STPS140U

® STPS140A/U POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM VF (max) FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNTED DEVICE DESCRIPTION Single chip Schottky rectifier suited for Switchmode Power Supplies and high frequency DC to DC converters. Packaged in SMA and SMB(*), this device is intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. (*) in accordance with DO214AAand DO21AC JEDEC 1A 40 V 0.5 V SMA STPS140A SMB STPS140U ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM Tstg Tj dV/dt RMS forward current Average forward current δ = 0.5 Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Storage temperature range Maximum junction temperature Critical rate of rise of reverse voltage SMA SMB TL = 130°C TL = 135°C tp = 10 ms Sinusoidal tp = 2 µs F = 1kHz tp = 100µs square 60 1 1 - 65 to + 150 150 10000 V/µs A A A °C Parameter Repetitive peak reverse voltage Value 40 7 1 Unit V A A July 1998 - Ed: 6B 1/6 STPS140A/U THERMAL RESISTANCES Symbol Rth (j-l) Junction to lead Parameter SMA SMB STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Tests Conditions Reverse leakage current Tests Conditions Tj = 25°C Tj = 100°C VF ** Forward voltage drop Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Pulse test : * tp = 5 ms, δ < 2 % ** tp = 380 µs, δ < 2% Value 30 25 Unit °C/W Min. Typ. Max. 12 Unit µA mA V VR = 40V 0.25 IF = 1 A IF = 1 A IF = 2 A IF = 2 A 0.53 0.43 2 0.55 0.5 0.65 0.6 To evaluate the maximum conduction losses use the following equation : P = 0.4 x IF(AV) + 0.10 x IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. Fig. 2: Average forward current versus ambient temperature (δ=0.5). IF(av)(A) PF(av)(W) 0.7 0.6 δ = 0.05 δ = 0.1 1.2 δ = 0.2 δ = 0.5 1.0 0.8 δ=1 SMA Rth(j-a)=100°C/W S(Cu)=1.5cm² SMB Rth(j-a)=80°C/W S(Cu)=1.5cm² Rth(j-a)=Rth(j-l) 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0.2 0.4 T 0.6 0.4 tp T IF(av) (A) 0.6 0.8 δ=tp/T 0.2 δ=tp/T tp Tamb(°C) 50 75 100 125 150 1.0 1.2 0.0 0 25 2/6 STPS140A/U Fig. 3-1: Non repetivesurge peak forward current versus overload duration (maximum values) (SMB). IM(A) 8 7 6 5 4 Ta=50°C Ta=25°C Fig. 3-2: Non repetivesurge peak forward current versus overload duration (maximum values) (SMA). IM(A) 8 7 6 5 4 3 Ta=50°C Ta=100°C t Ta=25°C 3 2 1 0 1E-3 IM t Ta=100°C δ=0.5 2 1 IM t(s) 1E-2 1E-1 1E+0 δ=0.5 t(s) 1E-2 1E-1 1E+0 0 1E-3 Fig. 4-1: Relative variation of thermal impedance junction to ambient versus pulse duration (SMB). Fig. 4-2: Relative variation of thermal impedance junction to ambient versus pulse duration (SMA). Zth(j-a)/Rth(j-a) 1.0 Printed circuit board: SCu=1.5cm (e=35µm) 0.9 0.8 0.7 0.6 δ = 0.5 0.5 0.4 0.3 δ = 0.2 0.2 δ = 0.1 0.1 tp(s) Single pulse 0.0 1E+0 1E-2 1E-1 1E+1 2 T δ=tp/T tp 1E+2 1E+3 Zth(j-a)/Rth(j-a) 1.0 Printed circuit board: SCu=1.5cm (e=35µm) 0.9 0.8 0.7 0.6 δ = 0.5 0.5 0.4 0.3 δ = 0.2 0.2 δ = 0.1 tp(s) 0.1 Single pulse 0.0 1E-2 1E-1 1E+0 2 T δ=tp/T tp 1E+1 1E+2 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). IR(µA) 1E+3 Tj=125°C Fig. 6: Junction capacitance versus reverse voltage applied (typical values) C(pF) 200 F=1MHz Tj=25°C 1E+2 1E+1 1E+0 Tj=25°C Tj=75°C 100 50 1E-1 20 VR(V) VR(V) 1E-2 10 25 30 35 40 0 5 10 15 20 1 2 5 10 20 50 3/6 STPS140A/U Fig. 7: Forward voltage drop versus forward current (maximum values). Fig. 8-1: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board, copper thickness: 35µm)(SMB). Rth(j-a) (°C/W) 120 Tj=125°C IFM(A) 1E+1 100 P=1.5W 1E+0 80 60 1E-1 VFM(V) 1E-2 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 40 20 S(Cu) (cm²) 0 0 1 2 3 4 5 Fig. 8-2: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board, copper thickness: 35µm)(SMA). Rth(j-a) (°C/W) 140 120 100 80 60 40 20 0 0 1 S(Cu) (cm²) P=1.5W 2 3 4 5 4/6 STPS140A/U PACKAGE MECHANICAL DATA SMA DIMENSIONS REF. E1 Millimeters Min. Max. 2.70 0.20 1.65 0.41 5.60 4.60 2.95 1.60 Inches Min. 0.075 0.002 0.049 0.006 0.189 0.156 0.089 0.030 Max. 0.106 0.008 0.065 0.016 0.220 0.181 0.116 0.063 A1 D 1.90 0.05 1.25 0.15 4.80 3.95 2.25 0.75 A2 b c E E A1 E1 D b C L A2 L FOOT PRINT (in millimeters) Marking: S140 1.65 1.45 2.40 1.45 5/6 STPS140A/U PACKAGE MECHANICAL DATA SMB Plastic DIMENSIONS REF. E1 Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063 A1 D 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 A2 b c E E A1 E1 D b C L A2 L FOOT PRINT (in millimeters) Marking: G14 2.3 1.52 2.75 1.52 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. 6/6