STPS15L45CB

STPS15L45C Datasheet 2 x 7.5 A - 45 V low drop power Schottky rectifier Features A1 K A2 K K A2 A2 A1 A1 DPAK • • • • • • • Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop Low capacitance Avalanche capability specified ECOPACK2 compliant component Applications • • • SMPS Freewheeling diodes Switching diodes Description Dual center tab Schottky rectifier suited for SMPS and high frequency DC to DC converters. Packaged in DPAK, the STPS15L45C is intended for use in low voltage, high frequency inverters, freewheeling and polarity protection applications. Product status link STPS15L45C Product summary Symbol Value IF(AV) 2 x 7.5 A VRRM 45 V T j(max.) 150 °C VF(typ.) 0.40 V DS2653 - Rev 6 - April 2020 For further information contact your local STMicroelectronics sales office. www.st.com STPS15L45C Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, per diode, at 25 °C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 10 A Per diode 7.5 Per device 15 Surge non repetitive forward current tp = 10 ms sinusoidal 75 A Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 265 W -65 to +175 °C 150 °C IF(AV) Average forward current IFSM PARM Tstg Tc = 140 °C, δ = 0.5 square wave Storage temperature range Tj Maximum operating junction temperature(1) A 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Max. value Per diode Unit 4 Total 2.4 °C/W 0.7 When the diodes 1 and 2 are used simultaneously : Δ Tj(diode 1) = P(diode1) x Rth(j-c)(per diode) + P(diode 2) x Rth(c) For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics (per diode) Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VF(2) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 7.5 A IF = 12 A IF = 15 A Min. Typ. - 60 - 0.40 500 µA 120 mA 0.46 0.60 0.49 - Unit 0.52 - Max. 0.57 V 0.64 0.53 0.63 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 μs, δ < 2% To evaluate the conduction losses, use the following equation: DS2653 - Rev 6 page 2/10 STPS15L45C Characteristics P = 0.29 x IF(AV) + 0.023 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS2653 - Rev 6 page 3/10 STPS15L45C Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current (per diode) Figure 2. Average forward current versus ambient temperature (δ = 0.5, per diode) IF(AV) (A) PF(AV) (W) 5.5 δ = 0.5 5.0 Rth(j-a) = Rth(j-c) δ = 0.2 4.5 4.0 δ = 0.1 δ = 0.05 δ=1 3.5 3.0 2.5 Rth(j-a) = 70 °C/W 2.0 1.5 T 1.0 0.5 0.0 IF(AV) (A) 0 1 2 3 4 5 6 7 8 9 0 10 Figure 3. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) PARM (t p ) PARM (10 µs) Tamb(°C) tp δ = tp/T tp δ = tp/T 25 50 75 100 125 150 Figure 4. Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 1 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.3 0.01 0.2 0.1 0.001 t p(µs) 1 DS2653 - Rev 6 10 100 1000 tp(s) Single pulse 0.0 1.E-03 1.E-02 1.E-01 1.E+00 page 4/10 STPS15L45C Characteristics (curves) Figure 5. Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 6. Junction capacitance versus reverse voltage applied (typical values, per diode) IR (mA) C(nF) 10.0 1.E+03 F = 1 MHz VOSC = 30 mV Tj = 25 °C Tj = 150 °C 1.E+02 Tj = 125 °C T = 100 °C j 1.E+01 T = 75 °C j 1.E+00 1.0 Tj = 50 °C T = 25 °C j 1.E-01 VR (V) 1.E-02 0 5 10 15 20 25 VR(V) 0.1 30 35 40 45 Figure 7. Forward voltage drop versus forward current (per diode) IFM(A) Tj = 125 °C Rth(j-a) (°C/W) DPAK Epoxy printed circuit board, copper thickness: 35 µm 90 (Maximum values) 100 Figure 8. Thermal resistance junction to ambient versus copper surface under tab 100 100 10 1 80 70 60 Tj = 125 °C (Typical values) 50 10 40 30 Tj = 25 °C (Maximum values) 20 10 VFM(V) 0.0 DS2653 - Rev 6 0.2 0.4 0.6 0.8 1.0 SCu (cm²) 0 1 1.2 1.4 1.6 1.8 0 5 10 15 20 25 30 35 40 page 5/10 STPS15L45C Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 DPAK package information • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Figure 9. DPAK package outline E A b4 c2 Thermal pad E1 L2 D D1 R H L4 A1 b e e1 R c A2 L1 L 0.25 Note: DS2653 - Rev 6 V2 Gauge plane This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. page 6/10 STPS15L45C DPAK package information Table 4. DPAK package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.265 E1 4.32 5.50 0.170 0.216 e 2.286 typ. 0.090 typ. e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.0 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° +8° Figure 10. DPAK recommended footprint (dimensions in mm) 12.7 6.7 3.0 3.0 4.572 6.7 B The device must be positioned within DS2653 - Rev 6 A 1.6 0.05 A B page 7/10 STPS15L45C Ordering Information 3 Ordering Information Table 5. Ordering information Order code STPS15L45CB STPS15L45CB-TR DS2653 - Rev 6 Marking Package Weight S15L45C DPAK 0.35 g Base qty. Delivery mode 75 Tube 2500 Tape and reel page 8/10 STPS15L45C Revision history Table 6. Document revision history DS2653 - Rev 6 Date Version Changes 10-Mar-2011 2 Automatic revalidation date workflow started. 07-Jul-2015 3 Updated DPAK package information and reformatted to current standard. Removed IPAK. 29-Nov-2018 4 Updated DPAK package information and reformatted to current standard. 09-Aug-2019 5 Added Section Applications. Updated Table 3, Figure 4 and Table 5. 02-Apr-2020 6 Updated Figure 5. page 9/10 STPS15L45C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS2653 - Rev 6 page 10/10