse leakage current versus reverse voltage applied (typical values, per diode) Tj=150°C Figure 10. Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C IR(mA) 1E+2 1E+1 Tj=125°C Tj=100°C 1E+0 100 1E-1 Tj=25°C 1E-2 VR(V) 1E-3 0 5 10 15 20 25 30 35 40 45 VR(V) 10 1 2 5 10 20 50 Figure 11. Forward voltage drop versus forward current (maximum values, per diode) Figure 12. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35 µm) ( D2PAK) Rth(j-a)(°C/W) 80 70 IFM(A) 100.0 Tj=150°C (typical values) Tj=25°C 60 50 40 10.0 Tj=125°C 1.0 30 20 VFM(V) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 10 S(Cu)(cm²) 0 0 4 8 12 16 20 24 28 32 36 40 4/10 STPS10L45C Package Information 2 Package Information ● ● ● ● Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm Maximum torque value: 0.70 Nm TO-220AB dimensions Dimensions Ref Millimeters Min. A H2 Dia L5 L7 L6 L2 F2 F1 L9 L4 F G1 G M E D C A Table 4. Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.066 0.202 0.106 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40 4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10 C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. 16.4 typ. 13 2.65 15.25 6.20 3.50 14 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 5/10 Package Information Table 5. I2PAK dimensions STPS10L45C Dimensions Ref. Millimeters Min. A E L2 c2 Inches Min. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.195 0.394 0.512 0.138 0.050 Max. 0.181 0.107 0.035 0.067 0.028 0.052 0.368 0.106 0.203 0.409 0.551 0.155 0.055 Max. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 A A1 b b1 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 D c c2 L1 L b1 A1 D e e1 E b e e1 c L L1 L2 6/10 STPS10L45C Table 6. TO-220FPAB dimensions Package Information Dimensions Ref Millimeters Min. A A H B Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 B D E Dia L6 L2 L3 L5 F1 L4 F2 D L7 F F1 F2 G G1 H L2 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 E L3 L4 G L5 L6 L7 Dia. 7/10 Package Information Table 7. D2PAK dimensions STPS10L45C Dimensions Ref Millimeters Min. A A E L2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 C2 A2 B D L L3 A1 B2 B G A2 B2 C C2 C R D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 13. Footprint (dimensions in millimeters) 16.90 10.30 1.30 5.08 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STPS10L45C Ordering information 3 Ordering information Ordering type STPS10L45CT STPS10L45CFP STPS10L45CG STPS10L45CG-TR STPS10L45CR Marking STPS10L45CT STPS10L45CFP STPS10L45CG STPS10L45CG STPS10L45CR Package TO-220AB TO-200FPAB D2PAK D PAK I PAK 2 2 Weight Base qty Delivery mode 2.23 g 2g 1.48 g 1.48 g 1.49 g 50 50 50 1000 50 Tube Tube Tube Tape and reel Tube 4 Revision history Date Jul-2003 22-Mar-2007 Revision 3B 4 Last release. Removed ISOWATT package. Added I2PAK package. Description of Changes 9/10 STPS10L45C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10