STPS130
Datasheet
30 V, 1 A power Schottky rectifier
Features
•
•
•
•
•
Very low forward voltage drop for less power dissipation
Optimized conduction/reverse losses trade-off which means the highest yield in
the applications
Surface mount miniature packages
Avalanche rated
ECOPACK2 compliant
Applications
•
•
•
•
•
Cordless appliance
SSD
Battery charger
Telecom power
DC / DC converter
Description
Single Schottky rectifiers designed for high frequency miniature switched mode
power supplies such as adaptors and on board DC/DC converters.
Packaged in SMA, SMA Flat Notch or SMB, the STPS130 is ideal for use in parallel
with MOSFETs in synchronous and low voltage secondary rectification.
Product status
STPS130
Product summary
Symbol
Value
IF(AV)
1A
VRRM
30 V
T j(max.)
150 °C
VF(typ.)
0.37 V
DS0933 - Rev 7 - September 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
STPS130
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
30
V
IF(RMS)
Forward rms current
7
A
1
A
IF(AV)
Average forward current, δ = 0.5, square wave
IFSM
Surge non repetitive forward current
PARM
Repetitive peak avalanche power
Tstg
Tj
SMA
TL = 130 °C
SMA Flat Notch, SMB
TL = 135 °C
SMA, SMB
SMA Flat Notch
tp = 10 ms sinusoidal
tp = 10 µs, Tj = 125 °C
Storage temperature range
Maximum operating junction temperature(1)
45
A
60
86
W
-65 to +150
°C
+150
°C
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameter
Symbol
Rth(j-l)
Parameter
Junction to lead
Max. value
SMA
30
SMA Flat Notch
20
SMB
23
Unit
°C/W
For more information, please refer to the following application note :
•
AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol
IR(1)
Parameter
Reverse leakage current
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF(2)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 1 A
IF = 2 A
Min.
Typ.
-
1.5
-
Unit
10
µA
10
mA
0.55
0.37
-
Max.
0.46
0.63
0.45
V
0.55
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.37 x IF(AV) + 0.090 x IF2(RMS)
For more information, please refer to the following application notes related to the power losses :
•
AN604: Calculation of conduction losses in a power rectifier
•
AN4021: Calculation of reverse losses on a power diode
DS0933 - Rev 7
page 2/14
STPS130
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
0.6
PF(AV)(W)
IF(AV)(A)
1.2
δ = 0.1
δ = 0.2
δ = 0.5
Rth(j-a)=Rth(j-l)
δ = 0.05
0.5
Figure 2. Average forward current versus ambient
temperature (δ = 0.5, SMB)
1.0
δ=1
0.4
0.8
Rth(j-a)=100°C/W
0.6
0.3
0.4
0.2
T
T
0.2
0.1
IF(AV)(A)
δ=tp/T
tp
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Figure 3. Normalized avalanche power derating versus
pulse duration (Tj = 125 °C)
PARM (t p )
PARM (10 µs)
Tamb (°C)
tp
δ =tp/T
0.0
0
0
25
50
75
100
125
150
Figure 4. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMB)
Zth(j-a)/ Rth(j-a)
1. 0
1
SMB
0. 8
0.1
0. 6
0. 4
0.01
0. 2
Single pulse
t p (s)
0.001
0. 0
1.0E-2
t p(µs)
1
DS0933 - Rev 7
10
100
1.0E-1
1.0E+0
1.0E+1
1.0E+2
1.0E+3
1000
page 3/14
STPS130
Characteristics (curves)
Figure 5. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA)
Figure 6. Reverse leakage current versus reverse voltage
applied (typical values)
IR(µA)
Zth (j-a)/Rt h(j-a)
5E+3
1.0
SMA
Tj = 125 °C
1E+3
0.8
1E+2
0.6
Tj = 70 °C
0.4
1E+1
0.2
1E+0
Single
Singlepulse
pul
t p( s )
0.0
1E-2
Tj = 25 °C
1E-1
1E+0
1E+1
1E+2
1E+3
Figure 7. Junction capacitance versus reverse voltage
applied (typical values)
C(pF)
5
10
15
20
25
30
Figure 8. Forward voltage drop versus forward current
(maximum values)
10.00
500
VR(V)
1E-1
0
IF(A)
F=1MHz
VOSC=30mVRMS
Tj=25°C
200
1.00
Tj=125°C
=75 °C
100
Tj=25°C
Tj=125°C
= 125 °C
50
0.10
20
VF(V)
V R (V)
0.01
10
20
10
5
2
1
30
Figure 9. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
0.0
0.2
0.4
0 .6
0.8
1 .0
1.2
Figure 10. Thermal resistance junction to ambient versus
copper surface under each lead (SMA)
Rth(j-a) (°C/W)
Rth(j-a) (°C/W)
200
200
Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMB
150
150
100
100
50
50
S(Cu)(cm²)
SMA
S(Cu)(cm²)
0
0
0.0
0.5
DS0933 - Rev 7
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
page 4/14
STPS130
Characteristics (curves)
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat
Notch)
Rth(j-a) (°C/W)
200
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMA Flat Notch
150
100
50
S(Cu)(cm²)
0
0.0
DS0933 - Rev 7
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
page 5/14
STPS130
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMA package information
•
•
Epoxy meets UL94, V0
Cooling method : by conduction (C)
Figure 12. SMA package outline
E1
D
E
A1
C
A2
L
b
Table 4. SMA package mechanical data
Dimensions
Ref.
