STPS15H100CB

STPS15H100C High voltage power Schottky rectifier Main product characteristics IF(AV) VRRM Tj (max) VF(max) 2 x 7.5 A 100 V 175° C 0.67 V K A1 K A2 K Features and Benefits ■ ■ ■ ■ ■ Negligible switching losses Low leakage current Good trade off between leakage current and forward voltage drop Low thermal resistance Avalanche capability specified STPS15H100CB DPAK STPS15H100CH IPAK A1 A2 K A1 A2 Description Dual center tab Schottky rectifier suited for switched mode power supply and high frequency DC to DC converters. Packaged in DPAK and IPAK, this device is intended for use in high frequency inverters. Table 1. Symbol VRRM IF(RMS) IF(AV) IFSM IRRM PARM Tstg Tj dV/dt 1. dPtot --------------dTj Absolute Ratings (limiting values, per diode) Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Peak repetitive reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature Critical rate of rise of reverse voltage (1) Value 100 10 Tc = 135° C δ = 0.5 Per diode Per device 7.5 15 75 1 6600 -65 to + 175 175 10000 Unit V A A A A W °C °C V/µs tp = 10 ms sinusoidal tp = 2 µs square F= 1 kHz tp = 1 µs Tj = 25° C 1 < -------------------------- condition to avoid thermal runaway for a diode on its own heatsink Rth ( j – a ) June 2006 Rev 4 1/8 www.st.com 8 Characteristics STPS15H100C 1 Characteristics Table 2. Symbol Rth(j-c) Rth(c) Junction to case Total Coupling 2.4 0.7 °C/W Thermal resistance Parameter Per diode Value 4 Unit When the diodes 1 and 2 are used simultaneously : ∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 3. Symbol IR(1) Static electrical characteristics (per diode) Parameter Reverse leakage current Test Conditions Tj = 25° C Tj = 125° C Tj = 25° C Tj = 125° C VR = VRRM IF = 7.5 A IF = 7.5 A IF = 1 2 A IF = 1 2 A IF = 1 5 A IF = 1 5 A 0.71 0.68 0.62 Min. Typ. Max. 3 1.3 4 0.8 0.67 0.85 V 0.73 0.89 0.76 Unit µA mA VF(1.) Forward voltage drop Tj = 25° C Tj = 125° C Tj = 25° C Tj = 125° C 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.58 x IF(AV) + 0.012 IF2(RMS) 2/8 STPS15H100C Characteristics Figure 1. PF(av)(W) 7 6 5 Conduction losses versus average Figure 2. current IF(av)(A) 9 δ = 0.5 Average forward current versus ambient temperature (δ = 0.5) 8 7 Rth(j-a)=Rth(j-c) δ = 0.2 δ = 0.1 δ=1 6 5 4 3 Rth(j-a)=70°C/W 4 3 2 δ = 0.05 T 2 1 T 1 IF(av)(A) 0 0 1 2 3 4 5 6 δ=tp/T 7 8 tp 0 δ=tp/T 0 25 tp Tamb(°C) 50 75 100 125 150 175 9 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1µs) 1 1.2 1 PARM(tp) PARM(25°C) 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(µs) 10 100 1000 Tj(°C) 0 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) Figure 6. Relative variation of thermal impedance junction to case versus pulse duration IM(A) 100 90 80 70 60 50 40 30 20 10 0 1.E-03 IM t Tc=125°C Tc=25°C Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 δ=0.5 δ = 0.2 δ = 0.1 δ = 0.5 Tc=75°C T Single pulse t(s) 1.E-02 1.E-01 1.E+00 0.1 tp(s) 1.E-02 1.E-01 0.0 1.E-03 δ=tp/T tp 1.E+00 3/8 Characteristics STPS15H100C Figure 7. Reverse leakage current versus reverse voltage applied (typical values) Tj=150°C Figure 8. Junction capacitance versus reverse voltage applied (typical values) F=1MHz Vosc=30mV Tj=25°C IR(mA) 1.E+01 1.0 C(nF) 1.E+00 Tj=125°C 1.E-01 Tj=100°C Tj=75°C 0.1 1.E-02 Tj=50°C 1.E-03 Tj=25°C VR(V) 1.E-04 0 10 20 30 40 50 60 70 80 90 100 0.0 1 VR(V) 10 100 Figure 9. Forward voltage drop versus forward current Figure 10. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu: 35µm) Rth(j-a)(°C/W) 100 90 IFM(A) 100 Tj=125°C (Maximum values) 80 70 10 Tj=125°C (Typical values) Tj=25°C (Maximum values) 60 50 40 30 20 VFM(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 10 0 0 2 4 6 8 S(cm²) 10 12 14 16 18 20 4/8 STPS15H100C Package Information 2 Package Information Epoxy meets UL94,V0 Table 4. DPAK Package mechanical data Dimensions Ref Millimeters Min. A A1 A2 B B2 C C2 D E G H L2 L4 V2 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 Max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 0.80 typ. 0.60 0° 1.00 8° 0.031 typ. 0.023 0° 0.039 8° Figure 11. DPAK Footprint (dimensions in mm) 6.7 6.7 3 3 1.6 2.3 2.3 1.6 5/8 Package Information Table 5. IPAK Package mechanical data STPS15H100C Dimensions Ref. Millimeters Min. A A1 A3 A E B2 L2 C2 Inches Min. 0.086 0.035 0.027 0.025 0.204 Typ. Max. 0.094 0.043 0.051 0.035 0.212 0.037 0.035 Typ. Max. 2.40 1.10 1.30 0.90 5.40 0.95 2.20 0.90 0.70 0.64 5.20 B B2 B3 B5 D 0.30 0.45 0.48 6 6.40 2.28 4.40 16.10 9 0.8 0.80 10° 9.40 1.20 1 0.354 0.031 4.60 0.173 0.60 0.60 6.20 6.60 0.017 0.019 0.236 0.252 C C2 0.023 0.023 0.244 0.260 0.090 0.181 0.634 0.370 0.047 0.031 0.039 10° H L L1 B3 B V1 A1 D E e e G B5 C A3 G H L L1 L2 V1 6/8 STPS15H100C Ordering Information 3 Ordering Information Ordering type STPS15H100CB STPS15H100CB-TR STPS15H100CH Marking S15H100 S15H100 S15H100CH Package DPAK DPAK IPAK Weight 0.30 g 0.30 g 0.35 g Base qty 75 2500 75 Delivery mode Tube Tape andreel Tube 4 Revision History Date Mar-2004 08-Jun-2006 Revision 3 4 Last issue Reformatted to current standard. Added IPAK. Changes 7/8 STPS15H100C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8