STPS160A

® STPS160A/U POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNTED DEVICE DESCRIPTION Single chip Schottky rectifier suited for Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in SMA or SMB, this device is intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM Tstg Tj dV/dt *: RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Storage temperature range Maximum junction temperature * Critical rate of rise of reverse voltage TLead = 130°C δ = 0.5 tp = 10 ms Sinusoidal tp = 2 µs square F = 1kHz tp = 100µs square Parameter Repetitive peak reverse voltage Value 60 10 1 75 1 1 - 65 to + 150 150 10000 V/µs Unit V A A A A A °C SMA (JEDEC DO-214AC) STPS160A SMB (JEDEC DO-214AA) STPS160U 1A 60 V 150°C 0.57 V dPtot 1 < thermal runaway condition for a diode on its own heatsink Rth(j−a) dTj 1/6 July 1999 - Ed: 5A STPS160A/U THERMAL RESISTANCES Symbol Rth (j-l) Junction to lead Parameter SMA SMB STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Tests Conditions Reverse leakage current Tests Conditions Tj = 25°C Tj = 125°C VF * Forward voltage drop Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Pulse test : * tp = 380 µs, δ < 2% Value 30 23 Unit °C/W Min. Typ. Max. 4 Unit µA mA V VR = 60V 1.1 IF = 1 A IF = 1 A IF = 2 A IF = 2 A 0.58 0.49 4 0.67 0.57 0.8 0.65 To evaluate the maximum conduction losses use the following equation : P = 0.49 x IF(AV) + 0.08 x IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. PF(av)(W) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0.2 0.4 IF(av) (A) 0.6 0.8 δ=tp/T T Fig. 2: Average forward current versus ambient temperature (δ=0.5). IF(av)(A) δ = 0.1 δ = 0.05 δ = 0.2 δ = 0.5 1.2 Rth(j-a)=Rth(j-l) 1.0 δ=1 0.8 0.6 0.4 0.2 tp T SMA Rth(j-a)=100°C/W S(Cu)=1.5cm² SMB Rth(j-a)=80°C/W S(Cu)=1.5cm² 1.0 1.2 0.0 δ=tp/T tp Tamb(°C) 50 75 100 125 150 0 25 2/6 STPS160A/U Fig. 3-1: Non repetive surge peak forward current versus overload duration (maximum values) (SMB). IM(A) 8 7 6 5 4 3 2 1 0 1E-3 IM t Fig. 3-2: Non repetive surge peak forward current versus overload duration (maximum values) (SMA). IM(A) 8 7 6 Ta=25°C 5 4 3 Ta=25°C Ta=50°C Ta=50°C IM t Ta=100°C δ=0.5 2 1 0 1E-3 Ta=100°C δ=0.5 t(s) 1E-2 1E-1 1E+0 t(s) 1E-2 1E-1 1E+0 Fig. 4-1: Relative variation of thermal impedance junction to ambient versus pulse duration (SMB). Fig. 4-2: Relative variation of thermal impedance junction to ambient versus pulse duration (SMA). Zth(j-a)/Rth(j-a) 1.0 0.9 Printed circuit board: S(Cu)=1.5cm² (e=35µm) 0.8 0.7 0.6 δ=0.5 0.5 0.4 0.3 δ=0.2 0.2 δ=0.1 0.1 tp(s) Single pulse 0.0 1E-2 1E-1 1E+0 1E+1 T δ=tp/T tp 1E+2 1E+3 Zth(j-a)/Rth(j-a) 1.0 0.9 Printed circuit board: S(Cu)=1.5cm² (e=35µm) 0.8 0.7 0.6 δ=0.5 0.5 0.4 0.3 δ=0.2 0.2 δ=0.1 0.1 tp(s) Single pulse 0.0 1E-2 1E-1 1E+0 T δ=tp/T tp 1E+1 1E+2 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). IR(µA) 1E+3 Tj=100°C Fig. 6: Junction capacitance versus reverse voltage applied (typical values) C(pF) 200 F=1MHz Tj=25°C 1E+2 Tj=75°C 100 50 1E+1 1E+0 1E-1 Tj=25°C 20 VR(V) 0 5 10 15 20 25 30 35 40 45 50 55 60 VR(V) 10 1 2 5 10 20 50 100 3/6 STPS160A/U Fig. 7: Forward voltage drop versus forward current (maximum values). Fig. 8-1: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board, copper thickness: 35µm)(SMB). Rth(j-a) (°C/W) 100 Tj=125°C IFM(A) 1E+1 80 Tj=25°C 1E+0 60 40 20 1E-1 VFM(V) 1E-2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 S(Cu) (cm²) 0 0 1 2 3 4 5 Fig. 8-2: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board, copper thickness: 35µm)(SMA). Rth(j-a) (°C/W) 140 120 100 80 60 40 20 0 0 1 S(Cu) (cm²) 2 3 4 5 4/6 STPS160A/U PACKAGE MECHANICAL DATA SMA DIMENSIONS E1 REF. Millimeters Min. Max. 2.70 0.20 1.65 0.41 5.60 4.60 2.95 1.60 Inches Min. 0.075 0.002 0.049 0.006 0.189 0.156 0.089 0.030 Max. 0.106 0.008 0.065 0.016 0.220 0.181 0.116 0.063 A1 D 1.90 0.05 1.25 0.15 4.80 3.95 2.25 0.75 A2 b c E E A1 E1 D b C L A2 L FOOT PRINT DIMENSIONS ( in millimeters) 1.65 1.45 2.40 1.45 5/6 STPS160A/U PACKAGE MECHANICAL DATA SMB DIMENSIONS REF. D E1 Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063 A1 A2 b E 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 c A1 E E1 b C L A2 D L FOOT PRINT DIMENSIONS ( in millimeters) 2.3 1.52 Ordering type 2.75 Marking 1.52 Package SMA SMB Weight 0.068 g. 0.107 g. Base qty 5000 2500 Delivery mode Tape & reel Tape & reel STPS160A GA6 STPS160U E16 Band indicates cathode Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1999 STMicroelectronics - Printed in Italy - All rights reserved. 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