STPS1170AFN

STPS1170 Datasheet 170 V, 1 A power Schottky rectifier Features • • • • • • Negligible switching losses High junction temperature capability Very small conduction losses Low leakage current Avalanche rated ECOPACK2 component Applications • • • • • LED lighting Battery charger DC / DC converter Notebook adapter Switching diode Description The STPS1170 is a 170 V Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in SMA Flat and SMA Flat Notch, the STPS1170 is ideal for use in low voltage, high frequency inverters, freewheeling and polarity protection. Also ideal for all LED lighting applications where efficiency and space constraint are required. Product status STPS1170 Product summary Symbol Value IF(AV) 1A VRRM 170 V T j(max.) 175 °C VF(typ.) 0.62 V DS10643 - Rev 2 - October 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS1170 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 170 V VRRM Repetitive peak reverse voltage, Tj = -40 °C 160 V IF(RMS) Forward rms current 15 A 1 A IF(AV) Average forward current, δ = 0.5, square wave IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 45 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 110 W -65 to +175 °C +175 °C Tstg Tj SMA Flat, SMA Flat Notch TL = 160 °C Storage temperature range Maximum operating junction temperature1 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Max. value Unit 20 °C/W SMA Flat, SMA Flat Notch For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR (1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 1 A IF = 2 A Min. Typ. - 0.25 - Unit 1.5 µA 1.5 mA 0.82 0.62 - Max. 0.67 0.89 0.69 V 0.75 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.59 x IF(AV) + 0.08 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS10643 - Rev 2 page 2/12 STPS1170 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 1.0 PF(AV) (W) Figure 2. Average forward current versus ambient temperature (δ = 0.5, SMA Flat, SMA Flat Notch) IF(AV) (A) 6 δ = 0.05 0.8 δ = 0.1 δ = 0.2 δ=1 δ = 0.5 SMA Flat / SMA Flat Notch R =R th(j-a) th(j-l) 5 4 0.6 3 0.4 2 T 0.2 T 1 δ= tp/T 0.0 0.0 0.2 0.4 0.6 I tp 0.8 F(AV) (A) 1.0 1.2 Figure 3. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) PARM (t p ) PARM (10 µs) δ= tp/T 0 25 50 75 100 125 150 175 Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration 1.0 1 Tamb(°C) tp 0 Z /R th(j-l) th(j-l) 0.9 0.8 0.7 0.1 0.6 0.5 0.4 Single pulse 0.3 0.01 0.2 tP(s) 0.1 0.001 0.0 1.E-04 t p(µs) 1 10 100 Figure 5. Reverse leakage current versus reverse voltage applied (typical values) 1.E+04 IR(µA) T = 150 °C j 1.E+02 T = 125 °C j T = 50 °C j 1.E-01 T = 25 °C j VR(V) DS10643 - Rev 2 20 40 60 80 100 1.E+01 C(pF) 10 1.E-02 0 1.E+00 T = 25 °C j T = 75 °C j 1.E+00 1.E-01 F = 1 MHz VOSC = 30 mVRMS T = 100 °C j 1.E+01 1.E-02 Figure 6. Junction capacitance versus reverse voltage applied (typical values) 100 1.E+03 1.E-03 1000 120 140 160 180 VR(V) 1 1 10 100 1000 page 3/12 STPS1170 Characteristics (curves) Figure 8. Forward voltage drop versus forward current (maximum values) Figure 7. Forward voltage drop versus forward current (typical values) I (A) 10.00 F IF(A) 10.00 T = 125 °C j 1.00 T = 125 °C j 1.00 T = 25 °C j T = 25 °C j 0.10 0.10 V (V) F 0.01 0.0 0.2 0.4 0.6 0.8 1.0 V (V) F 0.01 0.0 1.2 0.2 0.4 0.6 0.8 1.0 1.2 Figure 9. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat, SMA Flat Notch) Rth(j-a) (°C/W) 200 Epoxy printed circuit board FR4, copper thickness: 35 µm SMA Flat SMA Flat Notch 150 100 50 S(Cu)(cm²) 0 0.0 DS10643 - Rev 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/12 STPS1170 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DS10643 - Rev 2 page 5/12 STPS1170 SMA Flat package information 2.1 SMA Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 10. SMA Flat package outline A c D L 2x L1 2 x E E1 L L2 2 x b 2x Table 4. SMA Flat package mechanical data Dimensions Ref. Millimeters Min. DS10643 - Rev 2 Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.90 1.10 0.035 0.044 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.95 0.088 0.117 E 4.80 5.60 0.188 0.221 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 L1 0.50 0.020 L2 0.50 0.020 page 6/12 STPS1170 SMA Flat package information Figure 11. SMA Flat recommended footprint in mm (inches) 5.52 (0.217) 1.52 (0.060) 1.20 (0.047) 3.12 (0.123) 1.20 (0.047) millimeter s (inches) DS10643 - Rev 2 page 7/12 STPS1170 SMA Flat Notch package information 2.2 SMA Flat Notch package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Band indicates cathode Figure 12. SMA Flat Notch package outline Table 5. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Min. A1 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L DS10643 - Rev 2 Typ. Inches (for reference only) 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° page 8/12 STPS1170 SMA Flat Notch package information Figure 13. SMA Flat Notch recommended footprint in mm (inches) 1.20 (0.047) 3.12 1.20 (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) DS10643 - Rev 2 page 9/12 STPS1170 Ordering Information 3 Ordering information Table 6. Ordering information DS10643 - Rev 2 Order code Marking Package Weight Base qty. Delivery mode STPS1170AF F1170 SMA Flat 0.035 g 10 000 Tape and reel STPS1170AFN A1170 SMA Flat Notch 0.039 g 10 000 Tape and reel page 10/12 STPS1170 Revision history Table 7. Document revision history DS10643 - Rev 2 Date Version Changes 14-Oct-2014 1 First release. 08-Oct-2019 2 Added Section 2.2 SMA Flat Notch package information. page 11/12 STPS1170 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS10643 - Rev 2 page 12/12