STPS140AFN

STPS140 Datasheet 40 V, 1 A power Schottky rectifier Features • • • • • • Very small conduction losses Negligible switching losses Low forward voltage drop Surface mount miniature packages Avalanche rated ECOPACK2 compliant Applications • • • • Reverse polarity protection Set-top box power supply TV power supply Battery charger Description Single chip Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters. Packaged in SMA, SMA Flat Notch and SMB, the STPS140 is ideal for use in surface mounting and used in low voltage, high frequency inverters, free-wheeling and polarity protection applications. Product status STPS140 Product summary Symbol Value IF(AV) 1A VRRM 40 V T j(max.) 150 °C VF(typ.) 0.43 V DS1044 - Rev 9 - September 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS140 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 40 V IF(RMS) Forward rms current 7 A 1 A IF(AV) Average forward current δ = 0.5, square wave SMA TL = 130 °C SMA Flat Notch TL = 135 °C SMB TL = 135 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 60 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 65 W -65 to +150 °C +150 °C Tstg Tj Storage temperature range Operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Max. value SMA 30 SMA Flat Notch 20 SMB 25 Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 100 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 1 A IF = 2 A Typ. - 0.25 - Unit 12 µA 2 mA 0.55 0.43 - Max. 0.65 0.53 V 0.60 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.40 x IF(AV) + 0.10 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS1044 - Rev 9 page 2/13 STPS140 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (SMA, δ = 0.5) PF(AV)(W) IF(AV)(A) 1.2 0.7 δ = 0.1 δ = 0.2 Rth(j-a)=Rth(j-l) δ = 0.5 δ = 0.05 0.6 1.0 0.5 0.8 δ=1 0.4 0.6 0.3 Rth(j-a)=100°C/W 0.4 T 0.2 T 0.1 IF(AV)(A) δ=tp/T 0.2 tp 0.0 0.0 0.2 0.4 0.6 0.8 1.0 0 1.2 Figure 3. Average forward current versus ambient temperature (SMB, δ = 0.5) Tamb (°C) tp δ =tp/T 0.0 25 50 75 100 125 150 Figure 4. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) PARM (t p ) PARM (10 µs) IF(AV)(A) 1.2 1 Rth(j-a)=Rth(j-l) 1.0 0.8 0.1 0.6 Rth(j-a)=80°C/W 0.4 0.01 T 0.2 Tamb (°C) tp δ =tp/T 0.0 0 25 50 75 100 125 150 0.001 t p(µs) 1 10 100 1000 Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) to ambient versus pulse duration (SMB) 1.0 Zth(j-a)/ Rth(j-a) Zth (j-a)/Rt h(j-a) 1.0 SMA 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 Single pulse 0.0 1E-2 DS1044 - Rev 9 SMB 0.9 1E-1 1E+0 Single pulse 0.1 t p( s ) t p (s) 0.0 1E+1 1E+2 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3 page 3/13 STPS140 Characteristics (curves) Figure 7. Reverse leakage current versus reverse voltage applied (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1E+3 200 Tj = 125 °C F=1MHz VOSC=30mVRMS Tj=25°C 1E+2 100 Tj = 75 °C 1E+1 50 1E+0 Tj = 25 °C 20 1E-1 V R (V) VR(V) 1E-2 0 5 10 15 10 20 25 30 35 1 40 Figure 9. Forward voltage drop versus forward current (maximum values) IF(A) 10 5 50 20 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (typical values) 200 1E+1 2 Rth(j-a)(°C/W) SMA 150 1E+0 Tj=125°C = 125 °C 100 Epoxy printed board FR4, eCu = 35 µm 1E-1 50 SCu (cm²) VF(V) 1E-2 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0 0.7 0.8 0.9 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (typical values) 200 0.0 1.0 0.5 1.0 1.5 2.5 3.0 3.5 4.0 4.5 5.0 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat Notch) Rth(j-a) (°C/W) Rth(j-a)(°C/W) 200 Epoxy printed circuit board FR4, copper thickness: 35 µm SMB SMA Flat Notch 150 150 100 100 Epoxy printed board FR4, eCu = 35 µm 50 50 SCu (cm²) S(Cu)(cm²) 0 0.0 2.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 0.0 DS1044 - Rev 9 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/13 STPS140 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMA package information • • Epoxy meets UL94, V0 Cooling method : by conduction (C) Figure 13. SMA package outline E1 D E A1 C A2 L b Table 4. SMA package mechanical data Dimensions Ref. A1 DS1044 - Rev 9 Millimeters Inches (for reference only) Min. Max. Min. Max. 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 page 5/13 STPS140 SMA package information Figure 14. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS1044 - Rev 9 page 6/13 STPS140 SMA Flat Notch package information 2.2 SMA Flat Notch package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Band indicates cathode Figure 15. SMA Flat Notch package outline Table 5. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Min. A1 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L DS1044 - Rev 9 Typ. Inches (for reference only) 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° page 7/13 STPS140 SMA Flat Notch package information Figure 16. SMA Flat Notch recommended footprint in mm (inches) 1.20 (0.047) 3.12 1.20 (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) DS1044 - Rev 9 page 8/13 STPS140 SMB package information 2.3 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 17. SMB package outline E1 D E A1 C A2 L b Table 6. SMB package mechanical data Dimensions Millimeters Ref. DS1044 - Rev 9 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 page 9/13 STPS140 SMB package information Figure 18. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS1044 - Rev 9 page 10/13 STPS140 Ordering information 3 Ordering information Table 7. Ordering information DS1044 - Rev 9 Order code Marking Package Weight Base qty. Delivery mode STPS140A S140 SMA 68 mg 5000 Tape and reel STPS140AFN A140 SMA Flat Notch 39 mg 10 000 Tape and reel STPS140U G14 SMB 107 mg 2500 Tape and reel page 11/13 STPS140 Revision history Table 8. Document revision history Date DS1044 - Rev 9 Revision Changes Jul-2003 7.2 Last update. Aug-2004 7.3 SMA package dimensions update. Reference A1 max. changed from 2.70 mm (0.106 inch.) to 2.03 mm (0.080). 25-Nov-2018 8 Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified), Figure 4. Normalized avalanche power derating versus pulse duration (Tj = 125 °C), Section 2.3 and Section 2.1 . 27-Sep-2019 9 Added Section 2.2 SMA Flat Notch package information. page 12/13 STPS140 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS1044 - Rev 9 page 13/13