STPS1150
Datasheet
150 V, 1 A power Schottky rectifier
Features
•
•
•
•
•
•
Negligible switching losses
Low forward voltage drop for higher efficiency and extended battery life
Low thermal resistance
Surface mount miniature package
Avalanche capability
ECOPACK2 compliant component
Applications
•
•
•
•
Switching diode
SMPS
DC/DC converter
Telecom power
Description
This 150 V power Schottky rectifier is ideal for switch mode power supplies on up to
24 V rails and high frequency converters.
Packaged in SMA, SMA Flat Notch and axial, the STPS1150 is optimized for use in
consumer and computer applications where low drop forward voltage is required to
reduce power dissipation.
Product status
STPS1150
Product summary
Symbol
Values
IF(AV)
1A
VRRM
150 V
Tj (max.)
175 °C
VF(typ.)
0.62 V
DS3281 - Rev 8 - September 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
STPS1150
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
150
V
IF(RMS)
Forward rms current
15
A
1
A
TL = 150 °C
SMA
IF(AV)
Average forward current δ =
0.5, square wave
SMA Flat Notch TL = 160 °C
TL = 150 °C
DO-41
IFSM
Surge non repetitive forward
current
PARM
Repetitive peak avalanche
power
Tstg
Storage temperature range
Tj
SMA
50
SMA Flat Notch tp = 10 ms sinusoidal
50
DO-41
75
tp = 10 µs, Tj= 125 °C
108
W
-65 to + 175
°C
+ 175
°C
Max. value
Unit
Maximum operating junction temperature
(1)
A
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameter
Symbol
Rth(j-l)
Parameter
Junction to lead
Junction to lead
Lead length = 10 mm
SMA
30
SMA Flat Notch
20
DO-41
30
°C/W
For more information, please refer to the following application note :
•
AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol
IR(1)
Parameter
Reverse leakage
current
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF(2)
Forward voltage
drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 1 A
IF = 2 A
Min.
Typ.
Max.
Unit
-
0.2
1.0
µA
-
0.2
1.0
mA
-
0.78
0.82
-
0.62
0.67
-
0.85
0.89
-
0.69
0.75
V
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.08 IF2(RMS)
DS3281 - Rev 8
page 2/13
STPS1150
Characteristics (curves)
For more information, please refer to the following application notes related to the power losses :
•
AN604: Calculation of conduction losses in a power rectifier
•
AN4021: Calculation of reverse losses on a power diode
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
IF(AV)(A)
PF(AV)( W)
1.2
0.9
δ = 0.1
0.8
Figure 2. Average forward current versus ambient
temperature (δ = 0.5)
δ = 0.2
Rth(j-a) = Rth(j-l)
δ = 0.5
SMA / DO-41
1.0
δ = 0.05
0.7
δ =1
0.6
0.8
0.5
Rth(j-a) = 120 °C/W
0.6
0.4
0.4
0.3
T
0.2
T
0.2
0.1
IF(AV)(A)
δ =tp/T
tp
Tamb (°C)
tp
δ =tp/T
0.0
0.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Figure 3. Normalized avalanche power derating versus
pulse duration (Tj = 125 °C)
1
PARM (t p )
PARM (10 µs)
0
25
50
75
100
125
150
175
Figure 4. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA)
1.0
Zth(j-a)/ Rth(j-a)
SMA
0.9
0.8
0.7
0.1
0.6
0.5
0.4
0.01
0.3
0.2
0.1
t p(µs)
0.001
1
DS3281 - Rev 8
10
100
Single pulse
1000
0.0
1.E-02
t p( s)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
page 3/13
STPS1150
Characteristics (curves)
Figure 5. Relative variation of thermal impedance junction
to ambient versus pulse duration (DO-41)
Figure 6. Reverse leakage current versus reverse voltage
applied (typical values)
Zth(j-a) /Rth(j-a)
IR(µA)
1.0
1.E+ 04
DO-41
0.9
1.E+ 03
0.8
Tj =150°C
Tj =125°C
1.E+ 02
0.7
0.6
Tj =100°C
1.E+ 01
Tj =75°C
0.5
1.E+ 00
0.4
0.3
Tj =50°C
1.E- 01
Tj =25°C
0.2
1.E- 02
Single pulse
0.1
t p (s)
VR ( V)
1.E- 03
0.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0
1.E+03
Figure 7. Junction capacitance versus reverse voltage
applied (typical values)
25
50
75
100
125
150
Figure 8. Forward voltage drop versus forward current
IF(A)
C(pF)
3.0
100
F = 1 MHz
VOSC = 30mVRMS
Tj = 25 °C
2.5
T=
j 125°C
(maximum values)
2.0
1.5
10
T=
j 125°C
(typical values)
1.0
T=
j 25°C
(maximum values)
0.5
VR(V)
1
10
100
1000
Figure 9. Thermal resistance junction to ambient versus
copper surface under each lead (SMA)
200
VF(V)
0.0
1
0.0
0 .1
0.2
0 .3
0.4
0 .5
0.6
0 .7
0.8
0 .9
1.0
Figure 10. Thermal resistance versus lead length (DO-41)
Rth(°C/W)
Rth(j-a) (°C/W)
120
Rth(j-a)
Epoxy printed circuit copper thickness = 35 µm
100
150
80
60
100
Rth(j-I)
40
50
20
SCu (cm²)
0
0.0
0.5
DS3281 - Rev 8
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Lleads(mm)
0
5
10
15
20
25
page 4/13
STPS1150
Characteristics (curves)
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat
Notch)
Rth(j-a) (°C/W)
200
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMA Flat Notch
150
100
50
S(Cu)(cm²)
0
0.0
DS3281 - Rev 8
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
page 5/13
STPS1150
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMA package information
•
•
Epoxy meets UL 94, V0
Cooling method : by conduction (C)
Figure 12. SMA package outline
E1
D
E
A1
C
A2
L
b
Table 4. SMA package mechanical data
Dimensions
Ref.