A1
DS0933 - Rev 7
Millimeters
Inches (for reference only)
Min.
Max.
Min.
Max.
1.90
2.45
0.074
0.097
A2
0.05
0.20
0.001
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.005
0.016
D
2.25
2.90
0.088
0.115
E
4.80
5.35
0.188
0.211
E1
3.95
4.60
0.155
0.182
L
0.75
1.50
0.029
0.060
page 6/14
STPS130
SMA package information
Figure 13. SMA recommended footprint in mm (inches)
1.4
2.63
1.4
(0.055)
(0.104)
(0.055)
1.64
(0.065)
5.43
(0.214)
DS0933 - Rev 7
page 7/14
STPS130
SMA Flat Notch package information
2.2
SMA Flat Notch package information
•
•
•
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Band indicates cathode
Figure 14. SMA Flat Notch package outline
Table 5. SMA Flat Notch package mechanical data
Dimensions
Ref.
Millimeters
Min.
A1
0.90
A1
Max.
Min.
1.10
0.035
0.05
Typ.
Max.
0.044
0.002
b
1.25
1.65
0.049
0.065
C
0.15
0.40
0.005
0.016
D
2.25
2.90
0.088
0.115
E
5.00
5.35
0.196
0.211
E1
3.95
4.60
0.155
0.182
G
2.00
0.079
G1
0.85
0.033
L
DS0933 - Rev 7
Typ.
Inches (for reference only)
0.75
1.20
0.029
L1
0.45
0.018
L2
0.45
0.018
L3
0.05
0.002
V
8°
8°
V1
8°
8°
page 8/14
STPS130
SMA Flat Notch package information
Figure 15. SMA Flat Notch recommended footprint in mm (inches)
1.20
(0.047)
3.12
1.20
(0.123)
(0.047)
1.52
(0.060)
5.52
(0.217)
DS0933 - Rev 7
page 9/14
STPS130
SMB package information
2.3
SMB package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 16. SMB package outline
E1
D
E
A1
C
A2
L
b
Table 6. SMB package mechanical data
Dimensions
Millimeters
Ref.
DS0933 - Rev 7
Inches (for reference only)
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.074
0.097
A2
0.05
0.20
0.001
0.008
b
1.95
2.20
0.076
0.087
c
0.15
0.40
0.005
0.016
D
3.30
3.95
0.129
0.156
E
5.10
5.60
0.200
0.221
E1
4.05
4.60
0.159
0.182
L
0.75
1.50
0.029
0.060
page 10/14
STPS130
SMB package information
Figure 17. SMB recommended footprint
1.62
2.60
1.62
(0.064)
(0.102)
(0.064)
2.18
(0.086)
5.84
(0.230)
DS0933 - Rev 7
page 11/14
STPS130
Ordering Information
3
Ordering Information
Table 7. Ordering information
DS0933 - Rev 7
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STPS130A
S130
SMA
0.068 g
5000
Tape and reel
STPS130AFN
A130
SMA Flat Notch
0.039 g
10 000
Tape and reel
STPS130U
G12
SMB
0.107 g
2500
Tape and reel
page 12/14
STPS130
Revision history
Table 8. Document revision history
DS0933 - Rev 7
Date
Version
Changes
Jul-2003
4A
Aug-2004
5
SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inc.) to 2.03 mm
(0.080 inc).
21-Nov-2018
6
Updated Table 3. Static electrical characteristics and Figure 3. Normalized avalanche power derating
versus pulse duration (Tj = 125 °C).
27-Sep-2019
7
Added Section 2.2 SMA Flat Notch package information.
Last update.
page 13/14
STPS130
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Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
DS0933 - Rev 7
page 14/14
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