STPS10L60CFP

STPS10L60C Power Schottky rectifier Main product characteristics A1 IF(AV) VRRM Tj (max) VF (max) 2x5A A2 K 60 V 150° C 0.52 V K Features and benefits A2 ● ● ● Low forward voltage drop Negligible switching losses Insulated package: TO-220FPAB Insulating voltage = 2000 V DC Capacitance = 12 pF Avalanche capability specified K A1 A2 A1 TO-220FPAB STPS10L60CFP D2PAK STPS10L60CG ● Description Dual center tap Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in TO-220FPAB and D2PAK, this device is intended for use in high frequency inverters. March 2007 Rev 4 1/8 www.st.com 8 Characteristics STPS10L60C 1 Characteristics Symbol VRRM IF(RMS) IF(AV) IFSM IRRM PARM Tstg Tj dV/dt 1. dPtot --------------dTj Parameter Repetitive peak reverse voltage RMS forward current Average forward current TO220FPAB TC = 130° C δ = 0.5 Per diode Per device Value 60 30 5 10 180 1 4000 -65 to + 175 150 10000 Unit V A A A A W °C °C V/µs Surge non repetitive forward current Repetitive peak reverse current Repetitive peak avalanche power Storage temperature range tp = 10 ms Sinusoidal tp = 2 µs square F=1 kHz tp = 1 µs Tj = 25° C Maximum operating junction temperature(1) Critical rate of rise reverse voltage < 1 ------------------------Rth ( j – a ) thermal runaway condition for a diode on its own heatsink Table 1. Symbol Rth (j-c) Rth (c) Thermal resistance Parameter Junction to case TO-220FPAB Per diode Total Coupling Value 4.5 3.5 2.5 Unit ° C/W ° C/W When the diodes 1 and 2 are used simultaneously : ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 2. Symbol IR (1) Static electrical characteristics (per diode) Parameter Reverse leakage current Tests Conditions Tj = 25° C Tj = 125° C Tj = 25° C IF = 5 A IF = 5 A IF = 10 A IF = 10 A 0.55 0.43 VR = VRRM Min. Typ. Max. 220 45 60 0.55 0.52 V 0.67 0.64 Unit µA mA VF (1) Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C 1. Pulse test : tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.44 x IF(AV) + 0.0091x IF2(RMS) 2/8 STPS10L60C Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current (per diode) IF(AV)(A) δ = 0.05 δ = 0.1 δ = 0.2 6 Average forward current versus ambient temperature (δ = 0.5) (per diode) PF(AV)(W) 3.5 3.0 2.5 δ = 0.5 5 Rth(j-a)=Rth(j-c) δ=1 2.0 4 Rth(j-a)=15°C/W 3 1.5 2 1.0 0.5 T T 1 IF(AV)(A) 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 δ=tp/T 5.0 5.5 tp δ=tp/T 0 6.5 tp Tamb(°C) 50 75 100 125 150 6.0 0 25 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1µs) 1 1.2 1 0.1 0.8 0.6 0.4 0.2 0.001 0.01 0.1 1 PARM(tp) PARM(25°C) 0.01 tp(µs) 10 100 1000 Tj(°C) 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220FPAB) Figure 6. Relative variation of thermal transient impedance junction to case versus pulse duration (TO-220FPAB) IM(A) 90 80 70 60 Zth(j-c)/Rth(j-c) 1.0 0.8 0.6 50 40 30 20 10 0 1E-3 TC=125°C IM t TC=25°C TC=75°C δ = 0.5 0.4 δ = 0.2 0.2 δ = 0.1 T δ=0.5 t(s) 0.0 1E-2 1E-1 1E+0 Single pulse tp(s) 1E-2 1E-1 δ=tp/T 1E+0 tp 1E-3 1E+1 3/8 Characteristics STPS10L60C Figure 7. Relative variation of thermal transient impedance junction to case versus pulse duration (D2PAK) Figure 8. Reverse leakage current versus reverse voltage applied (typical values, per diode) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Single pulse IR(mA) 3E+2 1E+2 Tj=150°C Tj=125°C 1E+1 Tj=100°C Tj=75°C 1E+0 Tj=50°C 1E-1 Tj=25°C 1E-2 tp(s) 1E-3 0 5 10 15 20 25 VR(V) 30 35 40 45 50 55 60 Figure 9. Junction capacitance versus reverse voltage applied (typical values, per diode) Figure 10. Forward voltage drop versus forward current (maximum values, per diode) IFM(A) 100.0 C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C (typical values) Tj=25°C 500 Tj=125°C 10.0 200 1.0 VR(V) 100 1 10 100 0.1 0.0 0.2 0.4 0.6 0.8 1.0 VFM(V) 1.2 1.4 1.6 1.8 2.0 2.2 2.4 Figure 11. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35 µm) ( D2PAK) Rth(j-a)(°C/W) 80 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40 S(Cu)(cm²) 4/8 STPS10L60C Package information 2 Package information ● ● ● ● Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm Maximum torque value: 0.70 Nm TO-220FPAB dimensions Dimensions REF. Millimeters Min. A H2 Dia L5 L7 L6 C A Table 3. Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.205 0.106 0.409 Max. 4.60 2.70 2.75 0.70 1.00 1.70 1.70 5.20 2.70 10.40 4.40 2.50 2.50 0.45 0.75 1.15 1.15 4.95 2.40 10.00 B D E F F1 L2 F2 F1 L9 L4 F G1 G M E D F2 G G1 H L2 L3 L4 L5 L6 L7 Diam 16.00 Typ. 28.60 9.80 2.9 15.90 9.00 3.00 30.60 10.60 3.6 16.40 9.30 3.20 0.630 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 5/8 Package information Table 4. D2PAK dimensions STPS10L60C Dimensions Ref Millimeters Min. A A E L2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 C2 A2 B D L L3 A1 B2 B G A2 B2 C C2 C R D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 12. Footprint (dimensions in millimeters) 16.90 10.30 1.30 5.08 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 STPS10L60C Ordering information 3 Ordering information Delivery mode Tube Tube Tape and reel Type STPS10L60CFP STPS10L60CG STPS10L60CG-TR Marking STPS10L60CFP STPS10L60CG STPS10L60CG Package TO-220FPAB D PAK D PAK 2 2 Weight 2g 1.48 g 1.48 g Base qty 50 50 1000 4 Revision history Date Jul-2003 26-Mar-2007 Revision 3C 4 Last release. Removed ISOWATT package. Added D2PAK package. Description of Changes 7/8 STPS10L60C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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