DS3281 - Rev 8
Millimeters
Inches (for reference only)
Min.
Typ.
Max.
Min.
Typ.
Max.
A1
1.90
-
2.45
0.075
-
0.097
A2
0.05
-
0.20
0.002
-
0.008
b
1.25
-
1.65
0.049
-
0.065
C
0.15
-
0.40
0.006
-
0.016
D
2.25
-
2.90
0.089
-
0.114
E
4.80
-
5.35
0.189
-
0.211
E1
3.95
-
4.60
0.156
-
0.181
L
0.75
-
1.50
0.030
-
0.059
page 6/13
STPS1150
SMA package information
Figure 13. SMA recommended footprint in mm (inches)
1.4
2.63
1.4
(0.055)
(0.103)
(0.055)
1.64
(0.064)
5.43
(0.214)
DS3281 - Rev 8
page 7/13
STPS1150
SMA Flat Notch package information
2.2
SMA Flat Notch package information
•
•
•
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Band indicates cathode
Figure 14. SMA Flat Notch package outline
Table 5. SMA Flat Notch package mechanical data
Dimensions
Ref.
Millimeters
Min.
A1
0.90
A1
Max.
Min.
1.10
0.035
0.05
Typ.
Max.
0.044
0.002
b
1.25
1.65
0.049
0.065
C
0.15
0.40
0.005
0.016
D
2.25
2.90
0.088
0.115
E
5.00
5.35
0.196
0.211
E1
3.95
4.60
0.155
0.182
G
2.00
0.079
G1
0.85
0.033
L
DS3281 - Rev 8
Typ.
Inches (for reference only)
0.75
1.20
0.029
L1
0.45
0.018
L2
0.45
0.018
L3
0.05
0.002
V
8°
8°
V1
8°
8°
page 8/13
STPS1150
SMA Flat Notch package information
Figure 15. SMA Flat Notch recommended footprint in mm (inches)
1.20
(0.047)
3.12
1.20
(0.123)
(0.047)
1.52
(0.060)
5.52
(0.217)
DS3281 - Rev 8
page 9/13
STPS1150
DO-41 package information
2.3
DO-41 package information
•
Epoxy meets UL 94, V0
Figure 16. DO-41 package outline
C
C
A
ØD
ØB
Table 6. DO-41 package mechanical data
Dimensions
Ref.
DS3281 - Rev 8
Millimeters
Inches (for reference only)
Min.
Typ.
Max.
Min.
Typ.
Max.
A
4.1
-
5.20
0.160
-
0.205
B
2.00
-
2.71
0.080
-
0.107
C
25.40
-
1.000
-
D
0.71
-
0.028
-
0.86
0.0034
page 10/13
STPS1150
Ordering Information
3
Ordering Information
Table 7. Ordering information
DS3281 - Rev 8
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STPS1150AFN
A1150
SMA Flat Notch
0.039 g
10 000
Tape and reel
STPS1150A
1150
SMA
0.068 g
5000
Tape and reel
STPS1150
STPS1150
DO-41
0.34 g
2000
Ammopack
STPS1150RL
STPS1150
DO-41
0.34 g
5000
Tape and reel
page 11/13
STPS1150
Revision history
Table 8. Document revision history
DS3281 - Rev 8
Date
Version
Changes
Jul-2003
2A
Aug-2004
3
SMA package dimensions update. Reference A1 max. changed from 2.70 mm
(0.106) to 2.03 mm (0.080).
31-May-2006
4
Reformatted to current standard. Added ECOPACK statement. Updated SMA
footprint in Figure 15. Changed nF to pF in Figure 10.
09-Feb-2011
5
Added STmite and STmite flat package.
15-Apr-2014
6
Updated : Features, Table 2, 3 and Figure 2. Updated Section 2: Package
information.
28-Sep-2018
7
Removed STmite and STmite flat package information. Updated
Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified)
and Figure 3. Normalized avalanche power derating versus pulse duration (Tj
= 125 °C).
25-Sep-2019
8
Added Section 2.2 SMA Flat Notch package information.
Last update.
page 12/13
STPS1150
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© 2019 STMicroelectronics – All rights reserved
DS3281 - Rev 8
page 13/13
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